KR101769554B1 - Flexible complex substrate coated polyimide, manufacturing method thereof, and via hole structure of electronic device comprising the same - Google Patents

Flexible complex substrate coated polyimide, manufacturing method thereof, and via hole structure of electronic device comprising the same Download PDF

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KR101769554B1
KR101769554B1 KR1020160024670A KR20160024670A KR101769554B1 KR 101769554 B1 KR101769554 B1 KR 101769554B1 KR 1020160024670 A KR1020160024670 A KR 1020160024670A KR 20160024670 A KR20160024670 A KR 20160024670A KR 101769554 B1 KR101769554 B1 KR 101769554B1
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film
metal pattern
composite substrate
flexible composite
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KR20160110112A (en
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신윤석
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신윤석
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/028—Treatment by energy or chemical effects using vibration, e.g. sonic or ultrasonic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Abstract

The present invention relates to a polyimide-coated flexible composite substrate, which is excellent in heat resistance, chemical resistance, heat resistance, flame retardancy, mechanical / electrical properties, and is excellent in workability and workability due to soldering, A method of manufacturing the same, and a via hole structure of an electronic device including the same.

Description

 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible composite substrate coated with polyimide, a method of manufacturing the same, and a via hole structure of an electronic device including the same. BACKGROUND ART [0002]

The present invention relates to a technique of coating a liquid polyimide (yellow, transparent, black, or white) on a film or metal or a solid curved surface to produce a composite structure material having improved heat resistance, chemical resistance and abrasion resistance Flexible Composite Substrate Flexible Composite Substrate Coated with Polyimide Applicable to Various Electronic Devices such as FPCB, NFC Antenna, RFID Antenna, Flexible Copper Clad Laminate Film (FCCL) and Flexible Circuit Board (FPCB) To a via-hole structure of an electronic device.

Recently, new materials with high heat resistance as a result of miniaturization of electronic devices have been raised. As the demand for various flexible electronic devices including heat-resistant film, ANTENNA NFC type or RFID type antenna module and the like is rapidly increasing, It is activated.

NFC is an abbreviation of Near Field Communication. It is a standard that can transmit data up to 424 Kbps using frequency of 13.56 MHz band. It is used for card emulation mode settlement within 10cm, P2P data transmission / reception between NFC compatible terminals, And RFID processing, and is currently working on standardization and adding new functions to the NFC Forum.

The three companies, including AT & T, Verizon and T-Mobile, are in the process of establishing a joint venture ISIS and expanding the mobile commerce market across the US. ISIS is expected to concentrate on non-contact payment business, which will pay fees through mobile terminals. As a result, mobile payment functions using smartphones and NFC are expected to expand significantly in the US.

In recent years, there has been a growing interest in wireless charging between a charging pad and an electronic device. There are two types of wireless charging: 'magnetic induction', which converts the electricity on the charging pad to energy and induces electricity to the battery of the electronic device wirelessly through the magnetic field by the coil, There is a 'self resonance method' which is a method of charging at the same time through the antenna. The former is in commercial use, but the latter is still in the development stage. There are Wireless Power Consortium (WPC) and Power Matters Alliance (PMA) standards that are widely used in the world for wireless charging.

The wireless charger market is expected to grow at a CAGR of 74% over the next 10 years. The number of units sold is expected to grow at an average annual rate of 74.1% by 2021, and sales volume should increase by an annual average of 60.5%. Adoption rate in mobile phones is now only about 0.2%, but it is expected to reach 34% adoption rate until 2021.

Various electronic devices that are expected to grow explosively in the future, including those that are widely commercialized, are excellent in heat resistance, heat resistance, flame retardancy, mechanical characteristics, electrical characteristics and chemical characteristics, Next-generation materials are inevitably required.

