JP2005222770A - Connection structure of printed circuit board and connection method of printed circuit board - Google Patents

Connection structure of printed circuit board and connection method of printed circuit board Download PDF

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JP2005222770A
JP2005222770A JP2004027988A JP2004027988A JP2005222770A JP 2005222770 A JP2005222770 A JP 2005222770A JP 2004027988 A JP2004027988 A JP 2004027988A JP 2004027988 A JP2004027988 A JP 2004027988A JP 2005222770 A JP2005222770 A JP 2005222770A
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printed circuit
circuit board
conductor
electric terminal
terminal portion
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Ryokichi Matsumoto
亮吉 松本
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Fujikura Ltd
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Fujikura Ltd
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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of printed circuit boards with small electric terminal parts, capable of making high-density connection in an apparatus. <P>SOLUTION: In connecting the printed circuit boards, an adhesive sheet made of either thermoplastic resin or thermosetting resin is pinched between the electric terminal parts as connection parts. Here, the electric terminal parts of the printed circuit boards are heated and pressurized, and an adhesive is made to flow into air space formed by conductor circuits to bond each insulation material with the other of the printed circuit boards. With this, an interval between the conductor circuits of the electric terminal parts can be narrowed, and as a result, the electric terminal parts can be made smaller to allow connection of the high-density printed circuit boards. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、プリント回路(電気回路)基板に配列された電気端子を接続する接続構造及びプリント回路基板の接続方法に関する。   The present invention relates to a connection structure for connecting electrical terminals arranged on a printed circuit (electric circuit) board and a method for connecting the printed circuit board.

電気回路の端子部分を接続する方法としては、コネクタを利用した接続や、電気回路の端子部分の導体回路にはんだをリフローさせ、別の電気回路の端子部分を接着し加熱するはんだ付けによる方法などがある。これらの方法により、複数のプリント回路基板を接続し一体化することにより、低コストで複雑な構造を持つプリント回路基板の作製が可能である。   As a method of connecting the terminal part of an electric circuit, a connection using a connector, a soldering method in which solder is reflowed to a conductor circuit of a terminal part of an electric circuit, and a terminal part of another electric circuit is bonded and heated. There is. By connecting and integrating a plurality of printed circuit boards by these methods, a printed circuit board having a complicated structure can be manufactured at a low cost.

コネクタを用いるプリント回路基板の電気端子部の接続方法の例としては、2枚のプリント回路基板の間に絶縁性の中間部材を嵌合させ、導電金具がプリント回路基板の導電パターンを押圧して接触する構造の電気コネクタにより、多種のプリント回路基板を使用していろいろな電気回路の構成を可能にすると共に、プリント回路基板の材料の歩留まりも向上させる方法がある。(例えば、特許文献1参照)   As an example of a method for connecting electrical terminals of a printed circuit board using a connector, an insulating intermediate member is fitted between two printed circuit boards, and a conductive metal fitting presses the conductive pattern of the printed circuit board. There is a method of making various electrical circuits using various printed circuit boards, and improving the yield of the printed circuit board material by using the electrical connector having a contact structure. (For example, see Patent Document 1)

また、はんだ付けによるプリント回路基板の電気端子部の接続方法の例としては、溶融時にガスを発生する物質を含有させたはんだを用いて、発生したガスがはんだ表面の酸化膜を破り、はんだの新たな面を露出させるので、フラックスが不要となるはんだ付けによる接続方法がある。(例えば、特許文献2参照)
特開平05−266952号公報 特開平08−162753号公報
In addition, as an example of a method of connecting the electric terminal portion of the printed circuit board by soldering, using a solder containing a substance that generates a gas at the time of melting, the generated gas breaks the oxide film on the solder surface, Since a new surface is exposed, there is a soldering connection method that eliminates the need for flux. (For example, see Patent Document 2)
Japanese Patent Laid-Open No. 05-266952 Japanese Patent Application Laid-Open No. 08-162753

