KR101706568B1 - Gas wiping device of plating facility, and control method thereof - Google Patents

Gas wiping device of plating facility, and control method thereof Download PDF

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Publication number
KR101706568B1
KR101706568B1 KR1020150104854A KR20150104854A KR101706568B1 KR 101706568 B1 KR101706568 B1 KR 101706568B1 KR 1020150104854 A KR1020150104854 A KR 1020150104854A KR 20150104854 A KR20150104854 A KR 20150104854A KR 101706568 B1 KR101706568 B1 KR 101706568B1
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KR
South Korea
Prior art keywords
gas
gas supply
pressure
plating
sealed box
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KR1020150104854A
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Korean (ko)
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KR20170012790A (en
Inventor
최재혁
이동은
이필종
전지연
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주식회사 포스코
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Priority to KR1020150104854A priority Critical patent/KR101706568B1/en
Publication of KR20170012790A publication Critical patent/KR20170012790A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18—Removing excess of molten coatings from elongated material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18—Removing excess of molten coatings from elongated material
    • C23C2/20—Strips; Plates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/40—Plates; Strips

Abstract

A gas wiping apparatus for a plating facility and a control method thereof are disclosed. The gas wiping device of the plating apparatus according to the embodiment of the present invention includes a spray nozzle for spraying wiping gas into a plating layer of a steel sheet to adjust the thickness of the plating layer; A sealing box installed to surround the injection nozzle; A plurality of pressure sensors each sensing a pressure in a plurality of areas spaced apart from each other in the sealed box; A gas supply device capable of selectively supplying gas to a plurality of mutually spaced regions in a sealed box; And a control unit for controlling the operation of the gas supply device based on the plurality of pressure sensor detection information.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a gas wiping apparatus and a control method thereof,

The present invention relates to a gas wiping apparatus and a control method thereof for a plating facility, and more particularly, to a gas wiping apparatus and a control method thereof for a plating facility which solves a flow stagnation region inside a sealed box, ≪ / RTI >

Plating equipment, one of the surface treatment facilities of steel plates, is a device that can apply the plating solution to the steel plate surface while continuously supplying steel plates.

Conventional plating equipment includes a plating port containing a plating solution, a sink roll for guiding a continuously supplied steel sheet to be immersed in a plating solution of a plating port, a correcting roll for correcting the bending of the steel sheet, And a gas wiping device for adjusting the thickness of the plating layer on the surface of the steel sheet discharged from the plating port.

The gas wiping device has a spray nozzle for spraying gas for wiping from both sides of the steel sheet to the steel plate surface and a sealed box surrounding the wiping environment around the spray nozzle to provide a non-oxidizing atmosphere. The sealed box functions to prevent oxide film formation in the plating surface layer portion and to prevent defects in the flow pattern of the coated steel sheet. An example of such a gas wiping device can be found in the example of Korean Patent Laid-Open Publication No. 10-2011-0127917 (published on November 28, 2011).

In this gas wiping apparatus, the gas injected from the injection nozzle collides with the steel sheet and flows along the surface of the steel sheet to form an air flow, which forms a vortex in the airtight box, resulting in a stagnant region of gas flow.

If a stagnant region of the gas flow is generated in the sealed box, the flow becomes uneven and a temperature deviation occurs in each region inside the sealed box, and an uneven oxide film may be formed on the plating surface layer portion due to the temperature deviation. That is, due to uneven temperature in each region, an uneven oxide film is generated in the plating surface layer portion, and such an oxide film can cause a flow pattern in the plating layer due to the flow velocity fluctuation of the gas.

An embodiment of the present invention is to provide a gas wiping apparatus and a control method thereof for a plating facility capable of realizing a stable non-oxidizing atmosphere by eliminating a flow stagnation region inside a sealed box and uniformizing the temperature as a whole.

According to an aspect of the present invention, there is provided a spray nozzle for spraying wiping gas to a plating layer of a steel sheet to adjust a thickness of a plating layer; A sealed box installed to surround the injection nozzle; A plurality of pressure sensors each sensing a pressure of a plurality of areas spaced apart from each other in the sealed box; A gas supply device capable of selectively supplying gas to a plurality of mutually spaced regions in the sealed box; And a control section for controlling the operation of the gas supply device based on the plurality of pressure sensor detection information.