In particular, a flexible substrate made of a polymer film such as a polyethylene (PE) film, a polyethylene terephthalate (PET) film, or a polyethylene naphthalate (PEN) film as well as various metal foils, Are used as basic materials for electronic devices. However, these materials have poor heat resistance, flame retardancy, chemical resistance, and the like. As a result, they can not withstand a certain level of heat due to lack of heat resistance. There are many problems that are difficult to apply to electronic devices such as electronic devices, etc. In order to compensate for this, when various buffer layers and protective layers are stacked, there is a problem that advantages of the material itself are lost or economical efficiency is low.

Korean Registered Patent No. 0955451 ('Heat-dissipating FPCB and its manufacturing method', 2010. 04. 29. Announcement)

Disclosure of the Invention The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a polyimide resin composition which is excellent in heat resistance, chemical resistance, heat resistance, flame retardancy, mechanical / electrical characteristics, A polyimide-coated film and metal, a solid curved surface and a flexible composite substrate, a method of manufacturing the same, and a via hole structure of an electronic device including the same.

In order to achieve the above object, according to one embodiment of the present invention, a composite structure may be coated on a base material such as an electronic device, that is, an insulation film, a heat resistant film, The flexible composite substrate 100 includes a base film 110 and a polyimide layer 120 coated on the upper surface, the lower surface or the upper / lower surface of the base film 110 in the form of a thin film ). ≪ / RTI >

The base film 110 may be a polyethylene (PE) film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a polypropylene (PP) film, a copper foil, and an aluminum foil ), Or a combination of two or more thereof.

The thickness of the polyimide layer 120 is preferably 1 to 6 占 퐉, more preferably 2 to 3 占 퐉.

At least one metal thin film layer 140 may be attached to the exposed surface of the polyimide layer 120 through an adhesive 130 directly bonded or coated.

The polyimide layer 120 is coated on both the upper surface and the lower surface of the base film 110 and the polyimide layer 120a coated on the upper surface and the polyimide layer 120b coated on the lower surface are coated on the upper surface and the lower surface of the base film 110, The metal thin film layers 140a and 140b of different materials may be directly adhered to or adhered to each other through the adhesive 130.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible composite substrate 100 that can be used in an electronic device product, the method comprising: mixing a polyimide precursor resin with a solvent; Preparing a liquid raw material (S10); (S20) applying the liquid raw material to one surface of the base film 110; (S30) adjusting the thickness of the liquid raw material applied to the base film (110); (S40) of coating a polyimide layer (120) in the form of a thin film on one side of the base film (10) by reacting and drying the liquid raw material by applying heat to the polyimide- Of the present invention.

In the liquid raw material preparation step (S10), the solvent is classified into NMP based on N-methyl pyrrolidone (NMP) and DMAC based on DMAC. The viscosity of the liquid raw material can be adjusted to 50 to 100 cPs.

In the thickness control step S30, the thickness of the liquid raw material applied to the base film 110 may be controlled through a micro-cutter and a gravure facility.

In the coating step (S40), it may be heated to a temperature in the range of 150 to 200 占 폚.

The step (S50) of forming the polyimide layer (120) on various films and metal surfaces, or attaching at least one or more metal thin film layers (140) directly on the exposed surface or applying the adhesive (130) .

Another base film 110 coated with a polyimide layer 120 on one side is bonded to the exposed surface of the base film 110 so that a polyimide layer 120 coated on both sides (S60).

The bonding of the exposed surfaces of the base film 110 may be performed by applying the adhesive 130.

According to another aspect of the present invention, there is provided a via hole structure of an electronic device, including a base film and a lower surface of the base film, A flexible composite substrate 100 comprising a polyimide layer 120 coated in the form of a thin film on a substrate; A first metal pattern 200 formed on an upper surface of the flexible composite substrate 100; And a second metal pattern 300 formed on a lower surface of the flexible composite substrate 200. A part of the flexible composite substrate 100 is cut away to form a through hole 400, And the metal pattern 200 extends downward along the inner circumferential surface of the through hole 400 to be electrically connected to the second metal pattern 300.

The through-hole 400 may have a cross-sectional shape in which the diameter of the through-hole 400 is reduced from the upper portion where the first metal pattern 200 is formed to the lower portion thereof and both side edges thereof are inclined.

The first metal pattern 200 and the second metal pattern 300 may be directly bonded to the upper or lower surface of the flexible composite substrate 100 or may be attached through the applied adhesive 130.

The through hole 400 may be formed by ultrasonic welding in a state where the first metal pattern 200 and the second metal pattern 300 are formed on the upper and lower surfaces of the flexible composite substrate 100 .

The base film 110 of the flexible composite substrate 100 may be a polyethylene film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a polypropylene (PP) film, a copper foil ) And aluminum foil. [0034] The term " a "

The polyimide layer 120 of the flexible composite substrate 100 preferably has a thickness of 1 to 6 탆, more preferably 2 to 3 탆.

The first metal pattern 200 is a composite layer in which at least two or more metal thin films of different materials are laminated and the composite layers all extend downward along the inner circumferential surface of the through hole 400 to form the second metal pattern 300 As shown in FIG.

At least one of the first metal pattern 200 and the second metal pattern 300 may be an NFC antenna pattern.

The flexible composite substrate of the present invention as described above, the method of manufacturing the same, and the via hole structure of an electronic device including the same can be manufactured by coating a polyimide component having excellent heat resistance to a soft base film in an optimal thickness range, In addition, it has excellent properties in terms of mechanical strength, electrical properties, chemical resistance, insulation, heat radiation and radiation resistance, and can be used in various forms such as molding materials, composites, and films. It is possible.

Especially, it solves the problems of various soft base films which can not withstand the soldering temperature and deform the shape of the film itself, so that it can be soldered at high temperature and the film shape is preserved as it is applied and applied to various electronic device products Is possible.

In addition, the substrate itself is flexible and does not break or bend, and can be formed of a transparent material as needed, which makes it possible to utilize various types of substrates.

In addition, as in the conventional clamping method, an ultrasonic welding method in which a via hole is not formed inefficiently through only mechanical pressing, friction is generated at the same time as pressing, and a metal pattern on the upper surface and the lower surface is conducted So that wiring control of the electronic device can be achieved more effectively.

1 illustrates a cross-sectional film M having a polyimide layer 120 formed on only a top surface of a base film 110 and a polyimide layer 120b formed on both the top and bottom surfaces of the base film 110 according to a preferred embodiment of the present invention. Is a schematic view showing a laminated structure of the film (D).
FIG. 2 is a cross-sectional view illustrating a process of coating polyimide layers 120a and 120b on both the upper and lower surfaces of a base film 110 according to a preferred embodiment of the present invention and applying metal strips 140a and 140b to an exposed surface of the base film 110, A laminated structure of a cross section film M in which a polyimide layer 120 is coated only on an upper surface and a metal thin film layer 140 is directly bonded to an exposed surface of the polyimide layer 120 without an adhesive 130, Fig.
3 is a photograph of a film prepared by coating a polyimide film with a thickness of 2 탆 on the upper and lower surfaces of a PET film, respectively.
FIG. 4 is a cross-sectional view illustrating a state in which polyimide is coated on the upper and lower surfaces of a PET film, respectively, and then an aluminum layer is formed on upper and lower portions through an adhesive, Of the film.
FIG. 5 is a photograph of a film prepared by coating polyimide with a thickness of 2 μm on the upper and lower surfaces of a PET film, and then performing copper plating and sputter plating of 1 μm on the upper and lower portions, respectively.
6 is a photograph of a film prepared by coating polyimide with a thickness of 2 탆 only on the upper surface of a PET film and then bonding a copper foil to the upper surface thereof.
FIG. 7 is a photograph of a film prepared by coating a polyimide film with a thickness of 2 μm on the upper and lower surfaces of a PET film, and then forming an aluminum layer on the upper and lower portions, respectively, with an adhesive.
8 is a flowchart of a method of manufacturing a flexible composite substrate according to a preferred embodiment of the present invention.
9 is a schematic view schematically showing the entire process of the manufacturing method of the present invention.
10 shows a process of manufacturing a double-sided film D by bonding a base film 110 coated with a polyimide layer 120 on one side only with an adhesive 130 against each other according to a preferred embodiment of the present invention Fig.
11 is a cross-sectional view illustrating a laminated structure of an electronic device in which a via hole is formed according to a preferred embodiment of the present invention.
12 is a cross-sectional view illustrating a laminated structure of an electronic device in which a via hole is formed according to another preferred embodiment of the present invention.
13 is a cross-sectional view showing a laminated structure of an electronic device having a via hole according to another preferred embodiment of the present invention.
FIG. 14 is a schematic view showing a process of forming a via hole by a conventional clamping method.
Fig. 15 is a photograph of the upper part (upper two) and the lower part (lower two) of the base material after the via hole is formed by the conventional clamping method.
16 is an enlarged view showing a point contact with a cross-sectional photograph of a base material having a via hole formed by a conventional clamping method.
FIG. 17 is a photograph showing that a joint portion on the upper and lower surfaces of a base material is broken when a via hole is formed through a conventional clamping method.
18 is a schematic view showing a process of forming a via hole by ultrasonic welding according to the present invention.
FIG. 19 is a schematic view showing a process of forming a via hole by ultrasonic welding according to the present invention, and is a schematic view showing a state where the upper and lower metal layers are in contact with each other.
FIG. 20 is a photograph showing a state in which the upper and lower metal layers (the copper layer (Cu) and the aluminum layer (Al)) are in contact with each other as a cross-sectional photograph of a base material having via holes formed by ultrasonic welding according to the present invention.
21 is a photograph of a joint portion of the upper and lower base materials when a via hole is formed through ultrasonic welding according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Prior to the description, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and should be construed in accordance with the technical concept of the present invention.

