KR20180124210A - Lighting device - Google Patents

Abstract

The present invention relates to a lighting device capable of preventing short between components and increasing safety and marketability of a product by reducing a thickness of a product. The lighting device comprises: a light guide plate having an upper surface and a lower surface formed in a flat shape; a module substrate mounted on a part of a side surface of the light guide plate and having at least one light emitting element mounted on the light guide plate to emit light toward the light guide plate; and a heat dissipation frame having a light guide plate accommodating unit capable of accommodating a part of the light guide plate on one side of the heat dissipation frame so that the light guide plate and the module substrate are fixed to each other and having a module substrate accommodating unit accommodating the module substrate on the other side. The module substrate has a shape in which an upper portion of the module substrate has a first cross section length and a lower portion of the module substrate has a second cross section length shorter than the first cross section length centered on the light emitting element. In the heat dissipation frame, a sealing rail unit supporting a part of a front surface, a top surface, and a rear surface of the module substrate may be formed at the top of the module substrate accommodating unit so that the module substrate is slidably fastened, a front surface corresponding unit of the module substrate may be opened at a lower portion of the module substrate accommodating unit and an open rail unit corresponding to a lower surface and the rear surface may be formed.

Description

Lighting device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting apparatus, and more particularly, to a lighting apparatus that can prevent short-circuiting between parts and reduce the thickness of the product, thereby improving safety and merchantability of the product.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, and can be driven at a low voltage. In addition, these LEDs are resistant to impact and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on various types of boards or lead frames, and can be modularized for various purposes, unit or the like.

Conventional LED lighting apparatuses have a problem in that a high temperature heat is intensively generated in a light emitting element module substrate on which a plurality of LEDs are mounted, that is, a PCB, There has been inevitably a phenomenon in which the lifespan of the parts is reduced, a break phenomenon due to breakage of the wiring layer, and a substrate bending phenomenon.

In order to solve the high-temperature heat and heat accumulation phenomenon of such LED lighting apparatus, conventionally, various heat dissipating members fastened by using various fixtures such as a screw, a fixing pin and the like have been provided.

However, since the heat radiating member such as the heat radiating frame uses a metal material having high thermal conductivity, if a high voltage is applied to the light emitting element provided on the module substrate, a short circuit is generated between the light emitting element and the heat radiating frame, And the like.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a heat dissipation frame in which a closed rail part is formed in an inner part of a heat dissipation frame and an open rail part is formed in an inner part thereof It is an object of the present invention to provide a lighting apparatus that can secure a sufficient short-circuit distance and can increase the density of components by using an open rail unit to minimize the thickness of the product, thereby greatly improving the safety and commerciality of the product The purpose. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided an illumination device comprising: a light guide plate having a top surface and a bottom surface formed in a flat shape; A module substrate mounted on a part of the side surface of the light guide plate and having at least one light emitting element mounted on the light guide plate so as to emit light toward the light guide plate; And a heat radiating frame having a light guide plate accommodating portion capable of accommodating a part of the light guide plate on one side thereof and a module substrate accommodating portion accommodating the module substrate on the other side so that the light guide plate and the module substrate are fixed to each other, Wherein the module board has a shape in which an upper portion has a first section length and a lower portion has a second section length shorter than the first section length with the light emitting element as a center, An upper portion of the module substrate accommodating portion is formed with a closed rail portion for supporting a part of the front surface of the module substrate, an upper surface and a rear surface of the module substrate accommodating portion, and a front surface corresponding portion of the module substrate is opened, An open rail portion corresponding to the open rail portion can be formed.

Further, a lighting device according to the present invention may include: a cover provided on a lower surface of the light guide plate; And a reflection panel installed on the upper surface of the light guide plate, wherein the light guide plate accommodation portion of the heat radiation frame is formed to accommodate the light guide plate, the cover, and the reflection panel at the same time, A first space may be formed between the sealed rail and the reflective panel so as to secure a sufficient short-circuit distance with the device, and a second space may be formed between the open rail and the cover.

According to the present invention, the heat radiating frame includes an upper wing portion for supporting an upper surface of the reflection panel, a lower wing portion for supporting a lower surface of the cover, A plurality of first radiating fins protruding in the direction of the first radiating fins may be formed.

