JP6782114B2 - Lens drive device - Google Patents

Description

The present invention relates to, for example, a lens driving device mounted on a portable device with a camera and capable of moving a lens in the optical axis direction, and particularly to a lens driving device capable of moving a lens in a direction intersecting the optical axis direction.

In recent years, it has become common for mobile devices such as mobile phones to be equipped with a small camera. The lens drive device, which is the main component of the camera mechanism mounted on this small portable device, is used for autofocus for shooting still images or moving images, and is compact and accurately lens body (lens is attached). It was necessary to have a function to drive the lens barrel). As a lens driving device that should satisfy this requirement, a device in which a magnetic circuit for driving a lens holder (lens holding member) that holds a lens body is provided around the lens holder is well known.

Recently, in order to improve the quality of images taken by this small camera, attempts have been made to incorporate the image stabilization mechanism used in general cameras into this small camera. There are various methods for this image stabilization mechanism, such as a method of moving a lens, a method of moving an autofocus drive device, and a method of moving an image sensor (for example, CCD; Charge Coupled Device). Then, among the above-mentioned image stabilization mechanisms, a lens driving device incorporating a method of moving the lens has been proposed.

As the lens driving device described above, Patent Document 1 (conventional example) proposes a lens driving device 900 as shown in FIGS. 20 and 21. FIG. 20 is an exploded perspective view of the conventional lens driving device 900. 21A and 21B are views for explaining a conventional lens driving device 900, FIG. 21A is an upward perspective view of the lens driving device 900, and FIG. 21B is a lower side view of the lens driving device 900. It is a perspective view. In FIG. 21A, the outer case 904 shown in FIG. 20 is omitted. Further, in FIG. 21B, the outer case 904 and the suspension mechanism portion 903 shown in FIG. 20 are omitted.

The lens driving device 900 shown in FIG. 20 is obtained by moving the autofocus actuator 902 (first holding body) for the autofocus function for focusing the camera and the autofocus actuator 902 in a minute manner according to camera shake. It is configured to include a suspension mechanism portion 903 (second holding body) for camera shake correction that keeps the shaft constant. In the lens driving device 900, the autofocus actuator 902 as the first holding body and the suspension mechanism portion 903 as the second holding body are housed in the outer case 904.

First, as shown in FIG. 20, the autofocus actuator 902 includes a lens holder 921 that holds a lens body (not shown) and a first coil 922 that constitutes a moving mechanism that moves the lens holder 921 along the optical axis direction. It is composed of four magnets 923, an inner yoke 924 and an outer yoke 925, and a leaf spring holding member 926 to which one of the upper leaf spring 927 and the lower leaf spring 928 is attached.

When the lens driving device 900 is assembled, the other side of the upper leaf spring 927 is attached to the upper part of the lens holder 921 (see FIG. 21A), and the lower plate is attached to the lower part of the lens holder 921. The other end of the spring 928 is attached (see FIG. 21B). Further, a first coil 922 is arranged around the upper side of the lens holder 921, and magnets 923 are arranged on all four sides of the lower side of the lens holder 921 (see FIG. 21B). .. Further, as shown in FIG. 21B, the four magnets 923 are arranged so as to be sandwiched between the inner yoke 924 and the outer yoke 925.

Next, as shown in FIG. 20, the suspension mechanism unit 903 has a second coil holding member 931 having printed coils 912 (second coil) arranged at four positions facing the magnet 923, and a second coil. Four suspension wires 932 penetrating through holes 931h provided at the four corners of the holding member 931 and an FPC 933 (flexible printed substrate, which is electrically connected to the print coil 912 and electrically connected to the suspension wire 932). FPC; Flexible printed circuits), a lower case 934 provided with through holes 942 through which the suspension wire 932 penetrates, and a magnetic detection element that detects the position of the autofocus actuator 902 by detecting the magnetic force of the magnet 923. 935 and is configured to include. As shown in FIG. 21B, the magnetic detection element 935 is arranged one by one facing the lower side of the magnet 923 arranged along the X-axis direction and the Y-axis direction. Although not shown, it is soldered to the pattern on the lower surface side of the FPC933.

The autofocus actuator 902 and the suspension mechanism portion 903 configured in this way are connected by a suspension wire 932. Specifically, as shown in FIG. 21A, the upper end portion of the suspension wire 932 is soldered at the four corners of the upper leaf spring 927 and fixed to the autofocus actuator 902 side. On the other hand, the lower end of the suspension wire 932 penetrates the through hole 931h of the second coil holding member 931 (see FIG. 21A) and is soldered through the through hole 933h (see FIG. 20) of the FPC933. It is fixed to the suspension mechanism portion 903 side. With this configuration, the autofocus actuator 902 is swingably supported by the suspension mechanism unit 903. Therefore, the autofocus actuator 902 is orthogonal to the optical axis direction and orthogonal to each other in the X-axis direction, Y. It is possible to move freely in the axial direction.

Japanese Unexamined Patent Publication No. 2014-85524

However, in the lens driving device 900 configured in this way, since the respective magnetic detection elements 935 are arranged so as to face the lower side of the magnet 923 with the FPC 933 in between, the magnetic detection element 935 and the magnet The distance from 923 is large. Moreover, since it is mounted on the FPC933, which is a non-rigid film base material, there is a risk that the arrangement position and orientation of the magnetic detection element 935 may become unstable. Therefore, when the magnetic detection element 935 detects a change in the magnetic field due to the movement of the magnet 923, this unstable element may be added and the detection accuracy of the magnetic detection element 935 may not be improved.

The present invention solves the above-mentioned problems, and an object of the present invention is to provide a lens driving device in which control of a direction intersecting the optical axis direction is stable.

In order to solve this problem, the lens driving device of the present invention includes a lens holding member capable of holding a lens body, a movable unit including a first driving mechanism for moving the lens holding member in the optical axis direction, and the movable unit. A suspension wire that movably supports the movable unit in a direction intersecting the optical axis direction, a base member disposed below the movable unit, and a second moving the movable unit in a direction intersecting the optical axis direction. A drive mechanism and a detection means for detecting a position of the movable unit in a direction intersecting the optical axis direction are provided, and the first drive mechanism is a first coil fixed at least around the lens holding member. The second drive mechanism is configured to have a permanent magnet provided so as to face the first coil, and the second drive mechanism has a plurality of second coils that face the permanent magnet and are supported by the base member. In a lens driving device in which the detection means has at least two magnetic detection elements, the second coil is composed of a multilayer substrate in which a plurality of layers of spiral coil patterns are laminated, and between patterns formed in each layer of the multilayer substrate. Is connected by a through hole, the magnetic detection element is mounted on the lower surface of the multilayer substrate, and the base member is provided with a conductive portion conductively connected to the second coil. It is characterized by that.

According to this, the lens driving device of the present invention does not require a flexible printed circuit board (FPC) as in the conventional example. Therefore, the distance between the magnetic detection element and the permanent magnet can be shortened, and the magnetic detection element is stably mounted on a multilayer substrate having a rigidity higher than that of the FPC. As a result, the detection accuracy of the magnetic detection element can be improved, and the control of the direction intersecting the optical axis direction becomes stable.

Further, the lens driving device of the present invention is characterized in that the multilayer substrate is composed of at least two substrates arranged so as to face each other with the central portion of the lens holding member interposed therebetween.

According to this, when the multilayer substrate is produced from the mother substrate, the divided substrate can be obtained with a higher yield than the case where the multilayer substrate is formed by one connected substrate. Therefore, the number of boards taken from one mother board increases, and the manufacturing cost of the multilayer board can be suppressed.

Further, the lens driving device of the present invention is characterized in that the two magnetic detection elements are mounted on one of the divided substrates of the multilayer substrate.

According to this, when mounting the magnetic detection element, it is not necessary to mount it on all the boards, but to mount it on only the minimum number of boards. Therefore, productivity can be improved.

The lens driving device of the present invention, the multi-layer substrate is formed in a rectangular frame shape, a shape having a longitudinal direction in the direction in which the second coil along each side portion of the multilayer substrate The pair of second coils facing each other with the lens holding member interposed therebetween are provided so that the magnetic detection elements are respectively located on extension lines in the longitudinal direction of the two adjacent second coils. It is characterized by being provided point-symmetrically.

According to this, the magnetic detection element is less susceptible to the influence of the magnetic field generated by the second coil. For example, if there is a magnetic detection element under the second coil, the detection accuracy will deteriorate due to the influence of the magnetic field generated by the current flowing through the second coil. Further, when a current is passed through the second coil, a force that rotates the movable unit is not generated, and the movable unit can be appropriately driven in a well-balanced direction in a direction intersecting the optical axis.

Further, in the lens driving device of the present invention, the base member is provided with an adhesive arranging portion having an annular groove portion around the base member corresponding to each of the second coils, and the adhesive arranging portion is provided. The multilayer substrate is fixed to the base member by the provided adhesive.

According to this, it is possible to prevent the portion of the second coil from floating and maintain an appropriate distance between the second coil and the permanent magnet. Further, when the multilayer substrate and the base member are bonded together, excess adhesive is contained in the annular groove portion. Therefore, it is possible to bond the adhesives with an appropriate thickness, and it is possible to prevent the adhesives from squeezing out of the multilayer substrate.

The lens driving device of the present invention does not require a flexible printed circuit board (FPC) as in the conventional example. Therefore, the distance between the magnetic detection element and the permanent magnet can be shortened, and the magnetic detection element is stably mounted on a multilayer substrate having a rigidity higher than that of the FPC. As a result, the detection accuracy of the magnetic detection element can be improved, and the control of the direction intersecting the optical axis direction becomes stable.

It is an exploded perspective view explaining the lens driving device of 1st Embodiment of this invention. It is an upper perspective view explaining the lens driving device of 1st Embodiment of this invention. It is a figure explaining the lens driving device of 1st Embodiment of this invention, FIG. 3A is a top view of FIG. 2 as seen from the Z1 side, and FIG. 3B is FIG. 2 of Y2. It is a front view seen from the side. It is a figure explaining the lens driving device of 1st Embodiment of this invention, FIG. 4A is a bottom view which omitted the base member when FIG. 2 is seen from the Z2 side, and FIG. 4 (b) is , It is the bottom view which omitted the multilayer board shown in FIG. 4A. It is a figure explaining the lens driving device of 1st Embodiment of this invention, FIG. 5A is the upper perspective view which omitted the case member shown in FIG. 2, and FIG. 5B is FIG. (A) is a front view seen from the Y2 side. It is a figure explaining the lens holding member of the lens driving device which concerns on 1st Embodiment of this invention, FIG. 6A is the upward perspective view of the lens holding member, and FIG. 6B is a lens holding member. It is an upper perspective view which attached the urging member and the 1st coil to a member. It is a figure explaining the lens holding member of the lens driving device which concerns on 1st Embodiment of this invention, FIG. 7A is a downward perspective view of the lens holding member, and FIG. 7B is a lens holding member. It is a lower perspective view which attached the urging member and the 1st coil to a member. It is a figure explaining the urging member of the lens driving device which concerns on 1st Embodiment of this invention, FIG. 8A is a top view of the upper leaf spring of the urging member, and FIG. 8B is , It is a bottom view of the lower leaf spring of the urging member. It is a figure explaining the urging member of the lens driving device which concerns on 1st Embodiment of this invention, and FIG. 9A is the upper perspective view which attached the suspension wire and the fixing member to the urging member. 9 (b) is a downward perspective view of FIG. 9 (a) as viewed from below. It is a figure explaining the urging member of the lens driving device which concerns on 1st Embodiment of this invention, and FIG. 10A is the enlarged top view of the P portion shown in FIG. 8A, FIG. b) is an enlarged upper perspective view of the Q portion shown in FIG. 9A. It is a figure explaining the 1st drive mechanism of the lens drive device which concerns on 1st Embodiment of this invention, and FIG. 11A is the bottom surface which omitted the lens holding member and urging member shown in FIG. 4B. 11 (b) is a bottom view showing only the permanent magnet and the fixing member shown in FIG. 11 (a). It is a figure explaining the 1st drive mechanism of the lens drive device which concerns on 1st Embodiment of this invention, FIG. 12A is a downward perspective view of a fixing member, and FIG. 12B is a fixing member. It is a lower perspective view which attached the permanent magnet to. It is a figure explaining the 1st drive mechanism of the lens drive device which concerns on 1st Embodiment of this invention, and is the enlarged bottom view of the R part shown in FIG. 11 (b). It is a figure explaining the base member of the lens drive device which concerns on 1st Embodiment of this invention, FIG. 14A is the upper perspective view which attached the suspension wire to the base member, FIG. 14B. Is a downward perspective view of FIG. 14A as viewed from below. It is a figure explaining the base member of the lens driving apparatus which concerns on 1st Embodiment of this invention, and FIG. 15A is the enlarged upper perspective view of the S portion shown in FIG. 14A, FIG. b) is an enlarged downward perspective view of the T portion shown in FIG. 14 (b). It is a figure explaining the base member of the lens driving device which concerns on 1st Embodiment of this invention, and FIG. 16A is an upper perspective view which showed the magnetic detection member and adhesive in FIG. 14A. 16 (b) is an upward perspective view in which the multilayer substrate is arranged in FIG. 16 (a). It is a figure explaining the 2nd drive mechanism of the lens drive device which concerns on 1st Embodiment of this invention, and FIG. 17 (a) is the upper perspective view which arranged the permanent magnet in FIG. 16 (b). FIG. 17B is a rear view of FIG. 17A as viewed from the Y1 side. It is a figure explaining the manufacturing method of the lens driving device which concerns on 1st Embodiment of this invention, and is explanatory drawing which showed each manufacturing process. It is a figure explaining the modification of the lens driving device which concerns on 1st Embodiment of this invention, FIG. 19A is the enlarged top view which shows the modification 3 of the upper leaf spring, FIG. 19B. Is an enlarged top view showing a modified example 4 of the upper leaf spring, and FIG. 19 (c) is an enlarged downward perspective view showing a modified example 6 to a modified example 8 of the base member. It is an exploded perspective view of the lens driving device of the conventional example. 21 (a) is an upward perspective view of the lens driving device, and FIG. 21 (b) is a downward perspective view of the lens driving device, which is a diagram for explaining a conventional lens driving device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is an exploded perspective view illustrating a lens driving device 100 according to a first embodiment of the present invention. FIG. 2 is an upward perspective view illustrating the lens driving device 100. 3A and 3B are views for explaining the lens driving device 100, FIG. 3A is a top view of FIG. 2 as viewed from the Z1 side, and FIG. 3B is a top view of FIG. 2 as viewed from the Y2 side. It is a front view. 4 (a) is a bottom view of the lens driving device 100 shown in FIG. 2 when the base member 7 shown in FIG. 1 is omitted when viewed from the Z2 side, and FIG. 4 (b) is shown in FIG. 4 (a). It is the bottom view which omitted the multilayer board 98. 5 (a) is a perspective view in which the case member H9 of the lens driving device 100 shown in FIG. 2 is omitted, and FIG. 5 (b) is a front view of FIG. 5 (a) as viewed from the Y2 side.

