CN103419459A - Hot pressing device and hot pressing method - Google Patents
Hot pressing device and hot pressing method Download PDFInfo
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- CN103419459A CN103419459A CN2012101533269A CN201210153326A CN103419459A CN 103419459 A CN103419459 A CN 103419459A CN 2012101533269 A CN2012101533269 A CN 2012101533269A CN 201210153326 A CN201210153326 A CN 201210153326A CN 103419459 A CN103419459 A CN 103419459A
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Abstract
The invention relates to a hot pressing device comprising a tape-type separation substrate, a reeling wheel, an unreeling wheel, and a hot pressing head. The separation substrate comprises a resin material and a metal layer which are laminated together. Two ends of the separation substrate are respectively wound on the unreeling wheel and the reeling wheel, such that a part of the separation substrate is tensioned between the unreeling wheel and the reeling wheel. The hot pressing head is arranged between the unreeling wheel and the reeling wheel, and is positioned above the separation substrate tensioned between the unreeling wheel and the reeling wheel. One end face of the hot pressing head is a hot pressing surface. The hot pressing surface contacts the resin material of the separation substrate. The hot pressing head is used for the hot pressing of a flexible circuit board and a rigid circuit board. With the hot pressing head, solder paste is melted and cured, such that the flexible circuit board and the rigid circuit board can be connected. The invention also relates to a hot pressing method adopting the hot pressing device.
Description
Technical field
The present invention relates to a kind of hot-press arrangement and hot-press method, particularly a kind of for flexible PCB being connected in to hot-press arrangement and the hot-press method of hard circuit board.
Background technology
Usually, flexible PCB is connected to hard circuit board and can selects hot-press method, this hot-press method generally includes following steps: provide a hard circuit board with some weld pads, print solder paste respectively on these some weld pads; One flexible PCB is provided, there are the some splicing ears corresponding with these some weld pads on this flexible PCB; Some splicing ears of this flexible PCB are contacted with the tin cream on corresponding weld pad respectively; Adopt a thermal head to contact this flexible PCB to position that should some splicing ears, and press down this thermal head along the direction towards this weld pad, utilize the high temperature of thermal head and to the pressure of this tin cream, make tin cream melting bonding with this splicing ear, thereby make this flexible PCB be connected in this hard circuit board.
Yet, in the process that at thermal head, tin cream is pressed down and heat, may make tin cream overflow between this flexible PCB and hard circuit board and stick this thermal head, when the tin cream on adhering to thermal head is more, may cause thermal head to the tin cream heating-up temperature inequality on hard circuit board, cause part engagement position insufficient strength between hard circuit board and flexible PCB, hard circuit board descends with the yield that engages of flexible PCB.
Summary of the invention
In view of this, be necessary the hot-press arrangement and the hot-press method that provide a kind of hot pressing yield higher.
A kind of hot-press arrangement, it comprise the isolation base material, of a coil type broadcast wheel, furl the wheel and a thermal head.This isolation base material comprises resin material layer and the metal level fitted, and the glass transition temperature of this resin material layer is greater than 280 ℃, and the contact angle of this metal level and liquid tin is less than 55 °.The two ends of this isolation base material are wound in respectively this and broadcast wheel and furl wheel, so that the part isolate base material open be located at broadcast the wheel and furl between wheel, this furls wheel for driving wheel, and this furls wheel and can drive and be wound in the isolation base material of broadcasting wheel and broadcast from this that wheel is broadcasted, process is broadcasted to take turns and furl between wheel and furled in this and furl wheel again by rotations.This thermal head is arranged to be broadcasted wheel and furls between wheel, and be located at broadcast wheel and furl isolation base material between wheel above, one end face of this thermal head is hot-pressed surface, this hot-pressed surface contacts with the resin material layer of this isolation base material, this thermal head is for hot pressing flexible PCB and hard circuit board, so that the tin cream melting and solidification between flexible PCB and hard circuit board is to connect this flexible PCB and hard circuit board.
