KR101806245B1 - OIS Module and the Manufacturing Method of the Same - Google Patents

Abstract

Disclosed is a method for manufacturing a hand vibration preventing module, which can perform coupling and electrification between components at the same time to simplify a work process and to reduce the number of consumed components. The method for manufacturing the hand vibration module comprises the steps of: manufacturing an upper body; manufacturing a lower body; and arranging the lower body, support balls and the upper body sequentially on a base. The step of manufacturing the upper body comprises the steps of: arranging an upper crimping plate; arranging a suspension spring having an upper coupling hole through which the upper crimping plate is exposed; supplying a solder ball to the upper coupling hole; and irradiating the solder ball supplied to the upper coupling hole with laser to fuse the upper crimping plate and the suspension spring.

Description

[0001] The present invention relates to an OIS module and a manufacturing method thereof,

The present invention relates to an anti-shake module, and more particularly, to an anti-shake module and an anti-shake module that combine module parts by automatic laser welding using a solder ball.

Optical Image Stabilizer (OIS) using Shape Memory Alloy (SMA) realizes the prevention of camera shake by using the property of returning to the original shape at a certain temperature of the shape memory alloy.

When the shape memory alloy is made into a wire shape and is returned to its original shape by using the heat by the resistance, the shake prevention is realized by utilizing the section where the wire length changes linearly. The technique of using a shape memory alloy wire as an actuator is newly applied to a video image stabilizer.

Unlike the conventional optical image stabilizer, the optical image stabilizer using the shape memory alloy does not require the use of a magnetic material, so that the structure is simple and there is no magnetic field interference between the parts.

When magnetic field interference occurs in a limited space, existing optical image stabilization devices are limited in the location of the camera module. The above-mentioned positioning constraint is recognized as a fatal weakness in hardware design.

In the production of an optical anti-shake apparatus using a conventional shape memory alloy, an epoxy bond working process was used. In the epoxy bonding work, bonding work and thermosetting between the parts, additional work for energizing, and a complex process were required.

In addition, a dispenser is needed to supply the thermoset epoxy bond to the component. Since the camera module is getting smaller and smaller, it is difficult to apply the epoxy bonding process because the width of the component is narrow. Therefore, a technology for solving the problem is continuously required in the field.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an anti-shake module by supplying a solder ball to a predetermined portion of a component and reducing the number of processes by coupling and energizing the components.

In order to achieve the above object, the present invention provides a method of manufacturing a lower body, comprising the steps of: fabricating an upper body; fabricating a lower body; and sequentially arranging the lower body, the support ball, The step of fabricating the body includes the steps of disposing a printed circuit board, disposing a lower crimping plate having a lower engaging hole in which one side of the printed circuit board is exposed, supplying a solder ball to the lower engaging hole, Applying a laser to the solder ball supplied to the lower fitting hole to fuse one surface of the lower crimping plate to the printed circuit board; And a step of disposing a bearing plate having a current-carrying hole therein.

The step of fabricating the upper body includes disposing an upper crimping plate and a suspension spring having an upper coupling hole through which the upper crimping plate is exposed and a pair of resilient arms spaced along the rim, Supplying a solder ball to the upper coupling hole, and fusing the upper crimping plate and the suspension spring by irradiating a laser beam onto the solder ball supplied to the upper coupling hole.

The method of manufacturing an anti-shake module further includes joining the upper body and the lower body, wherein the joining comprises: supplying a solder ball for joining the pair of arms and the bearing plate; And irradiating a solder ball to be supplied with a laser to fuse the suspension spring and the bearing plate.

A plurality of the lower coupling holes may be provided and solder balls supplied to at least one lower coupling hole of the lower coupling holes may electrically connect the printed circuit board and the lower crimping plate.

The step of fabricating the lower body may further include a step of supplying a solder ball to the conductive hole and fusing the other surface of the printed circuit board with the bearing plate by irradiating a laser beam onto the solder ball supplied to the conductive hole .

The solder balls supplied to the current-carrying holes may electrically connect the printed circuit board and the bearing plate.

A lower crimping plate including a base, a printed circuit board supported by the base, an upper coupling hole on one side of which is fused with the printed circuit board and on which a solder ball for fusion bonding is seated, A suspension spring disposed on the other surface of the finging plate and including a lower engaging hole on which the solder ball is seated; an upper crimping plate which melts the solder ball seated in the lower engaging hole and fuses with the suspension spring, And a shape memory alloy wire connected to the upper crimping plate and the lower crimping plate to horizontally move the upper crimping plate, thereby achieving the above object.

