KR101719260B1 - 스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법 - Google Patents

스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법 Download PDF

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Publication number
KR101719260B1
KR101719260B1 KR1020150153795A KR20150153795A KR101719260B1 KR 101719260 B1 KR101719260 B1 KR 101719260B1 KR 1020150153795 A KR1020150153795 A KR 1020150153795A KR 20150153795 A KR20150153795 A KR 20150153795A KR 101719260 B1 KR101719260 B1 KR 101719260B1
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KR
South Korea
Prior art keywords
control unit
wireless transceiver
unit
smart
electrostatic chuck
Prior art date
Application number
KR1020150153795A
Other languages
English (en)
Korean (ko)
Inventor
강창수
Original Assignee
(주)파웰이엔지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파웰이엔지 filed Critical (주)파웰이엔지
Priority to KR1020150153795A priority Critical patent/KR101719260B1/ko
Priority to PCT/KR2016/007564 priority patent/WO2017078246A1/fr
Application granted granted Critical
Publication of KR101719260B1 publication Critical patent/KR101719260B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H04B1/401—Circuits for selecting or indicating operating mode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020150153795A 2015-11-03 2015-11-03 스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법 KR101719260B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150153795A KR101719260B1 (ko) 2015-11-03 2015-11-03 스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법
PCT/KR2016/007564 WO2017078246A1 (fr) 2015-11-03 2016-07-12 Mandrin électrostatique intelligent, dispositif de traitement de substrat incluant ledit mandrin et procédé d'entraînement de module de communication associé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150153795A KR101719260B1 (ko) 2015-11-03 2015-11-03 스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법

Publications (1)

Publication Number Publication Date
KR101719260B1 true KR101719260B1 (ko) 2017-03-23

Family

ID=58496002

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150153795A KR101719260B1 (ko) 2015-11-03 2015-11-03 스마트 정전 척, 그를 포함하는 기판 처리 장치, 및 그의 통신 모듈 구동 방법

Country Status (2)

Country Link
KR (1) KR101719260B1 (fr)
WO (1) WO2017078246A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020041606A1 (fr) * 2018-08-24 2020-02-27 Applied Materials, Inc. Ensemble mandrin électrostatique et procédé de fabrication de mandrin électrostatique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050056757A (ko) * 2003-12-10 2005-06-16 삼성전자주식회사 이온화 공정 챔버
JP2008047564A (ja) * 2006-08-10 2008-02-28 Tokyo Electron Ltd 真空処理装置、静電チャックの診断方法及び記憶媒体
KR20150002120A (ko) * 2013-06-28 2015-01-07 엘지디스플레이 주식회사 정전척 시스템

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5812361A (en) * 1996-03-29 1998-09-22 Lam Research Corporation Dynamic feedback electrostatic wafer chuck
US6215640B1 (en) * 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
KR20050018063A (ko) * 2003-08-13 2005-02-23 삼성전자주식회사 반도체 제조장치의 기판 척킹/디척킹 장치 및 그의 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050056757A (ko) * 2003-12-10 2005-06-16 삼성전자주식회사 이온화 공정 챔버
JP2008047564A (ja) * 2006-08-10 2008-02-28 Tokyo Electron Ltd 真空処理装置、静電チャックの診断方法及び記憶媒体
KR20150002120A (ko) * 2013-06-28 2015-01-07 엘지디스플레이 주식회사 정전척 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020041606A1 (fr) * 2018-08-24 2020-02-27 Applied Materials, Inc. Ensemble mandrin électrostatique et procédé de fabrication de mandrin électrostatique

Also Published As

Publication number Publication date
WO2017078246A1 (fr) 2017-05-11

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