KR101763906B1 - Substrate processing device and film forming device - Google Patents
Substrate processing device and film forming device Download PDFInfo
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- KR101763906B1 KR101763906B1 KR1020167008733A KR20167008733A KR101763906B1 KR 101763906 B1 KR101763906 B1 KR 101763906B1 KR 1020167008733 A KR1020167008733 A KR 1020167008733A KR 20167008733 A KR20167008733 A KR 20167008733A KR 101763906 B1 KR101763906 B1 KR 101763906B1
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- shaft portion
- swinging
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- arm
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32908—Utilities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The substrate processing apparatus has a casing (21) and a hollow swing arm (23) positioned inside the casing. The swing arm includes a hollow swinging central shaft portion 23a connected to the casing and a hollow connecting shaft portion 23b which is a swinging end. The substrate processing apparatus further includes a processing section (22) located inside the casing and moving the processing space facing the substrate in a direction orthogonal to the axial direction (P) of the swinging central axis part to perform processing on the substrate. The processing section follows the movement of the processing section and is connected to the connecting shaft section so that the connecting shaft section 23b can be translated with the processing section. Therefore, the swing arm 23 rocks by the movement of the processing section 22. [ The substrate processing apparatus is connected to a utility which is located inside the swing arm 23 and is located outside the casing through the inside of the swinging central shaft portion 23a and which is connected to the processing section through the inside of the connecting shaft portion 23b Line.
Description
The present disclosure relates to a substrate processing apparatus for performing a process on a substrate and a film forming apparatus for forming a thin film on the substrate.
As a sputtering apparatus for forming a thin film on a substrate, for example, as disclosed in Patent Document 1, a sputtering apparatus is known in which a cathode containing a target moves from one side of a pair of opposite sides of the substrate toward the other side. In such a sputtering apparatus, the cathode moves while emitting the sputtering particles toward the substrate.
Incidentally, the sputtering apparatus has a connection line including a power line for supplying electric power to the target, a pipe for supplying sputter gas to the surface of the target, and the like. In the sputtering apparatus described above, every time the cathode moves, the connection line is pulled inwardly or outwardly from the chamber outside the chamber in which the cathode is arranged as the cathode moves. And, every time the cathode moves, the connecting line is repeatedly subjected to a mechanical load because the connecting line is pulled or the connecting line and the member guiding the connecting line are skewed.
Sputtering apparatus, or the like, and in the case of a substrate processing apparatus in which a processing section for processing a substrate moves in a space opposed to the substrate, the above-mentioned matters are generally common.
It is an object of the present disclosure to provide a substrate processing apparatus and a film forming apparatus capable of reducing a mechanical load which is caused by a connection line connected to a processing section for processing a substrate due to the entry and exit between the inside of the casing and the outside of the casing .
One embodiment of the substrate processing apparatus in the present specification includes a casing and a hollow swinging arm located inside the casing. The rocking arm includes a hollow pivot center shaft portion connected to the casing and a hollow connecting shaft portion that is a swinging end. The substrate processing apparatus further includes a processing section which is located inside the casing and moves the processing space facing the substrate with respect to the substrate in a direction orthogonal to the axial direction of the swinging central axis section to perform processing on the substrate. The processing section is connected to the connection shaft section so that the connection shaft section follows the movement of the processing section so as to be able to translate with the processing section, and causes the swinging arm to swing by the movement of the processing section. The substrate processing apparatus further includes a connection line which is located inside the swing arm and is connected to a utility located outside the casing through the inside of the swing center shaft and connected to the processing unit through the connection shaft .