Wherein the anti-shake module includes a support ball for supporting the suspension spring, and a bearing plate disposed between the base and the printed circuit board and supporting the support ball, wherein the printed circuit board and the lower crimping plate And a plurality of ball seats for determining the position of the support ball.

The suspension spring is separated from the rim and is formed with a pair of arms extending at regular intervals in the rim, and the pair of arms and the bearing plate can be coupled by fusion of the solder balls.

As described above, the method for manufacturing an anti-shake module according to an embodiment of the present invention can simultaneously connect and energize components, simplifying the work process and reducing the number of auxiliary materials consumed.

1 is an exploded view illustrating a camera including an anti-shake module according to an embodiment of the present invention.
2 is an exploded perspective view of an anti-shake module according to an embodiment of the present invention.
3 is a flowchart showing a manufacturing method of the anti-shake module.
4 is a bottom view of the upper crimping plate and the suspension spring.
5A and 5B are views showing a method of combining the upper crimping plate and the suspension spring.
6 is a flowchart showing a manufacturing method of the upper body.
7 is a plan view showing the arrangement of the lower crimping plate and the printed circuit board.
8 is a plan view in which a printed circuit board and a bearing plate are arranged.
9 is a plan view of the bearing plate.
10 is a flowchart showing a manufacturing method of the lower body.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. It should be understood, however, that the techniques described herein are not intended to be limited to any particular embodiment, but rather include various modifications, equivalents, and / or alternatives of the embodiments of this document. In connection with the description of the drawings, like reference numerals may be used for similar components.

Also, the terms "first," "second," and the like used in the present document can be used to denote various components in any order and / or importance, and to distinguish one component from another But is not limited to those components. For example, the first user equipment and the second user equipment may represent different user equipment, regardless of order or importance. For example, without departing from the scope of the rights described in this document, the first component can be named as the second component, and similarly the second component can also be named as the first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the other embodiments. The singular expressions may include plural expressions unless the context clearly dictates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. The general predefined terms used in this document may be interpreted in the same or similar sense as the contextual meanings of the related art and, unless expressly defined in this document, include ideally or excessively formal meanings . In some cases, even the terms defined in this document can not be construed as excluding the embodiments of this document.

Hereinafter, a structure and a manufacturing method of an anti-shake module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded view illustrating a camera including an anti-shake module according to an embodiment of the present invention.

Referring to FIG. 1, the lens driving apparatus 1 includes a case 10, a lens barrel 20, and an anti-shake module 100. The case 10 and the anti-shake module 100 have openings through which the lens barrel 20 passes.

The lens driving apparatus 1 may further include an auto focus adjustment module 30. [

FIG. 2 is an exploded perspective view of an anti-shake module according to an embodiment of the present invention, and FIG. 3 is a flowchart showing a method of manufacturing an anti-shake module.

Referring to FIG. 2, the anti-shake module 100 includes a roll of the upper body 210 and the lower body 220.

The upper body 210 includes an upper crimping plate 110 and a suspension spring 120. One end of the shape memory alloy wire 115 is fixed to the upper crimping plate 110. The suspension spring 120 has elasticity and resiliently supports the upper crimping plate 110 disposed thereon.

The lower body 220 is sequentially laminated with the lower crimping plate 130, the printed circuit board 140, and the bearing plate 150. And the other end of the shape memory alloy wire 115 is fixed to the lower crimping plate 130. The printed circuit board 140 and the lower crimping plate 130 are electrically coupled. The current transferred to the printed circuit board 140 is transferred to the lower crimping plate 130 and flows to the shape memory alloy wire 115 electrically connected to the lower crimping plate 130.

When the current is applied to the shape memory alloy wire 115 and the temperature changes or the resistance changes, the length of the shape memory alloy wire 115 changes due to the phase change of the alloy. Utilizing this property, the shape memory alloy wire 115 moves the fixed upper crimping plate 110 in the horizontal direction, and is used as an actuator of a camera having an anti-shake function.

That is, the lower body 220 is fixed to the base 170 to function as a fixing part, and the upper crimping plate 110 connected by the lower body 220 and the shape memory alloy wire 115 horizontally moves as a driving part do.

Referring to FIGS. 2 and 3, the upper body 210 is manufactured by combining the upper crimping plate 110 and the suspension spring 120. The lower body 220 is manufactured by assembling the lower crimping plate 130, the printed circuit board 140, and the bearing plate 150 (S301).

The lower body 220 is disposed on the base 170 and the support balls 161, 162, 163 and 164 are arranged in predetermined positions and the support balls 161, 162, 163 and 164 are disposed on the upper body 210 ).

