KR101690108B1 - Apparatus of Compression Molding - Google Patents

Apparatus of Compression Molding Download PDF

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Publication number
KR101690108B1
KR101690108B1 KR1020150145138A KR20150145138A KR101690108B1 KR 101690108 B1 KR101690108 B1 KR 101690108B1 KR 1020150145138 A KR1020150145138 A KR 1020150145138A KR 20150145138 A KR20150145138 A KR 20150145138A KR 101690108 B1 KR101690108 B1 KR 101690108B1
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KR
South Korea
Prior art keywords
film
picker
cut
tray
cutting
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KR1020150145138A
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Korean (ko)
Inventor
김석배
Original Assignee
한미반도체 주식회사
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Priority to KR1020150145138A priority Critical patent/KR101690108B1/en
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Publication of KR101690108B1 publication Critical patent/KR101690108B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

According to the present invention, disclosed is a compression molding apparatus including a film cutting apparatus. According to one embodiment of the present invention, a compression molding apparatus to mold a substrate comprises: a film picker having an adsorption unit capable of adsorbing an upper surface of a film supplied from a film supply unit, and installed to be movable along a Y-axis in order to adjust a length of the film and supply the film; a film table which receives the film adsorbed by the film picker and is installed to be movable along the Y-axis in order to fit a position according to a size of the substrate; a film cutting unit fixed on one side of the film table, installed to be movable along an X-axis, and cutting the film along one side of the film table; and a tray picker installed to be movable along the X-axis in order to pick up the cut film and a powder tray which is placed on the upper side of the film cut by the film cutting unit and has a through-hole to receive powder inside, so as to move the cut film and the powder tray to a supply unit side. The film picker varies a moving distance of the film picker with respect to the film cutting unit to supply the film to the film table as much as a length predetermined according to the size of the substrate. The film table is placed in a position matching a central part of the tray picker with a half position of the length of the film to be cut.

Description

[0001] Apparatus of Compression Molding [0002]

The present invention relates to a compression molding apparatus. More particularly, the present invention relates to a compression molding apparatus including a film cutting apparatus for cutting a film used in a compression molding process during a manufacturing process of a semiconductor package.

The compression molding process is performed by supplying powdered EMC molding compound onto the mold and pressurizing the die and EMC with the die placed on the surface of the EMC. As a method of supplying the EMC into the mold cavity, first, a resin accommodating portion is formed by covering a release film on the lower surface of a through hole formed in a plate corresponding to the mold cavity and accommodating EMC, and then the EMC is supplied to the resin accommodating portion .

The release film constitutes a compression molding system with the roll wound, and the release film is cut and fed from the film plate whenever necessary. The length of the release film should be able to accommodate the length of printed circuit boards (PCBs) made in various sizes. In the past, the film was cut to the maximum length in anticipation of the maximum PCB size, and the position of the film plate and cutter was fixed Respectively.

That is, if a release film is needed, the film is cut and supplied according to the maximum PCB size regardless of the size of the PCB. Therefore, even when a short-length PCB is molded, unnecessary film consumption is caused by supplying the same length of film.

The present invention provides a compression molding apparatus capable of adjusting a cutting position of a film according to a size of a substrate.