According to this configuration, when the processing portion translates together with the connection shaft portion, the swinging arm rocks about the swinging central axis portion. At this time, the connection line located in the swinging arm keeps connection with the processing unit while following the swinging motion of the swinging arm. Therefore, the connection line is hardly inserted or removed between the inside and the outside of the swing arm through the swing center shaft portion. That is, the connection line rocks about the swinging central axis portion following the swinging motion of the swinging arm. Therefore, the amount of change in the length of the connecting line that changes between the inside of the casing and the outside may be smaller than the moving distance of the treating section. As a result, the mechanical load received by the connection line due to the entry / exit between the inside of the casing and the outside of the casing can be reduced.
One embodiment of the film forming apparatus in this specification includes a casing and a hollow swinging arm that is located inside the casing. The swinging arm includes a hollow swinging central shaft portion connected to the casing and a hollow connecting shaft portion which is a swinging end. In addition, the film forming apparatus may further include a step of moving a processing space facing the substrate with respect to the substrate in a direction orthogonal to the axial direction of the swinging central axis portion, and forming a film on the substrate by discharging the film forming material toward the substrate As shown in Fig. The film forming portion is connected to the connecting shaft portion so that the connecting shaft portion can follow the movement of the film forming portion and can translate to the film forming portion, and causes the swinging arm to rock by the movement of the film forming portion. The film forming apparatus further includes a connection line which is located inside the swinging arm and is connected to a utility located outside the casing through the inside of the swinging central axis portion and connected to the film forming portion through the connection shaft portion .
According to this configuration, when the film forming portion translates together with the connecting shaft portion, the swinging arm rocks around the swinging central shaft portion. At this time, the connection line located in the pivoting arm keeps connection with the film forming section while following the swinging motion of the pivoting arm. Therefore, the connection line is hardly inserted or removed between the inside and the outside of the swing arm through the swing center shaft portion. That is, the connection line rocks around the swinging central shaft portion in accordance with the swinging motion of the swinging arm. Therefore, the amount of change in the length of the connecting line that changes between the inside of the casing and the outside may be smaller than the moving distance of the film forming portion. As a result, the mechanical load received by the connection line due to the entry / exit between the inside of the casing and the outside of the casing can be reduced.
Preferably, in the substrate processing apparatus, the processing section includes a shaft support portion that rotatably supports the connection shaft portion with respect to the processing portion. Preferably, the rocking arm is provided with an expanding and contracting mechanism for displacing the connecting shaft portion with respect to the swinging central shaft portion, thereby expanding and contracting the distance between the swinging central shaft portion and the connecting shaft portion. In this configuration, the extensible mechanism changes the distance between the pivot center shaft portion and the connection shaft portion to match the distance between the pivot center shaft portion and the shaft support portion.
With this configuration, when the processing portion translates together with the connecting shaft portion, the extending and retracting mechanism of the swinging arm changes the distance between the swinging central shaft portion and the connecting shaft portion according to the distance between the swinging central shaft portion and the shaft supporting portion. Thus, the connection shaft portion of the swing arm can follow the movement of the processing portion.
Preferably, in the substrate processing apparatus, the connection line is composed of a plurality of line components. Preferably, the plurality of line elements are disposed inside the swinging arm and are individually fixed to the swinging arm, and the distance between the swinging arm and the swinging arm is set to be longer And two intermediate rigid wiring lines. Preferably, the plurality of line elements are disposed inside the swing arm, and are connected between the two intermediate rigid wiring lines and have flexibility so that the distance between the two intermediate rigid wiring lines increases And an intermediate flexible line for reducing the amount of warp.
According to this configuration, when the swinging arm expands and contracts, the amount of warping of the intermediate flexible line between the two intermediate rigid wiring lines changes. Therefore, the change in the difference between the length of the connection line passing through the inside of the swing arm and the length of the swing arm is absorbed by the change in the amount of bending of the intermediate flexible line. Therefore, the length of the connection line that goes in and out between the inside and the outside of the swing arm is shortened.
