KR101778592B1 - Deposition chamber including inner shield having weight frame - Google Patents
Deposition chamber including inner shield having weight frame Download PDFInfo
- Publication number
- KR101778592B1 KR101778592B1 KR1020160013911A KR20160013911A KR101778592B1 KR 101778592 B1 KR101778592 B1 KR 101778592B1 KR 1020160013911 A KR1020160013911 A KR 1020160013911A KR 20160013911 A KR20160013911 A KR 20160013911A KR 101778592 B1 KR101778592 B1 KR 101778592B1
- Authority
- KR
- South Korea
- Prior art keywords
- sample
- film
- weight
- inner shield
- sample holder
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a deposition chamber apparatus, and more particularly, to a deposition chamber apparatus capable of closely contacting a sample-attached film with a suitable pressure to a sample holder using the weight of a weight, The present invention relates to a deposition chamber apparatus capable of effectively performing temperature control of a deposition chamber and a deposition chamber apparatus in which a weight is adhered to a film to divide the deposition space and the non-deposition space based on the inner shield.
Description
The present invention relates to a deposition chamber apparatus, and more particularly, to a deposition chamber apparatus capable of closely contacting a sample-attached film with a suitable pressure to a sample holder using the weight of a weight, The present invention relates to a deposition chamber apparatus capable of effectively performing temperature control of a deposition chamber and a deposition chamber apparatus in which a weight is adhered to a film to divide the deposition space and the non-deposition space based on the inner shield.
In order to shield electromagnetic interference (EMI) of a sample such as a printed circuit board, a method of attaching a shielding film to the surface of a sample is generally used.
The method of attaching such a shielding film has a problem in that productivity, shielding uniformity, and stability are lowered because the processes such as shape processing, mold production, and fabric attachment are performed by hand, but they are continuously used because they are easy to control the instantaneous production amount .
Recently, researches for conducting electromagnetic wave shielding of samples using a vacuum deposition method such as sputtering have been actively carried out. Electromagnetic wave shielding through vacuum deposition can automate all processes, thereby reducing production cost and achieving uniform thin film deposition It has attracted attention because of its advantages.
Generally, in order to perform electromagnetic shielding of a sample by using a vacuum deposition method, a sample is attached to a temperature-controlling chuck (generally a cooling chuck) and then fixed in a vacuum chamber (batch type) to deposit a shielding layer (In-line type) deposition. Applicants mount a plurality of samples by attaching them to an adhesive film and attaching them to the temperature control chuck.
However, this adhesive film causes thermal deformation due to an increase in the internal temperature of the vacuum chamber, so that the sample is not brought into close contact with the temperature control chuck, and the temperature control effect of the sample is lowered.
If the temperature control effect is so low that the temperature of the sample is not controlled, there is a problem that the electromagnetic wave shielding layer is unevenly deposited or the sample is damaged by heat.
Meanwhile, when the evaporation material is scattered in the vacuum chamber, the evaporation material is scattered to the undesired space in the vacuum chamber, which shortens the cleaning period for cleaning the inside of the vacuum chamber to lower the operation rate of the deposition chamber device It acts as a cause.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to improve the temperature control efficiency of a sample by maximizing the adhesion between a sample to be deposited and a sample holder, To provide a deposition chamber apparatus having a deposition chamber.
Another object of the present invention is to provide a deposition chamber apparatus capable of bringing a sample into close contact with a sample holder without deforming or breaking the film with a simple structure when the film with the sample is pressed toward the sample holder.
It is still another object of the present invention to provide a deposition chamber apparatus capable of preventing deposition of deposition material in an undesired space of an internal space of a vacuum chamber, thereby extending a cleaning cycle.
According to an aspect of the present invention, there is provided a vacuum chamber comprising: a vacuum chamber; A cathode disposed within the vacuum chamber to scatter the evaporation material; A sample holder placed inside the vacuum chamber so as to face the cathode, the sample being an object to be vapor deposited; And an inner shield disposed between the sample holder and the cathode within the vacuum chamber, the inner shield shielding a region of the region between the cathode and the sample holder, and limiting a region where the evaporation material scatters to the sample. Wherein the sample is attached on a film and is placed on the sample holder, and a weight is further provided under the edge of the opening area of the inner shield, and when the inner shield is lowered or the sample holder is lifted, Contacting the upper edge of the film and pressing the film toward the sample holder to cause the film to be brought into close contact with the upper surface of the sample holder.
In a preferred embodiment, the weight is provided so as to be movable up and down on the inner shield.
In a preferred embodiment, the weight is exposed to the lower portion of the inner shield by its own weight, and after the inner shield is lowered or the sample holder is raised to contact the film, the inner shield is further lowered, The inner shield is inserted into the inner shield to provide a pressure due to its own weight to the film.
In a preferred embodiment, a support frame for supporting the shape of the film is attached to an upper edge of the film, and the weight presses the upper surface of the support frame to bring the film into close contact with the sample holder.
In a preferred embodiment, the vacuum chamber is divided into an evaporation space, which is an upper space, and a non-evaporation space, which is a lower space, based on the inner shield and the film when the weight is brought into contact with the film.