According to an aspect of the present invention, there is provided a compression molding apparatus for molding a substrate, comprising: a suction unit capable of suctioning an upper surface of a film supplied from a film supply unit; A film picker movably provided on the substrate; A film table mounted on the film picker so as to be able to move in the Y-axis direction in order to position the film on which the film picked up by the film picker is adhered; A film cutting unit fixed to one side of the film table and movably movable in the X axis direction and cutting the film along one side of the film table; And a powder tray provided on the upper surface of the cut film and the film cut by the film cutting portion and having a through hole for receiving the powder therein, so as to be able to move in the X axis direction so as to feed the powder to the supply portion side Wherein the film picker varies the movement amount of the film picker based on the film cut portion to supply the film to the film table by a predetermined length according to the size of the substrate, Wherein the center of the tray picker is located at a position where the central position of the half of the length of the film to be cut agrees with the center position of the tray picker.
Further, it is preferable that the film table further includes a base plate for supporting the film table and the film cutter, and the film cutter moves along the rails provided on the base plate in the longitudinal direction of the film, Can be cut.
In addition, the position at which the tray picker picks up the cut film and the powder tray is always fixed, and the tray picker is positioned at a position where the center portion of the tray picker and the center portion of the powder tray, Can be picked up.
In addition, the film picker may adsorb the film supplied from the film supply unit and move in the Y-axis direction by a length of the film to be cut from one side of the film table on which the film cut unit is fixed, thereby supplying the film onto the film table .
The film picker may further include a pressing member capable of pressing a film placed on the film table at a position adjacent to the film cut portion, wherein the pressing member is provided with a brush portion at an end thereof, It is possible to remove the foreign matter on the upper surface of the substrate.
The film cutting section includes a film seating section for holding and fixing the bottom surface of the film and a cutter disposed adjacent to the film seating section for cutting the film, Can be positioned opposite the film seating.
The film cutting unit may include a rail block that moves along a rail provided on the base plate, a moving block that is movable in the X-axis direction with respect to the rail block, and a movable block that is movable in the X- A cutter coupling block provided movably, and a cutter detachably coupled to the cutter coupling block to cut the film.

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The compression molding apparatus according to the present invention includes a film cutting apparatus that mounts a film table provided in various lengths according to the size of a substrate and moves the film cutting unit in close contact with the film table. The film can be cut.

In addition, the system can be configured such that the film table and the film cut-out portion are integrally modularized and the module can be moved back and forth according to the size of the substrate, so that the system can be configured to cope with the change in length of the film without replacing the film table.

Accordingly, the present invention can reduce unnecessary film consumption and reduce material cost.

1 is a plan view showing a configuration of a compression molding apparatus according to an embodiment of the present invention.
2 is a side view of a film cutting apparatus according to an embodiment of the present invention.
Fig. 3 is a side view showing the film cutting portion enlarged and removed.
4 is an enlarged perspective view of a moving block of the film cutout portion.
5 is an enlarged side view of the film picker.
6 to 11 show a process of cutting a film according to an embodiment of the present invention,
6 shows a state in which the film picker moves to the pickup position of the film,
7 shows a state in which the film picker picks up the film,
8 shows a state in which the film picker feeds the film,
Fig. 9 shows a state in which the film picker seats the film on the film table,
10 shows a state in which a film film picker moves to a cutting position of the film and presses the film, and then the cutting member cuts the film.
11 shows a state in which the length of the film after cutting is different by transferring the film cut portion.
12 is a side view showing a film cutting apparatus according to another embodiment of the present invention.
13 shows a state in which the length of the film after cutting is different by feeding the film cut portion.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals designate like elements throughout the specification.

A film cutting apparatus according to an embodiment of the present invention can be used to cut a film by a cut length. As an example, it can be used to cut a film used for compression molding of a substrate.

A process of manufacturing a semiconductor package or a PCB (Printed Circuit Board) includes a process of molding a substrate on which a semiconductor die is mounted by using EMC or the like, and compression molding may be used as a molding method. The compression molding can be achieved by forming a resin accommodating portion by covering a release film on a lower surface of a plate having a through hole formed therein corresponding to a mold cavity and accommodating the EMC, and then supplying EMC to the resin accommodating portion.

At this time, the release film to be used should be cut to a size corresponding to the size of the semiconductor package or the PCB. In this process, a film cutting apparatus according to an embodiment of the present invention can be used. Hereinafter, the substrate is used to mean a semiconductor package and a PCB.

However, the use range of the film cutting apparatus according to an embodiment of the present invention is not limited to the manufacturing process of the substrate, but can be used to cut films used in various technical fields.

1 is a plan view showing a configuration of a compression molding apparatus 100 according to an embodiment of the present invention.

The compression molding apparatus 100 includes a powder tray supply part 11 for supplying a powder tray 12 for housing a powder therein, a tray picker 20 for picking up the powder tray 12, a powder tray 12 A film cutting device 100 for cutting a film 110 provided on one side of the powder tray 12 and a powder feeder for supplying powder to the receiving portion of the powder tray 12, And a powder tray feeder 50 for supplying the powder tray 12 supplied with powder to a molding apparatus (not shown).

