KR101715619B1 - Lighting device - Google Patents

Abstract

The present invention relates to a lighting device which can improve productivity and strength of a product by facilitating fastening between parts, and improve radiating performance. The lighting device comprises: a module substrate on which at least one light emitting element can be mounted; a radiating frame having a rail part corresponding to a side surface of the substrate formed thereon so that the module substrate is fastened in a sliding manner to support a rear side of the module substrate; and a cover fastened to the radiating frame to protect an upper surface of the module substrate and formed of a transparent material to penetrate light generated from a light emitting device.

Description

Lighting device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting device, and more particularly, to a lighting device that can improve the productivity and strength of a product by facilitating fastening between parts and improve heat generating performance.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to impact and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on various types of boards or lead frames, and can be modularized for various purposes, unit or the like.

Conventional LED lighting apparatuses have a problem in that a high temperature heat is intensively generated in a light emitting element module substrate on which a plurality of LEDs are mounted, that is, a PCB, There has been inevitably a phenomenon in which the lifespan of the parts is reduced, a break phenomenon due to breakage of the wiring layer, and a substrate bending phenomenon.

In order to solve the high-temperature heat and heat accumulation phenomenon of such LED lighting apparatus, conventionally, various heat dissipating members fastened by using various fixtures such as a screw, a fixing pin and the like have been provided.

However, the conventional module substrate and the heat dissipating member are manufactured by a method in which they are fixed by fixing members, and the fastening time and process for fastening and disassembling the fixing member are cumbersome, and a separate tool such as a screwdriver or a wrench is required. And the module substrate is brought into thermal contact with the heat radiating member only in the vicinity of the fixing member in a close contact manner and the remaining portions are not widened in contact with each other,

It is an object of the present invention to solve the various problems including the above problems, and it is possible to easily fasten both the module substrate, the heat radiation frame and the cover in a sliding manner without a separate fixing device, This enables to reduce product production time and cost, and it is possible to make surface contact between the module substrate and the heat radiating frame, thus it is possible to greatly improve the heat radiation performance by increasing the heat transfer area. The reflection efficiency can be improved by forming a reflection blade having an inclined surface that can reduce the step difference with the module substrate and the reflection ink layer formed by printing on the surface can be used to greatly reduce the cost of the product And to provide a lighting device which enables the lighting device to be used. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided an illumination device including: a module substrate on which at least one light emitting device can be mounted; A rail portion having a shape corresponding to a side surface of the module substrate is formed so that the module substrate is fastened to the module substrate in a sliding manner so as to support the rear surface of the module substrate and a heat dissipation material A heat radiation frame formed; And a cover formed of a transparent material that is coupled to the heat dissipating frame to protect the upper surface of the module substrate and to transmit light generated from the light emitting device.

According to the present invention, the heat radiating frame may include a frame body having a surface corresponding to the module substrate so as to be in thermal contact with the rear surface of the module substrate, the frame body being formed as a whole long in the longitudinal direction; A first rail formed on one side of the frame body so that one side of the module substrate can be slidably inserted; And a second rail part facing the first rail part on the other side of the frame body so that the other side of the module board can be slidably inserted.

The illuminating device according to the present invention may further include a light emitting device which is formed to protrude outwardly of the frame body on the first rail and the second rail, And a reflection blade having a reflection surface formed on an upper surface thereof for reflection.

Also, according to the present invention, the inclined portion may be formed in the reflection blade to reduce a step difference from the module substrate.

In addition, according to the present invention, when the reflective blade is extended backward, the top depth of the rail can be smaller than the elastic deformation value so that the entrance is widened so that the module board can be hooked.

In addition, the module substrate may have a reflective ink layer printed on the upper surface thereof by a printing method, and a plurality of LEDs may be arranged long in the longitudinal direction.

Further, the lighting apparatus according to the present invention may further include a heat sink provided on a rear surface of the heat radiating frame, and the heat radiating frame may have a ventilation window or a radiating fin on the rear surface thereof.

The lighting device according to the present invention may further include an end bracket on which the cover and the heat dissipating frame are formed and the latching protrusion is engaged with the latching hole formed on the cover so as to be fastened laterally.

