KR101797587B1 - Water level/turbidity complex sensor and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a water level / turbidity composite sensor and a method of manufacturing the same. A plurality of protrusions and a plurality of grooves are alternately arranged on at least one surface of the first insulating film in a first direction and in a second direction intersecting the first direction, Wherein the protrusions of the first electrode correspond to the grooves of the second electrode and the protrusions of the second electrode correspond to the grooves of the first electrode and are engaged with each other, A capacitance sensor in which the first electrode and the second electrode are arranged at a predetermined interval; A pattern formed on an upper surface of the first insulating film so as not to overlap with the capacitance sensor and having a predetermined length in a first direction and being arranged in parallel to each other, and a resistor having a third electrode and a fourth electrode sensor; And a capacitance sensor disposed on an upper end of the resistance sensor for detecting a water level through a sensing signal generated by the capacitance sensor to generate a detection signal and detecting turbidity through a sensing signal generated by the resistance sensor And a signal processing unit for generating a detection signal, and a signal processing unit for detecting the level / turbidity of the water level / Turbidity composite sensor and a manufacturing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a water level / turbidity complex sensor,

The present invention relates to a combined water level / turbidity sensor and a method of manufacturing the same, and more particularly, to a combined water level / turbidity sensor capable of measuring the liquid level and turbidity of a liquid by a sensor will be.

Background Art Conventionally, a water level sensor and a turbidity sensor are used for measuring water level and turbidity of various liquids such as water, alcohol, and oil in an industrial field. The water level sensor is used to detect the level of liquid and is widely applied to water traps, industrial or domestic boilers, waterworks, water tanks, etc. used in various production facilities, and is also widely used in home appliances such as washing machines, dishwashers, Widely applied. Further, the turbidity sensor is for detecting the turbidity of the liquid (inclusion degree of the liquid), and is widely used in industries where many liquid handling equipments or the like are used, and is widely used in washing machines, dishwashers, water purifiers, humidifiers, It is also used in home appliances such as manufacturers.

In the case of the water level sensor, a capacitance level sensor for measuring the liquid level using the difference in the permittivity of air and liquid, an ultrasonic level sensor using the ultrasonic generator and a sensor, and a water level sensor Sensors have been disclosed. On the other hand, the conventional water level sensor is mostly manufactured by an individual assembly process, and mass production is difficult, and the unit price is relatively high. Further, the size of the water level sensor is large, so that it is inevitable to change the structure or install the specific structure for mounting the water level sensor.

In order to overcome this problem, a film type of water level sensor is being disclosed. Conventionally, a water level sensor in the form of a film is used to detect the level of liquid by attaching a sensor to the outer surface of the insulator tube. However, the change in the inner and outer diameter of the insulator tube and the change in physical properties of the insulating material can greatly affect the sensor sensitivity. When a water level sensor in the form of a film is required to accurately change the level of the liquid present inside the sensor tube attached to the outer surface of the insulator tube, the liquid is deposited on the outer surface of the level sensor electrode and temperature, humidity, As external environmental conditions change, sensor sensitivity can be affected.

In the turbidity sensor, a turbidity sensor having a light emitting portion and a light receiving portion is generally used. Since the turbidity sensor is exposed to the liquid for a long time due to its functional characteristics, the surface of the turbidity sensor may be contaminated and the light emitting ability of the light emitting portion or the light receiving ability of the light receiving portion may be reduced. For example, when the turbidity sensor is installed in water to detect the turbidity of water, the turbidity detection result of the contaminated turbidity sensor becomes unreliable because the light receiving amount of the light receiving portion of the turbidity sensor does not accurately reflect the actual turbidity of water. If the turbidity sensor is not able to remove the contamination, it is troublesome to calibrate the turbidity sensor based on clean water and to reliably determine the detection result of the turbidity sensor.

Another problem is that sensors for detecting the level and turbidity of such liquids have so far been manufactured and used individually. Therefore, it is inconvenient to separately measure and control the liquid level and the turbidity of the liquid to be measured. For example, when using a washing machine or a dishwasher, it is very difficult to collectively control the amount of laundry or washing water consumed.

