KR101822128B1 - Sample supporter for deposition apparatus and deposition apparatus having the supporter - Google Patents

Sample supporter for deposition apparatus and deposition apparatus having the supporter Download PDF

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Publication number
KR101822128B1
KR101822128B1 KR1020150188064A KR20150188064A KR101822128B1 KR 101822128 B1 KR101822128 B1 KR 101822128B1 KR 1020150188064 A KR1020150188064 A KR 1020150188064A KR 20150188064 A KR20150188064 A KR 20150188064A KR 101822128 B1 KR101822128 B1 KR 101822128B1
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KR
South Korea
Prior art keywords
sample
film
adapter
sample adapter
temperature control
Prior art date
Application number
KR1020150188064A
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Korean (ko)
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KR20170022835A (en
Inventor
안경준
김찬호
정성훈
Original Assignee
(주)에스엔텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에스엔텍 filed Critical (주)에스엔텍
Priority to PCT/KR2016/008782 priority Critical patent/WO2017030315A1/en
Priority to TW105126312A priority patent/TWI623641B/en
Publication of KR20170022835A publication Critical patent/KR20170022835A/en
Application granted granted Critical
Publication of KR101822128B1 publication Critical patent/KR101822128B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a sample holder for a deposition apparatus and a deposition apparatus having the sample holder. More particularly, the present invention relates to a deposition apparatus capable of effectively performing temperature control of a sample to be deposited, The present invention relates to a sample holder for a deposition apparatus capable of electrically protecting a sample holder and a sample holder thereof.

Description

Technical Field [0001] The present invention relates to a sample holder for a deposition apparatus and a deposition apparatus having the sample holder,

The present invention relates to a sample holder for a deposition apparatus and a deposition apparatus having the sample holder. More particularly, the present invention relates to a deposition apparatus capable of effectively performing temperature control of a sample to be deposited, The present invention relates to a sample holder for a deposition apparatus capable of electrically protecting a sample holder and a sample holder thereof.

In order to shield electromagnetic interference (EMI) of a sample such as a printed circuit board, a method of attaching a shielding film to the surface of a sample is generally used.

The method of attaching such a shielding film has a problem in that productivity, shielding uniformity, and stability are lowered because the processes such as shape processing, mold production, and fabric attachment are performed by hand, but they are continuously used because the instantaneous production amount is easy to control .

Recently, researches for conducting electromagnetic wave shielding of samples using a vacuum deposition method such as sputtering have been actively carried out. Electromagnetic wave shielding through vacuum deposition can automate all processes, thereby reducing production cost and achieving uniform thin film deposition It has attracted attention because of its advantages.

Generally, in order to perform electromagnetic shielding of a sample by using a vacuum deposition method, a sample is attached to a temperature-controlling chuck (generally a cooling chuck) and then fixed in a vacuum chamber (batch type) to deposit a shielding layer (In-line type) deposition, wherein the sample is attached to the temperature control chuck using a tacky film.

However, since the adhesive film causes thermal deformation due to an increase in the internal temperature of the vacuum chamber, the sample is not brought into close contact with the temperature control chuck, and the temperature control effect of the sample is lowered.

If the temperature control effect is so low that the temperature of the sample is not controlled, there is a problem that the electromagnetic wave shielding layer is unevenly deposited or the sample is damaged by heat.

Further, there is a problem that the sample is not insulated from the temperature control chuck and electrical damage occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a sample holder capable of greatly improving the quality of electromagnetic wave shielding deposition by maximizing the adhesion between the sample and the sample adapter, And to provide a deposition apparatus having a sample holder.

It is also an object of the present invention to provide a sample holder capable of maintaining insulation between a sample and a sample adapter to prevent electrical damage of the sample from occurring and a deposition apparatus having the sample holder.

According to an aspect of the present invention, there is provided a sample holder for holding a sample, which is an object to be deposited, in a vacuum chamber, comprising: a temperature controllable chuck; And a sample adapter stacked on top of the temperature control chuck and having an upper surface on which a film with the sample attached is placed and which transfers the heat of the sample to the temperature control chuck or transfers the heat of the temperature control chuck to the sample, Wherein the upper surface of the sample adapter is a curved surface.

In a preferred embodiment, the temperature control chuck and the sample adapter are integrally formed.

In a preferred embodiment, a buffer pad for close contact of the film is coated or attached to the upper surface of the sample adapter.

In a preferred embodiment, the upper surface of the sample adapter is provided with a cylindrical surface or a spherical surface.

In a preferred embodiment, the top surface width of the sample adapter is smaller than the width of the film.

In a preferred embodiment, the top surface area of the sample adapter is smaller than the area of the film.

In a preferred embodiment, a plurality of grooves are formed on the upper surface of the sample adapter.

