CN107991752B - Lens driving device, camera module, and method for manufacturing lens driving device - Google Patents
Lens driving device, camera module, and method for manufacturing lens driving device Download PDFInfo
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- CN107991752B CN107991752B CN201710998858.5A CN201710998858A CN107991752B CN 107991752 B CN107991752 B CN 107991752B CN 201710998858 A CN201710998858 A CN 201710998858A CN 107991752 B CN107991752 B CN 107991752B
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- Prior art keywords
- driving device
- lens driving
- plate spring
- moving member
- brazing material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
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- Manufacturing & Machinery (AREA)
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- Optics & Photonics (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Reciprocating, Oscillating Or Vibrating Motors (AREA)
Abstract
The invention provides a lens driving device which can reliably connect a plate spring supporting a moving component and a coil arranged on the moving component and realize the thinning of the moving component, a camera module using the lens driving device and a manufacturing method of the lens driving device. A moving member (10) for holding a lens body is provided with a protruding section (15), and a distal end section (41a) of a covered wire (41) constituting a coil is wound around the protruding section (15) to form a wire winding section (42). A joining edge part (27) of a brazing part (25) formed on a movable side supporting piece (22) of the lower leaf spring (20) is opposite to the wire winding part (42). A communication section (28) is formed in the brazing section (25). Therefore, the brazing filler metal can adhere to the inner surface (20a) and the outer surface (20b) of the lower plate spring (20) and the wire winding portion (42).
Description
Technical Field
The present invention relates to a lens driving device to which a coil provided in a moving member on which a lens body is mounted and a plate spring supporting the moving member are soldered, a camera module using the lens driving device, and a method of manufacturing the lens driving device.
Background
The lens driving device includes a lens holding member (moving member) capable of mounting a lens body and a support member. The lens holding member is supported by the support member via the lower plate spring and the upper plate spring. The lens holding member is provided with a coil, and a magnet is fixed to the support member side. A connection terminal portion is formed on a metal member buried in the support member, and a drive current is applied from the connection terminal portion to the coil via the lower plate spring to move the lens holding member in the optical axis direction of the lens body. This operation focuses the image of the imaging element.
In this lens driving device, it is necessary to connect the lower plate spring and the end of the coil. As a configuration for achieving this object, a projection projecting downward is provided on the lens holding member, and the end of the coil is wound around the projection. The lower plate spring is formed with a brazed portion, the brazed portion of the lower plate spring faces the protruding portion, and the brazed portion and the end portion of the coil are brazed.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2015-99322
In the lens driving device described in patent document 1, the plate spring has an inner surface facing the base portion side of the protruding portion and an outer surface facing the front portion side of the protruding portion, and a brazing material is supplied to the outer surface of the plate spring at the brazing portion and brazed.
Therefore, in order to reliably solder the end of the coil wound around the protrusion and the plate spring and conduct them, it is necessary to wind the end of the coil around the protrusion so much that the end of the coil reaches a high position apart from the outer surface of the plate spring. As a result, the height of the projection from the outer surface of the plate spring increases, which hinders the reduction in thickness of the lens driving member in the optical axis direction.
Further, if the brazing material is mainly provided only on the outer surface of the plate spring, the amount of the brazing material contributing to the joining of the coil end portion and the plate spring cannot be increased, and it is difficult to sufficiently secure the joining strength of the coil end portion and the plate spring.
Disclosure of Invention
Problems to be solved by the invention
An object of the present invention is to solve the above conventional problems and to provide a lens driving device capable of reliably joining a coil and a leaf spring without excessively increasing a protruding dimension of a protruding portion provided in a moving member, the protruding dimension protruding from an outer surface of the leaf spring, a camera module using the lens driving device, and a method for manufacturing the lens driving device.
Means for solving the problems
The present invention relates to a lens driving device including a moving member capable of mounting a lens body, a plate spring provided between the moving member and a support member and supporting the moving member to be movable in an optical axis direction of the lens body, a coil provided on the moving member, and a magnet opposed to the coil, the lens driving device is characterized in that the moving member is provided with a protruding part, a lead wire constituting the coil is wound on the protruding part to form a lead wire winding part, the plate spring has an inner surface facing a base side of the protruding portion and an outer surface facing a front side of the protruding portion, and has an engagement edge portion adjacent to the wire winding portion, at least the inner surface of the plate spring and the wire wound portion are joined by a brazing material in a state where the joining edge portion faces the wire wound portion.
In the lens driving device according to the present invention, the plate spring may be provided with a communication portion that communicates the inner surface and the outer surface, the brazing material may be provided on the inner surface and the outer surface via the communication portion, and at least the inner surface and the lead wire winding portion may be joined by the brazing material.