Accordingly, there is a demand for a water level sensor and a turbidity sensor which are easy to install, easy to manufacture without being influenced by the surrounding environment, and are required to have a high reliability of measurement of water level and turbidity, a small size and low cost, There is a need for a composite sensor in which a turbidity sensor is integrally formed.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above problems, and it is an object of the present invention to provide a combined water level / turbidity sensor and a method of manufacturing the same.

The present invention also provides a water level / turbidity complex sensor capable of increasing measurement reliability and a manufacturing method thereof.

The present invention also provides a water level / turbidity complex sensor and a manufacturing method which can be small and can be supplied at low cost.

The present invention also provides a combined water level / turbidity sensor and a method of manufacturing the same.

According to an aspect of the present invention,

(1) a first insulating film; A plurality of protrusions and a plurality of grooves are alternately arranged on at least one surface of the first insulating film in a first direction and in a second direction intersecting the first direction, Wherein the protrusions of the first electrode correspond to the grooves of the second electrode and the protrusions of the second electrode correspond to the grooves of the first electrode and are engaged with each other, A capacitance sensor in which the first electrode and the second electrode are arranged at a predetermined interval; A pattern formed on an upper surface of the first insulating film so as not to overlap with the capacitance sensor and having a predetermined length in a first direction and being arranged in parallel to each other, and a resistor having a third electrode and a fourth electrode sensor; And a capacitance sensor disposed on an upper end of the resistance sensor for detecting a water level through a sensing signal generated by the capacitance sensor to generate a detection signal and detecting turbidity through a sensing signal generated by the resistance sensor And a signal processing unit for generating a detection signal.

(2) In the above (1), a double-sided adhesive film is formed on the bottom surface of the first insulating film.

According to another aspect of the present invention,

(3) (a) bonding the conductive film to the upper surface of the first insulating film by using a laminating process; (b) forming a capacitive sensor pattern, a resistance sensor pattern, and a PCB pattern for wiring in a batch process through a photolithography process and an etching process; (c) coating a second insulating film by a laminating process or a waterproof plastic film on the resistance sensor pattern except for the capacitance sensor pattern and the resistance electrode; (d) soldering at least one SMD (Surface Mount Devices) type signal processing device for signal processing on the PCB pattern or bonding a signal chip for signal processing to form a signal processing part; And (e) molding the signal processing unit to protect the signal processing unit from external influences.

(4) The method according to (3), wherein after (f) any one step selected from the group consisting of (c), (d) Plating at least one selected from the group consisting of Cr, Ni, Sn, Pd, Pt, Au and Ag; The present invention also provides a method for manufacturing a combined water level / turbidity sensor.

(5) The method according to (3) above, wherein (g) after any one step selected from the group consisting of (c), (d) And forming an adhesive material film in the form of a double-sided adhesive agent.

(6) The method according to (3) above, wherein (h) after the step (c), the step (d) And performing a strong hydrophobic treatment on the surface of the water level / turbidity composite.

According to the present invention, it is possible to provide an integrally formed water level / turbidity composite sensor capable of simultaneously detecting a water level and a turbidity on one insulating film.

Further, since the conductive film is adhered to the insulating film by the laminating process and the electrode is formed by the photolithography and the etching process, it is possible to provide a composite sensor having a variety of shapes and sizes which are easy to mass-produce.

In addition, it is possible to provide a composite sensor having a relatively high sensitivity of the sensor and a high reliability of measurement by protecting a part performing a sensing function from the external environment.

Further, since the material cost is low, it is possible to provide a composite sensor with reduced manufacturing cost.

Also, there is provided a composite sensor which is manufactured by using a film of plastic or the like and has an adhesive material film (adhesive tape) formed on the sensor surface so that it can be easily attached and attached to a structure without designing a special mechanism .

1 to 3 are diagrams for explaining the structure of a water level / turbidity composite sensor according to an embodiment of the present invention,
FIG. 4 is a cross-sectional view of a water level / turbidity composite sensor according to an embodiment of the present invention,
5 and 6 are views for explaining the principle of water level measurement in the water level / turbidity composite sensor having the structures of Figs. 1 to 3,
FIGS. 7 and 8 are cross-sectional views illustrating a method of manufacturing a combined water level / turbidity sensor according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the drawings, the same or similar reference numerals are given to the same or equivalent components, and the directions are described with reference to the drawings, wherein the first direction means the longitudinal (long) direction of the sensor, ) Direction. Also, throughout the specification, when an element is referred to as "including " an element, it means that it may include other elements, not excluding other elements, unless specifically stated otherwise.

First, the structure of the water level / turbidity composite sensor according to the present invention will be described in detail.

FIGS. 1 to 3 are diagrams for explaining the structure of a water level / turbidity composite sensor according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating a water level / turbidity composite sensor according to an embodiment of the present invention. 1 to 3 illustrate a pattern of a water level / turbidity composite sensor, a signal processing unit including a molding part, and a position and an arrangement structure of a solar cell. For the sake of convenience, the entire structure of the completed water level / And the molded part, the second insulating film, the plated part, the adhesive film, and the like are not shown in the completed structure.

1, the hybrid sensor 100 according to an embodiment of the present invention includes a first electrode 121 for forming a capacitance sensor 120 on an upper surface of a first insulating film 110, The signals of the third electrode 131 and the fourth electrode 132 and the pattern 133 to form the second electrode 122 and the resistance sensor 130 and the signals of the signal processing unit 140 and the signal processing unit 140 And may have connection lines 150 for transmitting or supplying power. At this time, the first electrode 121 and the second electrode 122 forming the electrostatic capacity sensor 120 are arranged corresponding to the center, and the third electrode 131 forming the resistance sensor 130 The fourth electrode 132 and the pattern 133 may be disposed symmetrically with respect to the left and right of the capacitance sensor 120, respectively.

The first electrode 121 and the second electrode 122 have a predetermined length in the first direction and a plurality of protrusions and a plurality of grooves are alternately arranged in at least one surface of the second direction crossing the first direction And can be arranged parallel to each other. That is, the protrusion of the first electrode 121 corresponds to the groove of the second electrode 122, the protrusion of the second electrode 122 corresponds to the groove of the first electrode 121, The first electrode 121 and the second electrode 122 may be spaced apart from each other by a predetermined distance.

For example, the first electrode 121 and the second electrode 122 may have a shape in which a plurality of teeth (protrusions) of a quadrangular (or polygonal) shape protruding in the second direction are arranged at regular intervals The first electrode 121 and the second electrode 122 may be arranged such that the teeth of the second electrode 122 and the teeth of the first electrode 121 mesh with each other, The first electrode 121 and the second electrode 122 may be spaced apart from each other by a predetermined distance.

One end of the first electrode 121 and the second electrode 122 are electrically connected to the signal processing unit 140 through the electrode pattern. The signal processing unit 140 is disposed at an upper end of the first electrode 121 and the second electrode 122 and is connected to the first electrode 121 and the second electrode 122 constituting the capacitance sensor 120, And the detection signal is generated by detecting the water level through the sensing signal generated in the sensor 122.

The third electrode 131 and the fourth electrode 132 forming the resistance sensor 130 may be disposed at a lower end portion of the first insulation film 110. The third electrode 131 and the fourth electrode 132 may be arranged in a square shape as shown in FIG. 1, and may be arranged in various shapes such as a circle, an ellipse, and a polygon.

The third electrode 131 and the fourth electrode 132 are electrically connected to the signal processing unit 140 through the upper electrode pattern 133, The third electrode 131 and the fourth electrode 132 to generate a detection signal.

The arrangement structure of the signal processing unit 140 may be linearly arranged as shown in FIG. 1, may have a circular arrangement structure, and may have various arrangement structures such as 'a' character or 'b' character. And may be variously configured according to the shape, size, or arrangement structure of the chips or elements constituting the signal processing unit 140. [

2, in addition to the configuration shown in FIG. 1, an antenna 260 may be disposed at an upper end of the signal processing unit 240 A battery 270 may be disposed on the side of the antenna 260 and the solar battery 280 may be disposed on an upper end of the battery 260 and the battery 270.

The antenna 260 is connected to the signal processing unit 240, the first electrode 221, the second electrode 222, the third electrode 231 and the fourth electrode 232, And supplies the detection signal of the signal processing unit 240 to the outside. The shape of the antenna 260 may have a hollow square shape as shown in FIG. 2, or may be arranged in various shapes such as a rectangle, a circle, and a straight line.

2 shows a combined sensor 200 of a water level / turbidity when the solar cell 280 is provided. However, the combined water level / turbidity sensor 200 according to the present invention is a wireless sensor that does not have a solar cell 280 And may be manufactured in a wireless type or a wire type.

In the case of the wireless type water level / turbidity composite sensor 300 having the solar cell 280 as described in FIG. 2 and the wireless type water level / turbidity composite sensor 300 having no solar cell 280, The first electrode 321 and the second electrode 322 constituting the capacitance sensor 320, the third electrode 331 and the fourth electrode 332 constituting the resistance sensor 330, A signal processing unit 340, an antenna 360, and a battery 370. The arrangement structure is the same as or similar to that described with reference to FIG.

Another example of the wireless type water level / turbidity composite sensor 300 that does not include the solar cell 280 is a passive type water level / turbidity composite sensor 300 that does not include a battery (battery) Lt; / RTI >

4, the combined water level / turbidity sensor 100 includes a resistance sensor 130 excluding the capacitance sensor 120 and the resistance electrodes 131 and 132, 2 insulating film 190 and an adhesive film 190-1 may be formed on the lower surface of the first insulating film 110. [

The first insulating film 110 and the second insulating film 190 are coated for insulation with the liquid 1 of the capacitance sensor 120 and the resistance sensor 130 and are made of polyethylene terephthalate Lt; / RTI >

Further, the adhesive film 190 can be easily adhered or fixed to a specific site such as a surface of the structure by forming the adhesive material film in the form of a double-sided adhesive.

Hereinafter, the principle of measuring the water level and the turbidity of the water level / turbidity complex sensor 100 according to the present invention will be described in detail.

5 and 6 are views for explaining the principle of water level measurement in the water level / turbidity composite sensor having the structures of FIGS. 1 to 3. FIG. 5 is a graph showing a change in capacitance when the electrodes constituting the combined water level / turbidity sensor are exposed to a place without the liquid 1. FIG. 6 shows that the electrodes constituting the water level / And the capacitance change when exposed to the presence.

5, the capacitance C between the first electrode 121 and the second electrode 122 can be calculated by the following equation 1 when the liquid 1 is not present. In this case, the dielectric constant of air (ε _r) is known to have a value of approximately "1".

[ Formula 1 ]

(C: capacitance,? ₀ : vacuum permittivity,? _R : relative dielectric constant, S: electrode area,

6, it is possible to calculate the value of the electrostatic capacitance C according to the equation (1), and when the liquid (1) is water, the relative dielectric constant (? _R ) It is known as '80'.

Accordingly, as the liquid level of the liquid 1 gradually increases, the value of the capacitance C through the first electrode 121 and the second electrode 122 increases in proportion to the level of the liquid 1, And the level of the liquid 1 can be grasped through the signal processing unit 140 by reading the value of the capacitance C obtained by the signal processing unit 140. [ The signal processing unit 140 may include a circuit unit for converting the value of capacitance C through the first electrode 121 and the second electrode 122 to a voltage value, .

In the turbidity measurement of the water level / turbidity composite sensor 100 according to the present invention, the electrical conductivity between the third electrode 131 and the fourth electrode 132 is measured, And by observing the turbidity of the liquid 1 through the signal processing unit 140. The signal processing unit 140 may include a circuit unit for converting a resistance value through the third electrode 131 and the fourth electrode 132 to a voltage value, It is possible.

Hereinafter, a method of manufacturing the hybrid water level / turbidity sensor according to the present invention will be described in detail.

FIGS. 7 and 8 are cross-sectional views illustrating a method of manufacturing a combined water level / turbidity sensor according to an embodiment of the present invention. Here, FIG. 7 is a cross-sectional view taken along the line A-A 'in FIG. 3, and FIG. 8 is a cross-sectional view taken along line B-B' in FIG.

Referring to FIGS. 7A and 8A, a first insulation film 110 is prepared for manufacturing the hybrid sensor 100 according to an embodiment of the present invention, The conductive film 111 is bonded to the upper surface of the insulating film 110 by using a laminating process. At this time, the first insulating film 110 may be a PET (polyethylene terephthalate) film. The conductive film 111 is made of a material such as the electrodes 121, 122, 131 and 132, the antennas 260 and 360 and the circuit pattern 133 of the water level / turbidity composite sensor 100, A copper film may be mainly used. However, the present invention is not limited to this, and a copper alloy film containing a copper component such as brass, bronze or the like may be used, and another conductive material such as nickel, A film may be used.

The laminating process may be a rolling coating method using a laminating machine at a preheated temperature of 100 to 120 ° C. The conductive film 111 may be coated at a temperature outside the range of 100 to 120 ° C.

7B and 8B, a first electrode 121 and a second electrode 122 are formed on the top surface of the conductive film 111 through a photolithography process and an etching process, The resistance sensor pattern 130 including the capacitive sensor pattern 120, the third electrode 131 and the fourth electrode 132 and the PCB pattern 112 for circuit connection are formed in a batch process.

The antenna patterns 260 and 360 may be formed in a batch process together with the capacitive sensor pattern 120, the resistance sensor pattern 130, and the PCB pattern 112. The antenna patterns 260 and 360 may be formed only when necessary. Hereinafter, it is assumed that the antenna patterns 260 and 360 are formed together.

The photolithography process may be performed by coating a photosensitive dry film on the conductive film 111 or forming a photoresist film on the conductive film 111 and exposing the capacitive sensor pattern 120, (Not shown) for forming the PCB pattern 112 and the antenna patterns 260 and 360 are formed.

The resist pattern 130, the PCB pattern 112, and the antenna pattern 260 (not shown) are formed by etching a part of the conductive film 111 using the mask pattern, , 360 are formed. As the etching process, various etching methods such as wet etching, dry etching, and plasma etching may be used.

Thereafter, the mask pattern is removed through a separate process including a cleaning process.

According to another embodiment of the present invention, the capacitive sensor pattern 120, the resistance sensor pattern 130, the PCB pattern 112, and the antenna patterns 260 and 360 may be formed by a screen printing, a deposition, or a sputtering process Or a conductive thin film. Alternatively, it may be formed by coating gold, silver, platinum, copper, nickel, or the like using a deposition or sputtering process, and then etching. Alternatively, carbon or silver may be formed by screen printing.

Referring to FIGS. 7 (c) and 8 (c), the capacitive sensor pattern 120, the resistance sensor pattern 130, the PCB pattern 112 and the antenna patterns 260, Only the portion where the resistance sensor pattern 130 is formed excluding the capacitance sensor pattern 120 and the resistance electrodes (the third electrode 131 and the fourth electrode 132) The film 190 is laminated using a laminating process, or coated with a waterproof plastic film.

The resistive sensor pattern 130, the PCB pattern 112, and the antenna patterns 260 and 360 may be formed on the capacitive sensor pattern 120, the resistance sensor pattern 130, the PCB pattern 112, and the antenna patterns 260 and 360 before the step of adhering or coating the second insulation film 190. [ A plating process can be performed. The plating material used for the plating may be any one selected from the group consisting of nickel (Ni), gold (Au), platinum (Pt) and silver (Ag). In addition, the plating process may be performed at least two times with different materials. For example, it is also possible that the gold plating is performed continuously after performing the nickel plating. This plating process can be carried out by an electroless plating process.

The plating process is performed to extremely reduce the resistance of the capacitive sensor pattern 120, the resistance sensor pattern 130, the PCB pattern 112 and the antenna patterns 260 and 360, It is advantageous in that the production cost can be lowered than that the resistance sensor pattern 130, the PCB pattern 112 and the antenna patterns 260 and 360 are formed of nickel, gold, platinum, silver, or the like.

The second insulation film 190 protects the capacitance sensor pattern 120 and the resistance sensor pattern 130 from the liquid 1 to prevent damage and may be made of a PET film . At this time, a step of performing a strong hydrophobic treatment on the second insulating film 190 may be added.

Referring to FIGS. 7D and 8D, an adhesive material layer 190-1 is formed on the lower surface of the first insulating film 110 in the form of a double-sided adhesive by a laminating process, a coating process, or an adhering process . The adhesive material film 190-1 is for adhering or fixing the completed water level / turbidity composite sensor 100 to a specific site.

Accordingly, the process of forming the adhesive material layer 190-1 may be performed after any one of the processes described above, or may be performed after any process selected from processes described later. Further, it is also possible to carry out after completing the manufacture of the water level / turbidity composite sensor 100 according to the present invention.

As another example, the adhesive material layer 190-1 may be formed on the upper surface of the second insulating film 190. [

7 (e) and 8 (e), after the adhesive material film 190-1 or the second insulating film 190 is formed, at least the signal processing for the signal processing on the PCB pattern 112 One SMD (Surface Mount Dvices) type signal processing element is soldered or a signal processing unit 140 is formed by bonding a dedicated chip for signal processing.

The SMD type signal processing element is a general term for elements used for signal processing among electronic components mounted on the surface of a printed board and refers to elements mounted on one or both sides of the printed board by using surface mounting technology (SMT) Lt; / RTI > In addition, a dedicated chip for signal processing may include an application-specific integrated circuit (ASIC) chip of a demand type semiconductor, which is customized or sold separately for signal processing of the water level / turbidity composite sensor.

Referring to FIGS. 7 (f) and 8 (f), the signal processing unit 140 is molded to protect it from external influences. The material for the molding may be epoxy or the like. The molding part 140a may include the PCB pattern part 112 as well as the signal processing part 140. [

At this time, the resistance electrode portions 131 and 132 at the lower end of the resistance sensor pattern 130 are formed of Cr, Ni, Sn, and Pd to prevent oxidation of the resistance electrodes 131 and 132 Pd), platinum (Pt), gold (Au), and silver (Ag).

According to another embodiment of the present invention, the water level / turbidity composite sensor 100 may be manufactured by a PCB substrate manufacturing method well known to those skilled in the art. That is, after the capacitive sensor pattern 120, the resistance pattern 130, the PCB pattern 112, and the antenna patterns 260 and 360 are manufactured in the form of a general PCB, the resistance electrodes 131 and 132, A method of coating the whole with an insulating material may be used.

The capacitive sensor pattern 120 and the resistive sensor pattern 130 may be manufactured by the method of FIGS. 7 and 8, and the signal processing unit 140 including the PCB pattern 112 may include a general PCB The water level / turbidity composite sensor 100 may be manufactured by separately manufacturing the water level / turbidity complex sensor 100 and electrically connecting the water level / turbidity sensor 100 with each other.

The foregoing is a description of specific embodiments of the present invention. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments or constructions. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It should be understood that this is possible. It is therefore to be understood that all such modifications and alterations are intended to fall within the scope of the invention as disclosed in the following claims or their equivalents.

100, 200, 300: Combined water level / turbidity sensor
110: first insulating film 111: conductive film
112: PCB pattern 120, 220, 320: Capacitive sensor (pattern)
121, 221, 321: first electrodes 122, 222, 322: second electrodes
130, 230, 330: resistance sensor (pattern) 131, 231, 331:
132, 232, 332: fourth electrode 133: pattern
140, 240, 340: a signal processor 150:
190-1: adhesive film (adhesive material film) 260, 360: antenna
270, 370: Battery (battery) 280: Solar cell
190: second insulating film l: liquid

Claims (6)

delete delete (a) bonding a conductive film to a top surface of a first insulating film using a laminating process;
(b) through a photolithography process and an etching process, a capacitive sensor pattern; A resistance sensor pattern including a resistance electrode; And forming a PCB pattern for circuit connection in a batch process;
(c) coating a second insulating film by a laminating process or a waterproof plastic film on the resistance sensor pattern except for the capacitance sensor pattern and the resistance electrode;
(d) soldering at least one SMD (Surface Mount Devices) type signal processing device for signal processing on the PCB pattern or bonding a signal chip for signal processing to form a signal processing part; And
(e) molding the signal processor to protect it from external influences;
Lt; / RTI >
In the step (b), the resistance electrode is formed to be positioned below the capacitance sensor pattern. In the step (c), the second insulating film is simply coated with a simple adhesive or a plastic film except for the resistance electrode / RTI > The method of claim 1, The method of claim 3,
(Cr), nickel (Ni), nickel (Ni), and nickel (Ni) for preventing oxidation of the resistance electrode after any one of the steps (c), (d) , At least one selected from the group consisting of tin (Sn), palladium (Pd), platinum (Pt), gold (Au), and silver (Ag);
The method of claim 1, further comprising: The method of claim 3,
(g) forming a double-sided adhesive type adhesive material film on the bottom surface of the first insulating film after any one step selected from the group consisting of (c), (d), and (e) ;
The method of claim 1, further comprising: The method of claim 3,
(h) performing a strong hydrophobic treatment on the second insulating film after any one of the steps (c), (d), and (e);
The method of claim 1, further comprising:

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