Wherein the gas supply device comprises: a plurality of gas supply pipes arranged to communicate with a plurality of mutually spaced regions in the sealed box; A gas supply source for supplying gas to the plurality of gas supply pipes; And a plurality of open / close valves for opening and closing the flow paths of the respective gas supply pipes by the control of the control unit.

According to another aspect of the present invention, there is provided a gas-wiping device control method for a plating facility including a spray nozzle for spraying wiping gas to a plating layer of a steel sheet to adjust a thickness of a plating layer, A pressure sensing step of sensing pressure in a plurality of areas spaced apart from each other in the hermetic container by a plurality of pressure sensors; Determining at least one region having a relatively high pressure among the plurality of regions based on the information detected in the pressure sensing step; And a gas supply step of causing a gas supply device connected to the airtight box to supply gas to an area determined in the determination step among the plurality of areas.

The control method further includes a determining step of determining whether there is a pressure difference between the plurality of areas after the pressure sensing step, and if it is determined that there is a pressure difference between the plurality of areas, the determining step is performed, The gas supply device may supply gas to all of the plurality of areas.

The control method may operate the gas supply device to supply gas to all of the plurality of areas before the pressure sensing step.

Since the gas wiping apparatus of the plating apparatus according to the embodiment of the present invention can inject the gas into the flow stagnation region (the region with a relatively high pressure) in the hermetically sealed box to eliminate the flow stagnation in the hermetically sealed box, The temperature can be made uniform, and a stable anoxic atmosphere can be realized.

1 shows a plating apparatus to which a gas wiping apparatus according to an embodiment of the present invention is applied.
2 is a perspective view of a gas wiping device according to an embodiment of the present invention, showing a state in which a gas supply device is installed in a sealed box.
3 is a detailed view of part A of FIG.
4 is a flowchart showing the control operation of the gas wiping apparatus according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided to fully convey the spirit of the present invention to a person having ordinary skill in the art to which the present invention belongs, and the present invention is not limited thereto, but may be embodied in other forms. In order to clarify the present invention, it is possible to omit the parts of the drawings that are not related to the description, and the size of the components may be slightly exaggerated to facilitate understanding.

1 shows a plating apparatus to which a gas wiping apparatus according to an embodiment of the present invention is applied. As shown in the figure, the plating facility is provided in the form of a container having an open top and includes a plating port 10 in which a plating solution such as molten zinc is contained, and a guide 20 of the steel plate 20 via the inside of the plating port 10 A roll device 30 installed in the plating port 10 for calibrating the bending of the steel plate 20 and a gas wiping device 30 for adjusting the thickness of the plating layer on the surface of the steel plate 20 discharged from the plating port 10 100).

The roll device 30 includes a sink roll 31 which is installed in a plating solution in the plating port 20 in a state of being immersed in the plating liquid and a plating roll 30 which is disposed at an upper portion spaced from the sink roll 31, A supporting roll 32 for supporting an outer surface of one side of the steel sheet to be discharged to the upper side of the supporting roll 32 and a supporting roller 32 for supporting the outer side of the steel sheet 20 on the opposite side of the supporting roll 32, And a calibrating roll 33 for calibrating the curvature.

The gas wiping apparatus 100 includes two spray nozzles (not shown) for spraying gas for wiping from both sides of the steel plate 20 discharged upward from the plating port 10 toward the surface of the steel plate 20, And a sealing box 120 surrounding the wiping environment (wiping zone) around the injection nozzle 110 to provide a non-oxidizing atmosphere.

