JP6548526B2 - Lens drive device, unit and camera - Google Patents

Description

  The present invention relates to a lens drive device, a unit and a camera.

  A lens drive device is known that includes a magnetic position detection unit including a magnetic sensor and a magnet, and an electromagnetic drive unit including a coil and a magnet.

  For example, Patent Document 1 discloses a lens drive device including a position detection unit including a Hall element sensor and a magnet for a Hall element sensor, and a drive unit including a main coil and a drive magnet. The Hall element sensor is disposed at the base of the lens driving device, and the Hall element sensor magnet is disposed at the lens support. Further, the main coil is wound around a cylindrical lens support, and the drive magnet is disposed in an annular yoke surrounding the lens support so as to face the main coil.

  In the lens driving device disclosed in Patent Document 1, the Hall element sensor detects the position of the lens support from the strength of the magnetic field generated by the Hall element sensor magnet. The drive unit moves the lens support using the force generated by the magnetic field of the drive magnet and the current flowing in the main coil by adjusting the intensity of the current flowing through the main coil according to the position of the lens support. Let

JP, 2013-33179, A

  In the lens drive device disclosed in Patent Document 1, magnets are disposed in the lens support and the yoke, which are two members whose relative positional relationship changes with each other. Therefore, when the drive unit moves the lens support, the lens support may not be able to be smoothly driven and controlled by the attractive force or the repulsive force acting between the drive magnet and the Hall element sensor magnet.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a lens driving device, a unit, and a camera for driving a lens smoothly.

In order to achieve the above object, a lens driving device according to a first aspect of the present invention is
A position detection unit that detects the position of the lens frame;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
And a holding frame disposed to enclose the lens frame,
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The holding frame, and a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The holding frame is provided with a position detection magnet disposed to face the position detection sensor.

The lens drive device according to the second aspect of the present invention is
A position detection unit that detects the position of the lens frame;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
A base supporting an imaging side of the lens frame;
A cover which covers the lens frame and is fixed to the base;
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The cover includes a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The base includes a position detection magnet disposed to face the position detection sensor.

The lens driving device
It has conductivity, is electrically connected to an external device, and includes biasing means for biasing the lens frame,
The position detection sensor and the drive coil may be configured to receive supply of a drive current from the external device via the biasing unit.

The position detection unit further includes a driver circuit that supplies a driving current to the driving coil,
The driver circuit is supplied with power from the external device via the biasing means,
The drive coil may be configured to receive supply of a drive current from the driver circuit.

The unit according to the third aspect of the present invention is
The lens driving device;
And a blade driving device which is disposed on the surface of the lens driving device on the side of the object to be imaged and which drives a blade for photographing.
The blade drive device contacts the blade drive device with a projecting portion of the position detection sensor from the lens drive device, which is generated when the lens frame is driven in the direction toward the imaging object by the drive unit. It has a recess to prevent it.

  A camera according to a fourth aspect of the present invention includes the lens driving device.

  A camera according to a fifth aspect of the present invention comprises the unit.

  According to the present invention, the lens can be driven smoothly.

It is a schematic diagram which shows the imaging device provided with the lens drive device which concerns on the reference example 1 of this invention. It is a schematic diagram which shows the electronic device provided with the lens drive device which concerns on the reference example 1 of this invention. It is an exploded perspective view of a lens drive concerning a reference example 1 of the present invention. It is a top view of a lens drive concerning a reference example 1 of the present invention. FIG. 5 is a cross-sectional view of the lens driving device shown in FIG. 4 taken along the line A-A. It is a schematic diagram which shows arrangement | positioning of the lens holding part which concerns on the reference example 1 of this invention. It is a schematic diagram which shows the lens holding part which concerns on the reference example 1 of this invention. It is a schematic diagram for demonstrating the lens drive device based on Example 4 of this invention. It is a schematic diagram which shows the cross section which looked at the lens drive device shown in FIG. 8 by the arrow of B-B. (A) It is a perspective view of a base part concerning Example 5 of the present invention, (b) It is a perspective view of a cover part concerning Example 5 of the present invention. It is a side view of a base part concerning Example 5 of the present invention, and is a side view showing a (a) trapezoidal base side wall, (b) a side view showing an arc-like base side wall, (c) a step-like base side wall It is a side view which shows the base side wall which has (d) uneven | corrugated | grooved part. It is a schematic diagram for demonstrating the assembling method of the base part and cover part which concern on the reference example 5 of this invention, (a) The figure which shows the state which has attached the cover part to the base part, (b) Opening part of a cover (C) shows a state in which the adhesive is diffused by capillary force, (d) shows a state in which the adhesive reaches the end of the base side wall. FIG. It is a schematic diagram which shows the spread of the adhesive agent along the base side wall which concerns on the reference example 5 of this invention, (a) A figure which shows a state in which an adhesive agent is collected in the direction toward a base, (b) adhesive agent in an edge part. It is a figure which shows the state which penetrates toward. It is a schematic diagram which shows the lens drive device based on the reference example 6 of this invention, and is a side view of (a) lens drive device, the cross section which saw the lens drive device shown to (b) and (a) by the arrow CC '. FIG. It is a schematic diagram which shows the manufacturing method of the lens drive device based on the reference example 6 of this invention, and is a figure which shows the state which inject | pours an adhesive into the opening part of a cover, (b) adhesive is by capillary action. It is a figure which shows the state which has spread | diffused by the penetration force, and is a figure which shows the state which the adhesive agent reached to the edge part of the base side wall. FIG. 16 is a cross-sectional view of the lens driving device of FIG. 15 taken along the line DD ', showing (a) a state in which the adhesive is injected into the opening of the cover; (b) the adhesive by penetration force It is a figure which shows the state which has spread | diffused, (c) It is a figure which shows the state which the adhesive agent reached to the edge part of the base side wall. It is a figure for demonstrating the lens drive device based on the reference example 7 of this invention, and is a figure which shows the cover side wall and base side wall in the lens drive device in which only a cover side wall inclines, (b) base side wall. And FIG. 10 is an enlarged view showing the cover side wall and the base side wall in the lens driving device in which both the cover side wall and the cover side wall are inclined. It is the elements on larger scale which show the corner | angular part of the flame | frame which concerns on Embodiment 8 of this invention. It is a top view of the upper leaf | plate spring which concerns on Embodiment 8 of this invention. It is the elements on larger scale which show the assembled state of the upper leaf | plate spring and suspension wire which concern on the reference example 8 of this invention. It is a top view which shows the state which the flux wet-spreaded in the comparative example. It is a top view which shows the state which the flux wet-spreaded in Example 8 of this invention. FIG. 1 is an exploded perspective view of a lens drive device according to Embodiment 1 of the present invention. It is a top view of the upper leaf | plate spring which concerns on Embodiment 1 of this invention. It is a block diagram of the lens holding part which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the outline of the support structure of the flame | frame supported by a suspension wire when the lens drive device shown in FIG. 4 is arrowed by AA. It is a perspective view of the suspension wire concerning the reference example 9, a lead frame, and an upper leaf spring. It is the perspective view which fixed with solder the structure shown in FIG. It is sectional drawing of the part which fixed the suspension wire and lead frame which concern on the reference example 9 with solder. It is sectional drawing of the comparative example which fixed the suspension wire and the lead frame with solder. It is sectional drawing of the part which fixed the suspension wire and the upper leaf | plate spring which concern on the reference example 9 with solder. It is sectional drawing of the comparative example which fixed the suspension wire and the upper leaf | plate spring with solder. (A), (b), (c), (d) is a procedure figure explaining the alignment method of the flame | frame and base based on the reference example 10 of this invention. (E), (f), (g) is a figure explaining the alignment method of the flame | frame and base based on the reference example 10 of this invention. (H), (i), (j) is a figure explaining the alignment method of the suspension wire which concerns on the reference example 10 of this invention, and an upper leaf | plate spring through-hole. (K), (l) is a figure explaining the alignment method of the suspension wire which concerns on the reference example 10 of this invention, and an upper leaf | plate spring through-hole. It is a top view which shows the triangle surface of three object points. It is a top view which shows the triangle surface of three different object points. It is a flowchart of the registration method which concerns on the reference example 10 of this invention. It is an exploded perspective view of a lens drive provided with a shutter. It is a figure which shows the external appearance of the lens drive device provided with the shutter. (A) It is an upper side figure of the lens drive provided with the shutter. (B) It is sectional drawing of the lens drive device provided with the shutter. (A) and (b) It is the figure which expanded sectional drawing of the lens drive provided with the shutter. It is a disassembled perspective view of the lens drive device based on Embodiment 2 of this invention. It is a figure which shows the external appearance of the lens drive device based on Embodiment 2 of this invention. It is a figure which shows the external appearance of the lens drive device based on Embodiment 2 of this invention. (A) It is a top view of the lens drive device based on Embodiment 2 of this invention. (B) It is sectional drawing of the lens drive device based on Embodiment 2 of this invention.

(Reference Example 1)
The lens drive device 100 in the present embodiment will be described with reference to FIGS. 1 to 7.

  The lens driving device 100 is provided in an imaging device 1 having an imaging element, an electronic device 2 and the like as shown in FIGS. 1 and 2, and an automatic focusing (AF) mechanism and an anti-shake mechanism for preventing shaking. (E.g., Optical Image Stabilizer: OIS). The imaging device 1 is a camera including a digital camera, a monitoring camera or the like, and the electronic device 2 is a portable terminal including a smartphone having an imaging function, a laptop personal computer, or the like. The imaging device is, for example, an image sensor of a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

  As shown in FIG. 3, the lens drive device 100 includes a base portion 10, an OIS frame portion 30, a frame support portion 40, a lens holding portion 60, a lens support portion 70, and a cover portion 80.

The base unit 10 includes a base 11, lead frames 24, 25A, 25B, 25C, 25D, OIS coils 22A, 22B, and OIS position detectors 23A, 23B. Each of the OIS coils 22A and 22B constitutes an OIS drive unit that drives the OIS frame unit 30 and the OIS magnets 32A and 32B of the OIS frame unit 30 described later.
Further, the OIS position detectors 23A and 23B detect the position of the OIS frame 30 relative to the base 10 from the magnetic field of the OIS magnets 32A and 32B.

The OIS frame unit 30 includes a frame 31 which is a frame, OIS magnets 32A and 32B, an AF magnet 35A, and an AF position detection unit 36. Each of the OIS magnets 32A and 32B constitutes an OIS drive unit that drives the OIS coil 22A and 22B of the base unit 10 and the OIS frame unit 30. As shown in FIGS. 5 and 6, the AF magnet 35A constitutes an AF driving unit 92 together with an AF coil 62 of a lens holding unit 60 described later.
Further, the AF position detection unit 36 detects the position of the lens holding unit 60 with respect to the base unit 10 from the magnetic field of the AF position detection magnet 65 of the lens holding unit 60 described later.
The OIS frame unit 30 houses and holds the lens holding unit 60. Further, the OIS frame unit 30 is a lens holding unit in a direction orthogonal to the optical axis AX of the lens in a lens barrel (not shown) having one or more lenses attached to the lens holding unit 60. Swing 60 Thereby, the lens drive device 100 prevents camera shake.

  The frame support portion 40 is composed of suspension wires 42A, 42B, 42C, 42D, and upper flat springs 41A, 41B, 41C, 41D. The frame support 40 pivotally supports the OIS frame 30.

The lens holding unit 60 includes a substantially octagonal cylindrical member 61, an AF coil 62, a yoke 63, and an AF position detection magnet 65. The AF coil 62 constitutes an AF driving unit 92 together with the AF magnet 35A of the OIS frame unit 30.
A lens barrel is attached to the lens holding unit 60, and the lens holding unit 60 moves in the direction of the optical axis AX of the lens. Thereby, the lens drive device 100 performs focusing.

  The lens supporting portion 70 is a set of bearings 73A and 73B and a bearing 73C, and is disposed between the OIS frame portion 30 and the lens holding portion 60, as shown in FIGS. To support.

  The cover 80 is attached to the base 11 of the base 10, as shown in FIGS. 4 and 5, and covers the OIS frame 30, the frame support 40, the lens holder 60, and the lens support 70.

Hereinafter, the specific configuration of the lens drive device 100 will be described.
In order to facilitate understanding, the object side with respect to the lens of the lens barrel will be described as “front”, and the image forming side of the lens of the lens barrel will be described as “rear”. Further, the optical axis AX of the lens is taken as the Z axis, the directions orthogonal to the Z axis, and the directions orthogonal to each other are taken as the X axis and the Y axis.

(Base part)
The base unit 10 includes a substantially rectangular resin base 11, lead frames 24, 25A, 25B, 25C, and 25D provided on the base 11, OIS coils 22A and 22B, and OIS position detectors 23A and 23B. Ru.

  The base 11 has a circular opening 15 at the center, and the light transmitted through the lens of the lens barrel passes through the opening 15 and reaches an imaging element (not shown) disposed rearward. A cover 80 is attached to the base 11 so as to cover the OIS frame 30, the frame support 40, the lens holder 60, and the lens support 70.

  Each of the OIS coils 22A and 22B is attached to each of coil support portions 20A and 20B provided along each of two adjacent sides of the base 11. The OIS position detectors 23A and 23B are attached to the OIS position detectors 21A and 21B adjacent to the coil supporters 20A and 20B, respectively.

The OIS coil 22A generates a magnetic field that moves the OIS frame unit 30 in the Y-axis direction. In addition, the OIS coil 22B generates a magnetic field that moves the OIS frame unit 30 in the X-axis direction. Each of the OIS coils 22A, 22B is opposed to each of the OIS magnets 32A, 32B of the OIS frame unit 30, and both constitute an OIS drive unit for driving the OIS frame unit 30. The driving of the OIS frame unit 30 and the prevention of camera shake will be described later.
In addition, the OIS position detectors 23A and 23B face the OIS magnets 32A and 32B of the OIS frame unit 30, respectively, with respect to the base unit 10, in the Y axis direction of the OIS magnets 32A and 32B of the OIS frame unit 30, X axis Detect the position in the direction. Thus, the OIS position detectors 23A and 23B can detect the position of the OIS frame unit 30 in the Y-axis direction and the X-axis direction with respect to the base unit 10. The OIS position detectors 23A and 23B are, for example, magnetic sensors such as Hall elements.

  The lead frames 24, 25A, 25B, 25C, and 25D provided on the base 11 are made of, for example, a copper alloy, and nickel plating and gold plating are applied in this order. The lead frames 25A, 25B, 25C, and 25D are respectively provided at the four corners of the base 11, and the suspension wires 42A, 42B, 42C, and 42D of the frame support portion 40 are connected to the lead frames 25A, 25B, 25C, and 25D, respectively.

  The lead frames 24, 25A, 25B, 25C, and 25D are connected to an external control unit (not shown), and input and output power, signals, and the like from the control unit. The power, signals, etc. supplied to the lead frames 24, 25A, 25B, 25C, 25D are connected to the lead frame 24 through the wiring (not shown) and the suspension wires 42A, 42B, 42C, 42D, and the OIS coil of the base portion 10 22A and 22B, the OIS position detectors 23A and 23B, the AF position detector 36 of the OIS frame unit 30, and the AF coil 62 of the lens holding unit 60.

(Frame support)
The frame support portion 40 includes upper flat springs 41A, 41B, 41C, 41D, and suspension wires 42A, 42B, 42C, 42D connected to the upper flat springs 41A, 41B, 41C, 41D, respectively.

The suspension wires 42A, 42B, 42C, 42D are made of metal having elasticity and conductivity.
The suspension wires 42A, 42B, 42C, 42D are respectively connected and fixed to the upper flat springs 41A, 41B, 41C, 41D at the front end. The rear end portions of the suspension wires 42A, 42B, 42C, 42D are connected to the lead frames 25A, 25B, 25C, 25D of the base portion 10, respectively.

The upper flat springs 41A, 41B, 41C, and 41D are frame-shaped plate-like members each having a right triangle. The upper flat springs 41A, 41B, 41C, 41D are made of metal having elasticity and conductivity.
The upper flat springs 41A, 41B, 41C, 41D, to which the suspension wires 42A, 42B, 42C, 42D are respectively connected, are respectively attached to the spring support portions 37A, 37B, 37C, 37D of the OIS frame portion 30 described later. It is done.

  By the above-described configuration, the frame support 40 supports the OIS frame 30 so as to be able to swing.