In the lens driving device according to the present invention, the wire wound portion may have a height dimension of a portion located on a base side of the protruding portion from the inner surface of the plate spring larger than a height dimension of a portion located on a front side of the protruding portion from the outer surface.
In the lens driving device according to the present invention, both the inner surface and the outer surface of the plate spring may be joined to the lead wire wound portion with a brazing material, and an amount of the brazing material attached to the inner surface of the plate spring may be larger than an amount of the brazing material attached to the outer surface.
In the lens driving device of the present invention, the communication portion is a hole penetrating the plate spring.
In this case, a connecting portion may be formed between the joining edge portion of the plate spring and the hole, and the brazing material may be provided on both inner and outer surfaces of the hole and the connecting portion.
In the lens driving device according to the present invention, the communication portion may be a recess having a portion opened at the joint edge portion.
Next, a camera module of the present invention is characterized by comprising: any one of the lens driving devices; a lens body held by the moving member of the lens driving device; and an imaging element facing the lens body.
The present invention also relates to a method of manufacturing a lens driving device including a moving member capable of mounting a lens body, a leaf spring provided between the moving member and a support member and supporting the moving member to be movable in an optical axis direction of the lens body, a coil provided in the moving member, and a magnet opposed to the coil, the method being characterized in that a lead wire constituting the coil is wound around a protruding portion provided in the moving member to form a lead wire wound portion, a joining edge portion of the leaf spring is opposed to the lead wire wound portion, the leaf spring has an inner surface facing a base portion side of the protruding portion, an outer surface facing a front portion side of the protruding portion, a communication portion communicating the inner surface and the outer surface, and the joining edge portion, the brazing material is melted on the outer surface of the plate spring, the brazing material is made to reach the inner surface from the outer surface through the communication portion, and at least the inner surface and the lead wire winding portion are joined by the brazing material.
In the method of manufacturing the lens driving device according to the present invention, the communication portion is a hole penetrating the plate spring.
Alternatively, the communication portion is a recess portion having a part thereof opened at the joining edge portion.
Effects of the invention
In the present invention, the inner surface of the plate spring facing the base portion side of the protruding portion and the wire wound portion formed in the protruding portion are soldered, and therefore the protruding dimension of the protruding portion with respect to the outer surface of the plate spring can be reduced. As a result, the moving member can be thinned, and the entire lens driving device can be thinned.
Further, since the communicating portion is formed in the plate spring, the lead wire wound portion can be joined to the plate spring by the brazing material provided on both the inner surface and the outer surface of the plate spring, and therefore, the joining strength between the plate spring and the lead wire wound portion is improved, and the conductivity is also improved. As a result, the number of turns of the wire at the wire winding portion of the protruding portion can be reduced, whereby the height dimension of the protruding portion can also be reduced, contributing to the thinning of the moving member.
In the method of manufacturing the lens driving device according to the present invention, the communication portion is formed in the plate spring, so that when the brazing material is supplied from the outer surface of the plate spring, the melted brazing material passes through the communication portion and reaches the inner surface of the plate spring, and the inner surface of the plate spring and the lead wire winding portion can be reliably soldered.
Drawings
Fig. 1 is a perspective view showing an external appearance of a lens driving device according to an embodiment of the present invention.
Fig. 2 is an exploded perspective view of the lens driving device shown in fig. 1.
Fig. 3 is a perspective view showing a moving member constituting the lens driving device shown in fig. 2 upside down.
Fig. 4 is a partially enlarged perspective view of fig. 3 showing a first embodiment of a solder joint portion between a wire wound portion and a plate spring.
Fig. 5 is an exploded perspective view of a solder joint portion between the wire wound portion and the plate spring shown in fig. 4.
Fig. 6 is a cross-sectional view of the solder joint between the lead wire winding portion and the plate spring shown in fig. 4, taken along line VI-VI.
Fig. 7 is an exploded perspective view showing a second embodiment of a solder joint portion between a wire wound portion and a plate spring.
Fig. 8 is an exploded perspective view showing a third embodiment of a solder joint portion between a wire wound portion and a plate spring.
Fig. 9 is an exploded perspective view showing a fourth embodiment of a solder joint portion between a wire wound portion and a plate spring.
Fig. 10 is an exploded perspective view showing a fifth embodiment of a solder joint portion between a lead wire wound portion and a plate spring.
Description of the reference numerals
1a lens driving device;
2a support base (support member);
3, covering;
4b a connection terminal;
10 moving means;
10a lower surface of the moving member;
15a projection;
15a base portion;
15b front part;
20a lower leaf spring;
20a inner surface;
20b outer surface;
21a fixed-side support piece;
22a movable-side support piece;
23 a resilient arm portion;
25 brazed portions;
25a connecting part;
27 engaging the rim portion;
28. 28a, 28b, 28c, 28 d;
30 an upper plate spring;
40. 40A, 40B, 40C, 40D solder joints;
41 coating a wire;
41a terminal portion;
42 a wire winding portion;
45, brazing filler metal;
c, a coil;
m magnet.