As shown in FIGS. 1 and 2, the closed box 120 may have a top face and a plurality of side faces closed, a bottom face opened, and a hexahedral shape extending in the width direction of the steel plate 20. On the upper surface of the sealed box 120, a through-hole 121 through which the steel sheet passes without interference is formed. As shown in Fig. 1, the lower part of the sealed box 120 remains partially immersed in the plating liquid of the plating port 10. [

1, a gas jetted from the spray nozzle 110 forms an air stream after colliding with the steel plate 20, and the air stream flows in the airtight box 120, And congestion of the gas flow may occur in a specific region in the closed box 120. That is, the flow velocity of the gas as a whole is not uniform in the sealed box 120, so that the flow stagnation may occur in a specific region, which may cause a temperature variation within the sealed box 120. If a temperature variation occurs in the sealed box 120, a non-uniform oxide film may be formed in the plating surface layer portion.

The gas wiping device 100 according to the present embodiment includes a gas supply device 130 capable of supplying gas to the flow stagnant region in the sealed box 120 to solve this problem, A plurality of pressure sensors 140 for sensing pressure in a plurality of areas to sense a flow state of the plurality of pressure sensors 140 and a control unit for controlling the operation of the gas supply device 130 based on the plurality of pressure sensors 140 sensed information Respectively.

As shown in FIGS. 1 to 3, the gas supply device 130 includes a plurality of gas supply pipes 131 and a plurality of gas supply pipes 131 arranged to communicate with a plurality of mutually spaced regions in the sealed box 120 A gas supply source 132 for supplying a gas, and a plurality of open / close valves 133 for opening and closing the flow paths of the respective gas supply pipes 131.

The gas supply source 132 may include a pump for feeding gas at a set pressure, a gas tank for storing compressed gas, and the like.

As shown in FIG. 2, the plurality of gas supply pipes 131 can be installed on both sides of the sealing box 120 facing the surface of the steel plate 20, They can be spaced apart from one another. Here, the present embodiment is merely to show an installation form of the plurality of gas supply pipes 131 as an example, but the positions and the quantity of the plurality of gas supply pipes are not limited thereto. The installation position and the quantity of the gas supply pipe 131 can be variously modified in such a manner that gas can be supplied to a plurality of areas in the sealed box 120.

The plurality of gas supply pipes 131 are connected to the gas supply source 132 through the connection pipe 134 and the plurality of opening and closing valves 133 selectively open and close the flow path of each gas supply pipe 131 to control the supply of gas One for each gas supply pipe 131. [

3, the plurality of pressure sensors 140 are disposed in the inner space of the sealed box 120 so as to detect a pressure in a plurality of areas in the sealed box 120, that is, a region where the gas supply pipes 131 are installed, (Not shown). Of course, since the plurality of pressure sensors 140 can detect the pressure of a plurality of regions in the sealed box 120, the installation position is not limited thereto.

Next, the operation and control method of the gas wiping apparatus will be described with reference to the flowchart of Fig.

1, the spray nozzle 110 installed in the sealed box 120 injects the wiping gas onto the surface of the steel sheet 20 discharged via the plating port 10, Adjust the thickness. At this time, an air flow is formed in the sealed box 120 by the gas injected from the injection nozzle 110, and a flow of the internal gas is generated.

When the gas wiping device 100 operates, the control unit operates the gas supply device 130 to supply gas to all the plurality of regions in the sealed box 120 provided with the gas supply pipe 131 (step 161). At this time, the plurality of open / close valves 133 are kept open so that the gas is supplied into the closed box 120 through the gas supply pipes 131. This is to minimize the phenomenon of stagnation of the flow of the gas to all the regions in the sealed box 120 to maintain an even temperature distribution.

In this state, the control unit senses (162) the pressure of a plurality of areas (the positions of the respective gas supply pipes) spaced apart from each other in the closed box 120 through the plurality of pressure sensors 140, It is determined whether there is a pressure difference (163).

If it is determined in step 163 that there is a pressure difference, on the basis of the information sensed in the pressure sensing step 162, one or more regions having relatively high pressure are determined in step 164. The crystals in the high pressure region can be preset to select one or more regions having a relatively high pressure.

After the high pressure region is determined, the gas supply device 130 is controlled so as to supply the gas only to the determined region. At this time, the open / close valve 133 in the region determined to have a high pressure is opened to supply the gas, and the open / close valves 133 in the remaining region are closed to block the supply of the gas (165).