Preferably, the pivot center shaft portion of the substrate processing apparatus is provided as a base end rotation portion that rotates with respect to the casing about a rotation axis along the axial direction of the pivot center shaft portion. Preferably, the connection line includes: a base end rotation wiring fixed to the base end rotation portion and being a rigid body rotating following the rotation of the base end rotation portion; a base end fixed wiring that is a rigid body fixed to the casing; And a base end flexible line connected between the base end fixed wiring and the base end rotation wiring and reducing the amount of warping as the distance between the base end rotation wiring and the base end fixed wiring increases.
According to such a configuration, the connection line is prevented from twisting due to the rotation of the base-end rotating portion. Therefore, the mechanical load on the connection line can be reduced.
Preferably, in the substrate processing apparatus, the connecting shaft portion is provided as a tip rotating portion that rotates with respect to the processing portion about a rotation axis along the axial direction of the swinging central axis portion. Preferably, the connecting line is a rigid body that is fixed to the distal rotating part and is a rigid body that rotates following the rotation of the distal rotating part. The connecting line is fixed to the processing part, And is connected between the distal rotating wiring and the distal rotating wiring so as to reduce the amount of warping as the distance between the distal rotating wiring and the distal rotating wiring increases And a leading end curved line.
According to such a configuration, it is possible to suppress the twist of the connection line by the rotation of the tip rotation portion. Therefore, the mechanical load on the connection line can be reduced.
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a configuration diagram schematically showing an internal configuration of a sputtering apparatus, which is a first embodiment of a film forming apparatus, together with a substrate to be processed by a sputtering apparatus. FIG.
FIG. 2 is a view showing the internal structure of the casing in a direction opposite to the substrate placed in the casing. FIG.
Fig. 3 is a view showing the casing internal structure in a direction facing the substrate positioned in the casing. Fig.
Fig. 4 is a view showing the internal structure of the casing in a direction opposite to the substrate placed in the casing. Fig.
5 is a cross-sectional view showing a cross-sectional structure along the height direction of a rocking arm of a sputtering apparatus which is a second embodiment of the film forming apparatus.
6 is a front view showing the frontal structure of the swing arm before stretching.
Fig. 7 is a front view showing the frontal structure of the swing arm after stretching. Fig.
8 is a cross-sectional view showing a partial cross-sectional structure along the height direction of the rocking arm before stretching.
9 is a cross-sectional view showing a partial cross-sectional structure along the height direction of the rocking arm after stretching.
10 is a partial rear view showing a part of the back surface structure of the sputtering apparatus of the third embodiment of the film forming apparatus viewed from the side opposite to the substrate with respect to the cathode apparatus.
11 is a partial rear view showing a part of the back surface structure of the rocking arm viewed from the side opposite to the substrate with respect to the cathode device.
12 is a partial front view showing a part of the frontal structure seen from the substrate side with respect to the cathode device of the rocking arm.
Fig. 13 is a partial front view showing a part of the frontal structure of the rocking arm viewed from the substrate side with respect to the cathode device. Fig.
[First Embodiment]
A first embodiment in which a substrate processing apparatus and a film forming apparatus are embodied as a sputtering apparatus will be described with reference to Figs. Hereinafter, an example of the entire configuration of the sputtering apparatus, the cathode apparatus included in the sputtering apparatus, and the operation of the cathode apparatus will be described in order.
[Overall structure of sputtering apparatus]
An example of the entire configuration of the sputtering apparatus will be described with reference to Fig.
1, the
The
The loading and unloading
The
The
The
The
[Cathode device]
The
2, the
The
A
A swinging
The
A pivotal shaft support portion 23a1 which is formed in a cylindrical shape extending along the opposite direction and supports the pivotal
The connecting
A connection shaft support portion 23b1 for supporting the
In the
Inside the
[Operation of the cathode device]
The operation of the cathode device will be described with reference to Figs. 2 to 4. Fig.
2, when the
When the
3, the
The position of the connecting
As shown in Fig. 4, when the
Thus, the
Therefore, when the
As described above, according to the sputtering apparatus of the first embodiment, the following effects can be obtained.
