200945213 六、發明說明： 【發明所屬之技術領域】 本發明疋關於一種非接觸式智慧卡或標籤用天線的製 造方法以及非接觸式智慧卡或標翻天線，該非接觸式智慧 卡以或該標籤用天賴如是驗定期券、信时、進出入管 制1C卡’以及1C標籤等。 【先前技術】 在非接觸式智慧卡或標籤（以下，將以「智慧卡」作為 代表進行·)的内部層積有賴天線_ ant_)，此線 圈天線是用非彳細的方式與外部裝置做非觸式的信號傳 輸。此線圈天線是層積於智慧卡的基材上，例如是經由以下 的私序所製成.制貼有銅金制基材，並對此基材進雜 刻(etching) ’以於智慧卡的其中一面或兩面上形成線圈。呈 體的說’ S利用網版印刷與凹版印刷，而將光阻劑印刷在具. 有銅箔或滅的_(版)上，天賴層(ant_pattem) 以外的部份侧溶解去除，以形成非接觸式智慧卡用 回路。 、請參閱_ 5 ’其步驟⑻至步驟⑴依序繪示出藉由移除法 以於基材的兩φ上形成回路的製造流程。在此，移除法 (subtractive method)是指使用微影(ph〇t〇lkh〇卿屻盥侧技 術的製造方法。步驟⑻所示為黏著層的成形製程，其是於絕 緣性的基材的兩面上塗佈黏著劑以形成黏著層。步驟⑼所示 糊箱層的成形製程，其是於基材的兩面之黏著層上貼附銅 泊。步驟⑷所示為開洞的製程，其是於其中—面料外一面 200945213 製程，處開設洞穴。步驟(d)所示為銅的電解電錢 銅，以使^ ^進行躺電解，並於敢_壁鑛上 而相互i通=另外:面_藉由洞穴内壁上的銅 豆-热士 e)所示為乾膜咖mm)光阻的成形製程， 程程全=光步:,(，為曝光製 ❹ ❹ Μ)所4於兩社齡絕緣性賴膜。上述之 、$例如被揭露於日本專利特開平1〇_19細巾。 ητ 之开^ί由上述之移除法’於一般的_圖案_咖） 致^太ήΐ」下的面積只有絲之材料面積的ig%以下，導 特別是，當使用的材料 :： 入成本特別高，這更成為成本增高的 广， 的薄膜便㈣，但在作鹽：、 且π=乍熱處理，這會導致相闕費用的產生。而 使用二或附軸的薄臈，皆須對 3力刻液4產業廢棄物進行處理，這都會導致成本 另一方面，日本專利特開平ί(Μ9385 (additive method)，其是利用導"路’小、〇/ 接觸式智慧卡用天線圖案师啦行非 —般是使用銀導電穋（硬化溫度_。(^^=的 “格較局。此外’銀導電耀具有較低的曲折性並易於^生破 5 200945213200945213 VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a contactless smart card or tag antenna, and a contactless smart card or a flip antenna, the contactless smart card or the tag Use Tian Lai as a time stamp, letter, entry and exit control 1C card, and 1C label. [Prior Art] The internal stratification of a contactless smart card or tag (hereinafter, "smart card" is used as a representative) depends on the antenna _ ant_), which is made in a non-transparent manner with an external device. Non-contact signal transmission. The coil antenna is laminated on a substrate of a smart card, for example, by the following private sequence. A copper-gold substrate is attached, and the substrate is etched for smart cards. A coil is formed on one or both sides. It is said that 'S uses screen printing and gravure printing, and the photoresist is printed on the _ (plate) with copper foil or extinction, and the side of the outer layer (ant_pattem) is dissolved and removed. Form a loop for the contactless smart card. Referring to _ 5 ', the steps (8) to (1) sequentially depict the manufacturing process for forming a loop on the two φ of the substrate by the removal method. Here, the subtractive method refers to a manufacturing method using lithography (the ph〇t〇lkh〇 屻盥 屻盥 side technology). The step (8) shows a forming process of the adhesive layer, which is an insulating substrate. Applying an adhesive on both sides to form an adhesive layer. The forming process of the paste layer shown in step (9) is to attach copper to the adhesive layer on both sides of the substrate. Step (4) shows a process of opening the hole, It is in which - the outer surface of the fabric is 200945213, and the cave is opened. The step (d) shows the electrolytic copper of copper, so that the electrolysis of the copper is carried out, and the electrolysis is carried out on the wall. Surface _ by the copper bean