KR101792388B1

KR101792388B1 - Coil component and manufacturing method for the same

Info

Publication number: KR101792388B1
Application number: KR1020160010639A
Authority: KR
Inventors: 서정인
Original assignee: 삼성전기주식회사
Priority date: 2016-01-28
Filing date: 2016-01-28
Publication date: 2017-11-01
Also published as: KR20170090144A

Abstract

The present disclosure relates to a magnet comprising a body portion comprising a magnetic material; A coil portion disposed in the body portion, the coil portion including a support member, a coil pattern formed on at least one surface of the support member, and an insulating film covering the coil pattern; And an electrode portion disposed on the body portion and including an external electrode electrically connected to the coil pattern; Wherein the insulating film includes an adhesive layer formed on a surface of the coil pattern and an insulating layer formed on a surface of the adhesive layer, and a manufacturing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a coil component,

The present disclosure relates to a coil component and a method of manufacturing the same.

With the downsizing and thinning of electronic devices such as digital TVs, mobile phones, notebooks, etc., miniaturization and high capacity of coil parts applied to such electronic devices are also required. Therefore, the main power of the power inductor is shifted from the stacked type to the thin film type and the wound type while seeking a direction to lower the unit price of the magnetic material.

In the case of the thin film type power inductor, an insulating film is formed on the surface of the conductor pattern in order to prevent contact between the conductor pattern constituting the coil and the magnetic material constituting the body. At this time, a method of raising the surface roughness of the conductor pattern by chemical etching or the like is used for improving the adhesion.

However, since it is a wet process, it is difficult to manage, and the cost of maintenance and repair is high due to high consumption of chemicals.

One of the objects of the present disclosure is to form an insulating film which is easy to manage, can be maintained and repaired at low cost, and has excellent adhesion.

One of the solutions proposed through the present disclosure is to form an insulating film by first forming an adhesive layer on the surface of a conductor pattern.

For example, a coil component according to the present disclosure includes: a body portion including a magnetic material; A coil portion disposed in the body portion, the coil portion including a support member, a coil pattern formed on at least one surface of the support member, and an insulating film covering the coil pattern; And an electrode portion disposed on the body portion and including an external electrode electrically connected to the coil pattern; The insulating layer may include an adhesive layer formed on a surface of the coil pattern and an insulating layer formed on a surface of the adhesive layer.

Further, a method of manufacturing a coil component according to the present disclosure includes: forming a coil pattern on at least one surface of a support member; Forming an insulating film covering the coil pattern; Stacking a magnetic material layer on top and bottom of the support member; And forming an external electrode on the magnetic layer; Wherein the step of forming the insulating film includes the steps of forming an adhesive layer on the surface of the coil pattern, heat treating the adhesive layer, and forming an insulating layer on the heat-treated adhesive layer surface have.

As one of the effects of the present disclosure, it is possible to form an insulating film which can be easily managed, maintained and repaired at low cost, and has excellent adhesion.

1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
Fig. 3 shows an example of a schematic II 'cross-section of the coil part of Fig.
4 is a schematic process diagram showing an example of manufacturing a coil component.
5 is a schematic process drawing showing an example of manufacturing an insulating film.
6 is a schematic cross-sectional view showing an example of an adhesive layer forming apparatus.
7 shows the adhesive strength according to the thickness of the adhesive layer.
Fig. 8 shows the adhesive strength rating table according to ASTM D3002, D3359.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil component applied to an electronic device. Referring to the drawings, it can be seen that various types of electronic components are used in electronic devices. For example, DC / DC, Comm. Processor, WLAN BT / WiFi FM GPS NFC, PMIC, Battery, SMBC, LCD AMOLED, Audio Codec, USB 2.0 / 3.0 HDMI, CAM can be used. Various types of coil parts may be appropriately applied between the electronic parts for the purpose of noise removal and the like depending on the application. For example, a power inductor (1), a high frequency inductor A general bead 3, a bead for a high frequency band (GHz Bead 4), a common mode filter 5, and the like.

Specifically, the power inductor 1 may be used to stabilize the power source by storing electric power in the form of a magnetic field to maintain an output voltage. Further, the high frequency inductor (HF Inductor) 2 can be used for the purpose of securing a necessary frequency by matching the impedance, blocking the noise and the AC component, and the like. Further, a normal bead (General Bead) 3 can be used for eliminating noise in a power source and a signal line, removing high-frequency ripple, and the like. Further, the high frequency bead (GHz Bead) 4 can be used for eliminating high frequency noise of a signal line and a power supply line associated with audio. Further, the common mode filter (5) can be used for passing the current in the differential mode and removing only the common mode noise.