Detailed Description
Fig. 1 and 2 show an overall configuration of a lens driving device 1 according to an embodiment of the present invention.
The lens driving device 1 has a moving member 10. The moving member 10 is a lens holding member formed in a cylindrical shape. A lens body (lens barrel or lens barrel) is attached to the center hole 11 of the moving member 10. The lens body includes a lens group in which one or more lenses are combined, and a lens holding frame that holds the lens or the lens group. A female screw portion 11a is formed in the center hole 11, a male screw portion is formed on the outer peripheral surface of the lens holder, and the male screw portion is screwed into the female screw portion 11a, whereby the lens body is mounted and mounted on the moving member 10. The lens body may be fixed to the moving member 10 by an adhesive.
The Z1-Z2 direction in fig. 1 and 2 is the up-down direction, and is a direction parallel to the optical axis O of the lens body (optical axis direction). The lens driving device 1 is mounted on a portable electronic apparatus such as a mobile phone. An image pickup device such as a CCD is disposed on the Z2 side of the lens driving device 1. The lens driving device 1, the lens body, and the imaging element constitute a camera module. In the camera module, the moving member 10 and the lens body mounted on the moving member 10 move in the Z1-Z2 direction, whereby the image formed on the image pickup device is automatically focused.
As shown in fig. 1 and 2, the lens driving device 1 is provided with a support base 2 and a cover 3. The base 2 and the cover 3 are combined and supported to form a housing (casing) having a housing space therein. The support base 2 is formed of a synthetic resin material as a nonmagnetic material. The cover 3 is formed of a magnetic stainless steel plate or the like, and functions as a yoke. The supporting base 2 has a light-transmitting hole 2b, and the top plate 3a of the cover 3 also has a light-transmitting hole 3 b. The planar shapes of the support base 2 and the cover 3 are quadrangular. In this embodiment, the supporting base 2 and the cover 3 constitute a supporting member (fixing member).
As shown in fig. 2, spring fixing portions 2a are formed at four corners of the support base (support member) 2. A pair of lower leaf springs 20 are attached to the support base 2 so as to be spaced apart from each other. Each lower leaf spring 20 is integrally formed with a fixed-side support piece 21, a movable-side support piece 22 inside the fixed-side support piece 21, and an elastic arm portion 23 connecting the fixed-side support piece 21 and the movable-side support piece 22 by a leaf spring metal material.
Mounting holes 21a are formed in two positions, i.e., the Y1 side and the Y2 side, of the fixed-side support piece 21 of each lower leaf spring 20, and the respective mounting holes 21a are fitted with projections formed on the spring fixing portion 2a of the support base 2, and the projections are fixed by heat caulking. Mounting holes 22a are formed in three locations of the movable-side support piece 22 of each lower leaf spring 20.
The moving member 10 is shown in a posture in which the lower surface 10a is directed upward in fig. 3. Fig. 3 shows the moving member 10 shown in fig. 2 in a posture rotated 180 degrees about the X1-X2 axis. Fig. 3 shows a state in which the lower leaf spring 20 and a coil C described later are attached to the moving member 10. Projections serving as spring fixing portions 12 are provided at six locations in total on the lower surface 10a of the movable member 10. The respective mounting holes 22a formed in the movable-side support piece 22 of the lower leaf spring 20 are fitted into the projections of the spring fixing portion 12 provided on the lower surface 10a of the movable member 10, and the projections are fixed by heat caulking.
As shown in fig. 2, the lens driving device 1 is provided with four magnets M. Each magnet M is located in the vicinity of four corners inside the cover 3 functioning as a yoke, and is fixed to the inner surface of the cover 3 with an adhesive or the like.
As shown in fig. 2, an upper leaf spring 30 is provided above the moving member 10 (in the Z1 direction). The upper plate spring 30 is integrally formed with a rectangular frame-shaped fixed-side support piece 31, a movable-side support piece 32 inside the fixed-side support piece 31, and an elastic arm portion 33 connecting the fixed-side support piece 21 and the movable-side support piece 32, by a plate spring metal material. The four corners of the fixed-side support piece 31 are formed as attachment portions 31a, and each attachment portion 31a is fixed to the upper surface of the magnet M on the Z1 side by an adhesive or the like. Each mounting portion 31a is sandwiched between the inner surface of the top plate portion 3a of the cover 3 and the upper surface of the magnet M. As shown in fig. 2, spring fixing portions 13 are provided on the X1 side and the X2 side of the upper surface 10b of the moving member 10 facing the Z1 side. The movable-side support piece 32 of the upper leaf spring 30 is fixed to the spring fixing portion 13 by a caulking structure or an adhesive structure.