In a preferred embodiment, the grooves are connected to one another.

In a preferred embodiment, the grooves are formed in a lattice shape.

In a preferred embodiment, the sample adapter is provided with an exhaust line which, when loaded on the film, exhausts the air of the groove to cause the film to adhere to the upper surface of the sample adapter.

In a preferred embodiment, an insulating layer is coated or attached to the top surface of the sample adapter.

In a preferred embodiment, the film is attached to the top edge of the film, and when the film is placed on the sample adapter, the edge portion of the film that does not contact the sample adapter is pressed downward, And a pressing block for bringing the pressing surface into close contact with the upper surface.

In a preferred embodiment, the pressing block is provided with a metal frame attached along a top edge of the film.

The present invention also provides a vacuum chamber comprising: a vacuum chamber; And a sample holder, which is fixed or moved inside the vacuum chamber, and which can mount a sample, which is an object to be deposited, on an upper surface.

The present invention has the following excellent effects.

First, with the sample holder of the present invention and the deposition apparatus having the sample holder, it is possible to maximize the adhesion between the sample and the sample holder to effectively remove the heat generated from the sample or effectively heat the sample, Can be greatly improved.

In addition, since the sample holder and the deposition apparatus having the sample holder can maintain the insulation between the sample and the temperature control chuck, there is an advantage that electrical damage can be prevented from occurring in the sample during electromagnetic wave shielding deposition.

1 is a view showing a sample holder and a deposition apparatus according to an embodiment of the present invention;
2 is a detailed view showing the configuration of a sample holder according to an embodiment of the present invention,
3 is a view for explaining a pressure block of a sample holder according to an embodiment of the present invention,
4 is a view showing a sample beggar bar according to an embodiment of the present invention,
5 is a view for explaining a sample adapter of a sample holder according to an embodiment of the present invention,
6 is a view showing an example of a groove of a sample holder according to an embodiment of the present invention,
7 is a view showing another example of a groove of a sample holder according to an embodiment of the present invention;
8 is a view for explaining a film of a sample holder according to an embodiment of the present invention,
9 is a view showing a sample holder according to another embodiment of the present invention.

Although the terms used in the present invention have been selected as general terms that are widely used at present, there are some terms selected arbitrarily by the applicant in a specific case. In this case, the meaning described or used in the detailed description part of the invention The meaning must be grasped.

Hereinafter, the technical structure of the present invention will be described in detail with reference to preferred embodiments shown in the accompanying drawings.

However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Like reference numerals designate like elements throughout the specification.

Referring to FIG. 1, a sample holder 100 according to an embodiment of the present invention is a holder for placing a sample 10, which is an object of deposition, in a vacuum chamber 200 to perform deposition.

In addition, the sample holder 100 may be fixed in the vacuum chamber 200 during the deposition process, reciprocated, or passed through the vacuum chamber 200.

In other words, the sample holder 100 can be deposited in a batch type in the vacuum chamber 200, and can be deposited in an in-line type.

In addition, there is no particular restriction on the type of the deposition, but the effect can be maximized when the electromagnetic wave shielding deposition has a relatively large heat generation.

In addition, although not shown, a sputtering target or an electrode for plasma formation may be provided in the vacuum chamber 200.

In addition, the vacuum chamber 200 can deposit an electromagnetic shielding layer on the sample 10 by a physical vapor deposition or chemical vapor deposition method.

However, there is no particular limitation on the method of depositing the shielding layer in the sample 10. [

In addition, the present invention may be provided as one deposition apparatus including the sample holder 100 and the vacuum chamber 200.

Hereinafter, the configuration of the sample holder 100 will be described in detail with reference to FIG.

Referring to FIG. 2, the sample holder 100 includes a temperature controlling chuck 110, a sample adapter 120, and the like.

In addition, the sample adapter 120 may be provided separately from the temperature control chuck 110.

The temperature control chuck 110 is a temperature controllable plate fixed or moving within the vacuum chamber 200.

The temperature control chuck 110 is provided with a flow path 111 through which a temperature control fluid (cooling fluid or heating fluid) can flow, and serves to cool the sample 10.

Generally, a cooling fluid flows in the flow path 111 to cool the sample 10, but a heating fluid may flow to heat the sample 10 to a predetermined deposition temperature in an initial stage of deposition.

That is, the temperature control chuck 110 may be provided with a cooling chuck or a heating chuck.

The sample adapter 120 is stacked on top of the temperature control chuck 110, and the sample 10 is placed on the upper surface.

2, the temperature adjusting chuck 110 and the sample adapter 120 are separated from each other. However, as shown in FIG. 4, the temperature adjusting chuck 110 and the sample adapter 120 are integrally formed .

The sample adapter 120 transfers the heat of the sample 10 to the temperature control chuck 110 or provides the heat of the temperature control chuck 110 to the sample 10.

That is, the sample adapter 120 is a predetermined heat transfer medium that allows the sample 10 to be cooled or heated.

In addition, the sample adapter 120 is preferably attached to the upper surface of the temperature control chuck 110 to be fixedly laminated, but can be lifted without being attached when the position can be stably maintained.

5, the sample adapter 120 has a curved surface whose upper surface has a predetermined radius of curvature (R).

Here, the curved surface is defined as a concept including at least a curved surface. For example, the longitudinal cross-section of the sample adapter 120 may have a rounded top surface with the top two corners of the rectangle, with only the top edges of the sample adapter 120 having a partially curved surface .

In addition, the upper surface of the sample adapter 120 may be a surface including a bent line. For example, the sample adapter 120 may have a longitudinally-elongated cross-section having a predetermined bent line (corner) in a triangular or trapezoidal shape It can be a polygonal surface.

However, in order to maximize the adhesion, the upper surface of the sample adapter 120 is preferably curved.

In addition, the sample adapter 120 may have a rectangular top surface as shown in FIG. 6 and may be provided with a sample adapter 120a whose top surface is circular as shown in FIG.

However, the upper surface of the sample adapter 120 should have a predetermined curved surface.

As shown in FIG. 5, the upper surface of the sample adapter 120 may be a cylindrical surface cut in a longitudinal direction of the cylinder, or may be a spherical surface in which a predetermined portion of the spherical shape is cut into a square or circular shape.

In addition, the upper surface of the sample adapter 120 can be formed into a polygonal, triangular, or polygonal shape with rounded corners.

In other words, the cross section of the sample adapter 120 in the transverse direction is not limited to the shape, but the upper surface should be a cylindrical surface or a curved surface which is a spherical surface.

2, the sample 10 is attached to the upper surface of the sample adapter 120 through the film 130. [

The film 130 may be attached to the upper surface of the sample adapter 120 after the sample 10 is attached to the film 130. The film 130 may be first attached to the upper surface of the sample adapter 120 After attaching, the sample 10 may be attached.

In addition, the film 130 may be a tacky film, for example, a polyimide film (PI film).

5, the upper surface of the sample adapter 120 must be entirely covered by the film 130, so that the width w1 and the length w2 of the sample adapter 120 are Should be smaller than the width and length of the film 130.

In other words, the upper surface area of the sample adapter 120 should be smaller than the area of the film 130.

In addition, a plurality of grooves 121 may be formed on the upper surface of the sample adapter 120.

In addition, the grooves 121 are connected to and communicate with each other as a groove having a predetermined depth on the upper surface of the sample adapter 120, and may be formed in a lattice pattern as shown in FIG.

However, the shape of the grooves 121 is not particularly limited, and it is sufficient that the grooves 121 are uniformly distributed over the entire upper surface of the sample adapter 120 and are in communication with each other.

When the film 130 is attached to the upper surface of the sample adapter 120, the grooves 121 may be formed on the upper surface of the sample adapter 120 by venting the air inside the groove. So that it can be closely contacted.

Also, although not shown, an exhaust line for exhausting the air of the grooves 121 may be formed in the sample adapter 120.

When the film 130 is attached to the sample adapter 120, the edge 130 of the film 130 is pressed downward so that the film 130 contacts the upper surface of the sample adapter 120 And further includes a pressing block 140 which is closely attached and has a predetermined tension.

Also, the pressing block 140 may be formed in a bar shape.

However, as shown in FIG. 3, the pressing block 140 may be formed in a square ring shape for pressing the entire upper edge of the film 130, and may be made of a metal frame.

However, when the sample adapter 120 is formed in a circular shape as shown in FIG. 7, the pressing block 140 may be formed in a ring shape.

The vertical cross section of the pressing block 140 is preferably rectangular.

The sample adapter 120 may also be configured such that when the film 130 is pressed by the pressing block 140 the film 130 partially covers the sides of the sample adapter 120, And has a predetermined height h.

Referring to FIG. 8, a plurality of connection line exposure grooves 131 may be formed in the film 130 so that the electrical connection lines 11 of the sample 10 may be exposed downward.

The connecting line exposed groove 131 is smaller than the area of the sample 10 and the lower edge of the sample 10 can be attached and fixed to the upper edge of the connecting line exposed groove 131 .

Therefore, according to the sample holder 100 according to the embodiment of the present invention, since the sample 10 can be brought into close contact with the sample adapter 120 to improve the cooling efficiency, it is possible to perform the deposition of the electromagnetic wave shielding layer with high quality .