Throughout this specification, when a member is "on " another member, this includes not only when the member is in contact with another member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including" an element, it is understood that it may include other elements as well, without departing from the other elements unless specifically stated otherwise.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

In each step, the identification code is used for convenience of explanation, and the identification code does not describe the order of the steps, and each step may be performed differently from the stated order unless clearly specified in the context. have. That is, each of the steps may be performed in the same order as described, or may be performed substantially concurrently or in the reverse order.

First, the present invention provides a flexible composite substrate 100 that can be utilized in an electronic device product. The flexible composite substrate 100 according to the present invention basically comprises a base film 110 serving as a base material and a polyimide layer (not shown) coated on the upper, lower or upper / 120). Sectional view showing a laminated structure of a cross-section film M in which a polyimide layer 120 is formed only on an upper surface and a double-side film D in which a polyimide layer 120 is formed on both upper and lower surfaces, 1.

The polyimide coated on the base film 110 has insulative heat resistance of H to C type and can be used continuously at 230 to 260 ° C. It is excellent in dimensional stability against temperature and has excellent flame retardancy and can be used at high temperature or low temperature Has good mechanical properties and is resistant to abrasion and abrasion, and has good electrical insulation, chemical resistance and radiation resistance. However, the polyimide itself is not easy to apply, has poor economical efficiency, and has low flexibility, making it less usable as a thin film.

Accordingly, the present invention maximizes the utilization of the polyimide as a thin film while obtaining the inherent advantages of the polyimide by coating the polyimide on the base film 110. In particular, since the polyimide can not withstand the soldering temperature, It is possible to maintain the shape of the film even when the polyimide is coated on the soft base materials susceptible to heat and subjected to a high temperature treatment such as soldering, so that it can be widely applied to various electronic devices.

Although the base film 110 suitable for the polyimide coating process can be adopted as needed for all the substrates used in the electronic device products, it is preferable that the base film 110 is insufficient in heat resistance and can not withstand the soldering temperature, That is, a material having a melting point or a softening temperature lower than the brazing temperature, may be used, and may be applied to the shape of a metal or a solid curved surface to obtain abrasion resistance and chemical resistance. More preferably, it is a thin film including a polyethylene (PE) film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a polypropylene (PP) film, a copper foil and an aluminum foil A metal foil, and a solid curved surface.