The moving member 10 is held between a lower plate spring 20 and an upper plate spring 30, and is accommodated in an operating space surrounded by four magnets M, the lower plate spring 20 being positioned below the magnets M and fixed to a spring fixing portion 2a of the support base 2, and the upper plate spring 30 being fixed to the magnets M. The elastic arm portion 23 provided in the lower leaf spring 20 is formed in a meandering shape which is a fine curved shape, and the elastic arm portion 33 provided in the upper leaf spring 30 is also formed in a meandering shape which is a fine curved shape. The moving member 10 is supported to be movable in the optical axis direction, i.e., the Z1-Z2 direction, by elastic deformation of the upper and lower elastic arm portions 23 and 33.
A coil C around which a covered wire 41 is wound is provided on the outer periphery of the moving member 10. The magnet M fixed to the inner surface of the cover 3, which is a part of the support member, faces the coil C from the outside at four locations spaced apart from the coil C in the circumferential direction of the moving member 10.
As shown in fig. 2, a metal plate divided into three parts is embedded in the supporting base 2, and a part of each of the two metal plates protrudes downward from the side of the supporting base 2 as a connection terminal 4b (the connection terminal 4b is shown in fig. 2). Of the four spring fixing portions 2a of the support base 2, two spring fixing portions 2a provided on the Y1 side are formed with exposed portions 4a in which parts of the two metal plates are exposed. The two lower leaf springs 20 are individually brought into close contact with the exposed portion 4a and joined by welding or the like, and the two connection terminals 4b are electrically connected to the two lower leaf springs 20 in a one-to-one manner.
The other of the three-divided metal plates, on which the exposed portion 4a is not formed, is formed into a U-shape in plan view, and a part of the other metal plate protrudes outward as a grounding terminal 4c at a corner of the support base 2 as shown in fig. 1 and 2. The ground terminal 4c is joined to the lid 3, and the lid 3 is set to the ground potential.
As shown in fig. 3, the solder joint portions 40 are provided at two locations on the lower surface 10a of the moving member 10 facing the Z2 side. In each solder joint 40, one lower leaf spring 20 divided into two parts is soldered and joined to one end portion of the covered conductor wire 41 forming the coil C, and the other lower leaf spring 20 is soldered and joined to the other end portion of the covered conductor wire 41. The one end portion and the other end portion of the covered wire 41 are soldered by removing the insulating coating.
Thus, the connection terminals 4b, which are divided into two parts and embedded in the support base 2, are connected to and electrically connected to one end portion and the other end portion of the covered conductor wire 41 via the lower leaf springs 20. This allows the coil C to be energized from the two connection terminals 4 b. When a driving current is applied to the coil C through the current-carrying path, the moving member 10 is driven in the Z1-Z2 direction by an electromagnetic force generated by the current flowing through the coil C and the magnetic field generated by the magnet M. By the operation of the moving member 10, the image formed on the imaging element is focused on the lens body. The four magnets M are magnetized so that the facing inner surfaces facing the coil C and the outer surfaces facing the inner surface of the cover 3 have different magnetic poles.
Fig. 4 is a partially enlarged perspective view of fig. 3, and shows a solder joint 40 on the X1 side shown in fig. 3 as a solder joint of the first embodiment. In the solder joint 40, the lower leaf spring 20 on the X1 side is soldered to one end portion 41a of the covered wire 41 extending from the coil C. Fig. 5 is an exploded perspective view of the solder joint 40 shown in fig. 4, and fig. 6 is a cross-sectional view of fig. 4 taken along line VI-VI. The brazing material 45 is illustrated in fig. 4 and 6, but the illustration of the brazing material 45 is omitted in fig. 5. The solder joint 40 that solders the other lower leaf spring 20 located on the X2 side and the other end portion 41a of the covered wire 41 is axisymmetric to the solder joint 40 shown in fig. 4 to 6 about the Y1-Y2 axis, and has the same structure, and therefore, the description thereof is omitted.
As shown in fig. 4 to 6 and also in fig. 3, a projecting portion 15 projecting downward (in the Z2 direction: upward in fig. 4 to 6) is integrally formed on the lower surface 10a of the moving member 10. The projection 15 has a prismatic shape. As shown in fig. 6, the protrusion 15 has a base portion 15a at its boundary with the lower surface 10a of the moving member 10, and a front portion 15b on the Z2 side. That is, the protruding portion 15 protrudes from one end portion of the moving member 10 in the optical axis direction along the optical axis direction.
