KR101716856B1 - Elevating unit for substrate stage and apparatus for processing substrate having the same - Google Patents

Elevating unit for substrate stage and apparatus for processing substrate having the same Download PDF

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Publication number
KR101716856B1
KR101716856B1 KR1020160000927A KR20160000927A KR101716856B1 KR 101716856 B1 KR101716856 B1 KR 101716856B1 KR 1020160000927 A KR1020160000927 A KR 1020160000927A KR 20160000927 A KR20160000927 A KR 20160000927A KR 101716856 B1 KR101716856 B1 KR 101716856B1
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South Korea
Prior art keywords
frame
support frame
substrate
drive
driving
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KR1020160000927A
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Korean (ko)
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리경봉
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(주)제이피엘
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Publication of KR101716856B1 publication Critical patent/KR101716856B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

In order to provide a substrate stage elevating unit and a substrate processing apparatus including the substrate stage elevating unit in which vibrations and impacts are reduced during a lifting operation, the present invention provides a substrate stage elevating unit comprising a support frame connected to a substrate stage, And a cushioning portion for allowing a contact surface of the support frame and the drive frame to be in contact with each other so as to alleviate the vibration applied to the substrate stage at the contact between the drive frame and the drive frame. Accordingly, vibration and impact in the lifting operation can be reduced, thereby improving the yield of the display substrate and manufacturing a high-quality display substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate stage elevating unit and a substrate processing apparatus including the substrate stage elevating unit.

The present invention relates to a substrate stage lifting unit and a substrate processing apparatus including the same, and more particularly, to a substrate stage lifting unit for lifting and lowering a substrate stage on which a display substrate is supported, and a substrate processing apparatus including the same.

In general, display substrates are collectively referred to as flat panel display substrates such as LCDs, OLEDs, and PDPs. A manufacturing process of a display substrate will be described. A pair of pre-manufactured substrates are bonded together to complete a display substrate.

Such a conventional technique for a substrate bonding process has already been disclosed in Korean Patent Laid-Open Publication No. 2004-0043207 (Liquid crystal display device manufacturing process substrate bonding apparatus, 2004.05.24.). The above-mentioned patents support and align a pair of substrates pre-fabricated on a stage arranged to face each other, and cause a pair of substrates to be attached to each other in accordance with the lifting and lowering operation of the lifting unit connected to the stage.

However, in the conventional substrate bonding process, vibration and impact generated in the lifting and lowering operation of the lifting unit can be applied to the stage connected to the lifting unit. Therefore, in the conventional substrate laminating process, the pre-aligned substrate flows according to the generation of the flow of the stage, so that the laminating error may occur in the laminating process.

Korean Patent Laid-Open Publication No. 2004-0043207 (Liquid Crystal Display Device Manufacturing Process Coating Device, 2004.05.24.)

An object of the present invention is to provide a substrate stage lifting unit in which vibration and impact are reduced in a lifting operation and a substrate processing apparatus including the same.

The substrate stage lifting unit according to the present invention includes: a support frame connected to a substrate stage; a driving frame which is in close contact with one end of the supporting frame and moves up and down the supporting frame; And a cushioning portion for allowing a contact surface of the support frame and the drive frame to contact with each other at multiple points so as to alleviate vibrations.

The buffer portion may include a plurality of protrusions protruding from the one end of the driving frame facing the one end of the support frame toward the support frame.

The protrusion may be provided in a hemispherical shape protruding toward the support frame.

The plurality of protrusions may be uniformly formed on one end of the driving frame.

The plurality of protrusions may be uniformly formed in one edge region of the driving frame.

The support frame, the drive frame, and the buffer may be respectively formed of a rigid material including stainless steel.

The substrate stage lifting unit may further include a guide portion for guiding the lifting and lowering of the support frame and the drive frame outside the support frame and the drive frame to prevent eccentricity between the support frame and the drive frame.

The buffer portion may include a plurality of protrusions protruding from one end of the support frame toward the drive frame.