(OIS frame part)
The OIS frame unit 30 houses and holds the lens holding unit 60. The OIS frame unit 30 swings the lens holding unit 60 with respect to the base unit 10 in the X-axis direction and the Y-axis direction. The OIS frame portion 30 is swingably supported by the frame support portion 40.

  The OIS frame unit 30 includes a frame 31 which is a substantially rectangular frame, OIS magnets 32A and 32B provided on the frame 31, an AF magnet 35A, and an AF position detection unit 36.

The OIS magnets 32A and 32B are respectively provided on the magnet placement parts 33A and 33B on the rear side (base part 10 side) of two adjacent sides of the frame 31.
In the OIS frame unit 30, the OIS magnet 32A faces the OIS coil 22A and the OIS position detection unit 23A of the base unit 10, and the OIS magnet 32B faces the OIS coil 22B and the OIS position detection unit 23B of the base unit 10 Be placed.

The AF magnet 35A is fixed to a magnet support 35B provided at a corner 38B of the frame 31. Here, the corner of the frame 31 refers to the peripheral area of the corner sandwiched by the two sides forming the corner of the frame 31, and the shape of the corner of the frame 31 is arbitrary, and is formed at right angles as illustrated. For example, it may be rounded (having a curvature). The corner 38B of the frame 31 is a corner composed of the side on which the OIS magnet 32A is disposed and the side on which the OIS magnet 32B is disposed.
As shown in FIGS. 5 and 6, the AF magnet 35A faces the AF coil 62 of the lens holding unit 60, and together constitutes an AF driving unit 92 that drives the lens holding unit 60. The driving of the lens holding unit 60 and the automatic focusing will be described later.

The AF position detection unit 36 is fixed to an AF position detection support unit 36C provided at a corner 38D of the frame 31 facing (diagonally located) the corner 38B in which the AF magnet 35A is disposed.
The AF position detection unit 36 faces the AF position detection magnet 65 of the lens holding unit 60, and detects the position of the AF position detection magnet 65 of the lens holding unit 60 in the Z-axis direction with respect to the base unit 10. Thus, the AF position detection unit 36 can detect the position of the lens holding unit 60 in the Z-axis direction with respect to the base unit 10. The AF position detection unit 36 is, for example, a magnetic sensor such as a Hall element.

The frame 31 accommodates the lens holding unit 60 in the opening 31A.
In the frame 31, as shown in FIG. 6, the bearing sliding portions 72A, 72C, and 38C are disposed on the opposite corner portions 38A and 38C different from the corner portions 38B and 38D in which the AF magnet 35A and the AF position detection unit 36 are disposed. Each of 71A is formed. Each of the bearing sliding portions 71A, 72A extends in the Z-axis direction and has a groove in which each of the bearings 73A, 73B and the bearing 73C is disposed. The bearing sliding portions 71A and 72A hold the lens holding portion via the bearings 73A and 73B, the bearing 73C, and bearing sliding portions 71B and 72B of the lens holding portion 60 described later. The holding of the lens holding unit 60 will be described later.

Furthermore, at the four corners of the frame 31, spring support portions 37A, 37B, 37C, 37D to which the upper flat springs 41A, 41B, 41C, 41D of the frame support portion 40 are attached are respectively formed.
Upper flat springs 41A, 41B, 41C, 41D are attached to the spring supports 37A, 37B, 37C, 37D, respectively. The front end portions of the suspension wires 42A, 42B, 42C, 42D of the frame support portion 40 are respectively connected and fixed to the upper flat springs 41A, 41B, 41C, 41D. The rear end portions of the suspension wires 42A, 42B, 42C, 42D are respectively connected to and fixed to the lead frames 25A, 25B, 25C, 25D of the base portion 10. With such a configuration, the OIS frame portion 30 is elastically supported by the frame support portion 40 so as to be able to swing in the X axis direction and the Y axis direction.

(Lens support)
The lens support portion 70 is a set of bearings 73A and 73B and a bearing 73C, and supports the lens holding portion 60. As shown in FIGS. 3 and 6, the bearings 73A and 73B are disposed and held between the groove of the bearing sliding portion 71B and the groove of the bearing sliding portion 71A of the frame 31. In addition, the bearing 73C is disposed and held between the groove of the bearing sliding portion 72B and the groove of the bearing sliding portion 72A of the frame 31. The support of the lens holding unit 60 will be described later.

(Lens holding unit)
The lens holding unit 60 moves in the Z-axis direction to perform focusing. The lens holding unit 60 is housed in the opening 31 A of the frame 31 and held by the OIS frame unit 30.

  The lens holding unit 60 includes a substantially octagonal cylindrical member 61, a yoke 63, an AF coil 62, and an AF position detection magnet 65.

In the cylindrical member 61, a lens barrel attachment portion 74 is formed on the inner side surface of the cylinder, and the lens barrel is attached to the lens barrel attachment portion 74.
Further, bearing sliding portions 71B and 72B, each having a groove extending in the Z-axis direction and in which each of the bearings 73A and 73B and the bearing 73C is disposed, are provided on each of the facing side portions 67 and 68 of the cylindrical member 61. It is formed.

The yoke 63 is provided on the side surface portion 64 of the cylindrical member 61 integrally with the cylindrical member 61. Also, the AF coil 62 is provided on the side surface portion 64 of the cylindrical member 61 with the yoke 63 interposed therebetween. As shown in FIGS. 5 and 6, the AF coil 62 faces the AF magnet 35A of the OIS frame unit 30, and together constitutes an AF driving unit 92 that drives the lens holding unit 60.
The AF position detection magnet 65 is provided on the side surface 66 facing the side surface 64. As shown in FIGS. 5 and 6, the AF position detection magnet 65 is opposed to the AF position detection unit 36 of the OIS frame unit 30.
Here, as shown in FIG. 7, the side surface 64 where the AF coil 62 is provided and the side surface 66 where the AF position detection magnet 65 is provided are seen from the side surface 64 from the side surface 64 when the tubular member 61 is viewed in plan. The perpendicular L1 to 66 is in a positional relationship orthogonal to the perpendicular L2 from the side surface portion 67 on which each of the bearing sliding portions 71B and 72B is formed to the side surface portion 68. Therefore, for example, the bearing sliding portion 71B, the AF position detection magnet 65, the bearing sliding portion 72B, and the AF coil 62 are provided on the outer periphery of the cylindrical member 61 around the intersection C of the perpendicular L1 and the perpendicular L2. In this order, they are arranged at intervals of about 90 °.

  The arrangement of the lens holding unit 60 housed in the frame 31 of the OIS frame unit 30 and the support and holding of the lens holding unit 60 will be described.

  As shown in FIG. 6, in the lens holding unit 60, the AF coil 62 and the yoke 63 face the AF magnet 35A of the OIS frame unit 30 at the opening 31A of the frame 31, and the position detection magnet for AF of the lens holding unit 60 65 and the AF position detection unit 36 of the OIS frame unit 30 are disposed and stored so as to face each other.

Further, the groove of the bearing sliding portion 71B of the lens holding portion 60 and the groove of the bearing sliding portion 71A of the frame 31 face each other, and hold the bearings 73A and 73B. The groove of the bearing sliding portion 72B of the lens holding portion 60 and the groove of the bearing sliding portion 72A of the frame 31 face each other to hold the bearing 73C. The lens holding unit 60 is supported by the held bearings 73A and 73B and the bearing 73C.
Further, the lens holding portion 60 is held by the magnetic attraction force of the yoke 63 disposed opposite to each other and the AF magnet 35A of the OIS frame portion 30.

(Cover part)
The cover 80 is a cover whose bottom surface is substantially rectangular. The cover 80 covers and protects the OIS frame 30, the frame support 40, the lens holder 60, and the lens support 70. The cover 80 is attached to the base 11 of the base 10.
The cover 80 has an opening 82 at the center of the top surface. The light from the object to be imaged passes through the opening 82 and enters the lens barrel, and reaches the imaging element disposed rearward.

(Auto focus adjustment)
Next, driving of the lens holding unit 60 and automatic focusing will be described.

The AF magnet 35A of the OIS frame unit 30 and the AF coil 62 of the lens holding unit 60 are disposed to face each other, and constitute an AF driving unit 92. Further, the AF position detection unit 36 of the OIS frame unit 30 and the AF position detection magnet 65 of the lens holding unit 60 are disposed to face each other, and the AF position detection unit 36 is a Z axis direction of the lens holding unit 60 with respect to the base unit 10 Detect the position in
The AF coil 62 of the lens holding unit 60 is disposed so that the winding direction of the coil is orthogonal to the magnetic field of the AF magnet 35A of the OIS frame unit 30. Therefore, when current flows in the AF coil 62, the generated magnetic field acts on the magnetic field of the AF magnet 35A, and a force acts on the AF coil 62 in the Z-axis direction. The cylindrical member 61 to which the AF coil 62 is fixed is slidably supported by the bearings 73A, 73B and the bearing 73C with respect to the OIS frame portion 30, so the lens holding portion 60 slides in the Z axis direction. Move and move. By controlling the direction of the current supplied to the AF coil 62, it is possible to control the moving direction (front-rear direction) of the lens holding unit 60.
As described above, the lens holding unit 60 is driven by the AF driving unit 92.

  For example, the AF driving unit 92 sets the lens holding unit 60 to which the lens barrel is attached at a position where the contrast of the image obtained by the imaging device is maximized by the power supplied to the AF coil 62 from the control unit. Move in the (front-back direction). Thereby, the lens drive device 100 performs automatic focusing. In this case, the control unit feedback-controls the position of the lens holding unit 60 from the position of the lens holding unit 60 detected by the AF position detection unit 36, so that the lens driving device 100 detects the position of the lens holding unit 60 in the Z axis direction. The position, that is, the position of the lens barrel in the Z-axis direction can be controlled with high accuracy. Further, the lens holding unit 60 can be stably held by feedback control.

(Shake prevention)
Next, driving of the OIS frame unit 30 and prevention of camera shake will be described.

The OIS coil 22A of the base unit 10 and the OIS magnet 32A of the OIS frame unit 30 face each other, and the OIS coil 22B of the base unit 10 and the OIS magnet 32B of the OIS frame unit 30 face each other. And an OIS drive unit that drives in the X-axis direction. Further, the OIS position detectors 23A and 23B of the base unit 10 are disposed to face the OIS magnets 32A and 32B of the OIS frame unit 30, respectively. The OIS position detectors 23A and 23B respectively detect the positions of the OIS frame unit 30 in the Y-axis direction and the X-axis direction with respect to the base unit 10.
The OIS coil 22A of the base portion 10 is disposed such that the winding direction of the coil is orthogonal to the magnetic field of the OIS magnet 32A of the OIS frame portion 30. Therefore, when a current flows through the OIS coil 22A, the generated magnetic field acts on the magnetic field of the OIS magnet 32A to exert a force on the OIS magnet 32A in the Y-axis direction. Since OIS frame portion 30 is elastically supported (slidable in the Y-axis direction) on base portion 10 by frame support portion 40, OIS frame portion 30 is in the Y-axis direction with respect to base portion 10. Swing and move. By controlling the direction of the current supplied to the OIS coil 22A, the moving direction of the OIS frame unit 30 can be controlled.

Further, the OIS coil 22B of the base unit 10 is disposed such that the winding direction of the coil is orthogonal to the magnetic field of the OIS magnet 32B of the OIS frame unit 30. Therefore, when current flows in the OIS coil 22B, the generated magnetic field acts on the magnetic field of the OIS magnet 32B to exert a force on the OIS magnet 32B in the X-axis direction. Since OIS frame portion 30 is elastically supported (slidable in the X-axis direction) on base portion 10 by frame support portion 40, OIS frame portion 30 is in the X-axis direction with respect to base portion 10. Swing and move. The moving direction of the OIS frame unit 30 can be controlled by controlling the direction of the current flowing through the OIS coil 22B.
As described above, the OIS frame unit 30 is driven by the OIS drive unit.

The power supplied from the control unit to the OIS coils 22A and 22B causes the OIS drive unit to swing and move the OIS frame unit 30 holding the lens holding unit 60 so as to offset camera shake, for example. Thereby, the lens drive device 100 can perform shake prevention.
In this case, the lens driving device 100 can prevent camera shake with high accuracy by the control unit performing feedback control of the position of the OIS frame unit 30 from the position of the OIS frame unit 30 detected by the OIS position detection units 23A and 23B.

(Reference Example 2)
In the present reference example, the inclination of the lens holding portion 60 with respect to the XY plane, which occurs when the lens holding portion 60 of the first reference example moves in the Z-axis direction, will be described.
In Reference Example 1, as shown in FIGS. 1 and 6, the bearings 73A and 73B as the lens support 70 are held by the bearing sliding portion 71B of the lens holding portion 60 and the bearing sliding portion 71A of the frame 31. , And supports the lens holding unit 60. The bearing 73C, which is the lens support 70, is held by the bearing sliding portion 72B of the lens holding portion 60 and the bearing sliding portion 72A of the frame 31, and supports the lens holding portion 60.
Further, each of the bearing sliding portion 71A and the bearing sliding portion 72A of the frame 31 is formed at each of the facing corner portions 38C and 38A of the frame 31.

Therefore, the bearings 73A and 73B and the bearing 73C are disposed at the widest (longest distance) corner 38C and the corner 38A at the opening 31A, respectively, when the frame 31 is viewed in plan. .
In this embodiment, since the bearings 73A and 73B supporting the lens holding portion 60 and the bearing 73C can be disposed at the widest position, the lens holding portion 60 generated when the lens holding portion 60 moves in the Z-axis direction It is possible to suppress the inclination of the relative to the XY plane.

Further, as shown in FIG. 6, the lens driving unit 92 is disposed at a corner 38B different from the corners 38C and 38A of the frame 31 in which the bearings 73A and 73B and the bearing 73C are disposed.
As a result, the difference between the distance between the AF drive unit 92 and the bearing 73A or the bearing 73B and the distance between the AF drive unit 92 and the bearing 73C becomes smaller, and the bearings 73A and 73B and the bearing 73C are separated from the AF drive unit 92. The driving force is evenly applied. Since equal driving force is applied to the bearings 73A and 73B and the bearing 73C, it is possible to further suppress the inclination of the lens holding unit 60 with respect to the XY plane which occurs when the lens holding unit 60 moves in the Z axis direction.

Furthermore, in the present embodiment, as shown in FIG. 7, in the cylindrical member 61 of the lens holder 60 having a substantially octagonal shape, the bearing sliding portion 71 B and the AF coil 62 constituting the AF driving portion 92 perform bearing sliding. Since the portions 72B are arranged at intervals of about 90 ° around the intersection point C, the difference between the distance between the AF drive portion 92 and the bearing 73A or the bearing 73B and the distance between the AF drive portion 92 and the bearing 73C is further smaller Become. Therefore, the inclination of the lens holding unit 60 with respect to the XY plane, which occurs when the lens holding unit 60 moves in the Z-axis direction, can be further suppressed.
In order to further suppress the inclination of the lens holding unit 60 with respect to the XY plane, the intersection point C is preferably on the Z axis.

As described above, by disposing the bearings 73A and 73B and the bearing 73C at the facing corner 38C and the facing corner 38A, respectively, the lens driving unit 100 in the reference example 1 has the lens holding unit 60 of the lens. The inclination of the lens holding unit 60 with respect to the XY plane, which occurs when moving in the Z-axis direction, can be suppressed.
When the lens holding unit 60 is moved in the Z-axis direction by arranging the lens driving unit 92 at the corner 38B different from the corners 38C and 38A of the frame 31 in which the bearings 73A and 73B and the bearing 73C are arranged. Inclination of the lens holding unit 60 with respect to the XY plane can be further suppressed.
Further, the AF coil 62 constituting the bearing sliding portion 71B and the AF driving portion 92 and the bearing sliding portion 72B are set at about 90 ° centering on the intersection C in the cylindrical portion 61 of the substantially octagonal lens holding portion 60. By arranging at intervals, the lens drive device 100 according to the first reference example can further suppress the inclination of the lens holding unit 60 with respect to the XY plane, which occurs when the lens holding unit 60 moves in the Z-axis direction.