As shown in fig. 5 and 6, the covered conductive wire 41 wound to form the coil C is drawn out to the lower surface 10a of the moving member 10. The insulated coating of the coated wire 41 is removed at one end portion 41 a. That is, the portion where the insulation coating of the end portion of the covered conductor wire 41 is removed to expose the conductor wire (copper wire) is the terminal portion 41 a. Fig. 5 and 6 show a boundary portion P of the covered wire 41. Between the boundary portion P and the line end 41b is a terminal portion 41a with the insulation coating removed.
As shown in fig. 5 and 6, the distal end portion 41a of the covered wire 41 is spirally wound around the protrusion portion 15 to become a wire wound portion 42. As shown in fig. 6, around the protruding portion 15, a stepped portion 15c is formed between the base portion 15a and the front portion 15 b. The distal end portion 41a of the covered wire 41 extending from the coil C is sequentially wound toward the front portion 15b with respect to the protruding portion 15, with a position abutting the step portion 15C as a winding start point, to form a wire wound portion 42. As shown in the cross-sectional view of fig. 6, the number of turns of the terminal portion 41a in the wire winding portion 42 is 2 to 3 turns.
As shown in fig. 5 and 6, the surface of the lower leaf spring 20 facing the base portion 15a of the protrusion 15, i.e., the surface facing the Z1 side facing the lower surface 10a of the moving member 10 is an inner surface 20a, and the surface facing the Z2 side of the front portion 15b of the protrusion 15 on the side opposite to the inner surface 20a is an outer surface 20 b.
As shown in fig. 5 and 6, in the lower leaf spring 20, a brazed portion 25 is provided at an end portion on the Y2 side in the central portion of the movable-side support piece 22 extending in the Y direction. The movable-side support piece 22 has a dividing recess 26, and a region sandwiched between the joining edge 27 of the lower leaf spring 20 and the dividing recess 26 is a brazed portion 25. The dividing recess 26 is formed to prevent the molten solder adhering to the soldering portion 25 from flowing out in the Y1 direction through the movable-side support piece 22. The dividing recess 26 also has a function of preventing heat from being transmitted in the Y1 direction via the movable-side support sheet 22 when the brazing material is melted by heating the brazed part 25 with a laser or the like.
The engagement edge portion 27 is an edge portion of the movable-side support piece 22 disposed adjacent to the wire winding portion 42 in a state where the lower leaf spring 20 is fixed to the moving member 10.
As shown in fig. 5, a communication portion 28 that communicates the inner surface 20a and the outer surface 20b of the lower leaf spring 20 is formed in the brazing portion 25. The communication portion 28 is a circular hole penetrating the lower leaf spring 20.
The joint edge portion 27 formed in the movable-side support piece 22 linearly extends in the X1-X2 direction. When the movable-side support piece 22 of the lower leaf spring 20 is fixed to the lower surface 10a of the movable member 10, as shown in fig. 6, the engagement edge portion 27 and the distal end portion 41a constituting the wire winding portion 42 face each other with a narrow gap in the Y1-Y2 direction. Alternatively, in a state where the movable-side support piece 22 is fixed to the lower surface 10a of the movable member 10, the joining edge portion 27 may be opposed to the distal end portion 41a constituting the wire winding portion 42 in a state of being in contact with the distal end portion 41 a. That is, the joining edge portion 27 disposed adjacent to the wire winding portion 42 faces the wire winding portion 42 with a slight gap from the wire winding portion 42 or with a contact with the wire winding portion 42. The joining edge portion 27 is a portion constituting a part of the outer shape of the movable-side support piece 22.
As an assembling method (manufacturing method) of the lens driving device 1, after the covered wire 41 is wound around the outer periphery of the moving member 10 to form the coil C, the covered wire 41 is drawn out to the lower surface 10a of the moving member 10, and the distal end portion 41a is wound around the protrusion 15 to form the wire winding portion 42. Thereafter, the movable-side support piece 22 of the lower leaf spring 20 is fixed to the spring fixing portion 12 of the lower surface 10a of the movable member 10. At this time, the joining edge portion 27 of the lower leaf spring 20 faces the distal end portion 41a of the wire winding portion 42 with a slight gap therebetween or in contact therewith. The term "opposed" as used herein includes a mode in which two members (portions), that is, the opposed edge portion 27 and the wire winding portion 42 (distal end portion 41a) are opposed to each other in a state of contact.
