KR101810875B1 - 플라즈마 처리 장치, 데이터 처리 장치 및 데이터 처리 방법 - Google Patents

플라즈마 처리 장치, 데이터 처리 장치 및 데이터 처리 방법 Download PDF

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KR101810875B1
KR101810875B1 KR1020160007509A KR20160007509A KR101810875B1 KR 101810875 B1 KR101810875 B1 KR 101810875B1 KR 1020160007509 A KR1020160007509 A KR 1020160007509A KR 20160007509 A KR20160007509 A KR 20160007509A KR 101810875 B1 KR101810875 B1 KR 101810875B1
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세이이치 와타나베
사토미 이노우에
시게루 나카모토
고스케 후쿠치
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가부시키가이샤 히다치 하이테크놀로지즈
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
    • G06F17/13—Differential equations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Computational Mathematics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Theoretical Computer Science (AREA)
  • Algebra (AREA)
  • Databases & Information Systems (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Plasma Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Probability & Statistics with Applications (AREA)
KR1020160007509A 2015-05-12 2016-01-21 플라즈마 처리 장치, 데이터 처리 장치 및 데이터 처리 방법 Active KR101810875B1 (ko)

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JP2015097000A JP6553398B2 (ja) 2015-05-12 2015-05-12 プラズマ処理装置、データ処理装置およびデータ処理方法
JPJP-P-2015-097000 2015-05-12

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KR20160133352A KR20160133352A (ko) 2016-11-22
KR101810875B1 true KR101810875B1 (ko) 2017-12-20

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US (2) US10615010B2 (enExample)
JP (1) JP6553398B2 (enExample)
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JP6239294B2 (ja) * 2013-07-18 2017-11-29 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の運転方法
JP6318007B2 (ja) * 2013-11-29 2018-04-25 株式会社日立ハイテクノロジーズ データ処理方法、データ処理装置および処理装置
KR102063049B1 (ko) 2016-10-14 2020-01-07 주식회사 엘지화학 금속폼의 제조 방법
JP6676020B2 (ja) * 2017-09-20 2020-04-08 株式会社日立ハイテク プラズマ処理装置及びプラズマ処理装置状態予測方法
CN108897283B (zh) * 2018-05-31 2022-07-19 中策橡胶集团股份有限公司 一种炼胶生产线数据分析处理方法
JP6990634B2 (ja) * 2018-08-21 2022-02-03 株式会社日立ハイテク 状態予測装置及び半導体製造装置
KR102286360B1 (ko) * 2019-02-08 2021-08-05 주식회사 히타치하이테크 에칭 처리 장치, 에칭 처리 방법 및 검출기
JP7188560B2 (ja) * 2019-03-27 2022-12-13 株式会社島津製作所 ポンプ監視装置、真空ポンプおよび生成物堆積診断用データ処理プログラム
KR102429079B1 (ko) 2019-12-23 2022-08-03 주식회사 히타치하이테크 플라스마 처리 방법 및 플라스마 처리에 이용하는 파장 선택 방법
US10922056B1 (en) * 2020-04-24 2021-02-16 DESC (Dubai Electronic Security Center) Atmospheric pressure air microplasma system for true random bit generation
US12051575B2 (en) 2020-09-30 2024-07-30 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
US11437289B2 (en) 2020-09-30 2022-09-06 Hitachi High-Tech Corporation Plasma processing apparatus and plasma processing method
CN112269963A (zh) * 2020-10-27 2021-01-26 南开大学 一种多项式拟合的纳米随机表面光学特性快速预测算法
CN112668125B (zh) * 2021-01-06 2023-07-04 北京信息科技大学 提高非完整小圆弧评价精度的方法、系统、介质及设备
US12001310B2 (en) * 2021-04-05 2024-06-04 International Business Machines Corporation Approximating activity loads in databases using smoothed time series
US20250118537A1 (en) * 2022-06-21 2025-04-10 Hitachi High-Tech Corporation Plasma processing apparatus and heating apparatus
CN118350974B (zh) * 2024-06-14 2024-09-20 山东征途信息科技股份有限公司 一种智慧社区综合康养监护方法及系统

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US6153115A (en) * 1997-10-23 2000-11-28 Massachusetts Institute Of Technology Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
JP3383236B2 (ja) 1998-12-01 2003-03-04 株式会社日立製作所 エッチング終点判定方法及びエッチング終点判定装置
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JP3694662B2 (ja) * 2001-09-17 2005-09-14 株式会社日立製作所 半導体素子製造プロセスにおける膜の処理量測定方法と装置、及びそれを用いた被処理材の処理方法と装置、及びそれを用いたプロセスの終点判定方法と装置
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JP4943716B2 (ja) * 2006-03-01 2012-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5026326B2 (ja) 2008-04-04 2012-09-12 株式会社日立ハイテクノロジーズ エッチング処理状態の判定方法、システム
JP5383265B2 (ja) 2009-03-17 2014-01-08 株式会社日立ハイテクノロジーズ エッチング装置、分析装置、エッチング処理方法、およびエッチング処理プログラム
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JP6553398B2 (ja) 2019-07-31
TW201640580A (zh) 2016-11-16
US20160336154A1 (en) 2016-11-17
US11605530B2 (en) 2023-03-14
JP2016213360A (ja) 2016-12-15
TWI590326B (zh) 2017-07-01
US20200203133A1 (en) 2020-06-25
US10615010B2 (en) 2020-04-07
KR20160133352A (ko) 2016-11-22

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