(1) When the
The first embodiment may be modified as appropriate as follows.
The position at which the pivot
The
The film forming apparatus may be embodied as various film forming apparatuses such as a deposition apparatus having an evaporation source as a film forming unit, instead of the
[Second Embodiment]
A second embodiment in which the substrate processing apparatus and the film forming apparatus are embodied as a sputtering apparatus will be described with reference to Figs. 5 to 9. Fig. The distance between the swinging
[Overall configuration of the rocking arm]
The entire configuration of the
5, the
The
The fixing
The
The
The swinging
The connecting
The swinging
The
In the inside of the
The
The
[Extension mechanism of rocking arm]
The
6, the
The
The
6, when the
At this time, in the elongating and
The amount of bending in the bending
7, when the
At this time, in the elongating and
The amount of bending in the bending
The extending and retracting
[Configuration of Power Line]
The configuration of the
As shown in Fig. 8, the
The oscillating rigid body portion 51a1 passes through the inside of the
The connecting rigid portion 51a2 is formed in a strip shape extending from the
The
8, when the length L of the
9, when the length L of the
As described above, when the swinging
As described above, according to the sputtering apparatus of the second embodiment, the following effects can be obtained.
(2) When the translating
(3) When the swinging
The second embodiment may be modified as appropriate as follows.
The
The configuration of the
The sputtering apparatus may be embodied as a combination of the constitution described in the first embodiment and the constitution described in the second embodiment. According to such a structure, the sputtering apparatus can be embodied as a structure having both the effect of the first embodiment and the effect of the second embodiment.
The oscillating arm (23) may not have the elongating / contracting mechanism (40). In this case, the
The swinging
The swinging
The
[Third embodiment]
A third embodiment in which the substrate processing apparatus and the film forming apparatus are embodied as a sputtering apparatus will be described with reference to FIGS. 10 to 13. FIG. The sputtering apparatus of the third embodiment is characterized by a power line mounted on the swinging
[Power line at the pivot center shaft portion]
Referring to Figs. 10 and 11, the
10, the
Each of the
Each of the
10, when the length L of the swinging
11, when the length L of the swinging
As described above, since the rotation of the swinging
[Power line of connection shaft part]
The
As shown in Fig. 12, each of the connecting rigid portions 51a2 constituting the
Each of the
Each of the
The amount of bending of the
13, when the length L of the swinging
As described above, since the rotation of the connecting
As described above, according to the sputtering apparatus of the third embodiment, the following effects can be obtained.
(4) Since the
The
The third embodiment may be modified as appropriate as follows.
Each of the
Each of the
A terminal formed in an annular shape around the pivot axis P and connected to the utility (hereinafter referred to as a utility connection terminal) is mounted on the end face of the pivot
A terminal connected to the
Each of the
The configuration of the
The sputtering apparatus can be embodied as a combination of the structure described in the first embodiment and the structure described in the third embodiment. With this structure, the sputtering apparatus can be embodied as a structure having both the effects of the first embodiment and the effect of the third embodiment.
The sputtering apparatus can be embodied as a combination of the structure described in the first embodiment, the structure described in the second embodiment, and the structure described in the third embodiment. According to such a configuration, the sputtering apparatus can be embodied as a configuration having both the effects of the first embodiment, the effect of the second embodiment, and the effect of the third embodiment.