The electronic device may be a smart phone, but is not limited thereto. For example, the electronic device may be a personal digital assistant, a digital video camera, a digital still camera ), A network system, a computer, a monitor, a television, a video game, or a smart watch. But may be other various electronic devices well known to those skilled in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described. However, it is needless to say that the coil component of the present disclosure can be applied to other various types of coil components as described above, as well as the structure of a power inductor .

2 is a schematic perspective view showing an example of a coil part.

Fig. 3 shows a schematic II 'cross-sectional view of the coil part of Fig.

Referring to the drawings, a coil component 100 according to an example includes a body portion 10, a coil portion 20 disposed in the body portion 10, and an electrode portion 30 disposed on the body portion 10 .

The body part 10 forms the appearance of the coil part 100A. The body 10 has a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in the second direction, and a fifth surface and a sixth surface opposed to each other in the third direction But it is not limited thereto.

The body portion 10 may include a metal powder and a binder resin. The metal powder may include iron (Fe), chromium (Cr), or silicon (Si) as a main component. Examples of the metal powder include iron (Fe) Chromium (Cr) -silicon (Si), and the like. The binder resin may include, but is not limited to, an epoxy, a polyimide, a liquid crystal polymer, and the like. However, this is merely an example, and other magnetic materials may be included.

The metal powder may be a combination of metal powders having an average particle diameter (D ₁ , D ₂ ) of 2 or more. In this case, the filling rate can be increased by using a bimodal metal powder of different sizes.

The binder resin may be one in which a small amount of an acrylic resin or an alkali-based acid is added to the bisphenol A-based epoxy resin to impart sheet stretchability. For example, the binder resin may be an epoxy resin represented by the following formula or a derivative thereof, but is not limited thereto.

The coil part 20 functions to perform various functions in the electronic device through the characteristics expressed from the coil of the coil part 100. For example, the coil component 100 may be a power inductor. In this case, the coil portion 20 may store electricity in the form of a magnetic field to maintain the output voltage and stabilize the power supply.

The coil part 20 includes first and second coil patterns 22 and 23 respectively formed on one surface and the other surface of the support member 21 and the support member 21 and the first and second coil patterns 22 and 23, A via 24 electrically connecting the coil patterns 22 and 23 and an insulating film 25 covering the first and second coil patterns 22 and 23.

The support member 21 is formed to be thinner and easier to form the coil portion 20 and is not particularly limited as long as it can support the coil patterns 22 and 23. For example, a copper clad laminate (CCL), a polypropylene glycol (PPG) substrate, a ferrite substrate, a metal soft magnetic substrate, an insulating substrate made of an insulating resin, or the like. As the insulating resin, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- Film, FR-4, bismaleimide triazine (BT) resin, and PID (Photo Imagable Dielectric) resin. From the standpoint of stiffness maintenance, an insulating substrate including glass fiber and epoxy resin can be used, but the present invention is not limited thereto.

Each of the coil patterns 22 and 23 has a plane coil shape. The coil patterns 22 and 23 in the form of the plane coil may be a plating pattern formed by an isotropic plating method, but the present invention is not limited thereto and may be a plating pattern formed by an anisotropic plating method. In the case of the flat coil shape, since the number of turns can be at least 2 or more, it is advantageous to realize a thin and high inductance.

The coil patterns 22 and 23 may be composed of a seed layer and a plating layer. The seed layer may comprise a first layer comprising at least one of titanium (Ti), titanium-tungsten (Ti-W), molybdenum (Mo), chrome (Cr), nickel (Ni), and nickel (Ni) Layer and a second layer containing the same material as the plating layer, for example, copper (Cu). The plating layer may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pd) But it is not limited thereto.

The vias 24 extend through the support member 21 and thus have a thickness corresponding to the support member 21. The vias 24 electrically connect the coil patterns 22 and 23. The current path is continued, and as a result, one coil that rotates in the same direction is formed.

The via 24 may also be composed of a seed layer and a plating layer, and specific examples are as described above. That is, the vias 24 can be formed simultaneously with the coil patterns 22 and 23. The horizontal cross-sectional shape of the via 24 may be, for example, circular, elliptical, polygonal, or the like. The vertical cross-sectional shape of the via 24 may be, for example, a tapered shape, an inverted tapered shape, an hourglass shape, a columnar shape, or the like.

The insulating film 25 is provided to prevent contact between the magnetic material of the body 10 and the coil patterns 22 and 23. The insulating film 25 specifically includes an adhesive layer 25a formed on the surfaces of the coil patterns 22 and 23, And an insulating layer 25b formed on the surface of the adhesive layer 25a.

The adhesive layer 25a acts as a kind of AP (Adhesion Promoter). Unlike the conventional adhesive layer 25a, there is no need for chemical etching or the like. The adhesive layer 25a may include at least one of an alkyltrialkoxysilane and a derivative. The adhesive layer 25a may be formed by coating such a material by chemical vapor deposition (CVD) or the like, followed by heat treatment.

The thickness of the adhesive layer 25a may be 15 nm or more, more preferably 20 nm or more. In this case, the adhesive strength is particularly excellent. The upper limit of the thickness is not particularly limited, but may be about 30 nm.

Alkyltrialkoxysilanes and derivatives thereof may be compounds represented by the following formula wherein R ₁ to R ₄ may be any known organic chemical chain,

The insulating layer 25b substantially plays the role of the insulating film 25. The insulating layer 25b may include a parylene-based compound, and the insulating layer 25b may be formed by coating the material with a CVD (Chemical Vapor Deposition) method.

The electrode unit 30 serves to electrically connect the coil component 100 to the electronic device when the coil component 100 is mounted on the electronic device. The electrode unit 30 includes a first external electrode 31 and an external second electrode 32 which are disposed on the body unit 10 so as to be spaced apart from each other. The electrode portion 30 may include a pre-plating layer (not shown) to improve the electrical reliability between the coil portion 20 and the electrode portion 30, if necessary.

The first external electrode 31 covers the first surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The second outer electrode 32 covers the second surface of the body portion 10 and may extend partially to the third surface, the fourth surface, the fifth surface, and the sixth surface. The first external electrode 31 is connected to the lead-out terminal of the first coil pattern 22 drawn to the first surface of the body 10. The second external electrode 32 is connected to the lead-out terminal of the second coil pattern 23 drawn out to the second face of the body portion 10.

The first and second external electrodes 31 and 32 may include, for example, a conductive resin layer and a conductive layer formed on the conductive resin layer. The conductive resin layer may be formed by paste printing or the like and may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag) and a thermosetting resin. The conductor layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn). For example, a nickel layer and a tin As shown in FIG.

Manufacturing method of coil parts

Hereinafter, the method of manufacturing the coil component of the present disclosure will be described, but the overlapping contents of the above description will be omitted.

4 is a schematic process diagram showing an example of manufacturing a coil component.

Referring to the drawings, first, a support member 21 is prepared. A plurality of metal layers (not shown) may be disposed on both sides of the support member 21, which may be used as a seed layer when forming a coil or the like. The support member 21 may be of a large size for forming a plurality of coil parts 20. A via hole for forming the via 24 may be formed in the support member 21 in advance. The via hole may be a mechanical drill, a laser drill, or the like.

Next, coil patterns 22 and 23 are formed on the support member 21. [ The coil patterns 22 and 23 may be formed by forming a seed layer and then forming a plating layer on the seed layer. At this time, the vias 24 may also be formed at the same time. Electroplating copper plating or electroless copper plating can be used for the plating method. For example, a chemical vapor deposition (CVD), a physical vapor deposition (PVD), a sputtering, a subtractive, an additive, a semi-additive process, a modified semi- Process) can be used.

Next, an insulating film 25 covering the coil patterns 22 and 23 is formed. The insulating layer 25 may be formed by forming an adhesive layer 25a on the surfaces of the coil patterns 22 and 23 and then heat-treating the insulating layer 25a and then forming an insulating layer 25b on the surface of the heat-treated adhesive layer 25a. Details of this will be described later.

Next, through holes may be formed to penetrate the center portions of the first and second coil patterns 21, 22 of the support member 21. [ The through hole is filled with a magnetic material to form a magnetic core. In this case, characteristics such as inductance can be improved.

Next, a plurality of body parts 10 are formed by pressing and curing the magnetic material layer on the lower part of the upper part of the support member 21, and they are cut to obtain the body part 10. [

Next, external electrodes 31 and 32, that is, electrode portions 30 are formed in the body portion 10 to obtain the coil component 100. [

5 is a schematic process drawing showing an example of manufacturing an insulating film.

6 is a schematic cross-sectional view showing an example of an adhesive layer forming apparatus.

Referring to the drawing, first, the adhesive layer 25a may be formed by coating at least one of alkyltrialkoxysilane and derivatives on the surface of the coil patterns 22 and 23 by chemical vapor deposition (CVD) have. The heat treatment may be performed at about 130 ° C for about 30 minutes, but is not limited thereto. If the heat treatment is not performed, there is a problem that the adhesive force is lowered.

