KR101837489B1 - Roll to roll imprint apparatus for micro polymer stencil Continuous fabrication - Google Patents
Roll to roll imprint apparatus for micro polymer stencil Continuous fabrication Download PDFInfo
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- KR101837489B1 KR101837489B1 KR1020150187060A KR20150187060A KR101837489B1 KR 101837489 B1 KR101837489 B1 KR 101837489B1 KR 1020150187060 A KR1020150187060 A KR 1020150187060A KR 20150187060 A KR20150187060 A KR 20150187060A KR 101837489 B1 KR101837489 B1 KR 101837489B1
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- roll
- parafilm
- stamp
- film
- coating layer
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- 229920000642 polymer Polymers 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
- 239000011247 coating layer Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000010924 continuous production Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000004804 winding Methods 0.000 claims abstract description 7
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 abstract description 33
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 abstract description 33
- 238000001459 lithography Methods 0.000 abstract description 13
- 239000010410 layer Substances 0.000 abstract description 8
- 238000001723 curing Methods 0.000 abstract description 7
- 238000003848 UV Light-Curing Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 abstract 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 abstract 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 40
- 229920002799 BoPET Polymers 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- -1 Polydimethylsiloxane Polymers 0.000 description 2
- 238000004113 cell culture Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The present invention relates to a roll-to-roll imprint apparatus for continuous production of a micro-polymer stencil, and more particularly, to a roll-to-roll imprint apparatus for continuously producing a micro-polymer stencil, comprising a frame structure and a feed roller provided on a front side of the frame structure, A coating part for applying a UV curing resin to an upper surface of the parafilm supplied from the film supplying part to form a coating layer; a PDMS (not shown) provided rotatably on the frame structure and having a fine pattern formed on the outer circumferential surface thereof; A coating layer of the para film is pressed onto the outer circumferential surface of the roll stamp to transfer the fine pattern onto the coating layer and irradiating ultraviolet rays onto the coated layer on which the fine pattern is transferred to form a UV curable resin An imprint section for curing the substrate, And a film winder including a collection roller for demolding the imprinted parafilm from the roll stamp and winding the imprinted parafilm on the collection roller.
According to the present invention, a stamp-type UV imprint lithography process is applied to a roll-to-roll apparatus, so that a micro-polymer stencil can be continuously produced, thereby producing a product in a short period of time at a low cost.
In addition, a PDMS roll stamp and a film coated with UV curable resin are applied as a parafilm so that the resin coating layer hardened in the imprinting process is not demolded toward the stamp, and when the cured polymer stencil is released in the parafilm, The non-wettability of the product can be easily released, thereby reducing product defects and enhancing productivity.
In addition, the position of the roll stamp can be adjusted up or down, or the pressure of the pressure driving part provided at the lower part of the roll stamp can be arbitrarily adjusted so that the pressure applied to the coating layer of the roll film is appropriately adjusted, So that it is possible to manufacture different stencils.
Description
The present invention relates to a roll-to-roll imprint apparatus for continuous production of a micro-polymer stencil, and more particularly, to a roll-to-roll imprint apparatus for continuously forming a stencil in a short time by applying a stamp-type UV imprint lithography process to a roll- To-roll imprint apparatus.
As the field of information technology (IT) such as semiconductors, smart phones, displays, and the biotechnology industry (BT), which is represented by cell culture and patterning, have been developed, researches on micro and nano microstructure fabrication methods have been actively carried out in various fields have.
Recently, as practical products using micro and nano structures have been developed and used, attention has been paid to continuous production technology for increasing the productivity of these micro structures.
Among these microstructures, the microstencil is a shadow mask with microscale holes and is used in various fields such as metal or organic deposition, etching, and cell culture. Such a micro stencil refers to a thin film in which a hole such as a micro-sized circle or a square is regularly opened, and a method of manufacturing a stencil using a silicon wafer or a thermosetting resin is disclosed.