The powder tray feeder 11 can supply two or more powder trays 12 and in this case the two tray trays 12 can be simultaneously picked up by one tray picker 20 to shorten the processing time .

The tray picker 20 can be reciprocally movable in one direction (X-axis direction in the drawing). For example, the tray picker 20 can be guided to the tray picker conveying rail 21 arranged to extend in one direction, and can move left and right in the drawing. At this time, the tray picker conveying rail 21 extends to a position where the powder tray supplying unit 11, the tray washing unit 30, and the film cutting apparatus 100 are positioned, and moves the tray picker 20 to these places .

Meanwhile, the powder supply part 40, the powder tray supply part 11, the tray cleaning part 30, and the film cutting device 100 may be arranged side by side in the X axis direction. However, the respective orders may be switched with each other, and may not be arranged in a line as shown in the drawing.

The tray picker 20 picks up the powder tray 12 from the powder tray supplying part 11 and moves the tray to the tray cleaning part 30 and places the powder tray 12 on the cleaning table 31.

The tray cleaning unit 30 may be disposed adjacent to the powder tray supply unit 11. [ The tray cleaning unit 30 includes a cleaning table 31 for supplying the powder tray 12 from the tray picker 20, a cleaning device 32 for cleaning the cleaning table 31, And a cleaning table transferring rail 33 for guiding the cleaning table.

The cleaning table 31 can seat the two powder trays 12. The cleaning table 31 may be reciprocally movable in one direction (Y-axis direction in the figure). In one example, the cleaning table 31 is guided by the cleaning table transferring rail 33 arranged to extend in one direction and can move in the Y-axis direction.

The cleaning device 32 may be located in the middle of the cleaning table transferring rail 33 and may be located at the top and bottom of the cleaning table 31, respectively. Therefore, both the upper surface and the lower surface of the powder tray 12 on the cleaning table 31 can be cleaned.

The tray picker 20 picks up the cleaned powder tray 12 from the cleaning table 31 and transfers the picked up powder tray 12 to the film cutting apparatus 100. On the film table 133 on which the cut film 110 is placed, The powder tray 12 can be transferred.

The film cutting apparatus 100 may be disposed adjacent to the tray cleaning unit 30. [ The film cutting apparatus 100 includes a film supply unit 120 for supplying the film 110, a film picker 150 for picking up and moving the film 110 from the film supply unit 120, A film table 133 on which the transferred film 110 is placed and a film cut section 140 for cutting the film 110 seated on the film table 133.

The film supply unit 120 may include two. The processing speed can be improved by simultaneously cutting the two films 110 by the operation of the single film cutting unit 140.

The film picker 150 picks up the film 110 from the film feeder 120 and moves the film 110 to one side of the film table 133 and then places it down.

The film cut section 140 cuts the film 110 on the film table 133.

The tray picker 20 can pick up the film 110 in a state in which the powder tray 12 is moved on the cut film 110. Thus, the film 110 can be brought into close contact with the bottom of the powder tray 12.

The tray picker 20 transfers the film 110 together with the powder tray 20 to the powder supply unit 40.

The powder supply part 40 can supply the powder to the receiving part of the powder tray 20 whose bottom surface is blocked by the film 110. [ The powder can then be integrated with the PCB in the molding process.

The powder tray feeder 50 can be reciprocally movable in one axial direction (Y-axis direction in the figure). For example, the powder tray feeder 50 is guided by the tray feeder conveying rail 51 arranged to extend in one direction, and is movable in the Y-axis direction in the drawing. For example, the powder tray feeder 50 receives the powder tray 20 supplied with the powder from the powder feeder 40 in a downward state, moves up to move the powder tray 20 (not shown) .

2 is a side view showing a film cutting apparatus 100 according to an embodiment of the present invention. The film cutting apparatus 100 will be described in detail with reference to FIG.

The film cutting apparatus 100 includes a film supply unit 120 for supplying the film 110, a film guide for guiding the film 110 supplied from the film supply unit 120, a film 110 A film picker 150 for picking up the film 110 and a film table 133 on which the film picked up by the film picker 150 is seated .

