KR100988647B1 - Fine pattern impring method using successive press - Google Patents

Abstract

The fine pattern forming imprinting method according to the present invention includes a resin ejecting step of ejecting a resin on a substrate so as to easily form a large area fine pattern, and a stamp installation step of placing a stamp having a fine pattern formed on the substrate; And a stamp pressurizing step of filling a resin into the fine pattern of the stamp using a pressurizing device, and a resin curing step of curing the resin, wherein the pressurizing device includes a plurality of pressurizing units, and the stamp pressurizing step includes: Pressing the stamp sequentially from the pressure unit disposed in the center of the stamp to the pressure unit disposed outside.

Fine pattern, pressing force, stamp, pressurizing unit

Description

Fine pattern imprinting method through sequential press {FINE PATTERN IMPRING METHOD USING SUCCESSIVE PRESS}

The present invention relates to an imprinting method of a large area fine pattern, and more particularly, to an imprinting method of a large area fine pattern which presses a stamp sequentially.

Nano Technology (NT), along with Information Technology (IT) and Biotechnology (BT), is attracting attention as a new paradigm that will lead industrial development in the 21st century.

In addition, nanotechnology is a convergence of various scientific and technological fields such as physics, chemistry, biology, electronics, and materials engineering, overcoming the limitations of existing technologies, and innovating technology in various industries to dramatically improve the quality of human life. It is expected to improve.

Nanotechnology can be divided into a top-down approach and a bottom-up approach depending on the approach. The approach from top to bottom, as can be seen in the history of semiconductor integrated devices that have evolved over the last few decades, has enabled existing microstructure fabrication technologies to further advance to the nanometer scale to continue increasing information storage capacity and information processing speed. It is a technique to do. In contrast, the approach from bottom to top controls materials at the atomic or molecular level, or uses spontaneous nanostructure formation to induce new physical and chemical properties that would not be possible with existing technologies, and use them to create new materials and devices. It is a technique to make.

A representative example of the approach from top to bottom is the optical lithography technique used in existing semiconductor device manufacturing processes. Technological advances of the 20th century, called the information technology revolution, have relied heavily on miniaturization and integration of semiconductor devices, and the key technology of the semiconductor device manufacturing process is optical lithography. However, optical lithography has a disadvantage in that it is difficult to fabricate a pitch of 100 nm or less due to the limitation of the line width of the laser, and thus, there have been many attempts to develop a process using nanoimprint technology.

Nanoimprint technology is a nano device fabrication method introduced by Professor Stephen Chu of Princeton University in the mid-1990s, and is attracting attention as a technology that can compensate for the low productivity of electron beam lithography and the expensive optical lithography equipment.

Nanoimprint technology solves the low productivity problem of electron beam lithography by fabricating a stamp with a nanoscale pattern using electron beam lithography or other methods, imprinting the stamp on a polymer thin film to transfer the nanostructures and using them repeatedly.

In particular, the large-area imprint technology is a technology that duplicates or transfers nano- or micro-sized patterns of displays and optical films requiring large-area high-speed processes by applying existing nanoimprint technology, and has high productivity.

The size of the pattern required for the application device is micrometer level, but there are technical difficulties in forming the resin layer, uniform film, increasing imprint pressure, uniform pressure distribution, and release compared to the conventional nano imprint technology.

In order to solve this problem of pressure distribution, a method of generating a pressure difference by using hydraulic pressure or pneumatic pressure and pressurizing a stamp due to such a pressure difference has been proposed. However, it is possible to apply pressure uniformly, but there is a problem in that trapped air cannot be removed to the outside in the process of bonding the substrate and the stamp.

In order to solve this problem, the stamp may be attached in a vacuum state, but it is difficult to create a vacuum environment, there is a risk of defects in the process of inserting and withdrawing the substrate into the vacuum chamber, and there is a problem in that the production speed is lowered.

On the other hand, in order to prevent air from being collected, a method of pressurizing a stamp using a roller has been proposed. However, in the case of pressurizing using a roller, the pressing force cannot be maintained after the roller passes, so that the stamp is lifted at the point where the roller passes. Problem occurs.