The brazing material before melting is provided on the outer surface 20b of the lower leaf spring 20 on the Z2 side in the brazing portion 25 formed in the movable-side support piece 22. The brazing material before melting is Paste (Paste holder), and the Paste is applied to the brazed portion 25 in a step after the movable-side support piece 22 of the lower plate spring 20 is fixed to the lower surface 10a of the movable member 10. In this case, it is preferable to apply the solder paste so that a part of the solder paste is also in contact with the wire winding portion 42. The application of the solder paste to the soldered portion 25 may be performed in a step before the movable-side support piece 22 is fixed to the lower surface 10a of the movable member 10. Alternatively, instead of using the solder paste, a mass of the solder before melting in a spherical shape or the like may be provided on the communicating portion 28 (on the Z2 side).
Next, the brazing portion 25 is irradiated with laser light from the outer surface 20b side of the lower leaf spring 20, that is, the Z2 side, and the energy of the laser light causes the metal leaf spring constituting the brazing portion 25 to generate heat, thereby melting the brazing material. In this case, it is preferable that the laser is irradiated only to the brazing portion 25 of the movable-side support sheet 22 without directly irradiating the solder paste with the laser. Since the melted brazing material spreads in the brazing portion 25 while remaining adhered to the outer surface 20b of the lower plate spring 20 on the Z2 side, the melted brazing material can be sufficiently adhered to the distal end portion 41a where the lead wire winding portion 42 is formed even when the brazing paste does not contact the lead wire winding portion 42. At the same time, the melted brazing material passes through the hole serving as the communicating portion 28 in the Z1 direction, adheres to the inner surface 20a of the brazed portion 25 on the Z1 side, and adheres to the distal end portion 41a constituting the wire winding portion 42.
As shown in fig. 6, in a state before the brazing filler metal is provided, a part of the distal end portion 41a of the covered wire 41 from which the covering is removed is opposed to the communication portion 28. Therefore, the solder reaching the inner surface 20a of the lower leaf spring 20 is embedded in the portion of the distal end portion 41 a.
The solder (fillet) 45 after cooling and solidification is shown in fig. 4 and 6. Solder (fillet) 45 is provided to the inner surface 20a and the outer surface 20b of the lower plate spring 20 via the communication portion 28. Both the inner surface 20a and the outer surface 20b are joined to the wire winding portion 42 (the distal end portion 41a) by the brazing material 45.
Fig. 6 shows a center plane Ho bisecting the movable-side support piece 22 of the lower leaf spring 20 in the plate thickness direction. As shown in fig. 6, the laser irradiation to the brazed part 25 was performed in a state where the Z1 direction was oriented in the gravity direction. Therefore, the melted brazing filler metal bypasses the inner surface 20a more, and the amount of the solidified brazing filler metal 45 existing on the Z1 side of the center plane Ho is larger than the amount of the solidified brazing filler metal existing on the Z2 side of the center plane Ho. That is, the amount of the brazing material 45 attached to the inner surface 20a of the lower plate spring 20 is larger than the amount of the brazing material 45 attached to the outer surface 20 b.
Therefore, the height W1 of the wire-wound portion 42 around the protrusion 15 in the Z1 direction from the center plane Ho is preferably larger than the height W2 of the wire-wound portion in the Z2 direction from the center plane Ho. That is, the wire winding portion 42 preferably has a larger height dimension from the inner surface 20a of the lower leaf spring 20 at the base portion 15a side of the protruding portion 15 than at the front portion 15b side of the protruding portion 15 from the outer surface 20 b.
In the solder joint 40, the amount of the solder 45 is large on the Z1 side of the center plane Ho, and the tip end portion 41a forming the wire wound portion 42 is present more on the Z1 side of the center plane Ho, so that the inner surface 20a of the lower plate spring 20 and the wire wound portion 42 can be reliably connected by the solder 45.
As shown in fig. 6, a part of the distal end portion 41a of the covered wire 41 extending from the coil C passes directly below the communication portion 28 formed in the soldering portion 25 (on the Z1 side and on the lower surface 10a side of the moving member 10). As a result, the molten filler metal that has passed through the communicating portion 28 and moved to the Z1 side comes into contact with the tip end portion 41a directly below the communicating portion 28a, and as shown in fig. 6, a contact portion 46 is formed between the tip end portion 41a and the solidified filler metal 45. By providing the contact portion 46, the contact portion between the brazing material 45 and the distal end portion 41a can be increased, and the conductivity between the lower plate spring 20 and the covered wire 41 can be improved.
As described above, since the brazing material 45 is present in a large amount on the inner surface 20a side of the lower plate spring 20 and the contact area between the brazing material 45 and the lead wire wound portion 42 is increased, the contact state between the brazing material 45 and the tip end portion 41a can be made favorable even if the height W2 of the lead wire wound portion 42 on the Z2 side of the center plane Ho is reduced. Therefore, the projection dimension h of the projection 15 from the outer surface 20b of the lower leaf spring 20 can be reduced, the dimensions Z1 to Z2 of the moving member 10 can be reduced, and the overall thickness of the lens drive device 1 can be reduced.
Further, as shown in fig. 6, since the brazing material 45 is in contact with both the inner surface 20a and the outer surface 20b of the lower plate spring 20 and also in contact with the lead wire wound portion 42, both the inner and outer surfaces of the brazed portion 25 and the lead wire wound portion 42 can be firmly fixed by the brazing material 45, and the reliability of conduction between the lower plate spring 20 and the tip end portion 41a can be improved. In order to ensure a large contact area between both the inner surface 20a and the outer surface 20b of the lower leaf spring 20 and the brazing material 45 in the brazed portion 25, the opening area of the communication portion 28 is preferably 50% or less of the opening area of the brazed portion 25.
In the brazing filler metal joint 40, since both the inner and outer surfaces of the brazing portion 25 and the wire winding portion 42 are fixed by the brazing filler metal 45, the number of turns forming the distal end portion 41a of the wire winding portion 42 can be reduced. This also reduces the height of the projection 15.
As shown in fig. 5, in the brazed portion 25, a connecting portion 25a, which is a part of the lower leaf spring 20, remains between the joining edge portion 27 and the edge portion of the communicating portion 28. As shown in fig. 6, in order to reliably adhere the brazing material 45 to the inner surface 20a, the outer surface 20b, and the lead wire winding portion 42, the minimum dimension Wa of the connecting portion 25a is preferably 3 times or less the plate thickness of the plate spring material constituting the lower plate spring 20. However, considering workability in the pressing step and the etching step of the lower leaf spring 20, the minimum dimension Wa is more preferably set to be 1 to 2 times the thickness of the lower leaf spring 20.
Next, another embodiment of the present invention will be explained.
Hereinafter, the same portions as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
Fig. 7 shows a solder joint 40A according to a second embodiment of the present invention. In the solder joint portion 40A, a communication portion 28a is formed as a concave portion in which the center of the circular hole, which is the communication portion 28 shown in fig. 5, is formed closer to the joint edge portion 27 and a part of the concave portion is opened in the joint edge portion 27.
In the solder joint portion 40A, the width L1 of the opening of the communication portion 28a, which is a recessed portion, is preferably 50% or less, more preferably 30% or less, with respect to the entire length L0 of the joint edge portion 27, and setting in this range can ensure a long joint edge portion 27 facing the wire wound portion 42, and can maintain a high joint strength between the solder portion 25 and the wire wound portion 42.
In a solder joint portion 40B of the third embodiment shown in fig. 8, a plurality of (two) holes are formed in the brazing portion 25 to form a communicating portion 28B. In a solder joint portion 40C of the fourth embodiment shown in fig. 9, a concave portion opening to the X1 side is formed as a communicating portion 28C in the brazing portion 25.
In fig. 8 and 9, the communication portion 28b and the communication portion 28c preferably have an area of 50% or less of the area of the brazed portion 25.
In the solder joint 40D of the fifth embodiment shown in fig. 10, the plurality of recesses each opening at the joint edge portion 27 are formed in the brazing portion 25 to form the communication portion 28D, and in this case, the total L2 × N (N is 3 in fig. 10) of the opening sizes L2 of the communication portions 28D in the joint edge portion 27 is also preferably 50% or less, more preferably 30% or less, of the entire length L0 of the joint edge portion 27.
In the above embodiments, the lens driving device that performs autofocus by driving the moving member 10 serving as the lens holding member only in the optical axis direction has been described, but the present invention is not limited to this. For example, the present invention may be applied to a lens driving device capable of driving a movable unit for performing auto-focusing in a direction intersecting with an optical axis direction to perform so-called camera shake correction. In this case, the upper plate spring is generally divided into two parts, and each upper plate spring is joined to the lead wire winding portion by a brazing material.
Claims (11)
1. A lens driving device includes a moving member on which a lens body can be mounted, a plate spring provided between the moving member and a support member and supporting the moving member to be movable in an optical axis direction of the lens body, a coil provided on the moving member, and a magnet opposed to the coil,
a protrusion portion is provided in the moving member, a wire constituting the coil is wound around the protrusion portion to form a wire wound portion,
the plate spring has an inner surface facing a base side of the protruding portion and an outer surface facing a front side of the protruding portion, and has an engagement edge portion adjacent to the wire winding portion,
the lens driving device is characterized in that,
at least the inner surface of the plate spring and the wire wound portion are joined by a brazing material in a state where the joining edge portion faces the wire wound portion.
2. The lens driving device according to claim 1,
the plate spring is provided with a communication portion that communicates the inner surface and the outer surface, the brazing material is provided to the inner surface and the outer surface via the communication portion, and at least the inner surface and the lead wire winding portion are joined by the brazing material.
3. The lens driving device according to claim 2,
the wire winding portion has a height dimension of a portion located on a base side of the protruding portion from the inner surface of the plate spring that is larger than a height dimension of a portion located on a front side of the protruding portion from the outer surface.
4. The lens driving device according to claim 3,
both the inner surface and the outer surface of the plate spring are joined to the wire wound portion with a brazing material,
the amount of the brazing filler metal attached to the inner surface of the plate spring is larger than the amount of the brazing filler metal attached to the outer surface.
5. The lens driving device according to any one of claims 2 to 4,
the communication portion is a hole penetrating the plate spring.
6. The lens driving device according to claim 5,
a connecting portion is formed between the joining edge portion of the plate spring and the hole, and the brazing material is provided on both the inner surface and the outer surface of the hole and the connecting portion.
7. The lens driving device according to any one of claims 2 to 4,
the communication portion is a recess portion having a part opened at the joint edge portion.
8. A camera module, comprising:
the lens driving device according to any one of claims 1 to 7;
a lens body held by the moving member of the lens driving device; and
and an imaging element facing the lens body.
9. A method for manufacturing a lens driving device having a moving member capable of mounting a lens body, a leaf spring provided between the moving member and a support member and supporting the moving member to be movable in an optical axis direction of the lens body, a coil provided on the moving member, and a magnet opposed to the coil,
a wire winding portion formed by winding a wire constituting the coil around a protrusion provided on the moving member,
an engaging edge portion of the plate spring is opposed to the wire winding portion, the plate spring having an inner surface facing a base portion side of the protruding portion, an outer surface facing a front portion side of the protruding portion, a communicating portion communicating the inner surface and the outer surface, and the engaging edge portion,
the manufacturing method of the lens driving device is characterized in that,
the brazing material is melted on the outer surface of the plate spring, the brazing material is made to reach the inner surface from the outer surface through the communication portion, and at least the inner surface and the lead wire winding portion are joined by the brazing material.
10. The lens driving device manufacturing method according to claim 9,
the communication portion is a hole penetrating the plate spring.
11. The lens driving device manufacturing method according to claim 9,
the communication portion is a recess portion having a part thereof opened at the joining edge portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016209133A JP6738577B2 (en) | 2016-10-26 | 2016-10-26 | Lens driving device, camera module using the lens driving device, and method for manufacturing lens driving device |
| JP2016-209133 | 2016-10-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107991752A CN107991752A (en) | 2018-05-04 |
| CN107991752B true CN107991752B (en) | 2020-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710998858.5A Active CN107991752B (en) | 2016-10-26 | 2017-10-23 | Lens driving device, camera module, and method for manufacturing lens driving device |
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| Country | Link |
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| JP (1) | JP6738577B2 (en) |
| CN (1) | CN107991752B (en) |
Families Citing this family (4)
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|---|---|---|---|---|
| CN112567278B (en) * | 2018-08-09 | 2023-04-14 | 阿尔卑斯阿尔派株式会社 | Lens driving device, camera module, and method for manufacturing lens driving device |
| TWI706210B (en) * | 2018-09-17 | 2020-10-01 | 大陽科技股份有限公司 | Camera module and electronic device |
| US20230408735A1 (en) * | 2020-11-02 | 2023-12-21 | Micro Actuator Co., Ltd. | Lens assembly |
| JP2024518866A (en) * | 2022-04-01 | 2024-05-08 | 蘇州▲いん▼冢電子科技股▲ふん▼有限公司 | Base and motor with integrated coils |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101566969B1 (en) * | 2009-02-17 | 2015-11-09 | 엘지이노텍 주식회사 | Motor for driving lens |
| JP5350895B2 (en) * | 2009-06-09 | 2013-11-27 | 日本電産サンキョー株式会社 | Lens drive device |
| KR20110076063A (en) * | 2009-12-29 | 2011-07-06 | 엘지이노텍 주식회사 | Voice coil motor |
| CN102411187B (en) * | 2010-09-17 | 2014-07-09 | 阿尔卑斯电气株式会社 | Lens Driving Device |
| JP2012242647A (en) * | 2011-05-20 | 2012-12-10 | Alps Electric Co Ltd | Lens drive device and manufacturing method for the same |
| JP6192044B2 (en) * | 2013-11-20 | 2017-09-06 | アルプス電気株式会社 | Lens drive device |
| JP2017102375A (en) * | 2015-12-04 | 2017-06-08 | アルプス電気株式会社 | Lens drive device |
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| JP2018072449A (en) | 2018-05-10 |
| CN107991752A (en) | 2018-05-04 |
| JP6738577B2 (en) | 2020-08-12 |
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