JP2018072449A - Lens drive device, camera module using lens drive device, and manufacturing method of lens drive device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lens drive device ensuring a connection between a coil provided in a leaf spring for supporting a movable member and a coil provided in the movable member, and also a lens drive device capable of making the movable member to be thin, a camera module using the lens drive device, and a manufacturing method of the lens drive device.SOLUTION: A movable member 10 for holding a lens body is provided with a projection part 15. A terminal part 41a of a covered conductive wire 41 that forms a coil is wound by a projection part 15 to form a conductive wire wrap part 42. A soldering part 25 formed on a movable side support piece 22 of a lower leaf spring 20 has a bonded edge part 27 facing the conductive wire wrap part 42. The soldering part 25 is formed with a communication part 28. Thus, the solder can be adhered on an inner surface 20a and an external surface 20b of the lower leaf spring 20 and the conductive wire wrap part 42.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a lens driving device in which a coil provided on a moving member on which a lens body is mounted and a leaf spring supporting the moving member are soldered, a camera module using the lens driving device, and a lens driving device. It relates to the manufacturing method.

Patent Document 1 describes an invention related to a lens driving device.
This lens driving device has a lens holding member (moving member) on which a lens body can be mounted, and a support member. The lens holding member is supported by the support member via the lower leaf spring and the upper leaf spring. A coil is provided on the lens holding member, and a magnet is fixed to the support member side. A connection terminal portion is formed on a metal member embedded in the support member, and a drive current is applied from the connection terminal portion to the coil via the lower leaf spring, so that the lens holding member is in the optical axis direction of the lens body. Moved to. By this operation, the image is focused on the image sensor.

  In this lens driving device, it is necessary to connect the lower leaf spring and the end of the coil. As a structure for this purpose, the lens holding member is provided with a protruding portion that protrudes downward, and the end of the coil is wound around the protruding portion. A soldering portion is formed on the lower leaf spring, the soldering portion of the lower leaf spring faces the protruding portion, and the soldering portion and the end of the coil are soldered.

Japanese Patent Laying-Open No. 2015-99322

  In the lens driving device described in Patent Document 1, the leaf spring has an inner surface facing the base side of the protrusion and an outer surface facing the tip side of the protrusion, and the outer surface of the leaf spring in the soldering portion. Solder is supplied and soldered.

  Therefore, in order to securely solder the end of the coil wound around the protruding portion and the leaf spring and make it conductive, the end of the coil exists up to a high position away from the outer surface of the leaf spring. It is necessary to wind many ends of the coil around the protrusions. As a result, the height dimension at which the protrusion protrudes from the outer surface of the leaf spring becomes large, which hinders the thickness of the lens driving member from being thinned in the optical axis direction.

  Furthermore, if the solder is mainly provided only on the outer surface of the leaf spring, the amount of solder that contributes to the joining between the end portion of the coil and the leaf spring cannot be increased. It is difficult to ensure sufficient bonding strength.

  The present invention solves the above-described conventional problems, and reliably secures the coil and the leaf spring without increasing the projection of the protrusion provided on the moving member from the outer surface of the leaf spring more than necessary. It is an object of the present invention to provide a lens driving device that can be joined, a camera module using the lens driving device, and a method of manufacturing the lens driving device.

The present invention includes a moving member capable of mounting a lens body, a leaf spring provided between the moving member and the support member and supporting the moving member in a direction of the optical axis of the lens body, and the movement In a lens driving device having a coil provided on a member and a magnet facing the coil,
A projecting portion is provided on the moving member, and a conducting wire constituting the coil is wound around the projecting portion to form a conducting wire winding portion,
The leaf spring has an inner surface facing the base side of the projection and an outer surface facing the tip side of the projection, and has a joining edge adjacent to the conductor winding portion,
The inner surface of the leaf spring and the conductive wire winding portion are joined with solder in a state where the joining edge portion faces the conductive wire winding portion.

  In the lens driving device of the present invention, the leaf spring is formed with a communicating portion that communicates the inner surface and the outer surface, and the solder is provided on the inner surface and the outer surface via the communicating portion. At least the inner surface and the conductive wire winding portion can be configured as being joined by the solder.

  In the lens driving device of the present invention, the conductive wire winding portion has a height dimension of a portion located on the base side of the projection from the inner surface of the leaf spring, from the outer surface to the tip side of the projection. It is possible to make it larger than the height dimension of the located part.