on the inner wall of the cave - hots e) is shown as a dry film coffee mm) photoresist forming process, Cheng Chengquan = light step:, (for exposure system ❹ Μ) 4 in two Insulation insulation film. The above, for example, is disclosed in Japanese Patent Laid-Open No. 1-19. The opening of ητ ^ί by the above-mentioned removal method 'in general _ pattern _ coffee) to ^ ήΐ ήΐ 的 的 的 的 ήΐ ήΐ ήΐ ήΐ 下 面积 面积 面积 面积 ig ig ig ig ig ig 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下 下It is particularly high, which is a wide-ranging film with a high cost. (4), but it is made into a salt: and π = 乍 heat treatment, which will lead to the cost of the opposite. The use of two or the shaft of the thin shaft, must deal with the 3 force engraving 4 industrial waste, which will lead to cost. On the other hand, the Japanese patent special open ί (Μ9385 (additive method), which is the use of guides " Road 'small, 〇 / contact smart card with antenna pattern designer is not the general use of silver conductive 穋 (hardening temperature _. (^^= "compared to the game. In addition, 'silver conductive yoke has lower tortuosity And easy to be born and broken 5 200945213
裂，較難使用於薄膜天線(film antenna)。而且，在進行晶片 的封裝時也須多加注意。 B 【發明内容】 ,為_了解決上述之問題，本發明的目的在於提供一種適於 製作薄膜天線的非接觸式智慧卡或標籤駐、線的製造方 去’以及由此製造方法製作㈣非接觸式智慧卡或標鐵用天 線。相較於移除法，此製造方法_印刷與錢金峨術，故 具有低價格與減輕環境負荷的缺點。 根據上述目的與其他目的，本發明提供—種非接觸式智 j = _天線的製造方法。首先，在智慧卡或標籤的絕 π二材上進行銅基樹脂膠的圖案_，以形成第—銅基樹 j層。再來，於第—銅基樹轉層讀上銅或鎳，以形成 絕肺2。之後’關案印刷的方式，於具有第—鑛層的 ^ &才上形成絕緣性樹脂膠層，且於第-鑛層上的部份 =緣性樹脂膠層上以開口的方式形成導電部。然後 以網版 印刷的方式’於具有絕緣性樹脂膠層的絕 上銅或鎳以形成-第二鑛層。#现树祕層上鍍 慧卡述目的與其他目的，本發明提供一種非接觸式智 :绝:不裁用天、線，其包括：第—銅基樹月旨膠層、第—命屌 ίΪ ΐ轉層^銅細晴、第二鑛層與絕^保 ^ ' 銅基樹月曰谬層是以圖案印刷銅基樹脂膠的方十、 而形成於智慧卡或標籤的絕緣性基材上U層二二 200945213 第-銅基樹脂膠層上鍍上銅或録而 以圖案印刷絕_卿的 層疋 緣性基材上。而且，於第 =具有卜鑛層的絕 上形成開口，以作為導通邻1 且份絕緣性樹脂膠層 刷概鮮伽：ί 弟二銅基樹脂膠層是以圖宰印 刷銅基日_方式，㈣成於具有 f茶Ρ 性基材上，此第二銅細脂膠層可“ 緣Cracking is more difficult to use in film antennas. Also, care must be taken when packaging the wafer. B. SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a non-contact smart card or a tag holder for a film antenna, and a manufacturing method for the wire, and the manufacturing method (4) Contact smart card or standard antenna. Compared with the removal method, this manufacturing method_printing and money-selling has the disadvantage of low price and reduced environmental load. In accordance with the above and other objects, the present invention provides a method of manufacturing a non-contact smart j = _ antenna. First, a pattern of copper-based resin paste is applied to the π-material of the smart card or the label to form a first copper-based layer j layer. Then, copper or nickel is read on the first copper-base tree layer to form a lung. Then, in the method of 'closing the printing, an insulating resin adhesive layer is formed on the ^& which has the first-mine layer, and the conductive layer is formed in an open manner on the portion of the first-mine layer. unit. Then, in a screen