The lens driving device 100 according to the first embodiment of the present invention has a rectangular shape as shown in FIGS. 2 and 3, and can hold a lens body (not shown) as shown in FIG. The movable unit KU including the first drive mechanism D1 for moving the holding member 2 in the optical axis direction KD (Z direction shown in FIG. 1) and the movable unit KU are moved in the direction intersecting the optical axis direction KD (crossing direction CD). A suspension wire 5 that supports the movable unit 5, a base member 7 that is arranged below the movable unit KU, and a second drive mechanism D2 that moves the movable unit KU in a direction intersecting the optical axis direction KD (intersection direction CD). A detection means M8 for detecting the position of the movable unit KU in the crossing direction CD (direction intersecting the optical axis direction KD) is provided.

In addition, in the first embodiment of the present invention, as shown in FIGS. 1 to 4, the lens driving device 100 includes a case member H9 for accommodating the movable unit KU and the suspension wire 5 shown in FIG. 1, and FIG. As shown in the above, the frame body W9 is arranged above the lens holding member 2 (in the Z1 direction shown in FIG. 5). The crossing direction CD (direction intersecting the optical axis direction KD) shown in FIGS. 1 and 2 is an example thereof for the sake of easy understanding.

Further, as shown in FIGS. 1, 4 (b) and 5, the first drive mechanism D1 of the movable unit KU includes an annular first coil 13 wound and fixed around the lens holding member 2. It is configured to have four permanent magnets EM (driving magnets) provided so as to face each other on the outside of the first coil 13 and a fixing member R6 to which the four permanent magnets EMs are fixed. .. Then, the first drive mechanism D1 uses the electromagnetic force generated by the current flowing from the power source to the first coil 13 and the magnetic field generated from the permanent magnet EM to move the lens holding member 2 along the optical axis direction KD. It is something to move.

Further, as shown in FIGS. 1 and 5, the second drive mechanism D2 is arranged below the four permanent magnets EM (driving magnets) described above and the permanent magnet EM (in the Z2 direction shown in FIG. 5). It is configured to have a second coil 23. Then, the second drive mechanism D2 uses the electromagnetic force generated by the current flowing from the power supply to the second coil 23 and the magnetic field generated from the permanent magnet EM to cross the movable unit KU with the CD in the crossing direction (optical axis direction KD). It is moved in the direction of intersection with. In the first embodiment of the present invention, the drive magnet of the first drive mechanism D1 and the drive magnet of the second drive mechanism D2 are preferably shared by the four permanent magnets EM. At that time, the first coil 13 of the first drive mechanism D1 is arranged so as to face the side (outside) of the permanent magnet EM, and the second coil 23 of the second drive mechanism D2 is placed below the permanent magnet EM. They are placed facing each other so that both coils do not interfere with each other.

Further, as shown in FIG. 1, the detection means M8 includes the above-mentioned permanent magnet EM, a magnetic detection member 88 having a magnetic detection element for detecting a magnetic field generated by the permanent magnet EM (detection magnet), and a magnetic detection member. It is configured to include a multilayer substrate 98 on which 88 is mounted. Then, the detection means M8 detects a change in the magnetic field of the permanent magnet EM that is arranged on the movable unit KU side and moves with the swing of the movable unit KU, and intersects the optical axis direction KD of the movable unit KU (intersection). The position in the direction CD) is detected. In the first embodiment of the present invention, two permanent magnets EM are preferably shared and used as the detection magnet.

The lens driving device 100 configured as described above holds a lens body (not shown) on the lens holding member 2 with an adhesive or the like, and is mounted on a mounting substrate (not shown) on which an image sensor is mounted. Then, the lens driving device 100 moves the lens held by the lens body along the optical axis direction KD (Z direction shown in FIG. 2) and is a movable unit in order to adjust the focal length with respect to the image sensor. It is possible to correct the fluctuation of the KU. This makes it possible to provide the lens driving device 100 having both an autofocus function and a camera shake correction function.

Next, each component will be described in detail.

First, the movable unit KU of the lens driving device 100 will be described. 6A and 6B are views for explaining the lens holding member 2 of the movable unit KU, FIG. 6A is an upward perspective view of the lens holding member 2, and FIG. 6B is a lens holding member 2. FIG. 5 is an upward perspective view in which the urging member 4 and the first coil 13 of the first drive mechanism D1 are mounted. FIG. 7A is a downward perspective view of the lens holding member 2, and FIG. 7B is a downward view in which the urging member 4 and the first coil 13 of the first drive mechanism D1 are mounted on the lens holding member 2. It is a perspective view.

As shown in FIG. 1, the movable unit KU of the lens driving device 100 includes a lens holding member 2 capable of holding the lens body, an urging member 4 for movably supporting the lens holding member 2 in the optical axis direction KD, and the like. It is configured to have an upper spring fixing portion B16 and a lower spring fixing portion B26 to which a part of the urging member 4 is fixed, and a first drive mechanism D1 for moving the lens holding member 2 in the optical axis direction KD. There is. The upper spring fixing portion B16 and the lower spring fixing portion B26 are provided on the outside of the lens holding member 2.

Further, in the first embodiment of the present invention, as shown in FIG. 6B, the urging member 4 includes an upper leaf spring 4A in which one side portion is fixed to the upper portion of the lens holding member 2 and FIG. As shown in (b), the lens holding member 2 is provided with a lower leaf spring 4C to which one side portion is fixed to the lower portion of the lens holding member 2, and supports the lens holding member 2. Further, the other side portion of the upper leaf spring 4A is fixed to the upper spring fixing portion B16, and the other side portion of the lower leaf spring 4C is fixed to the lower spring fixing portion B26 described later. Further, in the first embodiment of the present invention, the upper spring fixing portion B16 and the lower spring fixing portion B26 are preferably provided integrally with the fixing member R6 described later. The upper leaf spring 4A is divided into two parts.

First, the lens holding member 2 of the movable unit KU is formed in a tubular shape as shown in FIGS. 6 and 7 by using a liquid crystal polymer (LCP, Liquid Crystal Polymer) or the like, which is one of the synthetic resin materials. , A tubular portion 12 having a circular inner peripheral surface and a rectangular outer peripheral surface, and an eaves portion 22 protruding outward in the radial direction from the outer peripheral surface on the upper end side (Z1 side shown in FIG. 6) of the tubular portion 12. It is mainly composed of a flange portion 32 that protrudes radially outward from the outer peripheral surface on the lower end side (Z2 side shown in FIG. 6) of the tubular portion 12. Then, as shown in FIG. 5, the lens holding member 2 is arranged below the frame body W9 (in the Z2 direction shown in FIG. 5) and above the base member 7 (in the Z1 direction shown in FIG. 5).

A lens body (not shown) can be attached to the inner peripheral surface of the tubular portion 12 of the lens holding member 2, and the lens body is held by the lens holding member 2 by using an adhesive or the like. Further, as shown in FIG. 6, on the upper end side of the tubular portion 12, four columnar convex portions 12t protruding upward are provided at four positions evenly with respect to the optical axis. Then, when the lens driving device 100 is assembled, as shown in FIG. 6B, these four convex portions 12t (lens holding member 2) and the upper leaf spring 4A of the urging member 4 (described later). By engaging with the first portion 14) to heat the convex portion 12t, one portion of each of the upper leaf springs 4A is fixed to the lens holding member 2.

Further, as shown in FIG. 6, on the upper end side of the tubular portion 12, there are two prismatic entwined portions 12k protruding upward. Then, as shown in FIG. 5A, each of the coil ends of the first coil 13 is wound around the entwined portion 12k and soldered to each of the upper leaf springs 4A. In FIG. 5A, the solder HD obtained by soldering the two coil ends and the upper leaf spring 4A is schematically shown by cross-hatching surrounded by a long-dotted chain wire.

Further, as shown in FIG. 7B, the outer peripheral surface of the tubular portion 12 between the eaves portion 22 and the flange portion 32 has a shape that follows the octagonal shape of the outer peripheral surface, and the first coil 13 has an octagonal shape. (See FIG. 1).

Further, as shown in FIG. 7A, four recessed portions 32r, which are recessed in a concave shape, are provided on the bottom surface of the collar portion 32 side at equal positions with respect to the optical axis. Then, when the lens driving device 100 is assembled, as shown in FIG. 7B, the recessed portions 32r (lens holding member 2) at these four locations and the lower leaf spring 4C of the urging member 4 (described later). The third portion 34) is arranged to face each other, this portion is fixed with an adhesive, and one portion of the lower leaf spring 4C is fixed to the lens holding member 2.

Next, the urging member 4 of the movable unit KU will be described. FIG. 8 is a view for explaining the urging member 4 of the movable unit KU, and FIG. 8A is a top view of the upper leaf spring 4A of the urging member 4 shown in FIG. 1 as viewed from the Z1 side. 8 (b) is a bottom view of the lower leaf spring 4C of the urging member 4 shown in FIG. 1 as viewed from the Z2 side. 9 (a) is an upward perspective view in which the suspension wire 5 and the fixing member R6 are attached to the urging member 4, and FIG. 9 (b) is a downward perspective view of FIG. 9 (a) as viewed from below. is there. 10 (a) is an enlarged top view of the P portion shown in FIG. 8 (a), and FIG. 10 (b) is an enlarged upper perspective view of the Q portion shown in FIG. 9 (a). In addition, in FIG. 10B, in order to make the explanation easy to understand, the solder HD obtained by soldering the upper end portion of the suspension wire 5 and the upper leaf spring 4A (wire fixing portion 64) is cross-hatched surrounded by a chain line. It is schematically shown in.

The urging member 4 of the movable unit KU is made of a metal plate mainly made of a copper alloy, and as shown in FIG. 5A, is more than the inner peripheral surface of the tubular portion 12 of the lens holding member 2. An upper leaf spring 4A having a large-diameter opening and arranged between the lens holding member 2 and the frame body W9, and as shown in FIG. 5B, the lens holding member 2 and the base member 7. It is composed of a lower leaf spring 4C arranged between them. Then, each of the lens holding member 2 and the urging member 4 (upper leaf spring 4A, lower leaf spring 4C) is engaged, and the lens holding member 2 can move in the optical axis direction KD (Z direction shown in FIG. 2). The lens holding member 2 is supported so as to be.

First, as shown in FIG. 8A, the upper leaf spring 4A of the urging member 4 is composed of two separated members and is manufactured substantially rotationally symmetrically. When arranged, the outer shape is formed. Has a substantially rectangular shape. As shown in FIG. 5A, the upper leaf spring 4A is electrically connected to the first coil 13 by the solder HD, so that it also has a function as a power feeding member to the first coil 13. There is.