(Reference Example 3)
In this reference example, the accuracy with which the AF position detection unit 36 in the reference example 1 detects the position of the lens support unit 60 in the Z-axis direction will be described.
In the first embodiment, as shown in FIGS. 5 and 6, the side surface portion 64 of the cylindrical member 61 provided with the AF coil 62 of the AF drive unit 92 and the cylindrical member 61 provided with the AF position detection magnet 65. The side portions 66 of the two face each other. The AF magnet 35A of the AF drive unit 92 faces the AF coil 62 of the AF drive unit 92, and the AF position detection unit 36 of the OIS frame unit 30 faces the AF position detection magnet 65.
Therefore, when the lens drive device 100 is viewed in plan from the front side, the AF position detection unit 36 and the AF drive unit 92 are opposed to each other with the lens barrel attachment portion 74 of the cylindrical member 61 interposed therebetween. That is, the AF position detection unit 36 is provided at a position sandwiching the AF drive unit 92, the lens and the cylindrical member 61.

In the first reference example, the AF position detection unit 36 is provided at a position sandwiching the AF drive unit 92 and the lens and the cylindrical member 61. Therefore, the AF coil 62 of the AF drive unit 92 and the AF position detection unit As the distance to the distance 36 increases, the interference of the magnetic field generated by the AF coil 62 received by the AF position detector 36 is reduced.
Therefore, the AF position detection unit 36 can detect the position of the lens holding unit 60 in the Z-axis direction with respect to the base unit 10 with high accuracy, and the lens driving device 100 in the first reference example detects the position of the lens holding unit 60 in the Z-axis direction. It can control with high accuracy.

  Further, in the movement of the lens holding unit 60 in the Z-axis direction, the angle (inclination with the AF coil 62 as a supporting point) with respect to the XY plane of the lens holding unit 60 may change. In this case, in the present embodiment, since the AF drive unit 92 is provided at a position far from the AF coil 62, the AF position detection unit 36 performs the feedback control when the AF coil 62 of the lens holding unit 60 is in the Z axis direction. A value larger than the distance moved to the position can be detected as the displacement of the lens holding unit 60. Thus, the lens drive unit 92 is controlled to further shorten the moving distance of the lens holding unit 60 in the Z-axis direction. Therefore, the lens driving device 100 in the first reference example has the lens holding unit 60 in the Z-axis direction. You can control the position with higher accuracy.

  As described above, in plan view, the AF position detection unit 36 is provided at a position sandwiching the AF drive unit 92 and the lens and the cylindrical member 61, so the lens drive device 100 in the first reference example is a lens holding unit The position in the Z-axis direction of 60 can be controlled with high accuracy.

(Reference Example 4)
In the reference example 1, the AF position detection unit 36 is provided at a position sandwiching the AF drive unit 92 and the lens and the tubular member 61 in plan view, but the AF position detection unit 36 performs AF in plan view. It may be provided at a position sandwiching the drive unit 92 and the lens.
For example, as shown in FIGS. 8 and 9, instead of the position detection magnet 65 for AF of the cylindrical member 61, a reflection plate 120 is provided, and the Z of the lens holding portion 60 is provided at a position facing the reflection plate 120 of the base 11. An optical sensor 122 may be provided to detect the position in the axial direction. Thus, as in the first embodiment, the lens driving device 100 can control the position of the lens holding unit 60 in the Z-axis direction with high accuracy. In FIGS. 8 and 9, only the base 11, the AF driving unit 92, the reflecting plate 120, and the optical sensor 122 are simplified and shown for easy understanding.
Furthermore, the lens holder 60 may hold the lens directly.

(Reference Example 5)
In the present embodiment, the base 10 and the cover 80 of the lens driving device 100 according to the first embodiment will be described with reference to FIGS.
The base portion 10 and the cover portion 80 have a structure for reliably sealing the gap 230 formed between the base portion 10 and the cover portion 80 with the adhesive 240 in a short time.

  First, with reference to FIGS. 10A and 10B, the overall structure of the base 10 and the cover 80 according to the present embodiment will be described.

As shown in FIG. 10A, the base unit 10 includes a substantially rectangular and flat base 11. At four sides of the base 11, base side walls 212 are formed to rise from the top surface of the base 11. The base side wall 212 rises from a position slightly inward from four sides of the base 11 and has a generally rectangular shape as a whole when viewed from the top of the base 11.
A flat portion between the four sides of the base 11 and the base side wall 212 is an abutting portion 216 with which the abutting portion 224 of the cover 80 abuts. The base sidewall 212 is composed of four base sidewalls 212a, 212b, 212c, 212d, and the respective base sidewalls 212a, 212b, 212c, 212d extend longitudinally along the four sides of the base 11 Is formed. The base portion 10 is formed of, for example, a resin such as a thermoplastic resin.

As shown in FIG. 10B, the cover portion 80 extends in the direction perpendicular to the cover 221 from the four sides of the cover 221 having a substantially rectangular bottom surface and the cover 221, and faces the cover 221. And a cover sidewall 222 having an abutment 224 at the end thereof. The inner surface of the cover side wall 222 and the outer surface of the base side wall 212 are adhered to each other by an adhesive 240. Four cover side walls 222 a, 222 b, 222 c, 222 d constituting the cover side wall 222 are formed to extend in the longitudinal direction along four sides of the cover 221, respectively.
In the cover side walls 222a, 222b, 222c, and 222d, openings 223 are formed, through which the adhesive 240 can be injected into the gap 230 between the base side wall 212 and the cover side wall 222. The opening 223 is located near the center in the longitudinal direction so as to correspond to the highest portion of the cover side walls 222a, 222b, 222c, 222d when the cover 80 is attached to the base 10. It is formed. The cover 80 is formed of, for example, a metal such as stainless steel or a resin such as a thermoplastic resin.

  Next, the shape of the base side wall 212 of the base portion 10 will be described in detail. FIGS. 11A to 11D are side views of the base side wall 212 according to the present embodiment, and these drawings will be referred to as necessary.

  As shown in FIGS. 11 (a) to 11 (d), the respective base side walls 212a, 212b, 212c and 212d are the highest near the longitudinal central portion as a whole, and are directed toward both longitudinal ends. The height is formed to decrease gradually. The height of the base side walls 212a, 212b, 212c, 212d can be formed so as to decrease continuously from near the longitudinal center to both ends. For example, as shown in FIGS. 11A and 11B, the upper surfaces 215 of the base sidewalls 212a, 212b, 212c, and 212d may be trapezoidal or arc-shaped, respectively.

  In addition, the heights of the base side walls 212a, 212b, 212c, and 212d are not limited to those that change continuously, but can be formed to change in stages. For example, as shown in FIG. 11C, the upper surface 215 of the base side walls 212a, 212b, 212c and 212d may be formed to decrease stepwise.

  The base side walls 212a, 212b, 212c, 212d are not limited to those whose heights decrease continuously or stepwise from the center to the end in the longitudinal direction, and the heights of the base side walls 212a, 212b, 212c, 212d are not limited. The shape may be any shape as long as it decreases as a whole from the longitudinal center to both ends. The base side walls 212a, 212b, 212c, 212d whose heights generally decrease from the center to both ends in the longitudinal direction partially include portions that do not decrease from the center to the both ends in the longitudinal direction. It also includes those provided. For example, as shown in FIG. 11D, it can be formed so as to partially include the portion in which the irregular asperity portion 213 is formed. Also, the base side walls 212a, 212b, 212c, 212d are perpendicular to the plane of the base 10, where the height increases from the central portion to the end in the longitudinal direction, the portion where the height varies irregularly, and It can also be formed to include a portion projecting in one direction.

  An adhesive 240 is injected into the gap 230 between the base sidewall 212 and the cover sidewall 222 in order to seal the base portion 10 and the cover portion 80. As the adhesive 240, a thermosetting resin having a viscosity that allows penetration of the narrow gap 230 between the base sidewall 212 and the cover sidewall 222 is preferable. The adhesive agent 240 is not limited to the thermosetting resin as long as it can penetrate the gap 230 between the base side wall 212 and the cover side wall 222. For example, as the adhesive 240, a photocurable resin that is cured by ultraviolet light or the like may be used. Needless to say, in the case of using a photocurable resin as the adhesive 240, it is necessary to form at least a part of the cover 80 from a translucent resin.

  Next, a method of assembling the base portion 10 and the cover portion 80 will be described with reference to FIGS. 12 (a) to 12 (d). FIGS. 12 (a) to 12 (d) are diagrams schematically showing the method of assembling the base portion 10 and the cover portion 80 in the present embodiment in order.

  As shown in FIG. 12A, the cover 80 is attached to the base 10 first. Since the base 11 is provided with the base side wall 212, when the contact portion 224 of the cover is moved toward the contact portion 216 of the base 11, the contact portion 224 is guided by the outer surface of the base side wall 212. . Therefore, the contact portion 224 can be reliably in contact with the contact portion 216 of the base 11.

  Next, as shown in FIG. 12 (b), the adhesive 240 is injected from the opening 223 provided in the cover side wall 222. A predetermined gap 230 is formed between the base side wall 212 and the cover side wall 222, and as shown in FIG. 12C, the adhesive 240 injected from the opening 223 is capillarified by the capillary action. It penetrates gradually to both ends. After a while after the injection of the adhesive 240, as shown in FIG. 12 (d), the adhesive 240 penetrates around the base 11 and reaches both ends of the gap 230. The opening 223 provided in the cover side wall 222 is formed to correspond to the highest part of the base side wall 212. For this reason, there is no possibility that the injected adhesive 240 will pass over the base side wall 212 and enter the inside of the base side wall 212.

  After the adhesive 240 spreads across the gap 230 between the base sidewall 212 and the cover sidewall 222, the adhesive 240 is cured in a predetermined manner to tightly seal the gap 230. When the adhesive 240 is a thermosetting resin, the periphery of the base side wall 212 and the contact portion 224 of the cover 80 is heated by a heater or the like. When the adhesive 240 is a photocurable resin, light is emitted around the base sidewall 212 and the cover sidewall 222.

  Next, with reference to FIGS. 13A and 13B, the mechanism by which the adhesive 240 spreads into the gap 230 between the base sidewall 212 and the cover sidewall 222 by capillary action will be described.

  Capillarity is a phenomenon in which liquid is drawn to the surface of an object and moved by the adhesion acting between the surface of the object and the liquid molecules against the cohesion force acting between the liquid molecules. The adhesive 240 injected from the opening 223 is attracted to the base side wall 212 and the cover side wall 222 by adhesion, and tries to move so as to spread the gap 230.

  It is shown in FIG. 13A that the height of the base side wall 212 is formed in such a shape as to decrease from the center in the longitudinal direction to both ends as in the base side wall 212 according to the present embodiment. Thus, it is considered that the adhesive 240 attached to the base side wall 212 is collected near the base 11 as it goes to the both ends and is pushed out to the both ends of the gap 230. In addition, when the adhesive 240 is collected near the base 11, it is considered that the adhesive 240 is easily affected not only by the adhesion with the base sidewall 212 but also by the adhesion with the base 211. Therefore, the capillary phenomenon is promoted compared to the case where the height of the base side wall 212 is constant, and the adhesive 240 spreads in the gap 230 in a short time. For this reason, as shown in FIG. 13B, the adhesive 240 injected from the opening 223 spreads speedily and reliably toward both ends of the base side wall 212 due to the penetration force by the capillary phenomenon.

  As described above, in the lens driving device 100 according to this reference example, since the height of the base side wall 212 is formed in a shape that decreases as a whole from the center to the both ends in the longitudinal direction The force is increased, and the adhesive 240 enters the space 230 away from the opening 223 quickly and reliably. Therefore, the gap 230 between the base portion 10 and the cover portion 80 can be sealed in a short time.

(Reference Example 6)
Next, the lens driving device 130 according to the present reference example will be described with reference to FIGS. In the present embodiment, unlike the fifth embodiment, the spreading of the adhesive 240 by capillary action is promoted by devising the shape of the gap 230 between the base sidewall 212 and the cover sidewall 222. The other configuration is substantially the same as the configuration of the fifth embodiment, and in the following, the same or equivalent members will be denoted by the same reference numerals and descriptions thereof will be omitted, and differences will be mainly described.

  FIG. 14A is a side view conceptually showing the configuration of the lens drive device 130 according to the present embodiment, and FIG. 14B is a cross-sectional view of the lens drive device 130 of FIG. FIG. 2 is a cross-sectional view cut along a line.

  As shown in FIG. 14 (b), in the present embodiment, the surface of the base side wall 212 facing the cover side wall 222 is an inclined surface 214. The inclined surface 214 is formed to extend from the upper surface 215 of the base sidewall 212 toward the base 11 to the outside of the base 10. The angle between the outer surface of the base sidewall 212 and the inner surface of the cover sidewall 222 is preferably 45 ° or less. On the other hand, when the cover 80 is attached to the base 10, the cover side wall 222 is disposed in a direction substantially perpendicular to the base 11. Therefore, when the cover 80 is attached to the base 10, the gap 230 between the base sidewall 212 and the cover sidewall 222 is the largest in the vicinity of the upper surface 215 of the base sidewall 212 and gradually approaches the bottom of the base sidewall 212. It is formed to be narrow.

  In the present embodiment, unlike the fifth embodiment, the height of the base sidewall 212 does not have to be formed in a shape that decreases as a whole from the center to the both ends in the longitudinal direction. May have any shape. Further, the opening 223 of the cover 80 is preferably provided at the center of the cover side wall 222 in the longitudinal direction in consideration of the spreadability of the adhesive 240, but it is not always necessary to It is not limited to the center. It may be provided at the end of the cover side wall 222 in the longitudinal direction in consideration of the efficiency of the injection operation of the adhesive 240 and the like, or two or more openings 223 may be provided on one side.

Next, with reference to FIGS. 15 and 16, a method of attaching the cover 80 to the base 10 according to the present embodiment will be described.
FIG. 15 is a side view of the lens driving device 130 according to the present embodiment, and FIG. 16 is a cross-sectional view of the lens driving device 130 of FIG. Fig.15 (a) and Fig.16 (a) are the states which are injecting the adhesive agent 240 to the opening 223 of a cover, FIG.15 (b) and FIG.16 (b) are the adhesive agents 240 by the penetration force by a capillary phenomenon. FIGS. 15 (c) and 16 (c) show the state in which the adhesive 240 has reached the end of the base side wall 212 in the diffused state.

  First, also in the present embodiment, the cover portion 80 is assembled to the base portion 10 as in the fifth embodiment. Next, as shown in FIGS. 15A and 16A, the adhesive 240 is injected from the opening 223 of the cover sidewall 222 toward the gap 230 between the base sidewall 212 and the cover sidewall 222. At this time, since the outer surface of the base side wall 212 is formed as the inclined surface 214 as shown in FIG. 15B, even if the shapes of the base portion 10 and the cover portion 80 have some variations, the gap 230 At any height of the above, it is possible to obtain an appropriate spacing that can reliably generate the penetration force by capillary action. For this reason, as shown in FIGS. 15B and 16B, the adhesive 240 surely spreads in the gap 230 between the base sidewall 212 and the cover sidewall 222.

  Then, as time passes, as shown in FIG. 15C and FIG. 16C, the adhesive 240 reaches both ends of the gap 230. At this time, the adhesive 240 injected into the gap 230 does not completely penetrate uniformly from the center to both ends, and the adhesive 240 which penetrates near the both ends of the gap 230 is an adhesive existing near the center It is also assumed that it is less than 240. However, since the gap 230 is formed so as to narrow toward the base 11 from above, the adhesive 240 which has reached near the both ends is collected toward the lower side of the gap 230 by gravity. Thus, the adhesive 240 collected near the base 11 reliably adheres continuously to the base side surface 212 and the cover side surface 222. For this reason, the adhesive 240 injected into the gap 230 between the base side surface 212 and the cover side surface 222 can penetrate both ends reliably and speedily.

  As described above, in the present embodiment, since the sloped surface 214 extending from the top surface 215 toward the base 11 to the outside of the base portion 210 is formed on the base side wall 212, the adhesive 240 injected into the gap 230. On the other hand, the penetration by capillarity acts reliably, and the gap 230 between the base sidewall 212 and the cover sidewall 222 can be sealed in a short time.

  Further, when the outer surface of the base sidewall 212 is not inclined, depending on the amount of the adhesive 240 injected into the opening 223, the adhesive 240 may overflow from the gap 230 and flow out to the inside of the base sidewall 212. However, in the present embodiment, the outer surface of the base side wall 212 is the inclined surface 214, and the distance from the inner surface of the cover side wall 222 is formed so as to extend upward of the base side wall 212. Therefore, even if the flow rate of the adhesive 240 flowing through the gap 230 slightly fluctuates, the change in the height of the adhesive 240 can be suppressed, and the adhesive 240 can be prevented from overflowing to the inside of the base sidewall 212.

  Furthermore, in the present embodiment, when the cover 80 is attached to the base 10, the sloped surface 214 is formed on the base side wall 212, so that the sloped surface 214 plays a role as a guide to guide the cover side wall 222. become. For this reason, the improvement of the assemblability of the lens drive device 130 which concerns on this reference example is realizable.

(Reference Example 7)
In the lens driving device 130 according to the reference example 6, by inclining the base side wall 212 of the base portion 10, the gap 230 is formed to be wider at the upper side and narrower at the lower side. It is not restricted to this. For example, as shown in FIG. 17A, a part of the inner surface of the cover side wall 222 of the cover 80 may be inclined. Further, as shown in FIG. 17B, both the base side wall 212 of the base portion 10 and the cover side wall 222 of the cover portion 80 may be inclined so as to approach each other downward.

  Moreover, in the lens drive device 130 which concerns on the reference example 6, although the inclined surface 214 of the base side wall 212 was formed in one plane, it is not restricted to this. For example, the inclined surface 214 may be formed into a curved surface that is convex or concave toward the cover side surface 222. In addition, the inclined surface 214 may be formed of a plurality of planes, and a bent portion may be provided in the middle.

(Reference Example 8)
In this embodiment, upper leaf springs 41A, 41B, 41C, 41D to be soldered to the suspension wires 42A, 42B, 42C, 42D in the first embodiment will be described.

  FIG. 18 shows a corner 38B to which the upper flat spring 41B is attached. The corner 38B is different from the corners 38A, 38C, 38D in that the magnet support 35B is formed, but the corner 38A, the attachment of the upper flat springs 41A, 41B, 41C, 41D The structures of 38B, 38C and 38D are all equivalent.

  As shown in FIGS. 3 and 18, the L-shaped wall 311 of the frame 31 at the corner 38B is lower in height in the Z-axis direction than the surface of the spring support 37B at the corner 38B. In addition, a portion including the spring support portion 37B also constitutes another wall portion. An opening 312 is formed to be surrounded by these walls. The spring support portion 37B is also formed with two cylindrical projections 313 projecting forward. The tip of the protrusion 313 is chamfered.

  The upper leaf springs 41A, 41B, 41C, 41D of the present embodiment are all integral plate-like members having the same shape and size. Hereinafter, this embodiment will be described as the upper flat spring 41B. The corners and corners of the upper flat spring 41B in plan view are respectively rounded for the purpose of avoiding stress concentration and the like.

  As shown in FIG. 19, the upper flat spring 41 B has a frame body formed in a substantially right-angled triangle from the oblique side 333, the sides 335 and 336, and the side 336 in the outer peripheral part. The side portion 335 and the side portion 336 have the same predetermined width, and are connected so as to form a right angle at the mountain top portion 334 whose bottom is the oblique side portion 333. A circular positioning hole 331 is formed at the connection between the oblique side 333 and the side 335. At the connection portion between the oblique side 333 and the side 336, a positioning hole 332 is formed which is an oblong hole extending in parallel with the longitudinal direction of the oblique side 333 to facilitate assembly.

  An opening 343 which is a pentagon of deformation is formed inside the frame. Inside the opening 343, the arm 337 advances in a direction from the top 334 toward the oblique side 333. An outer peripheral portion 338, a connection portion 339, a solder connection portion 340, a through hole 341, and a slit 342 are formed at an end of the arm portion 337 on the oblique side 333 side.

  The outer circumferential portion 338 is an annular portion having a circular outer shape. The outer peripheral portion 338 is connected to the end of the arm 337 at one outer position.

  The connection portion 339 is a short band-like portion extending in a band shape toward the inside of the outer peripheral portion 338 from one position of the outer peripheral portion 338 farthest from the arm portion 337 in the circumferential direction.

  The solder connection portion 340 is connected to the end of the connection portion 339. The solder connection 340 is an annular portion having a circular outline. A through hole 341 of such a size as to allow the suspension wire 42B to pass through is formed at the central portion of the solder connection portion 340.

  Between the outer peripheral portion 338 and the solder connection portion 340, a C-shaped slit 342 opened at the position of the connection portion 339 is formed. In the present embodiment, the slits 342 are provided such that the outer peripheral portion 338 and the solder connection portion 340 are concentric. Also, the connecting portion 339 has the same length as the width of the slit 342. The arm portion 337, the outer peripheral portion 338 and the connecting portion 339 have predetermined widths which are slightly narrower than the side portions 335 and 336 in the illustrated example.

  The upper flat spring 41B is determined in shape and size so that the arm 337 is dominant in overall elasticity. The outer peripheral portion 338 and the connecting portion 339 each have a spring constant close to a rigid body as compared with the entire upper leaf spring 41B. In particular, since the connecting portion 339 is configured to have a sufficiently large spring constant relative to the arm 337, the elasticity is dominated by the arm 337.

  FIG. 20 shows an assembled state of the upper flat spring 41B and the suspension wire 42B at the corner 38B of the frame 31. As shown in FIG.

  The upper flat spring 41B is placed at a predetermined position on the spring support 37B by inserting the two projections 313 of the corner 38B into the holes 331 and 332 of the upper flat spring 41B. The upper flat spring 41B is fixed to the spring support 37B by an adhesive.

  The side portions 335 and 336 of the upper flat spring 41 B float from the frame 31 at positions corresponding to one side of the wall portion 311. The opening 343 of the upper flat spring 41 B is disposed at a position substantially corresponding to the opening 312.

  The suspension wire 42B is inserted through the through hole 341 of the upper flat spring 41B. The solder 321 is placed on the solder connection 340. Note that the placement here is not limited to the upper side in the direction of gravity, but refers to being in contact with the surface of the solder connection portion 340. The suspension wire 42B is soldered to the upper flat spring 41B near the front end by the upper flat spring fixing solder 321 which is a coupling member exhibiting conductivity. The rear end of the suspension wire 42B is soldered to the lead frame 25B.

  The solder 321 is formed as, for example, a thread solder or a cream solder. In the case of soldering, for example, a soldering iron, an oven, a hot air, a lamp or the like can be used appropriately for heating. As the solder 321, a solder provided with a conductive solder as a heat melting component and a flux 361 (described later) kneaded into the solder is preferably used. However, in addition to the form in which the solder and the flux are integrated or mixed as described above, for example, a form such as a solder using a flux in soldering may be used.

  In such an assembled state, the upper flat spring 41 B functions as a flat spring fixed to the spring support 37 B at the oblique side 333. The upper flat springs 41A, 41B, 41C, and 41D (leaf springs) in the present specification are springs on which a member such as the coupling member is placed on a plate surface as shown in FIG. Here, as shown in FIG. 3 and FIG. 19 etc., the upper flat springs 41A, 41B, 41C, 41D include a form having holes or openings in the spring region like the through holes 341 etc.

  Next, the comparative example (FIG. 21) and the structure (FIG. 22) in this reference example will be compared and described. In the leaf spring 350 shown in FIG. 21, it is assumed that it is the same as the case of the upper leaf spring 41B for the sake of simplicity, except for the portions described using the reference numerals different from the upper leaf spring 41B.

  In the leaf spring 350 of the comparative example shown in FIG. 21, the arm 351 corresponding to the arm 337 of the present embodiment is extended. A circular connection portion 352 having a through hole at the center portion is provided at the tip of the arm portion 351 similarly to the solder connection portion 340 of the present embodiment. The portions corresponding to the outer peripheral portion 338 and the connecting portion 339 are not formed.

  When the suspension wire 42B and the plate spring 350 are soldered on the connection portion 352, the flux 361 easily wets and spreads from the connection portion 352 in a wide area onto the arm 351 having a relatively narrow width. In FIG. 21 and FIG. 22 described later, only the inner flux 361 of the components of the solder 321 is displayed to facilitate understanding. In the case of the leaf spring 350 of the comparative example, the flux 361 sometimes spreads to the area of the top portion 334 and the side portions 335 and 336 as shown in the drawing. In addition, the dispersion of the wetting and spreading of the flux 361 is likely to occur.

  The wetting and spreading of the flux 361 changes the spring constant of the arm 351. The arm 351 has portions that extend from the top portion 334 toward the opening 343 and a predetermined spring constant that is dominant in the entire leaf spring 350. Therefore, the wetting spread of the flux 361 to the arm 351 in the plurality of leaf springs 350 and the variation thereof become the change of the spring constant and the variation thereof. As a result, when the leaf spring 350 is used for a camera shake correction mechanism, there is a possibility that stable performance can not be obtained by providing an inclination or the like of the support mechanism.

  On the other hand, the upper flat spring 41B in the present embodiment shown in FIG. 22 includes a solder connection portion 340 (first surface), a connecting portion 339 (second surface) protruding from the outer edge portion of the first surface, An outer peripheral portion 338 (third surface) formed in an annular body surrounding the first surface and the second surface and connected to one end of the second portion at the inner side of the annular body; And an arm 337 (fourth surface) connected to the third surface. The first to fourth surfaces are formed as one plane of the plate-like body. As in the case of the arm 351 in the case of the plate spring 350, the arm 337 has each portion advancing from the top portion 334 toward the opening 343 as described above, and has a predetermined predetermined spring constant in the entire plate spring 350. .

  With the above configuration, when the suspension wire 42B and the upper flat spring 41B are soldered on the solder connection portion 340, even if the flux 361 flows out to the outer peripheral portion 338 through the connection portion 339, the flux 361 The degree of wetting and spreading is as shown in FIG. By providing the outer peripheral portion 338, a relatively wide region can be provided up to the arm 337, and the connecting portion 339 can be provided at a position farthest from the arm 337.

  As a result, even if an element whose spring constant changes due to the wetting and spreading of the flux 361 is added in manufacturing, the influence on the spring performance of the entire upper flat spring 41B is suppressed. Therefore, according to the present embodiment, since the change and the variation of the spring constant of the arm 337 which is the dominant spring region are prevented, stable performance can be obtained for the spring constant of the upper flat spring 41B and the shake correction mechanism. .

  Further, by adopting the configuration as in the present embodiment, it is possible to form as a flat surface of the plate-like body without requiring a special three-dimensional addition or processing for stopping the flow of the flux. This makes it possible to suppress an increase in the manufacturing cost of the leaf spring. As in the present embodiment, it is particularly preferable in the case of the upper flat spring 41B all in one plane.

  In this reference example, the wetting and spreading due to the outflow of the flux has been described as an example. However, like the flux, the heat-heated solder itself may also spread in a certain range. Therefore, it is needless to say that there is an effect that the spread of the solder itself is suppressed by the plate spring of the present reference example, similarly to the suppression of the spread of the above-mentioned flux.

  Further, in the present embodiment, as an example, solder is used as a bonding material. Besides, a conductive adhesive (for example, silver paste or the like) may be used as a substitute for solder. The conductive adhesive is applied to the same area as the solder connection 340. When using a conductive adhesive, it can be heated by an oven, a hot air, a lamp or the like as in the case of a cream solder. When heated by heat, the heat-meltable conductive adhesive can spread to a certain extent. Therefore, also in the case of using the conductive adhesive, the spread of the conductive adhesive can be suppressed by the plate spring of the present embodiment, as in the case of the above-described flux or solder itself.

  Further, in the present embodiment, since the suspension wire 42B is premised to be energized, a member having conductivity is selected as the coupling member. However, in the reference example in which the suspension wire portion is not energized, the adhesive used does not necessarily have to exhibit conductivity. For example, a bonding member, such as a light curing adhesive or a heat curing adhesive, may be used which may cause wet spreading. Also in these cases, the spread of the connecting member can be suppressed by the leaf spring of this embodiment.

  Further, in the present embodiment, the outer peripheral portion 338 and the solder connection portion 340 are both formed as a circular ring. This takes into consideration that stress is likely to be concentrated at the location of soldering in the operation of the shake correction mechanism, but it is not limited to a circular shape from the viewpoint of the spring constant, for example, it may be an annular shape such as a polygon or oval. .

  Further, it is within the scope of the present invention to change the shape and size of each part so as not to affect the spring constant of the arm 337. For example, although one connection portion 339 is provided between the outer peripheral portion 338 and the solder connection portion 340, a plurality of connection portions 339 may be provided on the premise that the spread of the flux 361 can be suppressed.

Embodiment 1
The lens driving device 400 according to the present embodiment will be described with reference to FIGS.
In the lens driving device 100 of the first reference example, the OIS magnets 32A and 32B and the AF magnet 35A are provided in the OIS frame unit 30, and the AF position detection magnet 65 is provided in the lens holding unit 60. That is, magnets are dispersedly disposed in the OIS frame portion 30 and the lens holding portion 60 which are two members whose relative positional relationship changes in the Z-axis direction. Therefore, when the AF drive unit 92 drives the lens holding unit 60, the lens holding unit 60 is made precise by the attractive force or repulsive force acting between the AF position detection magnet 65 and the OIS magnet 32A, 32B or the AF magnet 35A. There are cases where drive control can not be performed well. Further, when the AF position detection magnet 65 is fixed to the OIS frame portion 30 and the AF position detection portion 36 is fixed to the lens holding portion 60, the six terminals including the power terminal and the control terminal are wired to the lens holding portion 60. There is a need. However, it is difficult to secure a path for wiring the six terminals to the lens holding unit 60 whose relative position changes.

  In the present embodiment, by fixing the AF position detection magnet to the OIS frame portion provided with another magnet, no attraction or repulsion force is generated by the magnet between the lens holding portion and the OIS frame portion. The present invention provides a configuration for driving and controlling the lens holding unit with high accuracy. In addition, when the AF position detection magnet is fixed to the OIS frame portion and the AF position detection portion and the AF coil are fixed to the lens holding portion, control can be performed by arranging four wires to the lens holding portion. provide.

  The lens driving device 400 according to the present embodiment includes a base portion 410, an OIS frame portion 430, a lens holding portion 460, a lens support portion 470, and a cover portion 480, as shown in FIG. Hereinafter, the configuration of each part of the lens driving device 400 will be described.

(Base part 410)
The base portion 410 is composed of a substantially rectangular resin base 411 having a lead frame (not shown), OIS coils 422A and 422B, and OIS position detectors 423A and 423B.

  The base 411 has a circular opening 415 at the center, and the light transmitted through the lens of the lens barrel passes through the opening 415 and reaches an imaging device (not shown) disposed rearward. The cover portion 480 is attached to the base 411 so as to cover the OIS frame portion 430, the lens holding portion 460, and the lens support portion 470.

Each of the OIS coils 422A and 422B is attached to each of the coil support portions 420A and 420B provided at each of the adjacent corner portions of the base 411. The OIS position detection units 423A and 423B are attached to OIS position detection support units 421A and 421B provided at corners facing the coil support units 420A and 420B, respectively.
Here, the corner of the frame 431 refers to the peripheral area of the corner sandwiched by the two sides forming the corner of the frame 431, and the corner of the frame 431 has an arbitrary shape, and is formed at right angles as illustrated. For example, it may be rounded (having a curvature).

The OIS coil 422A generates a magnetic field that moves the OIS frame portion 430 in the Y-axis direction. In addition, the OIS coil 422B generates a magnetic field that moves the OIS frame unit 430 in the X-axis direction. The OIS coils 422A and 422B face the OIS magnets 432A and 432B of the OIS frame unit 430, respectively, and together form an OIS drive unit that drives the OIS frame unit 430.
The OIS position detectors 423A and 423B face the OIS magnets 434A and 434B of the OIS frame 430, respectively, with respect to the base 410, in the X-axis direction and Y axis of the OIS magnets 434A and 434B of the OIS frame 430. Detect the position in the direction. Thus, the OIS position detection units 423A and 423B can detect the position of the OIS frame unit 430 in the X-axis direction and the Y-axis direction with respect to the base unit 410.

  Holes 425A and 425B for holding the suspension wires 472A, 472B, 472C and 472D electrically connected to the upper leaf springs 471A, 471B, 471C and 471D of the lens support portion 470 in the base 411. , 425C, 425D are provided.

  The respective ends of the suspension wires 472A, 472B, 472C, 472D held in the holes 425A, 425B, 425C, 425D are connected to the lead frame. The lead frames are respectively connected to an external control unit (not shown), and input and output power, signals and the like from the control unit. Power, signals, etc. supplied to the lead frame enter the AF position detection unit 469 of the lens holding unit 460 via the suspension wires 472A, 472B, 472C, 472D and the upper flat springs 471A, 471B, 471C, 471D. It is output.

(OIS frame section 430)
The OIS frame unit 430 houses and holds the lens holding unit 460. The OIS frame unit 430 swings the lens holding unit 460 with respect to the base unit 410 in the X-axis direction and the Y-axis direction.

  The OIS frame unit 430 includes a frame 431 which is a substantially rectangular frame, OIS magnets 432A, 432B, 434A, 434B provided on the frame 431, and an AF position detection magnet 435A.

The OIS magnets 432A, 432B, 434A, 434B are provided on magnet placement portions 433A, 433B, 439A, 439B at the corners of the frame 431, respectively.
The OIS frame unit 430 is disposed such that the OIS magnets 432A, 432B, 434A, 434B face the OIS coils 422A, 422B, OIS position detection units 423A, 423B of the base unit 410, respectively.

  The AF position detection magnet 435A is fixed to a magnet support 435B provided on the inner side of one side of the frame 431.

  The frame 431 accommodates the lens holding portion 460 in the opening 431A. The OIS frame portion 430 is elastically supported by the suspension wires 472 A, 472 B, 472 C, 472 D of the lens support portion 470 so as to be able to swing in the X axis direction and the Y axis direction.

  The frame 431 functions as a holding frame in the claims. In addition, the OIS magnets 432A, 432B, 434A, 434B function as drive magnets in the claims. Further, the AF position detection magnet 435A functions as a position detection magnet in the claims.

(Lens holder 460)
The lens holding unit 460 moves in the Z-axis direction to perform focusing. The lens holding unit 460 is accommodated in the opening 431 A of the frame 431 and is held by the OIS frame unit 430.

  The lens holding unit 460 includes a substantially octagonal cylindrical member 461, an AF coil 462, and an AF position detection unit 469.

  In the cylindrical member 461, a lens barrel attachment portion 474 is formed on the inner side surface of the cylinder, and the lens barrel is attached to the lens barrel attachment portion 474.

  The AF coil 462 is a coil wound around the side surface of the cylindrical member 461. The AF coil 462 is wound in the circumferential direction of the outer periphery of the cylindrical member 461 in the radial direction of the lens incorporated in the lens barrel. When a current flows in the AF coil 462, the AF coil 462 receives a force in the optical axis direction by the magnetic fields of the OIS magnets 432A, 432B, 434A, 434B. The lens holder 460 is held by the force that the AF coil 462 receives from the magnetic field, and the elastic force of the upper flat springs 471A, 471B, 471C, 471D, and the lower flat spring 473.

  The AF position detection unit 469 is disposed outside one side of the lens holding unit 460. The AF position detection unit 469 can detect the position of the lens holding unit 460 in the Z-axis direction with respect to the base unit 410 by detecting the position of the AF detection magnet 435A disposed in the OIS frame unit 430.

  The cylindrical member 461 functions as a lens frame in the claims. Also, the AF coil 462 functions as a drive coil in the claims. In addition, the AF position detection unit 469 functions as a position detection sensor in the claims.

  Furthermore, the AF position detection unit 469 and the AF position detection magnet 435A function as a position detection unit in the claims. Also, the AF coil 462 and the OIS magnets 432A, 432B, 434A, 434B function as drive units in the claims.

(Lens support portion 470)
The lens support portion 470 includes upper leaf springs 471A, 471B, 471C, and 471D, and suspension wires 472A, 472B, 472C, and 472D connected to the upper leaf springs 471A, 471B, 471C, and 47D, and a lower leaf spring 473, It consists of

The suspension wires 472A, 472B, 472C, 472D are made of metal having elasticity and conductivity.
The suspension wires 472A, 472B, 472C, 472D are respectively connected to and fixed to the upper flat springs 471A, 471B, 471C, 471D at the front end. In addition, the rear end portions of the suspension wires 472A, 472B, 472C, and 472D are connected to the lead frame of the base portion 410.

As shown in FIG. 24, each of the upper flat springs 471A, 471B, 471C, and 471D is formed in an arc shape with a frame-shaped plate portion B of a right triangle and an elastic portion S formed in a substantially S shape. And a lead portion L. Each of the upper flat springs 471A, 471B, 471C, and 471D is electrically connected to the AF position detection unit 469. The upper flat springs 471A, 471B, 471C, 471D are made of metal having elasticity and conductivity.
The upper flat springs 471A, 471B, 471C, 471D to which the suspension wires 472A, 472B, 472C, 472D are respectively attached are attached to the front side (the object side of the imaging object) of the OIS frame 430 containing the lens holder 460 It is done.

  The shapes of the plate portion B, the elastic portion S, and the lead portion L are not limited to those described above. For example, the plate portion B may be formed so as to support the suspension wire 472A or the like with a so-called cantilever structure. The plate portion B may have a rounded corner for the purpose of avoiding stress concentration. The elastic portion S may have, for example, a wave-like shape or a shape without bending as long as the plate portion B and the lead portion L can be connected with a certain elasticity.

  Referring back to FIG. 23, the lower flat spring 473 is made of an elastic metal. The lower flat spring 473 is attached to the rear side (image sensor side) of the OIS frame portion 430 in which the lens holding portion 460 is housed.

  With the above-described configuration, the lens support portion 470 supports the lens holding portion 460 in a swingable manner.

  The lens support portion 470 functions as a biasing unit in the claims.

(Cover unit 480)
The cover portion 480 is a cover whose bottom surface is substantially rectangular. The cover 480 covers and protects the OIS frame 430, the lens holder 460, and the lens support 470. The cover 480 is attached to the base 411 of the base 410.
The cover portion 480 has a circular opening 482 at the center of the top surface. The light from the object to be imaged passes through the opening 482 to be incident on the lens barrel, and reaches the imaging element disposed rearward.
In addition, the cover 480 makes the AF position detector 469 be a cover 480 so that the AF position detector 469 does not contact the cover 480 as the lens holder 460 moves in the Z-axis direction. It has an opening 483 to be penetrated.

  According to the lens driving device 400 having the above-described configuration, since the attractive force or the repulsive force due to the magnet does not occur between the lens holding unit 460 and the OIS frame unit 430, the lens holding unit 460 can be driven and controlled with high accuracy.

(Feeding method)
Next, a method of supplying power to the AF coil 462 and the AF position detection unit 469 provided in the lens holding unit 460 will be described with reference to FIG.

In this embodiment, in order to arrange the AF position detection magnet 435A in the OIS frame portion 430 provided with another magnet, the AF position detection portion 469 for detecting the magnetic field by the AF position detection magnet 435A is a lens holder Set at 460.
When the AF position detection unit 469 is provided in the lens holding unit 460, the number of terminals required to supply power or a signal to the lens holding unit 460 is four for the terminals for driving the magnetic sensor and for driving the AF coil 462. The number of terminals is two, for a total of six.

  In the present embodiment, a driver IC is provided in the AF position detection unit 469 to drive the AF coil 462. Therefore, two terminals for driving the AF coil 462 from the outside are unnecessary in the lens holding unit 460. By setting the number of terminals for supplying power or signals to the lens holding unit 460 to four, it is possible to supply power from the four upper flat springs 471A, 471B, 471C, and 471D. The configuration of the AF position detection unit 469 provided with the driver IC will be described below.

  The AF position detection unit 469 includes a controller 469a, a magnetic sensor 469b, an AF control unit 469c, and a driver circuit 469d on an FPC (Flexible Print Circuit).

  The controller 469a receives an input of power from the upper flat springs 471A and 471B, and adjusts the amount of direct current supplied to the magnetic sensor 469b. Further, the controller 469a receives control signals from the upper flat springs 471C and 471D, and supplies the control signals to the AF control unit 469c. The control signal is, for example, a signal indicating the position of the lens holding unit 460 in the Z-axis direction such that the contrast of the captured image is maximized, and controlling the amount of current supplied to the AF coil 462 by the AF control unit 469c. It is a signal which shows the target value of the position of the lens holding part 460 adjusted by this.

  The magnetic sensor 469b is made of a Hall element or the like, and detects a voltage generated when the direct current supplied from the controller 469a receives a magnetic field from the AF position detection magnet 435A. The magnetic sensor 469 b outputs the value of the detected voltage to the AF control unit 469 c.

The AF control unit 469c specifies the position of the lens holding unit 460 with respect to the OIS frame unit 430 based on the value of the voltage output from the magnetic sensor 469b. Further, the AF control unit 469c receives a control signal indicating a target value of the position of the lens holding unit 460 from the controller 469a.
The AF control unit 469c supplies, to the driver circuit 469d, a control signal for moving the lens holding unit 460 to the appropriate position based on the specified position of the lens holding unit 460 and the target signal supplied from the controller 469a. .

  The driver circuit 469d receives an input of power from the upper flat springs 471A and 471B, and further receives a control signal for moving the lens holding unit 460 to an appropriate position from the AF control unit 469c. The driver circuit 469d supplies, to the AF coil, a current having a strength necessary to move the lens holding unit 460 to an appropriate position based on the received control signal.

  In the power supply method according to the present embodiment, the number of terminals required to supply power or a signal to the lens holding unit 460 is four by incorporating the drive and control circuit in the AF position detection unit 469. Thus, the lens holding unit 460 can receive power or a signal from an external control unit (not shown) using the four upper flat springs 471A, 471B, 471C, and 471D. With the above configuration, control from the outside to the lens holding portion 460 can be controlled by four wires, and wiring can be easily performed via the four suspension wires 472A, 472B, 472C, and 472D.

  In the above description, the upper flat springs 471A and 471B supply power and the upper flat springs 471C and 471D supply signals for the sake of convenience, but the order of these symbols is not limited to this and is arbitrary.

(Configuration without camera shake prevention mechanism)
The lens driving device 400 may have a structure without a shake prevention function. In this case, the base portion 410 and the OIS frame portion 430 are integrally formed, and the OIS frame portion 430 does not swing with respect to the base portion 410 in the X axis direction and the Y axis direction. Therefore, the lens driving device 400 does not include the OIS coils 422A and 422B and the OIS position detectors 423A and 423B.

  In addition, when the lens driving device 400 does not have a shake prevention function, the OIS frame unit 430 includes a lead frame (not shown) inside. The lead frame is electrically connected to the four upper flat springs 471A, 471B, 471C, and 471D on the front side of the OIS frame portion 430 by solder or the like.

  Drive and control signals are supplied from the external device to the four terminals of the AF position detection unit 469 through the upper flat springs 471A, 471B, 471C, and 471D and the lead frame.

(Structure of shutter 490 for lens driving device 400)
Next, a shutter structure suitable for the lens driving device 400 according to the present embodiment will be described with reference to FIGS.

  The shutter 490 is a lens shutter disposed on the front side of the lens driving device 400. As shown in FIG. 40, the shutter 490 is disposed on the front side of the lens driving device 400. When the shutter 490 is disposed on the lens driving device 400 and assembled, it becomes as shown in FIG.

Fig.42 (a) is the top view which looked at the lens drive device 400 which concerns on this Embodiment from the front side, FIG.42 (b) is an AA 'line of the lens drive device 400 of Fig.42 (a). It is sectional drawing cut | disconnected.
As shown in FIG. 42B, the shutter 490 has a gap G formed on the rear side. The gap G not only receives the projecting portion from the cover 480 of the lens barrel (not shown) attached to the lens holder 460 when the lens holder 460 moves in the Z-axis direction, but also the AF position detector 469 Receives a protruding portion protruding from the cover portion 480.

FIGS. 43 (a) and 43 (b) are enlarged views of the vicinity of the AF position detector 469 in FIG. 42 (b). FIG. 43 (a) shows the case where there is no displacement of the lens holding portion 460 in the Z-axis direction, and FIG. 43 (b) shows the case where there is a displacement of the lens holding portion 460 in the Z-axis direction.
As shown in FIG. 43B, in the case where there is a displacement of the lens holding portion 460 in the Z-axis direction and the AF position detection portion 469 protrudes from the cover portion 480, the protruding portion is the gap of the shutter 490. Accepted by G. Further, when there is a displacement of the lens holding portion 460 in the Z-axis direction, the protruding portion of the lens barrel (not shown) attached to the lens holding portion 460 is also received by the gap G.
By configuring in this manner, the overall thickness can be reduced.
The gap G may be formed in an apparatus other than the shutter 490. For example, the blade driving device may be formed to drive a shooting blade such as an aperture or an optical filter in cooperation with the lens driving device 400.

  Also, the gap G functions as a recess in the claims.

(Reference Example 9)
Reference Example 9 of the present invention will be described with reference to FIGS.

  The OIS frame portion 30 is supported by the base portion 10 by the suspension wires 42A, 42B, 42C, 42D of the frame support portion 40 as described above. Specifically, as shown in FIG. 26, lower end portions of the suspension wires 42B and 42D are fixed to lead frames 25B and 25D of the base 11 by lead frame (support plate) fixing solders 511B and 511D, respectively.

  The lead frames 25B, 25D are support plates for fixing the suspension wires 42B, 42D.

  Further, upper end portions of the suspension wires 42B and 42D are fixed to the upper leaf springs 41B and 41D of the frame 31 by an upper leaf spring fixing solder 321. The solder for fixing the upper flat spring 41B and the suspension wire 42B is referred to as an upper flat spring fixing solder 321B. The same applies to the following.

  Although only the suspension wire 42B and the suspension wire 42D are illustrated in FIG. 26, the same structure is applied to the suspension wire 42A and the suspension wire 42C which are not illustrated. That is, the suspension wire 42A is fixed to the lead frame 25A and the upper flat spring 41A by the lead frame fixing solder 511A and the upper flat spring fixing solder 321A, respectively. The suspension wire 42C is fixed to the lead frame 25C and the upper flat spring 41C by lead frame fixing solder 511D and the upper flat spring fixing solder 321D, respectively. The same applies to the following, and in the following description, one member will be representatively described.

  The connection structure of the suspension wire 42B, the lead frame 25B and the upper flat spring 41B is shown in FIG. As shown in FIG. 27, the lead frame 25B is provided with a through hole 514B through which the lower end portion (rear end in the front and rear direction of the optical axis) of the suspension wire 42B penetrates. A through hole 341B through which the upper end (front end) of 42B passes is provided. The portion on which the upper flat spring fixing solder 321B of the central portion of the upper flat spring 41B is placed is referred to as a solder connection portion 340B. The same applies to the other members.

  As shown in FIG. 28, in the suspension wire 42B, the portion penetrating through the through hole 341B is fixed by the upper flat spring fixing solder 321B placed on the solder connection portion 340B, and the portion penetrating through the through hole 514B is fixing the lead frame It is fixed by solder 511B. The same applies to the other members.

  As shown in FIG. 29, the lead frame fixing solder 511B is disposed on a surface 523B on the lower side (rear side) of the lead frame 25B. This surface 523B is also referred to as the surface opposite to the surface facing the upper leaf spring 41B of the lead frame 25B, or simply as "one surface" of the lead frame 25B.

  The surface 522B on the upper side (front side) of the lead frame 25B shown in FIG. 29 is also referred to as the surface facing the upper flat spring 41B of the lead frame 25B, or simply the "other surface" of the lead frame 25B.

  As shown in FIG. 31, the upper flat spring fixing solder 321B is disposed on the upper surface (front side) 520B of the solder connection portion 340B of the upper flat spring 41B. This surface 520B is also referred to as the surface opposite to the surface of the upper flat spring 41B opposite to the lead frame 25B, or simply as "one side" of the upper flat spring 41B.

  The surface 521B opposite to the upper surface 520B of the upper leaf spring 41B shown in FIG. 31 is also referred to as the surface facing the lead frame 25B of the upper leaf spring 41B, or simply the "other surface" of the upper leaf spring 41B.

  The lead frame 25B and the suspension wire 42B are fixed by a lead frame fixing solder 511B placed only on one surface 523B side of the lead frame 25B as shown in FIG.