printing manner, the copper or nickel having an insulating resin layer is formed to form a second layer. The purpose of the present invention is to provide a non-contact type of wisdom: absolutely: not to use the sky, the line, including: the first - copper base tree month glue layer, the first - 屌 屌 Ϊ ΐ 层 layer ^ copper fine, the second layer and the ^ ^ ^ ^ copper base tree layer is printed on the insulating substrate of the smart card or label by the pattern of copper-based resin glue Layer 22, 200945213 The copper-based resin layer is plated with copper or recorded on a layer of enamel substrate. Moreover, an opening is formed in the first layer having the ore layer to serve as a conductive neighboring layer 1 and a portion of the insulating resin layer brush is used for the glaze: (4) formed on a substrate having f tea, the second copper fine grease layer can be "edge"
方式而形成。絕緣性保護膜是形成於絕緣性基的 鍍層的一側上。 ％,丞何上罪近第二 本發明的雜料妓核標_ · 於是利用印刷、化學技術，故相較; ϊ，其價格較便宜，且對環境所產生的影響除 =明的非接觸式智慧卡或標籤用天線更適於作為薄膜天 下 ，-、fx明之上述目的、特徵和優點更能明顯易僅， 文將以實施例並配合所附圖示，作詳細說明如下。 【實施方式】 實施例 圖1A至目1C尋^為本發明之非接赋智慧卡的 構成’圖1A所缘不為其平面圖，圖1B所緣示為圖认 A-A線剖面圖’圖lc所繪示為圖1A中的B七線剖面圖。 在此1C%慧卡1的尺寸大小（橫長：85 6mm;綜寬：5如^. 厚度.7±〇.〇8mm)是依據日本工業規格所制定地。忆智議 卡1包括-基板’此基板具有由PET構成且呈薄膜狀的^ 7 200945213 材2 ’此基材2的其中一面具有呈環狀之第一層的天線部3， 在此天線部3的上方則具有第二層的天線部5，在天線部3 與天線部5間則具有—絕緣層4。上述之天線部3與天線部 5共同形成階層構造的線圈天線，在此線圈天線的二端則藉‘ 由覆曰曰封裝而連接固定有一 jc 6。此外，元件符號7是指第 一層的天線部3與第二層的天線部5間之導通部。而且，在 此基板上，層積有與絕緣層4相同材質的表面蓋（圖未示）， 此表面蓋是用以密封IC6。因此，IC智慧卡i是經由線圈天 線而與外部襞置間進行通信。 請參閱圖2A至圖2F，其依序繪示出實施例！之非接觸 式智慧卡或標籤用天線的製造流程。以下，將以「智慧卡」 作為代表進行說明。圖2A所繪示為銅樹脂圖案的印刷製程， 其疋以網版印刷的方式且於常溫的狀態下在智慧卡的絕緣 性基材11上進行銅基樹脂膠(resin paste)的圖案印刷，之後再 進行硬化，以形成厚度1〇μπι左右的銅基樹脂膠層12 (第一 銅基樹脂膠層）。銅基樹脂膠可在10(rc左右進行硬化。絕緣 性基材11的材質例如為聚對苯二甲酸乙二酯(p〇lyethylene terephthalate，簡稱 PET)、聚萘二甲酸乙二醇酯（p〇lye%iene naphthalate，簡稱 PEN )、與聚酿亞胺(p〇iyimide，簡稱 pi)等。 以PET為例，厚度為38μπι或50μιη。在此，銅基樹脂膠是 指在樹脂中添加銅粉末，在此樹脂例如是指聚烯烴(p〇ly〇lefm) 樹月曰、丙坤酸(acrylic)樹脂、或紛類(phenol)樹脂。 此外，還有許多種的材質可作為絕緣性基材u，例如： 環氧玻璃(glass epoxy)基材、玻璃基材（例如：石英、石夕材）、 陶瓷基板（例如：氧化鋁、氮化鋁、氮化矽、氧化懿）等。 8 200945213 基樹月，2 的智慧卡等相關領域。此外，銅 i脂二有=可以為鍍銅的粉末。相較於銀樹脂膠，銅基 細曰膠具有較向的緊密性與柔軟性。 (由= 其是於銅基樹脂膠層12 (第m 成）鑛上銅或錄，以形成—錢層13 Ο 行，賴^二3ΓΓ是在溫度4°〜贼的溫度下進 触且右= 帅。此外，並不限於只鍵銅，本 制;匕者也可同時鑛上鋼及錦。另外，也不限於 便用化子錢，也可使用電錄的方式。 圄4二示為絕緣層印刷的製程，其是以網版印刷等 ==於具有鍍層13的絕緣性基材"上形成絕 緣1·生树月曰膠層14，且於鑛層13上 此開恤約一=:= 脂或紫外線硬化樹脂，其例如為丙稀酸系、 μ糸或_緖脂，或者其也可為上述的混合物。 缘性=二:t為銅樹脂圖案的印刷製程’其是於具有絕 、=:層14的絕緣性基材u上形成 ^銅基樹脂膠層）。此鋼基樹脂膠層15的 =?程相似’皆是利用網版印刷的方式進_^ 3圖案印刷，其材料與厚度與銅基樹脂膠層12相當= 銅基树脂膠層15可經由開口而與 u相導通。 上化學翻餘，其是賴_旨膠層15 ，又銅或鎳以形成一錢層16 (第二鑛層）。此鑛層】6的製 9 200945213 作方式與圖2B所的製程她，其材料與厚度與鍍層i3相 t ° 、又曰 圖2F所繪示為保護膜印刷的製程，其是於絕緣性基材 U上靠近鑛層16的-側上形成絕緣性傾膜17。此絕緣性 保護膜17可使用與絕緣性樹脂膠層14(由圖％的製程所形 成）相同的材料。此’絕雜保_ 17的厚度約為⑴卿，並 用以保護且密封電路。 由於鍍層13與銅基樹脂膠層15間的絕緣性樹脂膠層μ ，厚度約只有I。，，故鑛層13與銅基樹脂膠層15二電 ❹ 較大。由下述的公式(1)可知，在所設定的共振頻率^下， 當電容C愈大，電感L便愈小’電路長（即線路的長度）也 愈短。因此’藉由實施例1所製作的非接觸式智慧卡用天線， 其具有線路的長度較短的優點。 f = l/(2nVLC) ⑴ 此外’相較於習知的具有銅_薄膜（此薄膜的材質例 如為PET) ’藉由實施例！所製作的非接觸式智慧卡用天線 具有較低的電阻，且在表面處理上也較為料。而且，銅基 ❹ 樹脂膠層可藉由鋪而得到湘，較不易產生 = 於作為薄臈天線。 更過 而且’實施例！