図6は、コネクタにより接続されるプリント回路基板の一例を示す図である。プリント回路基板21の表面に形成された導体回路22の端にコネクタ23が固定されている。このコネクタ23に、他のプリント回路基板に接合されているコネクタ24を挿入することで、プリント回路基板同士が電気的に接合される。
図7は、はんだ付けによるプリント基板回路の接続部分の一例を示す図である。プリント回路基板21の表面に導体回路22が形成されている。導体回路22はプリント回路基板の接続部分である端子25にも延伸し、図には示されていないが、同様に掲載された他のプリント回路基板の端子とはんだ付けされ、回路基板21は他のプリント回路基板と電気的に接続される。
FIG. 6 is a diagram illustrating an example of a printed circuit board connected by a connector. A connector 23 is fixed to the end of the conductor circuit 22 formed on the surface of the printed circuit board 21. By inserting the connector 24 joined to another printed circuit board into the connector 23, the printed circuit boards are electrically joined together.
FIG. 7 is a diagram illustrating an example of a connection portion of a printed circuit board circuit by soldering. A conductor circuit 22 is formed on the surface of the printed circuit board 21. The conductor circuit 22 extends to a terminal 25 which is a connection portion of the printed circuit board, and is not shown in the figure, but is soldered to a terminal of another printed circuit board similarly listed, and the circuit board 21 is other Electrically connected to the printed circuit board.

近年、プリント回路基板では回路の微細化が進み、また携帯電話などの携帯用通信機器は更なる小型化が求められることから、プリント回路基板の接続部分においても小型化、省スペース化の要求が増している。これに対して、従来のコネクタによるプリント回路基板の電気端子部の接続構造では、コネクタ自体の大きさや隣接する接続部分間の距離の制約から、プリント回路基板の電気端子部の導体回路の間隔を狭くするには限界があった。
一方、はんだ付けによるプリント回路基板の接続においては、隣接する導体回路との間隔が小さい場合には、リフローによる導体回路面へのはんだ層の形成時やはんだの再加熱時に、隣接する導体回路との間にもはんだが付着し回路が短絡する恐れがある。この短絡防止のために、電気端子部の導体回路の間隔を小さくすることが困難であった。
また、接続するプリント回路基板の対応する端子を精密に整合させる必要があり、これも回路の微細化を妨げる要因になっていた。また、接続時に電気端子部をはんだの融点以上の温度まで加熱する必要があり、この際にプリント回路基板が熱による損傷を受け易いという問題があった。
In recent years, circuit miniaturization has progressed in printed circuit boards, and portable communication devices such as mobile phones are required to be further miniaturized. Therefore, there is a demand for miniaturization and space saving in the connection part of printed circuit boards. It is increasing. On the other hand, in the connection structure of the printed circuit board electrical terminal portion using the conventional connector, the distance between the conductor circuits of the electrical terminal portion of the printed circuit board is limited due to the size of the connector itself and the restrictions on the distance between adjacent connection portions. There was a limit to narrowing.
On the other hand, in the connection of the printed circuit board by soldering, when the distance between the adjacent conductor circuits is small, when the solder layer is formed on the conductor circuit surface by reflow or when the solder is reheated, There is a risk that the solder may adhere between the two and the circuit may be short-circuited. In order to prevent this short circuit, it has been difficult to reduce the interval between the conductor circuits in the electric terminal portion.
In addition, it is necessary to precisely match the corresponding terminals of the printed circuit board to be connected, which is also a factor that hinders circuit miniaturization. Further, it is necessary to heat the electrical terminal portion to a temperature equal to or higher than the melting point of the solder at the time of connection, and there is a problem that the printed circuit board is easily damaged by heat.

よって、本発明における課題は、機器内での高密度の配線が可能な様に、プリント回路基板の電気端子部の導体回路の間隔を狭くすることが出来、接続部分を小型化可能なプリント回路基板の接続構造を提供することにある。   Therefore, the problem in the present invention is that the printed circuit board can reduce the interval between the conductor circuits of the electrical terminal portion of the printed circuit board and can reduce the size of the connection portion so that high-density wiring in the device is possible. It is to provide a connection structure for a substrate.