10 sputter apparatus, 11 transfer chamber, 12 pre-treatment chamber, 13 sputter chamber, 14 gate valve, 15 times base, 16 deposition lane, 17 recovery lane, 18 cathode device, 19 lane changing section, 21 casing, 22
Claims (6)
A hollow swinging arm disposed inside the casing, the hollow swinging arm including: a hollow swinging central shaft portion that is pivotally supported by the swinging shaft support portion fixed to the casing such that the swinging shaft can rotate with respect to the casing; The rocking arm including a connecting shaft portion,
A processing unit which is located inside the casing and moves the processing space facing the substrate in a direction orthogonal to the axial direction of the swinging central axis part to perform processing on the substrate, wherein the processing unit follows the movement of the processing unit, The processing portion being connected to the connection shaft portion so as to be able to translate the processing portion,
And a connection line which is located inside the swinging arm and is connected to a utility located outside the casing through the inside of the swinging central axis portion and connected to the processing portion through the inside of the connection shaft portion,
Wherein the processing section includes a shaft supporting section for rotatably supporting the connection shaft section with respect to the processing section,
Wherein the swing arm includes a stretching mechanism that displaces the connecting shaft portion with respect to the swinging central shaft portion and expands and contracts the distance between the swinging central shaft portion and the connecting shaft portion,
The elongating and contracting mechanism changes a distance between the swinging central axis portion and the connecting shaft portion in accordance with the distance between the swinging central shaft portion and the shaft supporting portion,
Wherein the connection line includes a bent portion having a bent shape and the bent portion is provided inside the lower casing of the swing arm connected to the connecting shaft portion.
Wherein the connection line is composed of a plurality of line components,
Wherein the plurality of line elements comprise:
Two intermediate rigid wiring lines which are disposed inside the swinging arm and which are individually fixed to the swinging arm and which extend and retract each other in accordance with the expansion and contraction of the swinging arm by the extending and contracting mechanism,
And an intermediate flexible line arranged inside the swinging arm and connected between the two intermediate rigid wiring lines and having flexibility so as to reduce the amount of bending in accordance with an increase in the distance between the two intermediate rigid wiring lines, .
Wherein the pivot center shaft portion is provided as a proximal rotating portion that rotates with respect to the casing about a rotation axis along the axial direction of the pivot center shaft portion,
The connection line includes:
A base end rotation wiring fixed to the base end rotation part and being a rigid body rotating following the rotation of the base end rotation part,
A base fixed wiring that is a rigid body fixed to the casing,
A base end which is provided so as to be able to be wheeled by its own weight and which is connected between the base end rotation wiring and the base end fixed wiring and reduces the amount of bending according to an increase in the distance between the base end rotation wiring and the base end fixed wiring Line.
Wherein the connection shaft portion is provided as a tip rotation portion that rotates with respect to the processing portion about a rotation axis along an axial direction of the swinging central axis portion,
The connection line includes:
A distal rotating wire fixed to the distal rotating part and being a rigid body rotating following the rotation of the distal rotating part,
A distal end translating wiring fixed to the processing portion and being a rigid body that follows the movement of the processing portion and translates with the processing portion,
And a distal end connected to between the distal rotation wiring and the distal rotation wiring so as to reduce the amount of deflection in accordance with an increase in the distance between the distal rotation wiring and the distal rotation wiring, Line.