According to another aspect of the present invention, there is provided a substrate processing apparatus including a process chamber in which a substrate is loaded, a substrate stage disposed inside the process chamber and supporting the substrate, and a lift unit connected to the substrate stage to lift the substrate stage The lifting unit includes a support frame connected to the substrate stage, a driving frame which is in close contact with one end of the supporting frame and moves up and down the supporting frame, and a vibration applied to the substrate stage during contact between the supporting frame and the driving frame, So that the contact surface between the support frame and the drive frame contacts the multi-point contact.

The buffer portion may include a plurality of protrusions protruding from the one end of the driving frame facing the one end of the support frame toward the support frame.

The protrusion may be provided in a hemispherical shape protruding toward the support frame.

The plurality of protrusions may be uniformly formed on one end of the driving frame.

The plurality of protrusions may be uniformly formed in one edge region of the driving frame.

The support frame, the drive frame, and the buffer may be respectively formed of a rigid material including stainless steel.

The elevating unit may further include a guide unit for guiding the elevation and the elevation of the support frame and the drive frame outside the support frame and the drive frame to prevent eccentricity between the support frame and the drive frame.

The buffer portion may include a plurality of protrusions protruding from one end of the support frame toward the drive frame.

The substrate processing apparatus may further include a driving chamber disposed under the processing chamber and supporting the process chamber, wherein the elevating unit is disposed therein, and a supporting portion for supporting the elevating unit within the driving chamber, A plurality of partition walls extending from a bottom surface of the driving chamber in a longitudinal direction of the lifting unit to form a space in which the lifting and lowering unit is accommodated, and a support plate which is seated on one end of the plurality of partition walls, . ≪ / RTI >

The substrate processing apparatus may further include an elevation guide unit disposed between the process chamber and the support plate and guiding the elevation of the support frame.

Wherein the substrate processing apparatus further includes a stage disposed within the process chamber facing the substrate stage and supporting another substrate to be bonded to the substrate, wherein the elevation unit includes a process of aligning the substrates, The substrate stage can be moved up and down in at least one of the processes.

The substrate stage lifting unit and the substrate processing apparatus including the substrate stage lifting unit according to the present invention have the effect of reducing the vibration and impact in the lifting operation and improving the yield of the display substrate and manufacturing the display substrate of good quality.

The technical effects of the present invention are not limited to the effects mentioned above, and other technical effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a schematic view showing a substrate processing apparatus according to this embodiment.
2 is a schematic view showing a substrate stage lifting unit of the substrate processing apparatus according to the present embodiment.
3 is a plan view showing a buffering portion of the substrate stage lifting unit according to the present embodiment.
4 is a plan view of a buffer stage of a substrate stage lifting unit according to another embodiment.
5 is a flowchart showing a substrate processing method according to the present embodiment.
6 to 9 are process drawings showing a substrate processing method according to the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the disclosed embodiments, but may be implemented in various forms, and the present embodiments are not intended to be exhaustive or to limit the scope of the invention to those skilled in the art. It is provided to let you know completely. The shape and the like of the elements in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the drawings.

FIG. 1 is a schematic view showing a substrate processing apparatus according to this embodiment, and FIG. 2 is a schematic view showing a substrate stage lifting unit of the substrate processing apparatus according to this embodiment. And Fig. 3 is a plan view showing a buffering portion of the substrate stage lifting unit according to the present embodiment.

1 to 3, the substrate processing apparatus according to the present embodiment may be provided with a substrate adhering apparatus 100 for adhering a substrate. However, this is an embodiment for explaining the present embodiment, and the substrate processing apparatus may be variously provided, such as a substrate deposition apparatus and a substrate etching apparatus.

Meanwhile, the substrate adhering apparatus 100 may include a process chamber 200 and a driving chamber 300.

First, the process chamber 200 is formed with a process region in which a substrate adhering process is performed. Here, the process chamber 200 may include an upper chamber 210 and a lower chamber 230.

The upper chamber 210 forms an upper region of the process chamber 200 and may be provided with an upper stage 211 for supporting the first substrate S 1 to be transferred into the process chamber 200. The upper stage 211 is provided with a first substrate supporting portion 211a for supporting the upper surface of the first substrate S1. The first substrate supporting part 211a may be provided in various ways such as an adhesive device for adhering the first substrate S1 or an adsorption device for adsorbing the first substrate S1. ) Is not limited.

