KR101785471B1

KR101785471B1 - Method of manufacturing a dust-free cavity for printed circuit board

Info

Publication number: KR101785471B1
Application number: KR1020160009105A
Authority: KR
Inventors: 이충식; 황정호; 윤기호; 신윤철
Original assignee: 대덕지디에스 주식회사
Priority date: 2016-01-26
Filing date: 2016-01-26
Publication date: 2017-10-16
Also published as: KR20170089443A

Abstract

The present invention relates to a circuit board which prevents foreign matter such as a resin and a filler from remaining on the inner wall of a cavity during a cavity forming process of a circuit board to prevent dust from acting as a dust, And a manufacturing method thereof. The present invention is characterized in that a plating film is applied to an inner wall of a cavity to cut off dust generated during a cavity fabrication process.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a dust-free cavity for a circuit board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board (PCB) manufacturing method, and more particularly, to a method of manufacturing a cavity for mounting a semiconductor chip or other parts. More specifically, foreign substances such as resin, filler, and the like remain on the inner wall of the cavity during the cavity fabrication step of the circuit board, thereby preventing dust from acting in the subsequent process, To a circuit board manufacturing method.

Recently, it has been demanded to reduce the size of the components of electronic products and to intensify system integration technology. In order to meet such a demand, a semiconductor or a component is inserted and assembled into a cavity of a package substrate for a semiconductor so that the final thickness of the component is thinned, the circuit length is reduced to increase the signal transmission speed, It is required to develop a cavity type substrate manufacturing method capable of increasing the degree of integration.

In the prior art, a cavity is formed by performing a drilling process on a substrate on which a resin such as a copper foil and a prepreg is repeatedly laminated. In this case, dust generated in the cavity manufacturing step adheres to the cavity inner wall, Or may be transferred to a circuit to cause defects.

FIG. 1 is a view showing that a foreign substance such as a resin, a filler and the like remains in the cavity inner wall at the cavity manufacturing step according to the related art, and acts as dust in a subsequent process to cause defective black point . Particularly, in the case of a cavity substrate on which an image sensor is mounted, dusts such as resin or filler adhere to the camera lens, leading to defective black spots.

1. Korean Patent No. 10-1304359. 2. Korean Patent No. 10-1233642. 3. Korean Patent No. 10-063385.

An object of the present invention is to provide a circuit board manufacturing method in which a foreign material such as a resin, a filler, and the like remains in the cavity inner wall during a cavity manufacturing process, and is prevented from acting as dust in a subsequent process have.

According to a first embodiment of the present invention, there is provided a method of manufacturing a circuit board, comprising the steps of: (a) machining a slot penetrating a substrate above and below a substrate surface with a substrate laminated with a copper foil and an insulating layer; (b) performing a copper plating to form a copper plating film on the front surface of the substrate and the inner wall surface of the slot, and transferring the circuit pattern to the outer layer to form a circuit; (c) forming a protective coating by printing a solder resist and forming a finish-treated coating on the exposed copper (Cu) surface; (d) attaching an adhesive member to the lower surface of the substrate as a result of step (c); (e) forming a cavity by removing structures in the slot area through laser machining; And (f) attaching a stiffener to the lower surface of the resultant structure as a result of step (e).

A second embodiment of the present invention relates to a method of manufacturing a circuit board, comprising the steps of: (a) machining a slot up and down a substrate with respect to a substrate laminated with a copper foil and an insulating layer, to a specific layer of the substrate; (b) performing copper plating to form a copper plating film on the front surface of the substrate and the inner wall surface of the slot; (c) forming a cavity by removing the structure of the area inside the slot; And (d) forming a protective coating by printing a solder resist and forming a finish coating film on the exposed copper (Cu) surface.

In the present invention, since the inner wall of the cavity is covered with the copper plating film, foreign substances such as resin or filler are originally blocked from acting as dust, so that it is possible to prevent defects such as a black spot.

FIG. 1 is a view showing that a foreign material such as a resin, a filler, etc. remains in the cavity inner wall at the cavity manufacturing step according to the related art, and acts as dust in a subsequent process to cause a black spot defect or the like.
2A to 2F show a method of manufacturing a circuit board according to a first embodiment of the present invention.
3A to 3D are views showing a method of manufacturing a circuit board according to a second embodiment of the present invention.

The present invention is characterized in that a plating film is applied to an inner wall of a cavity to cut off dust generated during a cavity fabrication process.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings 2 and 3. 2A to 2F are views showing a method of manufacturing a circuit board according to a first embodiment of the present invention.

2A, a build-up substrate is manufactured by repeatedly laminating a resin insulating layer such as a prepreg and a copper foil, and then a slot 110 is formed so as to pass through the cross section of the substrate 100 vertically. The slot 110 can be fabricated using a laser drill or a router.

Referring to FIG. 2B, a coating 120 is formed on the inner wall of the slot by performing copper plating on the entire surface of the substrate, and an image process such as photographing, developing, etching, etc. is performed to form a circuit on the outer layer.

Referring to FIG. 2C, a protective coating 130 is printed on the outer layer using a solder resist (PSR) or the like, followed by a finish treatment such as gold plating or OSP treatment to form a finish coating film 140 on the exposed copper foil .

Referring to FIG. 2D, an adhesive member 150 such as an adhesive or an adhesive film is attached to the bottom of the substrate. Next, referring to FIG. 2E, the adhesive of the slot machining portion is removed through laser machining, and the portion through which the cavity is to be formed in the PCB is passed through.

Referring to FIG. 2F, a stiffener 190 is attached under the lower surface bonding member 150 of the substrate to complete the cavity shape. As a preferred embodiment of the stiffener 190 according to the present invention, SUS or metal-based materials can be used.

3A to 3F are views showing a method of manufacturing a circuit board according to a second embodiment of the present invention. 3A, a build-up substrate is manufactured by repeatedly laminating a resin insulating layer such as a prepreg and a copper foil, and then a slot 210 is formed so as to pass through a top surface and a bottom surface of the substrate 200, The slot 210 is formed so as to penetrate only a part of the slot 210.

Although not shown in detail in FIG. 3A, as a preferred embodiment of the present invention, it is preferable that the slot 210 is fabricated to the inner copper foil layer and the release film is coated on the inner copper foil layer.

Referring to FIG. 3B, in the state that the slot 210 is manufactured, copper plating is performed on the entire surface of the substrate to form a copper plating film 220, and an image process such as photo, development, etching, etc. is performed to form a circuit on the outer layer .

Referring to FIG. 3C, the cavity 230 is formed by removing the remaining island 220. Referring to FIG. 3D, a protective coating 240 such as PSR is finally printed and subjected to gold plating or OSP finish treatment to form a finish coating film.

According to the first and second embodiments of the present invention, since the copper plating films 120 and 220 are formed on the inner wall of the cavity, it is possible to prevent the resin or filler from generating dust on the inner wall.

The foregoing has somewhat improved the features and technical advantages of the present invention in order to better understand the claims of the invention described below. Additional features and advantages that constitute the claims of the present invention will be described in detail below. It should be appreciated by those skilled in the art that the disclosed concepts and specific embodiments of the invention can be used immediately as a basis for designing or modifying other structures to accomplish the invention and similar purposes.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures to accomplish the same purpose of the present invention. It will be apparent to those skilled in the art that various modifications, substitutions and alterations can be made hereto without departing from the spirit or scope of the invention as defined in the appended claims.

Claims

A method of manufacturing a circuit board,
(a) machining a slot penetrating the upper and lower surfaces of the substrate with respect to the substrate laminated with the copper foil and the insulating layer;
(b) performing a copper plating to form a copper plating film on the front surface of the substrate and the inner wall surface of the slot, and transferring the circuit pattern to the outer layer to form a circuit;
(c) forming a protective coating by printing a solder resist and forming a finish-treated coating on the exposed copper (Cu) surface;
(d) attaching an adhesive member to the lower surface of the substrate as a result of step (c);
(e) forming a cavity by removing structures in the slot area through laser machining; And
(f) attaching a stiffener to the lower surface of the resultant structure as a result of step (e)
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