First, a micro stencil using a silicon wafer is formed by etching a portion of the silicon wafer with a protective layer covering the exposed surface. Typically, a photoresist is applied to a silicon wafer, a stencil pattern mask is placed on the applied photoresist, and the photoresist is irradiated with ultraviolet light and developed with a developer. The surface of the silicon wafer developed in the same shape as the stencil pattern is etched with the photosensitive agent cured with ultraviolet rays, and the portion where the protective layer is present is etched, and the exposed portion is etched to manufacture the stencil. The stencil fabricated by this method is advantageous in durability. However, since it is necessary to fabricate a protective layer on the surface of the silicon wafer, it takes a lot of time and cost, and it can not be used on curved surfaces due to the material properties of the stencil.
And micro-stencil using thermosetting resin is manufactured by soft lithography. A PDMS (Polydimethylsiloxane) elastomer base and a curing agent, which are typical thermosetting resins, were mixed in a ratio of 10: 1 to a master mold having a plurality of columnar uneven patterns formed by photolithography, Is applied to the mold, and the remaining layer of the mold surface is sucked in, or pressed or blown into a flat surface to remove unnecessary portions. PDMS stencils are biocompatible and can be used on curved surfaces. However, due to the nature of PDMS materials, there are limitations in that they are difficult to apply to continuous production due to the long-time thermosetting process at high temperature.
As described above, it is difficult to manufacture a continuous stencil by the above method, and it is most preferable to apply a stamp type UV imprint lithography process to a roll-to-roll apparatus.
FIG. 1 is a schematic view of such a stamped UV imprint lithography process. In general UV imprint lithography, a UV
However, when the
If the surface energy of the film is larger than that of the PDMS stamp (3000), the fine pattern may be copied to the film to be used for a desired purpose. However, the surface of the PDMS stamp (3000) The energy is greater than the surface energy of the PET film so that the cured resin is demolded toward the
Accordingly, when a PET film is used, a surface treatment agent (typically, silane-based compound, fluorine-based molecular deposition using C4F8 gas) is coated to lower the surface energy of the stamp, or urethane treatment is applied to increase the surface energy of the PET film It is troublesome to adjust the surface energy.
Furthermore, the stencil having the through-hole formed should be easy to release from the PET film. Unlike the PDMS, the PET film does not cause wetting property, which is very difficult to release the cured resin.
Therefore, a roll-to-roll imprint apparatus capable of overcoming the unreasonableness of manufacturing such a conventional micro stencil and applying a stamp-type UV imprint lithography process to a roll-to-roll apparatus for continuous stencil production, There is a growing demand for a microstencil manufacturing method using the same.
SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and it is an object of the present invention to provide a stencil stencil by applying a stamp-type UV imprint lithography process to a roll- .
Another object of the present invention is to select a film suitable for the surface energy of the UV curable resin forming the PDMS roll stamp and the coating layer of the film so that the cured resin coating layer in the imprint process is not demolded towards the stamp and the cured polymer stencil Even when the film is released from the film, the release of the film due to the non-wettability of the film is facilitated.
Another object of the present invention is to make it possible to produce an optimum stencil by allowing the roll stamp to control the pressure applied to the coating layer of the parafilm.
According to an aspect of the present invention, there is provided a film processing apparatus including a frame structure and a feed roller provided on a front side of the frame structure, the film feeder feeding a parafilm wound on the feed roller backward, A coating part on which a UV curable resin is applied to a top surface of a parafilm supplied from the film supply part to form a coating layer, a roll stamp rotatably installed on the frame structure and having a PDMS mold with fine patterns formed on its outer surface, An imprint unit for pressing the coating layer of the parafilm onto the outer circumferential surface of the roll stamp to transfer the fine pattern onto the coating layer and irradiating ultraviolet rays onto the coated layer on which the fine pattern is transferred to cure the UV curable resin, And a collection roller provided at a rear side of the frame structure, wherein the imprinted para By de-molding of the flow in the rolling-stamp is provided comprising a film take-up winding with the number of rollers.
Here, the fine pattern formed on the roll stamp is formed of a plurality of irregularities. When the upper surface of the parafilm is pressed, the UV curable resin is brought into contact with the end of the convex convex portion, and the UV curable resin is pushed into the recessed concave portion The end portion of the convex portion is brought into close contact with the upper surface of the para film to form a through hole in the cured coating layer.