Here, the high pressure region is the region where the flow velocity is low and the static pressure is high, which is the place where the flow stagnation occurs. Such control slows the flow stagnation by supplying the gas to the stagnation region due to the relatively low flow rate.

If the flow stagnation is eliminated and the gas flow as a whole is smooth in the sealed box 120, the temperature deviation in the sealed box 120 is minimized, and the thickness of the oxide film formed on the surface layer portion of the plating can be made uniform, Can be minimized.

As shown in Fig. 4, after step 165, step 162 is performed again. If it is determined in step 163 that there is no pressure difference in a plurality of areas, step 161 is performed.

As described above, since the gas wiping device 100 of the present embodiment can eliminate the flow congestion in the sealed box 120 by injecting gas into the flow stagnation region (the region with a relatively high pressure) in the sealed box 120 The temperature of the entire inside of the sealed box 120 can be made uniform, and a stable anaerobic atmosphere can be realized.

10: plating port, 20: steel plate,
100: gas wiping device, 110: jet nozzle,
120: sealed box, 130: gas supply device,
131: gas supply pipe, 132: gas supply source,
133: opening / closing valve, 140: pressure sensor.

Claims (5)

A spray nozzle for spraying wiping gas onto the plating layer of the steel sheet to adjust the thickness of the plating layer;
A sealing box installed to surround the injection nozzle and having a passage groove formed on an upper surface thereof so as to allow the steel plate to pass through without interference;
A plurality of pressure sensors each sensing a pressure of a plurality of areas spaced apart from each other in the sealed box;
A gas supply device capable of selectively supplying gas to a plurality of mutually spaced regions in the sealed box; And
And a control unit for controlling the operation of the gas supply device based on the plurality of pressure sensor detection information,
Wherein the gas supply device comprises: a plurality of gas supply pipes provided so as to communicate with a plurality of mutually spaced regions in the sealed box;
A gas supply source for supplying gas to the plurality of gas supply pipes,
And a plurality of open / close valves for opening and closing the flow paths of the gas supply pipes by the control of the control unit. delete 1. A method for controlling a gas wiping apparatus in a plating facility comprising a spray nozzle for spraying wiping gas to a plating layer of a steel sheet to adjust a thickness of a plating layer and a seal box surrounding the spray nozzle,
A pressure sensing step of sensing pressure of a plurality of areas spaced apart from each other in the sealed box by a plurality of pressure sensors;
Determining at least one region having a relatively high pressure among the plurality of regions based on the information detected in the pressure sensing step; And
And a gas supply step of supplying a gas from a gas supply device connected to the closed box to an area of the plurality of areas determined in the determination step. The method of claim 3,
Further comprising a determining step of determining whether there is a pressure difference between the plurality of areas after the pressure sensing step,
Wherein the determining step determines that there is a pressure difference between the plurality of areas, and if the pressure difference is determined to be zero, the gas supplying device controls the gas wiping device control Way. The method of claim 3,
And operating the gas supply device to supply gas to all of the plurality of areas before the pressure sensing step.
KR1020150104854A 2015-07-24 2015-07-24 Gas wiping device of plating facility, and control method thereof KR101706568B1 (en)

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KR1020150104854A KR101706568B1 (en) 2015-07-24 2015-07-24 Gas wiping device of plating facility, and control method thereof

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Application Number Priority Date Filing Date Title
KR1020150104854A KR101706568B1 (en) 2015-07-24 2015-07-24 Gas wiping device of plating facility, and control method thereof

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KR101706568B1 true KR101706568B1 (en) 2017-02-15

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101481606B1 (en) 2012-12-20 2015-01-12 주식회사 포스코 Galvanizing apparatus of steel sheet

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08356Y2 (en) * 1990-03-28 1996-01-10 川崎製鉄株式会社 Gas wiping device
JP2848208B2 (en) * 1992-08-27 1999-01-20 日本鋼管株式会社 Hot-dip metal plating equipment
KR101620670B1 (en) * 2013-12-21 2016-05-12 주식회사 포스코 Plating Apparatus and Plating Method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101481606B1 (en) 2012-12-20 2015-01-12 주식회사 포스코 Galvanizing apparatus of steel sheet

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