According to some embodiments of the present invention as described above, both the module substrate, the heat radiation frame, and the cover can be easily fastened, so that the fastening time and cost can be reduced, The heat transfer performance can be greatly improved by increasing the heat transfer area, the working time and cost can be further shortened, the reflection efficiency can be improved by forming the reflective blade, and the product cost can be improved by using the reflective ink layer It is possible to greatly reduce the cost. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating a lighting apparatus according to some embodiments of the present invention.
Fig. 2 is a cross-sectional view showing the illumination device of Fig. 1;
Fig. 3 is an exploded perspective view of the illuminating device of Fig. 1; Fig.
Fig. 4 is an enlarged perspective view showing a part of the illumination device of Fig. 3 in an enlarged manner. Fig.
5 is a bottom perspective view showing the illumination device of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions illustrated herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a perspective view illustrating a lighting device 100 in accordance with some embodiments of the present invention. 2 is a cross-sectional view showing the illumination device 100 of FIG. 1, and FIG. 3 is an exploded perspective view of the illumination device 100 of FIG.

1 to 3, a lighting apparatus 100 according to some embodiments of the present invention includes a module substrate 10, a heat radiation frame 20, and a cover 30 .

For example, as shown in FIGS. 1 to 3, the module substrate 10 includes at least one light emitting device, that is, a printed circuit board (PCB) Board.

More specifically, for example, the module substrate 10 can support the light emitting device and other components, and is electrically connected to the light emitting device and other components, and can be made of a mixed material having suitable mechanical strength for the light emitting device and other components.

More specifically, for example, the module substrate 10 may be formed of a resin, a glass, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition , PPA, polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, Epoxy Mold Compound, Photoimageable solder resist and the like can be applied.

In addition, the module substrate 10 may be an insulating substrate of a printed circuit board (PCB) or a flexible printed circuit board (FPCB) of a thin flexible material.

In addition, the module substrate 10 may be formed of an insulated metal such as aluminum, copper, zinc, tin, lead, gold, silver, or the like, and may be a perforated or bent lead frame or plate.

Further, for example, as shown in Fig. 2, the module substrate 10 may be formed with a reflective ink layer 11 printed on the upper surface in a printing manner. Here, the reflective ink layer 11 is formed of a reflective paint component such as white or silver series titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, Light-reflecting materials such as a series or a metal-based component can be contained. However, the present invention is not limited to this, and a reflective paint or pigment having high reflectance may be included.

Therefore, the unit cost of the product can be greatly reduced by using the reflective ink layer 11 formed on the surface of the printing method in comparison with the conventional injection method or the like.

Fig. 4 is an enlarged perspective view showing a part of the illumination device 100 of Fig. 3 in an enlarged manner.

1 to 4, the heat radiating frame 20 is mounted on the module substrate 10 so that the module substrate 10 is coupled in a sliding manner to support the rear surface of the module substrate 10, And a heat dissipation structure formed of a heat dissipation material so that the heat generated from the light emitting device can be transmitted to the outside.

For example, the heat dissipation frame 20 may be formed of a metal material such as aluminum, copper, zinc, tin, lead, gold, silver and the like, Can be made of a material having suitable mechanical strength for supporting other parts and being thermally connected with them.

More specifically, for example, as shown in FIG. 4, the heat-radiating frame 20 has a module substrate-corresponding surface formed so as to be in thermal contact with the rear surface of the module substrate 10, A first rail part 21 formed at one side of the frame body 23 so that one side of the module board 10 can be slidably inserted and a second rail part 21 formed at one side of the module board 10 And a second rail 22 formed on the other side of the frame body 23 so as to face the first rail 21 so that the other side of the frame body 23 can be slidably inserted.

Therefore, since the heat radiating frame 20 can be fastened to the module substrate 10 in a sliding manner by using the first and second rails 21 and 22, It is possible to easily fasten the module board 10 and the heat radiating frame 20 in a sliding manner, thereby reducing the time and cost of the fastening, thereby reducing the production time and cost of the product, 10) and the front surface of the heat dissipating frame (20), so that the heat dissipating performance can be greatly improved by increasing the heat transfer area.

For example, the heat radiating frame 20 is formed to protrude from the first rail part 21 and the second rail part 22 in the outer direction of the frame body 23, and the cover 30 The light emitting device may further include a reflection wing 24 formed on the upper surface thereof to reflect light emitted from the light emitting device.

Therefore, the light generated from the light emitting device can be reflected upward through the reflection wing 24, thereby improving the luminous efficiency and widening the irradiation area.

The inclined portion 25 may be formed on the reflection wing portion 24 so as to reduce a step with respect to the module substrate 10. Therefore, the light generated from the light emitting element is blocked by the step, and is prevented from being reflected and spread to the side, and the light can be guided to be concentrated upward.

