KR101869460B1 - Method for controlling top flange mounting apparatus on wafer cassette - Google Patents

Method for controlling top flange mounting apparatus on wafer cassette Download PDF

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Publication number
KR101869460B1
KR101869460B1 KR1020170007040A KR20170007040A KR101869460B1 KR 101869460 B1 KR101869460 B1 KR 101869460B1 KR 1020170007040 A KR1020170007040 A KR 1020170007040A KR 20170007040 A KR20170007040 A KR 20170007040A KR 101869460 B1 KR101869460 B1 KR 101869460B1
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KR
South Korea
Prior art keywords
top flange
posture
mounting
chucking unit
unit
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KR1020170007040A
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Korean (ko)
Inventor
김상현
이호근
조세환
Original Assignee
크린팩토메이션 주식회사
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Priority to KR1020170007040A priority Critical patent/KR101869460B1/en
Application granted granted Critical
Publication of KR101869460B1 publication Critical patent/KR101869460B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

Provided is a control method of an apparatus for mounting a top flange on a wafer cassette, comprising: a step of firstly grasping the top flange which takes a first posture with a chucking unit of a mounting module in a loading area; a step of releasing a primary grip on the top flange by the chucking unit and converting the top flange to a second posture; a step of secondly grasping the top flange taking the second posture with the chucking unit; and a step of transferring the top flange held in the second posture by the chucking unit to a mounting area by a moving unit of the mounting module and mounting the top flange to the wafer cassette.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of controlling a device for mounting a top flange on a wafer cassette,

The present invention relates to a method of controlling an apparatus for mounting a top flange on a wafer cassette.

Generally, semiconductor devices are fabricated by repeatedly performing various kinds of processes to form fine patterns on a wafer surface. Various types of main equipment and auxiliary equipment are used to perform such a semiconductor process.

In addition, various types of containers for storing a plurality of wafers are used for transferring wafers between the facility and the facility. Among such containers is a wafer cassette in which a slot is formed therein and in which a wafer to be inserted into the slot is stacked.

Such a wafer cassette may be equipped with a top flange on its outer surface. Specifically, when the wafer cassettes are stacked and moved to the passive carrier, it is advantageous that the top flange is separated from the wafer cassette because the top flange interferes with the stacking. Alternatively, when the wafer cassette is clamped by a carrier robot mounted on the ceiling, the top flange must be mounted on the wafer cassette as an object that the robot can hold.

In this process, mounting or removal of the top flange to the wafer cassette is done entirely in a manner that is done manually by the operator. The operator is faced with difficulties and troubles due to the mounting / removing of the top flange in the handling of the wafer cassette.

It is an object of the present invention to provide a method of mounting a top flange on a wafer cassette while minimizing the possibility of incorrect operation in the operation of the apparatus for mounting the top flange, And to provide a control method of the apparatus.

According to an aspect of the present invention, there is provided a method of controlling an apparatus for mounting a top flange on a wafer cassette, the method comprising: a first step of gripping a top flange, step; Releasing the primary grip on the top flange by the chucking unit and converting the top flange to a second posture; Secondly grasping the top flange taking the second posture with the chucking unit; And transferring the top flange held in the second posture by the chucking unit to the mounting area by the moving unit of the mounting module, and then mounting the top flange to the wafer cassette.

The step of first gripping the top flange, which takes the first posture into the chucking unit of the mounting module in the loading area, is characterized in that the pair of clamping arms of the chucking unit are brought close to each other, Clamping both sides of the top flange in the state.

Wherein releasing the primary grip on the top flange by the chucking unit and converting the top flange to the second posture comprises moving a pair of clamping arms of the chucking unit away from each other, May be inclined again on the pair of clamping arms to make the second posture horizontal.

Wherein the step of moving the pair of clamping arms of the chucking unit away from each other so that the top flange is tilted again on the pair of clamping arms to be in the horizontal posture, Area of the substrate.

The step of secondarily grasping the top flange taking the second posture by the chucking unit may include grasping the pair of clamping arms of the chucking unit toward each other so that the pair of clamping arms And clamping both sides of the top flange taking the second posture.

The step of transferring the top flange held in the second posture by the chucking unit to the mounting region by the moving unit of the mounting module and mounting the top flange to the wafer cassette further comprises: Moving the units simultaneously in the uniaxial direction; And moving the mobile unit in the biaxial direction simultaneously in an area outside the loading area.

Here, when the mounting module detaches the top flange mounted on the wafer cassette, the mounting module waits in an area outside the loading area while grasping the top flange, and mounting the wafer on another wafer cassette in the loading area May be further included.

According to another aspect of the present invention, there is provided a method for controlling a device for mounting a top flange on a wafer cassette, the method comprising: calculating a positional offset amount for correcting a tilting position of a top flange Determining a grip position; The chucking unit of the mounting module holding the top flange in a horizontal posture by correcting the tilting posture of the top flange at the determined grip position; And a step of transferring the top flange held by the chucking unit to the mounting area of the mounting module through the correction of the tilt position and the correction of the tilting posture to mount the wafer on the wafer cassette.

The step of determining the gripping position with respect to the top flange reflecting the position offset amount for correcting the tilting position of the top flange loaded on the stacking module in the stacking area may include: Calculating a buffer amount of the top flange; Calculating an offset amount based on a tilted position of the top flange, based on the buffer amount of the top flange; And determining a gripping position with respect to the top flange according to the offset amount.

The step of holding the top flange in the horizontal posture by correcting the tilting posture of the top flange at the determined gripping position of the chucking unit of the mounting module is characterized in that at the determined gripping position, 1) holding a top flange for one posture; Releasing the primary grip on the top flange by the chucking unit and converting the top flange to a horizontal posture; And secondarily grasping the top flange taking the second posture with the chucking unit.

Wherein releasing the primary grip on the top flange by the chucking unit and converting the top flange to the second posture comprises moving a pair of clamping arms of the chucking unit away from each other, May be inclined again on the pair of clamping arms to be in the second posture in a horizontal state.

According to the method of controlling an apparatus for mounting a top flange on a wafer cassette according to an aspect of the present invention configured as described above, even though a top flange is mounted on a wafer cassette without manual operation of an operator, The possibility of occurrence of an incorrect operation can be minimized.

1 is a perspective view of an apparatus 100 for mounting a top flange to a wafer cassette according to an embodiment of the present invention.
FIG. 2 is a perspective view of the apparatus 100 for mounting a top flange on the wafer cassette of FIG. 1, with the frame 110 removed.
FIG. 3 is a perspective view of the apparatus 100 for mounting a top flange on the wafer cassette of FIG. 2, as viewed from behind.
4 is a perspective view showing a chucking unit 151 of the mounting module 150 of FIG.
Fig. 5 is a perspective view of the chucking unit 151 of Fig. 4 as viewed from below.
6 is a perspective view illustrating a part of the holding module 170 of FIG.
7 is a flowchart illustrating a method of controlling the mounting apparatus 100 according to an embodiment of the present invention.
FIG. 8 is a flowchart illustrating the buffer quantity calculation step S1 of FIG. 7 in more detail.
Fig. 9 is a flowchart showing the pre-control step S3 of Fig. 7 in more detail.
10 is a flowchart illustrating a control method of the mounting apparatus 100 according to another embodiment of the present invention.
11 is a flowchart specifically illustrating the top flange mounting step (S43) of Fig.
12 is a flowchart illustrating additional control contents in connection with the top flange mounting step (S43) of Fig.

Hereinafter, a method of controlling an apparatus for mounting a top flange on a wafer cassette according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

Figure 1 is a perspective view of an apparatus 100 for mounting a top flange to a wafer cassette according to an embodiment of the present invention, Figure 2 is a perspective view of a device 100 for mounting a top flange to the wafer cassette of Figure 1, (110) is removed.

Referring to these drawings, an apparatus 100 for mounting a top flange to a wafer cassette can include a frame 110, a loading module 130, a mounting module 150, and a holding module 170.

The frame 110 is a basic structure of the mounting apparatus 100. [ Such a frame 110 may have a plurality of bars assembled as in the present embodiment. Specifically, the frame 110 may have a horizontal bar 111, a vertical bar 113, and a height bar 115. The horizontal bar 111 and the vertical bar 113 are arranged along different directions in one plane and joined to each other. The height bar 115 may be mainly coupled to a position where the horizontal bar 111 and the vertical bar 113 meet. Thereby, they can cause the frame 110 to form a hexahedral as a whole.

The loading module 130 is configured to load a top flange F to be mounted on the wafer cassette C. For this purpose, the stacking module 130 is installed in the frame 110, and the top flange F may be stacked along the same direction as the height bars 115 are arranged. Here, the top flange F may be defined to be located in the loading area when it is loaded in the loading module 130. [

The loading module 130 may have a support plate 131, a lifting unit 136, and a guide post 141.