  The reason is that the portion (spring portion) of the suspension wire 42B from the other surface 522B of the lead frame 25B to the other surface 521B of the opposing upper flat spring 41B is a portion functioning as an elastic spring, This is because the spring constant is determined by this length. Therefore, the solder is not attached to the side of the other surface 522B of the suspension wire 42B.

  Specifically, the other surface 522B of the lead frame 25B is a nickel plated surface, and one surface 523B of the lead frame 25B is a gold plated surface.

  The solderability of nickel plating is worse (harder to wet) than the solderability of gold plating. Therefore, even when the lead frame fixing solder 511B flows from the one surface 523B of the lead frame 25B to the other surface 522B through the through hole 514B, it is difficult to spread to the other surface 522B. For this reason, a force acts to hold the lead frame fixing solder 511B, which extends along the suspension wire 42B to the front side of the other surface 522B. As a result, as shown in FIG. 29, the lead frame fixing solder 511B stops at the other surface 522B.

  For example, as in the comparative example shown in FIG. 30, when one surface 523B 'and the other surface 522B' of the lead frame 25B 'are gold plated, the lead frame fixing solder 511B' passes through the through hole 514B 'and the lead frame 25B. It also adheres to the other side 522 B of '. Then, it adheres to the suspension wire 42B 'above the front side of the other surface 522B'. Then, the length of the spring portion showing the elasticity of the suspension wire 42B 'changes, and the spring constant changes. If such a phenomenon occurs in each of the suspension wires 42A, 42B, 42C, 42D, the manner of oscillation of the OIS frame portion 30 may change depending on the direction, which may make it difficult to perform precise anti-shake control.

  The lead frame 25B shown in FIG. 29 is manufactured as follows. The lead frame 25B is made of a plate material of copper (or copper alloy), and both surfaces 522B and 523B are laminated by nickel plating and then gold plating. Then, only the gold plating on the other surface 522B is removed by a laser (or any other method).

  By such a manufacturing method, the surface of one surface 523B of the lead frame 25B is a gold plating layer, and the surface of the other surface 522B is a nickel plating layer exposed. Since the solder wettability of nickel is worse than that of gold, the solder does not spread to the other surface 522B and does not flow upward through the suspension wire 42B.

  The same applies to the solder connection between the upper flat spring 41B and the suspension wire 42B shown in FIG. That is, the upper flat spring 41B and the suspension wire 42B are fixed by an upper flat spring fixing solder 321B placed only on one surface 520B side of the upper flat spring 41B as shown in FIG.

  The other surface 521B of the upper flat spring 41B shown in FIG. 31 is a nickel plated surface, and one surface 520B of the upper flat spring 41B is a gold plated surface. The solderability of nickel plating is worse (harder to wet) than the solderability of gold plating. Therefore, even if the upper leaf spring fixing solder 321B flows from the one surface 520B of the upper leaf spring 41B to the other surface 521B through the through hole 341B, as shown in FIG. 31, the other surface 521B spreads. Stay without.

  The method of manufacturing the upper flat spring 41B is as follows. Both surfaces 520B and 521B of the upper flat spring 41B made of copper (or copper alloy) are coated with nickel and then gold. Then, only the gold plating on the other surface 521B is removed by a laser (or any other method). As a result, one surface 520B of the upper flat spring 41B is gold-plated, and the other surface 521B is exposed to the nickel-plated layer.

  For example, as shown in the comparative example of FIG. 32, when one surface 520B 'and the other surface 521B' of the upper flat spring 41B 'are gold plated, the upper flat spring fixing solder 321B' passes through the through hole 341B '. It also adheres to the other surface 521B 'of the plate spring 41B'. Then, it adheres to the suspension wire 42B 'below (rear side) the other surface 521B'. Therefore, there arises a problem that the length of the spring portion of the suspension wire 42B 'changes.

  Methods of evaluating solder wettability to materials include types such as a wet spread test method, a meniscograph test method, a globule method, a one-end dipping method, and a rotary dipping method. Among them, the wet spread test method and the meniscograph test method are standardized by the IEC (International Electrotechnical Commission), JIS, and EIAJ (the current Information Technology Industries Association). For example, the wetting and spreading test method is defined in JIS Z 3198-3. The solder wettability measured by any of these methods may be compared.

  The spring constants of the suspension wires 42A, 42B, 42C, 42D are made uniform by the reference example as described above, and the spring constant does not change depending on the direction, and the variation of the spring constant for each product can be suppressed. As a result, it is possible to perform precise shake prevention control in a lens drive device mounted on a portable terminal device or the like, in which the length of the suspension wire is required to be shortened particularly in order to thin the entire device. Become.

  In the above-described embodiment, the upper flat spring 41B and the lead frame 25B coupled to the suspension wire 42B supporting the OIS frame portion 30 of the lens driving device 100 to the base portion 10 have been described. However, the invention is not limited to this, and any plate-like member for connecting linear members can be applied to any member. That is, the solder wettability of one surface of the two surfaces and the solder wettability of the other surface of the plate-like member for connecting linear members having a through hole through which the two surfaces are communicated and the linear member penetrates. Can be configured differently.

In the above reference example, the upper plate spring 41B and the lead frame 25B are made of copper (or copper alloy) and coated with nickel and then gold. However, the material used is optional. Also, the number of layers to be plated (coated) is arbitrary. For example, instead of nickel plating, zinc plating may be used, or depending on the required mechanical properties of the members, nickel or iron may be used as the material and the surface may be gold plated. Further, although gold plating is used as the material of the outermost surface, it is not limited to gold plating, and silver, tin, solder or the like having good solder wettability may be coated by plating or the like.
Further, the range of laminating the plating may be partial instead of the entire surface of each surface. Further, the range for removing the plating may not be the entire surface but may be partial.

  In the above reference example, the solder wettability of the two surfaces is changed by removing the gold plating layer on the surface with a laser or the like to expose the lower layer, but the configuration and method of changing the materials of the two surfaces are arbitrary. is there. For example, the two surfaces may be separately formed of different materials, and the method is not limited to plating, and may be bonding or the like. The combination of materials of the two faces is optional as long as the solderability of the two faces can be different.

  In addition, the solder wettability may be changed by performing surface treatment on one surface of the two surfaces. For example, the solder wettability may be made different by performing oxidation treatment on one side, changing the surface roughness, or coating oxide or nitride.

  In the above reference example, in both members of the lead frame 25B and the upper flat spring 41B, the types of plated layers on the two surfaces are changed to make the solder wettability different, but only one of the members has such a configuration It may be

(Reference Example 10)
Reference Example 10 of the present invention will be described with reference to FIGS. 26 to 28 and 33 to 39. FIG.

  The OIS frame portion 30 is supported by the base portion 10 by the suspension wires 42A, 42B, 42C, 42D of the frame support portion 40 as described above. Specifically, as shown in FIG. 26, lower end portions of the suspension wires 42B and 42D are fixed to lead frames 25B and 25D of the base 11 by lead frame (support plate) fixing solders 511B and 511D, respectively.

  The lead frames 25B, 25D are support plates for fixing the suspension wires 42B, 42D.

  Further, upper end portions of the suspension wires 42B and 42D are fixed to the upper leaf springs 41B and 41D of the frame 31 by an upper leaf spring fixing solder 321. The solder for fixing the upper flat spring 41B and the suspension wire 42B is referred to as an upper flat spring fixing solder 321B. The same applies to the following.

  Although only the suspension wire 42B and the suspension wire 42D are illustrated in FIG. 26, the same structure is applied to the suspension wire 42A and the suspension wire 42C which are not illustrated. That is, the suspension wire 42A is fixed to the lead frame 25A and the upper flat spring 41A by the lead frame fixing solder 511A and the upper flat spring fixing solder 321A, respectively. The suspension wire 42C is fixed to the lead frame 25C and the upper flat spring 41C by lead frame fixing solder 511D and the upper flat spring fixing solder 321D, respectively.

  The connection structure of the suspension wire 42B, the lead frame 25B and the upper flat spring 41B is shown in FIG. As shown in FIG. 27, the lead frame 25B is provided with a through hole 514B through which the lower end portion (rear end in the front and rear direction of the optical axis) of the suspension wire 42B penetrates. A through hole 341B through which the upper end (front end) of 42B passes is provided. The portion on which the upper flat spring fixing solder 321B of the central portion of the upper flat spring 41B is placed is referred to as a solder connection portion 340B. The same applies to the other members.

  As shown in FIG. 28, in the suspension wire 42B, the portion penetrating through the through hole 341B is fixed by the upper flat spring fixing solder 321B placed on the solder connection portion 340B, and the portion penetrating through the through hole 514B is fixing the lead frame It is fixed by solder 511B. The same applies to the other members.

  In order to fix the suspension wire 42B to the lead frame 25B and the upper flat spring 41B by soldering as shown in FIG. 28, first, as shown in FIG. 27, the suspension wire 42B is passed through the through hole 514B of the lead frame 25B and the upper flat spring. It is necessary to insert the through hole 341B of 41B. The same applies to the other members.

  Hereinafter, a method of simultaneously inserting the suspension wire 42B and the suspension wire 42D into the through hole 341B, the through hole 514B and the through hole 341D, and the through hole 514D will be described. First, since the position alignment of the frame 31 and the base 11 is performed, the method will be described.

  As shown in the coordinate axes in the figure, the horizontal axis of the figure is the X axis, the direction orthogonal to the back of the figure is the Y axis, and the X axis and the Y axis are as shown in the coordinate axes in the following description. The orthogonal direction (vertical direction in the figure) is taken as the Z axis. The Z-axis direction is the vertical direction when working, and is also referred to as the "up" direction or the "down" direction.

  First, as shown in FIG. 33A, the frame 31 with the upper flat springs 41B and 41D attached is placed on the work table 505 (usually, the frame 31 with all the upper flat springs 41A, 41B, 41C and 41D attached is I will use it, but I will explain here only at two places). This position is arbitrary. The work surface of the work table 505 is parallel to the XY plane. The lens holding unit 60 is attached to the frame 31. Note that FIG. 33 is simplified for ease of understanding, and so forth.

  Place the base 11 to which the lead frames 25B and 25D are attached at a predetermined position on the work table 505 (usually, the base 11 to which all the lead frames 25A, 25B, 25C, and 25D are attached is used. explain). This position is a position directly below the first camera 535 described later.

  The upper flat springs 41B and 41D have upper flat spring through holes 341B and 341D, respectively. The lead frames 25B and 25D have lead frame (support plate) through holes 514B and 514D, respectively.

  Next, as shown in FIG. 33B, the frame holding robot 530 holds and lifts the frame 31 (hereinafter simply referred to as “frame 31”) to which the upper flat springs 41B and 41D are attached. The method of holding is optional.

  Next, as shown in FIG. 33C, the base 11 (hereinafter, simply referred to as “base 11”) attached with the lead frames 25B and 25D is photographed from above using the first camera 535 installed in advance. . Further, the frame holding robot 530 brings the frame 31 onto the second camera 536 installed in advance, and shoots from the bottom with the second camera 536. The positions of the first camera 535 and the second camera 536 are fixed, and the coordinates of the three-dimensional space including the positions of the first camera 535 and the second camera 536 are determined in advance.

  Next, the image taken by the first camera 535 is analyzed to determine a line segment S1 connecting the centers of the lead frame through holes 514B and 514D. To determine the line segment S1 is to determine the coordinates of both ends of the line segment S1 (the centers of the lead frame through holes 514B and 514D), thereby determining the length L1 and direction of the line segment S1. .

  Then, as shown in FIG. 33 (d), the line segment S1 is set virtually so as to be placed vertically above the bottom surface of the base 11 by the distance H1 while keeping the length L1 and direction. ). Thus, the relative positional relationship between the lead frame through holes 514B and 514D and the line segment S1 is determined.

  Similarly, the image taken by the second camera 536 is subjected to image analysis to determine a line segment S2 connecting the centers of the upper leaf spring through holes 341B and 341D. Determining the line segment S2 is to determine the coordinates of both ends of the line segment S2 (the centers of the upper flat spring through holes 341B and 341D), thereby determining the length L2 and direction of the line segment S2. Ru.

  Then, as shown in FIG. 33 (d), the line segment S2 is set virtually so that it is placed vertically downward at a distance H2 from the upper surface of the frame 31 while keeping the length L2 and direction. ). Thus, the relative positional relationship between the upper leaf spring through holes 341B and 341D and the line segment S2 is determined.

  Next, as shown in FIG. 34 (e), while the relative positional relationship G2 between the frame 31 and the line segment S2 is held, the line segment S2 holds the relative positional relationship G1 with the base 11 Calculate the movement path for moving the line segment S2. Then, the frame 31 is moved using the frame holding robot 530 in accordance with the movement path.

To overlap the line segment S2 and the line segment S1 means that the middle point M1 of the line segment S1 (or near the middle point M1, hereinafter referred to as the “middle point M1”) and the line segment as shown in FIG. The middle point M2 (or near the middle point M2, hereinafter collectively referred to as "middle point M2") of S2 is made to coincide, and the direction of the line segment S1 and the direction of the line segment S2 are made to coincide. Therefore, parallel movement to move the midpoint M2 to the position of the midpoint M1 and rotational movement to match the direction are performed.
Note that “in the vicinity” means the vicinity of a range in which an error does not substantially occur in the positions of both ends of the line segment.

  Specifically, in order to determine the route for moving the middle point M2 to the position of the middle point M1, each movement distance in the X-axis, Y-axis, and Z-axis directions from the coordinates of the middle point M2 and the middle point M1 And calculate the movement direction. At the same time, a rotation angle and a rotation direction for making the line segment S2 coincide with the line segment S1 are calculated centering on the middle point M2. In addition, since line segment S1 and line segment S2 are both on the XY plane, rotation is performed in the XY plane.

  The frame holding robot 530 is used to move the frame 31 in accordance with the calculated axial movement distance and movement direction, rotation angle and rotation direction.

  The reason for matching the middle point M1 of the line segment S1 and the middle point M2 of the line segment S2 is as follows. The line segment S1 and the line segment S2 are designed and manufactured so as to have the same length, but they do not necessarily coincide due to errors in manufacturing and errors in image shooting and image analysis. The error is equally distributed to both ends of the line segments S1 and S2 and distributed to the displacement of the upper leaf spring through hole 341B and the lead frame through hole 514B and the displacement of the upper leaf spring through hole 341D and the lead frame through hole 514D. It is.

  For example, when the ends of the line segment S1 and the line segment S2 are aligned and coincided, an error is wrinkled at the opposite end. Therefore, it is necessary to give the through-hole at the end on the opposite side a margin for absorbing the error. However, if the middle points of the line segments S1 and S2 coincide with each other, errors can be distributed to both sides. Thereby, the margin of the diameter of the through hole can be reduced compared to the case where all the errors are wrinkled on one side.

  Next, as shown in FIG. 34 (g), after the line segment S1 and the line segment S2 are made to coincide with each other, the frame holding robot 530 holding the frame 31 is lowered vertically downward while maintaining its direction. When it reaches the position of the spacer 538 having a thickness of, the frame 31 is released and placed on the base 11 via the spacer 538.

  By the above-described operation, the lead frame through holes 514B and 514D and the upper leaf spring through holes 341B and 341D are aligned and arranged so as to correspond to the vertical direction.

  FIG. 39 shows the above alignment method in the form of a flowchart.

  First, the first target point group of two or more points and the second target point group of the same number as the first target point group are photographed respectively (step S1). In the above reference example, the first target point group is the lead frame through holes 514B and 514D, and the second target point group is the upper leaf spring through holes 341B and 341D.

  Next, the first target point group and the second target point group are subjected to image processing (step S2). Next, the coordinates of the first target point group and the second target point group are determined (step S3).

  Next, first and second line segments or polygonal surfaces connecting the first and second target point groups are determined (step S4). In the above reference example, the first line segment is S1, and the second line segment is S2.

  Next, the positional relationship between the first target point group and the first line segment or polygonal surface is determined (step S5). In the above-described reference example, the line segment S1 is placed vertically above the bottom surface of the base 11 by the distance H1.

  Next, the positional relationship between the second target point group and the second line segment or polygonal surface is determined (step S6). In the above-described reference example, the line segment S2 is placed vertically below the top surface of the frame 31 by the distance H2.

  Next, a movement path (each axis movement distance and movement direction, rotation angle and rotation direction) of overlapping the first and second line segments or polygonal surfaces is calculated (step S7). In the above-mentioned reference example, in order to overlap line segment S2 on line segment S1, it is calculating the movement path which moves line segment S2.

  Next, the second target point group is moved according to the movement route (step S8). In the above reference example, the frame 31 (upper leaf spring through holes 341B, 341D) is moved using the frame holding robot 530 in accordance with the calculated movement path.

  By such an operation, the first target point group and the second target point group can be aligned with high accuracy.

  Next, a method of aligning the suspension wires 42B and 42D with the upper flat spring through holes 341B and 341D will be described from the state of FIG. 34 (g). Basically, the method is the same as the method for aligning the frame 31 and the base 11 described above.

  As shown in FIG. 35H, the frame 31 placed on the base 11 is photographed from above using the first camera 535. Further, the jig holding robot 531 holding the wire holding jig 532B holding the suspension wire 42B and the wire holding jig 532D holding the suspension wire 42D is photographed by the second camera 536 from below.

  The jig holding robot 531 holds the wire holding jigs 532B and 532D at a designed spacing of the suspension wires 42B and 42D.

  Next, the image taken by the first camera 535 is subjected to image analysis to determine a line segment S3 connecting the centers of the upper leaf spring through holes 341B and 341D. To determine the line segment S3 is to determine the coordinates of both ends of the line segment S3 (the centers of the upper flat spring through holes 341B and 341D), thereby determining the length L3 and direction of the line segment S3. be able to.

  Then, as shown in FIG. 35 (i), while keeping the line segment S3 in the direction of the length L3, the vertically upper portion (upward in the Z-axis direction) separated by the distance H3 from the upper surface of the upper leaf spring through holes 341B and 341D. Virtually set (determine the coordinates) to place in. Thus, the relative positional relationship between the upper leaf spring through holes 341B and 341D and the line segment S3 is determined.

  Similarly, the image taken by the second camera 536 is analyzed to determine a line segment S4 connecting the centers of the tips 540B and 540D of the suspension wires 42B and 42D shown in FIG. 35 (h). To determine the line segment S4 is to determine the coordinates of both ends of the line segment S4 (the centers of the tips 540B and 540D of the suspension wires 42B and 42D, respectively), and thereby the length L4 of the line segment S4 and the direction It can be decided.

  Then, as shown in FIG. 35 (i), keeping the line segment S4 in the direction of the length L4, the wire holding jigs 532B and 532D are separated vertically downward (downward in the Z-axis direction) by the distance H4. Virtually set (determine the coordinates) to place. Thus, the relative positional relationship between the tips 540B and 540D and the line segment S4 is determined.

  Next, as shown in FIG. 35 (j), while holding the relative positional relationship G4 between the tips 540B and 540D and the line segment 4, the relative positional relationship G3 with the upper leaf spring through holes 341B and 341D is The movement path is calculated so that the line segment S4 overlaps the line segment S3 being held, and the jig holding robot 531 is moved as shown by the arrow.

  To overlap the line segment S4 and the line segment S3, as shown in FIG. 36 (k), the middle point M3 of the line segment S3 (or near the middle point M3, hereinafter collectively referred to as "middle point M3." Near "is And the middle point M 4 of the line segment S 4 (or near the middle point M 4, hereinafter collectively referred to as “middle point M 4.“ Nearby ”is as described above) and the line This is to make the direction of the minute S3 coincide with the direction of the line segment S4. The method of determining the movement path for overlapping the line segment S4 and the line segment S3 and the reason for matching the middle point M3 of the line segment S3 and the middle point M4 of the line segment S4 are as described above.

  By the above operation, the tips 540B and 540D of the suspension wires 42B and 42D are aligned with the upper leaf spring through holes 341B and 341D, respectively. At this time, the distance between the tips 540B and 540D of the suspension wires 42B and 42D and the upper leaf spring through holes 341B and 341D should be as small as possible in consideration of the insertion operation. Therefore, the distance between H3 and H4 is set so that the total distance between H3 and H4 is as small as possible.

  Finally, as shown in FIG. 36 (l), when the suspension wires 42B and 42D are respectively inserted vertically from the wire holding jigs 532B and 532D or dropped downward, the suspension wires 42B and 42D are respectively inserted into the upper leaf spring through holes 341B. It is inserted through the lead frame through hole 514B, the upper flat spring through hole 514D and the lead frame through hole 341D.

  As described above, by aligning the suspension wires 42B and 42D to be inserted with the upper flat spring through holes 341B and 341D, it is possible to simultaneously align and insert two wires and two through holes with high accuracy. The margin of the diameter of the upper leaf spring through holes 341B and 341D can be made smaller than the diameter of the suspension wires 42B and 42D.

  In the prior art, when two wires are to be inserted simultaneously into two through holes, the diameter of the suspension wire needs to be 1, and the diameter of the through holes through which it passes needs to be more than 5. For example, the diameter of the suspension wire 42B has to be 0.05 mm, and the diameter of the upper leaf spring through hole 341B has to be larger than 0.25 mm.

However, in this reference example, when the diameter of the suspension wire is 1, the diameter of the through hole can be 5.0 or less, preferably 4.0 or less, more preferably 3.0 or less, more preferably 1 .3 or less, more preferably 1.2 or less, still more preferably 1.1 or less.
Further, the shape of the through hole is not limited to the circular cross-sectional shape, and may be a shape into which the suspension wire can be inserted, and examples thereof include a polygonal shape and an elliptical shape. In this case, when the cross-sectional area of the suspension wire is 1, the area of the through hole can be 25.0 or less, preferably 9.0 or less, more preferably 4.0 or less, still more preferably 1.1. It is below.

(Reference Example 11)
Next, a method of simultaneously inserting the three suspension wires 42A, 42B, 42C will be described. In addition, since the basic method is the same as that of the case of two, the part which overlaps with the above-mentioned description abbreviate | omits description suitably.

  First, using the first camera 535, the base 11 shown in FIG. 37 is photographed from above the lead frame through holes 514A, 514B, and 514C. Further, the frame 31 shown in FIG. 38 (viewed from the lower side) is carried on the second camera 536 by the frame holding robot 530, and the second flat plate camera 536 is inserted into the upper leaf through holes 341A, 341B, 341C from the bottom. Take a picture.

  Next, the image taken by the first camera 535 is subjected to image analysis, and a triangular surface D1 connecting the centers of the lead frame through holes 514A, 514B, 514C is determined as shown in FIG. To determine the triangular surface D1 is to determine the coordinates of each vertex of the triangular surface D1 (the center of each of the lead frame through holes 514A, 514B, 514C), and thereby the shape and direction of the triangular surface D1. Can be determined.

  Then, the triangle surface D1 is virtually set (coordinates are determined) to be placed vertically above the bottom surface of the base 11 by a predetermined distance while maintaining the shape and the direction. Thus, the relative positional relationship between the lead frame through holes 514A, 514B, 514C and the triangular surface D1 is determined.

  Similarly, the image taken by the second camera 536 is subjected to image analysis, and as shown in FIG. 38, a triangular surface D2 connecting the centers of the upper leaf spring through holes 341A, 341B, 341C is determined. Determining the triangular surface D2 is to determine the coordinates of each vertex of the triangular surface D2 (the center of each of the upper flat spring through holes 341A, 341B, 341C), and thereby the shape of the triangular surface D2 and The direction can be determined.

  Then, the triangular face D2 is virtually set (coordinates are determined) to be placed vertically downward at a predetermined distance from the upper surface of the frame 31 while maintaining its shape and direction. Thereby, the relative positional relationship between the upper leaf spring through holes 341A, 341B, 341C and the triangular surface D2 is determined.

  Next, in order to overlap the triangular surface D2 on the triangular surface D1 which holds the relative positional relationship with the base 11 while maintaining the relative positional relationship between the frame 31 and the triangular surface D2, the triangular surface D2 is formed. Calculate the movement path to move the Then, a path for moving the frame 31 using the frame holding robot 530 is determined in accordance with the movement path.

The overlapping of the triangular surface D2 and the triangular surface D1 means that the center of the triangular surface D1 (or near the center, hereinafter referred to as "center") and the center of the triangular surface D2 coincide with each other, and the triangular surface D1 And the shape of the triangular surface D2 are made to match. To match the shapes means to rotate and arrange such that, when the centers are matched, the sum of the respective distances between the vertex of the triangular surface D1 and the corresponding vertex of the triangular surface D2 becomes the smallest.
The center of the triangle may be the center of gravity. In addition, "near" means the vicinity of the range in which the difference | error about the vertex position of a substantially triangular surface does not arise.

  In order to determine a path for moving the center of the triangular surface D1 to the position of the center of the triangular surface D2, the movement distance and the movement direction of each of the X axis, Y axis, and Z axis directions are calculated. The rotation angle and the rotation direction for making the triangular surface D1 and the triangular surface D2 coincide with each other about the center of D1 are calculated.

  Since the triangular surface D2 and the triangular surface D1 are on the XY plane, rotation for matching the shape is performed in the XY plane.

  Then, the frame holding robot 530 is used to move the frame 31 in accordance with the calculated movement distance and movement direction of each axis, and the rotation angle and rotation direction.

  By doing this, it is possible to overlap the three upper leaf spring through holes 341A, 341B, 341C and the three lead frame through holes 514A, 514B, 514C in a state where the errors are dispersed as much as possible.

  Next, after overlapping the triangular surface D1 and the triangular surface D2, the frame holding robot 530 holding the frame 31 is lowered vertically while keeping its direction, and the spacer 538 having a predetermined thickness is obtained. Once in position, the frame 31 is released and placed on the base 11 via the spacer 538.

  By the above-described operation, the lead frame through holes 514A, 514B, and 514C and the upper leaf spring through holes 341A, 341B, and 341C are aligned and disposed so as to correspond to the vertical direction.

  Next, a method of aligning the suspension wires 42A, 42B, 42C with the positions of the upper flat spring through holes 341A, 341B, 341C will be described.

  The frame 31 placed on the base 11 is photographed from above using the first camera 535. In addition, a jig holding robot 531 (see FIG. 12) holding a wire holding jig 532A holding the suspension wire 42A, a wire holding jig 532B holding the suspension wire 42B, and a wire holding jig 532C holding the suspension wire 42C (see FIG. The image is taken from below with the second camera 536).

  The jig holding robot 531 holds the wire holding jigs 532A, 532B, 532C at a designed spacing of the suspension wires 42A, 42B, 42C.

  Next, the image captured by the first camera 535 is analyzed to determine a triangular surface D3 (not shown) connecting the centers of the upper flat spring through holes 341A, 341B, and 341C. Determining the triangular surface is to determine the coordinates of each vertex of the triangular surface (the center of each of the upper flat spring through holes 341A, 341B and 341C), thereby determining the shape and direction of the triangular surface D3. It can be decided.

  Then, while keeping the shape, the virtual face is set virtually (coordinates are determined) to be placed vertically above the upper surface of the upper leaf spring through holes 341A, 341B, 341C by a predetermined distance. Thereby, the relative positional relationship between the upper flat spring through holes 341A, 341B, 341C and the triangular surface is determined.

  Similarly, the image taken by the second camera 536 is analyzed, and the coordinates of the triangle D4 (not shown) corresponding to the tips 540A, 540B, 540C of the suspension wires 42A, 42B, 42C are determined. The position is virtually set, and the relative positional relationship is determined.

  Next, the jig holding robot 531 is moved so as to overlap the triangular surface D3 and the triangular surface D4 while maintaining the relative positional relationship of each. Then, in a state where the triangular surface D3 and the triangular surface D4 are overlapped, the three suspension wires 42A, 42B, 42C are simultaneously and accurately inserted by inserting or dropping the suspension wires 42A, 42B, 42C vertically downward. Can.

  Thereby, the margin of the diameter of the through hole when inserting the suspension wires 42A, 42B, 42C, that is, the ratio of the diameter of the through hole to the diameter of the suspension wire can be made smaller.

  According to the above configuration, the alignment between two or more target points and the corresponding two or more different target points can be simultaneously and accurately performed. By applying the suspension wire into the through hole as in the above reference example, the suspension wire can be reliably inserted even if the ratio of the diameter of the through hole to the diameter of the suspension wire is reduced. .

  When applied to the insertion step of the suspension wire in the lens drive having a mechanism for preventing hand movement, the diameter of the through hole can be made closer to the diameter of the suspension wire, and the gap between the through hole and the suspension wire It is possible to suppress the flow of the solder, the spring constant of the suspension wire is less likely to change, and it becomes possible to manufacture a lens drive device having a high precision camera shake prevention function.

  In the above reference example, predetermined two or three suspension wires were simultaneously inserted. However, the number and combination of the suspension wires to be inserted are not limited to this and are arbitrary. For example, the suspension wires 42A and 42B may be inserted simultaneously. However, as long as possible between the two object points is preferable in terms of reducing the error.

  In the case of three wires, the suspension wires 42A, 42C, 42D may be combined. Also, four may be aligned and inserted simultaneously. In the case of four, the center of the square may be the center of gravity, or may be the intersection of two diagonal lines. The vertex alignment may be performed in the same manner as the triangular surface.

  In the reference example, the end 540B of the suspension wire 42B and the like are set as the target points. However, the target point is not limited to this. For example, when the wire end is small and image recognition is difficult, the end of the wire holding jig 532B or the like (if the end can be recognized as a circle, the center thereof) may be selected as the target point.

  In the reference example, the line segments S1 and S2 and the triangular surfaces D1 and D2 are on the XY plane. That is, one target point group is in one XY plane. However, the arrangement of the target point group is not limited to this and is arbitrary. That is, one target point group may be separated from each other in the Z-axis direction. In this case, after matching the middle point and the center of gravity, the rotation for overlapping the direction and the shape may be a three-dimensional rotation.

  In the reference example, the frame 31 is moved so that the line segment S2 matches the line segment S1. However, the object to be moved is not limited to this and is arbitrary. The base 11 may be moved so as to make the line segment S1 coincide with the line segment S2 while holding the base 11 in a movable state. Alternatively, both may be moved to match at any position.

Second Embodiment
The lens driving device 600 according to the present embodiment will be described with reference to FIGS. The lens drive device 600 is a device that performs autofocus control of the lens. The lens drive device 600 includes a base portion 610, a drive magnet group 630, a lens holding portion 660, a lens support portion 670, and a cover portion 680, as shown in FIG. Combining these configurations, the lens driving device 600 has a shape as shown in FIG.
Hereafter, each part which comprises the lens drive device 600 is demonstrated.

(Base part 610)
Referring back to FIG. 44, the base portion 610 is composed of a substantially rectangular resin base 611. Inside the base 611, four lead frames insulated from each other are arranged.

  A circular opening 615 is formed in the center of the base 611. The light transmitted through the lens of the lens barrel passes through the opening 615 and reaches an imaging device (not shown) disposed rearward. A cover portion 680 is attached to the base 611 so as to cover the drive magnet group 630, the lens holding portion 660, and the lens support portion 670.

Contact portions 625A, 625B, 625C, 625D electrically connected to lower leaf springs 673A, 673B, 673C, 673D of the lens support portion 670 described later are disposed at four corners of the base 611. .
Here, the corner portion of the base 611 refers to a peripheral region of the corner sandwiched by two sides forming the corner of the base 611, and the corner shape of the base 611 is arbitrary, and is formed at a right angle as illustrated. For example, it may be rounded (having a curvature).

  Each of the contact portions 625A, 625B, 625C, 625D is electrically connected to the end of each of the four lead frames disposed inside the base 611. The contact portions 625A, 625B, 625C, 625D are terminals 625'A, 625'B, 625'C, 625'D shown in FIG. 46 when the lens driving device 600 is viewed from the rear side via the lead frame of the base 611. , Are electrically connected.

  The terminals 625'A, 625'B, 625'C, 625'D are connected to an external device. Power and control signals supplied from an external device shown in FIG. 25 pass through the lead frame of the base 611, the contact portions 625A, 625B, 625C and 625D, and the lower flat springs 673A, 673B, 673C and 673D, and an AF position described later The signal is supplied to the detection unit 669.

  Returning to FIG. 44, on one side of the base 611, a magnet support frame 635B is formed to be erected, in which the AF position detection magnet 635A is fitted and supported. The magnet support frame 635B causes the AF position detection magnet 635A to face the AF position detection unit 669.

  The base portion 610 functions as a base frame in the claims. Further, the AF position detection magnet 635A functions as a position detection magnet in the claims.

(Driving magnet group 630)
The drive magnet group 630 includes four drive magnets 632A, 632B, 634A, 634B. The drive magnets 632A, 632B, 634A, 634B are disposed between the corner of the upper leaf spring 671 of the lens support 670 described later and the lower leaf springs 673A, 673B, 673C, 673D. The definition of the corner of the upper flat spring 671 conforms to the definition of the corner of the base 611.
The driving magnet group 630 is disposed to face the AF coil 662 of the lens holding unit 660.

The front side of the drive magnet group 630, the upper flat spring 671, a spacer 675 to be described later, and a cover 680 are adhered to each other. The front side of the drive magnet group 630 is bonded to the upper surface of the cover portion 680 via an upper flat spring 671 and a spacer 675. Further, an adhesive is filled between the side surface of the cover portion 680 and the surface of the drive magnet group 630 opposed to the side surface, and the corresponding surface of the drive magnet group 630 is adhered to the side surface of the cover portion 680 It is done.
Furthermore, since the cover portion 680 is bonded to the base 611 of the base portion 610, the drive magnet group 630 is designed so that the position thereof does not change relative to the base portion 610. Therefore, the relative positional relationship between the drive magnet group 630 and the AF position detection magnet 635A does not change even if the lens holder 660 moves in the Z-axis direction.

  The drive magnet group 630 functions as a drive magnet in the claims.

(Lens holder 660)
The lens holding unit 660 moves in the Z-axis direction to perform focusing. The lens holding portion 660 is housed in the opening 615 of the base portion 610, and is swingably supported by the upper leaf spring 671 and the lower leaf springs 673A, 673B, 673C, 673D of the lens support portion 670.

  The lens holding unit 660 includes a substantially octagonal cylindrical member 661, an AF coil 662, and an AF position detection unit 669.

  A lens barrel attachment portion 674 is formed on the inner side surface of the cylindrical member 661, and the lens barrel is attached to the lens barrel attachment portion 674.

FIG. 47 (a) is a plan view of the lens driving device 600 according to the present embodiment as viewed from the front side (object side to be imaged), and FIG. 47 (b) is a lens driving device 600 of FIG. Is a cross-sectional view taken along the line AA '.
As shown in FIG. 47 (b), a winding groove 661A for winding the AF coil 662 is formed on the outer peripheral surface of the cylindrical member 661, and the AF coil 662 is formed in the winding groove 661A, It is wound in the circumferential direction of the lens incorporated into the lens barrel. The winding groove 661A is formed with a depth such that the AF coil 662 does not protrude from the outer peripheral surface of the cylindrical member 661 when the AF coil 662 is wound.

  Further, as shown in FIG. 47B, the AF position detection unit 669 is disposed on one side surface of the lens holding unit 660 so as to cover the AF coil 662. The AF position detection unit 669 can detect the position of the lens holding unit 660 in the Z-axis direction with respect to the base unit 610 by detecting the magnetic field generated by the AF position detection magnet 635A disposed in the base unit 610.

  The cylindrical member 661 functions as a lens frame in the claims. The AF coil 662 functions as a drive coil in the claims. In addition, the AF position detection unit 669 functions as a position detection sensor in the claims.

  Furthermore, the AF position detection unit 669 and the AF position detection magnet 635A are configured as a position detection unit in the claims. The AF coil 662 and the drive magnet group 630 are configured as a drive unit in the claims.

(Lens support 670)
The lens support portion 670 is configured of an upper flat spring 671, lower flat springs 673 A, 673 B, 673 C, 673 D, and a spacer 675.

  The upper flat spring 671 is a substantially rectangular frame member having four corner portions as shown in FIG. The upper flat spring 671 is made of elastic metal and is provided on the front side of the lens holding portion 660.

  Each of the lower flat springs 673A, 673B, 673C, 673D is made of metal having elasticity and conductivity. The shapes of the lower flat springs 673A, 673B, 673C, and 673D conform to the upper flat springs 471A, 471B, 471C, and 471D of the first embodiment. The lower flat springs 673A, 673B, 673C, and 673D are provided on the rear side (the imaging device side) of the lens holding portion 660.

  The spacer 675 is a substantially rectangular frame member having four corner portions, as shown in FIG. The spacer 675 is formed to fill the space between the cover portion 680 and the upper flat spring 671.

  A driving magnet group 630 and a lens holding portion 660 are disposed between the upper flat spring 671 and the lower flat springs 673A, 673B, 673C, and 673D. The drive magnet group 630 is bonded to the cover 680 bonded to the base 611 so that the position from the base 610 does not change. Further, the lens holding portion 660 is held by the lens support portion 670 so as to be able to swing in the Z-axis direction.

  The upper flat spring 671 and the lower flat springs 673A, 673B, 673C, and 673D of the lens support portion 670 function as biasing means in the claims.

(Cover part 680)
The cover portion 680 is a cover whose bottom surface is substantially rectangular. The cover 680 covers and protects the drive magnet group 630, the lens holder 660, and the lens support 670. The cover 680 is attached to the base 611 of the base 610.
The cover portion 680 has a circular opening 682 at the center of the top surface. The light from the imaging target passes through the opening 682 to be incident on the lens barrel and reaches the imaging element disposed rearward.

  The procedure of focus control in the present embodiment conforms to that of the first embodiment. Also, the cover 680 functions as a cover in the claims.

  According to the lens driving device 600 having the above-described configuration, since the attraction or repulsion by the magnet does not occur between the lens holding portion 660 and the base portion 610, the lens holding portion 660 can be driven and controlled smoothly.

  The above embodiments, reference examples and modifications are exemplifications, and the present invention is not limited to these, and various embodiments are possible without departing from the scope of the invention described in the claims. It is. The components described in each embodiment, reference example, and modification can be freely combined. The invention equivalent to the invention described in the claims is also included in the invention.

  Although a part or all of the above-mentioned embodiment may be described as the following supplementary notes, it is not limited to the following.

(Supplementary Note 1)
With the lens frame,
A support frame which elastically supports the lens frame in the optical axis direction via a leaf spring;
A position detection unit that detects the position of the lens frame in the optical axis direction;
A driving unit configured to drive the lens frame in the optical axis direction based on the position of the lens frame in the optical axis direction detected by the position detection unit;
The position detection unit is
Position detection magnet,
A position detection sensor that specifies the position of the lens frame in the optical axis direction by detecting the position of the position detection magnet;
The drive unit is
Drive magnet,
A driving coil that receives a force by a magnetic field generated by the driving magnet;
The position detection magnet and the drive magnet are provided on the support frame,
Lens drive device.

(Supplementary Note 2)
The leaf spring is connected to an external device,
The position detection sensor and the drive coil are provided in the lens frame, and are supplied with power from the external device through the plate spring.
The lens driving device according to appendix 1.

(Supplementary Note 3)
The position detection sensor includes a driver circuit that supplies power to the drive coil,
The drive coil receives power from an external device via the driver circuit and the plate spring.
The lens driving device according to appendix 2.

(Supplementary Note 4)
The position detection unit detects the position of the lens frame in the direction orthogonal to the optical axis direction,
The drive unit further drives the lens frame in a direction orthogonal to the optical axis direction based on the position of the lens frame in the direction orthogonal to the optical axis direction detected by the position detection unit.
The lens driving device according to any one of appendices 1 to 3.

(Supplementary Note 5)
The camera provided with the lens drive device as described in any one of appendixes 1 to 4.

(Supplementary Note 6)
A position detection unit that detects the position of the lens frame;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
And a holding frame disposed to enclose the lens frame,
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The holding frame includes a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The holding frame includes a position detection magnet disposed to face the position detection sensor;
Lens drive device.

(Appendix 7)
A position detection unit that detects the position of the lens frame;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
A base supporting an imaging side of the lens frame;
A cover that covers the lens frame and is fixed to the base;
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The cover includes a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The base includes a position detection magnet disposed to face the position detection sensor;
Lens drive device.

(Supplementary Note 8)
It has conductivity, is electrically connected to an external device, and includes biasing means for biasing the lens frame,
The position detection sensor and the drive coil receive supply of drive current from the external device via the biasing means.
The lens driving device according to Appendix 6 or 7.

(Appendix 9)
The position detection unit further includes a driver circuit that supplies a driving current to the driving coil,
The driver circuit is supplied with power from the external device via the biasing means,
The drive coil receives supply of drive current from the driver circuit,
The lens driving device according to appendix 8.

(Supplementary Note 10)
A blade driving device which is provided on a surface of the lens driving device according to any one of appendices 6 to 9 on the side of an object to be imaged and which drives a blade for photographing.
The lens frame includes a concave portion for preventing the protruding portion from the lens driving device of the position detection sensor from coming into contact with the blade driving device, which is generated when the lens frame is driven in the direction toward the imaging object by the driving unit. ,
Blade drive.

(Supplementary Note 11)
The lens driving device according to any one of appendices 6 to 9,
And a blade driving device which is disposed on the surface of the lens driving device on the side of the object to be imaged and which drives a blade for photographing.
The blade drive device contacts the blade drive device with a projecting portion of the position detection sensor from the lens drive device, which is generated when the lens frame is driven in the direction toward the imaging object by the drive unit. With a recess to prevent
unit.

(Supplementary Note 12)
A camera comprising the lens driving device according to any one of appendices 6 to 9.

(Supplementary Note 13)
A camera comprising the unit according to appendix 11.

1: Imaging device 2: Electronic device 10: Base 11: Base 15: Opening 20A, 20B: Coil support 21A, 21B: OIS position detection support 22A, 22B: OIS coil 23A, 23B: OIS position detection 24 , 25A, 25B, 25C, 25D, 25 ': lead frame 30: OIS frame portion 31: frame 31A: opening 32A, 32B: OIS magnet 33A, 33B: magnet arrangement portion 35A: AF magnet 35B: magnet support portion 36: AF Position detection part 36C: AF position detection support part 37A, 37B, 37C, 37D: Spring support part 38A, 38B, 38C, 38D: Corner part 40: Frame support part 41A, 41B, 41C, 41D, 41B ': Upper leaf spring 42A, 42B, 42C, 42D: Suspension wire 60: Lens holder 1: Cylindrical member 62: AF coil 63: Yoke 64, 66, 67, 68: Side surface portion 65: AF position detection magnet 70: Lens support portion 71A, 71B, 72A, 72B: Bearing sliding portion 73A, 73B, 73C: Bearing 74: Lens barrel attachment portion 80: Cover portion 82: Opening portion 92: AF drive portion 100, 130, 400: Lens drive device 120: Reflector plate 122: Optical sensor 212, 212a, 212b, 212c, 212d: Base Side wall 213: uneven portion 214: inclined surface 215: upper surface 216: contact portion 221: cover 222, 222a, 222b, 222c, 222d: cover side wall 223: opening portion 224: contact portion 230: gap 240: adhesive 311: Wall 312: Opening 313: Projections 321, 321B, 321D, 321B and 321D ': Top Spring fixing solder 331, 332: positioning hole 333: oblique side portion 334: top portion 335, 336: side portion 337: arm portion 338: outer peripheral portion 339: connection portion 340: solder connection portion 341, 341A, 341B, 341C, 341D, 341B ': Through hole 342: slit 350: plate spring 351: arm portion 352: connection portion 361: flux 410: base portion 411: base 415: opening portion 420A, 420B: coil support portion 421A, 421B: OIS position detection support portion 422A , 422B: OIS coil 423A, 423B: OIS position detection unit 425A, 425B, 425C, 425D: hole 430: OIS frame unit 431: frame 431A: opening 432A, 432B, 434A, 434B: OIS magnet 433A, 433B, 439A, 439B : Mug Position arrangement portion 435A: position detection magnet for AF 435B: magnet support portion 460: lens holding portion 461: tubular member 462: AF coil 469: AF position detection portion 469a: controller 469b: magnetic sensor 469c: AF control portion 469d: Driver circuit 470: Lens support 471A, 471B, 471C, 471D: Upper flat springs 472A, 472B, 472C, 472D: Suspension wire 473: Lower flat spring 474: Lens barrel attachment section 480: Cover section 482: Opening 483: Opening Part 490: Shutter 505: Work bench 511B, 511D, 511B ', 511D': Lead frame (support plate) fixing solder 514A, B, C, D: Lead frame (support plate) through hole 514B, 514B ': Lead frame penetration Hole 52 B, 520B ': one surface 521B of upper leaf spring 521B': the other surface 522B of upper leaf spring 522B ': the other surface 523B of lead frame 523B': one surface 530 of lead frame 530: frame holding Robot 531: jig holding robot 532A, 532B, 532C, 532D: wire holding jig 535: first camera 536: second camera 540A, 540B, 540C, 540D: tip 600 of suspension wires 42A, 42B, 42C, 42D Lens driving device 610: Base portion 611: Base 615: Openings 625A, 625B, 625C, 625D: Contact portions 625'A, 625'B, 625'C, 625'D: Terminals 630: Drive magnet group 632A, 632B , 634A, 634B: Drive magnet 635A: AF position detection magnet Net 635B: magnet support frame 660: lens holding portion 661: cylindrical member 661A: winding groove 662: AF coil 669: AF position detection portion 670: lens support portion 671: upper leaf spring 673A, 673B, 673C, 673D: lower Leaf spring 674: Lens barrel attachment portion 675: Spacer 680: Cover portion 682: Opening portion B: Plate portion C: Intersection G: Gap S: Elastic portion L: Lead portion

Claims (9)

A position detection unit that detects the position of the lens frame whose outer shape is octagon;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
A holding frame which is disposed so as to enclose the lens frame;
And four leaf springs electrically conductive and electrically connected to an external device and biasing the lens frame,
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The holding frame, and a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The holding frame includes a position detection magnet disposed to face the position detection sensor;
Each of the four plate springs is electrically connected to the external device, and a plate portion attached to the surface on the imaging object side of the holding frame , and a lead attached to the surface on the imaging object side of the lens frame And an elastic portion having elasticity and connecting the plate portion and the lead portion,
The end portions of the lead portions of the four plate springs are disposed on the same side of the surface of the lens frame on the imaging object side .
Lens drive device. A position detection unit that detects the position of the lens frame whose outer shape is octagon;
A driving unit configured to drive the lens frame based on the position of the lens frame detected by the position detection unit;
A base supporting an imaging side of the lens frame;
A cover which covers the lens frame and is fixed to the base;
And four leaf springs electrically conductive and electrically connected to an external device and biasing the lens frame,
The drive unit is
A driving coil wound in a circumferential direction around the lens frame;
The cover includes a drive magnet disposed to face the drive coil;
The position detection unit is
A position detection sensor disposed on the lens frame;
The base includes a position detection magnet disposed to face the position detection sensor;
Each of the four plate springs is electrically connected to the external device and has a plate portion attached to the surface on the imaging target side of the base , and a lead portion attached to the image-side surface of the lens frame An elastic portion having elasticity and connecting the plate portion and the lead portion;
Ends of the lead portions of the four leaf springs are disposed on the same side of the surface on the image forming side of the lens frame.
Lens drive device. The plate spring is paired with one of two adjacent plate springs,
The lead portions of the pair of leaf springs extend adjacent to each other to the same side.
The lens drive device according to claim 1. The position detection sensor and the drive coil receive supply of drive current from the external device via the end of the lead portion.
The lens drive device according to any one of claims 1 to 3. The position detection unit further includes a driver circuit that supplies a driving current to the driving coil,
The driver circuit receives supply of power from the external device through an end of the lead portion,
The drive coil receives supply of drive current from the driver circuit,
The lens drive device according to claim 4. The lens drive device according to any one of claims 1 to 5.
And a blade driving device which is disposed on the surface of the lens driving device on the side of the object to be imaged and which drives a blade for photographing.
The blade driving device has a portion covering the lens driving device and a portion projecting in the optical axis direction of the lens driving device.
The portion of the lens driving device protruding in the optical axis direction is disposed adjacent to the lens driving device.
unit. The blade drive device contacts the blade drive device with a projecting portion of the position detection sensor from the lens drive device, which is generated when the lens frame is driven in the direction toward the imaging object by the drive unit. With a recess to prevent
A unit according to claim 6.   The camera provided with the lens drive device as described in any one of Claims 1-5.   A camera comprising the unit according to claim 6 or 7.