In addition, when the stamp is pressed by a mechanical press method in a large area imprint technique, excessive pressure is concentrated in the center so that there is little gradient of pressure in the center, while the pressure gradient rapidly increases toward the outside. As such, if the pressure is not uniform, it is difficult to induce the resin to a long distance, so that the resin is not properly filled in the stamp, and the center stamp is deformed.

An object of the present invention is to provide a fine pattern imprinting method capable of preventing air collection and uniformly forming a resin layer in imprinting a fine pattern in a large area.

The fine pattern forming imprinting method according to an embodiment of the present invention includes a resin discharge step of discharging a resin on a substrate, a stamp installation step of placing a stamp having a fine pattern formed on the substrate, and a stamp using the pressing device. A stamp pressing step of filling the resin into the fine pattern of, and a resin curing step of curing the resin, the pressing device comprises a plurality of pressing units, the stamp pressing step is a pressing unit disposed in the center of the stamp Pressing the stamp sequentially from the pressure unit disposed on the outside.

In the stamp pressing step, the resin flows outward from the center of the substrate, and the pressing force applied to the stamp in the process of resin flow may decrease from the center to the outside, and in the stamp pressing step, The acting pressing force may have a uniform pressure gradient depending on the distance from the center.

The fine pattern may have a pitch of micro or nano size, and the pressing device may include a center pressing unit formed in the center and a plurality of annular pressing units surrounding the center pressing unit.

The pressing unit may be formed in a piston shape, the pressing unit may press the stamp in a pressure control method or a position control method.

The pressurizing units may be provided with a hydraulic or pneumatic cylinder to control the transfer of the pressurizing unit, respectively, and the resin curing step may include the step of irradiating ultraviolet light toward the resin.

In the resin curing step, the resin may be cured by free radical polymerization, and the resin curing step may include applying heat toward the resin.

The stamp pressing step may include maintaining a pressing force acting on the stamp through the pressing units when the resin is filled in the fine pattern of the stamp and the resin is no longer flowing.

The fine pattern imprinting method according to another embodiment of the present invention includes a resin discharge step of discharging a resin on a substrate, a stamp installation step of placing a stamp having a fine pattern formed on the substrate, a center pressurizing unit and the center pressurization. The first pressing step of pressing the stamp to the center pressing unit to induce the resin to spread out in pressurizing the stamp using a pressing device including an annular pressing unit surrounding the unit, and the resin ring Positioning the pressure pressing unit comprises a second pressing step of inducing the resin to spread outward by pressing the stamp with the annular pressure unit, and a resin curing step of curing the resin.

In the second pressing step, the annular pressurizing unit may be formed in plural, and the pressurized stamp may be pressurized while the annular pressurizing unit positioned outside the annular pressurizing unit positioned inside.

In addition, when the resin moves to the lower portion of the annular pressurization unit located on the outside due to the annular pressurization unit located on the inner side in the second pressurizing step, press the stamp with the annular pressurization unit located on the outer side. The resin can be filled with a fine pattern of.

The second pressing step may be performed before the first pressing step is completed, and the substrate may be installed in a lower mold, and a resin discharge passage may be formed in the lower mold to discharge the resin.

According to the present invention, by sequentially pressing the stamp using a plurality of pressing units, the resin can be easily applied onto the substrate, and bubbles can be prevented from being collected in the resin layer.

Further, by uniformly applying the pressing force, the thickness of the resin layer can be formed uniformly.

In addition, a hydraulic or pneumatic cylinder is installed in each pressurizing unit so that the pressing force acting on the stamp through the pressurizing unit can be more easily controlled.

In the present invention, the "fine pattern" refers to a pattern in which the height, pitch, etc. of the pattern have a micro or nano size.

In addition, in the present invention, "on" means to be located above or below the target member, and does not necessarily mean to be located above the gravity direction.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.

1 is a flowchart illustrating a fine pattern imprinting method according to a first embodiment of the present invention.

Referring to FIG. 1, the fine pattern imprinting method according to the present embodiment includes a resin discharge step of discharging a resin 120 on a substrate 110 and a stamp 130 having a fine pattern formed on the substrate 110. Stamp pressing step of filling the resin 120 in the fine pattern 135 of the stamp 130 using a stamp installation step and a pressing device for positioning the resin, and a resin curing step of curing the resin 120 do.