The support plate 131 serves as a bottom surface for supporting the top flange F. The support plate 131 may be fixed to the frame 110.

The lifting unit 136 is configured to push up the top flange F supported on the support plate 131 to the upper side of the support plate 131. Specifically, the lifting unit 136 pushes the top flange F in the Z-axis direction, causing the top flange F located at the top to rise to a proper position for the chucking unit 151 to grasp.

The lifting unit 136 may include a base 137 and a contact arm 138. The base 137 is installed in the frame 110, and is arranged along the Z-axis direction. The contact arm 138 is slid in the Z-axis direction through the base 137, and is brought into contact with the bottom top flange F and pushes it upward in the Z-axis.

The guide post 141 may be installed on the support plate 131 so as to extend in the Z-axis direction. Thereby, the guide post 141 guides the top flange F to the above-mentioned correct position in the ascending path when the top flange F is lifted.

The mounting module 150 is configured to mount the top flange F loaded in the loading area to the wafer cassette C in the loading area. Here, the mounting region is regarded as defining a region corresponding to the wafer cassette C located in the holding module 170.

The mounting module 150 may include a chucking unit 151 and a mobile unit 161.

The chucking unit 151 is configured to grip the top flange F in the loading area. To this end, the chucking unit 151 is installed in the first moving part 162 to be described later. Such a chucking unit 151 will be described later with reference to Figs. 3 and 4. Fig.

The moving unit 161 moves the chucking unit 151 from the loading area to the loading area to a first large extent and then to the second area in the loading area so that the top flange F moves to the wafer cassette C As shown in Fig.

The moving unit 161 may have a first moving unit 162, a second moving unit 163, and a third moving unit 164.

The first moving part 162 may be arranged in the Z direction. The first moving part 162 is provided with a chucking unit 151. The chucking unit 151 can be moved in the Z direction (first direction) by the first moving unit 162. [

The second moving part 163 may be arranged in the Y direction. The second moving part 163 is provided with a first moving part 162. [ Accordingly, the first moving part 162 and the chucking unit 151 can be moved in the Y direction (second direction) by the second moving part 163.

The third moving part 164 may be arranged in the X direction. The third moving part 164 is provided with a second moving part 163. The first moving part 162, the second moving part 163 and the chucking unit 151 can be moved in the X direction (third direction) by the third moving part 164.

The holding module 170 is a structure for fixing the wafer cassette C to the mounting area. To this end, the holding module 170 may have a support housing 171 and a holding arm 173.

The support housing 171 is a structure serving as a pedestal for supporting the wafer cassette (C). The support housing 171 may have a substantially rectangular parallelepiped shape corresponding to the shape of the wafer cassette C.

The holding arms 173 may be provided in pairs with respect to one support housing 171. These holding arms 173 may be configured to be moved toward each other on both sides of the support housing 171. Thereby, the pair of holding arms 173 fix the wafer cassette C.

In this configuration, the wafer cassette C on which the top flange F is not mounted can be mounted on the support housing 171 of the holding module 170. [ This wafer cassette C is held stationary by the holding module 170 in place.

In order to mount the top flange F to such a wafer cassette C, the chucking unit 151 is moved to the loading module 130. At this time, in accordance with the operation of the third moving part 164, the chucking unit 151 can be moved along the X direction from the loading area to the loading area. The chucking unit 151 moves in the Y direction and the Z direction by the operation of the second moving unit 163 and the first moving unit 162 to move the top flange F Approaching the top, the chucking unit 151 grips the top flange F.

The chucking unit 151 holds the top flange F and moves the mounting portion 151 in the loading area by the operation of the first moving portion 162, the second moving portion 163, and the third moving portion 164, Area. The chucking unit 151 and the moving unit 161 allow the top flange F to be attached to the mounting portion i of the wafer cassette C.

The process of removing the top flange F from the wafer cassette C may be performed in the opposite manner to the above mounting process.

Hereinafter, the detailed configuration of the apparatus 100 for mounting the top flange on the wafer cassette will be described with reference to the drawings.

3 is a perspective view of an apparatus 100 for mounting a top flange on the wafer cassette of FIG. 2, as viewed from behind.

Referring to this figure, a more specific structure of the lifting unit 136 and the supporting plate 131 constituting the loading module 130 can be confirmed.

Specifically, the support plate 131 may have a through-hole 132. The through hole 132 passes through the support plate 131 and has a shape in which the contact arm 138 can be inserted.

The contact arm 138 is inserted into the through hole 132 to have a contact end 138a which is in contact with the bottom of the top flange F. [

The loading module 130 may further have a sensor unit and an alarm unit.

The sensor unit is for grasping the number and position of the top flange F mounted on the support plate 131. Specifically, the sensor unit may have a product sensor 143a and a position sensor 143b.

The product sensor 143a may be configured to sense the top flange F mounted on the contact end 138a of the contact arm 138 and loaded on the support plate 131. [ If the product sensor 143a does not sense the top flange F, it can be determined that there is no top flange F on the support plate 131. [ At this time, the alarm unit sounds an alarm and can notify the manager thereof.

The positive position sensor 143b may be installed on the upper side of the guide post 141. [ Thereby, the correct position sensor 143b recognizes that the top flange F at the top is properly positioned in a proper position to be held by the chucking unit 151. [ If the top flange F is not sensed by the position sensor 143b while the top flange F is detected by the product sensor 143a, the lifting unit 136 lifts the contact arm 138 to the top flange F F may be actuated to be sensed by the correct position sensor 143b in the correct position.

Next, the chucking unit 151 will be described with reference to Figs. 4 and 5. Fig.

4 is a perspective view showing a chucking unit 151 of the mounting module 150 of FIG.

Referring to this figure, the chucking unit 151 may include a base 152, a clamping arm 153, and an alignment member 155.

The base 152 is installed in the first moving part 162 and can be arranged in the X-axis direction.

The clamping arm 153 can be installed movably in the X-axis direction with respect to the base 152. These clamping arms 153 can be provided in pairs and can be moved toward each other on both sides of the top flange F or away from each other.

The clamping arm 153 may have a pair of guide members 154 corresponding to both sides of the top flange F. [ The guide member 154 may have a reference projection 154a inserted in a reference groove formed in a side surface of the top flange F. [ The guide member 154 can be formed of a resin material to reduce damage to the top flange F, unlike the other parts of the clamping arm 153 being made of metal.

The alignment member 155 may be installed on the base 152 and inserted into the alignment groove on the top surface of the top flange F. [ The alignment member 155 is inserted into the alignment groove along a direction (Z direction) different from the moving direction (X direction) of the clamping arm 153.

Fig. 5 is a perspective view of the chucking unit 151 of Fig. 4 as viewed from below.

Referring to this figure, the clamping arm 153 may further have a pusher 156. [ These pushers 156 are provided in pairs in each of the pair of clamping arms 153. The pair of pushers are arranged to face each other.

This pusher 156 is disposed corresponding to the hook h of the top flange F. [ The hook h protrudes from the bottom surface of the top flange F in the direction in which the top flange F is inserted into the wafer cassette C.

With this arrangement, while the pair of clamping arms 153 clamp the top flange F on both sides of the top flange F, the pair of pushers 156 press the pair of hooks h .

Thereby, the pair of hooks (h) are bent in a direction toward each other. Accordingly, when the pair of hooks h are slidably engaged with the mounting portion i of the wafer cassette C, the hooks h can easily slide without any restriction on the mating member of the mounting portion.

In the process of separating the top flange F from the wafer cassette C as well, the pusher 156 deforms the hook h of the wafer cassette C so that the hook h is released from the hook .

6 is a perspective view illustrating a part of the holding module 170 of FIG.

Referring to this figure, the holding module 170 is a structure for holding the wafer cassette C fixedly in place when the top flange F is fitted in the wafer cassette C.

To this end, the holding module 170 has the support housing 171 and the pair of holding arms 173 described above. Here, the support housing 171 may include an upper housing 171a and a lower housing 171b. The upper housing 171a and the lower housing 171b are coupled to each other to form an inner space.

In addition to the support housing 171, the holding module 170 may further have a drive unit 175. The drive unit 175 is configured to cause the pair of holding modules 170 to move closer to each other to hold the wafer cassette C or to move in reverse in that state to release holding for the wafer cassette C .

The drive unit 175 may have a moving member 176, a screw 178, and a motor 181.

The moving member 176 may be installed in the lower housing 171b to be located in the inner space. The shifting member 176 may have the form of a generally square block. A through hole is formed in the moving member 176, and a ball bush 176a is provided in the through hole. A female thread is formed on the inner peripheral surface of the ball bush 176a. This shifting member 176 may also be connected to the holding arm 173 via a connecting rod 174. At this time, the connection rod 174 may extend through the support housing 171 from the inside of the support housing 171 to the outside. Furthermore, the connecting rod 174 can be slidably supported by the supporting member 177 fixed to the lower housing 171b.