かかる課題を解決するため、請求項1に記載した発明は、絶縁基材上に電気接続部を除いて絶縁被覆された複数の導体回路が形成され、他の回路基板と電気的に接続するための複数の導体回路が露出した電気端子部を備えるプリント回路基板の接続構造において、前記プリント回路基板の相対する電気端子部に接着剤を狭み、電気端子部同士を接続することを特徴とするプリント回路基板の接続構造である。   In order to solve such a problem, the invention described in claim 1 is to form a plurality of conductor circuits coated with insulation except for an electrical connection portion on an insulating base material, and to electrically connect to other circuit boards. In the printed circuit board connection structure including the electrical terminal portions where the plurality of conductor circuits are exposed, an adhesive is narrowed to the opposing electrical terminal portions of the printed circuit board, and the electrical terminal portions are connected to each other. It is a connection structure of a printed circuit board.

また、請求項2に記した発明は、少なくとも一方の前記プリント回路基板の電気端子部の導体回路は、該導体回路の断面が相対する導体回路側に凸状であることを特徴とする請求項1のプリント回路基板の接続構造である。   The invention described in claim 2 is characterized in that the conductor circuit of the electric terminal portion of at least one of the printed circuit boards is convex toward the conductor circuit side where the cross section of the conductor circuit is opposed. 1 is a connection structure of one printed circuit board.

また、請求項3に記した発明は、少なくとも一方の前記プリント回路基板の電気端子部の導体回路は、該導体回路の断面が相対する導体回路側の辺が絶縁基材側の辺よりも短い台形状であることを特徴とする請求項1のプリント回路基板の接続構造である。   According to a third aspect of the present invention, in the conductor circuit of the electrical terminal portion of at least one of the printed circuit boards, the side of the conductor circuit on which the cross section of the conductor circuit is opposed is shorter than the side on the insulating substrate side. 2. The printed circuit board connection structure according to claim 1, wherein the printed circuit board connection structure is trapezoidal.

また、請求項4に記した発明は、一方の前記プリント回路基板の電気端子部の絶縁材表面と他方のプリント回路基板の前記電気端子部の絶縁材表面に狭まれる接着剤は、両絶縁基材表面を接着していることを特徴とする請求項1ないし3に記載のプリント回路基板の接続構造である。   Further, the invention described in claim 4 is characterized in that the adhesive narrowed on the insulating material surface of the electric terminal portion of one of the printed circuit boards and the insulating material surface of the electric terminal portion of the other printed circuit board is both insulated. 4. The printed circuit board connection structure according to claim 1, wherein the substrate surface is adhered.

また、請求項5に記した発明は、前記接着剤は、熱可塑性または熱硬化性樹脂であることを特徴とする請求項1ないし4に記載のプリント回路基板の接続構造である。   The invention described in claim 5 is the printed circuit board connection structure according to any one of claims 1 to 4, wherein the adhesive is a thermoplastic or thermosetting resin.

また、請求項6に記した発明は、絶縁基材上に電気接続部を除いて絶縁被覆された複数の導体回路が形成され、他の回路基板と電気的に接続するための複数の導体回路が露出した電気端子部を備えるプリント回路基板の接続方法において、一方の電気端子部と相対する他方の電気端子部間にシート状の接着剤を狭み、その後、前記接着剤を挟んだ電気端子部を熱プレスにより接合することを特徴とするプリント回路基板の接続方法である。   In the invention described in claim 6, a plurality of conductor circuits which are insulated and coated except for an electrical connection portion are formed on an insulating substrate, and a plurality of conductor circuits for electrically connecting to another circuit board. In the method of connecting a printed circuit board having an exposed electric terminal part, a sheet-like adhesive is narrowed between the other electric terminal parts opposite to one electric terminal part, and then the adhesive is sandwiched between the electric terminals The printed circuit board connecting method is characterized in that the portions are joined by hot pressing.