As shown in FIG. 1A, a substrate 110 having a flat plate shape is prepared, and the resin 120 is discharged onto the substrate 110 while the discharge device 125 is positioned on the substrate 110. .

The substrate 110 may be made of a polymer or a metal, and the resin 120 may be made of a photo curable resin or a thermosetting resin.

As shown in FIG. 1B, after the stamp 130 having the fine pattern 135 is aligned on the substrate, the stamp 130 is installed on the substrate 110.

As shown in FIG. 1 (c), the pressing force is applied to the stamp 130, and the first pressing force P1 is applied to the center of the stamp 130 using a pressing member (not shown). When the resin 120 flows to the outside by the first pressing force P1 applied to the center, the second pressing force P2 is applied to the outside to which the first pressing force P1 is applied as shown in FIG. do. The second pressing force P2 is applied along the circumference of the first pressing force P1 to flow the resin 120 outward.

When the resin 120 is pushed by the second pressing force P2, the third pressing force P3 is applied to the outside to which the second pressing force P2 is applied, as shown in FIG. 1E. The third pressing force P3 is applied along the circumference of the second pressing force P2 to push the resin 120 outward.

When the resin 120 is pushed by the third pressing force P3, the fourth pressing force P4 is applied to the outside to which the third pressing force P3 is applied, as shown in FIG. 1F. The fourth pressing force P4 is applied to a portion adjacent to the edge of the stamp 130 to fill the resin with the fine pattern 135 of the stamp 130.

As such, when the pressing force is sequentially applied from the center to the outside of the stamp 130, the resin layer positioned at the center of the substrate 110 is gradually pushed outward by the pressing force, and thus the resin layer is formed on the entire substrate 110. Is formed. In addition, as the resin 120 is pushed, air between the stamp 130 and the substrate 110 is pushed together to prevent bubbles from being formed in the resin layer.

2 is a perspective view illustrating a state in which a pressing device is installed on a stamp according to a second embodiment of the present invention, and FIGS. 3A to 3F illustrate a method of imprinting using the pressing device shown in FIG. 2. It is a process chart.

Referring to FIGS. 2 and 3A to 3F, as illustrated in FIG. 3A, first, the substrate 210 is prepared, and the resin 250 is discharged onto the substrate 210. In this case, the substrate 210 may be formed in a large area, and the resin 250 may be formed of a photo resist or a thermosetting resist. In addition, the resin 250 is made of a material having viscosity and fluidity, and is dropped to the center of the substrate 210 by the discharge device 253.

As shown in FIG. 3B, a stamp 230 is installed on the substrate 210. A fine pattern is formed on the stamp 230, and the stamp 230 is placed on the substrate 210 in a state in which the surface on which the fine pattern 235 is formed faces the substrate 210.

As shown in FIG. 3C, after the pressing device 240 is placed on the stamp 230, the pressing device is pressurized, and the pressing device includes a plurality of pressing units.

That is, as shown in detail in FIG. 2, the pressurizing device 240 includes a first pressurized pressurizing unit 243 and a first annular pressurizing that surround the center pressurizing unit 241 and the center pressurizing unit 241 located at the center. And a second annular pressing unit 245 surrounding the unit 243, and a third annular pressing unit 247 surrounding the second annular pressing unit 245.

The center pressurizing unit 241 has a circular cross section, and the annular pressurizing units 243, 245 and 247 have a circular ring cross section. The pressure units 241, 243, 245, 247 is made of a structure that can be fitted to each other, the center pressure unit 241 is formed to be fitted to the first annular pressure unit 243, the first ring Type pressing unit 243 is formed to be fitted to the second annular pressing unit 245, the second annular pressing unit 245 is formed to be fitted to the third annular pressing unit 247. .

Referring to FIG. 3C again, the center pressurizing unit 241 located in the center of the stamp 230 is moved downward to press the stamp 230. When the center pressurizing unit 241 pressurizes the stamp 230, the resin 250 is pushed outward, and as shown in FIG. 3D, when the resin 250 is pushed below the first annular pressurizing unit 243. The first annular pressing unit 243 is moved downward to press a portion located outside the center pressing unit 241 in the stamp 230.

As shown in FIG. 3E, when the resin 250 is pushed by the first annular pressing unit 243, the first annular pressing unit is moved from the stamp 230 by moving the second annular pressing unit 245 downward. The part located outside the 243 is pressed.

As shown in FIG. 3F, when the resin 250 is pushed by the second annular pressure unit 245, the second annular pressure unit is moved from the stamp 230 by moving the third annular pressure unit 247 downward. The part located outside the 245 is pressed.

At this time, the center pressurizing unit 241 and the first and second pressurizing units 243 and 245 maintain the pressurizing state of the stamp 230 so that the resin 250 may spread outward without being reversed.

When the filling of the resin 250 in the fine pattern 235 of the stamp 230 is completed by the third annular pressing unit 247, the pressing units 241, 243, 245, and 247 are stamp 230. The pressing force acting on the same is maintained to adjust the resin layer to have a uniform thickness and shape.

The pressure in which the pressure units 241, 243, 245, and 247 pressurizes the stamp 230 may be adjusted by controlling the position of the pressure units 241, 243, 245 and 247, and the pressure units 241. , 243, 245, 247 may be adjusted by directly controlling the pressing force.

When the pressurization by the stamp 230 is completed, the resin layer is cured by irradiating ultraviolet rays with the resin layer in the state where the stamp 230 is installed. When the ultraviolet ray is irradiated with the resin layer, the resin 250 is cured with a free radical polymerization plate.

The resin layer according to the present embodiment is made of a photocurable resin and exemplifies that the resin layer is cured by irradiating ultraviolet rays with the resin layer. However, the present invention is not limited thereto, and the resin layer is made of a thermosetting resin. Heat may be applied to the resin layer to cure the resin.

4 is a cross-sectional view illustrating a process of imprinting a fine pattern using a pressing member according to a third exemplary embodiment of the present invention.

Referring to FIG. 4, the substrate 312 according to the present embodiment is located in the lower mold 325. The lower mold 325 has a groove in which a substrate is mounted, and a resin discharge passage 326 is formed at a side thereof so that the surplus resin can be discharged. The resin discharge passage 326 is formed at the same height as the top surface of the substrate 312 so that the resin spilled on the substrate 312 can be easily exited.

After the resin 313 is discharged onto the substrate 312 and the stamp 315 is installed on the resin 313, the stamp 315 is pressed using the pressurizing device 300.

The pressurizing device 300 includes a side frame 321 and an upper frame 323 supported by the side frame 321, pressure units 361, 362, 364 installed on the upper frame 323, and an upper frame 323. And a hydraulic cylinder 340 installed between the pressure units 361, 362, and 364 to transfer the pressure units 361, 362, and 364.

The pressurizing units 361, 362, and 364 are the outer side of the first annular pressurizing unit 362 and the first annular pressurizing unit 362 surrounding the center pressurizing unit 361 and the center pressurizing unit 361 installed at the center. It is located in the second annular pressing unit (362) consists of a second annular pressing unit (364).

A hydraulic cylinder 340 is installed at the upper portion of each of the pressure units 361, 362, and 364. The hydraulic cylinders 340 control the pressure units 361, 362, and 364 to an appropriate position to stamp 315. It serves to pressurize. In addition, the hydraulic cylinder 340 may move the pressurizing units 361, 362, 364 downward by applying an appropriate pressure to the pressurizing units 361, 362, 364. The pressurizing units 361, 362, The pressure unit no longer moves when the pressure 364 is in contact with the stamp 315 and acts by the hydraulic cylinder 340 and the pressure between the stamp 315 and the pressure units 361, 362, 364 is the same. It is also possible to apply an appropriate pressure to the stamp 315 so as not to be. In the present embodiment, the hydraulic cylinder 340 is illustrated as being applied, but the present invention is not limited thereto, and a pneumatic cylinder may be applied.

When the hydraulic cylinder 340 is installed in each of the pressure units 361, 362, and 364 as in this embodiment, the pressing force applied to the stamp 315 through the pressure units 361, 362, and 364 is easier. Can be controlled.

The pressurization step using the pressurizing units 361, 362, and 364 may be performed by pressing the stamp using the first pressurizing step and the first annular pressurizing unit 362 using the center pressurizing unit 361. And a second pressing step of pressing the stamp 315 using the second pressing step of pressing the 315 and the second annular pressing unit 364.