The support balls 161, 162, 163 and 164 are arranged so as to keep the upper body 210 horizontal. That is, the support balls 161, 162, 163, and 164 are disposed such that the center of gravity of the upper body 210 and the center of gravity of the support balls 161, 162, 163, and 164 are at the same positions on the X-Y plane. The number of the support balls 161, 162, 163, 164 is not limited to four as long as the upper body 210 can be kept horizontal.

FIG. 4 is a bottom view of the upper crimping plate and the suspension spring, FIGS. 5A and 5B are views showing a method of coupling the upper crimping plate and the suspension spring, and FIG. Fig.

Referring to FIG. 4, the upper body 210 includes an upper crimping plate 110 and a suspension spring 120.

The upper crimping plate 110 includes upper fixing portions 111 and 112 to which the shape memory alloy wire 115 can be fixed.

The suspension spring 120 includes resilient arms 121 and 122 and is resiliently disposed within the case so that the suspension spring 120 can elastically support the upper crimping plate 110. [ The suspension spring 120 may include upper fitting holes 123a, 123b, 123c, 123d, and 123e in which solder balls are disposed.

The arms 121 and 122 having elasticity are fusion-bonded by fusion of a solder ball and a bearing plate to be described later.

Although the coupling hole is shown as an opening for coupling in Fig. 4, the coupling hole may be formed at the edge portion of a member for coupling (e.g., a member having an opening for coupling such as a suspension spring 120, a bearing plate 150, And may be rounded to the inside.

Solder balls are arranged in the upper coupling holes 123a, 123b, 123c, 123d and 123e and the laser beam is irradiated to melt the solder balls so that the upper crimping plate 110 and the suspension spring 120 are fused together.

Although the suspension spring 120 is shown as including the upper engagement holes 123a, 123b, 123c, 123d, and 123e in FIG. 4, the upper crimping plate 110 may have openings instead.

5A and 6, in order to assemble the upper body 210, the upper crimping plate 110 is disposed (S601), and the suspension spring 120 corresponds to the shape of the upper crimping plate 110 (S602).

In order to improve lifting of the upper crimping plate 110 and the suspension spring 120, a product can be closely contacted by using a tension jig.

When the upper crimping plate 110 has an opening, the suspension spring 120 may be disposed first and the upper crimping plate 110 may be disposed on the upper surface of the suspension spring 120 .

Then, a solder ball 125 is supplied to the upper coupling holes 123a, 123b, 123c, 123d, and 123e (S603). The solder ball may have a diameter of 1 mm or less. In general, a solder ball 125 having a thickness of about 400 mu m can be used. The size of the solder ball 125 required is determined by the size of the upper coupling holes 123a, 123b, 123c, 123d, and 123e.

The solder ball 125 is supplied to the predetermined position through the solder ball supply device (not shown), and the solder ball can be supplied by an amount necessary for coupling the parts.

The laser device 200 irradiates laser to the solder balls 125 supplied to the upper coupling holes 123a, 123b, 123c, 123d and 123e to fuse the upper crimping plate 110 and the suspension spring 120 S604).

Additional angular correction jigs can be used to form the fillets at the corners of the soldering.

Referring to FIG. 5B, a process of joining the upper crimping plate 110 and the suspension spring 120 using a reflow process instead of the solder ball process is shown.

5A, the upper crimping plate 110 and the suspension spring 120 are disposed. As described above, when the upper crimping plate 110 has an opening, the suspension spring 120 may be disposed first, and the upper crimping plate 110 may be disposed on the upper surface of the suspension spring 120.

A mask 126 having a shape corresponding to the suspension spring 120 is disposed on the upper surface of the suspension spring 120 and a solder cream 127a is applied on the mask 126 to form upper engagement holes 123a, , 123d, and 123e, and the mask is removed.

Thereafter, a reflow process is applied to melt the solder cream in the oven. Suspension spring 120 and upper crimping plate 110 are joined by molten solder cream 127b.

FIG. 7 is a plan view of the lower crimping plate and the printed circuit board, FIG. 8 is a plan view of the printed circuit board and the bearing plate, FIG. 9 is a plan view of the bearing plate, As shown in Fig.

7 and 10, the printed circuit board 140 is disposed (S1001), and the lower crimping plate 130 is disposed on the printed circuit board 140 (S1002).

The lower crimping plate 130 includes a plurality of crimping plate parts 131a, 131b, 131c, and 131d. Although a plurality of crimping plate parts 131a, 131b, 131c and 131d are shown as the lower crimping plate 130 in FIG. 7, a plurality of crimping plate parts 131a, 131b, 131c and 131d They can be combined into a single plate.

Each of the crimping plate parts 131a, 131b, 131c and 131d includes lower fitting holes 133a, 133b, 133c and 133d and first ball catches 135a, 135b, 135c and 135d.

The first ball receiving ports 135a, 135b, 135c and 135d are openings in which the support balls 161, 162, 163 and 164 are arranged, to be. The areas where the support balls 161, 162, 163, and 164 can be positioned are determined by the first ball receiving ports 135a, 135b, 135c, and 135d.

Solder balls are supplied to the lower coupling holes 133a, 133b, 133c, and 133d (S1003). The solder ball may have a diameter of 1 mm or less. The size of the solder balls required is determined by the size of the lower coupling holes 133a, 133b, 133c, and 133d.

The laser device irradiates the solder balls supplied to the lower coupling holes 133a, 133b, 133c and 133d with a laser to fuse the lower crimping plate 130 and the printed circuit board 140 (S1004).

Referring to FIG. 8, the printed circuit board 140 includes solder ball seats 143a, 143b, 143c, and 143d and a second ball seat 145a corresponding to the first ball seats 135a, 135b, 135c, , 145b, 145c, and 145d.

The solder ball seating portions 143a, 143b, 143c, and 143d are positions corresponding to the lower coupling holes 133a, 133b, 133c, and 133d, and are solder ball supply portions. The solder ball seating portions 143a, 143b, 143c, and 143d may have fine grooves and may be flat. The printed circuit board 140 serves to supply the supplied power to the lower crimping plate 130 so that the solder ball seats 143a, 143b, 143c, and 143d are positioned at positions where the lower crimping plate 130 needs to be energized As shown in FIG. The lower crimping plate 130 and the printed circuit board 140 can be energized by fusion of the lower crimping plate 130 and the printed circuit board 140 by solder balls.

The bearing plate 150 includes engagement regions 147a and 147b on which a pair of resilient arms 121 and 122 (see FIG. 4) are seated. A pair of arms 121, 122 extend along the rim at spaced apart portions of the edge of the bearing plate 150. The pair of arms 121 and 122 may be formed to be bent according to the shape of the rim.

 The arms 121 and 122 having elasticity are seated in the coupling regions 147a and 147b and the solder balls are disposed between the arms 121 and 122 and the coupling regions 147a and 147b.

The solder balls placed are melted by laser irradiation. The bearing plate 150 and the suspension spring 120 can be coupled with each other.

The present invention is not limited to the arrangement of the solder balls between the suspension spring 120 and the bearing plate 150. The present invention is not limited to this, A solder ball is disposed on the side surfaces of the first and second electrodes 147a and 147b and can be melted by irradiating a laser.

With the melting of the solder balls, the suspension spring 120 and the bearing plate 150 can be physically coupled as well as electrically coupled.

Referring to FIG. 9, the bearing plate 150 includes a base engagement portion 158, 159.

The bearing plate 150 includes support balls 161, 162, 163, and 164 disposed through the first ball seats 135a, 135b, 135c, and 135d and the second ball seats 145a, 145b, 145c, Lt; / RTI > The support balls 161, 162, 163, and 164 supported by the bearing plate 150 support the upper body 210.

The base engaging portions 158 and 159 are engaged with protrusions 178 and 179 projecting vertically from the surface of the base 170 to the inside. The lower crimping plate 130 and the printed circuit board 140 also have respective engaging openings 139 and 149 at positions corresponding to the base engaging portions 158 and 159. The lower body 220 may be installed on the base 170 through the coupling openings 139 and 149 and the base joints 158 and 159.

The bearing plate 150 also engages with the printed circuit board 140 and can be energized with the printed circuit board 140. The bearing plate 150 may include a conductive hole (not shown) around which the solder ball can be mounted on the conductive part or the terminal part 146 so that the printed circuit board 140 and the bearing plate 150 are electrically connected. The conductive pattern of the printed circuit board 140 and the bearing plate 150 are electrically coupled to each other so that the bearing plate 150 can function as a grounding portion or a shielding plate.

The conductive hole may be formed in the printed circuit board 140 as long as it is electrically connected to the conductive pattern of the printed circuit board 140. [

In order to overlap the printed circuit board 140 and the bearing plate 150, the printed circuit board 140 and the bearing plate 150 are disposed in a manner similar to that shown in FIGS. 6 and 10, and a solder ball is supplied do. Then, the solder balls are irradiated with a laser beam to fuse the printed circuit board 140 and the bearing plate 150 together.

As described above, the anti-shake module 100 and the anti-shake module 100 according to an embodiment of the present invention can utilize an automatic laser welding method using a solder ball. The solder ball feeder can supply the solder balls with the required amount of solder balls in the correct position, and irradiates the supplied solder balls with the laser so that the respective parts are coupled.