また、請求項7に記した発明は、電気端子部間に狭まれるシート状の接着剤が、電気端子部に配置された導体回路の形状に勘合するように成形されていることを特徴とする請求項6に記載のプリント回路基板の接続方法である。   The invention described in claim 7 is characterized in that the sheet-like adhesive narrowed between the electric terminal portions is shaped so as to fit into the shape of the conductor circuit arranged in the electric terminal portions. The printed circuit board connection method according to claim 6.

本発明のプリント回路基板の接続構造によれば、プリント回路基板の電気端子部の導体回路において、はんだのリフロー工程やプリント回路基板の再加熱時に、はんだが導体回路から流出することで発生する隣接する導体回路との短絡を防止できる。したがって、プリント回路基板を接続する電気端子部の導体回路の間隔を狭くすることができ、これにより、電気端子部を小さくでき、機器内の高密度配線が可能となる。   According to the printed circuit board connection structure of the present invention, in the conductor circuit of the electrical terminal portion of the printed circuit board, the adjoining generated by the solder flowing out of the conductor circuit during the solder reflow process or the reheating of the printed circuit board. It is possible to prevent a short circuit with the conducting circuit. Therefore, it is possible to reduce the distance between the conductor circuits of the electric terminal portions to which the printed circuit board is connected, thereby reducing the electric terminal portions and enabling high-density wiring in the device.

また、本発明のプリント回路基板の接続方法によれば、電気端子部を接着する接着剤はシート状であることで容易に量産が可能であり、また、コネクタ接続やはんだ接続に比べ、材料費や加工費が低減される。また、接着時の加熱温度をはんだ付けの際の加熱温度よりも低く設定でき、回路基板の熱による損傷を防止できる。
また、近年では環境への影響を配慮して、鉛を含有しない鉛フリーはんだの使用が増加しているが、鉛フリーはんだはフローはんだ工程でステンレス鋼製のはんだ槽を損傷する問題もあり、通常はんだを全面的に置き換えるには至っていない。本発明は、はんだ自体を使用しないことから、プリント回路基板の接続部分の鉛フリー化にも有効である。
In addition, according to the printed circuit board connection method of the present invention, the adhesive for bonding the electric terminal portion can be easily mass-produced because it is in the form of a sheet, and the material cost compared to connector connection and solder connection. And processing costs are reduced. Moreover, the heating temperature at the time of adhesion can be set lower than the heating temperature at the time of soldering, and damage to the circuit board due to heat can be prevented.
Also, in recent years, the use of lead-free solder that does not contain lead has been increasing in consideration of the impact on the environment, but lead-free solder also has a problem of damaging the stainless steel solder bath in the flow soldering process, Usually, solder has not been completely replaced. Since the present invention does not use solder itself, the present invention is also effective for lead-free connection of printed circuit boards.

以下、本発明を詳しく説明する。
図1及び図2は、相対する2枚のプリント回路基板の電気端子部と電気端子部に狭まれる接着シートの関係の一例を示す図である。
プリント回路基板11及び12は、絶縁性の材料からなる絶縁基材上に、導電性の材料からなる導体回路がエッチング法等により形成され、それぞれの回路基板には、他の回路基板と接続する部分として電気端子部13及び14が設けられている。電気端子部13及び14の対向する面には、プリント回路基板11及び12から延伸された同一形状の導体回路15及び16形成されている。
The present invention will be described in detail below.
1 and 2 are diagrams illustrating an example of a relationship between an electric terminal portion of two printed circuit boards facing each other and an adhesive sheet narrowed by the electric terminal portion.
In the printed circuit boards 11 and 12, a conductive circuit made of a conductive material is formed on an insulating base made of an insulating material by an etching method or the like, and each circuit board is connected to another circuit board. Electrical terminal portions 13 and 14 are provided as parts. Conductor circuits 15 and 16 having the same shape extending from the printed circuit boards 11 and 12 are formed on the opposing surfaces of the electrical terminal portions 13 and 14.