According to the present invention, the heat dissipation frame may have an inner wall corresponding to the module substrate to support the rear surface of the module substrate, and a third space may be formed on the rear surface of the inner wall corresponding to the module substrate.

Also, according to the present invention, a plurality of second radiating fins may be formed in the third space.

In addition, according to the present invention, the heat radiating frame may further include a corner bracket disposed on four side surfaces of the light guide plate, the corner bracket connecting the heat radiating frame and the adjacent heat radiating frame.

According to the present invention, the corner bracket may include a heat radiating frame accommodating portion for accommodating the heat radiating frame at one side thereof, and a module board corresponding portion corresponding to one end of the module substrate at the other side thereof.

According to some embodiments of the present invention, when the module substrate is slidably coupled to the inside of the heat dissipation frame, a closed rail part is formed in an inner part of the heat dissipation frame and an open rail part is formed in the inner side part, And the thickness of the product can be minimized by increasing the density of the parts by using the open rail part. Thus, the safety and the merchantability of the product can be greatly improved. Of course, the scope of the present invention is not limited by these effects.

1 is an external perspective view showing a lighting apparatus according to some embodiments of the present invention.
Fig. 2 is an exploded perspective view of the illuminating device of Fig. 1; Fig.
Fig. 3 is an enlarged perspective view showing an enlarged part A of the illumination device of Fig. 2; Fig.
Fig. 4 is an enlarged perspective view showing an enlarged view of a part B of the illuminating device of Fig. 2;
5 is an enlarged cross-sectional view of the illumination device of Fig.
Fig. 6 is a perspective view showing a corner bracket of the illumination device of Fig. 2;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term " and / or " includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise " and / or " comprising " when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is an external perspective view showing a lighting device 100 according to some embodiments of the present invention. 2 is an exploded perspective view showing the illumination device 100 of FIG. 1, FIG. 3 is an enlarged perspective view of an A portion of the illumination device 100 of FIG. 2, FIG. 5 is an enlarged cross-sectional view of the illumination device 100 of FIG. 4. FIG.

1 to 5, a lighting apparatus 100 according to some embodiments of the present invention includes a light guide plate 10, a module substrate 20, and a heat radiation frame 30 .

2 to 5, the light guide plate 10 includes a light guide plate 10 that is capable of diffusing light generated from the light emitting device (LED) mounted on the module substrate 20 in a large area, And may be a photoelectric achievement structure formed of a translucent material and formed in a panel shape having a top surface and a bottom surface as a whole.

The light guide plate 10 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like. In addition, materials of various translucent resin types can be applied. The light guide plate 10 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface or forming fine bubbles therein.

Although not shown, various optical sheets such as diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 10.

A cover 11 capable of protecting the light guide plate 10 may be provided on the lower surface of the light guide plate 10 and a light guide plate 10 may be provided on the upper surface of the light guide plate 10. For example, A reflection panel 12 may be further provided to reflect the light toward the cover 11 in the direction of the cover 11.

However, the present invention is not limited thereto, and various types of additional panels may be installed together with the light guide plate 10, or the light guide plate 10 may be installed.

2 to 5, the module substrate 20 is provided on a part of the side surface of the light guide plate 10 and includes at least one light guide plate 10 for emitting light toward the light guide plate 10, Or may be a long substrate structure in which the light emitting device (LED) is mounted.

More specifically, for example, the module substrate 20 may be a printed circuit board (PCB) in which at least one light emitting device, that is, an LED, may be mounted in a lengthwise direction and mounted.

For example, the module substrate 20 can support the light emitting device (LED) and other components, and is electrically connected to the light emitting device (LED) and other components. The module substrate 20 can be made of a mixed material having suitable mechanical strength.

More specifically, for example, the module substrate 20 may be formed of a resin, a glass, a silicone resin composition, a modified epoxy resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition , PPA, polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, Epoxy Mold Compound, Photoimageable solder resist and the like can be applied.

In addition, the module substrate 20 may be an insulating substrate of a printed circuit board (PCB) or a flexible printed circuit board (FPCB) of a thin flexible material.

In addition, the module substrate 20 may be formed of an insulated metal such as aluminum, copper, zinc, tin, lead, gold, silver, or the like, and may be a perforated or bent lead frame or plate.