The flexible composite substrate 110 is given a characteristic of being able to withstand long-term use under a wide temperature range from a low temperature to a high temperature by coating using a polyimide resin having a melting point as high as 700 DEG C as a resin having excellent heat resistance.

The thickness of the polyimide layer 120 coated on the base film 110 may be set in a suitable range as required, but is preferably adjusted to a range of 1 to 6 탆. When the thickness of the polyimide layer 120 is less than 1 占 퐉, there is a problem that the improvement in properties due to the polyimide coating treatment is not reflected even when the polyimide layer 120 is coated. When the thickness exceeds 6 占 퐉, In addition, cracks are generated on the surface of the coating to reduce the related characteristics, and excessive polyimide materials are used, resulting in poor economical efficiency.

It is more preferable to control the thickness of the polyimide layer 120 in the range of 2 to 3 탆. When the polyimide layer 120 is formed by controlling the thickness of the polyimide layer 120, The surface cracking can be minimized while improving the characteristics and maximizing the economical efficiency.

The flexible composite substrate 100 of the present invention may further include at least one metal thin film layer 140 laminated on the exposed surface of the polyimide layer 120 in addition to the base film 110 and the polyimide layer 120 . The metal thin film layer 140 may be attached directly to the polyimide layer 120 as shown in FIG. 2 or through the adhesive 130 applied to the exposed surface of the polyimide layer 120. As described above, the base film 110 may be formed in the form of a double-sided film D on both exposed sides of the polyimide layer 120 formed on both sides of the base film 110, But may be formed in the form of a cross-section film M only on the exposed side of the mid layer 120. [

The use of the flexible composite substrate 100 of the present invention can be variously changed according to the material, the type, the thickness, the lamination structure of two or more, etc. of the metal thin film layer 140 to be formed. For example, as shown in FIG. 3, after the polyimide layer 120 having a thickness of 2 μm is formed on the upper and lower surfaces using the PET film as the base film 110, the polyimide layer 120 may be used as an electronic material itself , An aluminum thin film is formed on the exposed surface of the polyimide layer 120 formed on the upper and lower surfaces through the adhesive 130 as shown in FIG. 4, and a spot plating of 1 탆 is formed on the exposed surface, ) Plating layer may be formed and used for other purposes. As shown in FIG. 5, the copper plating layer may be directly bonded to the exposed surface of the PET film on which the polyimide layer 120 is formed without the adhesive 130 and the aluminum thin film, with sputter plating of 1 탆. As described above, the adhesive 130 may be applied to the upper surface of the polyimide layer 120 in the form of a cross-section film M as shown in FIG. 6, and a copper foil may be applied thereto. It is also possible to attach the aluminum foil to both sides of the aluminum foil through the adhesive 130 as shown in FIG.

As described above, the flexible composite substrate 100 of the present invention can realize various laminated structures by performing aluminum (Al) lamination, copper (copper) plating, gold plating, sputter plating, And has the advantage of being flexible and not breaking or bending, while exhibiting excellent characteristics such as heat resistance, heat radiation and durability as mentioned above.

The present invention provides a method of manufacturing a flexible composite substrate 100 that can be utilized in an electronic device product according to another preferred embodiment. A flowchart of the manufacturing method of the present invention is shown in Fig. 8, and a whole schematic diagram that can be grasped at a glance of the overall manufacturing process is shown in Fig.

The manufacturing method of the present invention includes a step (S10) of preparing a PI liquid raw material, a step (S20) of applying the same to the base film 110, a step (S30) of adjusting a coating thickness, And forming a polyimide layer 120 by drying (S40).

In the liquid raw material preparation step (S10), a liquid polyimide raw material to be used for coating is prepared. Specifically, a solvent is mixed with the polyimide precursor resin to lower the viscosity thereof so that the coating can be easily performed. The solvent is largely volatilized during subsequent curing upon heating and is used to control the viscosity of the liquid raw material to within the range of 50 to 100 cPs at a temperature of 20 ° C. Various materials may be employed as the solvent, but N-methyle pyrrolidone (NMP) or dimethylacetamide (DMAC) may be preferably used. The density of the mixed liquid raw material is preferably about 1.10 ± 0.02, and the solid content is preferably adjusted to about 20 ± 4%.

Next, the PI liquid material prepared in the base film 110 is applied, and the step of adjusting the applied thickness to the optimal thickness range as described above is performed. At this time, the thickness can be adjusted through a micro cutter which is spaced a predetermined distance from the application surface of the base film 110.

After the coating thickness is controlled, the polyimide precursor resin in the liquid raw material is heated by heating through a heater, and dried and cured to form a thin polyimide layer 120 on one side of the base film 10. The heating is preferably performed in a temperature range of 150 to 200 ° C.

Thus, the cross-section film M having the polyimide layer 120 formed on one surface of the base film 10 is produced. In the case of processing in the form of a cross-section film (M), at least one metal thin film layer 140 may be directly bonded to the upper surface of the formed polyimide layer 120 or may be attached through application of an adhesive 130. At this time, as shown in FIG. 9, the metal thin film layer 140 can be continuously formed at the end of the process of coating polyimide through a roll-to-roll process.

On the other hand, when the polyimide layer 120 is formed on both the upper and lower surfaces of the base film 110 to manufacture the double-sided film D, the above-mentioned processes are repeated on the lower surface of the produced cross- The coating process of the polyimide layer 120 may minimize the thermal damage to the base film 110 during the thermal fusion process of the metal thin film layer 140, The double-sided film D may be manufactured by bonding the base film 110 side with the adhesive 130 such that the base film 110 side is facing in a state of being manufactured in the form of a cross-section film M as shown in FIG. The manufacturing method of the double-sided film (D) through the cross-sectional film (M) laminate in this manner becomes even more significant, especially in the case of producing a laminate with a fine size of 20 탆 or less, because the thermal damage is further maximized.

Meanwhile, the present invention provides a structure of an electronic device in which a via hole is formed by using the flexible composite substrate 100 as described above according to another embodiment.

A via hole means a through hole used for electrical connection between two or more layers of internal conductors without inserting a component in a printed circuit board (PCB) having a multilayer structure, and a through hole Refers to a hole in a round shape on a printed circuit board, which is used for mounting wiring or components between two or more layers.

Conventionally, in a conventional printed circuit board, after a laminated structure is formed in a via hole, a clamping method of forming a through hole in a multilayer through physical pressing is adopted, so that conduction between metal wires can not be smoothly performed, There has been a problem in that it is necessary to perform additional plating in order to allow smooth energization along the inner circumferential surface of the through hole. The reason why the via holes have to be formed by the conventional simple pressing method is that the base substrate itself is poor in heat resistance, heat resistance and durability in using other energy sources such as heat and light.

However, in the present invention, the electronic device is configured based on the flexible composite substrate 100 in which the physico-chemical properties as the basic substrate are greatly improved, so that the upper and lower surfaces of the composite soft substrate 100 The first metal pattern 200 and the second metal pattern 300 can be smoothly energized. Specifically, a conventional method of clamping the flexible composite substrate 100, which is not the conventional clamping method, in which the 'upper metal-base metal-lower metal' is compressed without breaking the intermediate-layer base material through simple pressing, The first metal pattern 200 formed on the upper portion of the flexible composite substrate 100 is downwardly extended along the inner peripheral surface of the through hole 400 formed as a part of the flexible composite substrate 100, A via hole can be formed in which the upper and lower metal patterns are energized along the inner circumferential surface of the through hole by making contact with the pattern 300. [ The lamination structure of the electronic element in which the via hole is formed according to the present invention is shown in Figs.