2つの電気端子部13及び14の間に、熱可塑性樹脂もしくは熱硬化型樹脂からなる接着シート17が挟まれて配置されいる。この接着シート17は、均一な厚さで電気端子部13及び14の寸法に成形されたものである。また、接着シート17の代わりに、電気端子部14の表面に熱可塑性樹脂もしくは熱硬化型樹脂からなる接着剤を塗布し、接着材層を形成しても良い。
また、電気端子部13及び14と嵌合する形状に接着シート17を予め成形しておき、電気端子部13及び14の位置合わせを接着シート17を用いて行っても良い。
An adhesive sheet 17 made of a thermoplastic resin or a thermosetting resin is sandwiched between the two electric terminal portions 13 and 14. The adhesive sheet 17 is formed to have the uniform thickness and the dimensions of the electric terminal portions 13 and 14. Further, instead of the adhesive sheet 17, an adhesive layer may be formed by applying an adhesive made of a thermoplastic resin or a thermosetting resin to the surface of the electric terminal portion 14.
Alternatively, the adhesive sheet 17 may be previously formed in a shape that fits with the electric terminal portions 13 and 14, and the electric terminal portions 13 and 14 may be aligned using the adhesive sheet 17.

図3及び図4は、電気端子部13及び14を接合する接着シート17の関係を示す断面図である。
導体回路15及び16の断面は、電気端子部13及び14の対向する導体回路側の辺が絶縁基材側の辺よりも短い台形状である。また、導体回路15及び16の断面の形状は、対向する導体回路側に凸状の弧の形状であっても良い。断面が台形状である導体回路15及び16は、例えば、複数回のエッチングにより形成することができる。以下にその詳細を述べる。
まず、初回のエッチングで断面が長方形である通常の導体回路を形成する。さらに、初回のエッチングよりも導体回路を覆う面積が小さなマスキングをかけて再度エッチングを行う。これにより、導体回路の側面および側面と絶縁基板とは接触していない面との角部分が削られ、断面が台形状の導体回路が形成される。
電気端子部13及び14が受ける押力が、電気端子部13及び14の突起した部分である導体回路15及び16の面に集中して作用する。更に、導体回路15及び16の断面が、導体回路側に凸状の弧もしくは台形状であることにより、電気端子部13及び14の応力は更に小さな面積に集中して伝搬することで、接着シート17を分断することが可能になる。
3 and 4 are cross-sectional views showing the relationship of the adhesive sheet 17 that joins the electric terminal portions 13 and 14.
The cross sections of the conductor circuits 15 and 16 are trapezoidal in which the sides on the side of the conductor circuit facing the electrical terminal portions 13 and 14 are shorter than the sides on the insulating base material side. Moreover, the shape of the cross section of the conductor circuits 15 and 16 may be an arc shape convex toward the opposing conductor circuit side. The conductor circuits 15 and 16 having a trapezoidal cross section can be formed by a plurality of etchings, for example. Details are described below.
First, a normal conductor circuit having a rectangular cross section is formed by the first etching. Further, etching is performed again with masking that covers a smaller area than the first etching. As a result, the side surface of the conductor circuit and the corner portion between the side surface and the surface where the insulating substrate is not in contact are cut away, and a conductor circuit having a trapezoidal cross section is formed.
The pressing force received by the electric terminal portions 13 and 14 is concentrated on the surfaces of the conductor circuits 15 and 16 that are the protruding portions of the electric terminal portions 13 and 14. Further, since the cross sections of the conductor circuits 15 and 16 are convex arcs or trapezoids on the conductor circuit side, the stress of the electric terminal portions 13 and 14 is concentrated and propagated in a smaller area. 17 can be divided.