A kind of hot-press method comprises step: S1: a hard circuit board is provided, and this hard circuit board comprises one first basalis and is arranged at the first conducting wire layer on this first basalis surface, and this first conducting wire layer comprises a plurality of weld pads; S2: a flexible PCB is provided, and this flexible PCB comprises one second basalis and is arranged at the second conducting wire layer on this second basalis surface, and this second conducting wire layer comprises a plurality of splicing ears corresponding with the plurality of weld pad; S3: at a plurality of weld pad surface printing tin creams of this hard circuit board; S4: a plurality of splicing ears that make this flexible PCB contact with the tin cream on corresponding weld pad surface respectively; S5: utilize above-mentioned this hard circuit board of hot-press arrangement hot pressing and flexible PCB, make and be located at the metal level that furls the wheel and broadcast the isolation base material between wheel and contact with the second basalis of this flexible PCB, and make hot-pressed surface corresponding with the plurality of splicing ear, make tin cream heating and melting cooling curing by thermal head hot pressing, thereby this flexible PCB is fixedly connected with this hard circuit board; S6: furl wheel by rotation, make this isolation base material do not pressed the zone of crossing to contact with the hot-pressed surface of this thermal head, repeating step S1 to S5, to be fixedly connected with another hard circuit board and another flexible PCB.
With respect to prior art, in described hot-press arrangement and hot-press method, at this thermal head and between by the tin cream district of hot pressing, adopt this isolation base material to be isolated, when the tin cream district by hot pressing and overflow this flexible PCB and this hard circuit board between the time, the metal level of this isolation base material can stick this tin cream thereon, avoid tin cream to stick on thermal head, prevent that thermal head from adhering to the heating inequality that tin cream causes, thereby improve the hot pressing yield.
The accompanying drawing explanation
The schematic diagram of the hard circuit board that Fig. 1 provides for the embodiment of the present invention.
The schematic diagram of the flexible PCB that Fig. 2 provides for the embodiment of the present invention.
The schematic diagram of the hot-press arrangement that Fig. 3 provides for the embodiment of the present invention.
The enlarged diagram that Fig. 4 is the IV part in Fig. 3.
Fig. 5 is the schematic diagram after the hard circuit board print solder paste shown in Fig. 1.
Fig. 6 is by the contacted schematic diagram of the hard circuit board of the flexible PCB of Fig. 2 and Fig. 5.
Fig. 7 schematic diagram that to be the hot-press arrangement that utilizes Fig. 3 carry out hot pressing to flexible PCB and the hard circuit board of Fig. 6.
The schematic diagram that Fig. 8 is the Rigid Flex that forms after the heat-press step shown in Fig. 7.
The main element symbol description
| |
10 |
| The |
12 |
| The first conducting |
14 |
| |
142 |
| |
20 |
| The |
22 |
| The second conducting |
24 |
| |
242 |
| Hot- |
30 |
| |
32 |
| |
34 |
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36 |
| The |
38 |
| Hot-pressed |
322 |
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382 |
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384 |
| The |
144 |
| Rigid Flex | 40 |
The following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, the technical program is described in further detail.
Refer to Fig. 1 to Fig. 8, the embodiment of the present invention provides a kind of hot-press method, thereby can realize continuously that hot pressing is fixedly connected with a plurality of flexible PCBs with a plurality of hard circuit boards continuously one by one.This hot-press method comprises the following steps:
The first step, refer to Fig. 1, and a hard circuit board 10 is provided, and this hard circuit board 10 comprises one first basalis 12 and be arranged at the first conducting wire layer 14 on these the first basalis 12 surfaces, and this first conducting wire layer 14 comprises a plurality of weld pads 142.
This first basalis 12 is the hard resin layer, and as epoxy resin, glass-fiber-fabric etc., this first conducting wire layer 14 is made through selective etch by the copper layer.In the present embodiment, this hard circuit board 10 is single sided board.Be appreciated that this hard circuit board 10 can also be multi-layer sheet, the first basalis 12 can be multilager base plate, comprises the multi-layer resinous layer and multilayer conductive circuit layer of alternative arrangement.The plurality of weld pad 142 is electrically connected to realize electrical communication mutually for the flexible PCB with subsequent step.
Be appreciated that this first conducting wire layer 14 is outer to comprise solder mask, to protect the first conducting wire layer 14, and can prevent the oxidation of the first conducting wire layer 14, it should be noted that, the plurality of weld pad 142 need be exposed to outside solder mask.