Further, as shown in FIGS. 6 (b) and 8 (a), the upper leaf spring 4A is a plurality of (four locations in the first embodiment of the present invention) first portion 14 fixed to the lens holding member 2. And, as shown in FIGS. 8 (a) and 9 (a), a plurality of locations located on the outer peripheral side of the first portion 14 and fixed to the upper spring fixing portion B16 (four locations in the first embodiment of the present invention). ), And as shown in FIG. 8A, four elastic arm portions 54A provided between the first portion 14 and the second portion 24, and extending from the first portion 14. A connecting portion J4 that connects the first portions 14 to each other, a crosspiece S4 that connects the second portions 24 to each other at two locations, and an upper end of the suspension wire 5 located outside the second portion 24 as shown in FIG. Four wire fixing portions 64 to be soldered to the portion, a connecting portion 74 provided so as to connect the second portion 24 and the wire fixing portion 64, and the inside (optical axis side) from the wire fixing portion 64. It is configured to have a plate-shaped projecting portion 84 projecting toward.

First, the four first portions 14 of the upper leaf spring 4A are provided in the first portion 14 as shown in FIG. 6B when the upper leaf spring 4A is incorporated in the lens driving device 100. The convex portion 12t of the lens holding member 2 is inserted into the through hole, and is crimped to each of the four portions so that one side of the upper leaf spring 4A is fixed to the lens holding member 2.

Similarly, as shown in FIG. 9A, the second portion 24 of the upper leaf spring 4A has two through holes (8 in total, FIG. 8) provided at each of the four locations of the second portion 24. (See (a))), a protrusion B16t (described later) of the upper spring fixing portion B16 is inserted, and by fixing this portion with an adhesive, the other side of the upper leaf spring 4A is fixed to the fixing member R6 side. Become so.

In this way, as shown in FIG. 8A, the upper leaf spring 4A is composed of two members having a shape substantially point-symmetrical, and the lens holding member 2 has four parts of the first portion 14 with respect to the lens holding member 2. Is fixed at equal positions, and is fixed to the fixing member R6 at four equal positions of the second portion 24. As a result, the lens holding member 2 can be supported in a well-balanced manner.

Next, as shown in FIG. 8A, the wire fixing portions 64 of the upper leaf spring 4A are provided at four locations on the outside of the second portion 24 fixed to the upper spring fixing portion B16. Each of the four wire fixing portions 64 has a penetrating portion 64k formed of a penetrating hole. Then, as shown in FIG. 9, the wire fixing portion 64 has the suspension wire 5 inserted through the penetrating portion 64k and is soldered to the upper end portion of the suspension wire 5 as shown in FIG. 10 (b).

Next, in the first embodiment of the present invention, the connecting portion 74 of the upper leaf spring 4A is fixed by wire from two separated portions of the second portion 24, as shown in FIGS. 8A and 10A. It is configured to have two extending portions 74e extending toward the portion 64 side. The two extending portions 74e have a spring property, and enable the movable unit KU to move in the direction intersecting the optical axis direction KD (intersection direction CD).

Next, as shown in FIGS. 8A and 10A, the protruding portion 84 of the upper leaf spring 4A is formed in a plate shape and a rectangular shape, and is formed between the two extending portions 74e. It is provided so as to project inward from the wire fixing portion 64. The protruding direction of the protruding portion 84 is a direction toward the central optical axis. In other words, it is a direction along a straight line connecting the penetrating portion 64k of the wire fixing portion 64 and the center of the optical axis. Then, the protruding portion 84 can be irradiated with a laser beam.

As a result, the protruding portion 84 of the upper leaf spring 4A is irradiated with laser light, and heat is transferred from the protruding portion 84 to the wire fixing portion 64, whereby the wire fixing portion 64 of the upper leaf spring 4A and the upper end portion of the suspension wire 5 are formed. Can be soldered. As a result, workability and the like can be improved and defects in the soldering process can be reduced as compared with the case of manual soldering.

Further, since the protruding portion 84 is configured to protrude inward (on the optical axis side) from the wire fixing portion 64, it is possible to suppress an increase in the outer shape of the upper leaf spring 4A, and as a result, the outer shape of the lens driving device 100 is made smaller. can do.

Further, as shown in FIGS. 8A and 10A, the projecting portion 84 is formed with an elongated opening 84k formed adjacent to the wire fixing portion 64 side. The opening 84k is composed of a through hole (a long hole that penetrates), and the dimension in the orthogonal direction (Wa shown in FIG. 10A) orthogonal to the protrusion direction of the protrusion 84 is formed to be larger than the dimension in the protrusion direction. ing. The portion located inside the opening 84k is the laser irradiation portion for irradiating the above-mentioned laser light.

As a result, when the solder paste is applied to the wire fixing portion 64 and the protruding portion 84 is irradiated with laser light for soldering, the melted solder HD is blocked by the opening 84k (see FIG. 10B). ), It is possible to prevent the solder HD from flowing widely toward the protruding portion 84 side. Therefore, the amount of solder in the wire fixing portion 64 is less likely to vary, and the soldering between the wire fixing portion 64 and the upper end portion of the suspension wire 5 can be ensured. Furthermore, since the solder HD does not flow to the part irradiated with the laser light (laser irradiation part), it is necessary to prevent the solder HD from scattering due to the laser light and the "burning" of the surrounding synthetic resin material due to the diffused reflection of the laser light. Can be done.

Further, in the first embodiment of the present invention, as shown in FIG. 10A, the width dimension of the opening 84k in the orthogonal direction (Wa shown in FIG. 10A) is in the orthogonal direction. The width dimension between the edge of the protrusion 84 (left and right at the end in the width direction) and the edge of the opening 84k (left and right at the end in the orthogonal direction) (Wb shown in FIG. 10A). ) Is set larger than.

As a result, the solder HD melted in the wide opening 84k can be reliably blocked. Therefore, it is possible to reliably prevent the solder HD from flowing widely toward the protrusion 84 side. The larger the width dimension (Wa) of the opening 84k, the better the blocking effect of the solder HD, but the lower the heat conduction effect from the protruding portion 84 to the wire fixing portion 64. The balance of Wa and Wb) is appropriately determined in consideration of these effects. In the first embodiment of the present invention, in consideration of this balance, the width dimension (Wa) of the opening 84k in the orthogonal direction is set to the width dimension (Wa) of the protrusion 84 in the portion where the opening 84k is formed. It is set smaller than the dimension (Wb + Wb) of the portion excluding the width dimension (Wa) of the opening 84k from Wb + Wa + Wb).

Further, in the first embodiment of the present invention, as shown in FIG. 10A, the width of the connecting portion between the penetrating portion 64k and the opening 84k is a protrusion in a portion located inside the opening 84k. It is narrower than the width of the portion 84. As a result, the outer shape (footprint) of the solder fillet formed around the suspension wire 5 is regulated by the portion where the width is narrowed. Therefore, it is possible to prevent the solder fillet from spreading significantly and to reduce the variation in the amount of solder in the wire fixing portion 64. As shown in FIG. 10, the portion located between the penetrating portion 64k and the opening portion 84k is a part of the wire fixing portion 64.

Moreover, since the variation in the amount of solder in the wire fixing portion 64 can be reduced, the solder adhesion region (back fillet) formed on the lower side (back side) along the penetrating portion 64k can be made into a stable shape. .. Therefore, the variation in the influence of the solder HD on the suspension wire 5 is suppressed, and the "effective length (effective length)" that contributes to the spring characteristics of the suspension wire 5 can be stabilized. As a result, the characteristics of image stabilization can be stabilized.

Next, as shown in FIGS. 7 (b) and 8 (b), a plurality of lower leaf springs 4C of the urging member 4 are fixed to the lens holding member 2 (4 locations in the first embodiment of the present invention). ), And as shown in FIGS. 8 (b) and 9 (b), a plurality of lenses (the first of the present invention) located on the outer peripheral side of the third portion 34 and fixed to the lower spring fixing portion B26. The fourth portion 44 (4 locations in one embodiment) and the four elastic arm portions 54C provided between the third portion 34 and the fourth portion 44, respectively, as shown in FIG. 8 (b). It is configured to have a chain portion R4 that connects the third portions 34 at four locations.

The lower leaf spring 4C has a circular inner shape and a rectangular outer shape, and each of the lower leaf springs 4C is formed substantially point-symmetrically about the optical axis. As a result, the lower leaf spring 4C supports the lens holding member 2 at four equal positions in the third portion 34, and at the same time, the lower spring 4C supports the lens holding member 2 at four locations in the fourth portion 44 with respect to the lower spring fixing portion B26 (fixing member R6). It is supported at an even position. As a result, the lens holding member 2 can be supported in a well-balanced manner.

When the lens driving device 100 is assembled, as shown in FIG. 7B, the third portion 34 and the recessed portion 32r of the lens holding member 2 (see FIG. 7A) face each other. Arranged, this portion is fixed with an adhesive, and as shown in FIG. 9 (b), through holes provided at each of the four locations of the fourth portion 44 (see FIG. 8 (b)). , The protrusion B26t (described later) of the lower spring fixing portion B26 is inserted, and this portion is fixed with an adhesive. Therefore, the urging member 4 configured as described above supports the lens holding member 2 so as to be movable in the optical axis direction KD.

Next, as shown in FIG. 9A, the upper spring fixing portion B16 of the movable unit KU is on the upper side of the fixing member R6 (specifically, the upper side surface of the frame-shaped portion 56 described later) as described above. ), And the other side (second portion 24) of the upper leaf spring 4A is fixed. Similarly, as shown in FIG. 9B, the lower spring fixing portion B26 of the movable unit KU is preferably integrally provided on the lower side of the fixing member R6 as described above, and the lower leaf spring. The other side of the 4C (fourth portion 44) is fixed.

Next, the first drive mechanism D1 of the movable unit KU will be described. 11A and 11B are views for explaining the first drive mechanism D1, and FIG. 11A is a bottom view in which the lens holding member 2 and the urging member 4 shown in FIG. 4B are omitted, and FIG. (B) is a bottom view showing only the permanent magnet EM and the fixing member R6 shown in FIG. 11 (a). 12A and 12B are views for explaining the first drive mechanism D1, FIG. 12A is a downward perspective view of the fixing member R6, and FIG. 12B is a permanent magnet EM mounted on the fixing member R6. It is a downward perspective view. FIG. 13 is an enlarged bottom view of the R portion shown in FIG. 11 (b).

The first drive mechanism D1 of the movable unit KU has a function of moving the lens holding member 2 in the optical axis direction KD (Z direction shown in FIG. 2), and is wound and fixed around the lens holding member 2. It is configured to include a first coil 13, four permanent magnets EM provided facing the outside of the first coil 13, and a fixing member R6 to which the four permanent magnets EMs are fixed.

First, the first coil 13 of the first drive mechanism D1 is made of a metal wire having an insulating coating on the outer circumference, and is wound around the outer circumference of the lens holding member 2 as shown in FIG. 7B. Is formed. At that time, the first coil 13 is arranged between the eaves portion 22 and the flange portion 32 as shown in FIG. 7 (b), and four as shown in FIG. 11 (a). It is arranged so as to face the inner surface EMp of the permanent magnet EM (the surface of the permanent magnet EM facing the first coil 13 side).

The first coil 13, as shown in FIG. 11 (a), is formed substantially octagonal ring, four extending portions 13q that extends opposite the inner surface EMp permanent magnet EM It is configured to have a bent portion 13r connecting the adjacent extending portions 13q and the bending portion 13r. The first coil 13 has a shape in which a metal wire is wound and bundled, but in FIGS. 1, 4 (b), 7 (b) and 11 (a), it is simplified. , The surface is shown flat.

Further, in the first coil 13, both ends of the wound metal wire are electrically conductive, and as described above, as shown in FIG. 5A, each of the coil ends is on the upper side. It is soldered to each of the side leaf springs 4A and electrically connected.

Next, the permanent magnet EM of the first drive mechanism D1 uses, for example, four neodymium magnets, and is formed in an elongated plate shape as shown in FIGS. 11 and 12 (b), and the first coil 13 It has an inner surface EMp extending in the longitudinal direction facing the side and an outer surface EMq extending in the longitudinal direction opposite to the inner surface EMp. Further, the permanent magnets EM are fixed to the fixing member R6 by arranging a pair of permanent magnets EM that face each other in parallel so as to surround the optical axis. The permanent magnet EM is magnetized so that the inner surface EMp and the outer surface EMq have different magnetic poles.

Next, the fixing member R6 of the first drive mechanism D1 is formed into a substantially rectangular frame shape in a plan view by using a liquid crystal polymer (LCP) or the like, which is one of the synthetic resin materials, as shown in FIG. As shown in FIG. 12A, the facing wall portion 46 forming the outer periphery facing the outer surface EMq of the permanent magnet EM and the facing wall portion 46 formed orthogonally to the facing wall portion 46 form the upper side surface. It is configured to have a frame-shaped portion 56, an extending portion 66 formed at four corners and projecting downward from the frame-shaped portion 56, and a positioning portion 76 capable of contacting the inner side surface EMp of the permanent magnet EM. There is. Then, as shown in FIG. 11, four permanent magnets EM are mounted on the fixing member R6, and the inner side surface EMp of the permanent magnet EM and the positioning portion 76 are arranged in contact with each other and positioned on the positioning portion 76. It is fixed to the fixing member R6 in the fixed state.