The lower chamber 230 forms a lower region of the process chamber 200. Here, the lower chamber 230 is connected to the chamber lifting unit 220 so that the distance from the upper chamber 210 can be adjusted. The lower chamber 230 is spaced apart from the upper chamber 210 at the entrance and exit of the substrate to form an entrance and exit path of the substrate and is closely contacted to the upper chamber 210 in the process of substrate adherence, .

The lower chamber 230 may be provided with a lower stage 231 for supporting the second substrate S2 transferred into the process chamber 200. The lower stage 231 may be provided with a second substrate supporting portion 231a for supporting the lower surface of the second substrate S2. Here, the second substrate supporting portion 231a may be variously provided, such as an adhesive apparatus for adhering the second substrate S2 or an adsorption apparatus for adsorbing the second substrate S2, and the second substrate supporting portion 231a ) Is not limited.

The lower stage 231 is provided with a lift pin 231c for seating the second substrate S2 on the lower stage 231 at the entrance and exit of the substrate or for separating the second substrate S2 from the lower stage 231 . The lift pins 231c may be provided as a plurality of support pins 231ca passing through the lower stage 231 and a lift module 231cc for lifting and lowering the support pins 231ca.

Meanwhile, a camera 250 and a light source 270 may be installed in the process chamber 200.

The camera 250 may be disposed above the upper chamber 210. Here, the camera 250 can observe the inside of the process chamber 200 through the imaging hole formed in the upper chamber 210. The camera 250 photographs an alignment mark that can be formed on each of the first and second substrates S1 and S2 so that the first and second substrates S1 and S2 are positioned at the correct attachment points .

The light source 270 is disposed above the upper chamber 210 to allow light to be emitted into the process chamber 200 through the illumination holes formed in the upper chamber 210. Accordingly, the camera 250 can accurately observe the alignment mark according to the light irradiated into the process chamber 200 during the alignment mark photographing.

On the other hand, the lower stage 231 may align the first and second substrates S1 and S2 according to a signal provided from the camera 250. [ For example, the lower stage 231 may be provided in a UVW stage for moving the second substrate S2 supported on the upper side in the x-axis, the y-axis and the z-axis, The position of the second substrate S2 can be aligned to correspond to the first substrate S1.

On the other hand, the driving chamber 300 is disposed below the process chamber 200. The driving chamber 300 supports a plurality of lifting units 400 that lift and lower the lower stage 231 in the alignment of the second substrate S2 and the adhesion of the first and second substrates S1 and S2.

The driving chamber 300 includes a lower plate 310 supported by the base 10. A plurality of level feet 311 may be disposed on the lower surface of the lower plate 310 to maintain a parallel state of the process chamber 200 disposed above the driving chamber 300. The driving chamber 300 may include a sidewall 330 disposed between the process chamber 200 and the lower plate 310 to define a space in which the elevator unit 400 is disposed within the driving chamber 300 .

A support part 350 for supporting the plurality of elevating units 400 is provided in the driving chamber 300. The supporting unit 350 may be configured to allow the position of the lifting unit 400 to be fixed in the driving chamber 300 and prevent the vibration and impact generated in the lifting and lowering operation of the lifting unit 400 from being transmitted to the process chamber 200 . The support unit 350 includes a plurality of barrier ribs 351 extending from the lower plate 310 toward the process chamber 200 and capable of supporting the longitudinal direction of the elevator unit 400 and a plurality of barrier ribs 351, (Not shown).

On the other hand, the plurality of elevating units 400 are respectively supported by the supporting portions 350, and perform the elevating operation together or individually. The lifting unit 400 may include a power unit 410, a driving frame 430, a support frame 450, a guide unit 470, and a buffer unit 490.

The power unit 410 is disposed below the lift unit 400 and generates power for lifting and lowering the lower stage 231. Here, the power unit 410 may be provided as a power unit such as a motor. However, the power unit 410 is not limited to the power unit 410 according to an embodiment of the present invention.

The driving frame 430 is raised and lowered by the power provided from the power section 410. Here, when the power unit 410 is provided as a motor, the driving frame 430 may be provided in the form of a ball screw so as to be able to move up and down based on the rotational force provided from the power unit 410.

