KR101772943B1 - 극자외선용 블랭크 마스크 및 이를 이용한 포토마스크 - Google Patents

극자외선용 블랭크 마스크 및 이를 이용한 포토마스크 Download PDF

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Publication number
KR101772943B1
KR101772943B1 KR1020160050066A KR20160050066A KR101772943B1 KR 101772943 B1 KR101772943 B1 KR 101772943B1 KR 1020160050066 A KR1020160050066 A KR 1020160050066A KR 20160050066 A KR20160050066 A KR 20160050066A KR 101772943 B1 KR101772943 B1 KR 101772943B1
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KR
South Korea
Prior art keywords
film
layer
platinum
extreme ultraviolet
light
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KR1020160050066A
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English (en)
Korean (ko)
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KR20170021191A (ko
Inventor
남기수
신철
이종화
양철규
최민기
김창준
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주식회사 에스앤에스텍
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Publication of KR20170021191A publication Critical patent/KR20170021191A/ko
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Publication of KR101772943B1 publication Critical patent/KR101772943B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54Absorbers, e.g. of opaque materials
    • G03F1/58Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020160050066A 2015-08-17 2016-04-25 극자외선용 블랭크 마스크 및 이를 이용한 포토마스크 KR101772943B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150115198 2015-08-17
KR20150115198 2015-08-17

Publications (2)

Publication Number Publication Date
KR20170021191A KR20170021191A (ko) 2017-02-27
KR101772943B1 true KR101772943B1 (ko) 2017-09-12

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KR (1) KR101772943B1 (zh)
TW (1) TWI623805B (zh)

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TWI774375B (zh) 2016-07-27 2022-08-11 美商應用材料股份有限公司 具多層吸收劑的極紫外遮罩坯料及製造方法
EP3454120B1 (en) 2017-09-09 2024-05-01 IMEC vzw Method for manufacturing euv reticles and reticles for euv lithography
EP3454119B1 (en) * 2017-09-09 2023-12-27 IMEC vzw Euv absorbing alloys
TWI811369B (zh) * 2018-05-25 2023-08-11 日商Hoya股份有限公司 反射型光罩基底、反射型光罩、以及反射型光罩及半導體裝置之製造方法
JP2020034666A (ja) * 2018-08-29 2020-03-05 Hoya株式会社 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法
US11119398B2 (en) * 2018-09-28 2021-09-14 Taiwan Semiconductor Manufacturing Co., Ltd. EUV photo masks
TW202026770A (zh) 2018-10-26 2020-07-16 美商應用材料股份有限公司 用於極紫外線掩模吸收劑的ta-cu合金材料
TWI845579B (zh) 2018-12-21 2024-06-21 美商應用材料股份有限公司 極紫外線遮罩吸收器及用於製造的方法
TWI828843B (zh) 2019-01-31 2024-01-11 美商應用材料股份有限公司 極紫外線(euv)遮罩素材及其製造方法
TW202035792A (zh) 2019-01-31 2020-10-01 美商應用材料股份有限公司 極紫外光遮罩吸收體材料
US11249390B2 (en) 2019-01-31 2022-02-15 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
TWI836073B (zh) 2019-05-22 2024-03-21 美商應用材料股份有限公司 極紫外光遮罩坯體及其製造方法
TWI845677B (zh) 2019-05-22 2024-06-21 美商應用材料股份有限公司 極紫外光遮罩吸收材料
TW202104666A (zh) 2019-05-22 2021-02-01 美商應用材料股份有限公司 極紫外光遮罩吸收劑材料
TW202104667A (zh) 2019-05-22 2021-02-01 美商應用材料股份有限公司 極紫外光遮罩吸收材料
TWI836072B (zh) 2019-05-22 2024-03-21 美商應用材料股份有限公司 具有嵌入吸收層之極紫外光遮罩
US11385536B2 (en) 2019-08-08 2022-07-12 Applied Materials, Inc. EUV mask blanks and methods of manufacture
KR102473558B1 (ko) * 2019-10-23 2022-12-05 주식회사 에스앤에스텍 극자외선 리소그래피용 하프톤 위상반전 블랭크 마스크 및 포토마스크
KR102285099B1 (ko) * 2020-01-08 2021-08-04 주식회사 에스앤에스텍 극자외선용 반사형 블랭크 마스크 및 포토마스크
US11630385B2 (en) * 2020-01-24 2023-04-18 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
TW202129401A (zh) 2020-01-27 2021-08-01 美商應用材料股份有限公司 極紫外線遮罩坯體硬遮罩材料
TWI817073B (zh) 2020-01-27 2023-10-01 美商應用材料股份有限公司 極紫外光遮罩坯體硬遮罩材料
TW202131087A (zh) 2020-01-27 2021-08-16 美商應用材料股份有限公司 極紫外光遮罩吸收劑材料
US11392036B2 (en) 2020-01-31 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist and method
TW202141165A (zh) 2020-03-27 2021-11-01 美商應用材料股份有限公司 極紫外光遮罩吸收材料
TWI836207B (zh) 2020-04-17 2024-03-21 美商應用材料股份有限公司 極紫外光遮罩吸收材料
US11300871B2 (en) 2020-04-29 2022-04-12 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US11294271B2 (en) * 2020-04-30 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mask for extreme ultraviolet photolithography
TW202202641A (zh) 2020-07-13 2022-01-16 美商應用材料股份有限公司 極紫外線遮罩吸收劑材料
US11609490B2 (en) * 2020-10-06 2023-03-21 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US11513437B2 (en) * 2021-01-11 2022-11-29 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US11592738B2 (en) 2021-01-28 2023-02-28 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
US20220350233A1 (en) * 2021-05-03 2022-11-03 Applied Materials, Inc. Extreme ultraviolet mask absorber materials
WO2024053634A1 (ja) * 2022-09-09 2024-03-14 Agc株式会社 反射型マスクブランク、反射型マスク、反射型マスクブランクの製造方法、及び反射型マスクの製造方法

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JPWO2014050891A1 (ja) * 2012-09-28 2016-08-22 旭硝子株式会社 Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにeuvリソグラフィ用反射型マスクおよびその製造方法
KR102239728B1 (ko) * 2013-08-28 2021-04-12 호야 가부시키가이샤 마스크 블랭크, 마스크 블랭크의 제조 방법 및 전사용 마스크의 제조 방법
KR101567057B1 (ko) * 2013-11-15 2015-11-09 주식회사 에스앤에스텍 극자외선용 블랭크 마스크 및 이를 이용한 포토마스크

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KR20170021191A (ko) 2017-02-27
TW201725440A (zh) 2017-07-16

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