As a result, the permanent magnet EM is fixed to the fixing member R6 in a state where the inner surface EMp of the permanent magnet EM and the positioning portion 76 of the fixing member R6 are in contact with each other and positioned, so that the thickness of the permanent magnet EM is increased. Even if there is a variation, the variation in the distance between the inner surface EMp of the permanent magnet EM and the first coil 13 is suppressed, and the permanent magnet EM is arranged with high accuracy. Therefore, the magnetic force acting on the first coil 13 from the permanent magnet EM is stable, and the thrust for moving the lens holding member 2 in the optical axis direction KD is also stable.

First, as shown in FIG. 12A, the facing wall portions 46 of the fixing member R6 are provided between the adjacent extending portions 66 and continuously to form the outer circumferences of the four sides of the fixing member R6. doing. Thereby, the strength of the fixing member R6 for fixing the permanent magnet EM can be increased. Therefore, since the deformation of the fixing member R6 can be suppressed, the permanent magnet EM can be arranged with high accuracy.

Further, each of the facing wall portions 46 has a notch 46k in the central portion thereof, as shown in FIG. 12A. Then, using this notch 46k, even after the permanent magnet EM is arranged on the fixing member R6 (see FIG. 12B), the adhesive is easily applied to the permanent magnet EM and the fixing member R6. Alternatively, the adhesive (ultraviolet curable type) can be irradiated with ultraviolet rays from the outside to cure the adhesive. As a result, the lens driving device 100 can be easily assembled when it is manufactured.

Further, in the first embodiment of the present invention, as shown in FIG. 11B, when the permanent magnet EM is arranged on the fixing member R6, the facing wall portion 46 is the outer surface EMq of the permanent magnet EM. As shown in FIG. 13, it is configured to have a first gap of 6 g between the outer surface EMq and the facing wall portion 46. An adhesive is provided in the first gap 6 g, and the permanent magnet EM and the fixing member R6 are adhered to each other. As a result, the permanent magnet EM and the fixing member R6 can be adhered to each other in a wide area portion between the outer surface EMq and the facing wall portion 46. Therefore, the permanent magnet EM can be fixed to the fixing member R6 with strong strength, and even if a strong impact such as dropping is applied, the permanent magnet EM can be prevented from falling off from the fixing member R6.

Next, as shown in FIGS. 1 and 12A, the frame-shaped portion 56 of the fixing member R6 is formed in a rectangular shape on a plane orthogonal to the facing wall portion 46, and constitutes an upper side surface of the fixing member R6. ing. Then, as described above, the facing wall portion 46 is formed by extending downward from the four sides of the frame-shaped portion 56, and the extending portion 66 is formed by extending downward from the four corners of the frame-shaped portion 56. Has been done. In the first embodiment of the present invention, the facing wall portion 46, the frame-shaped portion 56, and the extending portion 66 are continuously and integrally formed.

Further, as described above, the upper spring fixing portions B16 are provided on the upper surface side of the four corners of the frame-shaped portion 56, and as shown in FIG. 9A, the other side (second portion 24) of the upper leaf spring 4A is provided. , It is inserted through the protrusion B16t of the upper spring fixing portion B16 and fixed to the fixing member R6.

Further, in the first embodiment of the present invention, when the permanent magnet EM is arranged on the fixing member R6, although not shown, the upper surface EMa (see FIG. 1) and the fixing member R6 of the permanent magnet EM are not shown. It is configured to have a second gap between it and the frame-shaped portion 56 of the above.

Next, the extending portion 66 of the fixing member R6 is formed so as to project downward from the four corners of the frame-shaped portion 56, and extends along the optical axis direction KD as shown in FIG. 5A. There is. Further, as shown in FIGS. 11 and 12 (a), each of the extended portions 66 is provided with a positioning portion 76 formed in parallel with the facing wall portion 46.

Then, in the first embodiment of the present invention, a storage space surrounded on all four sides (two sides are open) is formed by the extending portion 66, the frame-shaped portion 56, the facing wall portion 46, and the positioning portion 76. There is. In this accommodation space, when the permanent magnet EM is arranged on the fixing member R6, a part of the permanent magnet EM, specifically, the longitudinal direction of the permanent magnet EM (the direction intersecting the optical axis direction KD, FIG. Both ends in the X direction or the Y direction shown in 11) are accommodated. Then, the inner side surface EMp on both end sides of the permanent magnet EM in the longitudinal direction comes into contact with the positioning portion 76. As a result, the permanent magnet EM is positioned at two points of the inner side surface EMp on both end sides in the longitudinal direction, and the positional deviation can be suppressed. As a result, it is easy to secure the positioning accuracy of the permanent magnet EM and the first coil 13.

Further, as shown in FIG. 5B, the extension portion 66 is configured to have a lower end surface 66p at the same height as the lower surface EMz of the permanent magnet EM in the optical axis direction KD. As a result, even if the dimensions of the permanent magnet EM in the optical axis direction KD (height direction) vary, the permanent magnet EM is accurately arranged with reference to the lower end surface 66p of the extension portion 66 and the lower surface EMz of the permanent magnet EM. can do. Moreover, since the second gap is provided between the upper surface EMa of the permanent magnet EM and the frame-shaped portion 56 of the fixing member R6, the dimensional variation of the permanent magnet EM can be absorbed by this second gap.

Further, as described above, the lower spring fixing portion B26 is provided on the lower side of the extension portion 66, and as shown in FIG. 9B, the other side (fourth portion 44) of the lower leaf spring 4C is below. It is inserted through the protrusion B26t of the spring fixing portion B26 and fixed to the fixing member R6.

Next, as described above, two positioning portions 76 of the fixing member R6 are provided on each of the extending portions 66, as shown in FIG. Then, each of the positioning portions 76 on one side of the adjacent extension portions 66 is in contact with the inner side surface EMp of one permanent magnet EM. Further, these two positioning portions 76 are provided at positions outside the extending portion 13q of the first coil 13 in the extending direction, in other words, at a position on the bending portion 13r side of the first coil 13. Therefore, the permanent magnets EM directly face each other over the entire length of the extending portion 13q of the first coil 13. As a result, the thrust of the first drive mechanism D1 in the optical axis direction KD can be ensured.

Further, as shown in FIG. 12A, the length dimension of the positioning portion 76 in the optical axis direction KD is configured to be larger than the length dimension of the optical axis direction KD of the facing wall portion 46. As a result, the facing wall portion 46 can be formed small and thin without affecting the positioning accuracy of the permanent magnet EM. As a result, the outer shape of the fixing member R6 can be made smaller, and the lens driving device 100 can be made smaller. Further, when the permanent magnet EM is incorporated into the fixing member R6, it can be easily attached from the outside.

Further, as shown in FIG. 13, a portion located inside the positioning portion 76 has a wall portion 66w extending in parallel with the facing wall portion 46, and the permanent magnet EM is a fixing member R6. When arranged in, it is configured to have a third gap 6s between the extending wall portion 66w and the inner surface EMp of the permanent magnet EM. An adhesive is provided in the third gap 6s, and the permanent magnet EM and the fixing member R6 are adhered to each other. As a result, the permanent magnet EM can be fixed to the fixing member R6 with strong strength, and even if a strong impact such as dropping is applied, the permanent magnet EM can be prevented from falling off from the fixing member R6.

As described above, the movable unit KU includes the lens holding member 2, the urging member 4 (upper leaf spring 4A and lower leaf spring 4C), and the first drive mechanism D1 (first coil 13, permanent magnet EM, and fixing member R6). ) And are arranged respectively, so that the electromagnetic force generated by the current flowing from the power source to the first coil 13 via the upper leaf spring 4A causes the first coil 13 to correspond to the direction in which the current flows. A thrust acts on the spring, and the lens holding member 2 moves up and down. Moreover, in the first embodiment of the present invention, since the permanent magnet EM surrounds the optical axis (first coil 13) and is arranged on each of the four sides, the optical axis direction KD created by the first coil 13 and the permanent magnet EM. The driving force to the lens can be applied to the lens holding member 2 in a well-balanced manner.

Next, the suspension wire 5 of the lens driving device 100 will be described. The suspension wire 5 is made of a metal material having conductivity and excellent elasticity, the upper end portion is soldered to the upper leaf spring 4A (wire fixing portion 64), and the lower end portion is the base member 7 ( It is soldered to a plating portion (7 m) described later. The suspension wire 5 supports the movable unit KU to move in the direction intersecting the optical axis direction KD (intersection direction CD) via the upper leaf spring 4A. As the metal material, for example, a copper alloy or the like is used, the cross section is circular with a diameter of about 50 μm, and the effective length contributing to elasticity is about 3 mm.

Next, the base member 7 of the lens driving device 100 will be described. 14A and 14B are views for explaining the base member 7, FIG. 14A is an upward perspective view in which the suspension wire 5 is attached to the base member 7, and FIG. 14B is FIG. 14A. ) Is a downward perspective view seen from below. 15 (a) is an enlarged upper perspective view of the S portion shown in FIG. 14 (a), and FIG. 15 (b) is an enlarged downward perspective view of the T portion shown in FIG. 14 (b). In addition, in FIG. 14 and FIG. 15, in order to make the explanation easy to understand, the solder HD obtained by soldering the lower end portion of the suspension wire 5 and the base member 7 (plating portion 7 m) is modeled by cross-hatching surrounded by a chain line. Is shown. 16 (a) is an upward perspective view showing the magnetic detection member 88 and the adhesive (AD shown in the drawing) on the base member 7 of FIG. 14 (a), and FIG. 16 (b) is a view of FIG. 16 (b). It is an upper perspective view which further arranged the multilayer substrate 98 in a). Note that FIG. 16B shows the magnetic detection member 88 mounted on the back surface side (lower surface) of the multilayer board 98 with a broken line.

The base member 7 of the lens driving device 100 is manufactured by injection molding using a liquid crystal polymer (LCP) or the like, which is one of the same synthetic resin materials as the lens holding member 2 and the fixing member R6, and is shown in FIG. As described above, the outer shape is formed in a rectangular plate shape, and the outer shape is formed in an annular shape having a circular opening in the central portion thereof. The base member 7 has a frame-shaped base portion 17, an adhesive arranging portion 37 provided on the upper surface side of the base member 7, and a thin-walled portion 57 located at a corner portion of the base member 7. It is composed of.

First, as shown in FIGS. 14 and 15, the base portion 17 of the base member 7 is provided with a conductive portion 7c sterically wired on the upper surface, the lower surface 17u, and the side surface. The conductive portion 7c is electrically connected to the second coil 23 provided on the multilayer substrate 98, which will be described later.

Further, as shown in FIG. 14, two recesses 7r recessed downward are provided on the upper surface side of the base member 7, and the recesses 7r are provided with a multilayer substrate as shown in FIG. 16A. The magnetic detection member 88 mounted on the 98 is housed. As a result, the lens driving device 100 can reduce the height corresponding to the thickness (height) of the magnetic detection member 88.

Further, as shown in FIG. 14B, a plurality of terminals T9 for connecting to an external device are provided on the lower surface 17u side of the base member 7. Each of the terminals T9 is electrically connected to an electrode land of a mounting board on which an image pickup device (not shown) is mounted, and can supply electric power or the like from the electrode land of the mounting board, and a magnetic detection member 88 (detection means M8). You can also extract the signal from. It can also be grounded to the electrode land. Specifically, the terminal T9 is electrically connected to the first coil 13 of the first drive mechanism D1 via the conductive portion 7c, the suspension wire 5, and the upper leaf spring 4A, and is also electrically connected to the conductive portion 7c and the multilayer. It is electrically connected to the second coil 23 of the second drive mechanism D2 via the substrate 98. Further, the terminal T9 is electrically connected to the magnetic detection member 88 via the conductive portion 7c and the multilayer substrate 98.

Next, as shown in FIG. 14A, the adhesive arranging portions 37 of the base member 7 are provided at four locations on the upper surface side of the base portion 17, and have a shape having an annular groove portion 37 m around them. .. As shown in FIG. 16A, an adhesive (AD) is applied to the adhesive arrangement portion 37. Then, as shown in FIG. 16B, the multilayer substrate 98 is placed on the upper surface side of the base member 7, and the multilayer substrate 98 is fixed to the base member 7 by the adhesive (AD). At that time, the adhesive arranging portion 37 is located at a position corresponding to each of the second coils 23 provided on the multilayer substrate 98. As a result, it is possible to prevent the portion of the second coil 23 from floating and to maintain an appropriate distance between the second coil 23 and the permanent magnet EM. Further, since the adhesive arranging portion 37 has an annular groove portion 37 m around it, excess adhesive (AD) is accommodated in the annular groove portion 37 m when the multilayer substrate 98 and the base member 7 are bonded to each other. The Rukoto. Therefore, the adhesive (AD) can be bonded with an appropriate thickness of the adhesive (AD), and the adhesive (AD) can be prevented from protruding to the outside of the multilayer substrate 98.