The support frame 450 may be disposed on the upper portion of the driving frame 430 so that the lower stage 231 can be moved up and down according to the vertical movement of the driving frame 430. For example, the upper end of the support frame 450 is connected to the lower surface of the lower stage 231, and the lower end of the support frame 450 is in contact with the upper end of the driving frame 430. At this time, the support frame 450, one end of which is exposed above the support part 350, is arranged to pass through the support plate 353 and the lower chamber 230 so that the lower stage 231 is moved up and down .

The guide unit 470 guides the elevating and lowering operations of the driving frame 430 and the supporting frame 450 to prevent eccentricity from being generated between the driving frame 430 and the supporting frame 450. For example, the guide portion 470 may be provided in a bushing shape that encloses a space between the driving frame 430 and the supporting frame 450 to guide the elevating and lowering operations of the driving frame 430 and the supporting frame 450.

The cushioning portion 490 allows the upper end of the driving frame 430 and the lower end of the supporting frame 450, which are in surface contact with each other in the ascending and descending of the lower stage 231, Although the buffering portion 490 is formed on the upper end of the driving frame 430 in the following description, the buffering portion 490 may be formed on the lower end of the supporting frame 450 As shown in FIG.

The buffer part 490 may include a plurality of protrusions 491 protruding upward from the upper end of the driving frame 430 toward the lower end of the supporting frame 450. The plurality of protrusions 491 may be formed on the entire upper surface of the upper end of the driving frame 430. The upper region contacting the lower end of the supporting frame 450 may be rounded, for example, in a hemispherical shape.

This buffering portion 490 is generated at the upper end of the driving frame 430 and the lower end of the supporting frame 450 in the ascending and descending of the lower stage 231 by bringing the driving frame 430 and the supporting frame 450 into multi- Thereby reducing possible vibrations and impacts.

For example, when the driving frame 430 and the supporting frame 450 are in contact with each other, not only the vibrations and impacts generated in the contact between the driving frame 430 and the supporting frame 450 are large, And may be applied to the lower stage 231 through the frame 450. As a result, an error occurs in the position of the second substrate S2 supported by the lower stage 231, and consequently, a process error may occur in the adhesion of the first and second substrates S1 and S2.

The buffering portion 490 may be configured such that the upper end of the driving frame 430 and the lower end of the supporting frame 450 are brought into multi-point contact with each other so that the vibration and the impact amount generated in contact between the driving frame 430 and the supporting frame 450 . This minimizes the vibration and impact applied to the lower stage 231 through the support frame 450 and prevents an error in the position of the second substrate S2 supported by the lower stage 231 .

The buffer part 490 may be made of the same material as the driving frame 430. For example, when the driving frame 430 and the supporting frame 450 are made of stainless steel, the buffer part 490 may be made of stainless steel . Particularly, when the buffer part 490 is provided with a rigid body such as stainless steel, the buffer part 490 is less deformed when the drive frame 430 and the support frame 450 are in contact with each other, have.

4, a plurality of protrusions 491 may be formed only in an upper edge region of the driving frame 430. In this case, Accordingly, only the rim region of the driving frame 430 and the supporting frame 450 can be brought into contact with each other at multiple points. At this time, the cushioning portion 490 formed only in the rim portion of the driving frame 430 not only reduces vibration and impact at the contact between the driving frame 430 and the supporting frame 450, There is an advantage that the manufacturing difficulty of the buffer part 490 can be lowered and the manufacturing efficiency can be improved.

An elevation guide unit 370 is provided between the support plate 353 and the process chamber 200. The elevation guide portion 370 is provided in a bushing shape to cover the upper portion of the support frame 450. Accordingly, the elevation guide unit 370 can smoothly raise and lower the support frame 450, and the flow of the support frame 450 can be minimized when the support frame 450 is lifted and lowered.

In addition, the process chamber 200 may be connected to an exhaust pump 290 for exhausting the inside of the process chamber 200 in the process of attaching the substrate. The exhaust pump 290 evacuates the process region to form a vacuum atmosphere within the process chamber 200.

Hereinafter, a substrate processing method according to the present embodiment will be described in detail with reference to the accompanying drawings. However, the above-described components will not be described in detail and will be denoted by the same reference numerals.