所示之非接觸式智慧卡用天線的製造方 ^可在低溫下進行加工。而且，相較於習知的移除法，所 :的廢液處理程序也大幅減少。另外，材料也可1〇〇%得到 *用，且可在大氣中（不需氮氣）進行加工。 只靶例1所示之非接觸式智慧卡用天線的製造方法及非 10 200945213 接觸式智慧卡肤_具打義優點。她於習知的移除 法（即使用微影與餘刻技術），其價格較便宜。此外，印 化學鑛或電錢等技術對環境所產生的影響也較小。在必要的 情況下’也可與已發展良久的捲軸式㈣i-t〇顿)印刷技術搭 配使用，從而大幅縮短工程並降低成本。 實施例2 / 在下述之各®巾’與上狀_同或她的元件將桿以 ❹ 相_元件符號’且不騎其作詳細制。請參賴3，圖 3所繪示為本發明之實_ 2的非接觸式智慧卡的剖面圖: 智計的絕雜紐U的材_如為料笨二甲酸乙二酿 或丙烯酸。在本實施例中，可使用網版印刷的方式圖案印^ 銅基樹脂膠（與實施例1相同）於絕緣性基材11上，以形成 銅基樹脂^層12。此外，在銅基樹脂膠層12上鑛上銅或鎳， 以^成與實施例1相同的鑛層13。而且，可在絕緣性基材u 上罪近鑛層16 6勺-側形成絕緣性保護膜17。藉由上述之方 _ 式，可形成單層的非接觸式智慧卡用天線。 實施例3 明ί閲圖4A至圖4E，其依序緣示出實施例3之非接觸 式备慧卡或標籤用天線的製造流程。以下，將以「智犛、卡」 作，代表進行說明。圖4Α所繪示為開設洞穴的製程二其例 如疋在厚度5〇μηι且由聚對苯二甲酸乙二酯所構成的絕緣性 ，材11上開設一穿孔21，以作為導通部，此穿孔21的直徑 約為0.1mm。圖4Β所繪示為銅樹脂圖案的印刷製程，其是 以網版印刷的方式且於常溫的狀態下在具有穿孔21的絕緣 200945213 性基材11上進行銅基樹脂膠的圖案印刷。藉由直办 術，可將銅基樹脂膠吸入至穿孔21 a。此 基樹脂膠從穿孔21滴落，可在絕緣性基材u的另—面設 防止銅基樹麟滴落祕伽。讀，將銅細轉進^ =以於穿孔21與絕緣性基材η上形成厚度1〇_左右的 樹脂膠層12。 〇 圖4C所繪示為銅樹脂圖案的印刷製程，於絕緣性美 11中相對銅基樹脂縣12的另―側，進行銅基樹脂膠_ 案印刷亚使其硬化，以於絕緣性基材u的另—細彡成厚度約 為=μιη的銅基樹脂膠層22。圖4D所繪示為化學鍍的製程， 其是在絕雜紐11 _彳財孔21⑽峨樹轉^ 22 (由圖2Α的製程所形成）上鍍上銅或鎳，以形成_；尸产 2_的鍍層13。圖4Ε所纷示為保護膜印刷的製程= 是於具有鋪I6的絕緣性基材η之兩面上形成厚产約^ HVm的絕緣性保護膜17, 27，用以保護且密封電路。、‘、' 實施例2, 3所製作的非接觸式智慧卡用天線，由於Formed by the way. The insulating protective film is formed on one side of the plating layer of the insulating base. %, why is it close to the second invention of the miscellaneous materials 妓 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The above-mentioned purpose, features, and advantages of the smart card or tag antenna are more suitable as a film, and the above-mentioned objects, features, and advantages of the present invention will be more apparent, and will be described in detail below with reference to the accompanying drawings. [Embodiment] Embodiments 1A to 1C are the configuration of the non-contact smart card of the present invention. FIG. 1A is not a plan view, and FIG. 1B is a cross-sectional view of the AA line. It is shown as a B-line cross-sectional view in Fig. 1A. Here, the size of the 1C% Phillips card 1 (horizontal length: 85 6 mm; full width: 5 such as ^. thickness. 7 ± 〇. 〇 8 mm) is based on Japanese industrial specifications. Recall that the smart card 1 includes a substrate which has a PET film and is in the form of a film. 2009. The material of the substrate 2 has an antenna portion 3 having a first layer in a ring shape. The antenna portion 5 of the second layer is provided above the third layer, and the insulating layer 4 is provided between the antenna portion 3 and the antenna portion 5. The antenna unit 3 and the antenna unit 5 together form a coil antenna having a hierarchical structure, and at both ends of the coil antenna, a jc 6 is connected and fixed by a cover. Further, the reference numeral 7 denotes a conduction portion between the antenna portion 3 of the first layer and the antenna portion 5 of the second layer. Further, on the substrate, a surface cover (not shown) of the same material as that of the insulating layer 4 is laminated, and this surface cover is used to seal the IC 6. Therefore, the IC smart card i communicates with the external device via the coil antenna. Please refer to FIG. 2A to FIG. 2F, which illustrate the embodiment in sequence! The manufacturing process of the non-contact smart card or tag antenna. In the following, a "smart card" will be used as a representative. 2A is a printing process of a copper resin pattern, in which a copper-based resin paste pattern printing is performed on the insulating substrate 11 of the smart card in a screen printing manner and at a normal temperature. Thereafter, hardening is performed to form a copper-based resin adhesive layer 12 (first copper-based resin adhesive layer) having a thickness of about 1 μm. The copper-based resin paste can be hardened at about 10 rc. The material of the insulating substrate 11 is, for example, polyethylene terephthalate (PET) or polyethylene naphthalate (p). 〇lye%iene naphthalate (referred to as PEN), and polyaniline (p〇iyimide, referred to as pi), etc. Taking PET as an example, the thickness is 38μπι or 50μιη. Here, copper-based resin glue refers to adding copper to the resin. A powder, such as a resin, for example, a polyolefin (p〇ly〇lefm), a acryl resin, or a phenol resin. In addition, there are many kinds of materials which can be used as an insulating base. The material u is, for example, a glass epoxy substrate, a glass substrate (for example, quartz, a stone material), a ceramic substrate (for example, alumina, aluminum nitride, tantalum nitride, or cerium oxide). 200945213 Ji Shuyue, 2 smart cards and other related fields. In addition, copper i grease II = can be copper-plated powder. Compared with silver resin glue, copper-based fine rubber has a relatively tight tightness and softness. By = it is on the copper-based resin layer 12 (m) into copper or recorded to form - money 13 Ο, Lai ^ 2 3 ΓΓ is in the temperature of 4 ° ~ thief temperature touch and right = handsome. In addition, is not limited to only the key copper, the system; the latter can also mine steel and brocade. It is not limited to the use of chemical money, but also the method of electric recording. 圄 4 2 shows the process of insulating layer printing, which is formed by screen printing, etc. == on the insulating substrate with plating layer 13 Insulating 1 · raw tree eucalyptus layer 14, and on the mineral layer 13 the opening is about one =: = fat or ultraviolet curing resin, which is, for example, acrylic acid, μ 糸 or _ 绪 ,, or it can also It is a mixture of the above. 缘=2: t is a printing process of a copper resin pattern, which is a copper-based resin layer formed on an insulating substrate u having a layer of =1: ??? The layer 14 has a similar process. The screen printing is performed by screen printing, and the material and thickness thereof are equivalent to the copper-based resin layer 12. The copper-based resin layer 15 can be electrically connected to the u through the opening. The upper chemical is overlaid, which is a layer of glue 15 and copper or nickel to form a layer of money 16 (second layer). This layer] 6 system 9 200945213 The process of FIG. 2B, the material and the thickness thereof are opposite to the plating i3, and FIG. 2F is a process of printing the protective film, which is formed on the insulating substrate U near the side of the ore layer 16. Insulating pour film 17. The insulating protective film 17 can be made of the same material as the insulating resin subbing layer 14 (formed by the process of Fig. %). The thickness of the insulating film 17 is about (1) and is used. Protected and sealed circuit. Due to the insulating resin layer μ between the plating layer 13 and the copper-based resin layer 15, the thickness is only about 1. Therefore, the ore layer 13 and the copper-based resin adhesive layer 15 are larger. It can be seen from the following formula (1) that at the set resonance frequency ^, the larger the capacitance C is, the smaller the inductance L is, and the shorter the circuit length (i.e., the length of the line). Therefore, the antenna for a non-contact smart card manufactured by the first embodiment has an advantage that the length of the line is short. f = l/(2nVLC) (1) In addition, the conventional copper-film (the material of the film is PET) is by way of example! The antenna for the contactless smart card produced has a lower resistance and is also more suitable for surface treatment. Moreover, the copper-based ruthenium resin layer can be obtained by spreading, and is less likely to be produced as a thin-twist antenna. More and the 'example! The manufacturer of the non-contact smart card antenna shown can be processed at a low temperature. Moreover, the waste liquid handling procedure is greatly reduced compared to the conventional removal method. In addition, the material can also be used in an amount of 1%, and can be processed in the atmosphere (without nitrogen). Only the manufacturing method of the non-contact smart card antenna shown in the target example 1 and the non-contact feature of the contact smart card skin. She uses the conventional removal method (ie, using lithography and engraving techniques), which is cheaper. In addition, technologies such as printing minerals or electricity money have less impact on the environment. When necessary, it can also be used in conjunction with the long-developed roll-type (four) i-t )) printing technology, which significantly reduces engineering and reduces costs. Example 2 / In each of the following <RTIgt;</RTI>>''''' Please refer to FIG. 3, which is a cross-sectional view of the non-contact smart card of the present invention as shown in FIG. 3: The material of the smart meter is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the present embodiment, a copper-based resin paste (the same as in Embodiment 1) can be printed on the insulating substrate 11 by screen printing to form a copper-based resin layer 12. Further, copper or nickel is mineralized on the copper-based resin adhesive layer 12 to form the same ore layer 13 as in the first embodiment. Further, the insulating protective film 17 can be formed on the insulating substrate u on the 16-spoon side of the smear. According to the above formula, a single-layer non-contact smart card antenna can be formed. Embodiment 3 Referring to Figures 4A to 4E, the manufacturing flow of the non-contact type flash card or the tag antenna of the third embodiment will be sequentially shown. In the following, the representative will be explained by "smart, card". FIG. 4A shows a process for opening a cave. For example, the insulation is made of polyethylene terephthalate having a thickness of 5 μm, and a through hole 21 is formed in the material 11 as a conductive portion. The diameter of 21 is approximately 0.1 mm. Fig. 4A shows a printing process of a copper resin pattern in which a pattern printing of a copper-based resin paste is performed on a dielectric substrate 11 having a perforation 21 in a screen printing manner and at a normal temperature. The copper-based resin gel can be sucked into the perforations 21a by straight-through processing. This base resin glue is dropped from the perforations 21, and the copper base can be prevented from dripping on the other side of the insulating substrate u. After reading, the copper is finely transferred into the resin layer 12 having a thickness of about 1 Å on the perforated film 21 and the insulating base material η. 4C is a printing process of a copper resin pattern, and is made of a copper-based resin paste on the other side of the copper-based resin county 12 in the insulating beauty 11 to harden the insulating substrate. The other part of u is finely divided into a copper-based resin adhesive layer 22 having a thickness of about = μιη. 4D is a process of electroless plating, which is plated with copper or nickel on the ruthenium 11 (10) eucalyptus turn 22 (formed by the process of FIG. 2) to form _; 2_ plating 13. Fig. 4 shows a process for printing a protective film = forming an insulating protective film 17, 27 having a thickness of about HVm on both sides of an insulating substrate η having an I6 to protect and seal the circuit. , ', ' Embodiment 2, 3 non-contact smart card antenna, due to
樹脂膠層可藉缝層而得到補強，較不易產生破損，故$ 於作為薄膜天線。 、 ^ 而且，實施例2, 3所示之非接觸式智慧卡用天線的製造 方去可在低/皿下進行力口工。而且，相較於習知的移除法， 所需的廢液處理程序也大幅減少。另外，材料也可ι〇〇%得 到利用，且可在大氣中（不需氮氣）進行加工。 貫施例2, 3所不之非接觸式智慧卡肢線的製造方法及 非接觸式智慧侧天線還具有钉的優點。她於習知的移 200945213 除法（即使用微影熱刻技術），其價格較便宜。此外· 學贼賴料術__赴的影響也較小。在必 術柊5可與已發展良久的捲軸式⑽Μ〇-Γ〇11)印刷技 抓配使用，k而域驗卫程並降低成本。 本發_實關_如上，然其並_罐定本發明所 &張之專#]權利細。其翻保護範圍當視後附之中請專利 其糊領域而定。