KR101771885B1 - Laser machining method and device - Google Patents

Laser machining method and device Download PDF

Info

Publication number
KR101771885B1
KR101771885B1 KR1020177005932A KR20177005932A KR101771885B1 KR 101771885 B1 KR101771885 B1 KR 101771885B1 KR 1020177005932 A KR1020177005932 A KR 1020177005932A KR 20177005932 A KR20177005932 A KR 20177005932A KR 101771885 B1 KR101771885 B1 KR 101771885B1
Authority
KR
South Korea
Prior art keywords
laser beam
optical system
laser
workpiece
diameter
Prior art date
Application number
KR1020177005932A
Other languages
Korean (ko)
Other versions
KR20170031781A (en
Inventor
히데노리 후카호리
겐지 이토
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Priority to PCT/JP2014/079435 priority Critical patent/WO2016071986A1/en
Publication of KR20170031781A publication Critical patent/KR20170031781A/en
Application granted granted Critical
Publication of KR101771885B1 publication Critical patent/KR101771885B1/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring

Abstract

An incident optical system 3 for irradiating a mask 5 with a laser beam emitted from a laser oscillator is moved in a direction opposite to the advancing direction of the laser beam or the advancing direction of the laser beam, And a transfer optical system (7) for irradiating the workpiece with a laser beam after passing through the opening portion, based on the movement of the incident optical system (3), with a progressing direction of the laser beam or a traveling direction of the laser beam And the second step of adjusting the diameter of the workpiece on the workpiece surface by moving the workpiece in the opposite direction so that the desired laser processing can be performed on the workpiece even if the output of the laser oscillator 2 is lowered do.

Figure 112017021148985-pct00008

Description

[0001] LASER MACHINING METHOD AND DEVICE [0002]

The present invention relates to a laser machining method and apparatus for machining a workpiece by irradiating a laser beam.

In the laser processing apparatus, the output of the laser oscillator may decrease due to deterioration of the laser oscillator over time or an individual difference. If the output of the laser oscillator is lowered, there is a possibility that the machining necessary for the workpiece can not be performed. Specifically, there is a possibility that a hole of a desired diameter can not be formed on the workpiece.

As a related art, Patent Document 1 below discloses a technique in which a movable lens is provided between an aperture and a laser oscillator, a position of a movable lens is changed to change a laser beam diameter on an aperture, And adjusting the laser power after the irradiation of the laser beam to improve the reproducibility of the processing.

Patent Document 2 below discloses a technique of moving a converging lens according to the height of a work to align the focal point of the laser beam with the work surface to obtain a desired machining width.

Japanese Patent Application Laid-Open No. 2000-176661 Japanese Patent Application Laid-Open No. 2009-208093

However, in the technique described in Patent Document 1, if the diameter of the laser beam on the aperture is made small, the difference between the optical axis portion and the edge portion of the profile of the laser beam after passing the aperture becomes large. Further, there is a possibility that the strength at the edge portion of the laser beam reaching the workpiece is insufficient, and holes of a desired diameter can not be formed.

In addition, the technique described in Patent Document 2 has no aperture, and does not disclose adjusting the energy of the laser beam with the aperture. That is, it is not considered that the energy of the laser beam emitted from the laser oscillator is lowered due to the deterioration with time of the laser oscillator or the individual difference. The technique described in Patent Document 2 is to move the converging lens according to the height of the work so that the focal point of the laser beam is matched to the work surface.

The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing method and apparatus capable of performing desired laser processing on a workpiece even when the output of the laser oscillator is reduced.

In order to solve the above-described problems and to achieve the object, according to the present invention, an incident optical system for irradiating a mask with a laser beam emitted from a laser oscillator is moved in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam, A first step of adjusting the energy of the laser beam after passing through the opening and a second step of adjusting the energy of the laser beam in the direction of advance of the laser beam or the direction of movement of the laser beam based on the movement of the incident optical system, And a second step of moving the laser beam in a direction opposite to the advancing direction to adjust the diameter of the workpiece on the surface to be processed.

The laser processing method and apparatus according to the present invention have an effect that desired laser processing can be performed on a workpiece even if the output of the laser oscillator is lowered.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram showing a configuration of a laser machining apparatus according to a first embodiment. FIG.
Fig. 2 is a diagram showing the profile of the laser beam after passing through the opening of Embodiment 1. Fig.
3 is a view showing a profile of a laser beam on a surface to be processed of the workpiece of Embodiment 1. Fig.
4 is a diagram showing the profile of the laser beam on the surface to be processed of the workpiece according to the first embodiment.
5 is a flowchart showing a laser machining method according to the first embodiment.
6 is a graph showing the relationship between the position of the incident optical system of Embodiment 1, the position of the transfer optical system, and the diameter of the processing hole.
7 is a diagram showing a table stored in the storage unit according to the first embodiment;
8 is a flowchart showing a laser machining method according to the first embodiment.
9 is a diagram showing a state in which the energy of the laser beam of the laser machining apparatus of Embodiment 1 is adjusted.
10 is a diagram showing a configuration of a laser machining apparatus according to the second embodiment.
11 is a diagram showing a configuration of a laser machining apparatus according to Embodiment 3;
12 is a graph showing the relationship between the position of the incident optical system of Embodiment 3, the position of the transfer optical system, and the diameter of the processing hole.
13 is a diagram showing a table stored in the storage unit according to the third embodiment;
14 is a diagram showing a configuration of a laser machining apparatus of a comparative example.
15 is a diagram showing the profile of the laser beam on the mask of the comparative example.
16 is a view showing the profile of the laser beam after passing through the opening of the comparative example.
17 is a diagram showing the profile of the laser beam on the mask of the comparative example.
18 is a view showing the profile of the laser beam after passing through the opening of the comparative example.