Further, the present invention is further provided with a press driving unit which is provided at a lower portion of the roll stamp and presses the lower surface of the parafilm closely attached to the outer circumferential surface of the roll stamp.
Further, the pressure driver may include a contact plate which is a transparent material through which ultraviolet rays pass and which is in close contact with a lower surface of the parafilm, and a damper which is coupled to a lower surface of the contact plate to provide a uniform pressure to the contact plate do.
The coating unit may include first and second rotating rollers spaced apart from each other by a predetermined distance and spaced apart from the upper one frame structure of the feeding roller so that the parafilm supplied from the feeding roller moves in a horizontal plane with a predetermined interval, And a resin supply portion provided on the upper portion of the rotating roller and applying UV curable resin to the upper surface of the para film to be transported to the upper portion of the rotating roller.
The fine pattern attached to the roll stamp is made of a thermosetting resin material.
Further, the UV curable resin is synthesized with an oligomer, a monomer, and a photoinitiator.
In addition, a tension providing unit is further provided between the collection roller and the roll stamp, wherein the tension providing unit includes a tension roller which is in close contact with the lower surface of the deformed parafilm in the roll stamp and slides on the tension roller, And a damper for providing a constant tension to the tension roller, so that the parafilm adheres to the tension roller and has a constant tension.
The roll stamp is provided on the frame structure so as to be movable up and down, and the tension applied to the parafilm is adjusted.
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According to the present invention, a stamp-type UV imprint lithography process is applied to a roll-to-roll apparatus, so that a micro-polymer stencil can be continuously produced, thereby producing a product in a short period of time at a low cost.
In addition, a PDMS roll stamp and a film coated with a UV curable resin are applied as a parafilm so that the resin coating layer hardened in the imprinting process is not demolded toward the stamp, and when the cured polymer stencil is released in the parafilm, The non-wettability of the product can be easily released, thereby reducing product defects and enhancing productivity.
In addition, the position of the roll stamp can be adjusted up or down, or the pressure of the pressure driving part provided at the lower part of the roll stamp can be arbitrarily adjusted so that the pressure applied to the coating layer of the roll film is appropriately adjusted, So that it is possible to manufacture different stencils.
Figure 1 schematically illustrates this stamped UV imprint lithography process.
2 is a schematic view illustrating a UV imprint lithography process for fabricating a micro-polymer stencil according to the present invention.
Fig. 3 is a schematic view of the reaction during curing of the UV curable resin PUA used in the present experiment.
4 is a view showing a roll-to-roll imprint apparatus for continuous production of a micro-polymer stencil according to the present invention.
FIG. 5 is a flowchart showing a sequence of continuous production of a micro-polymer stencil using a roll-to-roll imprint apparatus according to the present invention.
FIG. 6 is a schematic view illustrating a process of manufacturing a stencil by transferring a parafilm to a roll-to-roll imprint apparatus according to the present invention.
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
2 is a schematic view illustrating a UV imprint lithography process for fabricating a micro-polymer stencil according to the present invention.
In the present invention, the UV imprint lithography technique used for conventional simple patterning is applied to a roll-to-roll imprint apparatus to continuously produce a micro polymer stencil.
2, a UV-curable resin B is coated on the film A to form a coating layer, and then a
In the present invention, a microporous polymer stencil is continuously produced by applying a parafilm (A) having a surface energy lower than that of a PET film, which is a conventional PDMS mold and is wound on a roller and can be continuously supplied.
This parafilm (A) confirms that the cured stencil after the imprint process is released to the para-film (A) through the following experiment.
UV curable resins, which are synthetic organic materials that are cured by ultraviolet light (UV) in UV imprint lithography, are composed of oligomers, monomers, and photoinitiators. The oligomer is a component that affects the physical properties of the resin, and forms a cured film by forming a polymer bond by a polymerization reaction. Depending on the structure of the skeleton molecule, an oligomer may be a polyester, an epoxy, a polyether, Rate. The monomer serves as a crosslinking agent and a diluent for the reactive oligomer, and is a raw material that forms a cured coating by polymerization. Photoinitiator is a raw material that absorbs UV to generate radicals or cations to initiate polymerization.