FIG. 5 is a flowchart showing a substrate processing method according to the present embodiment, and FIGS. 6 to 9 are process drawings showing a substrate processing method according to the present embodiment.

As shown in FIGS. 5 to 9, the substrate processing method according to the present embodiment will be described with reference to a substrate adhering step for adhering a pair of pre-manufactured substrates to one another.

The first and second substrates S1 and S2 are brought into the process chamber 200 with the upper chamber 210 and the lower chamber 230 being spaced apart from each other. At this time, the first substrate S1 is supported on the upper stage 211 and the second substrate S2 is seated on the lower stage 231 (S100, see FIG. 6).

Thereafter, the exhaust pump 290 may exhaust the inside of the process chamber 200 to form a vacuum atmosphere inside the process chamber 200, and the camera 250 may be provided on the first and second substrates S1 and S2 The alignment mark formed is photographed. The lower stage 231 controls the position of the second substrate S2 so that the alignment marks of the first and second substrates S1 and S2 correspond to each other, Are positioned at a cementing point to be adhered to each other.

Then, the elevating unit 400 raises the lower stage 231 so that the first and second substrates S1 and S2 are attached to each other. The support frame 450 supporting the lower stage 231 has a support protrusion 451 protruding from the outer diameter of the support frame 450 to extend from the upper portion of the guide portion 470 And may be separated from the driving frame 430 by being supported by the stopper 480 disposed on the driving frame 430.

Then, when the power unit 410 generates power for coalescing the first and second substrates S1 and S2, the driving frame 430 is raised toward the support frame 450. [ The cushioning portion 490 may be formed so that the contact surfaces of the drive frame 430 and the support frame 450 are brought into contact with each other at multiple points to reduce vibration and impact that may occur in contact between the drive frame 430 and the support frame 450 (S200, see Fig. 7). That is, the cushioning portion 490 originally reduces vibration and impact applied to the lower stage 231 to prevent the position of the second substrate S2 supported by the lower stage 231 from being changed by vibration and impact can do.

The support frame 450 moves up and down the lower stage 231 toward the upper stage 211 according to the continuous raising and lowering of the driving frame 430 so that the first and second substrates S1 and S2 are fixed to each other (S300, see Fig. 8).

The lowering stage 231 is lowered and the transfer robot transfers the first and second substrates S 1 and S 2 to which the transfer robot has completed the adhesion process from the process chamber 200, (S400, see Fig. 9).

In the present embodiment, however, the elevation unit 400 lifts the lower stage 231 at the time of attaching the first and second substrates S1 and S2. However, the elevation unit 400 includes the first and second The lower stage 231 can be moved up and down in the alignment of the substrates S1 and S2. Thus, the buffering part 490 may be arranged such that the driving frame 430 and the support frame 450 are brought into multi-point contact with each other even when the first and second substrates S1 and S2 are aligned, And can be prevented from being changed by impact.

As described above, the substrate stage elevating unit and the substrate processing apparatus including the substrate stage elevating unit can reduce vibrations and shocks during the elevating operation, thereby improving the yield of the display substrate and manufacturing a high quality display substrate.

An embodiment of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

100: substrate bonding apparatus
200: process chamber
300: drive chamber
400: Lift unit

Claims (19)

