CN109375400B - Novel optical heater and preparation method thereof - Google Patents
Novel optical heater and preparation method thereof Download PDFInfo
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- CN109375400B CN109375400B CN201811187698.7A CN201811187698A CN109375400B CN 109375400 B CN109375400 B CN 109375400B CN 201811187698 A CN201811187698 A CN 201811187698A CN 109375400 B CN109375400 B CN 109375400B
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- type low
- conductive copper
- temperature
- temperature curing
- adhesive
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Surface Heating Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Liquid Crystal (AREA)
- Resistance Heating (AREA)
Abstract
The invention discloses a novel optical heater and a preparation method thereof, wherein the novel optical heater comprises ITO conductive glass, and two opposite sides of the ITO conductive glass are respectively provided with an electrode strip mechanism; the electrode strip mechanism comprises A-type low-temperature cured conductive copper adhesive, B-type low-temperature cured conductive copper adhesive and a tin-plated white copper sheet which are fixed on the surface of the ITO conductive glass from bottom to top; the problem of traditional electrode strip required temperature when solidifying higher, make heating glass's coating film layer change easily, lead to the square resistance value skew, square resistance value grow for heater glass's heating power reduces, and the effect of the not enough anticipatory design of heating effect, simultaneously, the skew condition of square resistance value does not have effectual linear law to predict, seriously influences the reliable quality of product is solved.
Description
Technical Field
The invention relates to the field of liquid crystal displays, in particular to a novel optical heater and a preparation method thereof.
Background
At present, a liquid crystal display occupies most of the market of the display industry, and the liquid crystal display is an electronic display terminal product and mainly comprises a liquid crystal panel, a backlight, a structural member, a circuit control panel and the like. Liquid crystal display is a passive display technology, and needs to realize selective transmission and color realization of a backlight source by controlling the deflection direction of liquid crystal molecules in a box. The crystallization point of the liquid crystal molecules is about-45 ℃, and the deflection rate of the liquid crystal molecules is obviously reduced at a low temperature of-20 ℃ or lower, so that the switching of the display picture is slowed, and therefore, in the display field, the quality of the display picture is generally maintained by increasing a heating device and heating the liquid crystal at a low temperature.
The traditional LCD heater is mainly characterized in that a layer of ITO conductive oxide layer is plated on optical white glass, then a power supply is connected through 2 or more than 2 electrodes, the opening and closing of the heating electrodes are controlled by a program of a circuit control board to realize heating at a low temperature, and meanwhile, a temperature sensor is used for monitoring the current temperature value in real time. Because the ITO conductive oxide layer itself cannot be used for operations such as wire bonding, the conventional method at present is to coat 1 electrode strip with a certain width on each of 2 sides of glass with conductive silver paste, cure the electrode strips through high-temperature sintering, and then perform the operation of wire bonding on the electrode strips, so as to achieve the extraction of the heating electrodes. As a key material for manufacturing an optical heater, the conductive silver paste must satisfy the following characteristics: 1. can be reliably adhered to the ITO conductive oxide layer, 2, the resistivity of the ITO conductive oxide layer is very small, and 3, the ITO conductive oxide layer can be welded.
The ITO coating layer is usually coated by magnetron sputtering or vacuum evaporation, and the surface temperature of the glass is generally below 200 ℃ in the coating process; in the process of manufacturing the electrode strip, the electrode strip can be subjected to a higher temperature, so that a film coating layer of the electrode strip is easy to change, the square resistance value is deviated, the square resistance value is increased under common conditions, the visual influence is that the heating power of the whole heater glass is reduced, the heating effect is insufficient for the effect of the expected design, meanwhile, the deviation condition of the square resistance value is not effectively predicted in a linear rule, and the quality reliability of a product is seriously influenced.
Disclosure of Invention
The invention aims to provide a novel optical heater and a preparation method thereof, and solves the problems that the traditional electrode strip needs higher temperature during curing, a film coating layer of heating glass is easy to change, the square resistance value is deviated, the square resistance value is increased, the heating power of the heating glass is reduced, the heating effect is insufficient for the effect of the expected design, and meanwhile, the deviation condition of the square resistance value is not effectively predicted by a linear rule, so that the quality reliability of a product is seriously influenced.