FIG. 3 is a schematic view of the reaction during curing of the UV curable resin PUA used in this experiment. When UV is irradiated on the surface of the UV curable resin, UV is radiated in all directions of the resin, the photoinitiator is excited by UV energy, Photoinitiator polymerizes the oligomer within a short time. The excited photoinitiator continuously initiates a photopolymerization reaction to complete the polymerization reaction of the monomer and the oligomer, which are the main components of the UV curable resin.
In this experiment, self-copying is possible among PUA (Polyurethane acrylate) which has fast curing speed, excellent physical properties and is widely used as a resin for UV hardening imprint in the industry, and it is possible to perform smooth releasing and pattern transferring even at a pattern height of several tens of micrometers or less Use a visible PUA (MINS-311RM, Minuta Tech).
As described above, when a UV curable resin is applied between the stamp and the film and a sufficient pressure is applied, the nonwettability continuously appears. The wettability is such that the excess UV curable resin present between the stamp and the film is pushed to the concave recessed portion of the stamp by pressure, thereby creating a portion where there is no UV curable resin between the end of the convex convex portion of the mold and the film.
This non-wetting occurs when the spreading coefficient has a negative value. The expression of the expansion coefficient is expressed by the following equation (1).
The Wow And S, L, and M represent the substrate, the liquid, and the mold, respectively. Surface energy of mold and film Can be obtained by the Owens-Wendt method (Equation 2), which is a combination of Young's equation and geometric mean equation using the contact angles of water and methylene iodide, have.
The surface energy between the mold and the film is calculated by Equation (3), which is a geometric mean equation.
Table 1 below shows the surface energies of the
The interfacial energy between the cured PUA (B) and the cured PUA (B) was 28.8 mJ / m2, and the interfacial energy between the cured PUA (B) and the parafilm (A) was 50.9 mJ / ) And the cured PUA (B). This proves that the PUA stencil (B) produced after the imprint process is released into the parafilm (A) rather than the PDMS mold (31).
4 is a view showing a roll-to-roll imprint apparatus for continuous production of a micro-polymer stencil according to the present invention.
Referring to the drawings, a roll-to-roll imprint apparatus according to the present invention includes a
The
The
The
The
A
The
In order to manufacture such a soft mold, a silicone elastomer base and a silicone elastomer curing agent were uniformly mixed at a ratio of 10: 1, and a master mold with a fine pattern (31a) . The bubbles formed by the inflow of air during the mixing of the PDMS remove bubbles in the PDMS for 30 minutes in the vacuum chamber. Then, the PDMS applied to the master mold is thermally cured in an oven at 70 DEG C for 60 minutes, and is then released from the master mold to produce a
The
The film take-up
Further, a
Hereinafter, a method for continuously producing a micro-polymer stencil using the roll-to-roll imprint apparatus according to the present invention will be described in detail.
FIG. 5 is a flow chart showing a sequence of continuous production of a micro-polymer stencil using a roll-to-roll imprinting apparatus according to the present invention, and FIG. 6 is a schematic view illustrating a process of manufacturing a stencil by transferring a parafilm to a roll- FIG.
Referring to the drawings, a method of continuously forming a micro-polymer stencil using a roll-to-roll imprint apparatus according to the present invention includes a film supplying step (S510), a coating layer forming step (S520), an imprinting step (S530), and a film winding step (S540) .
In the film supply step (S510), the parafilm (A) wound on the supply roller (11) is supplied to the rear side.
In the coating layer forming step S520, the UV curing resin B is applied to the upper surface of the parafilm A fed backward from the
The parafilm A having the coating layer formed thereon is supplied to the
Further, the lower surface of the parafilm (A) is pressed by the
In the film winding step (S540), the cured parafilm (A) is demolded from the roll stamp (31) and wound on the collecting roller (61). As described above, in the parafilm (A), the interface energy between the hardened stencil (B) and the parafilm (A) is larger than the interface energy between the roll stamp (31) and the hardened stencil (B) The stencil B is released into the parafilm A as shown in Fig.
In addition, the parafilm (A) exhibits wettability, and the cured micro-polymer stencil is more easily deformed than the PET film.
Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications and variations without departing from the spirit and scope of the invention. Accordingly, the scope of the appended claims should include all such modifications and changes as fall within the scope of the present invention.
100: frame structure
10: film feeder 11: feed roller
20: coating part 21: first rotating roller
22: second rotating roller 23: resin supply portion
30: Imprint section 31: Roll stamp
31a: fine pattern 32: lamp part
40: pressure drive part 41: tight contact plate
42: Damper
50: Tension supplier 51: Tension roller
52: Damper
60: film winding portion 61: collection roller
A: Parafilm B: UV curable resin
Claims (13)
A film feeding part including a feeding roller provided on a front side of the frame structure and feeding the parafilm wound on the feeding roller backward;
A coating part on which a UV curable resin is applied to a top surface of a para film supplied from the film supply part to form a coating layer;
And a roll stamp which is rotatably mounted on the frame structure and on which a mold having fine patterns formed on its outer circumferential surface is attached, the coating layer of the para film is pressed along the outer circumferential surface of the roll stamp to transfer the fine pattern onto the coating layer, An imprint unit for curing the UV curable resin by irradiating ultraviolet rays onto the coating layer onto which the fine pattern is transferred;
And a damper made of a transparent material through which ultraviolet rays pass and which is formed on the lower part of the roll stamp and closely attached to the lower surface of the parafilm and a damper made of a spring having a constant spring coefficient, A pressure driver for pressing the lower surface of the para film closely attached to the outer circumferential surface of the roll stamp;
A film winding unit including a collection roller provided at a rear side of the frame structure for demolding the imprinted parafilm from the roll stamp and winding the imprinted parafilm onto the collection roller; including,
The fine pattern formed on the roll stamp is formed of a plurality of irregularities. When the fine pattern is pressed onto the upper surface of the parafilm, the UV curable resin is brought into contact with the end of the convex convex portion, Wherein the end portion of the convex portion is in close contact with the upper surface of the parafilm to form a through hole in the cured coating layer.
The coating portion
First and second rotating rollers spaced apart from each other by a predetermined distance in the upper one frame structure of the feeding roller so that the parafilm supplied from the feeding roller moves in a horizontal plane with a predetermined interval,
And a resin supplying unit installed on the first and second rotating rollers and applying UV curable resin to the upper surface of the parafilm transported to the upper portion of the first and second rotating rollers, Roll to roll imprinting device for fabrication.
Wherein the fine pattern attached to the roll stamp is made of a thermosetting resin material. A roll to roll imprint apparatus for continuous production of a micro-polymer stencil.
Wherein the UV curable resin is synthesized from an oligomer, a monomer and a photoinitiator.
A tension providing unit is further provided between the collection roller and the roll stamp,
Wherein the tension providing unit includes a tension roller which is in close contact with a lower surface of the deformed parafilm in the roll stamp and a damper provided below the tension roller and providing a constant tension to the tension roller,
Wherein the parafilm has a constant tension while being closely attached to the tension roller. ≪ RTI ID = 0.0 > 11. < / RTI >
Wherein the roll stamp is installed on the frame structure so as to be movable up and down, thereby controlling the tension applied to the para-film.
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KR1020150187060A KR101837489B1 (en) | 2015-12-28 | 2015-12-28 | Roll to roll imprint apparatus for micro polymer stencil Continuous fabrication |
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KR101837489B1 true KR101837489B1 (en) | 2018-03-13 |
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KR101957493B1 (en) | 2017-12-28 | 2019-03-25 | 양철수 | Equipment for fabricating micro-pattern of high aspect ratio and control method thereof |
KR102708229B1 (en) * | 2019-10-23 | 2024-09-20 | 주식회사 엘지화학 | Pattern film for transferring display pixel and method for manufacturing thereof |
Citations (1)
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JP2011114309A (en) * | 2009-11-30 | 2011-06-09 | Canon Inc | Imprint apparatus |
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JP2011114309A (en) * | 2009-11-30 | 2011-06-09 | Canon Inc | Imprint apparatus |
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