9 shows a sample holder 100a according to another embodiment of the present invention. The sample holder 100a according to another embodiment of the present invention is different from the sample holder 100 according to the embodiment of the present invention And further includes an insulating layer 150 in addition to the temperature controlling chuck 110 and the sample adapter 120.

The insulating layer 150 is formed on the sample adapter 120 to electrically isolate the sample adapter 120 and the sample 10 from each other.

In addition, the insulating layer 150 may be coated on the upper surface of the sample adapter 120, and may be formed by attaching an insulating film.

That is, when the electromagnetic interference shielding process is performed on the insulating layer 150, the sample 10 is insulated from the sample adapter 120, thereby preventing electrical damage.

Although not shown, the sample holder 100a may further include a buffer pad on the upper surface of the sample adapter 120 to closely contact the film.

In addition, the buffer pad may function as the insulating layer 150 and may be, for example, a silicon pad.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, Various changes and modifications will be possible.

100: Sample holder 110: Temperature control chuck
111: Euro 120: Sample Adapter
121: groove 130: film
140: pressure block 150: insulating layer
200: vacuum chamber

Claims (14)

A sample holder for placing a sample as an object to be deposited in a vacuum chamber,
Temperature control chuck; And
A sample adapter stacked on top of the temperature control chuck and having an upper surface on which a film with the sample attached is placed and which transfers the heat of the sample to the temperature control chuck or transfers the heat of the temperature control chuck to the sample; Lt; / RTI >
The top surface of the sample adapter is a curved surface,
Wherein the sample adapter has a top surface area smaller than that of the film and a corner portion of the film not touching the top surface of the sample adapter so that the edge portion of the film is pressed downward by the weight of the pressing block, After the entire top surface of the adapter is covered and adhered, deposition is performed,
Wherein the pressing block is not secured to the sample adapter when spaced apart from the sample adapter when pressing the film and does not press the film toward the sample adapter but fix it to the sample holder.
The method according to claim 1,
Wherein the temperature adjusting chuck and the sample adapter are integrally formed.
3. The method according to claim 1 or 2,
Wherein a buffer pad for adhering the film is coated or attached to the upper surface of the sample adapter.
3. The method according to claim 1 or 2,
Wherein the upper surface of the sample adapter is a cylindrical surface or a spherical surface.
3. The method according to claim 1 or 2,
Wherein a width of an upper surface of the sample adapter is smaller than a width of the film.
delete 3. The method according to claim 1 or 2,
And a plurality of grooves are formed on an upper surface of the sample adapter.
8. The method of claim 7,
And the grooves are connected to each other to communicate with each other.
9. The method of claim 8,
Wherein the grooves are formed in a lattice shape.
8. The method of claim 7,
Wherein the sample adapter is provided with an exhaust line for exhausting the air of the groove when the film is loaded on the film, so that the film is brought into close contact with the upper surface of the sample adapter.
3. The method according to claim 1 or 2,
Wherein an insulating layer is coated or adhered to the upper surface of the sample adapter.
delete The method according to claim 1,
Wherein the pressing block is a metal frame attached along a top edge of the film.
A vacuum chamber; And
The deposition apparatus according to claim 1 or 2, wherein the sample holder is fixed or movable within the vacuum chamber, and the sample, which is an object to be deposited, can be mounted on the upper surface.
KR1020150188064A 2015-08-19 2015-12-29 Sample supporter for deposition apparatus and deposition apparatus having the supporter KR101822128B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/KR2016/008782 WO2017030315A1 (en) 2015-08-19 2016-08-10 Sample mount for deposition apparatus, deposition apparatus having said sample mount
TW105126312A TWI623641B (en) 2015-08-19 2016-08-18 Sample holder for vapor deposition device and vapor deposition device having the holder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150116631 2015-08-19
KR20150116631 2015-08-19

Publications (2)

Publication Number Publication Date
KR20170022835A KR20170022835A (en) 2017-03-02
KR101822128B1 true KR101822128B1 (en) 2018-01-25

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KR1020150188064A KR101822128B1 (en) 2015-08-19 2015-12-29 Sample supporter for deposition apparatus and deposition apparatus having the supporter

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252271A (en) 2001-02-26 2002-09-06 Anelva Corp Substrate holding device for substrate processing apparatus
JP5651693B2 (en) * 2010-06-23 2015-01-14 株式会社アルバック Substrate holder and film forming apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252271A (en) 2001-02-26 2002-09-06 Anelva Corp Substrate holding device for substrate processing apparatus
JP5651693B2 (en) * 2010-06-23 2015-01-14 株式会社アルバック Substrate holder and film forming apparatus

Also Published As

Publication number Publication date
KR20170022835A (en) 2017-03-02
KR20170022836A (en) 2017-03-02
KR101853063B1 (en) 2018-04-27

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