At this time, the first pressing step is started first, the second pressing step is performed before the first pressing step is completed, and the third pressing step is performed before the second pressing step is completed. In this way, if the pressurization is continued, the flow of the resin can be continued without stopping the imprinting process more quickly.

In the above description of the preferred embodiment of the present invention, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is a flowchart illustrating a fine pattern imprinting method according to a first embodiment of the present invention.

2 is a perspective view showing a state in which a pressing device is installed on a stamp according to a second embodiment of the present invention.

3A to 3F are process diagrams for explaining a method of imprinting using the pressurization apparatus shown in FIG. 2.

4 is a cross-sectional view illustrating a process of imprinting a fine pattern using a pressing member according to a third exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: substrate 120: resin

135: fine pattern 130: stamp

Claims (17)

A resin ejecting step of ejecting the resin on the substrate; A stamp installation step of placing a stamp having a fine pattern formed on the substrate; A stamp pressing step of filling resin into the fine pattern of the stamp using a pressing device; And A resin curing step of curing the resin; Including; The pressing device includes a plurality of pressing units, wherein the stamp pressing step is a fine pattern imprinting method for pressing the stamp sequentially from the pressing unit disposed in the center of the stamp to the pressing unit disposed outside. The method of claim 1, In the stamp pressing step, the resin flows outward from the center of the substrate, and the pressing force applied to the stamp during the flow of the resin decreases from the center to the outside, In the stamp pressing step, the pressing force acting on the stamp has a uniform pressure gradient according to the distance from the center fine pattern imprinting method. The method of claim 1, The fine pattern is a fine pattern imprinting method having a micro or nano size pitch. The method of claim 1, The pressing device is a fine pattern imprinting method comprising a center pressing unit formed in the center and a plurality of annular pressing units surrounding the center pressing unit. The method of claim 1, The pressing unit is a fine pattern imprinting method consisting of a piston. The method of claim 1, The pressing unit is a fine pattern imprinting method for pressing the stamp in a pressure control method. The method of claim 1, The pressing unit is a fine pattern imprinting method for pressing the stamp in a position control method. The method of claim 1, Fine pattern imprinting method is installed in the pressure unit is installed in each of the hydraulic or pneumatic cylinder to control the transfer of the pressing unit The method of claim 1, The resin curing step is fine pattern imprinting method comprising the step of irradiating ultraviolet light toward the resin. 10. The method of claim 9, In the resin curing step, the resin is a fine pattern imprinting method that is cured by a free radical polymerization. The method of claim 1, The resin curing step is a fine pattern imprinting method comprising the step of applying heat toward the resin. The method of claim 1, The stamp pressing step may include uniformly fine pattern imprinting including maintaining a pressing force acting on the stamp through the pressing units when the resin is filled in the fine pattern of the stamp and the resin is no longer flowing. Way. A resin ejecting step of ejecting the resin on the substrate; A stamp installation step of placing a stamp having a fine pattern formed on the substrate; First pressurizing the stamp to the center pressurizing unit in pressurizing the stamp by using a pressurizing device including a center pressurizing unit and an annular pressurizing unit surrounding the center pressurizing unit to induce the resin to spread outwardly. step; A second pressing step of inducing the resin to spread outward by pressing the stamp with the annular pressing unit when the resin is located in the annular pressing unit; And A resin curing step of curing the resin; Fine pattern imprinting method comprising a. The method of claim 13, In the second pressing step, the annular pressurizing unit is formed of a plurality, and the micro-pattern imprinting method for pressurizing the stamp while the annular pressurizing unit positioned outside the annular pressurizing unit located inside. The method of claim 13, In the second pressing step, when the resin moves to the lower portion of the annular pressurization unit located at the outside due to the annular pressurization unit located at the inner side, the stamp is pressurized by the annular pressurization unit located at the outside to form a fine stamp. Fine pattern imprinting method to fill resin with pattern. The method of claim 13, The fine pattern imprinting method in which the second pressing step is performed before the first pressing step is completed. The method of claim 13, The substrate is installed in the lower mold, fine pattern imprinting method has a resin discharge passage formed in the lower mold so that the resin can be discharged.

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