  In the lens driving device of the present invention, both the inner surface and the outer surface of the leaf spring and the conductor winding portion are joined by solder, and the amount of the solder adhering to the inner surface of the leaf spring is reduced. The amount of the solder adhering to the outer surface may be larger.

In the lens driving device of the present invention, the communication portion is a hole that penetrates the leaf spring.
In this case, a connecting portion is formed between the joint edge portion of the leaf spring and the hole, and the solder is provided over the hole and the inner surface and the outer surface of the connecting portion. be able to.

  In the lens driving device according to the present invention, the communication portion may be a concave portion that is partially opened at the joint edge portion.

  Next, a camera module according to the present invention includes any one of the lens driving devices, a lens body held by the moving member of the lens driving device, and an imaging element facing the lens body. It is what.

Furthermore, the present invention provides a moving member capable of mounting a lens body, a leaf spring provided between the moving member and the support member and movably supporting the moving member in the optical axis direction of the lens body, In a manufacturing method of a lens driving device having a coil provided on the moving member and a magnet facing the coil,
The conductor wire constituting the coil is wound around a protrusion provided on the moving member to form a conductor winding portion,
The joint edge of the leaf spring having an inner surface facing the base side of the protrusion, an outer surface facing the tip side of the protrusion, a communication portion communicating the inner surface and the outer surface, and a joint edge portion. Opposing to the wire winding part,
Solder is melted at the outer surface of the leaf spring, the solder is led from the outer surface to the inner surface through the communicating portion, and the inner surface and the conductive wire winding portion are joined by the solder. Is.

In the method of manufacturing a lens driving device according to the present invention, the communicating portion is a hole that penetrates the leaf spring.
Or the said communication part is a recessed part which the part opens to the said joining edge part.

  In the present invention, since the inner surface facing the base side of the protrusion of the leaf spring and the conductor winding portion formed on the protrusion are soldered, the protrusion dimension of the protrusion relative to the outer surface of the leaf spring is shortened. become able to. As a result, the moving member can be thinned, and the entire lens driving device can be thinned.

  In addition, by forming the communicating portion in the leaf spring, the wire winding portion and the leaf spring can be joined by the solder provided on both the inner surface and the outer surface of the leaf spring. This increases the bonding strength and also improves the conductivity. As a result, it is possible to reduce the number of turns of the conductive wire at the conductive wire winding portion of the protrusion, thereby reducing the height of the protrusion and contributing to the thinning of the moving member.

  In the manufacturing method of the lens driving device of the present invention, by forming the communicating portion in the leaf spring, when solder is supplied from the outer surface of the leaf spring, the melted solder passes through the communicating portion and the inner surface of the leaf spring. Thus, the inner surface of the leaf spring and the conductor winding portion can be reliably soldered.

The perspective view which shows the external appearance of the lens drive device of embodiment of this invention, 1 is an exploded perspective view of the lens driving device shown in FIG. The perspective view which shows the moving member which comprises the lens drive device shown in FIG. 2 upside down, 3 is a partially enlarged perspective view of FIG. 3 showing a first embodiment of a solder joint portion between a conductive wire winding portion and a leaf spring; FIG. 4 is an exploded perspective view of a solder joint portion between the conductive wire winding portion and the leaf spring shown in FIG. Sectional drawing which cut | disconnected the solder joint part of the conducting wire winding part shown in FIG. 4 and a leaf | plate spring with the VI-VI line, An exploded perspective view showing a second embodiment of the solder joint portion between the conductive wire winding portion and the leaf spring, An exploded perspective view showing a third embodiment of the solder joint portion between the conductive wire winding portion and the leaf spring, An exploded perspective view showing a fourth embodiment of a solder joint portion between the conductive wire winding portion and the leaf spring; An exploded perspective view showing a fifth embodiment of the solder joint portion between the conductive wire winding portion and the leaf spring,

1 and 2 show the overall structure of a lens driving device 1 according to an embodiment of the present invention.
The lens driving device 1 has a moving member 10. The moving member 10 is a lens holding member formed in a cylindrical shape. A lens body (lens barrel or lens barrel) is mounted in the central hole 11 of the moving member 10. The lens body includes a lens set obtained by combining one lens or a plurality of lenses, and a lens holder that holds the lens or the lens set. A female screw part 11a is formed in the center hole 11, a male screw part is formed on the outer peripheral surface of the range holder, and the male screw part is screwed to the female screw part 11a so that the lens body is mounted on the moving member 10 and mounted. Is done. The lens body may be fixed to the moving member 10 with an adhesive.