Also, for example, the module substrate 20 may be formed with a reflective ink layer printed on the upper surface in a printing manner. Here, such a reflective ink layer may be formed of a reflective paint component, that is, a white or silver series titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chrome, Light-reflecting material such as a component of the light-emitting layer. However, the present invention is not limited to this, and a reflective paint or pigment having high reflectance may be included.

1 to 5, the heat dissipation frame 30 may be configured to receive a part of the light guide plate 10 on one side so that the light guide plate 10 and the module substrate 20 are fixed to each other, And a module substrate accommodating portion 30b capable of accommodating the module substrate 20 is formed on the other side of the light guide plate accommodating portion 30a.

More specifically, for example, the heat dissipating frame 30 may be made of a metal material such as aluminum, copper, zinc, tin, lead, gold, silver, And may be made of a material such as aluminum, copper, steel, or stainless steel having suitable mechanical strength and durability for supporting the module substrate 20 and other components and being thermally connected thereto .

More specifically, for example, as shown in FIG. 5, the module substrate 20 has an upper portion with a first cross-sectional length L1 and a lower portion with a second cross- And a second cross-sectional length L2 shorter than the length L1.

5, in order to reduce the thickness of the lower part of the module substrate 20, the length L2 of the second section is shortened, and the sliding connection with the heat radiating frame 30 is performed instead The first cross-sectional length L1 may be made long.

3 to 5, the heat dissipating frame 30 is mounted on the upper portion of the module substrate accommodating portion 30b so that the module substrate 20 can be slidably coupled, An upper side and a rear side of the module substrate 20 are formed on the lower surface of the module substrate accommodating portion 30b and the front surface portion of the module substrate 20 is opened at the lower portion of the module substrate accommodating portion 30b, An open rail R2 corresponding to the rear surface can be formed.

5, the closed rail part R1 is formed in an inverted U-shape in which three sides are closed, and the forward movement, the backward movement and the upward movement of the upper end of the module board 20 It can be an interfering rail-shaped part.

As shown in FIG. 5, the open rail (R2) is formed in an L-shape in which two sides are closed. The open rail (R2) can interfere with the backward movement and the downward movement of the lower end of the module board And the forward movement of the lower end of the module substrate 20 can not be interfered with because the front is opened.

However, in the case of the present invention in which the open rail (R2) is applied together with the closed rail (R1) even if it is not the closed rail (R1) described above, the open rail The lower end of the substrate 20 can not descend and the upper end of the module substrate 20 can not escape from the sealed rail portion R1 at all times. It can play the same role as part (R1).

At the same time, since the front of the open rail (R2) is opened, a sufficient short-circuit preventing distance is ensured to enable stable operation, and the thickness of the bottom rail is lower than that of the open rail It is possible to reduce the thickness of the entire product and minimize the bottom step difference between the lower surface of the light guide plate 10 and the heat radiating frame 30 to make the product slimmer.

The light guide plate receiving portion 30a of the heat radiating frame 30 may be formed to accommodate the light guide plate 10, the cover 11, and the reflection panel 12 at the same time. However, the present invention is not limited thereto, and can be accommodated in a very wide variety of combinations.

5, the heat dissipating frame 30 may have a sufficient short-circuit distance with the light emitting device (LED) so as to minimize the weight per unit area and prevent a short circuit between the components A first space A1 is formed between the closed rail part R1 and the reflection panel 12 so that a second space A2 is formed between the open rail R2 and the cover 11, .

5, the heat dissipating frame 30 may include various types of heat dissipating fins. The heat dissipating frame 30 may support the upper surface of the reflection panel 12 The lower wing portion W2 is formed to support the lower surface of the cover 11 and the lower wing portion W2 is protruded toward the cover 11 A plurality of first radiating fins F1 can be formed.

5, the heat dissipating frame 30 includes a module substrate-corresponding inner wall 31 for supporting the rear surface of the module substrate 20, and the module substrate corresponding inner wall 31, And a plurality of second radiating fins F2 may be formed in the third space A3.

Therefore, the heat radiating frame 30 can rapidly transfer the heat of high temperature generated from the light emitting device (LED) and the module substrate 20 to the outside, and the first space A1, The second space A2 and the third space A3 can be formed to improve the weight saving and air permeability of the parts and to improve the heat radiation performance.

6 is a perspective view showing the corner bracket 40 of the illumination device 100 of Fig.

1 to 6, the heat radiating frame 30 is installed on the four side surfaces of the light guide plate 10, and the corner bracket 40 is disposed adjacent to the heat radiating frame 30 And the heat-radiating frames 30 may be connected to each other.

2 and 6, the corner bracket 40 includes a heat radiation frame receiving portion 40a for receiving the heat radiation frame 30 on one side thereof and a heat radiation frame receiving portion 40a for receiving the heat radiation frame 30 on the other side thereof, And a module substrate corresponding portion 40b corresponding to one end of the module substrate 20 is formed and screwed to the heat dissipating frame 30, A heat dissipation frame insertion portion 40c may be formed on one side.

1 and 2, in the lighting apparatus 100 according to some embodiments of the present invention, various electronic component assemblies 50 such as a ballast or a power supply may be additionally installed .

However, the present invention is not limited to this, and a very wide variety of parts can be fastened in various shapes.

Therefore, when the module substrate 20 is slidingly coupled to the inside of the heat dissipating frame 30, the closed rail part R1 is formed in an inner part of the heat dissipating frame 30, A sufficient short-circuiting distance can be secured, and at the same time, the thickness of the product can be minimized by increasing the density of components by using the open rail R2, thereby enhancing the safety and merchability of the product Can be improved.

While the present invention has been described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: light guide plate
11: cover
12: Reflective panel
LED: Light emitting element
20: module substrate
30: heat radiating frame
30a: light guide plate accommodating portion
30b: module substrate receiving portion
31: Inner wall for module board
R1: Enclosed railway
R2: open railway
A1: First space
A2: the second space
A3: Third space
W1: upper wing portion
W2: Lower wing portion
F1: First radiator pin
F2: Second radiator pin
40: Corner bracket
40a: heat radiation frame accommodating portion
40b: module substrate corresponding part
50: Electronic component assembly
100: Lighting device

Claims (7)

A light guide plate having an upper surface and a lower surface formed in a flat shape;
A module substrate mounted on a part of the side surface of the light guide plate and having at least one light emitting element mounted on the light guide plate so as to emit light toward the light guide plate; And
And a heat dissipating frame having a light guide plate accommodating portion capable of accommodating a part of the light guide plate on one side thereof and a module substrate accommodating portion accommodating the module substrate on the other side so that the light guide plate and the module substrate are fixed to each other,
Wherein the module substrate comprises:
Wherein the light emitting device has a first section with an upper portion and a second section with a lower section than the first section,
The heat radiating frame may include a closed rail portion for supporting a portion of the front surface of the module substrate, the top surface and the rear surface of the module substrate accommodating portion so that the module substrate can be slidably engaged, Wherein the front facing portion of the substrate is open and the open rail portion corresponding to the bottom surface and the rear surface is formed. The method according to claim 1,
A cover provided on a lower surface of the light guide plate; And
And a reflection panel provided on an upper surface of the light guide plate,
Wherein the light guide plate accommodating portion of the heat dissipation frame is formed to accommodate the light guide plate, the cover, and the reflection panel at the same time,
The heat radiating frame has a first space formed between the closed rail and the reflective panel so as to secure a sufficient short-circuit distance with the light emitting device, and a second space formed between the open rail and the cover , A lighting device. 3. The method of claim 2,
The heat-
An upper wing portion is formed to support an upper surface of the reflection panel,
A lower blade portion is formed to support the lower surface of the cover,
And a plurality of first radiating fins protruding in the direction of the cover are formed on the lower wing portion. 3. The method of claim 2,
The heat-
Wherein a module substrate corresponding inner wall is formed to support the rear surface of the module substrate and a third space is formed on the rear surface of the module substrate corresponding inner wall. 5. The method of claim 4,
And a plurality of second radiating fins are formed in the third space. The method according to claim 1,
Wherein the heat radiation frame is provided on four side surfaces of the light guide plate,
And a corner bracket connecting between the heat radiating frame and the adjacent heat radiating frame. The method according to claim 6,
The corner bracket
Wherein a heat radiation frame accommodating portion accommodating the heat radiation frame is formed on one side and a module substrate corresponding portion is formed on the other side and corresponding to one end of the module substrate.

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