図5は、接着シートにより電気端子部を接着する概略の方法を示す図である。
接着シート17は、電気端子部13及び14に狭まれた位置に配置され、この状態で熱プレスにより加圧と同時に加熱される(図5−a)。加熱されて流動性を増した接着シート17は、加圧による押力で分断され、導体回路間の隙間18に流出する(図5―b)。隙間18は、流出した接着シート17の樹脂が充填され、樹脂は電気端子部13及び14の絶縁基材と接着することで、プリント回路基板11及び12が接着される(図5−c)。
FIG. 5 is a diagram illustrating a schematic method of bonding the electric terminal portion with an adhesive sheet.
The adhesive sheet 17 is disposed at a position narrowed by the electric terminal portions 13 and 14, and in this state, is heated simultaneously with the pressurization by the hot press (FIG. 5-a). The adhesive sheet 17 that has been heated and has increased fluidity is divided by the pressing force by pressurization and flows out into the gap 18 between the conductor circuits (FIG. 5B). The gap 18 is filled with the resin of the adhesive sheet 17 that has flowed out, and the printed circuit boards 11 and 12 are bonded to each other by bonding the resin to the insulating base material of the electric terminal portions 13 and 14 (FIG. 5-c).

以下に、本発明の実施例を示す。
幅10mm×長さ20mm×厚さ25μmのポリイミド製の絶縁基材上に、幅20μm×長さ15mm×厚さ35μmの銅製の導体回路が200μm間隔で20本並ぶ電気端子部を有するプリント回路基板を2枚用意した。10mm×20mmに成型した厚さ30μmの熱可塑性接着剤であるポリエチレン樹脂製の接着シートを、導体回路を有する面を対向させた電気端子部の間に挟み圧着させた。この状態で、電気端子部の外面に0.1MPaの押力をかけながら、120℃に加熱し2分間保持した後、室温まで冷却した。
このプリント回路基板は、幅10mm、厚さ120μmであり、従来のコネクタ加工やはんだ付けによるプリント回路基板の接続部と比較して、大幅に小型化されている。
Examples of the present invention are shown below.
A printed circuit board having an electrical terminal portion in which 20 copper conductor circuits of width 20 μm × length 15 mm × thickness 35 μm are arranged at intervals of 200 μm on an insulating base made of polyimide having a width of 10 mm × length of 20 mm × thickness of 25 μm. Two sheets were prepared. An adhesive sheet made of polyethylene resin, which is a thermoplastic adhesive having a thickness of 30 μm, molded to 10 mm × 20 mm was sandwiched between the electric terminal portions facing the surfaces having conductor circuits and pressed. In this state, while applying a pressing force of 0.1 MPa to the outer surface of the electric terminal portion, it was heated to 120 ° C. and held for 2 minutes, and then cooled to room temperature.
This printed circuit board has a width of 10 mm and a thickness of 120 μm, and is greatly reduced in size as compared with a connection part of a printed circuit board by conventional connector processing or soldering.

本発明のプリント回路基板の接続構造の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the connection structure of the printed circuit board of this invention. 本発明のプリント回路基板の接続構造の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the connection structure of the printed circuit board of this invention. 本発明のプリント回路基板の接続構造の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the connection structure of the printed circuit board of this invention. 本発明のプリント回路基板の接続構造の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the connection structure of the printed circuit board of this invention. (a)〜(c)本発明のプリント回路基板の接続方法になる各工程の一例を示す概略断面図である。(A)-(c) It is a schematic sectional drawing which shows an example of each process used as the connection method of the printed circuit board of this invention. 従来のコネクタにより接続されるプリント回路基板の接続部分の一例を示す概略構成図である。It is a schematic block diagram which shows an example of the connection part of the printed circuit board connected by the conventional connector. 従来のはんだ付けによるプリント基板回路の接続部分の一例を示す概略構成図である。It is a schematic block diagram which shows an example of the connection part of the printed circuit board circuit by the conventional soldering.

符号の説明Explanation of symbols

11,12・・・回路基板、13,14・・・電気端子部、15,16・・・導体回路、17・・・接着シート
DESCRIPTION OF SYMBOLS 11,12 ... Circuit board, 13, 14 ... Electrical terminal part, 15, 16 ... Conductor circuit, 17 ... Adhesive sheet

Claims (7)

絶縁基材上に複数の導体回路が形成され、他の回路基板と電気的に接続するための複数の導体回路が露出した電気端子部を備えるプリント回路基板の接続構造において、
前記プリント回路基板の相対する電気端子部に接着剤を狭み、電気端子部同士を接続することを特徴とするプリント回路基板の接続構造。
In the connection structure of the printed circuit board including the electrical terminal portion in which the plurality of conductor circuits are formed on the insulating base material and the plurality of conductor circuits for electrical connection with other circuit boards are exposed,
A printed circuit board connection structure characterized in that an adhesive is narrowed between opposing electric terminal portions of the printed circuit board and the electric terminal portions are connected to each other.
少なくとも一方の前記プリント回路基板の電気端子部の導体回路は、該導体回路の断面が相対する導体回路側に凸状であることを特徴とする請求項1のプリント回路基板の接続構造。 2. The printed circuit board connection structure according to claim 1, wherein the conductor circuit of the electric terminal portion of at least one of the printed circuit boards has a convex shape on the side of the conductor circuit facing the conductor circuit. 少なくとも一方の前記プリント回路基板の電気端子部の導体回路は、該導体回路の断面が相対する導体回路側の辺が絶縁基材側の辺よりも短い台形状であることを特徴とする請求項1のプリント回路基板の接続構造。 The conductor circuit of the electrical terminal portion of at least one of the printed circuit boards has a trapezoidal shape in which a side of the conductor circuit on which the cross section of the conductor circuit is opposed is shorter than a side on the insulating substrate side. 1 is a printed circuit board connection structure. 一方の前記プリント回路基板の電気端子部の絶縁材表面と他方のプリント回路基板の前記電気端子部の絶縁材表面に狭まれる接着剤は、両絶縁基材表面を接着していることを特徴とする請求項1ないし3に記載のプリント回路基板の接続構造。 The adhesive that is narrowed between the insulating material surface of the electrical terminal portion of one of the printed circuit boards and the insulating material surface of the electrical terminal portion of the other printed circuit board bonds the surfaces of both insulating substrates. The printed circuit board connection structure according to claim 1. 前記接着剤は、熱可塑性または熱硬化性樹脂であることを特徴とする請求項1ないし4に記載のプリント回路基板の接続構造。 The printed circuit board connection structure according to claim 1, wherein the adhesive is a thermoplastic or thermosetting resin. 絶縁基材上に複数の導体回路が形成され、他の回路基板と電気的に接続するための複数の導体回路が露出した電気端子部を備えるプリント回路基板の接続方法において、
前記一方の電気端子部と相対する他方の電気端子部間にシート状の接着剤を狭み、その後、前記接着剤を硬化することにより電気端子部を接合することを特徴とするプリント回路基板の接続方法。
In the connection method of the printed circuit board including a plurality of conductor circuits formed on the insulating base material and having an electric terminal portion exposed to be electrically connected to another circuit board,
A printed circuit board characterized in that a sheet-like adhesive is narrowed between the other electrical terminal portions facing the one electrical terminal portion, and then the electrical terminal portions are joined by curing the adhesive. Connection method.
電気端子部間に狭まれるシート状の接着剤が、電気端子部に配置された導体回路の形状に勘合するように成形されることを特徴とする請求項6に記載のプリント回路基板の接続方法。
7. The printed circuit board connection according to claim 6, wherein a sheet-like adhesive narrowed between the electric terminal portions is molded so as to fit into a shape of a conductor circuit arranged in the electric terminal portion. Method.
JP2004027988A 2004-02-04 2004-02-04 Connection structure of printed circuit board and connection method of printed circuit board Pending JP2005222770A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020102887A (en) * 2016-05-10 2020-07-02 カイメタ コーポレイション Assembling method of aperture segment of cylindrical feed antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020102887A (en) * 2016-05-10 2020-07-02 カイメタ コーポレイション Assembling method of aperture segment of cylindrical feed antenna

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