凡本領域具有通常知識者，在不脫The resin adhesive layer can be reinforced by the seam layer and is less likely to be damaged, so it is used as a film antenna. Further, the antenna of the non-contact smart card shown in Embodiments 2 and 3 can be manufactured under the low/dish. Moreover, the required waste liquid handling procedures are substantially reduced compared to conventional removal methods. In addition, the material can be used as much as possible and can be processed in the atmosphere (without nitrogen). The manufacturing method of the non-contact smart card limbs and the non-contact smart side antenna of the second embodiment and the third embodiment also have the advantages of the nail. She moved to the well-known 200945213 division (that is, using lithography hot engraving technology), which is cheaper. In addition, the impact of thieves' __ __ go to the __ is also small. At Bingyu 5, it can be used with the long-running reel type (10) Μ〇-Γ〇11) printing technology, and the field is repaired and the cost is reduced. The present invention _ real off _ as above, but it is _ can be determined by the invention & Zhang Zhi special #] rights fine. The scope of its protection is determined by the patent field. Those who have common knowledge in this field are not taking off
離本專利精神或細内，所作之更動或_，均屬於本發明 所揭不精神τ所完成之等蚊變或設計，且應包含在下述之 申請專利範圍内。 【圖式簡單說明】 圖1Α至圖1C所繪示為本發明之非接觸式智慧卡的基板 構成，圖1Α所繪示為其平面圖，圖m所繪示為圖丨八中的 Α-Α線剖面圖，圖1C所繪示為圖1Α中的Β_Β線剖面圖。 /圖2Α至圖2F依序繪示出實施例1之非接觸式智慧卡或 標籤用天線的製造流程。 圖3所繪示為本發明之實施例2的非接觸式智慧卡的剖 面圖。 圖4Α至圖4Ε，其依序繪示出實施例3之非接觸式智慧 卡或標籤用天線的製造流程。 〜 圖5之步驟⑻至步驟(i)依序繪示出藉由移除法以於基材 的兩面上形成回路的製造流程。 【主要元件符號說明】 200945213 1 : 1C智慧卡 2 :基材 3、5 ··天線部 4 :絕緣層 6 ： 1C / 7 :元件符號 11 :絕緣性基材 12、 22 :銅基樹脂膠層 13、 16 :鑛層 14 :絕緣性樹脂膠層 15 :銅基樹脂膠層 17、27 :絕緣性保護膜 21 :穿孔Modifications or modifications made by the spirit or the details of the patent are within the scope of the invention, and are included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1C illustrate a substrate structure of a non-contact smart card of the present invention, and FIG. 1A is a plan view thereof, and FIG. The line cross-sectional view is shown in Fig. 1C as a cross-sectional view of the Β_Β line in Fig. 1 . FIG. 2A to FIG. 2F sequentially illustrate the manufacturing flow of the non-contact smart card or the tag antenna of the first embodiment. Fig. 3 is a cross-sectional view showing a non-contact smart card according to a second embodiment of the present invention. 4A to 4B, the manufacturing flow of the non-contact smart card or the tag antenna of the third embodiment is sequentially illustrated. ~ Steps (8) through (i) of Figure 5 sequentially illustrate the manufacturing process for forming a loop on both sides of the substrate by a removal method. [Description of main component symbols] 200945213 1 : 1C smart card 2: base material 3, 5 · antenna part 4 : insulating layer 6 : 1C / 7 : component symbol 11 : insulating substrate 12 , 22 : copper base resin adhesive layer 13, 16: mineral layer 14: insulating resin adhesive layer 15: copper-based resin adhesive layer 17, 27: insulating protective film 21: perforated