A support frame connected to the substrate stage;
A drive frame closely attached to one end of the support frame to move the support frame up and down;
A buffer for allowing a contact surface between the support frame and the drive frame to be multi-pointed so that vibration applied to the substrate stage at the contact between the support frame and the drive frame is alleviated; And
And a chamber disposed under the substrate stage and having a support portion for supporting the support frame, the drive frame, and the buffer,
The support portion includes a plurality of partition walls extending in a longitudinal direction of the drive frame from a bottom surface of the chamber and defining a space for receiving the support frame, the drive frame, and the buffer, And a support plate on which a hole through which the support frame passes is formed.
The method according to claim 1,
The buffer
And a plurality of protrusions protruding from one end of the drive frame facing one end of the support frame toward the support frame.
3. The method of claim 2,
The protrusion
Wherein the support frame is provided in a hemispherical shape protruding toward the support frame.
The method according to claim 2 or 3,
The plurality of protrusions
Wherein the driving frame is uniformly formed on one entire surface of the driving frame.
The method according to claim 2 or 3,
The plurality of protrusions
Wherein the driving frame is uniformly formed at one edge region of the driving frame.
3. The method of claim 2,
Wherein the support frame, the drive frame,
Wherein the substrate stage lifting unit is provided with a rigid material including stainless steel.
The method according to claim 1,
Further comprising a guiding part for guiding the lifting and lowering of the supporting frame and the driving frame outside the supporting frame and the driving frame to prevent eccentricity between the supporting frame and the driving frame.
The method according to claim 1,
The buffer
And a plurality of protrusions protruding from one end of the support frame toward the drive frame.
A process chamber into which a substrate is introduced;
A substrate stage disposed within the process chamber and supporting the substrate;
An elevating unit connected to the substrate stage to elevate the substrate stage;
A drive chamber disposed below the process chamber and supporting the process chamber, the drive unit having the lift unit disposed therein; And
And a support for supporting the elevating unit inside the driving chamber,
Wherein the lifting unit comprises: a support frame connected to the substrate stage; A drive frame closely attached to one end of the support frame to move the support frame up and down; And a cushioning portion for causing a contact surface of the support frame and the drive frame to contact with each other so as to alleviate the vibration applied to the substrate stage at the contact between the support frame and the drive frame,
The supporting portion includes a plurality of partitions extending from the bottom surface of the driving chamber in the longitudinal direction of the elevating unit to form a space in which the elevating unit is accommodated and a hole that is seated on one end of the plurality of partitions, And a support plate formed on the substrate.
10. The method of claim 9,
The buffer
And a plurality of protrusions protruding from one end of the drive frame facing one end of the support frame toward the support frame.
11. The method of claim 10,
The protrusion
Wherein the support frame is provided in a hemispherical shape protruding toward the support frame.
The method according to claim 10 or 11,
The plurality of protrusions
Wherein the driving frame is uniformly formed on one entire surface of the driving frame.
The method according to claim 10 or 11,
The plurality of protrusions
Wherein the driving frame is uniformly formed at one edge region of the driving frame.
11. The method of claim 10,
Wherein the support frame, the drive frame,
And each of the plurality of substrates is provided with a rigid material including stainless steel.
10. The method of claim 9,
The elevating unit
Further comprising a guide portion for guiding the elevation of the support frame and the drive frame outside the support frame and the drive frame to prevent eccentricity between the support frame and the drive frame.
10. The method of claim 9,
The buffer
And a plurality of protrusions protruding from one end of the support frame toward the drive frame.
delete 10. The method of claim 9,
Further comprising a lift guide portion disposed between the process chamber and the support plate and guiding the lifting and lowering of the support frame.
10. The method of claim 9,
Further comprising a stage disposed within the process chamber facing the substrate stage and supporting another substrate to be bonded to the substrate,
The elevating unit
Wherein the substrate stage is moved up and down in at least one of a process of aligning the substrates and a process of aligning the substrates.
KR1020160000927A 2016-01-05 2016-01-05 Elevating unit for substrate stage and apparatus for processing substrate having the same KR101716856B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324048A (en) * 2002-04-26 2003-11-14 Kyocera Corp Wafer heating device
KR20040043207A (en) 2002-11-16 2004-05-24 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
KR20090066773A (en) * 2007-12-20 2009-06-24 주식회사 에이디피엔지니어링 Apparatus for attaching substrates
JP2012182338A (en) * 2011-03-02 2012-09-20 Sekisui Chem Co Ltd Surface processing device and surface processing system
KR20140035132A (en) * 2012-09-13 2014-03-21 엘아이지에이디피 주식회사 Sealing apparatus of organic light emitting diodes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324048A (en) * 2002-04-26 2003-11-14 Kyocera Corp Wafer heating device
KR20040043207A (en) 2002-11-16 2004-05-24 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
KR20090066773A (en) * 2007-12-20 2009-06-24 주식회사 에이디피엔지니어링 Apparatus for attaching substrates
JP2012182338A (en) * 2011-03-02 2012-09-20 Sekisui Chem Co Ltd Surface processing device and surface processing system
KR20140035132A (en) * 2012-09-13 2014-03-21 엘아이지에이디피 주식회사 Sealing apparatus of organic light emitting diodes

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