Second step, refer to Fig. 2, one flexible PCB 20 is provided, and this flexible PCB comprises one second basalis 22 and is arranged at the second conducting wire layer 24 on these the second basalis 22 surfaces, and this second conducting wire layer 24 comprises a plurality of splicing ears 242 corresponding with the plurality of weld pad 142.
This second basalis 22 is the flexible resin layer, as polyimides (Polyimide, PI), PETG (Polyethylene Terephtalate, PET) or PEN (Polythylene Naphthalate, PEN).This second conducting wire layer 24 is made through selective etch by the copper layer.In the present embodiment, this flexible PCB 20 is single sided board.Be appreciated that this flexible PCB 20 can also multi-layer sheet, the second basalis 22 can be multilager base plate, comprises the multi-layer resinous layer and multilayer conductive circuit layer of alternative arrangement.The plurality of splicing ear 242 is for being electrically connected to realize and hard circuit board 10 electrical communication with the plurality of weld pad 142.
Be appreciated that this second conducting wire layer 24 is outer to comprise solder mask, to protect the second conducting wire layer 24, and can prevent the oxidation of the second conducting wire layer 24, it should be noted that, the plurality of splicing ear 242 need be exposed to outside solder mask.
The 3rd step, refer to Fig. 3, and a hot-press arrangement 30 is provided.This hot-press arrangement comprises that a thermal head 32, furls wheel 34, and broadcasts wheel 36 and one coil type isolation base material 38.This thermal head 32 has a hot-pressed surface 322, the bar-shape that this isolation base material 38 is coil type, and the two ends of this isolation base material 38 are wound on respectively this and furl wheel 34 and broadcast wheel 36, and 38 of this isolation base materials of part are located at and are furled wheel 34 and broadcast between wheel 36.This furls wheel 34 is driving wheel, and this broadcasts wheel 36 for driven pulley, and this rotation that furls wheel 34 can drive furling at this of this isolation base material 38 and furl on wheel 34, and drive is simultaneously broadcasted wheel 36 and rotated and broadcast the isolation base material 38 that this broadcasts the coiling on wheel 36.This thermal head 32 is arranged at this and furls wheel 34 and broadcast between wheel 36 with this, be located at furl wheel 34 and broadcast the isolation base material 38 of taking turns between 36 above, and this hot-pressed surface 322 contacts with this isolation base material 38.
This furls wheel and 34 can rotate under the driving of a motor (not shown), and when this furls wheel 34 and does not rotate, this furls wheel 34 and broadcasts wheel 36 and all can bear predetermined pulling force and not rotate, so that isolation base material 38 therebetween has certain tension force.
Refer to Fig. 4, this isolation base material 38 comprises a resin material layer 382 and fits in the metal level 384 on these resin material layer 382 surfaces.The close thermal head 32 of resin material layer 382, and contact with hot-pressed surface 322.The glass transition temperature of this resin material layer 382 is higher than 280 ℃, and as polyimides (Polyimide, PI), preferably the thickness range of this resin material layer 382 is 20 μ m to 100 μ m.This metal level 384 is for contacting with circuit board.The liquid tin that this metal level 384 will produce for adsorbing, adhere to the circuit board hot pressing, therefore this metal level 384 generally should be less than 55 ° with the contact angle of liquid tin, preferably contact angle is less than 45 °.The material of this metal level 384 can be copper, gold etc.
The 4th step, refer to Fig. 5, at a plurality of weld pads 142 surface printing tin creams of this hard circuit board 10, forms a plurality of tin creams district 144 corresponding to the plurality of weld pad 142.
The plurality of tin cream district 144 can form by the mode of screen painting, specific as follows: provide one to have the steel plate (not shown) of a plurality of through holes, the position of the plurality of through hole, shape and size are corresponding with position, shape and the size of the plurality of weld pad; Steel plate is positioned on this hard circuit board 10, and makes the plurality of through hole respectively over against the plurality of weld pad 142; The tin cream material is arranged to this surface of steel plate, and utilizes scraper that tin cream is scraped to weld pad 142 surfaces from the through hole of predetermined pattern, form the plurality of tin cream district 144.
The 5th step, refer to Fig. 6 to Fig. 8, a plurality of splicing ears 242 of flexible PCB 20 are contacted respectively to the tin cream district 144 on corresponding weld pad 142, and make the position corresponding with the plurality of splicing ear 242 of these flexible PCBs 20 of isolation base material 38 contact of hot-press arrangement 30, this second basalis 22 is away from position corresponding with the plurality of splicing ear 242 in the surface of this second conducting wire layer 24.Simultaneously, thermal head 32 heats and forces in this contacted hard circuit board 10 and flexible PCB 20, makes the plurality of tin cream district 144 between the plurality of splicing ear 242 and weld pad 142 be heated melting.And then remove this thermal head 32 and this isolation base material 38, be fixedly connected with the plurality of weld pad 142 and the plurality of splicing ear 242 after tin cream district 144 cooling curings after heating and melting, thereby make this flexible PCB 20 be connected and fixed on this hard circuit board 10.
In this step, the heating-up temperature of this thermal head 32 is generally 280 ℃, thermal head 32 conducts to tin cream district 144 by this isolation base material 38 and splicing ear 242 by heat, make this tin cream district 144 heating and meltings cooling curing, thereby make a plurality of splicing ears 242 reach and be electrically connected to by tin cream district 144 with the plurality of weld pad 142.Have in this area and usually know that the knowledgeable is appreciated that, this tin cream district 144 in the pressing process after heating and melting will become mobile liquid tin, if having operative liquid tin to flow overflows outside the plurality of weld pad 142 and the plurality of splicing ear 242, now, metal level 384 can be adhered thereto by the liquid tin overflowed, and prevents from polluting thermal head 32.
It should be noted that, the hot-press method of the present embodiment both can be used for that flexible PCB all was pressed on to hard circuit board and had formed new hard circuit board, also can be used for flexible PCB and the pressing of hard circuit board part are formed to Rigid Flex, depending on actual needs.In the present embodiment, as shown in Figure 8, through this hot-press method, this flexible PCB 20 is connected to form a Rigid Flex 40 with this hard circuit board 10.
The 6th step, driving this to furl wheel 34 rotates, make this isolation base material 38 pressed the zone of crossing to leave this hot-pressed surface 322 by this thermal head 32, and these isolation base material 38 another zones of not pressed contact with the hot-pressed surface 322 of this thermal head 32, repeat first and second, four and five steps, another flexible PCB 20 can be connected in to another hard circuit board 10.
Repeat above step, can realize continuously connecting one to one between a plurality of flexible PCBs 20 and a plurality of hard circuit board 10.
With respect to prior art, in the hot-press method of the present embodiment, at this thermal head 32 and between by the tin cream district 144 of hot pressing, adopt this isolation base material 38 to be isolated, when tin cream district 144 by hot pressing and while overflowing between this flexible PCB 20 and this hard circuit board 10, the metal level 384 of this isolation base material 38 can be adhered thereto by this tin cream, avoid tin cream to adhere on thermal head 32, prevent that thermal head 32 from adhering to the heating inequality that tin cream causes, thereby improve the hot pressing yield.
In addition, those skilled in the art also can do other variation in spirit of the present invention, with for designs such as the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (10)
1. a hot-press arrangement, it comprises:
The isolation base material of one coil type, this isolation base material comprises resin material layer and the metal level fitted, and the glass transition temperature of this resin material layer is greater than 280 ℃, and the contact angle of this metal level and liquid tin is less than 55 °;
One broadcasts wheel and furls wheel, the two ends of this isolation base material are wound in respectively this and broadcast wheel and furl wheel, so that the part isolate base material open be located at broadcast the wheel and furl between wheel, this furls wheel for driving wheel, and this furls wheel and can drive and be wound in the isolation base material of broadcasting wheel and broadcast from this that wheel is broadcasted, process is broadcasted to take turns and furl between wheel to furl in this again and furled wheel by rotations; And
One thermal head, this thermal head is arranged to be broadcasted wheel and furls between wheel, and be located at broadcast wheel and furl isolation base material between wheel above, one end face of this thermal head is hot-pressed surface, this hot-pressed surface contacts with the resin material layer of this isolation base material, this thermal head is for hot pressing flexible PCB and hard circuit board, so that the tin cream melting and solidification between flexible PCB and hard circuit board is to connect this flexible PCB and hard circuit board.