Hereinafter, a laser processing method and apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments.

Embodiment 1

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram showing a configuration of a laser machining apparatus according to a first embodiment. FIG. 1, the laser machining apparatus 1 includes a laser oscillator 2 for emitting a laser beam 15a, an incidence optical system 3 to which a laser beam 15a is incident, an incidence optical system 3, And a first driving part 4 for moving the laser beam 15a in the traveling direction 16 of the laser beam 15a or in the reverse direction 17 of the traveling direction 16 of the laser beam 15a.

The laser processing apparatus 1 further includes a mask 5 having an aperture 5a through which a part of the laser beam 15b passed through the incidence optical system 3 passes, A transfer optical system 6 for transferring the laser beam 15c and a laser beam 15c transmitted by the transfer optical system 6 are incident on the aperture 5a so that the image of the aperture 5a is processed And a transfer optical system 7 for transferring the transfer optical system 7 to the surface in the direction of advance of the laser beam 15c 2 drive unit 8 as shown in FIG.

The laser machining apparatus 1 further includes a table 9 on which the workpiece 14 is placed and a third drive section 16 for moving the table 9 in the direction intersecting the advancing direction 18 of the laser beam 15c. A sensor 11 installed on the table 9 for measuring the laser beam 15c, a storage section 12 for storing the table 12a, a laser oscillator 2, And a control unit 13 for controlling the first driving unit 4, the second driving unit 8, and the third driving unit 10.

1, the incident optical system 3 is a single lens, but may be a plurality of lenses. The incident optical system 3 is movable in the traveling direction 16 of the laser beam 15a or in the reverse direction 17 of the traveling direction 16 of the laser beam 15a. The control unit 13 can adjust the beam diameter of the laser beam 15b incident on the mask 5 by moving the incident optical system 3. [ Accordingly, the control unit 13 can change the ratio of the laser beam 15c to the entire laser beam 15b, and thus can adjust the energy of the laser beam 15c.

The incident optical system 3 is positioned at a position where the energy of the laser beam 15c becomes appropriate energy for processing the work 14 in the initial state. Hereinafter, the position of the incidence optical system 3 at this time will be referred to as a reference position of the incidence optical system 3.

The transmission optical system 6 is composed of one mirror or a plurality of mirrors. The transmission optical system 6 may include a scan mirror. The scan mirror may be a galvano mirror. The transfer optical system 7 may be an f? Lens.

The transfer optical system 7 is positioned at a position where the image of the opening 5a is formed on the surface to be processed of the work 14 in an initial state. Hereinafter, the position of the transferring optical system 7 at this time will be referred to as a reference position of the transferring optical system 7.

Next, an overview of the operation of the laser machining apparatus 1 will be described. The laser beam 15a emitted from the laser oscillator 2 enters the incidence optical system 3 first. The laser beam 15b whose laser beam 15a is changed in beam diameter by the incidence optical system 3 is incident on the mask 5. [ 1, the laser beam 15b converges once at the convergence point 20 and diverges to be incident on the mask 5. However, the laser beam 15b may be incident on the mask 5 while being converged, And then may be incident on the mask 5.

The control unit 13 controls the position of the incident optical system 3 such that the beam diameter of the laser beam 15b on the mask 5 is larger than the aperture diameter of the aperture 5a. Thus, a part of the laser beam 15b passes through the opening 5a and becomes a laser beam 15c. At this time, even if the energy of the laser beam 15a is lowered due to individual variation of the laser oscillator 2 or degradation with time, the control unit 13 controls the laser beam 15c so that the energy of the laser beam 15c after passing through the opening 5a becomes constant, The position of the incident optical system 3 is adjusted.

More specifically, when the energy of the laser beam 15a emitted from the laser oscillator 2 is lowered, the control unit 13 moves the incident optical system 3 in the advancing direction 16 of the laser beam 15a, And the beam diameter of the beam 15b on the mask 5 is reduced. Accordingly, the control section 13 can increase the ratio of the laser beam 15c to the entire laser beam 15b, and can maintain the energy of the laser beam 15c.

The laser beam 15c having passed through the opening 5a is incident on the transferring optical system 7 by the transferring optical system 6. The transfer optical system 7 transfers the image of the opening 5a onto the surface to be processed of the work 14. Thus, a machining hole corresponding to the opening diameter of the opening 5a is formed in the work 14. The machining hole may be a bottomed hole or a through hole.

Here, a comparative example will be described. 14 is a diagram showing a configuration of a laser machining apparatus of a comparative example. 14, the laser machining apparatus 81 includes a laser oscillator 82 for emitting a laser beam 90a, an incident optical system 83 to which the laser beam 90a is incident, and an incident optical system 83 And a driving unit 84 for moving the laser beam 90a in the traveling direction 100 or the reverse direction 101 of the traveling direction 100 of the laser beam 90a.

The laser processing device 81 further includes a mask 85 having an opening 85a for passing a part of the laser beam 90b passed through the incidence optical system 83 and a laser beam 90c passing through the opening 85a A transfer optical system 86 for transferring the image of the opening 85a onto the surface of the work 89 to which the laser beam 90c transmitted by the transfer optical system 86 is incident, A laser oscillator 82, and a control unit 88 for controlling the driving unit 84. [

The laser beam 90a emitted from the laser oscillator 82 is incident on the incidence optical system 83 first. The laser beam 90b whose laser beam 90a is changed in beam diameter by the incident optical system 83 is incident on the mask 85. [ In Fig. 14, the laser beam 90b converges once at the convergence point 91, diverges and enters the mask 85. Fig.

The laser beam 90c after passing through the opening 85a is incident on the transferring optical system 87 by the transferring optical system 86. [ The transfer optical system 87 transfers the image of the opening 85a onto the surface of the workpiece 89 to be processed. Thus, a machining hole corresponding to the opening diameter of the opening 85a is formed in the work piece 89. [

15 is a diagram showing the profile of the laser beam on the mask of the comparative example. 16 is a view showing the profile of the laser beam after passing through the opening of the comparative example. Further, the profile of the laser beam may be referred to as a beam shape or a mode shape.

As shown in Fig. 15, the profile 92 of the laser beam 90b on the mask 85 is Gaussian. A part of the laser beam 90b passes through an opening 85a having a diameter 93. [ The profile 94 of the laser beam 90c after passing through the opening 85a has a diameter 93 as shown in Fig. At this time, the beam intensity of the entire laser beam 90c exceeds the machining threshold value 99, and a machining hole of a desired diameter can be formed on the work piece 89. [

Next, a case where the energy of the laser beam 90a is lowered due to individual variation or degradation with time of the laser oscillator 82 will be described.

14, the control unit 88 moves the incident optical system 83 in the advancing direction 100 of the laser beam 90a to adjust the beam diameter of the laser beam 90b on the mask 85 . Thus, the control unit 88 can increase the ratio of the laser beam 90c to the entire laser beam 90b, and thus can maintain the energy of the laser beam 90c.

17 is a diagram showing the profile of the laser beam on the mask of the comparative example. 18 is a view showing the profile of the laser beam after passing through the opening of the comparative example.

As shown in Fig. 17, the profile 95 of the laser beam 90b on the mask 85 has a gauss shape. 15 shows the profile 95 of the laser beam 90b on the mask 85 because the diameter of the laser beam 90b is smaller than the profile 92 before the output of the laser oscillator 82 shown in Fig. And has a pointed shape. The laser beam 90b passes through the opening 85a to the portion where the beam intensity at the periphery of the laser beam 90b is low.

A part of the laser beam 90b passes through an opening 85a having a diameter 93. [ The profile 96 of the laser beam 90c after passing through the opening 85a has a diameter 93 as shown in Fig. Here, the beam intensity of the portion including the optical axis of the laser beam 90c exceeds the machining threshold 99. [ However, the beam intensities of the peripheral portions 97 and 98 of the laser beam 90c are below the processing threshold 99. [ For this reason, the laser machining apparatus 81 can not form machining holes of a desired diameter in the work piece 89. Specifically, the laser machining apparatus 81 can not be formed on the work piece 89 except for a machining hole having a diameter smaller than a desired diameter.

Next, the principle of the laser processing method according to the first embodiment will be described. The optical system of the laser processing apparatus 1 shown in Figure 1 is an optical system for transferring the image of the opening 5a onto the work 14 so that the diameter of the processing hole is determined by the opening diameter of the opening 5a do.

However, when the output of the laser oscillator 82 is lowered and the control unit 13 controls the beam diameter of the laser beam 15b incident on the mask 5 to be smaller, the laser beam after passing through the opening 5a 15c have a pointed shape.

Fig. 2 is a diagram showing the profile of the laser beam after passing through the opening of Embodiment 1. Fig. The profile 30 of the laser beam 15c after passing through the opening portion 5a shown in Fig. 2 includes a portion having a low beam intensity at the periphery.

3 is a view showing a profile of a laser beam on a surface to be processed of the workpiece of Embodiment 1. Fig. The profile 31 of the laser beam 15d on the surface to be processed of the workpiece 14 shown in Fig. 3 has the portion 32 including the optical axis of the laser beam 15d on the surface of the workpiece 14, The beam intensity of the beam exceeds the processing threshold value 37. [ However, the beam intensities of the peripheral portions 33 and 34 of the laser beam 15d are lower than the processing threshold 37. [ Therefore, the laser processing apparatus 1 can not form a machining hole of a desired diameter in the work 14. Specifically, the laser machining apparatus 1 can not be formed on the workpiece 14 except for a machining hole having a diameter smaller than a desired diameter.

Here, the control unit 13 moves the transferring optical system 7 from the reference position for forming the image of the opening 5a on the workpiece 14 in the advancing direction 18 of the laser beam 15d . That is, the control unit 13 shifts the image of the opening 5a in the advancing direction 18 of the laser beam 15d rather than the surface to be processed of the workpiece 14. Accordingly, the control unit 13 causes the image of the opening 5a on the surface to be processed of the work 14 to be blurred. The reason that the image of the opening portion 5a on the surface to be processed of the workpiece 14 is blurred is that the boundary of the image of the opening portion 5a on the surface to be processed of the workpiece 14 and the boundary of the shade It means to blur. Thus, the control section 13 enlarges the beam diameter of the portion of the workpiece 14 above the processing threshold of the laser beam 15d on the work surface. Accordingly, the laser machining apparatus 1 can form a machining hole of a desired diameter by increasing the diameter of the machining hole to a desired machining hole diameter.

4 is a diagram showing the profile of the laser beam on the surface to be processed of the workpiece according to the first embodiment. The control unit 13 shifts the transfer optical system 7 from the reference position where the image of the opening 5a is formed on the workpiece 14 in the advancing direction 18 of the laser beam 15d. That is, the control unit 13 shifts the image of the opening 5a in the advancing direction 18 of the laser beam 15d relative to the surface to be processed of the workpiece 14. Thereby, the control section 13 causes the image of the opening portion 5a on the surface to be processed of the work 14 to be blurred. Thus, the control section 13 enlarges the beam diameter of the portion of the workpiece 14 above the processing threshold of the laser beam 15d on the work surface.

In the profile 35 of the laser beam 15d on the surface to be processed of the workpiece 14 shown in Fig. 4, since the beam diameter of the portion above the machining threshold of the laser beam 15d is enlarged, The machining hole of the base 36 can be formed. The reason why the profile 35 has a wavy shape is the influence of the diffraction by shifting the transfer optical system 7 from the imaging position.

Next, the procedure of the laser processing method according to the first embodiment will be described. 5 is a flowchart showing a laser machining method according to the first embodiment. 5 is a flowchart showing a method for acquiring the relationship between the position of the incidence optical system 3, the position of the transfer optical system 7, and the diameter of the processing hole. The flowchart shown in Fig. 5 may be executed at the time of installing the laser machining apparatus 1, or at the time of replacing the laser oscillator 2. Fig. The program for executing the flowchart shown in Fig. 5 may be stored in the storage unit 12. Fig.

First, in step S100, the control unit 13 drives the laser oscillator 2 to process the test object. Then, in step S102, the control unit 13 obtains the relationship between the position of the transfer optical system 7 and the diameter of the processing hole.

Next, in step S104, the control unit 13 determines whether or not the transfer optical system 7 has reached the measurement end. If the control unit 13 determines in step S104 that the transferring optical system 7 has not reached the measuring end (No), the control unit 13 moves the transferring optical system 7 by one reference amount in step S106, and proceeds to step S100. In addition, one reference amount can be an order of a micrometer.

On the other hand, if the control unit 13 determines in step S104 that the transfer optical system 7 has reached the measurement end (Yes), the control unit 13 determines whether or not the incident optical system 3 has reached the measurement end in step S108. If the control unit 13 determines in step S108 that the incident optical system 3 has not reached the measurement end (No), the control unit 13 moves the incident optical system 3 by one reference amount in step S110. In addition, one reference amount can be an order of millimeters.

Next, in step S112, the control unit 13 returns the transfer optical system 7 to the reference position, and the process proceeds to step S100.

On the other hand, when the control unit 13 determines in step S108 that the incident optical system 3 has reached the measurement end (Yes), the control unit 13 ends the processing.

It is preferable to obtain the relationship between the position of the incident optical system 3, the position of the transfer optical system 7, and the diameter of the machining hole by actually operating the laser machining apparatus 1 in accordance with the flowchart shown in Fig. However, the relationship between the position of the incidence optical system 3, the position of the transferring optical system 7, and the diameter of the machining hole may be obtained by performing simulation of the flowchart shown in Fig.

6 is a graph showing the relationship between the position of the incident optical system of Embodiment 1, the position of the transfer optical system, and the diameter of the processing hole. The graph shown in Fig. 6 is obtained by executing the flowchart shown in Fig. 5 by simulation.

In the graph shown in Fig. 6, the horizontal axis represents the position of the transfer optical system 7, and the vertical axis represents the diameter of a portion above the processing threshold of the laser beam 15d on the surface of the workpiece 14 to be processed. The case where the transfer optical system 7 is moved to the advancing direction 18 side of the laser beam 15d is denoted by " - ", and the transferring optical system 7 is reversed from the advancing direction 18 of the laser beam 15d 19) side is indicated by " + ".

6, when the position of the incidence optical system 3 is the reference position, when the position of the incidence optical system 3 is at a position of -1 mm from the reference position, the position of the incidence optical system 3 is -2 mm The case where the position of the incident optical system 3 is at a position of -3 mm from the reference position and the case where the position of the incident optical system 3 is at a position of -4 mm from the reference position. The case where the incident optical system 3 is moved toward the advancing direction 16 side of the laser beam 15b is indicated by "-".

A line 40 is an approximate straight line of the sample point when the position of the incident optical system 3 is the reference position. A line 41 is an approximate straight line of the sample point when the position of the incidence optical system 3 is -1 mm from the reference position. Line 42 is an approximate straight line of the sample point when the position of the incidence optical system 3 is -2 mm from the reference position. Line 43 is an approximate straight line of the sample point when the position of the incidence optical system 3 is -3 mm from the reference position. Line 44 is an approximate straight line of the sample point when the position of the incident optical system 3 is -4 mm from the reference position.

Here, the desired machining hole diameter is 50 占 퐉. In this case, a line 45, a line 41, a line 42, a line 43, and a line 44 intersect with a cross point 45 of a diameter of a portion above the processing threshold of the laser beam 15d on the surface to be processed of the work 14 , Intersection point 46, intersection point 47, intersection point 48, and intersection point 49 are obtained. When the value of the horizontal axis of the intersection point 45, the intersection point 46, the intersection point 47, the intersection point 48 and the intersection point 49 and the position of the incident optical system 3 is the reference position, the position of the incident optical system 3 is -1 mm The position of the incidence optical system 3 is -2 mm from the reference position and the position of the incidence optical system 3 is -3 mm from the reference position and the position of the incidence optical system 3 is And becomes the position of the transfer optical system 7 to be disposed in the case of a position of -4 mm from the reference position.

More specifically, when the position of the incidence optical system 3 is the reference position, the position of the transfer optical system 7 becomes -140 탆 from the reference position. When the position of the incidence optical system 3 is a position of -1 mm from the reference position, the position of the transfer optical system 7 becomes -120 탆 from the reference position. When the position of the incidence optical system 3 is at a position of -2 mm from the reference position, the position of the transfer optical system 7 becomes -95 탆 from the reference position. When the position of the incidence optical system 3 is at a position of -3 mm from the reference position, the position of the transfer optical system 7 becomes -70 탆 from the reference position. When the position of the incidence optical system 3 is at a position of -4 mm from the reference position, the position of the transfer optical system 7 becomes -25 탆 from the reference position.

7 is a diagram showing a table stored in the storage unit according to the first embodiment; The table 12a shown in Fig. 7 is a table 12a in which the position of the incidence optical system 3 and the diameter of the laser beam 15d on the surface to be processed of the workpiece 14 become the desired diameter And the position of the transferring optical system 7 at the time of exposure.

8 is a flowchart showing a laser machining method according to the first embodiment. The flowchart shown in Fig. 8 is a flowchart showing a method of adjusting the laser machining apparatus 1 during laser machining. The processing in the flowchart shown in Fig. 8 may be executed every time the laser processing is performed, may be executed before every day of operation, or may be executed in view of a drop in the output of the laser oscillator 2. The program for executing the processing of the flowchart shown in Fig. 8 may be stored in the storage unit 12. Fig.

The control unit 13 moves the incident optical system 3 to the traveling direction 16 of the laser beam 15a or the reverse direction 17 of the traveling direction 16 of the laser beam 15a in step S120 , And the energy of the laser beam 15c after passing through the opening 5a is adjusted.

9 is a view showing a state in which the energy of the laser beam of the laser machining apparatus of Embodiment 1 is adjusted. 9, the control section 13 drives the third driving section 10 to move the table 9 and position the sensor 11 on the optical axis of the laser beam 15d. The controller 13 monitors the energy of the laser beam 15d measured by the sensor 11 and moves the incident optical system 3 so that the energy of the laser beam 15d incident on the sensor 11 is desired Value.

8, the control unit 13 sets the transferring optical system 7 in the advancing direction 18 of the laser beam 15d or in the direction of the laser beam 15a (step S122), based on the movement of the incident optical system 3 15d in the reverse direction 19 of the proceeding direction 18 to adjust the beam diameter of the portion of the workpiece 14 that exceeds the machining threshold of the laser beam 15d on the surface to be machined. At this time, the control unit 13 can determine the position of the transfer optical system 7 in accordance with the position of the incident optical system 3, by referring to the table 12a shown in Fig.

In the above description, the table 12a is stored in the storage unit 12 and the position of the transfer optical system 7 is determined according to the position of the incident optical system 3. However, the table 12a may be provided in the storage unit 12, May not be stored. Concretely, when the operator operates the laser machining apparatus 1, the diameter of the portion above the machining threshold of the laser beam 15d on the surface to be machined of the workpiece 14 is set to a desired diameter, 7 can be adjusted. It is also possible to adjust the position of the transfer optical system 7 so that the diameter of the hole actually formed in the work 14 becomes a desired diameter while the operator operates the laser processing apparatus 1. [

As described above, according to the first embodiment, even if the output of the laser oscillator 2 is lowered, it is possible to form a machining hole having a required diameter in the work piece 14. Therefore, according to the first embodiment, the usable period of the laser oscillator 2 can be extended, and the frequency of replacement of the laser oscillator 2 can be reduced. Therefore, according to the first embodiment, the cost of laser machining can be reduced.

Embodiment 2

10 is a diagram showing a configuration of a laser machining apparatus according to the second embodiment. The laser machining apparatus 1A according to the second embodiment includes a laser oscillator 2A capable of outputting a signal indicating a laser output in place of the laser oscillator 2 of the laser machining apparatus 1 according to the first embodiment .

The control unit 13 can acquire the output of the laser oscillator 2A by a signal indicating the laser output received from the laser oscillator 2A. If the laser output of the laser oscillator 2A can be obtained, the position of the incident optical system 3 when the energy of the laser beam 15c becomes the desired energy can be determined. Here, the relationship between the signal indicating the laser output and the position of the incident optical system 3 when the energy of the laser beam 15c becomes the desired energy is obtained in advance, and a signal indicating the laser output and a signal indicating the laser output The table 12b describing the relationship of the position of the incidence optical system 3 when the energy becomes the desired energy is stored in the storage unit 12. [

The control unit 13 determines the position of the incident optical system 3 and moves the incident optical system 3 based on the signal indicating the laser output received from the laser oscillator 2A with reference to the table 12b. The control unit 13 determines the position of the transferring optical system 7 and moves the transferring optical system 7 based on the movement of the incident optical system 3 with reference to the table 12a.

As described above, according to the second embodiment, the labor of measuring the energy of the laser beam 15d by the sensor 11 can be omitted. Therefore, according to the second embodiment, the efficiency of laser machining can be improved.

In the first and second embodiments, the relationship between the position of the incidence optical system 3 and the position of the transfer optical system 7 is stored in the storage unit 12 in advance. However, the position of the transfer optical system 7 may be adjusted every time the laser processing is performed. That is, as the procedure before the laser processing, the position of the transfer optical system 7 is changed and laser processing is performed to determine the position of the transfer optical system 7 having the desired processing hole diameter.

When the divergence angle or profile of the laser beam 15a changes, the relationship between the position of the incident optical system 3 and the beam diameter on the mask 5 also changes. That is, the relationship between the position of the incident optical system 3 and the profile of the laser beam 15c after passing through the opening 5a is also changed. Thus, the relationship between the tables 12a and 12b stored in the storage unit 12 in advance in the first and second embodiments is also changed, and the diameter of the machining hole may not be maintained at a desired diameter. However, if the position of the transfer optical system 7 is adjusted every time the laser processing is performed, the diameter of the processing hole can be maintained at a desired diameter even when the divergence angle or profile of the laser beam 15a fluctuates.

Embodiment 3

11 is a diagram showing a configuration of a laser machining apparatus according to Embodiment 3;

In the laser machining apparatus 1 according to the first embodiment, after the laser beam 15b converges at the convergence point 20, it diverges and enters the mask 5.

On the other hand, in the laser machining apparatus 1B according to the third embodiment, the laser beam 15b is incident on the mask 5 before converging. Then, the laser beam 15c passing through the opening 5a converges at the convergence point 20.

In the third embodiment, when the energy of the laser beam 15a emitted from the laser oscillator 2 is lowered, the control unit 13 causes the incident optical system 3 to move in the reverse direction 17 of the laser beam 15a in the traveling direction 16 So that the beam diameter of the laser beam 15b on the mask 5 is reduced. Accordingly, the control section 13 can increase the ratio of the laser beam 15c to the entire laser beam 15b, and can maintain the energy of the laser beam 15c.

12 is a graph showing the relationship between the position of the incident optical system of Embodiment 3, the position of the transfer optical system, and the diameter of the processing hole. The graph shown in Fig. 12 is obtained by executing the flowchart shown in Fig. 5 by simulation.

12, the horizontal axis represents the position of the transfer optical system 7, and the vertical axis represents the diameter of the portion of the work 14 over the processing threshold of the laser beam 15d on the work surface. The case where the transfer optical system 7 is moved to the advancing direction 18 side of the laser beam 15d is denoted by " - ", and the transferring optical system 7 is reversed from the advancing direction 18 of the laser beam 15d 19) side is indicated by " + ".

12, when the position of the incidence optical system 3 is the reference position, when the position of the incidence optical system 3 is + 1 mm from the reference position, the position of the incidence optical system 3 is shifted from the reference position by + 2 mm And the case where the position of the incident optical system 3 is at a position of + 3 mm from the reference position. The case in which the incident optical system 3 is moved to the side 17 opposite to the traveling direction 16 of the laser beam 15b is indicated by " + ".

Line 60 is an approximate straight line of the sample point when the position of the incident optical system 3 is the reference position. A line 61 is an approximate straight line of the sample point when the position of the incident optical system 3 is +1 mm from the reference position. Line 62 is an approximate straight line of the sample point when the position of the incidence optical system 3 is + 2 mm from the reference position. A line 63 is an approximate straight line of the sample point when the position of the incident optical system 3 is + 3 mm from the reference position.

Here, the desired machining hole diameter is 50 占 퐉. In this case, the intersection 64 between the line 60, the line 61, the line 62 and the line 63 and the diameter of the portion above the processing threshold of the laser beam 15d on the surface to be processed of the work 14 is 50 m, , The intersection point 66 and the intersection point 67 are obtained. When the value of the horizontal axis of the intersection 64, the intersection 65, the intersection 66 and the intersection 67 is the position of the incident optical system 3 at the reference position and the position of the incident optical system 3 is the position of +1 mm from the reference position, The position of the transfer optical system 7 to be arranged when the position of the incidence optical system 3 is + 2 mm from the reference position and when the position of the incident optical system 3 is + 3 mm from the reference position.

Specifically, when the position of the incidence optical system 3 is the reference position, the position of the transfer optical system 7 becomes +260 μm from the reference position. When the position of the incidence optical system 3 is at a position of +1 mm from the reference position, the position of the transfer optical system 7 becomes +200 μm from the reference position. When the position of the incidence optical system 3 is + 2 mm from the reference position, the position of the transfer optical system 7 becomes + 75 μm from the reference position. When the position of the incidence optical system 3 is + 3 mm from the reference position, the position of the transfer optical system 7 is + 10 μm from the reference position.

13 is a diagram showing a table stored in the storage unit according to the third embodiment; The table 12c shown in Fig. 13 is a table 12c based on the graph of Fig. 12 in which the position of the incidence optical system 3 and the diameter of the laser beam 15d on the surface to be processed of the workpiece 14 become a desired diameter The position of the transferring optical system 7 at the time of the transfer.

The control unit 13 moves the incident optical system 3 in the direction 17 opposite to the traveling direction 16 of the laser beam 15a to adjust the energy of the laser beam 15c after passing through the opening 5a.

The control unit 13 moves the transfer optical system 7 to the direction 19 opposite to the traveling direction 18 of the laser beam 15d based on the movement of the incident optical system 3. [ That is, the control unit 13 shifts the image of the opening 5a toward the direction 19 opposite to the traveling direction 18 of the laser beam 15d as compared with the surface to be processed of the work 14. Accordingly, the control unit 13 causes the image of the opening 5a on the surface to be processed of the work 14 to be blurred. Thus, the control section 13 enlarges the beam diameter of the portion of the work 14 above the processing threshold of the laser beam 15d on the surface to be machined. Thus, the laser machining apparatus 1 can increase the diameter of the machining hole and form a machining hole with a desired diameter.

As described above, according to the third embodiment, even if the output of the laser oscillator 2 is reduced, a machining hole with a desired diameter can be formed on the work 14. Therefore, according to the third embodiment, the usable period of the laser oscillator 2 can be extended, and the frequency of replacement of the laser oscillator 2 can be reduced. Therefore, according to the third embodiment, the cost of laser machining can be reduced.

The configuration shown in the above embodiments represents one example of the present invention and can be combined with other known techniques and a part of the configuration can be omitted or changed without departing from the gist of the present invention.

1, 1A, 1B laser processing device, 2, 2A laser oscillator,
3 incidence optical system, 4 first driving unit,
5 mask, 6 transmission optical system,
7 transfer optical system, 8 second drive unit,
9 table, 10 third driving section,
11 sensors, 12 storage units,
13 Controls.

Claims (10)

A first step of moving an incident optical system for irradiating a mask with a laser beam emitted from a laser oscillator in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam to adjust the energy of the laser beam after passing through the opening of the mask; ,
A transfer optical system for irradiating a workpiece with a laser beam after passing through the opening is moved in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam based on the movement of the incident optical system, And a second step of adjusting the diameter at the surface,
The first step refers to a table describing a relationship between a signal indicating the laser output received from the laser oscillator and a position of the incident optical system when the energy of the laser beam after passing through the opening becomes the target energy, Wherein the position of the optical system is determined.
An incident optical system for irradiating a mask with a laser beam emitted from a laser oscillator,
A transfer optical system for irradiating the workpiece with a laser beam after passing through the opening of the mask,
And a control unit for controlling the energy of the laser beam after passing through the opening by moving the incident optical system in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam, And a control unit for performing control to adjust the diameter of the laser beam on the work surface of the workpiece by moving the workpiece in the direction of travel or in the direction opposite to the traveling direction of the laser beam,
Further comprising a storage unit for storing a table describing a relationship between a signal indicating a laser output received from the laser oscillator and a position of an incident optical system when energy of a laser beam after passing through the opening reaches a target energy,
Wherein the control unit determines the position of the incident optical system by referring to the table.
A first step of moving an incident optical system for irradiating a mask with a laser beam emitted from a laser oscillator in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam to adjust the energy of the laser beam after passing through the opening of the mask; ,
A transfer optical system for irradiating a workpiece with a laser beam after passing through the opening is moved in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam based on the movement of the incident optical system, And a second step of adjusting the diameter at the surface,
And the second step increases the beam diameter of a portion of the workpiece above the processing threshold of the laser beam on the surface of the workpiece to a desired machining hole diameter.
An incident optical system for irradiating a mask with a laser beam emitted from a laser oscillator,
A transfer optical system for irradiating the workpiece with a laser beam after passing through the opening of the mask,
And a control unit for controlling the energy of the laser beam after passing through the opening by moving the incident optical system in a direction opposite to a traveling direction of the laser beam or a traveling direction of the laser beam, And a control unit for performing control to adjust the diameter of the laser beam on the work surface of the workpiece by moving the workpiece in the direction of travel or in the direction opposite to the traveling direction of the laser beam,
Wherein the control section increases the beam diameter of a portion of the workpiece above a processing threshold value of the laser beam on the surface of the workpiece to a desired machining hole diameter.
delete delete delete delete delete delete
KR1020177005932A 2014-11-06 2014-11-06 Laser machining method and device KR101771885B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/079435 WO2016071986A1 (en) 2014-11-06 2014-11-06 Laser machining method and device

Publications (2)

Publication Number Publication Date
KR20170031781A KR20170031781A (en) 2017-03-21
KR101771885B1 true KR101771885B1 (en) 2017-08-25

Family

ID=55908738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177005932A KR101771885B1 (en) 2014-11-06 2014-11-06 Laser machining method and device

Country Status (5)

Country Link
JP (1) JP5916962B1 (en)
KR (1) KR101771885B1 (en)
CN (1) CN107073654A (en)
TW (1) TWI586468B (en)
WO (1) WO2016071986A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480257B (en) * 2019-07-12 2020-05-19 江苏长龄液压股份有限公司 Manufacturing process of oil cylinder

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000176661A (en) 1998-12-21 2000-06-27 Mitsubishi Electric Corp Laser beam machining method and its device
JP2003285179A (en) 2002-03-26 2003-10-07 Sumitomo Heavy Ind Ltd Laser beam machining method and machining device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3292058B2 (en) * 1996-10-01 2002-06-17 三菱電機株式会社 Method and apparatus for processing wiring substrate using laser light
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
JP2004209508A (en) * 2002-12-27 2004-07-29 Sumitomo Heavy Ind Ltd Laser beam machining method and laser beam machining device
KR20060014359A (en) * 2003-03-24 2006-02-15 가부시키가이샤 니콘 Optical element, optical system, laser device, exposure device, mask testing device, and high polymer crystal processing device
JP2006082125A (en) * 2004-09-17 2006-03-30 Mitsubishi Electric Corp Image transfer type laser beam machining apparatus and its machining method
WO2006129369A1 (en) * 2005-06-03 2006-12-07 Mitsubishi Denki Kabushiki Kaisha Laser machining method and laser machining device
JP5062838B2 (en) 2008-02-29 2012-10-31 パナソニック デバイスSunx株式会社 Laser marking device
US20120187097A1 (en) * 2011-01-25 2012-07-26 Wu Jang-Yie Laser engraver capable of automatic defocusing
CN204430558U (en) * 2013-04-22 2015-07-01 三菱电机株式会社 Laser processing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000176661A (en) 1998-12-21 2000-06-27 Mitsubishi Electric Corp Laser beam machining method and its device
JP2003285179A (en) 2002-03-26 2003-10-07 Sumitomo Heavy Ind Ltd Laser beam machining method and machining device

Also Published As

Publication number Publication date
JPWO2016071986A1 (en) 2017-04-27
WO2016071986A1 (en) 2016-05-12
KR20170031781A (en) 2017-03-21
TW201620659A (en) 2016-06-16
CN107073654A (en) 2017-08-18
JP5916962B1 (en) 2016-05-11
TWI586468B (en) 2017-06-11

Similar Documents

Publication Publication Date Title
CN110394981B (en) Device for the generative production of three-dimensional structures
KR101298019B1 (en) Laser processing apparatus
US10341646B2 (en) Variable focal length lens system with optical power monitoring
CN107340584B (en) Microscope
JP6083284B2 (en) Laser processing equipment
KR101420565B1 (en) Laser processing apparatus and laser processing method
CN201693290U (en) Laser processing device
KR101939876B1 (en) Raser repair device
KR20170096812A (en) Multi-functional laser processing apparatus and laser processing method using the laser processing apparatus
KR101771885B1 (en) Laser machining method and device
JP2010142846A (en) Three-dimensional scanning type laser beam machine
JP2007222902A (en) Laser machining apparatus and laser machining method
JP2020505625A5 (en)
KR101279578B1 (en) Auto focusing apparatus for laser processing and auto focusing method using the same
KR20180021096A (en) Laser processing head and laser processing machine including the same
KR20160073785A (en) Laser processing system and laser processing method using the laser processing system
KR20170048969A (en) Laser processing method and laser processing apparatus using multi focusing
KR101678985B1 (en) Laser processing apparatus and laser processing method using the laser processing apparatus
KR101866825B1 (en) Method for surface scanning with controling of laser beam energy profile
JP6324151B2 (en) Laser processing apparatus and laser processing method
KR101728876B1 (en) An Apparatus Having a Structure of Automatic Focus Regulation and a Method for Marking with the Same
KR102272649B1 (en) Laser cleaning device having a function of checking cleaning quality and method thereof
KR20160127461A (en) Laser apparatus and method of manufacturing the same
KR101511645B1 (en) Method for calibrating irradiation position of laser beam
KR102076790B1 (en) Apparatus for 3D laser cutting

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant