KR102102404B1 - Contact terminal lamination structure for mobile device and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a laminated structure of a contact terminal for transceiving a wireless device antenna, and to a manufacturing method thereof. The laminated structure of a contact terminal for transceiving a wireless device antenna has a simple manufacturing process and can be widely applied to various wireless devices including smartphones, when a contact terminal for transceiving a wireless device is coupled to a metal case of a wireless device and is bonded with a conductive adhesive layer so that a contact terminal for transceiving a wireless device is adhered by the adhesive when adhered to a surface of the metal case.

Description

Stacking structure of a contact terminal for transmitting / receiving a wireless device antenna and its manufacturing method {CONTACT TERMINAL LAMINATION STRUCTURE FOR MOBILE DEVICE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a stacked structure of a contact terminal for transmitting and receiving antennas for wireless devices and a method for manufacturing the same, and more specifically, for a metal case made of aluminum or an aluminum alloy, a contact terminal for transmitting and receiving wireless communication in a wireless device such as a smartphone. The present invention relates to a stacked structure of a contact terminal for transmitting and receiving antennas for wireless devices that can not only prevent the occurrence of a galvanic phenomenon on the surface, but also improve productivity through an automated process when attaching a terminal, and lower manufacturing cost, and a method for manufacturing the same. .

Recently, thanks to the rapid technological development of wireless devices such as mobile phones, devices are becoming smaller, lighter and higher in performance.

For such a wireless device, a broadband antenna technology capable of realizing multiple bands as a single antenna in a terminal of a limited size for wireless communication has been proposed, but the design of the broadband antenna requires a lot of space.

Accordingly, a contact terminal technology for transmitting and receiving wireless devices in which a metal case is operated as an antenna was developed. In order to connect the metal case and the antenna circuit, a screw bonding method is conventionally used, but a bonding method using a plated contact terminal is used due to space utilization and inconvenience in external design.

The contact terminal for transmitting / receiving wireless devices usually uses a contact terminal formed of aluminum and gold-plated metal. Corrosion of the galvanic phenomenon progresses as micro-current flows to the connection portion of the contact terminal, and the contact surface gradually turns black. While the electrical conductivity is lowered, a call interruption or noise occurs during a call.

As an example of a method of joining a plating contact terminal to solve such a problem, a method of ultrasonically welding a plating contact terminal formed of gold plating on a copper foil to an aluminum metal case surface is used, but this is difficult to automate in the process. As the welding welding was performed manually, the manufacturing cost increased, and there is a limitation in reducing the size of the product because a separate area of the product for ultrasonic welding is required in addition to the contact area of the contact terminal, which also causes the manufacturing cost to increase.

On the other hand, Patent No. 10-1736211 (Reference 1) has been proposed as a related prior art. This relates to a method of manufacturing and processing a contact terminal thin film sheet for an antenna having excellent bonding characteristics with aluminum and aluminum alloy, and an antenna contact having a first-side plating layer satisfying corrosion resistance and abrasion resistance and a second-side plating layer excellent in bonding characteristics. Provided is a terminal thin film sheet and a method for manufacturing the same, and provides a contact terminal thin film sheet for an antenna having a tin plating layer made of tin or a tin-containing alloy on one side of the copper foil and the copper foil. A nickel plating layer forming step of forming a nickel plating layer by, a gold plating layer forming step of forming a gold plating layer of gold or gold alloy by electroplating on the nickel plating layer, and tin by electroplating on the second surface of the copper foil Including a tin plating layer forming step of forming a plating layer of tin or tin alloy using a plating solution The antenna contact terminal thin sheet preparation method has been proposed.

However, the tin plating layer formed on the second surface of the copper foil of Reference 1 is a plating mainly used for soldering purposes, and the material is soft and the particles are large, so that hardness and adhesive strength are lower than gold, and conductivity is generally low compared to copper or gold.

Therefore, this method of manufacturing a contact terminal thin film sheet for an antenna has a disadvantage in that it is easily detached due to weak adhesive strength when attached to the surface of a metal case using an adhesive, and thus there is a difficulty in manufacturing.

Reference 1: Registered Patent No. 10-1736211

Therefore, the present invention is intended to solve these problems, and the present invention provides a stacked structure of a contact terminal for transmitting and receiving antennas for a wireless device that is easy to manufacture because the contact terminal for transmitting and receiving wireless devices is attached to the surface of a metal case by an adhesive. The purpose is to provide a method of manufacturing the same.

In addition, an object of the present invention is to provide a stacked structure of a contact terminal for transmitting and receiving an antenna for a wireless device, which can lower the manufacturing cost and improve the productivity through an automated process, and is advantageous for signal transmission.

The present invention to solve this technical problem;

Copper foil, a first nickel plated layer formed on an upper surface of the copper foil to improve corrosion resistance and hardness of the copper foil, and a gold plated layer formed on the surface of the first nickel plated layer to improve electrical conductivity and corrosion resistance, and the copper foil It is characterized in that it comprises a second nickel plated layer formed on the bottom to improve the electrical conductivity and corrosion resistance.

Here, a gold plating layer for improving electrical conductivity and corrosion resistance is further formed under the second nickel plating layer.

In addition, the contact terminal for transmitting and receiving the wireless device is characterized in that the surface of the metal case of the wireless device is attached using a conductive epoxy resin.

In addition, the present invention;

It comprises a terminal preparation process for preparing a contact terminal for transmitting and receiving wireless devices, an adhesive applying process for applying an adhesive to the surface of a metal case of the wireless device, and a terminal insertion process for attaching a contact terminal for transmitting and receiving wireless devices to the adhesive. It is characterized by.

Herein, the terminal preparation process includes a plating step of forming a base sheet containing copper foil, a laminating step of laminating release paper on the lower portion of the base sheet, and a contact terminal for transmitting and receiving wireless devices by punching the base sheet located on the release paper upper part. Characterized in that it comprises a punching step to form a.

At this time, the plating step, the first step of forming a first nickel plating layer and a second nickel plating layer to improve the corrosion resistance and hardness of the copper foil on the upper and lower surfaces of the copper foil, the surface of the first nickel plating layer and the second nickel plating layer It characterized in that it comprises a second step of forming a gold plating layer in order to improve the electrical conductivity and corrosion resistance.

In addition, the adhesive used in the adhesive application process is characterized in that it is a conductive thermosetting epoxy resin.

Meanwhile, after the terminal insertion process, a curing process for curing the adhesive is further performed, and the curing process is characterized by heating at 80 to 90 ° C. for 90 to 120 minutes.

According to the present invention, when the contact terminal for transmitting and receiving wireless devices is bonded to the metal case of the wireless device with a conductive adhesive layer, the contact terminal for sending and receiving wireless devices is attached with the adhesive when attached to the surface of the metal case, so the manufacturing process becomes simpler. It can be widely applied to various wireless devices including smartphones.

In addition, the present invention can improve the productivity of the stacking and bonding of the contact terminals for transmitting and receiving wireless devices through an automated process, thereby lowering the manufacturing cost, and also advantageous in signal transmission by using a conductive adhesive layer.

In addition, the present invention not only simplifies the manufacturing process by forming the first and second nickel plating layers on both sides of the copper foil, but also improves the corrosion resistance and hardness of the contact terminal for transmitting and receiving wireless devices.

1 is a view showing a laminated structure of a contact terminal for transmitting and receiving wireless devices according to the present invention.
2 is a conceptual diagram of a manufacturing process diagram of a contact terminal for transmitting and receiving wireless devices according to the present invention.
3 is a block diagram of a manufacturing process diagram of a contact terminal for transmitting and receiving wireless devices according to the present invention.

Hereinafter, with reference to the accompanying drawings, a laminated structure and a manufacturing method of a contact terminal for transmitting and receiving a wireless device according to the present invention, it will be understood that the features are understood by an embodiment described in detail.

Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to ordinary or lexical meanings, and the inventor appropriately explains the concept of terms to explain his or her invention in the best way. Based on the principle that it can be defined, it should be interpreted as meanings and concepts consistent with the technical spirit of the present invention.

Therefore, the configuration shown in the embodiments and drawings described in this specification are only the most preferred embodiment of the present invention, and do not represent all the technical spirit of the present invention, and at the time of this application, they can be replaced. It should be understood that there may be various equivalents and variations.

1 is a view showing a laminated structure of a contact terminal for transmitting and receiving wireless devices according to the present invention, FIG. 2 is a conceptual diagram of a manufacturing process diagram of a contact terminal for transmitting and receiving wireless devices according to the present invention, and FIG. 3 is a wireless device according to the present invention It is a block diagram of a manufacturing process diagram of a contact terminal for transmission and reception.

Referring to FIG. 1, a stacked structure of a contact terminal for transmitting and receiving a wireless device according to the present invention is made of aluminum or an aluminum alloy material for a contact terminal 100 for transmitting and receiving a contact such as an antenna for wireless communication in a wireless device such as a smartphone. When attaching to the surface of the metal case 200 of the wireless device made by using an adhesive, the manufacturing process becomes simpler, so when attaching and receiving the contact terminal 100 for transmission / reception to the metal case 200, productivity is improved through an automated process. You can do it.

The laminated structure of a contact terminal for transmitting and receiving wireless devices according to the present invention includes a copper foil 1, first and second nickel plated layers 2 and 3 formed on upper and lower surfaces of the copper foil 1, and the first, 2 It consists of gold plating layers (4, 5) formed on the surface of the nickel plating layers (2, 3).

Hereinafter, a manufacturing process of a contact terminal for transmitting and receiving a wireless device according to the present invention will be described with reference to FIGS. 1 to 3.

The contact terminal for transmitting and receiving a wireless device according to the present invention includes a terminal preparation process (S100), an adhesive application process (S200), and a terminal insertion process (S300).

Here, the terminal preparation process (S100) is a step of preparing a contact terminal 100 for transmitting and receiving a wireless device to be attached to a metal case 200 of a wireless device used as an antenna, wherein the terminal preparation process (S100) is plating It consists of a step (S110), a lamination step (S120), and a punching step (S13).

At this time, the plating step (S110) is a step of forming a base sheet 10 by plating on the copper foil 1 for use as a base material of the contact terminal 100 for transmitting and receiving wireless devices, the copper foil 1 It may be used to have a thickness of at least 8㎛ to prevent damage during handling and bonding, for example, it is preferable to use a copper foil sheet having a thickness of 10-18㎛.

On the other hand, before performing the plating step (S110), it is preferable to perform a degreasing step of immersing the copper foil (1) in an alkali degreasing liquid in order to remove foreign substances and the like on the surface of the copper foil (1).

In addition, after the degreasing process, the copper foil 1 is washed to remove the degreasing liquid on the surface of the copper foil, and sulfuric acid treatment is performed to improve the plating property on the surface of the copper foil 1, thereby removing the oxide layer existing on the surface of the copper foil 1. desirable.

Here, in the plating step (S110), the first nickel plated layer 2 and the second nickel plated layer 3 are respectively formed on the upper and lower surfaces of the copper foil 1 to improve corrosion resistance and hardness of the copper foil 1. This is a step of further forming a first step (S112) and a gold plating layer (4,5) for improving electrical conductivity and corrosion resistance on the surfaces of the first and second nickel plating layers (2,3).

At this time, electrolytic nickel plating is performed on one surface and the other surface of the copper foil 1 to form a first nickel plated layer 2 and a second nickel plated layer 3, and then washed and washed with water, thereby providing corrosion resistance and hardness of the copper foil 1 Will improve.

The first nickel plated layer 2 is formed on the one side of the copper foil 1 in a thickness of 4 to 8 μm, which is less strength and corrosion resistance when the thickness of the first nickel plated layer 2 is less than 4 μm. , When the thickness of the first nickel plated layer 2 is formed to be thicker than 8 μm, the nickel plating hardness increases, and cracks may occur and thus be cut.

In addition, gold plating is performed on the surfaces of the first and second nickel plated layers 2 and 3 to form a gold plated layer 4 and 5, and thereafter washed with water to improve the electrical conductivity and corrosion resistance of the copper foil 1. do. The gold-plated layers 4 and 5 are excellent in electrical conductivity, and are not easily oxidized in air, so there is little change in electrical conductivity due to oxidation, which is advantageous when used as a contact.

At this time, the gold plating layers 4 and 5 are immersed in an electrolytic acidic gold plating solution to form gold plating on the surface, and if necessary, formed of a gold alloy plating layer containing metals such as indium, cobalt, and nickel to further improve wear resistance. You can.

The gold plating layers 4 and 5 are preferably formed on the surface of the first nickel plating layer 2 in a thickness of 0.04 to 0.10 µm, but may be formed above or below the thickness if necessary. Of course, when the thickness of the gold plating layer (4,5) is less than 0.04㎛, contact resistance and corrosion resistance are poor, and when the thickness of the gold plating layer (4,5) is thicker than 0.10㎛, the gold plating cost increases. there is a problem.

On the other hand, the gold plating layer 5 formed on the lower surface of the second nickel plating layer 3 not only further improves the electrical conductivity and corrosion resistance, but also improves the adhesive strength with the conductive adhesive used to bond the metal case 200 of the wireless device. You can increase it.

And, the laminating step (S120) is a step of laminating the release film 20 to the lower portion of the base sheet 10 formed in the plating step (S110), plating by laminating the release film 20 made of a PET film or the like Damage to the base sheet 10 formed in step S110 may be prevented, and the release film 20 may be easily separated when bonded to a metal case 200 of a wireless device.

Meanwhile, the punching step (S130) is a step of completing the contact terminal 100 for transmission and reception by punching the base sheet 10 to which the release film 20 is laminated to a certain size.

Here, the contact terminal 100 for transmitting and receiving is a process of punching the sheet 10 on which the release film 20 is laminated to a certain size and cutting it to a size suitable for a structure for fixing to the metal case 200 of the wireless device. Revenge at once.

And, in the adhesive application process (S200), an adhesive is applied to the surface of the metal case 200 of the wireless device to form a conductive adhesive layer 30. The base sheet 10 and the wireless device of aluminum or aluminum alloy material The metal case 200 is made of a thermosetting epoxy resin that exhibits conductivity to enable electrical conduction. The thermosetting epoxy resin is formed by mixing fine conductive particles, and the fine conductive particles are Ag (main component), Ni, carbon, Solder. It is made of a ball.

At this time, the thermally curable resin usually has the properties of an insoluble, irreversible process, and insoluble condensation-type synthetic resin after the initial condensate is cured through heating, catalyst, ultraviolet light, chemical reaction by time, and the like.

And, the terminal insertion step (S300) is a step of inserting the contact terminal 100 for transmission and reception in the metal case 200 of the wireless device, specifically, the contact terminal 100 for transmission and reception of the metal case 200 It is a process of adhering to the adhesive applied to the surface.

This picks up the contact terminal 100 for transmission and reception located on the top of the release film 20 using automation equipment, and then closes the contact terminal 100 for transmission and reception at a predetermined position on the surface of the metal case 200.

On the other hand, after the terminal insertion process (S300), a curing process (S400) is further performed, and the curing process (S400) cures the conductive adhesive layer 30 so that the contact terminal 100 for transmission and reception is made of aluminum or aluminum alloy material. It is a step of integrally bonding to the surface of the metal case 200.