Screw 178 may be disposed to thread through ball bush 176a and ball bush 176a. For this purpose, the screw 178 is formed with male threads on its outer surface.

The motor 181 is configured to rotate the screw 178 in conjunction with the screw 178. For this interlock, the output shaft of the motor 181 is connected to the pulley of the screw 178 via a belt 182.

According to this configuration, by rotating the motor 181 in the forward or reverse direction, the screw 178 is rotated forward or reverse. As a result, the ball bush 176a is engaged with the screw 178, so that the moving member 176 moves in a direction in which the pair of holding arms 173 are brought close to each other or away from each other.

The pair of holding modules 170 clamp the wafer cassette C placed on the support housing 171 so that the wafer cassette C is held in place do.

7 to 9 (and FIGS. 1 to 6), a control method for the mounting apparatus 100 will be described based on the above description of the mounting apparatus 100. FIG.

7 is a flowchart illustrating a method of controlling the mounting apparatus 100 according to an embodiment of the present invention.

Referring to this figure, the control method for the mounting apparatus 100 may include a buffer quantity calculating step S1, a pre-control step S3, and a top flange mounting step S5. This three-step control can be performed by the control unit.

The buffer quantity calculating step S1 is a configuration for calculating the number of top flanges F stacked on the stacking module 130 in the stacking area, in other words, the buffering quantity.

The pre-control step (S3) performs the pre-control required for the operation of the mounting module (150) based on the detected buffer quantity. In other words, before the mounting module 150 proceeds to grip the top flange F located in the loading area and transfer it to the loading area and then mount it on the wafer cassette C, And performs the pre-control.

As the pre-control, for example, an alarm for the number of buffers of the top flange F loaded in the loading module 130 can be given. The alarm can be executed by the alarm unit described above under the control of the control unit.

Specifically, if the buffer amount of the top flange F is out of the proper range, an alarm is sounded so that the operator can check and adjust the number. More specifically, the alarm can be set to sound when the buffer quantity is O or the buffer quantity is the maximum number of stacked items of the top flange (F).

The top flange mounting step S5 is a configuration in which the mounting module 150 grasps the top flange F and mounts the top flange F on the wafer cassette C based on the pre-control.

To this end, the control unit can control the mounting module 150 to operate when the loading module 130 has the buffer quantity within an appropriate range by the pre-control.

The chucking unit 151 of the loading module 130 grasps the top flange F and the moving unit 161 moves the chucking unit 151 and the top flange F to move the wafer cassette C).

According to such a configuration, when the top flange F is to be mounted on the wafer cassette C, the control unit is configured such that the mounting module 150 grasps the top flange F in the loading area and moves to the mounting area So that the top flange F is not mounted on the wafer cassette C.

Before the operation of such a mounting module 150, the preconditions for allowing the top flange F to be correctly gripped by the mounting module 150 and moved to the mounting area when the mounting module 150 is operated, It is not.

FIG. 8 is a flowchart illustrating the buffer quantity calculation step S1 of FIG. 7 in more detail.

Referring to this figure, in order to detect the number of buffers, it is first determined whether the contact arm 138 needs to return to the home position (S11).

For example, if the operator further loads the top flange F into the loading module 130, the contact arm 138 returns to the home position and the top of the top flange F rises again, And can be matched with the sensor 143b. At this time, the control unit instructs the contact arm 138 to return to the home position so that the contact arm 138 returns to the home position (S13).

On the other hand, if there is no top flange F and the contact arm 138 is located at the origin, there is no need to return to the origin.

The contact arm 138 is raised by an instruction from the control unit, whether at the origin or at another position (S15). As the contact arm 138 rises, the top flange F also ascends toward the right position sensor 143b.

When the contact arm 138 is raised, the top of the top flange F can be detected by the positive position sensor 143b of the sensor unit (S17). If not, the contact arm 138 needs to be raised further.

When the correct position sensor 143b detects the top of the top flange F, the control unit stops the rising of the contact arm 138 (S19).

The control unit calculates the buffer amount based on the height of the contact arm 138 when the contact arm 138 is stopped as described above (S20). More specifically, if the distance between the height of the position sensor 143b and the height of the contact arm 138 is obtained and the distance is divided by the thickness of the top flange F, the buffer quantity can be determined.

Fig. 9 is a flowchart showing the pre-control step S3 of Fig. 7 in more detail.

Referring to this figure, the top flange F stacked on the support plate 131 of the stacking module 130 is tilted to one side due to its shape. As a result, the top top flange F is positioned at an offset position from the bottom top flange F.

Therefore, the gripping position of the chucking unit 151 does not refer to the center of the support plate 131 (the center of the bottom top flange F), and calculates the offset degree of the top flange F at the top Should be determined on the basis of that.

To this end, the position offset amount according to the tilt (tilt position) of the top flange F must first be calculated (S21).

In order to calculate the offset amount, several pieces of data are required. Specifically, a first learning value, which is a learning value for an offset in the case where the top flange F exists only at one stage, is required. Also, when the top flange F is stacked at the maximum, a maximum learning value, which is a learning value for the offset of the maximum end of the top flange F, is required. In addition to this data, the buffer quantity is also used.

In this case, the offset amount can be determined by the following equation. The offset amount = (the maximum learning value - the first learning value) * (the current value of the buffer quantity / the maximum value of the buffer quantity). For example, along the one direction, if the first learning value is 10,000, the maximum learning value is 11,900, the maximum value of the buffer quantity is 15, and the current value of the buffer quantity is 9, (11,900-10,000) * (9/15) = 1,140.

Next, the control unit determines a grip position for holding the top flange F of the top chucking unit 151 of the mounting module 150 according to the calculated offset amount (S23). In the above example, the grip position is the next coordinate on the offset axis: 11,140 (10,000 + 1,140).

Finally, the control unit transmits the determined grip position to the mounting module 150 (S25) so that the mounting module 150 grips the top flange F at the determined grip position.

With this configuration, the chucking unit 151 grasps the top flange F at the grip position by reflecting the offset of the top flange F, so that the chucking unit 151 accurately grasps the top flange F accurately It can be grasped.

Thereby, there is no problem in alignment between the top flange F and the wafer cassette C even in the process in which the chucking unit 151 is transferred to the mounting region and the top flange F is mounted on the wafer cassette C .

Next, a control method for correcting the inclination posture of the top flange F will be described with reference to Fig.

10 is a flowchart illustrating a control method of the mounting apparatus 100 according to another embodiment of the present invention.

Referring to FIG. 5, the chucking unit 151 of the mounting module 150 in the loading area first grips the top flange F located at the top of the loading module 130 in a loaded state (S31). To this end, the control unit may cause the pair of clamping arms 153 of the chucking unit 151 to be driven in a direction close to each other. At this time, since the top flange F is in a state of being inclined (first posture) by its own shape, the pair of clamping arms 153 are clamped on both sides of the inclined top flange F, .

In order to correct the posture of the top flange F in the grip against the top flange F, the chucking unit 151 moves the top flange F from the first posture to the second posture (horizontal Posture).

First, the control unit determines whether the chucking unit 151 needs to be lifted (S33). This is related to the movement of the top flange F in the following steps S37 and S39. Specifically, when the stacking module 130 has two or more top flanges F, the control unit causes the chucking unit 151 to be driven up (S35). When only one top flange F is provided, The drive motor 151 may not be driven to ascend. In the former case, the top flange F below the top flange F may act as a spatial constraint when the top flange F moves for position correction.

The control unit may drive the chucking unit 151 to release the primary grip on the top flange F (S37). This is accomplished by moving a pair of clamping arms 153 of the chucking unit 151 away from each other. In this released state, the pair of clamping arms 153 does not clamp the side surface of the top flange F. The pair of clamping arms 153 are in a state of supporting the bottom of the top flange F only.

In this situation, the top flange F in the first posture is again tilted by the free fall of a part of the top flange F by gravity to become a horizontal state (second posture). In this posture change process, the clamping arm 153 is not operated but is kept in the standby state for a while (S39).

Thereafter, the control unit brings the pair of clamping arms 153 close to each other again, and clamps both sides of the top flange F. Thereby, secondary gripping with respect to the top flange F in a horizontal posture is achieved (S41).

The chucking unit 151 is moved under the control of the control unit to the mounting area by the moving unit 161 while holding the top flange F in the second posture (horizontal posture) So that the top flange F is mounted on the top flange F (S43).

According to this configuration, when the top flange F is fitted to the mounting portion i of the wafer cassette C, the problem of the fitting of the top flange F to the fitting portion i due to the incorrect posture of the top flange F can be solved have. This helps to ensure correct and smooth operation of the mounting apparatus 100.

Further, the correction of the tilting posture of the top flange F is not performed solely, but may be performed in succession to the correction of the tilting position of the top flange F described above. In this case, the primary gripping is performed on the top flange F at the grip position determined according to the correction of the tilt position of the top flange F described above, and the subsequent steps such as releasing the primary grip are performed do. This is a matter that can be easily understood by a general engineer, and thus is not described again.

Next, the area division control related to the moving operation of the mobile unit 161 will be described with reference to Figs. 11 and 12. Fig.

First, FIG. 11 is a flowchart illustrating the top flange mounting step (S43) of FIG. 10 in more detail.

Referring to FIG. 5, the control unit can divide a space in which the mobile unit 161 moves into a safe area and an atmospheric area (S51). Specifically, the safety zone is a zone where a greater attention is required to safety, and the loading zone may correspond to the zone. The waiting area may require less attention to safety than the safe area, and may be an area including the mounting area as an area excluding the loading area.

The control unit determines whether the chucking unit 151 is within the safety zone (S53).

If the chucking unit 151 is located in the safe area, the control unit causes the mobile unit 161 to move only in the uniaxial direction at step S55. For example, the mobile unit 161 moves in the X-axis direction or the Y-axis direction. By the movement of the movable unit 161, the problem that the chucking unit 151 hits the stacking module 130 can be prevented.

If the chucking unit 151 is located in the waiting area, the control unit causes the mobile unit 161 to move in the biaxial direction at the same time (S57). For example, the mobile unit 161 moves simultaneously in the X-axis direction and the Y-axis direction. This is because the operating time of the mobile unit 161 can be reduced without concern that the chucking unit 151 hits the stacking module 130 in the waiting area. As a result, the tact time required for the mounting operation of the mounting apparatus 100 can be reduced.

Next, Fig. 12 is a flowchart illustrating additional control contents in connection with the top flange mounting step (S43) of Fig.

Referring to this drawing, it is possible to improve the process of reattaching the top flange F separated from the wafer cassette C to another wafer cassette C to further reduce the tact time.

The separated top flange F is loaded on the stacking module 130 or the chucking unit 151 is moved to the waiting area in the standby area 130. When the top flange F is separated from the wafer cassette C, It is possible to wait while being grasped.

Specifically, the control unit determines whether the chucking unit 151 can wait in the waiting area (S63).

For example, if the chucking unit 151 needs to separate the top flange F from another wafer cassette C after the top flange F has been separated from one wafer cassette C, 151 can not wait in the waiting area. In this case, the mounting module 150 loads the top flange F separated from one wafer cassette C into the stacking module 130 under the control of the control unit (S69).

However, if it is not necessary to separate the top flange F from another wafer cassette C after separating the top flange F from one wafer cassette C, The separated top flange F can be held while grasping the separated top flange F in the waiting area (S65).

When the mounting of the top flange F to the other wafer cassette C occurs in this state, the control unit causes the mounting module 150 waiting in the waiting area to directly hold the top flange F gripped thereto To be mounted on the wafer cassette C (S67).

Alternatively, if the mounting module 150 is not gripping the top flange F by loading the separated top flange F into the loading module 130, the control unit may be configured such that the mounting module 150 is mounted on the loading module 130 To hold the top flange F mounted on another wafer cassette C (S71). At this time, the chucking unit 151 of the mounting module 150 correctly grasps the new top flange F in accordance with the tilt position correction and / or tilt correction of the top flange F as described above, So that it can be properly mounted on the cassette (C).

The method of controlling the apparatus for mounting the top flange to the wafer cassette as described above is not limited to the configuration and the manner of operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Device for mounting a top flange on a wafer cassette
110: frame 130: stacking module
131: support plate 136: lifting unit
141: Guide post 150: Moving module
151: chucking unit 153: clamping arm
155: alignment member 161: mobile unit
162: first moving part 163: second moving part
164: third moving part 170: holding module
171: Supporting housing 173: Holding arm
175: driving unit 176: moving member
178: screw 181: motor

Claims (11)