In order to achieve the purpose, the invention provides a novel optical heater, which comprises ITO conductive glass, wherein two opposite sides of the ITO conductive glass are respectively provided with an electrode strip mechanism;
the electrode strip mechanism comprises A-type low-temperature cured conductive copper adhesive, B-type low-temperature cured conductive copper adhesive and a tin-plated white copper sheet which are fixed on the surface of the ITO conductive glass from bottom to top; the grade of the A-type low-temperature curing conductive copper adhesive is SW180, and the grade of the B-type low-temperature curing conductive copper adhesive is AE 8006.
Preferably, the metal filling rate in the A-type low-temperature curing conductive copper paste is 89-91%.
Preferably, the metal filling rate in the B-type low-temperature curing conductive copper adhesive is 85-87%.
Preferably, the ITO conductive glass is of a rectangular structure, and the electrode strip mechanism is arranged along the long edge direction of the ITO conductive glass.
Preferably, the volume resistivity of the A-type low-temperature curing conductive copper paste is 1 x 10-6—9×10-6。
Preferably, the volume resistivity of the B-type low-temperature curing conductive copper paste is 1 x 10-6—9×10-6。
The invention also provides a preparation method of the novel optical heater, which comprises the following steps:
1) coating A-type low-temperature curing conductive copper adhesive on two sides of the ITO conductive glass respectively, heating at 140-180 ℃, and stopping heating until the thickness naturally shrinks by 30%;
2) coating B-type low-temperature curing conductive copper adhesive on the surface of the A-type low-temperature curing conductive copper adhesive, pressing and embedding the tin-plated white copper sheet into the B-type low-temperature curing conductive copper adhesive, heating at 140-180 ℃, and stopping heating until the thickness of the B-type low-temperature curing conductive copper adhesive naturally shrinks by 30%, thereby obtaining an electrode bar mechanism;
3) and carrying out welding lead operation on the electrode strip mechanism.
Preferably, the volume resistivity of the A-type low-temperature curing conductive copper paste is 1 x 10-6—9×10-6。
Preferably, the volume resistivity of the B-type low-temperature curing conductive copper paste is 1 x 10-6—9×10-6。
According to the technical scheme, the invention provides a novel optical heater and a preparation method thereof, wherein the novel optical heater comprises ITO conductive glass, and two opposite sides of the ITO conductive glass are respectively provided with an electrode strip mechanism; the electrode strip mechanism comprises A-type low-temperature cured conductive copper adhesive, B-type low-temperature cured conductive copper adhesive and a tin-plated white copper sheet which are fixed on the surface of the ITO conductive glass from bottom to top; the grade of the A-type low-temperature curing conductive copper adhesive is SW180, and the grade of the B-type low-temperature curing conductive copper adhesive is AE 8006. The A-type low-temperature cured conductive copper adhesive can be reliably attached to the ITO film layer; the B-type low-temperature cured conductive copper adhesive can be reliably attached to the cured layer of the A-type low-temperature cured conductive copper adhesive; the biggest difficulty of the low-temperature curing conductive material is that the conductive material is difficult to bear the welding high temperature of an electric soldering iron after being cured; generally, the soldering temperature of tin-lead soldering tin is controlled to be 270-280 ℃, and at the temperature, a low-temperature curing type conductive material is melted, so that the tin can not be applied and soldering can not be performed in a visual expression. The key point of the invention is that between the low-temperature curing conductive copper adhesive and the soldering tin, the B-type low-temperature curing conductive copper adhesive is used for bonding a tin-plated white copper sheet, the metal material can resist high temperature, and meanwhile, the tin-plating layer on the surface of the white copper sheet has excellent tin-plating performance, and the soldering operation is simple and easy to implement; the conductive copper adhesive and the tin-plated cupronickel sheet have strong adhesive force after being cured and good environmental adaptability, and meanwhile, the curing temperature in the electrode manufacturing process is reduced from 230 ℃ to (140-180 ℃), so that square resistance value deviation of an ITO film coating layer caused by high temperature is avoided to a great extent; the method reduces the reject ratio in the process, saves the material cost, and improves the reliability and consistency of the product.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a structural view of a novel optical heater provided by the present invention.
Description of the reference numerals
1-ITO conductive glass 2-A type low-temperature curing conductive copper adhesive
3-B type low-temperature curing conductive copper adhesive 4-tinned cupronickel sheet
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, an orientation word such as "bottom-up" or the like included in a term merely represents an orientation of the term in a conventional use state or a colloquial meaning understood by those skilled in the art, and should not be construed as limiting the term. The A-type low-temperature curing conductive copper adhesive with the brand name SW180 and the B-type low-temperature curing conductive copper adhesive with the brand name AE8006 are both commercially available products provided by Shanghai Yuxing electronics Co.
As shown in fig. 1: the invention provides a novel optical heater, which comprises ITO conductive glass 1, wherein electrode strip mechanisms are respectively arranged on two opposite sides of the ITO conductive glass 1; the electrode strip mechanism comprises an A-type low-temperature cured conductive copper adhesive 2, a B-type low-temperature cured conductive copper adhesive 3 and a tinned white copper sheet 4 which are fixed on the surface of the ITO conductive glass 1 from bottom to top; the grade of the A-type low-temperature curing conductive copper adhesive 2 is SW180, and the grade of the B-type low-temperature curing conductive copper adhesive 3 is AE 8006. The A-type low-temperature cured conductive copper adhesive can be reliably attached to the ITO film layer; the B-type low-temperature cured conductive copper adhesive can be reliably attached to the cured layer of the A-type low-temperature cured conductive copper adhesive; the biggest difficulty of the low-temperature curing conductive material is that the conductive material is difficult to bear the welding high temperature of an electric soldering iron after being cured; generally, the soldering temperature of tin-lead soldering tin is controlled to be 270-280 ℃, and at the temperature, a low-temperature curing type conductive material is melted, so that the tin can not be applied and soldering can not be performed in a visual expression. The key point of the invention is that between the low-temperature curing conductive copper adhesive and the soldering tin, the B-type low-temperature curing conductive copper adhesive is used for bonding a tin-plated white copper sheet, the metal material can resist high temperature, and meanwhile, the tin-plating layer on the surface of the white copper sheet has excellent tin-plating performance, and the soldering operation is simple and easy to implement; the conductive copper adhesive and the tin-plated cupronickel sheet have strong adhesive force after being cured and good environmental adaptability, and meanwhile, the curing temperature in the electrode manufacturing process is reduced from 230 ℃ to (140-180 ℃), so that square resistance value deviation of an ITO film coating layer caused by high temperature is avoided to a great extent; the method reduces the reject ratio in the process, saves the material cost, and improves the reliability and consistency of the product.
In a preferred embodiment of the present invention, in order to ensure the low resistivity of the type a low-temperature-curing conductive copper, the metal filling rate in the type a low-temperature-curing conductive copper paste 2 is 89 to 91%.
In a preferred embodiment of the invention, in order to ensure the proportion of the epoxy resin in the B-type low-temperature cured conductive copper paste and improve the adhesive force thereof so as to achieve the purpose of adhering the tin-plated copper white sheet, the metal filling rate in the B-type low-temperature cured conductive copper paste 3 is 85-87%.
In a preferred embodiment of the present invention, the ITO conductive glass 1 has a rectangular structure, and the electrode bar mechanism is disposed along a long side direction of the ITO conductive glass 1.
In a preferred embodiment of the present invention, the volume resistivity of the type a low temperature curing conductive copper paste 2 is 1 × 10-6—9×10-6Ω·m。
In a preferred embodiment of the present invention, the volume resistivity of the B-type low-temperature-curing conductive copper paste 3 is 1 × 10-6—9×10-6Ω·m。
The invention also provides a preparation method of the novel optical heater, which comprises the following steps:
1. coating A-type low-temperature curing conductive copper adhesive 2 on two sides of the ITO conductive glass 1 respectively, heating at 140-180 ℃, and stopping heating until the thickness naturally shrinks by 30%;
2. coating the B-type low-temperature curing conductive copper adhesive 3 on the surface of the A-type low-temperature curing conductive copper adhesive 2, pressing and embedding the tin-plated white copper sheet 4 into the B-type low-temperature curing conductive copper adhesive 3, heating at 140-180 ℃, and stopping heating until the thickness of the B-type low-temperature curing conductive copper adhesive 3 naturally shrinks by 30%, thereby obtaining an electrode bar mechanism;
3. and carrying out welding lead operation on the electrode strip mechanism.
In bookIn a preferred embodiment of the invention, the volume resistivity of the type a low-temperature curing conductive copper paste 2 is 1 × 10-6—9×10-6Ω·m。
In a preferred embodiment of the present invention, the volume resistivity of the B-type low-temperature-curing conductive copper paste 3 is 1 × 10-6—9×10-6Ω·m。
Table 1 below shows the breaking tension values of 20 pads on the new optical heater.
TABLE 1
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (7)
1. The novel optical heater is characterized by comprising ITO conductive glass (1), wherein two opposite sides of the ITO conductive glass (1) are respectively provided with an electrode strip mechanism;
the electrode strip mechanism comprises an A-type low-temperature cured conductive copper adhesive (2), a B-type low-temperature cured conductive copper adhesive (3) and a tin-plated white copper sheet (4) which are fixed on the surface of the ITO conductive glass (1) from bottom to top; wherein, the metal filling rate in the A-type low-temperature curing conductive copper adhesive (2) is 89-91%, and the metal filling rate in the B-type low-temperature curing conductive copper adhesive (3) is 85-87%.
2. The novel optical heater according to claim 1, characterized in that the ITO conductive glass (1) has a rectangular structure, and the electrode strip mechanism is arranged along the long side direction of the ITO conductive glass (1).
3. The new optical heater as claimed in claim 1, characterised in that the volume resistivity of said type a low temperature curing conductive copper paste (2) is 1 x 10-6—9×10-6Ω·m。
4. The new optical heater according to claim 1, characterized in that the volume resistivity of the B-type low temperature cured conductive copper paste (3) is 1 x 10-6—9×10-6Ω·m。
5. A preparation method of a novel optical heater is characterized by comprising the following steps:
1) coating A-type low-temperature curing conductive copper adhesive (2) on two sides of the ITO conductive glass (1), heating at 140-180 ℃, and stopping heating until the thickness naturally shrinks by 30%;
2) coating the B-type low-temperature curing conductive copper adhesive (3) on the surface of the A-type low-temperature curing conductive copper adhesive (2), pressing and embedding the tin-plated white copper sheet (4) into the B-type low-temperature curing conductive copper adhesive (3), heating at 140-180 ℃, and stopping heating until the thickness of the B-type low-temperature curing conductive copper adhesive (3) naturally shrinks by 30%, thereby obtaining an electrode bar mechanism;
3) welding a lead wire on the electrode strip mechanism;
the metal filling rate in the A-type low-temperature curing conductive copper adhesive (2) is 89-91%, and the metal filling rate in the B-type low-temperature curing conductive copper adhesive (3) is 85-87%.
6. The method according to claim 5, wherein the volume resistivity of the type A low-temperature-curing conductive copper paste (2) is 1 x 10-6—9×10-6Ω·m。
7. The method according to claim 5, wherein the volume resistivity of the B-type low-temperature-curing conductive copper paste (3) is 1 x 10-6—9×10-6Ω·m。
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| CN201811187698.7A CN109375400B (en) | 2018-10-12 | 2018-10-12 | Novel optical heater and preparation method thereof |
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| CN201811187698.7A CN109375400B (en) | 2018-10-12 | 2018-10-12 | Novel optical heater and preparation method thereof |
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| CN109375400B true CN109375400B (en) | 2021-09-21 |
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