2. hot-press arrangement as claimed in claim 1, is characterized in that, this resin material layer is polyimides.
3. hot-press arrangement as claimed in claim 1, is characterized in that, the thickness range of this resin material layer is 20 μ m to 100 μ m.
4. hot-press arrangement as claimed in claim 1, is characterized in that, the contact angle of this metal level and liquid tin is less than 45 °.
5. hot-press arrangement as claimed in claim 4, is characterized in that, the material of this metal level is copper or gold.
6. a hot-press method comprises step:
S1: a hard circuit board is provided, and this hard circuit board comprises one first basalis and is arranged at the first conducting wire layer on this first basalis surface, and this first conducting wire layer comprises a plurality of weld pads;
S2: a flexible PCB is provided, and this flexible PCB comprises one second basalis and is arranged at the second conducting wire layer on this second basalis surface, and this second conducting wire layer comprises a plurality of splicing ears corresponding with the plurality of weld pad;
S3: at a plurality of weld pad surface printing tin creams of this hard circuit board;
S4: a plurality of splicing ears that make this flexible PCB contact with the tin cream on corresponding weld pad surface respectively;
S5: utilize this hard circuit board of hot-press arrangement hot pressing as described as claim 1 to 5 any one and flexible PCB, make and be located at the metal level that furls the wheel and broadcast the isolation base material between wheel and contact with the second basalis of this flexible PCB, and make hot-pressed surface corresponding with the plurality of splicing ear, make tin cream heating and melting cooling curing by thermal head hot pressing, thereby this flexible PCB is fixedly connected with this hard circuit board;
S6: furl wheel by rotation, make this isolation base material do not pressed the zone of crossing to contact with the hot-pressed surface of this thermal head, repeating step S1 to S5, to be fixedly connected with another hard circuit board and another flexible PCB.
7. hot-press method as claimed in claim 6, is characterized in that, the heating-up temperature of this thermal head is 280 ℃.
8. hot-press method as claimed in claim 6, is characterized in that, at a plurality of weld pad surface printing tin creams of this hard circuit board, comprises step:
Provide a steel plate with a plurality of through holes, position, the shape and big or small corresponding of the position of the plurality of through hole, shape and size and the plurality of weld pad;
Steel plate is positioned on this hard circuit board, and makes the plurality of through hole respectively over against the plurality of weld pad; And
Tin cream is arranged to this surface of steel plate, and utilizes scraper that tin cream is scraped to the weld pad surface from a plurality of through holes.
9. hot-press method as claimed in claim 6, is characterized in that, this first basalis is epoxy resin or glass-fiber-fabric, and this second basalis is polyimides, PETG or PEN.
10. hot-press method as claimed in claim 6, is characterized in that, this first basalis is to comprise a plurality of insulating barriers of alternative arrangement and the multilager base plate of a plurality of conducting wires layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101533269A CN103419459A (en) | 2012-05-17 | 2012-05-17 | Hot pressing device and hot pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101533269A CN103419459A (en) | 2012-05-17 | 2012-05-17 | Hot pressing device and hot pressing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103419459A true CN103419459A (en) | 2013-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101533269A Pending CN103419459A (en) | 2012-05-17 | 2012-05-17 | Hot pressing device and hot pressing method |
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| Country | Link |
|---|---|
| CN (1) | CN103419459A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138843A (en) * | 2017-06-08 | 2017-09-08 | 苏州市美好精密机械有限公司 | For solar battery sheet grid line and the hot press of busbar |
| CN107580428A (en) * | 2017-08-30 | 2018-01-12 | 电子科技大学 | Medium based on tin pressure integrates suspended substrate stripline circuit implementing method |
-
2012
- 2012-05-17 CN CN2012101533269A patent/CN103419459A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138843A (en) * | 2017-06-08 | 2017-09-08 | 苏州市美好精密机械有限公司 | For solar battery sheet grid line and the hot press of busbar |
| CN107580428A (en) * | 2017-08-30 | 2018-01-12 | 电子科技大学 | Medium based on tin pressure integrates suspended substrate stripline circuit implementing method |
| CN107580428B (en) * | 2017-08-30 | 2019-12-10 | 电子科技大学 | Tin voltage-based dielectric integrated suspension line circuit implementation method |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |