KR101850364B1 - Laser processing system and picker apparatus - Google Patents

Laser processing system and picker apparatus Download PDF

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Publication number
KR101850364B1
KR101850364B1 KR1020160017766A KR20160017766A KR101850364B1 KR 101850364 B1 KR101850364 B1 KR 101850364B1 KR 1020160017766 A KR1020160017766 A KR 1020160017766A KR 20160017766 A KR20160017766 A KR 20160017766A KR 101850364 B1 KR101850364 B1 KR 101850364B1
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South Korea
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area
processed
adsorption
nozzle
suction
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KR1020160017766A
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Korean (ko)
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KR20170096418A (en
Inventor
김대성
고영준
김용찬
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주식회사 이오테크닉스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/42—Bombardment with radiation
    • H01L21/423—Bombardment with radiation with high-energy radiation
    • H01L21/428—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60292—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of an electron or laser beam

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Laser Beam Processing (AREA)
  • Manipulator (AREA)

Abstract

 A laser machining system is disclosed. The disclosed laser machining system includes a laser irradiation unit for irradiating a laser beam to an object to be processed and a picker device for picking up and moving the object to be machined, wherein the picker device has a first area At least one suction nozzle having an air inlet formed therein; And an ejector for supplying the suction nozzle with a flow rate equal to or greater than a predetermined magnitude such that a force acting on the adsorption area by the at least one adsorption nozzle is greater than a weight of the object to be processed.

Description

Technical Field [0001] The present invention relates to a laser processing system and a picker apparatus,

The present invention relates to a laser machining system and a picker apparatus.

The laser processing system refers to a system for processing an object to be processed, such as a semiconductor package or a wafer, by using a laser beam. The laser processing system includes a laser irradiation unit for irradiating a laser beam to an object to be processed and a picker device for picking up and moving the object to be processed.

Such a picker apparatus may include a suction nozzle for picking up an object to be processed. The suction nozzle provides a suction force to the object to be processed in a state of being closed by the object to be processed.

However, the types of objects to be processed in the laser processing system may vary. Accordingly, the pattern formed on the object to be processed may be different. For example, when the object to be processed is a semiconductor strip, the sizes of the semiconductor units included in the semiconductor strip may vary.

In order to stably attract semiconductor strips having different sizes of semiconductor units, a separate picker apparatus has to be manufactured according to the type of the semiconductor strip or the semiconductor unit so that the additional manufacturing cost and the replacement time of the picker apparatus .

The present invention provides a laser processing system and a picker apparatus for solving the above-mentioned problems.

According to an aspect of the present invention,

A laser irradiation unit for irradiating a laser beam onto an object to be processed,

And a picker device for picking up and moving the object to be processed,

Wherein the picker device comprises:

At least one suction nozzle having an air intake port having a first area larger than an adsorption area of the object to be processed; And

And an ejector for supplying a flow rate of the predetermined size or more to the adsorption nozzle so that a force acting on the adsorption area by the at least one adsorption nozzle is larger than a weight of the object to be processed.

The ejector may provide a flow rate of 200 l / min to 400 l / min.

The adsorption area of the object to be processed may be 60% or more of the first area.

The object to be processed includes a lead frame strip and a plurality of semiconductor units disposed on the lead frame strip, and the area of the object to be processed may be an area where the plurality of semiconductor units are overlapped with the air inlet.

The length of one side of each of the plurality of semiconductor units may be 5 mm or less.

The diameter of the air inlet may be 8 mm to 20 mm.

And a suction flow path disposed between the suction nozzle and the ejector, the suction flow path having a second area smaller than the first area.

The suction nozzle is disposed at an upper portion of the object to be processed and can provide an attraction force to the object in an upward direction.

The pressure difference between the upper surface and the lower surface of the object to be processed by the suction nozzle may be 30 kPa to 53 kPa.

The weight of the object to be processed may be 30 g to 150 g.

According to another aspect of the present invention,

At least one suction nozzle having an air suction port having a first area larger than an adsorption area of an object to be processed,

The ejector may include an ejector for providing a suction nozzle with a predetermined size or more so that a force acting on the suction area by the at least one suction nozzle is greater than a weight of the object.

The ejector may provide a flow rate of 200 l / min to 400 l / min.

The adsorption area of the object to be processed may be 60% or more of the first area.

The object to be processed includes a lead frame strip and a plurality of semiconductor units disposed on the lead frame strip, and the area of the object to be processed may be an area where the plurality of semiconductor units are overlapped with the air inlet.

The length of one side of each of the plurality of semiconductor units may be 5 mm or less.

The diameter of the air inlet may be 8 mm to 20 mm.

And a suction flow path disposed between the suction nozzle and the ejector, the suction flow path having a second area smaller than the first area.

The suction nozzle is disposed at an upper portion of the object to be processed and can provide an attraction force to the object in an upward direction.

The pressure difference between the upper surface and the lower surface of the object to be processed by the suction nozzle may be 30 kPa to 53 kPa.

The weight of the object to be processed may be 30 g to 150 g.

The laser processing system and the picker apparatus according to the embodiment of the present invention can provide a negative pressure capable of adsorbing an object to be processed even if the suction nozzle is not hermetically sealed by the object to be processed, It can be adsorbed and transported.

1 is a block diagram schematically showing a laser machining system according to an embodiment,
2 is a view for explaining the operation of the laser processing system according to the embodiment.
Fig. 3 is a view showing a state in which an object to be processed is attracted and supported by a picker device according to the embodiment, and Fig. 4 is a sectional view of Fig. 3. Fig.
5 to 6 are a plan view and a sectional view showing an example of a state in which the air inlet of the suction nozzle is superimposed on the object to be processed in Fig.
7 to 8 are plan views showing another example of a state in which the air inlet of the suction nozzle is superimposed on the object to be processed.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

Terms including ordinals such as " first, " " second, " and the like can be used to describe various elements, but the elements are not limited by terms. Terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The term " and / or " includes any combination of a plurality of related items or any of a plurality of related items.

Fig. 1 is a block diagram schematically showing a laser machining system according to an embodiment, and Fig. 2 is a view for explaining the operation of the laser machining system according to the embodiment.

1 and 2, the laser processing system includes a work table 10, a laser irradiation unit 20, a picker device 100, and a control unit (not shown) 30). The operation of at least one of the work table 10, the laser irradiation unit 20 and the picker apparatus 100 can be controlled by the control unit 30. [

The laser irradiation unit 20 irradiates the object T with a laser beam. The laser irradiation unit 20 can mark the surface of the object T in a predetermined shape. However, examples of processing by the laser irradiation unit 20 are not limited to these, and can be variously modified. For example, the laser irradiation unit 20 may cut the object T.

The work table 10 supports the object T while the laser processing operation on the object T is being performed.

The work table 10 can be moved. For example, the work table 10 can be reciprocated in the horizontal direction. However, the movement of the work table 10 is optional, so that when the laser irradiation unit 20 is movable, the work table 10 may not be moved.

The picker device 100 supports the object to be processed T by a suction method. For example, the picker apparatus 100 contacts the upper portion of the object T and supports the object T while supporting the load of the object T.

The picker device 100 can move the object T to be processed. For example, the picker apparatus 100 can move the object T up and down. However, the moving direction of the object T by the picker device 100 is not limited to the vertical direction, and can be variously modified.

The picker device 100 transfers the object T in the state before the laser machining operation to the work table 10 or moves the object T to which the laser machining operation has advanced from the work table 10 to another position Can be transported.

However, the movement of the object to be processed T by the picker apparatus 100 is not limited to the work table 10, and can be variously modified. For example, although not shown in the drawings, the picker apparatus 100 can transfer one object T to another position on a stacking table on which a plurality of objects T are placed.

Fig. 3 is a view showing a state in which the object to be processed T is attracted and supported by the picker apparatus 100 according to the embodiment, and Fig. 4 is a sectional view of Fig.

3 and 4, the picker apparatus 100 includes at least one adsorption nozzle 110 for adsorbing and supporting an object to be processed T, an ejector 150 for providing a flow rate of a predetermined amount or more to the adsorption nozzle 110 ). A suction passage 130 may be disposed between the suction nozzle 110 and the ejector 150. The suction passage 130 may have a second area smaller than the first area of the air inlet 110H.

The suction nozzle 110 is a portion for sucking air from the outside to the inside, and adsorbs and supports the object to be processed. The suction nozzle 110 includes an air inlet 110H for sucking outside air.

The suction nozzle 110 is opposed to the object to be processed T and the air inlet 110H is arranged to overlap the object to be processed T. [

5 to 6 are a plan view and a sectional view showing an example in which the air inlet 110H of the suction nozzle 110 is superimposed on the object T in Fig.

5 and 6, the surface of the object to be processed T facing the air inlet 110H may not be flat. For example, the object to be processed T may be a semiconductor strip including a lead frame strip 41 and a plurality of semiconductor units 42 mounted on the lead frame strip 41. A plurality of semiconductor units 42 protrude upward from the lead frame strip 41 and a predetermined gap G is formed between the semiconductor units 42. Here, the semiconductor strip is in a state in which a predetermined semiconductor process is in progress, and before the plurality of semiconductor units 42 are separated into the individual semiconductor units 42.

The diameter D of the air inlet 110H may be greater than the length d1 of the side of the semiconductor unit 42. [ For example, the diameter D of the air inlet 110H may be greater than the length of the shortest side of the semiconductor unit 42. [ For example, when the length of the shortest side of the semiconductor unit 42 is 5 mm or less, the diameter D of the air inlet 110H may be 8 mm to 20 mm.

The object to be processed T on which the surface facing the air inlet 110H is not flat may be smaller than the first area of the air inlet 110H by the adsorption area adsorbed by the air inlet 110H. Here, the adsorption area means the area of the portion of the object to be processed T that blocks the air inlet 110H.

For example, one air inlet 110H may be superposed on a part of four semiconductor units 42. [ The sum (a1 + a2 + a3 + a4) of the areas of the semiconductor units 42 overlapping the air inlet 110H is smaller than the first area of the air inlet 110H. In other words, the first area of the air inlet 110H is larger than the adsorption area of the object T to be processed.

The overlapping area of the air inlet 110H of the suction nozzle 110 and the object T may vary depending on the arrangement of the suction nozzle 110 or the type of the object T to be processed. For example, as shown in FIG. 7, as the position of the suction nozzle 110 is moved, the adsorption area of the object to be processed T by the air inlet 110H can be changed. 8, when the size of the semiconductor unit 42a and the distance between the semiconductor units 42a are different from each other, as shown in FIG. 8, when the object to be processed T is changed, (T) can be varied.

As described above, when the first area is larger than the adsorption area, the adsorption nozzle 110 is not closed by the object to be processed T, and thus air flows between the inside and the outside of the adsorption nozzle 110 do.

The attraction force by which the object to be processed T is adsorbed by the adsorption nozzle 110 in a state in which the adsorption nozzle 110 is not hermetically can be changed according to the pressure difference between the inside and the outside of the adsorption nozzle 110. [ The pressure difference between the inside and the outside of the adsorption nozzle 110 depends on the difference in the air flow rate between the inside and the outside of the adsorption nozzle 110.

3 and 4, the ejector 150 may be configured such that the difference in air velocity between the inside and the outside of the adsorption nozzle 110 is equal to or greater than a predetermined value. For example, the ejector 150 may provide a large flow rate to the adsorption nozzle 110. The ejector 150 may provide a flow rate of 200 l / min to 400 l / min to the adsorption nozzle 110. The pressure difference between the inside and the outside of the adsorption nozzle 110 may be between 30 kPa and 53 kPa.

As described above, even if the adsorption area is smaller than the first area, by increasing the flow rate of the ejector 150, the object to be processed T can be adsorbed by the adsorption nozzle 110. For example, the picker apparatus 100 according to the embodiment may be provided with five adsorption nozzles 110 and an ejector 150 for providing a negative pressure to the adsorption nozzles 110 so as to have a weight of 30 g to 150 g The object to be processed T can be attracted and supported.

If the flow rate provided by the ejector 150 is small, for example, 82 L / min or less, unless the object to be processed T closes the air inlet 110H of the suction nozzle 110, The object T is not adsorbed. Accordingly, a separate picker apparatus 100 suited to the kind of the object to be processed T should be used.

However, according to the embodiment, since the ejector 150 provides a large flow rate, even if the adsorption nozzle 110 is not sealed by the object T, .

The picker apparatus 100 according to the embodiment is capable of changing the type of the object to be processed T without changing the picker apparatus 100 to the object to be processed T, . ≪ / RTI > Therefore, the manufacturing cost of the picker apparatus 100 according to the object to be processed T can be reduced, and the replacement time of the picker apparatus 100 can be reduced.

5, the attraction force for attracting the object to be processed T by the suction nozzle 110 in a state in which the suction nozzle 110 is not hermetically closed is the air between the inside and the outside of the suction nozzle 110 But also by the adsorption area of the object T in addition to the difference in flow velocity. For example, if the adsorption area of the object to be processed T is too small, even if a large flow rate is supplied by the ejector 150, adsorption may not be easy. In view of this, the adsorption area of the object to be processed may be 60% or more of the first area of the air inlet.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

10: Work table
20: laser irradiation unit
30:
100: Picker device
110: Adsorption nozzle
110H: Air intake
130:
150: Ejector

Claims (20)

A laser irradiation unit for irradiating a laser beam onto an object to be processed,
And a picker device for picking up and moving the object to be processed,
The picker device
At least one suction nozzle having an air suction port having a first area larger than the suction area of the object and sucking air due to a difference between the first area and an absorption area of the object; And
Wherein when the air is sucked through the air suction port due to a difference between the first area and an adsorption area of the object to be processed, a force acting on the adsorption area by the at least one adsorption nozzle is greater than a weight of the object to be processed And an ejector for supplying a flow rate of 200 l / min to 400 l / min to the adsorption nozzle,
Wherein the adsorption area of the object to be adsorbed by the adsorption nozzle is 60% or more of the first area,
The pressure difference acting on the upper and lower surfaces of the object by the suction nozzle is 30 kPa to 53 kPa,
The object to be processed includes a lead frame strip and a plurality of semiconductor units disposed on the lead frame strip,
Wherein an adsorption area of the object to be processed is an area where the plurality of semiconductor units are overlapped with the air inlet,
Wherein a diameter of the air inlet is 8 mm to 20 mm so that the diameter of the air inlet is larger than the length of sides of the semiconductor unit. delete delete delete The method according to claim 1,
Wherein a length of one side of each of the plurality of semiconductor units is 5 mm or less. delete The method according to claim 1,
And a suction flow path disposed between the suction nozzle and the ejector, the suction flow path having a second area smaller than the first area. The method according to claim 1,
Wherein the suction nozzle is disposed at an upper portion of the object to be processed and provides an attraction force in an upward direction to the object to be processed. delete The method according to claim 1,
Wherein the weight of the object to be processed is 30 g to 150 g. At least one suction nozzle having an air suction port for sucking air due to a difference between the first area and an adsorption area of the object,
Wherein when the air is sucked through the air suction port due to a difference between the first area and an adsorption area of the object to be processed, a force acting on the adsorption area by the at least one adsorption nozzle is greater than a weight of the object to be processed And an ejector for supplying a flow rate of 200 l / min to 400 l / min to the adsorption nozzle,
Wherein the adsorption area of the object to be adsorbed by the adsorption nozzle is 60% or more of the first area,
The pressure difference acting on the upper and lower surfaces of the object by the suction nozzle is 30 kPa to 53 kPa,
The object to be processed includes a lead frame strip and a plurality of semiconductor units disposed on the lead frame strip,
Wherein an adsorption area of the object to be processed is an area where the plurality of semiconductor units are overlapped with the air inlet,
Wherein the diameter of the air inlet is 8 mm to 20 mm such that the diameter of the air inlet is larger than the length of the side of the semiconductor unit. delete delete delete 12. The method of claim 11,
And a length of one side of each of the plurality of semiconductor units is 5 mm or less. delete 12. The method of claim 11,
Further comprising a suction flow path disposed between the suction nozzle and the ejector, the suction flow path having a second area smaller than the first area. 12. The method of claim 11,
Wherein the suction nozzle is disposed at an upper portion of the object to be processed and provides an attraction force to the object in an upward direction. delete 12. The method of claim 11,
Wherein the weight of the object to be processed is 30 g to 150 g.
KR1020160017766A 2016-02-16 2016-02-16 Laser processing system and picker apparatus KR101850364B1 (en)

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Application Number Priority Date Filing Date Title
KR1020160017766A KR101850364B1 (en) 2016-02-16 2016-02-16 Laser processing system and picker apparatus

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KR101850364B1 true KR101850364B1 (en) 2018-04-20

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212196A (en) * 2008-03-03 2009-09-17 Tokyo Ohka Kogyo Co Ltd Sucking/holding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212196A (en) * 2008-03-03 2009-09-17 Tokyo Ohka Kogyo Co Ltd Sucking/holding apparatus

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