A hollow pivotal arm located inside the casing, the hollow pivotal shaft including a hollow pivotal central shaft portion that is pivotally supported by the pivotal shaft support portion fixed to the casing so as to be rotatable with respect to the casing, and a hollow connecting shaft portion that is a swinging end The rocking arm,
And a film forming unit for forming a film on the substrate by moving a processing space facing the substrate in a direction orthogonal to the axial direction of the swinging central axis part and releasing a film forming material toward the substrate, A film forming part connected to the connection shaft part so that the connection shaft part can translate with the film forming part following the movement of the part and that rocks the swinging arm by movement of the film forming part,
And a connecting line which is located inside the swinging arm and is connected to a utility located outside the casing through the inside of the swinging central axis portion and connected to the film forming portion through the inside of the connecting shaft portion,
Wherein the film forming section has a shaft supporting section for rotatably supporting the connection shaft section with respect to the film forming section,
Wherein the swing arm includes a stretching mechanism that displaces the connecting shaft portion with respect to the swinging central shaft portion and expands and contracts the distance between the swinging central shaft portion and the connecting shaft portion,
The elongating and contracting mechanism changes a distance between the swinging central axis portion and the connecting shaft portion in accordance with the distance between the swinging central shaft portion and the shaft supporting portion,
Wherein the connection line includes a bent portion having a bent shape and the bent portion is provided inside the lower casing of the swing arm connected to the connecting shaft portion.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2013200558 | 2013-09-26 | ||
JPJP-P-2013-200558 | 2013-09-26 | ||
PCT/JP2014/074525 WO2015045980A1 (en) | 2013-09-26 | 2014-09-17 | Substrate processing device and film forming device |
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KR1020177003025A Division KR20170017004A (en) | 2013-09-26 | 2014-09-17 | Substrate processing device and film forming device |
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KR20160042168A KR20160042168A (en) | 2016-04-18 |
KR101763906B1 true KR101763906B1 (en) | 2017-08-01 |
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KR1020177003025A KR20170017004A (en) | 2013-09-26 | 2014-09-17 | Substrate processing device and film forming device |
KR1020167008733A KR101763906B1 (en) | 2013-09-26 | 2014-09-17 | Substrate processing device and film forming device |
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JP (1) | JP6009685B2 (en) |
KR (2) | KR20170017004A (en) |
CN (1) | CN105555996B (en) |
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WO (1) | WO2015045980A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009299176A (en) * | 2008-06-16 | 2009-12-24 | Samsung Mobile Display Co Ltd | Transfer apparatus and organic deposition device with the same |
JP2012012626A (en) | 2010-06-29 | 2012-01-19 | Hitachi High-Technologies Corp | Assist mechanism and assist method for conveying heavy load, and device and method for film deposition |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000178716A (en) * | 1998-12-15 | 2000-06-27 | Mitsubishi Electric Corp | Formation of film and device therefor |
JP2010040956A (en) * | 2008-08-08 | 2010-02-18 | Tokyo Electron Ltd | Substrate processing apparatus |
JP5231917B2 (en) * | 2008-09-25 | 2013-07-10 | 株式会社日立ハイテクノロジーズ | Deposition equipment |
US20110195562A1 (en) | 2008-10-16 | 2011-08-11 | Ulvac, Inc. | Sputtering Apparatus, Thin-Film Forming Method, and Manufacturing Method for a Field Effect Transistor |
WO2011135731A1 (en) * | 2010-04-28 | 2011-11-03 | 株式会社ユーテック | Substrate processing apparatus and method for manufacturing thin film |
-
2014
- 2014-09-17 KR KR1020177003025A patent/KR20170017004A/en not_active Application Discontinuation
- 2014-09-17 WO PCT/JP2014/074525 patent/WO2015045980A1/en active Application Filing
- 2014-09-17 CN CN201480047603.5A patent/CN105555996B/en active Active
- 2014-09-17 JP JP2015539136A patent/JP6009685B2/en active Active
- 2014-09-17 KR KR1020167008733A patent/KR101763906B1/en active IP Right Grant
- 2014-09-22 TW TW103132600A patent/TWI575095B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009299176A (en) * | 2008-06-16 | 2009-12-24 | Samsung Mobile Display Co Ltd | Transfer apparatus and organic deposition device with the same |
JP2012012626A (en) | 2010-06-29 | 2012-01-19 | Hitachi High-Technologies Corp | Assist mechanism and assist method for conveying heavy load, and device and method for film deposition |
Also Published As
Publication number | Publication date |
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CN105555996B (en) | 2017-03-22 |
JP6009685B2 (en) | 2016-10-19 |
WO2015045980A1 (en) | 2015-04-02 |
KR20160042168A (en) | 2016-04-18 |
KR20170017004A (en) | 2017-02-14 |
TW201516170A (en) | 2015-05-01 |
CN105555996A (en) | 2016-05-04 |
TWI575095B (en) | 2017-03-21 |
JPWO2015045980A1 (en) | 2017-03-09 |
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