At this time, by heating and curing the conductive adhesive layer 30 made of a thermosetting epoxy resin exhibiting conductivity in close contact with the surface of the metal case 200 within a temperature range of 80 to 90 ° C within 90 to 120 minutes, the contact terminal for transmission and reception 100 On the surface of the metal case 200, the conductive adhesive layer 30 made of a thermosetting epoxy resin is fixed integrally.

That is, when heating the conductive adhesive layer 30 made of a thermosetting epoxy resin exhibiting conductivity, when heated to a temperature lower than 80 ° C, the adhesive strength of the conductive adhesive layer 30 decreases, and when heated to a temperature higher than 90 ° C. There is a problem in that the metal case 200 made of aluminum or an aluminum alloy is cracked due to thermal expansion.

In addition, when the heating is performed at a temperature that is too high, the metal case 200 made of aluminum or the like has an adverse effect such as deformation, so that it is heated in a temperature range of 80 to 90 ° C.

After that, the finished product is manufactured by determining whether the product is defective through inspection of the finished product.

After performing the curing process (S400) of bonding the contact terminal 100 for transmission and reception to the surface of the metal case 200, the test is performed in the following environment.

First, the metal case 200 to which the contact terminal 100 for transmission and reception is attached is attached for the adhesive strength test using 3M tape within 30 seconds at room temperature. It was confirmed that the adhesive surface was peeled off and stuck to the tape, and then an adhesive strength test was performed, and an electrical resistance test was performed to have reliability of less than 0.5 ohm (Ω).

The above description is merely illustrative of the technical spirit of the present invention, and those of ordinary skill in the art to which the present invention pertains can be modified and modified in various ways without departing from the essential characteristics of the present invention. The protection scope of should be interpreted by the claims below, and all technical spirits within the equivalent scope should be interpreted as being included in the scope of the present invention.

1: copper foil 2: 1st nickel plating layer
3: 2nd nickel plating layer 4,5: gold plating layer
20: release film 30: conductive adhesive layer
100: contact terminal for transmission and reception 200: metal case

Claims (7)

Copper Foil,
A first nickel plated layer formed on the top surface of the copper foil,
A gold plating layer formed on the surface of the first nickel plating layer,
A second nickel plated layer formed on the lower portion of the copper foil,
And a gold plating layer formed under the second nickel plating layer.
According to claim 1,
The wireless device transmitting and receiving contact terminal is a laminated structure of a wireless device transmitting and receiving contact terminal, characterized in that the surface of the metal case of the wireless device using a conductive epoxy resin.
Terminal preparation process for preparing a contact terminal for transmitting and receiving wireless devices,
An adhesive application process for applying an adhesive to the surface of a metal case of a wireless device,
It comprises a terminal insertion process to attach the contact terminal for transmitting and receiving wireless devices to the adhesive,
After the terminal insertion process, a curing process for curing the adhesive is further performed,
The curing process is a method of manufacturing a contact terminal for transmitting and receiving a wireless device, characterized in that heating at 80 ~ 90 ℃ for 90 to 120 minutes.
According to claim 3,
The terminal preparation process,
Plating step of forming a base sheet containing copper foil,
A lamination step of laminating release paper on the lower portion of the base sheet;
A method of manufacturing a contact terminal for transmitting and receiving a wireless device, comprising: a punching step of forming a contact terminal for transmitting and receiving a wireless device by punching a base sheet located on the release sheet.
According to claim 4,
The plating step,
A first step of forming a first nickel plating layer and a second nickel plating layer on the upper and lower surfaces of the copper foil to improve the corrosion resistance and hardness of the copper foil,
And a second step of forming a gold plating layer to improve electrical conductivity and corrosion resistance on the surfaces of the first nickel plating layer and the second nickel plating layer or the surfaces of the first nickel plating layer. Method of manufacture.
According to claim 3,
The adhesive used in the adhesive application process is a method of manufacturing a contact terminal for transmitting and receiving wireless devices, characterized in that the conductive thermosetting epoxy resin.
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