In a preferred embodiment, the weight is composed of circular or elliptical ring or polygonal frames.
In a preferred embodiment, the weight is made of copper.
In a preferred embodiment, the sample holder comprises a temperature controllable chuck; And a sample adapter stacked on top of the temperature control chuck and having an upper surface on which a film with the sample attached is placed and which transfers the heat of the sample to the temperature control chuck or transfers the heat of the temperature control chuck to the sample, .
In a preferred embodiment, the temperature control chuck and the sample adapter may be integrally constituted.
In a preferred embodiment, a buffer pad for close contact of the film is coated or attached to the upper surface of the sample adapter.
In a preferred embodiment, the upper surface of the sample adapter is a curved surface.
In a preferred embodiment, the upper surface of the sample adapter is a cylindrical surface or a spherical surface.
In a preferred embodiment, the top surface width of the sample adapter is smaller than the width of the film.
In a preferred embodiment, the top surface area of the sample adapter is smaller than the area of the film.
In a preferred embodiment, a plurality of grooves are formed on the upper surface of the sample adapter.
In a preferred embodiment, the grooves are connected to one another.
In a preferred embodiment, the grooves are formed in a lattice shape.
In a preferred embodiment, the sample adapter is provided with an exhaust line which, when loaded on the film, exhausts the air of the groove to cause the film to adhere to the upper surface of the sample adapter.
In a preferred embodiment, an insulating layer is coated or attached to the top surface of the sample adapter.
The present invention further provides a device in which a plurality of films are attached to a film to deposit a coating layer on the deposition chamber device.
The present invention has the following excellent effects.
According to the deposition chamber apparatus of the present invention, the edge of the film to which the sample is attached is pressed toward the sample holder using a weight, thereby improving the temperature control efficiency of the sample by increasing the adhesion between the sample and the sample holder .
In addition, according to the deposition chamber apparatus of the present invention, since the upper surface of the sample holder is curved to maximize the adhesion between the sample and the sample adapter, the temperature control efficiency can be enhanced and the quality of the deposition can be greatly improved.
Further, according to the deposition chamber apparatus of the present invention, since the film can be pressed by the weight of the weight without a separate driving device, the structure can be simplified and the film can be pressed with an appropriate load, There are advantages.
In addition, according to the deposition chamber apparatus of the present invention, deposition materials can be deposited only in the deposition space, which is the upper space, based on the film that is in close contact with the inner shield and the inner shield in the inner space of the vacuum chamber, Deposition of the deposition material in the space is prevented, and the yield of the cleaning chamber can be improved by extending the cleaning cycle in the vacuum chamber.
1 is a view showing a deposition chamber apparatus according to an embodiment of the present invention,
2 is a view showing a sample holder of a deposition chamber apparatus according to an embodiment of the present invention,
3 shows another example of the sample holder shown in Fig. 2,
4 is a top view of a sample holder of a deposition chamber apparatus according to an embodiment of the present invention,
Fig. 5 shows another example of the upper surface shown in Fig. 4,
FIG. 6 is a diagram illustrating deposition of a sample to be deposited on a film in a deposition chamber apparatus according to an embodiment of the present invention;
7 is a top view of an inner shield of a deposition chamber apparatus according to an embodiment of the present invention,
FIG. 8 is a bottom view of the inner shield of FIG. 7,
9 to 10 are views for explaining a process of depositing a sample using a deposition chamber apparatus according to an embodiment of the present invention.
Although the terms used in the present invention have been selected as general terms that are widely used at present, there are some terms selected arbitrarily by the applicant in a specific case. In this case, the meaning described or used in the detailed description part of the invention The meaning must be grasped.
Hereinafter, the technical structure of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.
However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Like reference numerals designate like elements throughout the specification.
FIG. 1 illustrates a deposition chamber apparatus according to an embodiment of the present invention, and a
In addition, the coating layer may be an electromagnetic interference (EMI) shielding layer.
Referring to FIG. 1, a
The
The
When performing physical vapor deposition, the
The
In addition, the
In addition, the
6, a
That is, the
The
That is, the
Also, the
2, the
The
Generally, a cooling fluid flows in the
That is, the
Further, the
The
That is, the
In addition, the
3, the upper surface of the
Here, the curved surface is defined as a concept including at least a curved surface. For example, the longitudinal cross-section of the
Also, the upper surface of the
However, in order to maximize the adhesion, the upper surface of the
4, the
Although not shown, the upper surface of the
However, the upper surface of the
The upper surface of the
The width w1 and the length w2 of the
In other words, the upper surface area of the
Also, a plurality of grooves (G) may be formed on the upper surface of the
In addition, the grooves G are connected to each other and connected to each other as a groove having a predetermined depth on the upper surface of the
However, the shape of the grooves G is not particularly limited, and it is sufficient that the grooves G are uniformly distributed over the entire upper surface of the
In addition, the grooves G may be formed on the upper surface of the
Also, although not shown, an exhaust line for exhausting the air of the grooves G may be formed in the
That is, the
In addition, although not shown, a buffer pad for closely contacting the
In addition, the buffer pad may serve as an insulating layer for insulating the
The
In addition, the
FIG. 7 is a top view of the
The
Also, the
For example, the
An
That is, the deposition material scattered by the
In addition, a
The
1, the
That is, when the
In addition, the
That is, when the
When the
At this time, the
In addition, since the size of the
However, the
8, the
Hereinafter, a process of depositing a coating layer on the
9, when a
At this time, only the lower center of the
Next, as shown in FIG. 10, the
However, the
The inner space of the
That is, since the
Accordingly, it is possible to prevent the evaporation material from scattering in a space where deposition is not required. This can extend the cleaning cycle for cleaning the inside of the
11, the
Next, a power source is applied to the
Therefore, according to the
According to the
According to the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, Various changes and modifications will be possible.
100: Deposition chamber device 110: Vacuum chamber
120: cathode 130: sample holder
131: Temperature control chuck 132: Sample adapter
140: inner shield 141: weight weight
Claims (20)
A cathode disposed within the vacuum chamber to scatter the evaporation material;
A sample holder placed inside the vacuum chamber so as to face the cathode, the sample being an object to be vapor deposited; And
An inner shield located between the sample holder and the cathode in the vacuum chamber and blocking an area of a region between the cathode and the sample holder to restrict a region in which the evaporation material scatters to the sample; Including,
The sample is attached to the film and placed on the sample holder,
A weight is further provided under the edge of the opening area of the inner shield,
Wherein the weight is brought into contact with an upper portion of an edge of the film when the inner shield is lowered or the sample holder is lifted to urge the film toward the sample holder to bring the film into close contact with the upper surface of the sample holder,
Wherein an upper surface area of the sample adapter is smaller than an area of the film and an edge portion of the film to which the weight is further pressed is not in contact with the upper surface of the sample holder, So that the entire upper surface of the sample adapter is covered and adhered.
Wherein the weight is movable up and down on the inner shield.
When the inner shield is lowered or the sample holder is raised to contact the film and further the inner shield is lowered or the sample holder is raised, the weight of the inner shield is lowered by the weight of the inner shield, Wherein the film is inserted into the inner shield to provide a pressure due to its own weight to the film.
Wherein a support frame for supporting the shape of the film is attached to an upper edge of the film and the weight pushes the upper surface of the support frame so that the film is brought into close contact with the sample holder.
The vacuum chamber includes:
Wherein the inner shield and the film are divided into a deposition space which is an upper space and a non-deposition space which is a lower space based on the inner shield and the film when the weight is added to the film.
Characterized in that the weight comprises a circular or elliptical ring or polygonal frame.
Wherein the weight is made of copper.
The sample holder
Temperature control chuck; And
A sample adapter stacked on top of the temperature control chuck and having an upper surface on which a film with the sample attached is placed and which transfers the heat of the sample to the temperature control chuck or transfers the heat of the temperature control chuck to the sample; Wherein the deposition chamber device comprises a deposition chamber.
Wherein the temperature control chuck and the sample adapter are integrally formed.
Wherein a buffer pad for adhering the film is coated or attached to the upper surface of the sample adapter.
Wherein the top surface of the sample adapter is a curved surface.
Wherein the upper surface of the sample adapter is a cylindrical surface or a spherical surface.
Wherein an upper surface width of the sample adapter is smaller than a width of the film.
Wherein a plurality of grooves are formed on an upper surface of the sample adapter.
And the grooves are connected to each other to communicate with each other.
Wherein the grooves are formed in a lattice shape.
Wherein the sample adapter is provided with an exhaust line which, when loaded on the film, exhausts the air of the groove to cause the film to adhere to the upper surface of the sample adapter.
Wherein an insulating layer is coated or adhered to an upper surface of the sample adapter.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160013911A KR101778592B1 (en) | 2016-02-04 | 2016-02-04 | Deposition chamber including inner shield having weight frame |
PCT/KR2016/008782 WO2017030315A1 (en) | 2015-08-19 | 2016-08-10 | Sample mount for deposition apparatus, deposition apparatus having said sample mount |
TW105126312A TWI623641B (en) | 2015-08-19 | 2016-08-18 | Sample holder for vapor deposition device and vapor deposition device having the holder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160013911A KR101778592B1 (en) | 2016-02-04 | 2016-02-04 | Deposition chamber including inner shield having weight frame |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020170008717A Division KR102007910B1 (en) | 2017-01-18 | 2017-01-18 | Deposition chamber including sample holder tightly contact with film |
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Publication Number | Publication Date |
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KR20170092796A KR20170092796A (en) | 2017-08-14 |
KR101778592B1 true KR101778592B1 (en) | 2017-09-26 |
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KR1020160013911A KR101778592B1 (en) | 2015-08-19 | 2016-02-04 | Deposition chamber including inner shield having weight frame |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5651693B2 (en) * | 2010-06-23 | 2015-01-14 | 株式会社アルバック | Substrate holder and film forming apparatus |
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2016
- 2016-02-04 KR KR1020160013911A patent/KR101778592B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5651693B2 (en) * | 2010-06-23 | 2015-01-14 | 株式会社アルバック | Substrate holder and film forming apparatus |
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