Next, as shown in FIGS. 14 to 16, the thin portion 57 of the base member 7 has a thickness dimension (dimension in the Z direction) smaller than that of the base portion 17, and is formed in FIGS. 5 (b) and 15. As shown in FIG. 15 (b), the lower surface 57v of the thin-walled portion 57 is located above the lower surface 17u of the base 17 (in the Z1 direction shown in FIG. 5 (b)), and as shown in FIG. 15 (b). The thin portion 57 (lower surface 57v) and the base 17 (lower surface 17u) are connected with a step. That is, a step is provided between the lower surface 57v of the thin portion 57 and the lower surface 17u of the base 17.

The wall portion 57w constituting this step is provided so as to face the thin-walled portion 57 side. Further, the wall portion 57w has a vertical wall formed perpendicularly (about 90 °) to the lower surface 57v of the thin wall portion 57. The lower surface 57v of the thin portion 57 and the lower surface 17u of the base 17 may be partially connected by a tapered surface.

Further, as shown in FIG. 16, the thin-walled portion 57 includes a through hole 7h through which the suspension wire 5 is inserted, and a plating portion 7m made of a metal film formed around the through hole 7h and on the inner surface of the through hole 7h. ,have. Here, the periphery of the through hole 7h includes the lower surface 57v or the upper surface portion of the thin-walled portion 57 adjacent to the through hole 7h. The plating portion 7m around the through hole 7h may be formed at least on the lower surface 57v of the thin-walled portion 57, but in the first embodiment of the present invention, it is formed on both the lower surface 57v and the upper surface of the thin-walled portion 57. It is provided.

Further, the same metal film as the plated portion 7 m is formed on the entire lower surface 57v of the thin-walled portion 57, and the same metal film as the plated portion 7 m is also formed on the wall portion 57w. The metal film on the lower surface 57v is continuous with the metal film formed on the entire wall portion 57w.

Then, the suspension wire 5 is inserted into the through hole 7h, and the lower end portion of the suspension wire 5 is soldered to the plating portion 7m. As a result, the suspension wire 5 is fixed to the base member 7. Therefore, the suspension wire 5 is securely fixed to the base member 7 which is more rigid than the FPC as compared with the FPC933 which is the film base material of the conventional example. As a result, the suspension wire 5 can be stably supported, and the control of the crossing direction CD intersecting the optical axis direction KD for image stabilization can be stabilized. The base member 7 has a function as a support member for supporting the lower end portion of the suspension wire 5. Further, the thin-walled portion 57 is called a "thin-walled portion" because the thickness dimension is smaller than that of the base portion 17, but the upper end portion is sufficient to support the suspension wire 5 soldered to the upper leaf spring 4A. It is formed to have a rigid thickness.

Further, when soldered at the plated portion 7 m, an upper solder fillet is formed above the through hole 7h so as to surround the suspension wire 5, as shown in FIG. 15A, and the through hole 7h is formed. As shown in FIG. 15B, a lower solder fillet is formed at the lower portion of the suspension wire 5 so as to surround the suspension wire 5. Although not shown in detail, the upper solder fillet is formed smaller than the lower solder fillet. As a result, the effective length of the suspension wire 5 that supports the movable unit KU disposed above the base member 7 can be lengthened, which contributes to the spring characteristics. Therefore, the spring characteristics can be improved and the product performance can be improved.

Further, as described above, since the thin-walled portion 57 having a thickness dimension smaller than that of the base portion 17 is provided with the through hole 7h, the surface area of the plating portion 7m formed on the inner surface of the through hole 7h is narrowed. can do. Therefore, the amount of solder HD filled in the inner surface of the through hole 7h can be reduced, and the amount of heat applied to the solder HD at the time of soldering can be reduced. As a result, damage to the base member 7 can be suppressed. Further, since the solder fillet (upper solder fillet and lower solder fillet) is formed in the thin portion 57, the solder fillet can be accommodated within the thickness dimension of the base portion 17. Therefore, the overall thickness can be reduced.

Further, in the first embodiment of the present invention, the same metal film as the plated portion 7m is formed on at least the vertical wall portion of the lower surface 57v of the thin wall portion 57 and the wall portion 57w. Therefore, when soldering the lower end portion of the suspension wire 5, for example, when irradiating a laser beam, even if the flux or solder HD scatters and hits the lower surface 57v and the wall portion 57w, the lower surface 57v It is possible to prevent the synthetic resin material constituting the base member 7 of the wall portion 57w from being burnt. Further, even if the laser beam that hits the solder paste or the solder HD is diffusely reflected and a part of the laser light hits the wall portion 57w, the synthetic resin material constituting the base member 7 of the wall portion 57w is suppressed from being burnt. can do.

Further, since a metal film is formed on the lower surface 57v and the wall portion 57w, heat can be dissipated by the metal film on this portion. Furthermore, by connecting a metal film from the wall portion 57w to the terminal portion formed on the base portion 17 (up to the terminal T9 in some cases), excess heat can be dissipated by the metal film and the terminal portion of this portion. .. As a result, the amount of heat given to the thin-walled portion 57 can be further reduced, and damage to the base member 7 can be further suppressed.

Further, in the first embodiment of the present invention, the outermost surface side layer of the metal film is formed of gold. Therefore, for example, it is hard to corrode, has excellent environmental resistance, and has good solderability. In the metal film of the first embodiment of the present invention, a two-layer film made of nickel and copper is formed under the gold layer.

In addition, when soldering is performed by irradiating with a laser, the reflectance of the laser light from gold is high (about 95%), so that the laser light that hits the solder HD is diffusely reflected, and a part of it is assumed to be a thin portion. Even if it hits the lower surface 57v of 57 or the wall portion 57w, it is surely reflected. Therefore, the amount of heat given to the thin-walled portion 57 and the wall portion 57w can be further reduced, and damage to the base member 7 can be further suppressed.

Next, the second drive mechanism D2 of the lens drive device 100 will be described. FIG. 17 is a view for explaining the second drive mechanism D2, FIG. 17 (a) is an upward perspective view in which the permanent magnet EM is arranged in FIG. 16 (b), and FIG. 17 (b) is a view. FIG. 17A is a rear view of FIG. 17A as viewed from the Y1 side. Note that FIG. 17B shows the magnetic detection member 88 mounted on the back surface side (lower surface) of the multilayer board 98 with a broken line.

As shown in FIG. 17, the second drive mechanism D2 of the lens drive device 100 is arranged below the four permanent magnets EM used in the first drive mechanism D1 and the four permanent magnets EM, respectively. It is mainly composed of two second coils 23. Then, using the electromagnetic force generated by the current flowing from the power supply of the external device to the second coil 23 via the terminal T9 and the magnetic field generated from the permanent magnet EM, the movable unit KU is crossed in the crossing direction CD (optical axis direction). It has a function to move in the direction (direction intersecting with KD). Since the permanent magnet EM has been described above, detailed description thereof will be omitted here.

As shown in FIG. 16B, the second coil 23 of the second drive mechanism D2 is provided on the multilayer substrate 98, and the multilayer substrate 98 having the conductive layers formed in multiple layers is used to form a spiral coil. The pattern is composed of multiple layers. Then, as described above, since the multilayer board 98 is fixed to the base member 7, the plurality of second coils 23 are supported by the base member 7. Needless to say, the patterns formed in each layer are connected by through holes. Further, each of the second coils 23 is electrically connected to an electrode terminal (not shown) formed on the lower surface of the multilayer substrate 98, and the electrode terminal and the conductive portion 7c of the base member 7 are soldered to each other. It is electrically connected.

Further, as shown in FIG. 16B, the second coil 23 has a shape having a longitudinal direction in the direction along each side portion of the rectangular frame-shaped multilayer substrate 98. When the lens driving device 100 is assembled, as shown in FIG. 17A, each of the four second coils 23 is arranged so as to face each of the four permanent magnets EM. , The permanent magnet EM is arranged at a position where the longitudinal direction and the longitudinal direction of the second coil 23 coincide with each other.

Further, as shown in FIG. 16B, the longitudinal directions of the four second coils 23 are arranged at positions where the neighbors are orthogonal to each other. That is, one pair of second coils 23 facing each other across the lens holding member 2 are arranged in a direction parallel to the X direction, and the other pair of second coils 23 are arranged in a direction parallel to the Y direction. Has been done. As a result, a current can be passed through each pair of second coils 23 to drive the movable unit KU in the X and Y directions.

Further, as shown in FIG. 16B, the second coil 23 is provided so that each pair of the second coil 23 facing each other with the lens holding member 2 sandwiched between them has the same size and is point-symmetrical in a plan view seen from the optical axis direction KD. Has been done. Therefore, when a current is passed through the second coil 23, a force that rotates the movable unit KU is not generated, and the movable unit KU can be appropriately driven in a well-balanced direction in the direction intersecting the optical axis (intersection direction CD).

Further, as described above, the permanent magnet EM is fixed to the base member 7 because the lower surface EMz of the permanent magnet EM is accurately arranged with reference to the lower end surface 66p of the fixing member R6 (extended portion 66). The variation in the distance between the second coil 23 formed on the multilayer substrate 98 and the lower surface EMz of the permanent magnet EM is suppressed. Therefore, the magnetic force acting on the permanent magnet EM from the second coil 23 becomes stable. As a result, the variation in the thrust of the crossing direction CD can be suppressed, and the movable unit KU can be stably driven.

Next, the detection means M8 of the lens driving device 100 will be described. As shown in FIG. 1, the detection means M8 includes two of the four permanent magnets EM described above, and a magnetic detection member 88 having a magnetic detection element that detects a magnetic field generated by the permanent magnet EM (detection magnet). , And a multilayer substrate 98 on which the magnetic detection member 88 is mounted. The detection means M8 has a function of detecting the position of the movable unit KU in the direction intersecting the optical axis direction KD (intersection direction CD). Since the permanent magnet EM has been described above, detailed description thereof will be omitted here as well.

First, the magnetic detection member 88 of the detection means M8 uses a magnetoresistive element whose electrical resistance changes with a change in a magnetic field, for example, a magnetic detection element (called a GMR (Giant Magneto Resistive) element) using a giant magnetoresistive effect. There is. Further, the magnetic detection member 88 is formed of a package containing the magnetic detection element (magnetoresistive element) by exposing four terminal portions to the outside and using a thermosetting synthetic resin material.

Further, the magnetic detection member 88 uses two magnetic detection elements, and is mounted (mounted) on the lower surface of the multilayer substrate 98 as shown in FIG. 17B, and two permanent magnets sandwiching the multilayer substrate 98. Facing the EM. Then, the magnetic detection member 88 detects the magnetic field generated by the permanent magnet EM arranged on the movable unit KU side and fixed to the fixing member R6, and the crossing direction CD of the movable unit KU (direction intersecting the optical axis direction KD). ) Can be detected to change the direction of the magnetic field. At this time, since the second coil 23 of the multilayer board 98 in which the magnetic detection element is mounted on the lower surface is conductively connected to the conductive portion 7c of the base member 7, the flexible printed circuit board (FPC933) as in the conventional example is unnecessary. It becomes. Therefore, the distance between the magnetic detection element and the permanent magnet EM can be shortened, and the magnetic detection element is stably mounted on the plate-shaped and rigid multilayer substrate 98. As a result, the detection accuracy of the magnetic detection element can be improved, and the control of the direction intersecting the optical axis direction KD (intersection direction CD) becomes stable.

Further, as shown in FIG. 16B, the magnetic detection member 88 (magnetic detection element) is provided on an extension line in the longitudinal direction of the two adjacent second coils 23, so that the second coil 23 is provided. The magnetic detection element is less susceptible to the influence of the generated magnetic field. For example, if there is a magnetic detection element under the second coil 23, the detection accuracy is deteriorated due to the influence of the magnetic field generated by the current flowing through the second coil 23.

Then, the multilayer substrate 98 of the detection unit M8, using a multi-layer printed wiring board (PWB, printed wiring board), which is formed in a rectangular frame shape, facing each other across the central portion of the lens holding member 2 It is composed of two substrates arranged in such a manner. As a result, when the multilayer substrate 98 is produced from the mother substrate, the divided substrate can be obtained with a higher yield than the case where the multilayer substrate 98 is formed of one connected substrate (ring-shaped substrate). Therefore, the number of boards taken from one mother board increases, and the manufacturing cost of the multilayer board 98 can be suppressed.