13, an intermediate black broken form corresponds to the flexible composite substrate 100, and the first metal pattern 200 and the second metal pattern 200 are formed on the upper and lower surfaces of the flexible composite substrate 100 in a somewhat darker white system. A metal plating layer is formed on the first metal pattern 200 in a lighter white system so that the first metal pattern 200 and the upper plating layer are integrally formed on the through- And is electrically connected to the second metal pattern 300 provided at the bottom by being downwardly extended along the inner circumferential surface. As shown in the photograph of FIG. 13, the through hole 400 may be formed such that the diameter gradually decreases from the upper portion to the lower portion, and both side edges thereof have a sloped cross section.

Preferably, the above-mentioned via hole structure of the present invention can be formed by adopting the 'ultrasonic welding' method replacing the conventional clamping method. Ultrasonic fusion is a method of transferring ultrasonic vibration energy (intensity of about 15,000 ~ 20,000 Hz) generated by mechanical vibration energy to a fused material through a horn to generate instantaneous frictional heat at the fused surface of the fused material. It means a way to connect water. Specifically, the ultrasonic welding on the FCCL (flexible circuit board) pushes the insulating layer using a predetermined pressure and ultrasonic vibration, and mechanically vibrates the metal surfaces on the upper and lower parts to strongly bond them through physical diffusion Technology. The FCCL ultrasonic welding technique preferably converts a power source of 100 to 250 V and 50 to 60 Hz to a power source of about 20 KHz or about 40 KHz and converts the same into mechanical vibration energy through a converter And the ultrasonic vibrational energy generated by amplifying the amplitude of the ultrasonic vibration by a booster is transferred to the fused material through a horn so that strong bonding is achieved by forced diffusion on the bonding surface. Particularly, due to the diffusion phenomenon due to ultrasonic vibration, the metal oxide film existing on the metal surface is removed and fused, so that high mechanical strength and electrical characteristics can be obtained. In this case, as shown in FIGS. 11 and 12, it is possible to penetrate the object, calculate the thickness of the metal layer and the insulating layer of the material, and apply an ideal pressure value so as not to penetrate the surface of the object. 13 is a cross-sectional photograph of a via hole formed through ultrasonic welding.

The difference from the conventional clamping method will be described in detail below. Conventional clamping method is a method to pressurize and conduct by merely horn and it is conduced by simple pressure, so only a part of the joint part is contacted, and sufficient contact area can not be ensured. It is possible to cause breakage or breakage of the base material due to pressure, There is a disadvantage in that the joint is easily separated and the reliability is lowered when used for a long time. FIG. 14 is a schematic view showing a process of forming a via hole through clamping, and FIG. 15 is a photograph showing a top and bottom views of a base material after a clamping process. 14, when the via hole is formed by the clamping method, the upper and lower portions are simply pressurized, so that the contact area is very narrow, or the contact is made in a nearly point contact form as shown in FIG. 16, As shown in Fig. 17, it can be seen that breakage occurred at the base material joints in some places.

In the meantime, the ultrasonic welding method according to the present invention can achieve surface contact and a perfect bonding structure by applying vibration energy through ultrasonic waves in addition to pressing, so that the surface contact and the perfect bonding structure can be achieved without additional plating through a diffusion action in the left and right direction (transverse direction). A schematic view of a process of forming a via hole through ultrasonic welding is shown in FIG. 18, and a schematic view showing that a uniform contact is uniformly formed in the process, unlike the clamping process, is shown in FIG. The upper and lower metal layers (for example, the copper (Cu) layer and the aluminum (Al) layer) are in a surface-contact state in an even shape, as shown in FIG. 19 and FIG. 20, which is a sectional view of a via hole. Referring to FIG. 21, since deformation of the base material due to ultrasonic welding is minimized, unlike the clamping method, it is possible to suppress the deterioration of the reliability due to breakage of the base material or disengagement of the joint.

In the present invention, the first metal pattern 200 and the second metal pattern 300 formed on the upper and lower surfaces of the flexible composite substrate 100 can be connected through the aforementioned ultrasonic welding method. And the use of the flexible composite substrate 100 in which the inherent characteristics such as heat resistance, heat dissipation, and durability are improved.

The electronic device structure of the present invention in which the through hole 400 is formed through the ultrasonic welding is not necessarily required to be separately formed in order to conduct electricity along the outer circumferential surface of the through hole. However, Copper plating, gold plating, etc. may be performed to improve the surface roughness.

The via-hole structure formed in this manner has a stable process itself compared to the conventional method, does not give physical burden to the entire substrate, is less likely to damage the metal pattern, and does not need to be exposed for a long time, so that the substrate or metal pattern is corroded or oxidized The problem can be suppressed.

When the through hole 400 of the present invention is formed through the ultrasonic welding method, the diameter decreases from the upper part to the lower part as described above. The flexible composite substrate 100 is broken due to the vibration energy applied at the time of ultrasonic welding and the through hole 400 is formed and the first metal pattern 200 is melted down along the inner circumferential surface thereof. The diameter of the upper portion, which is the side where the first metal pattern 200 is formed, is the largest, and the diameter becomes smaller toward the side where the second metal pattern 300 is formed, because the through hole 400 is also applied to the surface on which the metal pattern 200 is formed to be.

As a result, the flexible composite substrate 100 of the present invention can be applied to various electronic device products due to various excellent characteristics. Especially, by forming a via hole through ultrasonic welding, the flexible composite substrate 100 can be suitably utilized as a structure of an electronic device.

The present invention is not limited to the above-described specific embodiment and description, and various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention as claimed in the claims. And such modifications are within the scope of protection of the present invention.

M: section film
D: Double-sided film
100: flexible composite substrate
110: base film
120, 120a, 120b: polyimide layer
130: Adhesive
140, 140a, 140b: metal thin film layer
200: first metal pattern
300: second metal pattern
400: Through hole

Claims (22)

delete delete delete delete delete delete delete delete delete delete delete delete delete In a via hole structure of an electronic device,
A flexible composite substrate (100) comprising a base film (110) and a polyimide layer (120) directly coated on the upper and lower surfaces of the base film (110) in a thin film form;
A first metal pattern 200 formed on an upper surface of the flexible composite substrate 100; And
A second metal pattern 300 formed on a lower surface of the flexible composite substrate 100;
/ RTI >
A part of the flexible composite substrate 100 is cut away to form a through hole 400 and the first metal pattern 200 extends downward along the inner circumferential surface of the through hole 400 to form the second metal pattern 300, respectively,
The through hole 400 is formed through ultrasonic welding in a state where the first metal pattern 200 and the second metal pattern 300 are formed on the upper and lower surfaces of the flexible composite substrate 100,
The through-hole 400 has a cross-sectional shape in which the diameter of the through-hole 400 is reduced from the upper portion where the first metal pattern 200 is formed to the lower portion thereof,
The base film 110 of the flexible composite substrate 100 may be one selected from the group consisting of a polyethylene (PE) film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, and a polypropylene A via-hole structure of an electronic device, characterized in that it is at least two laminated layers. delete 15. The method of claim 14,
Wherein the first metal pattern 200 and the second metal pattern 300 are directly bonded to the upper or lower surface of the flexible composite substrate 100 or are attached through the applied adhesive 130. [ A via hole structure of a device. delete delete 15. The method of claim 14,
Wherein the polyimide layer (120) of the flexible composite substrate (100) has a thickness of 1 to 6 占 퐉. 15. The method of claim 14,
Wherein the polyimide layer (120) of the flexible composite substrate (100) has a thickness of 2 to 3 占 퐉. 15. The method of claim 14,
The first metal pattern 200 is a composite layer in which at least two or more metal thin films of different materials are laminated and the composite layers all extend downward along the inner circumferential surface of the through hole 400 to form the second metal pattern 300 And the via hole structure is electrically connected to the via hole structure. 15. The method of claim 14,
Wherein at least one of the first metal pattern (200) and the second metal pattern (300) is an NFC antenna pattern.
KR1020160024670A 2015-03-13 2016-02-29 Flexible complex substrate coated polyimide, manufacturing method thereof, and via hole structure of electronic device comprising the same KR101769554B1 (en)

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