The adhesive layer 25a may be formed in the vacuum chamber device 200. The vacuum chamber device 200 may include a chamber body 210 and an AP liquid disposed on one side of the chamber body 210. [ A cold trap 230 disposed on the other side of the chamber body 210 and a vacuum pump 240 connected to the cold trap 230. [ A plurality of support members 21 on which the coil patterns 22 and 23 are formed are arranged in the chamber body 210. [

Next, the insulating layer 25b may be formed by coating a surface of the adhesive layer 25a with a parylene compound or the like by chemical vapor deposition (CVD). As a result, the insulating film 25 is formed. At this time, the vacuum chamber device 200 as described above can be used.

Experimental Example

7 shows the adhesive strength according to the thickness of the adhesive layer.

Fig. 8 shows the adhesive strength rating table according to ASTM D3002, D3359.

The experiment was carried out through the following process. First, a substrate having a width of 510 mm and a length of 410 mm, in which a coil pattern is formed in a vacuum chamber having a diameter of 930 mm and a height of 1200 mm, is charged with 30 sheets (total 60 sheets) at each of upper and lower ends. When the vacuum chamber pressure is 25 mTorr or less, AP (Adhesion Promoter ) In the presence of 5 cc, 10 cc, and 15 cc, respectively. Heat was applied at a temperature to enter the vacuum chamber.

When the AP solution starts to vaporize, the vacuum chamber pressure is maintained at 25 mTorr or more. When the AP is completely vaporized, the vacuum chamber pressure drops to 25 mTorr or less. At this time, the vacuum is released and the substrate is taken out. The substrate coated with AP was 130? For 30 minutes.

The heat-treated substrate was coated with a parylene insulator to a thickness of 7 μm in a CVD coating apparatus. The adhesion test was evaluated with a Scotch Tape Test according to ASTM D3002, D3359.

AP thickness according to AP dose was measured with Horiba UVISEL (Spectroscopic ellipsometer) equipment and 13.3 ㎚, 16.0 ㎚ and 20.9 ㎚ thickness respectively according to 5cc, 10cc and 15cc doses.

The adhesive strength showed the best 5B grade when the AP input amount was 15cc (AP thickness: 20.9nm). As a result, it can be seen that the adhesive strength is excellent when the AP thickness is 15 nm or more, more preferably 20 nm or more.

In the present disclosure, the term " electrically connected " means a concept including both a physical connection and a non-connection. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

Furthermore, the expression " an example used in the present disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

Also, the terms used in the present disclosure are used to illustrate only one example, and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1: Power inductor
2: High frequency inductor
3: Normal bead
4: High frequency beads
5: Common mode filter
100: Coil parts
10: Body part
20: coil part
21: Support member
22, 23: first and second coil patterns
24: Via
25; Insulating film
25a:
25b: insulating layer
30:
31, 32: first and second outer electrodes

Claims

A body portion including a magnetic material;
A coil portion disposed in the body portion, the coil portion including a support member, a coil pattern formed on at least one surface of the support member, and an insulating film covering the coil pattern; And
An electrode portion disposed on the body portion and including an external electrode electrically connected to the coil pattern; / RTI >
Wherein the insulating film includes an adhesive layer formed on a surface of the coil pattern and an insulating layer formed on a surface of the adhesive layer,
Wherein the adhesive layer comprises at least one of an alkyltrialkoxysilane and a derivative,
Coil parts.

delete

The method according to claim 1,
Wherein the insulating layer comprises a parylene-
Coil parts.

The method according to claim 1,
Wherein the adhesive layer has a thickness of 15 nm or more,
Coil parts.

Forming a coil pattern on at least one side of the support member;
Forming an insulating film covering the coil pattern;
Stacking a magnetic material layer on top and bottom of the support member; And
Forming an external electrode on the magnetic layer; / RTI >
The step of forming the insulating film may include:
Forming an adhesive layer on the surface of the coil pattern,
Heat treating the adhesive layer, and
And forming an insulating layer on the heat-treated adhesive layer surface,
Wherein the step of forming the adhesive layer is formed by coating at least one of alkyltrialkoxysilane and a derivative on the surface of the coil pattern by chemical vapor deposition (CVD)
A method of manufacturing a coil component.

delete

6. The method of claim 5,
Wherein the step of forming the insulating layer is formed by coating a parylene compound on the surface of the adhesive layer by chemical vapor deposition (CVD).
A method of manufacturing a coil component.

6. The method of claim 5,
Wherein the adhesive layer has a thickness of 15 nm or more,
A method of manufacturing a coil component.