  The Z1-Z2 direction in FIGS. 1 and 2 is the vertical direction, which is a direction (optical axis direction) parallel to the optical axis O of the lens body. The lens driving device 1 is mounted on a portable electronic device such as a mobile phone. An imaging element such as a CCD is disposed on the Z2 side of the lens driving device 1. The lens driving device 1, the lens body, and the image sensor form a camera module. In the camera module, when the moving member 10 and the lens body mounted on the moving member 10 move in the Z1-Z2 direction, automatic focusing of an image formed on the image sensor is performed.

  As shown in FIGS. 1 and 2, the lens driving device 1 is provided with a support base 2 and a cover 3. By combining the support base 2 and the cover 3, a case (housing) having a storage space inside is formed. The support base 2 is formed of a synthetic resin material that is a nonmagnetic material. The cover 3 is formed of a magnetic stainless steel plate or the like and functions as a magnetic yoke. A light transmitting hole 2 b is opened in the support base 2, and a light transmitting hole 3 b is also opened in the ceiling portion 3 a of the cover 3. The support base 2 and the cover 3 have a quadrangular planar shape. In this embodiment, the support base 2 and the cover 3 constitute a support member (fixing member).

  As shown in FIG. 2, spring fixing portions 2 a are formed on four corners of the support base (support member) 2. A pair of lower leaf springs 20 separated from each other are mounted on the support base 2. Each of the lower leaf springs 20 includes a fixed-side support piece 21, a movable-side support piece 22 inside thereof, and an elastic arm portion 23 that connects the fixed-side support piece 21 and the movable-side support piece 22 with a leaf spring metal material. It is integrally formed.

  Mounting holes 21a are formed at two locations on the fixed side support piece 21 of each lower leaf spring 20 on the Y1 side and Y2 side, and the respective mounting holes 21a are formed in the spring fixing portion 2a of the support base 2. The protrusion is fixed by being fitted into the formed protrusion and heat-caulked. Mounting holes 22a are formed at three locations on the movable side support piece 22 of each lower leaf spring 20.

  FIG. 3 shows the moving member 10 in a posture with the lower surface 10a facing upward. FIG. 3 shows a posture in which the moving member 10 shown in FIG. 2 is rotated 180 degrees about the X1-X2 axis. FIG. 3 shows a state in which the lower leaf spring 20 and a coil C described later are attached to the moving member 10. The lower surface 10a of the moving member 10 is provided with protrusions that serve as spring fixing portions 12 in a total of six locations. Each attachment hole 22a formed in the movable side support piece 22 of the lower leaf spring 20 is fitted into the protrusion of the spring fixing portion 12 provided on the lower surface 10a of the moving member 10, and fixed by heat caulking the protrusion. Has been.

  As shown in FIG. 2, the lens driving device 1 is provided with four magnets M. Each magnet M is located in the vicinity of four corners inside the cover 3 that functions as a yoke, and is fixed to the inner surface of the cover 3 with an adhesive or the like.

  As shown in FIG. 2, an upper leaf spring 30 is provided above the moving member 10 (Z1 direction). The upper leaf spring 30 includes a rectangular frame-shaped fixed side support piece 31, a movable side support piece 32 inside thereof, and an elastic arm portion 33 that connects the fixed side support piece 31 and the movable side support piece 32. It is integrally formed of a spring metal material. The four corners of the fixed-side support piece 31 serve as attachment portions 31a, and each attachment portion 31a is fixed to the upper surface of the magnet M on the Z1 side with an adhesive or the like. Each attachment portion 31 a is sandwiched between the inner surface of the ceiling portion 3 a of the cover 3 and the upper surface of the magnet M. As shown in FIG. 2, on the upper surface 10b facing the Z1 side of the moving member 10, spring fixing portions 13 are provided on the X1 side and the X2 side. The movable side support piece 32 of the upper leaf spring 30 is fixed to the spring fixing portion 13 by a caulking structure or an adhesive structure.