Further, two magnetic detection elements are mounted together on one divided multilayer board 98. Therefore, when mounting the magnetic detection member 88 (magnetic detection element), it is sufficient to mount the magnetic detection member 88 (magnetic detection element) on only the minimum number of boards, not on all the boards. Therefore, productivity can be improved.

The detecting means M8 configured as described above can detect the position of the movable unit KU and, by extension, the lens holding member 2 in the crossing direction CD. Then, the lens driving device 100 can correct the position of the lens holding member 2 by passing a current through the second coil 23 based on the signal information from the detecting means M8.

Next, the frame body W9 of the lens driving device 100 will be described. The frame W9 is an annular member made of a synthetic resin material such as polybutylene terephtalate (PBT) and having a rectangular opening in the center and having a substantially rectangular shape as shown in FIG.

Further, as shown in FIG. 1, two sets of through holes W9k (a total of eight) are provided at the four corners of the frame body W9, and when the frame body W9 is incorporated into the lens driving device 100, As shown in FIG. 5A, the protrusion B16t of the upper spring fixing portion B16 is inserted. Then, by fixing this portion with an adhesive, the other side (second portion 24) of the upper leaf spring 4A sandwiched between the frame body W9 and the upper spring fixing portion B16 is fixed to the fixing member R6 side. become.

Finally, the case member H9 of the lens driving device 100 will be described. The case member H9 is manufactured by cutting, drawing, or the like using a metal plate made of a non-magnetic metal material, and has a box-shaped outer shape as shown in FIG. 1A. It has a substantially rectangular shape (viewed in a plane) as shown in. Then, the case member H9 covers the movable unit KU, the suspension wire 5, the second drive mechanism D2, the detection means M8, and the frame body W9, accommodates these members, and is fixed to the base member 7. .. The case member H9 and the base member 7 are fixed by an adhesive.

Next, the operation of the lens driving device 100 configured as described above will be briefly described.

First, in the movable unit KU of the lens driving device 100, both ends of the first coil 13 are electrically connected to the power feeding terminal T9 via the upper leaf spring 4A, the suspension wire 5, and the conductive portion 7c of the base member 7. Therefore, a current can be passed from the terminal T9 to the first coil 13. On the other hand, the magnetic flux from the permanent magnet EM emits the permanent magnet EM, passes through the first coil 13, and returns to the permanent magnet EM.

When a current is passed from one terminal T9 side to the first coil 13 from this initial state, an electromagnetic force is applied to the first coil 13 from the Z1 direction to the Z2 direction, which is the optical axis direction KD, according to Fleming's left-hand rule. Occur. Then, the lens holding member 2 moves in the Z2 direction. On the other hand, when a current is passed through the first coil 13 from the other terminal T9 side, an electromagnetic force is generated from the Z2 direction, which is the optical axis direction KD, to the Z1 direction, and the lens holding member 2 moves in the Z1 direction. .. In this way, by passing a current through the first coil 13, the lens driving device 100 is supported by the urging member 4 of the movable unit KU by the electromagnetic force generated in the first coil 13, and the lens body (not shown) is formed. It can be integrated with the lens holding member 2 and moved along the optical axis direction KD (Z direction shown in FIG. 2).

Further, in the second drive mechanism D2 of the lens drive device 100, each of the four second coils 23 is electrically connected to the power supply terminal T9 via the multilayer board 98 and the conductive portion 7c of the base member 7. Therefore, a current can flow from the terminal T9 to the second coil 23. On the other hand, the magnetic flux from the permanent magnet EM emits the permanent magnet EM, passes through the second coil 23, and returns to the permanent magnet EM.

When a current is passed through one pair of second coils 23 that are long in the X direction from this initial state, an electromagnetic force in the Y direction is generated in the second coil 23 that is long in the X direction. Further, when a current is passed through the other pair of second coils 23 that are long in the Y direction, an electromagnetic force in the X direction is generated in the second coil 23 that is long in the Y direction. Then, the electromagnetic force generated in the second coil 23 can apply thrust to the movable unit KU supported by the suspension wire 5 in the X direction or the Y direction. Therefore, the movable unit KU can be moved in the direction intersecting the optical axis direction KD (intersection direction CD).

Next, a method of manufacturing the lens driving device 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 18 is a diagram illustrating a manufacturing method of the lens driving device 100, and is an explanatory diagram showing each manufacturing process.

As shown in FIG. 18, the method for manufacturing the lens driving device 100 according to the first embodiment of the present invention includes each member (lens holding member 2, first coil 13, and urging member 4 (upper leaf spring) shown in FIG. 4A, lower leaf spring 4C), permanent magnet EM, suspension wire 5, fixing member R6, base member 7, multilayer substrate 98 on which the second coil 23 is formed, magnetic detection member 88, frame W9, case member H9). It is composed of a preparatory process PJ for preparation and an assembly process PK for assembling each member.

Further, in the preparation step PJ, as shown in FIG. 18, an urging member manufacturing step JB for manufacturing the urging member 4 to be soldered to the upper end portion of the suspension wire 5 and a fixing member to which the permanent magnet EM is fixed are included. A fixing member manufacturing process JC for manufacturing R6, a base member manufacturing process JD for manufacturing a base member 7 soldered to the lower end of a suspension wire 5, and a multilayer board for manufacturing a multilayer board 98 fixed to the base member 7. It has a manufacturing process JE. It should be noted that although each of the other members also has a manufacturing process JA, it does not have any distinctive features, so detailed description here will be omitted.

Further, as shown in FIG. 18, the assembly step PK mainly includes a wire insertion step (first insertion step K1) in which the suspension wire 5 is inserted into the penetrating portion 64k of the upper leaf spring 4A, and the upper leaf spring 4A. A coating step of applying solder paste to the wire fixing portion 64 (first coating step K2), a laser irradiation step of soldering the wire fixing portion 64 and the suspension wire 5 (first laser step K3), and a base member 7 A wire insertion step (second insertion step K4) for inserting the suspension wire 5 into the through hole 7h, a coating step (second coating step K5) for applying solder paste to the plating portion 7m of the base member 7, and a plating portion 7m. It has a laser irradiation step (second laser step K6) of soldering the suspension wire 5. Although it has other processes related to assembly, it does not have any distinctive features, so detailed description thereof will be omitted here.

First, the preparation process PJ will be described.

First, in the manufacturing step JA of the preparation step PJ, a liquid crystal polymer (LCP) or the like is injection-molded to manufacture a lens holding member 2 formed in a tubular shape. Then, a metal wire having an insulating coating on the outer circumference is wound around one entwined portion 12k of the lens holding member 2 and wound around an outer peripheral surface formed between the eaves portion 22 and the flange portion 32. ing. When the winding is completed, the metal wire is wound around the other entwined portion 12k to cut the metal wire to produce the octagonal first coil 13.

Next, in the urging member manufacturing step JB of the preparation step PJ, a metal plate such as a copper alloy is prepared and punched a plurality of times with a plurality of dies to perform the urging member 4, that is, the upper leaf spring 4A. And the lower leaf spring 4C is manufactured.

Then, when the upper leaf spring 4A is manufactured, the first portion 14 fixed to the lens holding member 2 and the second portion 24 fixed to the upper spring fixing portion B16 as shown in FIG. 8A are shown. An elastic arm portion 54A provided between the first portion 14 and the second portion 24, and a wire fixing portion 64 located outside the second portion 24 and soldered to the upper end portion of the suspension wire 5. The shape of the mold is determined so as to have a connecting portion 74 provided so as to connect the second portion 24 and the wire fixing portion 64. Further, the connecting portion 74 has two extending portions 74e extending from two separated portions of the second portion 24 toward the wire fixing portion 64 side, and a wire is provided between the two extending portions 74e. The shape of the mold is also determined so that a plate-shaped protruding portion 84 protruding inward from the fixed portion 64 is provided.

Further, the wire fixing portion 64 has a penetrating portion 64k through which the suspension wire 5 can be inserted, and the protruding portion 84 is made of gold so that an opening 84k adjacent to the wire fixing portion 64 is formed. Decide the shape of the mold. Further, the opening 84k is composed of a through hole (a long hole that penetrates) formed so that the dimension in the orthogonal direction orthogonal to the protrusion direction of the protrusion 84 is larger than the dimension in the protrusion direction, and the dimension of the opening 84k in the orthogonal direction. Is larger than the width dimension between the edge of the protrusion 84 and the edge of the opening 84k in the orthogonal direction, and the width of the portion between the penetration 64k and the opening 84k is larger than the width of the opening 84k. The shape of the mold is determined so as to be narrower than the width of the protruding portion 84 of the portion located inside.

Further, when the lower leaf spring 4C is manufactured, it is similarly fixed to the third portion 34 fixed to the lens holding member 2 and the lower spring fixing portion B26 as shown in FIG. 8B. The shape of the mold is formed so as to have an elastic arm portion 54C provided between the fourth portion 44, the third portion 34, and the fourth portion 44, and a chain portion R4 connecting the third portions 34, respectively. I will decide. The upper leaf spring 4A and the lower leaf spring 4C may be manufactured by etching instead of punching.

Next, in the manufacturing step JA of the preparation step PJ, a permanent magnet EM is manufactured by using a magnetic material such as neodymium and sintering it into an elongated plate-like shape. Then, four permanent magnet EMs having the same shape are prepared and magnetized so that the inner side surface EMp and the outer side surface EMq of the permanent magnet EM have different magnetic poles.

Next, in the preparation step JA of the preparation step PJ, a metal wire such as a copper alloy is prepared, and the metal wire is cut to a desired length to obtain a suspension wire 5 having conductivity and excellent elasticity. I am making it.

Next, in the fixing member manufacturing step JC of the preparation step PJ, a liquid crystal polymer (LCP) or the like is injection-molded to manufacture a fixing member R6 formed into a substantially rectangular frame shape in a plan view. Then, when the fixing member R6 is manufactured, a desired shape can be obtained by determining the shape of the mold in advance.

Specifically, the facing wall portion 46 forming the outer circumference, the frame-shaped portion 56 forming the upper side surface, the extending portion 66 formed at the four corners and protruding downward from the frame-shaped portion 56, and the permanent magnet EM. The shape of the mold is manufactured so as to have the positioning portion 76 capable of contacting the inner side surface EMp facing the first coil 13 side. Similarly, the facing wall portion 46 has a notch in the central portion, and the length dimension of the facing wall portion 46 in the optical axis direction KD is formed to be smaller than the length dimension of the positioning portion 76. To.

Further, when the permanent magnet EM is housed in the fixing member R6, the permanent magnet EM has a first gap of 6 g between the facing wall portion 46 and the outer surface EMq of the permanent magnet EM (see FIG. 13). When the lower surface EMz and the lower end surface 66p of the extension portion 66 are aligned, the mold is also prepared so as to have a second gap between the frame-shaped portion 56 and the upper surface EMa of the permanent magnet EM.

Further, on the upper side surface of the frame-shaped portion 56 of the fixing member R6, an upper spring fixing portion B16 for fixing the other side (second portion 24) of the upper leaf spring 4A is formed, and the fixing member R6 is extended. A mold is prepared so that a lower spring fixing portion B26 to which the other side (fourth portion 44) of the lower leaf spring 4C is fixed is formed on the lower side of the portion 66.

Next, in the base member manufacturing step JD of the preparation step PJ, first, a liquid crystal polymer (LCP) or the like is injection-molded to prepare a first molded member that supports the conductive portion 7c and the terminal T9. Next, a catalyst treatment for plating the first molded member is performed. Next, this first molding member is set in a mold, and the second molding member is injection-molded so as to cover other than the conductive portion 7c and the portion corresponding to the terminal T9. As a result, the base portion 17 having a rectangular outer shape and an annular shape having a circular opening, and the adhesive arranging portion 37 provided on the upper surface side of the base member 7 are formed. A molded member having a thin-walled portion 57 located at a corner of the base member 7 is produced. Finally, a plating film is formed on the portion where the first molding member is exposed on the surface in the order of copper plating, nickel plating, and gold plating. In this way, the base member 7 in which the conductive portion 7c and the terminal T9 are three-dimensionally wired on the upper surface, the lower surface 17u, and the side surface is manufactured.

Then, when the base member 7 is manufactured, a desired shape can be obtained by predetermining the shape of the mold as in the case of the fixing member R6. Specifically, the thin-walled portion 57 has a through hole 7h through which the suspension wire 5 is inserted, and a plating portion 7m made of a metal film formed around the through hole 7h and on the inner surface of the through hole 7h. The mold is prepared so that the lower surface 57v of the thin portion 57 is located above the lower surface 17u of the base 17.

Further, when the base member 7 is manufactured, at least a part of the thin-walled portion 57 and the base portion 17 have a step and are connected by the wall portion 57w, and the lower surface 57v and the wall portion 57w of the thin-walled portion 57 are formed. The first molding member and the second molding member are configured so as to be plated with the same metal film as the plated portion 7 m.

Next, in the multi-layer board manufacturing step JE of the preparation step PJ, a multi-layer board is formed by forming a plurality of multi-layer boards 98 on the mother board and performing division processing using the mother board in which the conductive layers are formed in multiple layers. 98 is being produced. At this time, in the first embodiment of the present invention, since the multilayer substrate 98 is composed of two substrates having a shape such that the central portion of the lens holding member 2 is sandwiched between them, the multilayer substrate 98 is formed of one connected substrate. The two multilayer boards 98 can be arranged on the mother board with better yield than in the case where the case is used. Therefore, the manufacturing cost of the multilayer board 98 can be suppressed.

Further, on the multilayer substrate 98, a second coil 23 in which a plurality of layers of spiral coil patterns are laminated is produced. In that case, when the two multilayer boards 98 are assembled, the pair of second coils 23 facing each other with the lens holding member 2 sandwiched in the plan view from the optical axis direction KD have the same size. It should be provided point-symmetrically. As a result, when a current is passed through the second coil 23, a force that rotates the movable unit KU is not generated, and the movable unit KU can be appropriately driven in a well-balanced direction in the direction intersecting the optical axis (intersection direction CD). ..

Next, in the manufacturing step JA of the preparation step PJ, the magnetic detection member 88 in which the magnetic detection element (GMR element) is packaged with a thermosetting synthetic resin is manufactured. In that case, a resin package base material having a pattern in which the four terminals are exposed to the outside is used, a magnetic detection element (GMR element) is mounted on the resin package base material, and the wirings of each other are connected by wire bonding. After that, it is packaged.

Then, the two magnetic detection members 88 are mounted on the lower surface of the multilayer board 98 by using a mounter or the like. In that case, the magnetic detection member 88 is mounted on the extension line in the longitudinal direction of the two adjacent second coils 23, so that the magnetic detection element is less likely to be affected by the magnetic field generated by the second coil 23. I am doing it.

Further, two magnetic detection elements are mounted (mounted) together on one divided multilayer board 98, and the magnetic detection member 88 (magnetic detection element) is mounted only on the minimum number of boards. I try to improve my productivity.

Further, in the manufacturing step JA of the preparation step PJ, polybutylene terephthalate (PBT) or the like is injection-molded to manufacture a frame body W9 having a rectangular opening in the center and having a substantially rectangular shape. Then, at the four corners of the frame body W9, two sets of through holes W9k through which the protrusions B16t of the upper spring fixing portion B16 are inserted are formed.

Further, in the manufacturing process JA of the preparation process PJ, a metal plate made of a non-magnetic metal material is used to perform cutting, drawing, etc., and the outer shape is formed into a box shape and has a substantially rectangular shape (in a plan view). The case member H9 is manufactured.

Next, the assembly process PK will be described.

First, as shown in FIG. 18, the permanent magnet mounting step LA for mounting the permanent magnet EM on the fixing member R6 is performed in advance. When incorporating this permanent magnet EM into the fixing member R6, the permanent magnet EM is placed on a flat plate-shaped jig, and further placed so as to cover the fixing member R6. As a result, the lower surface EMz of the permanent magnet EM and the lower end surface 66p of the extending portion 66 of the fixing member R6 can be easily aligned on the same plane. As a result, the permanent magnet EM can be arranged with high accuracy. A thermosetting adhesive is applied in advance to the portion of the second gap formed between the upper surface EMa of the permanent magnet EM and the frame-shaped portion 56 of the fixing member R6.

Further, after the permanent magnet EM is incorporated into the fixing member R6, an ultraviolet curable adhesive is applied to the notch 46k (concave shape portion) of the facing wall portion 46. By having this notch 46k, the adhesive can be easily applied. Further, since the fixing member R6 and the permanent magnet EM can be adhered to each other in a wide area between the facing wall portion 46 and the outer surface of the permanent magnet EM, the permanent magnet EM is fixed to the fixing member R6 with strong strength. be able to.

Further, after applying the ultraviolet curable adhesive, a thin jig is inserted between the permanent magnet EM and the facing wall portion 46 to bring the inner side surface EMp of the permanent magnet EM into contact with the positioning portion 76. Then, in this state, the adhesive is irradiated with ultraviolet rays to cure the ultraviolet curable adhesive, and the permanent magnet EM is fixed to the fixing member R6. Then remove the jig.

Further, a thermosetting adhesive is applied to the portion of the third gap 6s provided between the extending wall portion 66w of the fixing member R6 and the inner side surface EMp of the permanent magnet EM76, and the thermosetting is heat-cured by heating. Cure the mold adhesive. As a result, the permanent magnet EM and the fixing member R6 can be firmly fixed at the portion of the second gap and the portion of the third gap 6s. As a result, it is possible to reliably prevent the permanent magnet EM from falling off from the fixing member R6 even if a strong impact such as dropping is applied.

In this way, even if the thickness of the permanent magnet EM varies, the inner surface EMp of the permanent magnet EM and the positioning portion 76 of the fixing member R6 are in contact with each other for positioning, so that the permanent magnet EM (fixing member R6) is positioned. When assembled, the variation in distance between the inner surface EMp of the permanent magnet EM and the first coil 13 is suppressed, and the permanent magnet EM is arranged with high accuracy. Therefore, the magnetic force acting on the first coil 13 from the permanent magnet EM is stable, and the thrust for moving the lens holding member 2 in the optical axis direction KD is also stable.

Next, as shown in FIG. 18, the multilayer board mounting step LB for mounting the multilayer board 98 on the base member 7 is performed in advance. When fixing the multilayer substrate 98 to the base member 7, first, a thermosetting adhesive is applied to a convex portion inside the groove portion 37 m of the base member 7. Next, the multilayer board 98 is placed on the base member 7. At that time, the protruding adhesive is housed in the space of the groove 37 m. Finally, the adhesive is heated / cured to fix the multilayer substrate 98 to the base member 7.

Next, the urging member mounting step LC is performed. First, the first portion 14 of the upper leaf spring 4A is fixed to the lens holding member 2. At that time, the convex portion 12t of the lens holding member 2 is inserted into the through hole of the first portion 14, and the convex portion 12t is heated to heat one side of the upper leaf spring 4A to the lens holding member 2. Fix to.

Next, the fixing member R6 (where the permanent magnet EM is mounted) manufactured in the permanent magnet mounting step LA and the frame body W9 are assembled so as to sandwich the upper leaf spring 4A, and the second portion 24 of the upper leaf spring 4A is mounted. It is fixed to the upper spring fixing portion B16 (fixing member R6). In that case, the upper leaf spring 4A is formed by inserting the protrusion B16t of the upper spring fixing portion B16 into the through hole of the second portion 24 and the through hole W9k of the frame body W9 and fixing this portion with an adhesive. The other side of the is fixed to the fixing member R6 side.

Next, the lower leaf spring 4C is incorporated. At that time, the third portion 34 of the lower leaf spring 4C and the recessed portion 32r of the lens holding member 2 are fixed with an adhesive, and the fourth portion 44 of the lower leaf spring 4C and the lower spring fixing portion B26 (fixed). The member R6) is fixed with an adhesive.

Next, as shown in FIG. 18, a wire insertion step (first insertion step K1) is performed. In the wire insertion step (first insertion step K1), the suspension wire 5 is inserted through the penetrating portion 64k of the upper leaf spring 4A. As a result, the wire fixing portion 64 and the suspension wire 5 can be easily engaged with each other. Then, after the suspension wire 5 is inserted, the intermediate portion of the suspension wire 5 is clamped with a jig so that the suspension wire 5 does not shift in position.

Next, as shown in FIG. 18, after the wire insertion step (first insertion step K1), the coating step (first coating step K2) is performed. In the coating step (first coating step K2), the solder paste is applied to the upper surface of the wire fixing portion 64 including the penetrating portion 64k of the upper leaf spring 4A by using a dispenser device. As a result, the solder paste can be applied over the entire circumference of the suspension wire 5, and in the next laser irradiation step (first laser step K3), the solder paste can be soldered over the entire circumference of the suspension wire 5. ..

Further, since this coating step (first coating step K2) is performed after the wire insertion step (first insertion step K1), the suspension wire 5 is penetrated through the suspension wire 5 in a state where the solder paste is not applied to the penetration portion 64k. Can be inserted into. Therefore, it is possible to prevent the suspension wire 5 from being deformed due to the presence of the solder paste (if the suspension wire 5 is passed through the penetrating portion 64k while the solder paste is applied, the suspension wire 5 may be deformed. ).

Next, as shown in FIG. 18, a laser irradiation step (first laser step K3) is performed after the coating step (first coating step K2). In the laser irradiation step (first laser step K3), the protruding portion 84 connected to the wire fixing portion 64 is irradiated with the laser beam. As a result, the protruding portion 84 of the upper leaf spring 4A is heated by the laser beam, heat is conducted from the protruding portion 84 to the wire fixing portion 64 connected to the protruding portion 84, and the wire fixing portion 64 is heated. Therefore, the solder paste applied to the wire fixing portion 64 is heated to become molten solder HD, and then the solder HD is cooled to form the upper end portion of the suspension wire 5 and the wire fixing portion 64 of the upper leaf spring 4A. Will be soldered (soldering process). As a result, workability and the like can be improved and defects in the soldering process can be reduced as compared with the case of manual soldering.

Further, in the first embodiment of the present invention, since the opening 84k is formed in the protruding portion 84 adjacent to the wire fixing portion 64, the opening 84k is used in the laser irradiation step (first laser step K3). The melted solder HD is blocked, and it is possible to prevent the solder HD from flowing widely toward the protrusion 84 side. Therefore, the amount of solder in the wire fixing portion 64 is less likely to vary, and the soldering between the wire fixing portion 64 and the upper end portion of the suspension wire 5 can be ensured. Furthermore, since the solder HD does not flow to the portion irradiated with the laser beam (the portion inside the opening 84k), the solder HD is scattered by the laser beam and the surrounding synthetic resin material is "burnt" due to diffused reflection of the laser beam. Can be prevented.

Further, in the first embodiment of the present invention, the opening 84k is composed of a wide penetrating elongated hole (through hole) formed in a direction orthogonal to the projecting direction of the projecting portion 84, and the opening 84k in the orthogonal direction. Since the width dimension of the protrusion 84 is set to be larger than the width dimension between the edge portion of the protrusion 84 and the edge portion of the opening 84k, the solder HD can be reliably dammed by the opening 84k. Therefore, it is possible to reliably prevent the solder HD from flowing widely toward the protrusion 84 side.

Further, in the first embodiment of the present invention, the width of the portion between the penetrating portion 64k and the opening 84k is narrower than the width of the protruding portion 84 of the portion located inside the opening 84k. The outer shape (footprint) of the solder fillet formed around the suspension wire 5 is regulated by the portion where the width is narrowed. Therefore, it is possible to prevent the solder fillet from spreading significantly and to reduce the variation in the amount of solder in the wire fixing portion 64. After the soldering step, the jig is removed from the suspension wire 5.

Next, the main body is inverted with the upper leaf spring 4A on the lower side, and a wire insertion step (second insertion step K4) is performed as shown in FIG. In the wire insertion step (second insertion step K4), the base member 7 (with the multilayer board 98 mounted) produced in the multilayer board mounting step LB is incorporated from above, and the suspension wire 5 is inserted into the through hole 7h of the base member 7. Is inserted. As a result, the base member 7 and the suspension wire 5 can be easily engaged with each other. In the next coating step (second coating step K5) and laser irradiation step (second laser step K6), the main body was inverted with the upper leaf spring 4A on the lower side in order to facilitate manufacturing, but it was not necessarily inverted. do not have to.

Next, as shown in FIG. 18, a coating step (second coating step K5) is performed after the wire insertion step (second insertion step K4). In the coating step (second coating step K5), the solder paste is applied to the through hole 7h of the base member 7 and the plating portion 7m located around the through hole 7h from the lower surface 57v side of the thin wall portion 57 by using a dispenser device. .. As a result, the solder paste can be applied over the entire circumference of the suspension wire 5, and in the next laser irradiation step (second laser step K6), the solder paste can be soldered over the entire circumference of the suspension wire 5. ..

Further, since this coating step (second coating step K5) is performed after the wire insertion step (second insertion step K4), the suspension wire 5 is passed through the through hole 7h in a state where the solder paste is not applied to the through hole 7h. Can be inserted into. Therefore, it is possible to prevent the suspension wire 5 from being deformed due to the presence of the solder paste (if the suspension wire 5 is passed through the through hole 7h with the solder paste applied, the suspension wire 5 may be deformed. ).

Further, in the base member manufacturing step JD, since the through hole 7h is provided in the thin wall portion 57 formed to have a thickness dimension smaller than that of the base portion 17, the surface area of the plating portion 7m formed on the inner surface of the through hole 7h is reduced. be able to. Therefore, in this coating step (second coating step K5), the amount of solder paste filled on the inner surface of the through hole 7h can be reduced.

Next, as shown in FIG. 18, a laser irradiation step (second laser step K6) is performed after the coating step (second coating step K5). In the laser irradiation step (second laser step K6), the solder paste is directly irradiated with laser light. As a result, the solder paste is directly heated to become a molten solder HD, and then the solder HD is cooled to form a plating portion formed around the lower end of the suspension wire 5 and the through hole 7h and the inner surface of the through hole 7h. 7m will be soldered. Therefore, the suspension wire 5 is surely fixed to the plate-shaped and rigid base member 7. As a result, the suspension wire 5 can be stably supported as compared with the FPC933, which is a film base material of the conventional example, and the control of the crossing direction CD intersecting the optical axis direction KD for image stabilization is stable. Can be made to. Moreover, since it is a spot heating method using laser light, productivity is good. In the laser irradiation step (second laser step K6), since the laser beam is directly irradiated to the solder paste, the laser output is smaller than the laser output in the laser irradiation step (first laser step K3).

Further, in the first embodiment of the present invention, in the laser irradiation step (second laser step K6), the laser beam is emitted from the lower surface (lower) side of the base member 7 (the side opposite to the side on which the movable unit KU is arranged). Is irradiating. As a result, even if the flux or solder HD scatters due to the irradiation of the laser beam and hits the lower surface 57v and the wall portion 57w, the same metal film as the plating portion 7m is formed on the lower surface 57v and the wall portion 57w. Therefore, it is possible to prevent the synthetic resin material constituting the base member 7 of the lower surface 57v and the wall portion 57w from being burnt. Further, due to the irradiation of the laser beam, the laser beam that hits the solder paste is diffusely reflected, and even if a part of the laser beam hits the wall portion 57w, the synthetic resin material constituting the base member 7 of the wall portion 57w is burnt. Can be suppressed.

Further, heat can be dissipated by the metal film formed on the lower surface 57v and the wall portion 57w, and by connecting the metal film from the wall portion 57w to the terminal portion (conductive portion 7c) formed on the base portion 17, this is achieved. Excess heat can be further dissipated by the metal film and the terminal portion of the portion. As a result, the amount of heat given to the thin-walled portion 57 can be further reduced, and damage to the base member 7 can be further suppressed.

Further, in the first embodiment of the present invention, in the coating step (second coating step K5), the amount of the solder paste filled in the inner surface of the through hole 7h is reduced, so that the laser irradiation step (second laser). In step K6), the amount of heat applied to the solder paste can be reduced, and damage to the base member 7 can be suppressed.

Further, in the first embodiment of the present invention, since the layer on the outermost surface side of the metal film is gold, the solderability is good in the laser irradiation step (second laser step K6). Further, since the reflectance of the laser beam due to gold is high (about 95%), the laser beam that hits the solder paste or the solder HD is diffusely reflected, and a part of the laser beam is tentatively reflected on the lower surface 57v or the wall portion 57w of the thin portion 57. Even if it hits, it will be reflected reliably. Therefore, the amount of heat given to the thin-walled portion 57 and the wall portion 57w can be further reduced, and damage to the base member 7 can be further suppressed.

Finally, as shown in FIG. 18, the case member mounting step LD is performed. In the case member mounting step LD, the case member H9 is mounted on the base member 7 by applying an adhesive to the inside of the case member H9 so as to accommodate the movable unit KU, the suspension wire 5, and the like. Then, the case member H9 and the base member 7 are fixed by curing the adhesive.

The effects of the lens driving device 100 according to the first embodiment of the present invention configured as described above will be summarized below.

In the lens driving device 100 of the first embodiment of the present invention, the magnetic detection element is mounted on the lower surface of the multilayer substrate 98 in which a plurality of spiral coil patterns constituting the second coil 23 are laminated, and the multilayer substrate is mounted. Since the second coil 23 of 98 is electrically connected to the conductive portion 7c of the base member 7, the flexible printed circuit board (FPC) as in the conventional example becomes unnecessary. Therefore, the distance between the magnetic detection element and the permanent magnet EM can be shortened, and the magnetic detection element is stably mounted on the multilayer board 98 which is more rigid than the FPC. As a result, the detection accuracy of the magnetic detection element can be improved, and the control of the direction intersecting the optical axis direction KD (intersection direction CD) becomes stable.

Further, since the multilayer substrate 98 is composed of at least two substrates arranged so as to face each other with the central portion of the lens holding member 2 interposed therebetween, one is connected when the multilayer substrate 98 is manufactured from the mother substrate. Compared with the case of being formed of a substrate (ring-shaped substrate), the divided substrate can be obtained with a good yield. Therefore, the number of boards taken from one mother board increases, and the manufacturing cost of the multilayer board 98 can be suppressed.

Further, since the two magnetic detection elements are collectively mounted (mounted) on one of the divided substrates of the multilayer substrate 98, when the magnetic detection member 88 (magnetic detection element) is mounted, it is mounted on all the substrates. It is sufficient to mount only on the minimum board without mounting each. Therefore, productivity can be improved.

Further, since the magnetic detection element is provided on the extension line in the longitudinal direction of the two adjacent second coils 23, the magnetic detection element is less likely to be affected by the magnetic field generated by the second coil 23. For example, if there is a magnetic detection element under the second coil 23, the detection accuracy is deteriorated due to the influence of the magnetic field generated by the current flowing through the second coil 23. Further, in a plan view seen from the optical axis direction KD, the second coils 23 facing each other across the lens holding member 2 are provided point-symmetrically, so that when a current is passed through the second coil 23, the movable unit No force is generated to rotate the KU, and it can be driven appropriately in a well-balanced manner in the direction intersecting the optical axis (intersection direction CD).

Further, since the adhesive arranging portion 37 is provided corresponding to the second coil 23, and the multilayer substrate 98 is fixed to the base member 7 by the adhesive (AD) provided in the adhesive arranging portion 37. , It is possible to prevent the portion of the second coil 23 from floating and to maintain an appropriate distance between the second coil 23 and the permanent magnet EM. Further, since the adhesive arranging portion 37 has an annular groove portion 37 m around it, excess adhesive (AD) is accommodated in the annular groove portion 37 m when the multilayer substrate 98 and the base member 7 are bonded to each other. The Rukoto. Therefore, the adhesive (AD) can be bonded with an appropriate thickness of the adhesive (AD), and the adhesive (AD) can be prevented from protruding to the outside of the multilayer substrate 98.

The present invention is not limited to the above-described embodiment, and can be modified and implemented as follows, and these embodiments also belong to the technical scope of the present invention.

19A and 19B are views for explaining a modified example of the lens driving device 100, FIG. 19A is an enlarged top view showing a modified example 3 of the upper leaf spring 4A, and FIG. 19B is an upper view. It is an enlarged top view which shows the modification 4 of the side leaf spring 4A, and FIG. 19C is the enlarged downward perspective view which shows the modification 6 to the modification 8 of the base member 7.

<Modification example 1>
In the first embodiment, the upper spring fixing portion B16 and the lower spring fixing portion B26 to which the other side of the urging member 4 (upper leaf spring 4A, lower leaf spring 4C) is fixed are provided integrally with the fixing member R6. However, the present invention is not limited to this, and separate members may be used for each.

<Modification 2>
In the first embodiment, the opening 84k is preferably formed by a through hole, but the present invention is not limited to this, and the opening may be formed by a concave portion (recessed portion) having a step.

<Modification 3><Modification4>
In the first embodiment, as shown in FIG. 10A, the suspension wire 5 is formed as a penetrating portion 64k through which the suspension wire 5 is inserted, but is not limited to this. For example, as shown in FIG. 19 (a), it may be a notched penetrating portion C64k in which a part is cut out {modification example 3}, and as shown in FIG. 19 (b), it has a U shape. It may be a notch-shaped penetrating portion D64k {modification example 4}.

<Modification 5>
In the first embodiment, the base member 7 is preferably used as the support member for supporting the lower end portion of the suspension wire 5, but the present invention is not limited to this. For example, the lower end portion of the suspension wire 5 may be fixed to the multilayer board 98, and the multilayer board 98 may be used as a support member.

<Modification 6><Modification7>
In the first embodiment, as shown in FIG. 15B, the lower surface 57v of the thin wall portion 57 and the lower surface 17u of the base portion 17 are connected by a wall portion 57w having a vertical wall. The structure is not limited, and the thin-walled portion 57 and the base portion 17 may be connected with at least a part having a step. For example, as shown in FIG. 19C, the wall portion E57w may have an inclined wall formed diagonally with respect to the lower surface 57v of the thin-walled portion 57 {deformation example 6}, the thin-walled portion 57. And the base portion 17 may not be connected with a step from the lower surface 57v of the thin-walled portion 57, but may be directly connected (WP shown in FIG. 19C).

<Modification 8>
In the first embodiment, as shown in FIG. 15B, the same metal film as the plating portion 7m is formed on the lower surface 57v of the thin-walled portion 57 and the vertical wall portion of the wall portion 57w. However, the present invention is not limited to this, and as shown in FIG. 19 (c), a metal film (MP shown in FIG. 19 (c)) may be formed from the wall portion E57w to the lower surface 17u of the base portion 17. As a result, the metal film in this portion can further dissipate excess heat, and the amount of heat given to the thin portion 57 can be further reduced.

<Modification 9>
In the first embodiment, the GMR element is preferably used as the magnetic detection member 88, but in addition, an MR (Magneto Resistive) element and an AMR (Anisotropic Magneto Resistive) of a type in which the electrical resistance changes with a change in the magnetic field. It may be an element, a TMR (Tunnel Magneto Resistive) element, or the like. Further, the type is not limited to the type in which the electric resistance changes with the change of the magnetic field, and may be a Hall element, for example.

The present invention is not limited to the above-described embodiment, and can be appropriately modified without departing from the gist of the present invention.

KU Movable unit 2 Lens holding member D1 1st drive mechanism 13 1st coil EM Permanent magnet EMa Upper surface EMz Lower surface EMp Inner surface EMq Outer surface D2 2nd drive mechanism 23 2nd coil 4 Bias member 4A Upper leaf spring 4C Lower leaf spring 14 1st part 24 2nd part 54A, 54C Elastic arm part 64 Wire fixing part 64k, C64k, D64k Penetrating part 74 Connecting part 74e Extension part 84 Protruding part 84k Opening part 5 Suspension wire B16 Upper spring fixing part R6 Fixing member 46 Opposing wall part 56 Frame-shaped part 66 Extension part 66p Lower end surface 76 Positioning part 6g First gap 7 Base member 17 Base part 17u Bottom surface 37 Adhesive placement part 37m Groove part 57 Thin-walled part 57w, E57w Wall part 57v Bottom surface 7c Conductive part 7h Hole 7m Plated part M8 Detection means 98 Multilayer substrate K1 First insertion step (wire insertion step)
K2 1st coating process (coating process)
K3 1st laser process (laser irradiation process)
K4 2nd insertion process (wire insertion process)
K5 second coating process (coating process)
K6 2nd laser process (laser irradiation process)
KD optical axis direction 100 lens drive device

Claims (5)

A movable unit including a lens holding member capable of holding a lens body and a first driving mechanism for moving the lens holding member in the optical axis direction.
A suspension wire that movably supports the movable unit in a direction intersecting the optical axis direction,
A base member arranged below the movable unit and
A second drive mechanism that moves the movable unit in a direction intersecting the optical axis direction,
A detection means for detecting a position of the movable unit in a direction intersecting the optical axis direction is provided.
The first drive mechanism is configured to include at least a first coil fixed around the lens holding member and a permanent magnet provided so as to face the first coil.
The second drive mechanism has a plurality of second coils facing the permanent magnet and supported by the base member.
In a lens driving device in which the detection means has at least two magnetic detection elements,
The second coil is composed of a multilayer substrate in which a plurality of layers of spiral coil patterns are laminated.
The patterns formed in each layer of the multilayer substrate are connected by through holes.
The magnetic detection element is mounted on the lower surface of the multilayer substrate.
A lens driving device characterized in that the base member is provided with a conductive portion that is conductively connected to the second coil. The lens driving device according to claim 1, wherein the multilayer substrate is composed of at least two substrates arranged so as to face each other with the central portion of the lens holding member interposed therebetween. The lens driving device according to claim 2, wherein the two magnetic detection elements are mounted on one of the divided substrates of the multilayer substrate. The multilayer substrate is formed in a rectangular frame shape,
The second coil has a shape having a longitudinal direction in a direction along each side portion of the multilayer substrate.
The magnetic detection element is provided so as to be located on an extension line in the longitudinal direction of the two adjacent second coils.
The lens driving device according to any one of claims 1 to 3, wherein the pair of the second coils facing each other with the lens holding member interposed therebetween are provided point-symmetrically. The base member is provided with an adhesive arranging portion having an annular groove portion around the base member corresponding to each of the second coils.
The lens driving device according to any one of claims 1 to 4, wherein the multilayer substrate is fixed to the base member by an adhesive provided in the adhesive arranging portion.