Firstly grasping a top flange for taking a first posture into a chucking unit of a mounting module in a loading area;
Releasing the primary grip on the top flange by the chucking unit and converting the top flange to a second posture;
Secondly grasping the top flange taking the second posture with the chucking unit; And
And transferring the top flange held in the second posture by the chucking unit to the mounting area by the moving unit of the mounting module after mounting the top flange to the wafer cassette,
Releasing the primary grip on the top flange by the chucking unit and converting the top flange to the second posture,
And moving the pair of clamping arms of the chucking unit away from each other so that the top flange is tilted back on the pair of clamping arms to be in the horizontal second posture, A method of controlling a device for mounting.
The method according to claim 1,
The step of first gripping the top flange taking the first posture into the chucking unit of the mounting module in the loading area,
And clamping both sides of the top flange in a state of being tilted by the first posture with a pair of clamping arms of the chucking unit being close to each other, Control method.
delete The method according to claim 1,
The step of moving the pair of clamping arms of the chucking unit away from each other so that the top flange is again tilted on the pair of clamping arms to be horizontal,
And after the chucking unit is raised above the loading area, the top flange is mounted on the wafer cassette.
The method according to claim 1,
Wherein the second holding of the top flange taking the second posture by the chucking unit comprises:
And clamping both sides of the top flange that takes the second posture in the horizontal position on the pair of clamping arms with a pair of clamping arms of the chucking unit being close to each other, A method of controlling a device for mounting a flange.
The method according to claim 1,
Wherein the step of transferring the top flange held in the second posture by the chucking unit to the wafer cassette after transferring the top flange by the moving unit of the mounting module to the mounting area,
Moving the mobile unit in only one axial direction simultaneously in the loading area; And
And simultaneously moving the mobile unit in a biaxial direction in an area outside the loading area.
The method according to claim 6,
Wherein the mounting module holds the top flange and mounts the wafer on another wafer cassette in the mounting area outside the loading area when the mounting module has removed the top flange mounted on the wafer cassette Wherein the top flange is mounted on the wafer cassette.
Determining a gripping position with respect to the top flange by reflecting a position offset amount for correcting a tilting position of the top flange loaded on the loading module in the loading area;
The chucking unit of the mounting module holding the top flange in a horizontal posture by correcting the tilting posture of the top flange at the determined grip position; And
And transferring the top flange held by the chucking unit to the mounting area of the mounting module to mount the wafer on the wafer cassette by correcting the tilt position and correcting the tilting posture,
Wherein the step of determining a grip position of the top flange by reflecting a position offset amount for correcting a tilting position of the top flange loaded on the stacking module in the stacking area,
Calculating a buffer amount of the top flange loaded in the loading module in the loading area;
Calculating an offset amount based on a tilted position of the top flange, based on the buffer amount of the top flange; And
And determining a gripping position with respect to the top flange in accordance with the offset amount.
delete 9. The method of claim 8,
Wherein the chucking unit of the mounting module grasps the top flange in a horizontal posture by correcting the tilting posture of the top flange at the determined grip position,
Holding the top flange of the mounting module of the mounting module taking the first posture at the determined grip position;
Releasing the primary grip on the top flange by the chucking unit and converting the top flange to a horizontal posture; And
And secondly grasping the top flange that takes the second posture with the chucking unit. ≪ Desc / Clms Page number 20 >
11. The method of claim 10,
Releasing the primary grip on the top flange by the chucking unit and converting the top flange to the second posture,
And moving the pair of clamping arms of the chucking unit away from each other so that the top flange is tilted back on the pair of clamping arms to be in the horizontal position in the second position, A method of controlling a device for mounting.
KR1020170007040A 2017-01-16 2017-01-16 Method for controlling top flange mounting apparatus on wafer cassette KR101869460B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198836A (en) * 2007-02-14 2008-08-28 Dainippon Screen Mfg Co Ltd Substrate treatment device and substrate treatment method
KR20120003368A (en) * 2010-07-02 2012-01-10 무라텍 오토메이션 가부시키가이샤 Gripper device of overhead transportation vehicle and overhead transportation vehicle
JP5056368B2 (en) * 2007-11-21 2012-10-24 村田機械株式会社 Transport system
KR20160109375A (en) * 2015-03-11 2016-09-21 세메스 주식회사 Apparatus for changing structure of fosb loaded wafers
JP6032888B2 (en) * 2011-12-14 2016-11-30 コマツＮｔｃ株式会社 Stacked wafer tilt correction method and wafer stacking apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198836A (en) * 2007-02-14 2008-08-28 Dainippon Screen Mfg Co Ltd Substrate treatment device and substrate treatment method
JP5056368B2 (en) * 2007-11-21 2012-10-24 村田機械株式会社 Transport system
KR20120003368A (en) * 2010-07-02 2012-01-10 무라텍 오토메이션 가부시키가이샤 Gripper device of overhead transportation vehicle and overhead transportation vehicle
JP6032888B2 (en) * 2011-12-14 2016-11-30 コマツＮｔｃ株式会社 Stacked wafer tilt correction method and wafer stacking apparatus
KR20160109375A (en) * 2015-03-11 2016-09-21 세메스 주식회사 Apparatus for changing structure of fosb loaded wafers

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