  The moving member 10 is sandwiched between a lower leaf spring 20 positioned below the magnet M and fixed to the spring fixing portion 2a of the support base 2, and an upper leaf spring 30 fixed on the magnet M. It is housed in an operation space surrounded by four magnets M. The elastic arm portion 23 provided on the lower leaf spring 20 is formed in a thin curved shape, that is, a meandering shape, and the elastic arm portion 33 provided on the upper leaf spring 30 is also formed in a thin curved shape, that is, a meandering shape. Yes. The moving member 10 is supported movably in the Z1-Z2 direction, which is the optical axis direction, by elastic deformation of the upper and lower elastic arm portions 23, 33.

  A coil C around which the coated conducting wire 41 is wound is provided on the outer periphery of the moving member 10. The magnets M fixed to the inner surface of the cover 3 serving as a part of the support member are spaced apart from the coil C and opposed from the outside at four locations spaced in the circumferential direction of the moving member 10.

  As shown in FIG. 2, a metal plate divided into three is embedded in the support base 2, and a part of each of the two metal plates serves as a connection terminal 4b to the side of the support base 2. Projecting downward (the connection terminal 4b appears in FIG. 2). Exposed portions 4a where a part of the two metal plates are exposed are formed at two locations provided on the Y1 side of the four spring fixing portions 2a of the support base 2. Each of the two lower leaf springs 20 is individually in close contact with the exposed portion 4a and joined by welding or the like, and the two connection terminals 4b are electrically connected to the two lower leaf springs 20 on a one-to-one basis. Yes.

  Further, of the three divided metal plates, the other metal plate in which the exposed portion 4a is not formed is formed in a U shape in plan view, as shown in FIG. 1 and FIG. In addition, a part of the support base 2 protrudes outward as a grounding terminal 4 c at the corner of the support base 2. The grounding terminal 4c is joined to the cover 3, and the cover 3 is set to the ground potential.

  As shown in FIG. 3, solder joints 40 are provided at two locations on the lower surface 10 a facing the Z <b> 2 side of the moving member 10. In each solder joint portion 40, one lower leaf spring 20 divided into two and one terminal portion of the covered conductor 41 forming the coil C are soldered and joined, and the other lower plate The spring 20 and the other end portion of the covered conductor 41 are soldered and joined. The one end portion and the other end portion of the coated conductor 41 are soldered with the insulating coating removed.

  As a result, the connection terminal 4 b that is divided and embedded in the support base 2 is connected to one terminal portion and the other terminal portion of the covered conductor 41 through the respective lower leaf springs 20. Conducted. As a result, the coil C can be energized from the two connection terminals 4b. When a drive current is applied to the coil C through this energization path, the moving member 10 is driven in the Z1-Z2 direction by an electromagnetic force generated by a current flowing through the coil C and a magnetic field generated from the magnet M. By the operation of the moving member 10, the focus of the image formed on the imaging element by the lens body is adjusted. Each of the four magnets M is magnetized so that the opposed inner surface facing the coil C and the outer surface directed to the inner surface of the cover 3 are different magnetic poles.

  FIG. 4 is a partially enlarged perspective view in which a part of FIG. 3 is enlarged. As the solder joint portion of the first embodiment, the solder joint portion 40 on the X1 side shown in FIG. 3 is shown enlarged. . In the solder joint portion 40, the lower leaf spring 20 on the X1 side and one end portion 41a of the coated conductor 41 extending from the coil C are soldered. 5 is an exploded perspective view of the solder joint portion 40 shown in FIG. 4, and FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 4 and 6 show the solder 45, the solder 45 is not shown in FIG. Note that the solder joint 40 that solders the other lower leaf spring 20 located on the X2 side and the other end 41a of the covered conductor 41 to the Y1-Y2 axis as shown in FIGS. Although they are line symmetric with respect to each other, the structure thereof is the same, and thus description thereof is omitted.

  As shown in FIGS. 4 to 6, and as shown in FIG. 3, the lower surface 10a of the moving member 10 protrudes downward (in the Z2 direction: upward in FIG. 4 to 6). 15 is integrally formed. The protrusion 15 has a prismatic shape. As shown in FIG. 6, the protrusion 15 has a base portion 15a at the boundary with the lower surface 10a of the moving member 10 and a tip portion 15b on the Z2 side. That is, the protrusion 15 protrudes from the one end part in the optical axis direction of the moving member 10 along the optical axis direction.