In addition, there is an advantage in that a separate energization process is reduced for a portion requiring energization, and an adhesive film or an epoxy bonding operation for bonding is not separately required. In addition, since the solder balls can be supplied to the upper engagement holes 123a, 123b, 123c, 123d, and 123e and the lower engagement holes 133a, 133b, 133c, and 133d by a predetermined amount, wasted solder is reduced.

In addition, the bearing plate 150 is electrically coupled to the printed circuit board 140 by the solder ball, so that the bearing plate 150 can be utilized as a shielding member, and the number of components used in the anti-shake module of the present invention is reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

10: Case 20:
30: Automatic focusing device 100: Anti-shake module
110: upper crimping plate 115: shape memory alloy wire
120: suspension spring 130: lower crimping plate
140: printed circuit board 150: bearing plate
161, 162, 163, 164: support ball 170: base
210: upper body 220: lower body

Claims (9)

Supplying a solder ball between the upper crimping plate and the suspension spring and irradiating a laser to the solder ball to manufacture an upper body coupled with the upper crimping plate and the suspension spring;
Fabricating a lower body to which a lower crimping plate and a bearing plate are coupled to the printed circuit board and which is electrically connected;
Sequentially arranging the lower body, the spherical support ball, and the upper body on a base; And
Supplying a solder ball between the suspension spring and the bearing plate and irradiating the solder ball with laser to couple the upper body and the lower body; Lt; / RTI >
The step of fabricating the lower body comprises:
Disposing the printed circuit board;
Disposing the lower crimping plate having a lower engaging hole in which one side of the printed circuit board is exposed;
Supplying a solder ball to the lower fitting hole;
Irradiating a solder ball supplied to the lower coupling hole with laser to fuse one surface of the lower crimping plate and the printed circuit board; And
And disposing the bearing plate on the other surface of the printed circuit board, the bearing plate having a conductive hole through which the conductive pattern of the printed circuit board is exposed. The method according to claim 1,
The step of fabricating the upper body comprises:
Disposing the upper crimping plate;
Disposing the suspension spring having a pair of resilient arms spaced along the rim and an upper coupling hole through which the upper crimping plate is exposed;
Supplying a solder ball to the upper coupling hole; And
And irradiating a laser beam onto a solder ball supplied to the upper coupling hole to fuse the upper crimping plate and the suspension spring. 3. The method of claim 2,
Wherein coupling the upper body and the lower body comprises:
Supplying a solder ball for coupling the pair of arms and the bearing plate; And
And irradiating a laser beam onto the solder ball to fuse the suspension spring and the bearing plate. The method according to claim 1,
Wherein a plurality of the lower engagement holes are present,
And the solder balls supplied to at least one lower coupling hole of the lower coupling holes electrically connect the printed circuit board and the lower crimping plate. The method according to claim 1,
The step of fabricating the lower body comprises:
Supplying a solder ball to the electrifying hole;
And irradiating a laser beam onto the solder ball supplied to the electrifying hole to fuse the other surface of the printed circuit board with the bearing plate. 6. The method of claim 5,
And wherein the solder ball supplied to the electrification hole electrically connects the printed circuit board and the bearing plate. Base;
A printed circuit board supported by the base;
A lower crimping plate on one side of which is fused to the printed circuit board through a solder ball melted by a laser, and on which an upper coupling hole on which the solder ball is mounted is formed;
A suspension spring disposed on the other surface of the lower crimping plate and having a lower coupling hole for receiving a solder ball therein;
An upper crimping plate welded to the suspension spring through a solder ball that is seated on the lower fitting hole and melted by a laser and is horizontally movable;
A support ball received in the printed circuit board and the lower crimping plate and formed in a spherical shape to support the suspension spring in point contact with the suspension spring;
A bearing plate disposed between the base and the printed circuit board to support the support ball and fused to the suspension spring through a solder ball melted on one side by a laser; And
And a shape memory alloy wire connected to the upper crimping plate and the lower crimping plate to horizontally move the upper crimping plate,
Wherein the upper crimping plate and the bearing plate are coupled to the printed circuit board through a solder ball melted by the laser and are electrically connected. 8. The method of claim 7,
Wherein the printed circuit board and the lower crimping plate comprise a plurality of ball seats for determining the position of the support ball. 8. The method of claim 7,
Wherein the suspension spring is separated from a rim and is formed with a pair of arms extending at regular intervals in the rim, and the pair of arms and the bearing plate are coupled by fusion of a solder ball.

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