2, when the reflective blade portion 24 is turned backward, the inlet is enlarged so that the module substrate 10 can be hooked on the upper portion of the rail portion 21 (22) (D) may be formed smaller than the elastic deformation value.

Therefore, it is possible to improve the reflection efficiency by using the reflection wing portion 24 having the inclined portion 25 that can reduce the level difference from the module substrate 10, 22 are elastically deformed, it is possible to engage with a hooking method other than a sliding method, that is, a hooking method, so that the working time and cost can be further shortened.

5 is a bottom perspective view showing the lighting apparatus 100 of Fig.

1 to 5, the cover 30 is coupled to the heat radiating frame 20 in a sliding manner to protect the upper surface of the module substrate 10, A cover rail R having a shape corresponding to the protrusion T formed on the side surface is formed and may be formed of a light transmitting resin material transmitting light generated from the light emitting device.

Therefore, the heat radiating frame 20 can be easily fastened to the cover 30 in a sliding manner by using the cover rail portion R. Therefore, The heat dissipating frame 20 can be easily fastened, so that the fastening time and cost can be reduced, thereby reducing the production time and cost of the product.

As shown in FIG. 2, the cross-sectional shape of the heat radiating frame 20 is bent into a very complicated shape and can be produced at a very low cost through a rolling process using aluminum, magnesium, zinc, or the like Such complex shapes can greatly improve strength and durability.

1 to 5, a lighting apparatus 100 according to some embodiments of the present invention includes a cover 30 and a heat radiating frame 20 so as to be fastened to the sides of the cover 30 and the heat radiating frame 20, And an end bracket 40 on which a latching protrusion K is formed to be engaged with a latching hole G formed in the latch 30.

Therefore, the illumination device 100 according to some embodiments of the present invention can be cut and used in a predetermined length in the longitudinal direction according to the required specifications, usage environment, and the like, and the above-described end bracket 40 It can be tightened in a latching manner to improve aesthetic appearance and protect internal parts from external foreign matter.

1 to 5, the lighting apparatus 100 according to some embodiments of the present invention includes a heat sink H mounted on a rear surface of the heat radiating frame 20, Various types of components such as a ventilation window or a radiating fin P and a mica ring type fixing device F may be additionally provided on the rear surface of the main body 20.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Module substrate
11: reflective ink layer
20: Heat radiating frame
21: 1st leg part
22: 2nd railway
23: frame body
24: reflection wing
25:
30: cover
100: Lighting device

Claims (8)

A module substrate on which at least one light emitting element can be mounted;
A rail portion having a shape corresponding to a side surface of the module substrate is formed so that the module substrate is fastened to the module substrate in a sliding manner so as to support the rear surface of the module substrate and a heat dissipation material A heat radiation frame formed; And
And a cover formed of a transparent material that is coupled to the heat dissipating frame to protect an upper surface of the module substrate and transmit light generated from the light emitting device,
The heat-
A frame body having a surface corresponding to the module substrate so as to be in thermal contact with the rear surface of the module substrate, the frame body being formed as a whole lengthwise;
A first rail formed on one side of the frame body so that one side of the module substrate can be slidably inserted; And
A second rail part formed on the other side of the frame body so as to face the first rail part so that the other side surface of the module substrate can be slidably inserted; And
And a reflection surface formed on the upper surface so as to be able to reflect the light generated in the light emitting device, the reflection surface being formed inside the cover and projecting in the outer direction of the frame body to the first and second rails And a reflection wing portion
Wherein the reflective blade has an inclined portion to reduce a level difference with respect to the module substrate, and the inclined portion is widened when the reflective blade is widened backward, so that the upper depth of the rail portion is elastically deformed Lt; / RTI > delete delete delete delete The method according to claim 1,
Wherein the module substrate has a reflective ink layer formed on a top surface thereof to be printed by a printing method, and a plurality of LEDs are arranged in a lengthwise direction and mounted. The method according to claim 1,
A cover rail portion having a shape corresponding to a protrusion formed on a side surface of the heat radiating frame is formed so as to protect the upper surface of the module substrate by being slidably coupled with the heat radiating frame,
And a heat sink mounted on a rear surface of the heat dissipation frame,
Wherein the heat radiating frame has a ventilation window or a radiating fin formed on a rear surface thereof. The method according to claim 1,
And an end bracket formed with a latching protrusion which is engaged with a latching hole formed in the cover so as to be able to be locked laterally of the cover and the heat radiation frame.

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