  As shown in FIGS. 5 and 6, the covered conducting wire 41 that forms the coil C is drawn to the lower surface 10 a of the moving member 10. The insulated conductor 41 has an insulating coating removed at one end 41a. That is, a portion of the end portion of the covered conductor 41 where the insulating coating is removed and the conductor (copper wire) is exposed is the terminal portion 41a. 5 and 6, the boundary portion P of the covered conductor 41 is shown. Between the boundary part P and the line end 41b is the terminal part 41a from which the insulation coating is removed.

  As shown in FIGS. 5 and 6, the terminal portion 41 a of the covered conductive wire 41 is spirally wound around the protrusion 15 to form a conductive wire winding portion 42. As shown in FIG. 6, a step 15 c is formed around the protrusion 15 between the base 15 a and the tip 15 b. The terminal portion 41a of the coated conducting wire 41 extending from the coil C is wound around the protrusion 15 in order toward the tip portion 15b with the position where it contacts the stepped portion 15c as a winding start point, and the conducting wire winding portion 42 is formed. Yes. As shown in the cross-sectional view of FIG. 6, the number of turns of the terminal portion 41 a in the conductive wire winding portion 42 is 2 to 3 turns.

  As shown in FIGS. 5 and 6, in the lower leaf spring 20, the surface facing the base portion 15a of the projection 15, that is, the surface facing the Z1 side facing the lower surface 10a of the moving member 10 is the inner surface 20a, and the inner surface 20a On the opposite side, the surface facing the Z2 side facing the tip 15b of the protrusion 15 is the outer surface 20b.

  As shown in FIGS. 5 and 6, the lower leaf spring 20 is provided with a soldering portion 25 at the end portion on the Y2 side of the central portion extending in the Y direction of the movable support piece 22. The movable support piece 22 is formed with a divided recess 26, and a region sandwiched between the joining edge portion 27 of the lower leaf spring 20 and the divided recess 26 is a soldering portion 25. The division recessed portion 26 is formed to prevent the molten solder attached to the soldering portion 25 from flowing along the movable support piece 22 and flowing out in the Y1 direction. Further, when the soldering part 25 is heated by a laser or the like to melt the solder, it also has a function of preventing the heat from propagating in the Y1 direction through the movable support piece 22.

  The joining edge portion 27 is an edge portion of the movable side support piece 22 located adjacent to the conductor winding portion 42 in a state where the lower leaf spring 20 is fixed to the moving member 10.

  As shown in FIG. 5, the soldering portion 25 is formed with a communication portion 28 that allows the inner surface 20 a and the outer surface 20 b of the lower leaf spring 20 to communicate with each other. The communication portion 28 is a circular hole that penetrates the lower leaf spring 20.

  The joint edge portion 27 formed on the movable side support piece 22 extends linearly in the X1-X2 direction. When the movable side support piece 22 of the lower leaf spring 20 is fixed to the lower surface 10 a of the moving member 10, as shown in FIG. 6, the joining edge portion 27 and the terminal portion 41 a constituting the conductive wire winding portion 42 and Is opposed to the Y1-Y2 direction through a narrow gap δ. Alternatively, the movable-side support piece 22 may be opposed to the lower surface 10a of the moving member 10 in a state where the joint edge portion 27 is in contact with the terminal portion 41a constituting the conductive wire winding portion 42. That is, the joining edge portion 27 arranged adjacent to the conductor winding portion 42 faces the conductor winding portion 42 in a state having a slight gap with the conductor winding portion 42 or in contact with the conductor winding portion 42. ing. The joint edge 27 is a part constituting a part of the outer shape of the movable support piece 22.

  As an assembling method (manufacturing method) of the lens driving device 1, the coated conductor 41 is wound around the outer periphery of the moving member 10 to form the coil C, and then the coated conductor 41 is pulled out to the lower surface 10 a of the moving member 10 to end the terminal 41 a. Is wound around the protrusion 15 to form the conductor winding portion 42. Thereafter, the movable side support piece 22 of the lower leaf spring 20 is fixed to the spring fixing portion 12 of the lower surface 10 a of the moving member 10. At this time, the joining edge portion 27 of the lower leaf spring 20 faces the terminal portion 41a constituting the conducting wire winding portion 42 in a state where a slight gap is left or in contact therewith. The “opposing” mentioned here includes a form in which two members (parts), that is, the opposing edge portion 27 and the conductive wire winding portion 42 (terminal portion 41a) are in contact with each other.

  In the soldering portion 25 formed on the movable side support piece 22, the unmelted solder is placed on the outer surface 20b facing the Z2 side of the lower leaf spring 20. The solder before melting is cream solder (paste solder), and the cream solder is applied to the soldering portion 25 in a step after the movable side support piece 22 of the lower leaf spring 20 is fixed to the lower surface 10a of the moving member 10. Is done. At this time, it is preferable that a part of the cream solder is applied so as to be in contact with the conductive wire winding part 42. The application of cream solder to the soldering portion 25 may be performed in a step before the movable side support piece 22 is fixed to the lower surface 10a of the moving member 10. Alternatively, instead of using cream solder, a lump of solder before melting such as a ball shape may be placed on the communication portion 28 (Z2 side).

  Next, a laser is irradiated to the soldering portion 25 from the outer surface 20b side of the lower leaf spring 20, that is, the Z2 side, the metal leaf spring constituting the soldering portion 25 is heated by the energy of the laser, and the solder is melted. At this time, it is preferable to irradiate only the soldering part 25 of the movable support piece 22 without irradiating the laser directly on the cream solder. Since the melted solder spreads in the soldering portion 25 while adhering to the outer surface 20b on the Z2 side of the lower leaf spring 20, even when the cream solder is not in contact with the conductive winding portion 42, the conductive wire winding portion 42 is used. It can fully adhere to the terminal part 41a currently formed. At the same time, the molten solder passes through the hole serving as the communication portion 28 in the Z1 direction, and adheres to the terminal portion 41a constituting the wire winding portion 42 while adhering to the inner surface 20a on the Z1 side in the soldering portion 25. To do.

  As shown in FIG. 6, a part of the terminal portion 41 a of the coated conductor 41 from which the coating has been removed faces the communication portion 28 before the solder is installed. Therefore, this portion of the terminal portion 41 a is embedded in the solder that has reached the inner surface 20 a of the lower leaf spring 20.

  4 and 6 show the solder (solder fillet) 45 that has been cooled and hardened. The solder (solder fillet) 45 is provided on the inner surface 20 a and the outer surface 20 b of the lower leaf spring 20 via the communication portion 28. Then, both the inner surface 20 a and the outer surface 20 b and the conductive wire winding portion 42 (terminal portion 41 a) are joined by the solder 45.

  FIG. 6 shows a center plane Ho that bisects the movable support piece 22 of the lower leaf spring 20 in the thickness direction. As shown in FIG. 6, the laser irradiation to the soldering portion 25 is performed in a state where the Z1 direction is directed to the gravity direction. Therefore, a lot of melted solder wraps around to the inner surface 20a side, and the amount of the solder 45 after curing is present on the Z1 side from the central surface Ho is larger than the amount existing on the Z2 side from the central surface Ho. Become. That is, the amount of solder 45 adhering to the inner surface 20a of the lower leaf spring 20 is larger than the amount of solder 45 adhering to the outer surface 20b.

  Therefore, in the conductive wire winding portion 42 around the protrusion 15, it is preferable that the height dimension W1 in the Z1 direction from the center plane Ho is larger than the height dimension W2 in the Z2 direction from the center plane Ho. That is, the conductive wire winding portion 42 is located such that the height dimension of the portion located on the base 15a side of the projection 15 from the inner surface 20a of the lower leaf spring 20 is located on the tip 15b side of the projection 15 from the outer surface 20b. It is preferable that it is larger than the height dimension of the portion.

  In the solder joint portion 40, the amount of solder 45 is larger on the Z1 side than the center plane Ho, and more terminal portions 41a forming the conductive wire winding portion 42 are present on the Z1 side than the center plane Ho. The inner surface 20 a of the lower leaf spring 20 and the conductive wire winding portion 42 can be reliably connected by the solder 45.

  Further, as shown in FIG. 6, a part of the terminal portion 41 a of the covered conductive wire 41 extending from the coil C is directly below the communicating portion 28 formed on the soldering portion 25 (on the Z1 side and the moving member 10. The lower surface 10a side). As a result, the molten solder that has passed through the communication portion 28 and moved to the Z1 side comes into contact with the terminal portion 41a directly below the communication portion 28a, and as shown in FIG. 6, the terminal portion 41a and the cured solder 45 A contact portion 46 is formed therebetween. By providing the contact portion 46, the number of contact points between the solder 45 and the terminal portion 41 a increases, and the electrical conductivity between the lower leaf spring 20 and the covered conductor 41 can be increased.

  As described above, a large amount of solder 45 exists on the inner surface 20a side of the lower leaf spring 20, and the contact area between the solder 45 and the conductive wire winding portion 42 increases, so that Z2 is larger than the center plane Ho of the conductive wire winding portion 42. Even if the side height W2 is reduced, the contact state between the solder 45 and the terminal portion 41a can be improved. Therefore, the protrusion dimension h from the outer surface 20b of the lower leaf spring 20 of the protrusion 15 can be shortened, the dimension of Z1-Z2 of the moving member 10 can be decreased, and the entire lens driving device 1 can be made thin.

  Also, as shown in FIG. 6, since the solder 45 is in contact with both the inner surface 20a and the outer surface 20b of the lower leaf spring 20 and in contact with the conductor winding portion 42, both the inner and outer surfaces of the soldering portion 25 and the conductor The winding portion 42 can be firmly fixed with the solder 45, and the reliability of conduction between the lower leaf spring 20 and the terminal portion 41a can be improved. In order to ensure a wide contact area between the inner surface 20 a and the outer surface 20 b of the lower leaf spring 20 and the solder 45 in the soldering portion 25, the opening area of the communication portion 28 is set to be smaller than the opening of the soldering portion 25. It is preferably 50% or less of the area.

  In the solder joint portion 40, the inner and outer surfaces of the soldering portion 25 and the conductor winding portion 42 are fixed by the solder 45, so that the number of turns of the terminal portion 41 a that forms the conductor winding portion 42 can be reduced. This also makes it possible to reduce the height of the protrusion 15.

  As shown in FIG. 5, in the soldering portion 25, a connecting portion 25 a that is a part of the lower leaf spring 20 is left between the joint edge portion 27 and the edge portion of the communication portion 28. As shown in FIG. 6, in order to securely attach the solder 45 to the inner surface 20 a and the outer surface 20 b and the conductive wire winding portion 42, the minimum dimension Wa of the connecting portion 25 a is a leaf spring material plate constituting the lower leaf spring 20. The thickness is preferably 3 times or less of the thickness. However, in consideration of the workability of the lower leaf spring 20 in the pressing step and the etching step, it is more preferable to set the minimum dimension Wa to be not less than 1 and not more than twice the plate thickness of the lower leaf spring 20.

Next, another embodiment of the present invention will be described.
Hereinafter, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 7 shows a solder joint 40A according to the second embodiment of the present invention. In the solder joint portion 40A, the center of the circular hole, which is the communication portion 28 shown in FIG. 5, is formed closer to the joint edge portion 27, and a concave portion partially opened at the joint edge portion 27 is formed as the communication portion 28a. Has been.

  In the solder joint portion 40A, the width dimension L1 of the opening portion of the communication portion 28a that is a recess with respect to the entire length L0 of the joint edge portion 27 is preferably 50% or less, and more preferably 30% or less. When set in this range, it becomes possible to ensure a long joint edge 27 facing the conductor winding portion 42 and maintain a high joint strength between the soldered portion 25 and the conductor winding portion 42.

In the solder joint portion 40B of the third embodiment shown in FIG. 8, a plurality of (two) holes are formed in the soldering portion 25 to form the communication portion 28b. In the solder joint portion 40C of the fourth embodiment shown in FIG. 9, a concave portion that opens to the X1 side is formed in the soldering portion 25 to form a communication portion 28c.
In FIGS. 8 and 9, the area of each of the communication part 28 b and the communication part 28 c is preferably 50% or less of the area of the soldering part 25.

  In the solder joint portion 40D of the fifth embodiment shown in FIG. 10, the soldering portion 25 is formed with a plurality of concave portions each opened to the joint edge portion 27 to form a communication portion 28d. Also in this case, the total L2 × N (N = 3 in FIG. 10) of the opening dimension L2 of the communication portion 28d at the joint edge 27 is preferably 50% or less of the total length L0 of the joint edge 27. More preferably, it is% or less.

  In each of the above-described embodiments, the lens driving device that performs the automatic focusing by driving the moving member 10 that is a lens holding member only in the optical axis direction has been described, but the present invention is not limited thereto. For example, the present invention can be applied to a lens driving device that can perform so-called camera shake correction by driving a movable unit that performs automatic focusing in a direction crossing the optical axis direction. In this case, generally, the upper leaf spring is divided into two, and each upper leaf spring is joined to the conductive wire winding portion by solder.

DESCRIPTION OF SYMBOLS 1 Lens drive device 2 Support base (support member)
3 cover 4b connecting terminal 10 moving member 10a lower surface 15 of moving member 15a projecting part 15a base 15b front part 20 lower leaf spring 20a inner surface 20b outer surface 21 fixed side supporting piece 22 movable side supporting piece 23 elastic arm part 25 soldering part 25a connecting part 27 Joint edge portions 28, 28a, 28b, 28c, 28d Communicating portion 30 Upper leaf springs 40, 40A, 40B, 40C, 40D Solder joint portion 41 Covered conductor 41a Terminal portion 42 Conductor winding portion 45 Solder C Coil M Magnet

Claims (11)

A movable member capable of mounting a lens body, a leaf spring provided between the movable member and the support member, and movably supporting the movable member in the optical axis direction of the lens body; and provided on the movable member. In a lens driving device having a coil and a magnet facing the coil,
A projecting portion is provided on the moving member, and a conducting wire constituting the coil is wound around the projecting portion to form a conducting wire winding portion,
The leaf spring has an inner surface facing the base side of the projection and an outer surface facing the tip side of the projection, and has a joining edge adjacent to the conductor winding portion,
The lens driving device, wherein the inner surface of the leaf spring and the conductive wire winding portion are bonded together by solder in a state where the bonding edge portion faces the conductive wire winding portion.   The leaf spring is formed with a communication portion that communicates the inner surface and the outer surface, and the solder is provided on the inner surface and the outer surface via the communication portion, and at least the inner surface and the conductor winding The lens driving device according to claim 1, wherein a portion is joined with the solder.   In the conductive wire winding portion, the height dimension of the portion located on the base side of the projection from the inner surface of the leaf spring is the height of the portion located on the tip side of the projection from the outer surface. The lens driving device according to claim 2, wherein the lens driving device is larger than the size. Both the inner surface and the outer surface of the leaf spring and the conductor winding portion are joined with solder,
The lens driving device according to claim 3, wherein the amount of the solder adhering to the inner surface of the leaf spring is larger than the amount of the solder adhering to the outer surface.   The lens driving device according to claim 2, wherein the communication portion is a hole that penetrates the leaf spring.   The lens drive according to claim 5, wherein a connecting portion is formed between the joint edge portion of the leaf spring and the hole, and the solder is provided on the inner surface and the outer surface of the hole and the connecting portion. apparatus.   5. The lens driving device according to claim 2, wherein the communication portion is a concave portion that is partially opened at the joint edge portion.   The lens driving device according to claim 1, a lens body held by the moving member of the lens driving device, and an image sensor facing the lens body. The camera module. A movable member capable of mounting a lens body, a leaf spring provided between the movable member and the support member, and movably supporting the movable member in the optical axis direction of the lens body; and provided on the movable member. In a method for manufacturing a lens driving device having a coil and a magnet facing the coil,
The conductor wire constituting the coil is wound around a protrusion provided on the moving member to form a conductor winding portion,
The joint edge of the leaf spring having an inner surface facing the base side of the protrusion, an outer surface facing the tip side of the protrusion, a communication portion communicating the inner surface and the outer surface, and a joint edge portion. Opposing to the wire winding part,
Solder is melted at the outer surface of the leaf spring, the solder is led from the outer surface to the inner surface through the communicating portion, and the inner surface and the conductive wire winding portion are joined by the solder. A method for manufacturing a lens driving device.   The method for manufacturing a lens driving device according to claim 9, wherein the communication portion is a hole penetrating the leaf spring.   The method for manufacturing a lens driving device according to claim 9, wherein the communication portion is a concave portion that is partially open to the joint edge portion.

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