The film supply part 120 may have the film 110 wound in a roll form. In addition, a roll core 121 positioned at the center of the film 110 wound in a roll form may be rotatably provided. In one example, the roll shim 121 is seated on the bearing 122 and can feed the film 110 while rotating.

In addition, the film feeder 120 may be located below the film cutting apparatus 100, and the film cutout 140 may be located above the film cutting apparatus 100. The film guide guides the film 110 from the film feeder 120 to the film cutter 140. The film guiding part may include a plurality of rollers 123 disposed between the film feeding part 120 and the film cutting part 140 with an interval therebetween.

Next, the film cutting unit 140 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a side view showing an enlarged view of the film cutout section 140. FIG.

Referring to FIG. 3, the film cutout 140 may include a cutting member 147 that can cut the film 110 in the width direction. For example, the cutting member 147 may be provided with a blade that moves in the width direction of the film, and may be cut inward from the edge of the film 110.

The film cutout portion 140 may be provided on the base plate 130 and may be installed on the base plate 130 so as to be reciprocally movable in the longitudinal direction of the film. Therefore, the present invention is also applicable to the case where the length after cutting the film 110 is different. For example, on the base plate 130 along a cutter feed rail 131 provided to extend in the longitudinal direction of the film. Here, the longitudinal direction of the film may coincide with the Y-axis direction in Fig. The width direction of the film may coincide with the X-axis direction in Fig.

In addition, the film cut portion 140 can be installed to be reciprocally movable in the width direction of the film. Therefore, the film cut portion 140 can cut the film 110 in the width direction.

In addition, the film cutout 140 may include a film seating 148 that can support the vicinity of the rear of the cut line of the film 110. Here, the rear of the cutting line means the left side of the cutting line in the drawing.

The film seating portion 148 includes a suction hole 149 capable of adsorbing the lower surface of the film 110. Vacuum pressure can be selectively formed in the suction holes 149. Accordingly, a vacuum pressure is formed in the suction holes 149 to fix the film 110 so as not to move.

The base plate 130 can support the film table 133 on which the film 110 is seated. In one example, the film table 133 may be supported on a table support 132 that extends upwardly from the base plate 130.

Further, the film table 133 may be provided to have a length corresponding to the length of the film 110 after cutting. And the film table 133 can be detachably coupled to the table support 132. [ At this time, the film table 133 may be provided in various sizes according to the length of the cut film 110. Thus, by replacing the film table 133 of various sizes with the table support 132, the film 110 can be cut in various lengths.

The base plate 130 can support a picker conveying rail 135 that guides the movement of the film picker 150 picking up the film 110. In one example, the picker conveyance rail 135 may be supported on the picker support 134, which extends upwardly from the base plate 130. A plurality of picker support portions 134 may be provided in the longitudinal direction of the picker conveyor rail 135.

The film picker 150 can pick up the film 110 and move up and down to pick up the film 110 after the film picker 150 has picked up the film 110. In addition, the film picker 150 can be moved to the end of the film table 133 by picking up the film 110 by moving along the longitudinal direction of the film along the picker conveying rail 135 extending in the longitudinal direction of the film.

4, the film cutout portion 140 includes a body portion 141 that moves along the cutter feed rail 131, a rail block 142 that is connected to the body portion 141 and extends in the width direction of the film, A moving block 143 movably coupled with the rail block 142 in the width direction of the film, and a cutting member 147 mounted on the moving block 143. [

The moving block 143 may be provided to be capable of reciprocating in the width direction of the film along the rail block 142. On one side of the rail block 142, guide rails 142a and 142b for guiding the movable block 143 may be provided. For example, the guide rail may include a cylinder guide 142a for guiding the cylinder, and an LM guide 142b for guiding the movement block 143 positioned above the cylinder guide 142a.

The moving block 143 can move along the rail block 142 by the power generated by the power source 145. [ The power source 145 may be a cylinder, for example, a rodless cylinder, a pneumatic cylinder, a hydraulic cylinder, or the like. In the drawings, a rodless cylinder is used as an example.

Or the moving block 143 can be coupled to the rail block 142 and the gear assembly.

The cutting member 147 can be directly connected to the moving block 143. [ Or the cutting member 147 may be supported on the cutter engaging block 144 which is movably coupled to the moving block 143. [

The cutter engaging block 144 may be movably coupled to the moving block 143 in the width direction of the film. For example, a guide rail 143a and a guide shaft 143b for guiding the cutter coupling block 144 may be provided on one side of the moving block 143. The guide rail 143a is provided on one side of the moving block 143 in the width direction of the film, and guides the cutter engaging block 144. The guide shaft 143b is provided between the cutter engaging block 144 and the flange surface 143c provided at the widthwise end of the film of the moving block 143. [ For example, the guide shaft 143b protrudes in the width direction of the film on one side of the cutter engaging block 144 and may be provided to penetrate the flange surface 143c.

In addition, an overload detector may be interposed between the cutter coupling block 144 and the moving block 143. Accordingly, when an external force is applied to the cutting member 147, the external force is sensed by the overload detection device and the movement of the cutting member 147 is controlled, thereby preventing damage to the film due to wrinkles or the like of the film. For example, when an external force equal to or greater than a predetermined strength is applied, the deformable elastic member 146 is disposed between the cutter coupling block 144 and the moving block 143 so that the coupling block 144 is pushed only when an external force equal to or greater than a predetermined strength is applied. Can be configured. That is, when an external force equal to or greater than a predetermined strength is applied, the coupling block 144 is pushed backward, and it can be determined that an overload has occurred in the film cutout portion 140.

The overload detection method is a method for detecting the overload of the coupling block 144. For example, when the flange surface 143c and the cutter coupling block 144 The present invention can be applied to various modifications as long as it is possible to detect the pivoting of the coupling block, for example, by using the movement of the guide shaft 143b.

The cutting member 147 may be provided with a blade. In addition, the cutting member 147 may be provided such that the surface thereof contacting the film 110 is inclined when the film 110 is cut.

Further, the cutting member 147 can be detachably coupled to the cutter engaging block 144. [ Therefore, when the blade of the cutting member 147 is worn, only the cutting member 147 can be used by being replaced.

Next, the film picker 150 will be described in detail with reference to FIG. 5 is an enlarged side view of the film picker 150. FIG.

Referring to FIG. 5, the film picker 150 is provided so as to be movable in the longitudinal direction of the film along the picker conveying rail 135.

The film picker 150 is movable in the vertical direction. For example, the film picker 150 can move a long distance in the vertical direction by the first driving unit 152 and a small distance in the vertical direction by the second driving unit 154.

When the film picker 150 is driven using a plurality of driving units, the first driving unit 154 moves a long distance in the vertical direction and the second driving unit 154 moves a small distance in the vertical direction The film 110 is adsorbed and the adsorbed film 110 is moved to the film table 133 in a state where the film is raised by a small distance by the second driving unit 154. That is, when the film 110 is transferred to the film table 133, the film picker 150 moves the film 110 upward to cause the film 110 to be tilted at a predetermined angle with the film feeder 120, (133). The film 110 may be wound around the film feeder 120 so that the force to pull the film 110 toward the film feeder 120 while the film 110 moves to the film table 133 Which is affected by the slope between the film 110 and the film feeder 120. [ Therefore, the second driving unit 154 can be installed on the film picker 150 to transfer the film 110 at an optimum slope.

The first and second driving units 152 and 154 may use the cylinder 152. For example, a rodless cylinder, a pneumatic cylinder, a hydraulic cylinder, or the like may be used. In addition, the film picker 150 includes a suction hole 151 capable of adsorbing the upper surface of the film 110. Vacuum pressure can be selectively formed in the adsorption holes 151. Therefore, when the film 110 is to be picked up, vacuum pressure is formed in the suction hole 151 to hold the film 110, and when the film 110 is to be lowered, the vacuum pressure formed in the suction hole 151 Can be released.

In addition, the film picker 150 may include a pressing member 153 capable of pressing the vicinity of the cutting line of the film 110. Here, the vicinity of the front of the cutting line means the right side of the cutting line in the drawing. The pressing member 153 may press the vicinity of the cut line of the film 110 to prevent the film 110 from being lifted from the film table 133. That is, the pressing member 153 is pressed against the front side of the film 110, and the lower surface of the film 110 is adsorbed to the rear side of the film 110 by the suction holes 149 of the film receiving portion 148 The upper surface of the film 110 is fixed by the pressing force of the film picker 150. Therefore, the film 110 can be cut in a fixed state, so that the cut surface can be smooth.

Further, the pressing member 153 may be made of a material such as rubber that is deformable in shape. This is to prevent the surface of the film 110 from being damaged by the pressing member 153 being pressed. Or the pressing member 153 may be supported by the elastic member and movable up and down relative to the film picker 150. As a result, when the film picker 150 presses the pressing member 153 onto the surface of the film 110, the stress applied to the surface of the film 110 while the pressing member 153 moves upward can be reduced.

In addition, a brush (not shown) may be provided at the end of the pressing 153. The brush can contact the upper surface of the film table 133 to remove foreign matter.

Next, a process of cutting the film 110 by the film cutting apparatus 100 according to an embodiment of the present invention will be described with reference to FIG. 6 to FIG.

6, the film picker 150 moves to the pick-up position of the film 100 and forms a vacuum in the suction holes 151 in the lowered state to adsorb the upper surface of the film 110. At this time, the film picker 150 can adsorb near the edge of the film 110, thereby reducing the length error due to the excess of the film 110.

Referring to FIG. 7, the film picker 150 may pick up and transport the film 110 by increasing the film picker 150 a predetermined amount while adsorbing the film 110. Therefore, the film 110 can be prepared to move in a state where it is positioned higher than the upper surface of the film table 133. However, it includes a case in which the film 110 is moved along the upper surface of the film table 133 without being elevated in a state in which the film 110 is adsorbed.

8, the film picker 150 moves along the picker conveying rail 135 to the opposite corner of the film table 133 while the film 110 is picked up, and pulls the film 110 by the cutting length. At this time, the film table 133 may be provided in a size corresponding to the length of the cut film 110, and the film 110 may be seated such that its edge matches the edge of the film table 133.

9, when the film picker 150 moves down to the opposite corner of the film table 133 and then descends, the vacuum pressure of the suction hole 151 is released to place the film 110 on the film table 133 Rest. On the other hand, the pushing member 153 protruding downward in front of the suction hole 151 may be arranged to be deflected to the outside of the film table 133. Therefore, when the film picker 150 descends, the pressing member 153 can be prevented from colliding with the film table 133.

Referring to FIG. 10, the film picker 150 moves up to the cutting position of the film 110 along the picker conveying rail 135 in a state of being raised again. Then, the film picker 150 arrives at the cutting position of the film 110, and then descends, so that the pressing member 153 presses the film 110. At this time, the pressing member 153 presses against the cutting line of the film 110 (left side of the drawing).

Before the film 110 is cut, a vacuum pressure is formed in the suction hole 149 of the film seating portion 148 of the film cutout portion 140 so as to adsorb the rear of the cut line (the left side of the drawing) of the film 110 do. Therefore, the film 110 is fixed both forward and rearward, so that the film 110 is prevented from being lifted during the cutting process, and a smooth cut surface can be formed.

When the film 110 is fixed through the above process, the cutting member 147 cuts the film 110 while moving in the width direction of the film. At this time, the initial position of the cutting member 147 may be provided on the outer side of the widthwise edge of the film, and the final position of the cutting member 147 may be provided on the outer side of the widthwise opposite edge of the film.

11 shows a state in which the length of the film 110 after cutting is changed by transferring the film cut portion 140. FIG.

The film 110 can be cut to various lengths. As an example, in the case of a film used for compression molding of a substrate, it may be cut to a size corresponding to the size of the substrate. That is, when the size of the substrate is reduced, the size of the powder tray 12 becomes smaller, and the film 110 can be cut to correspond to the size of the powder tray 12 reduced in size.

Comparing FIG. 2 and FIG. 11, it can be seen that the length of the film table 133-1 shown in FIG. 11 is shortened. This is for cutting the film 110 with a shorter cutting length. That is, by using the film table corresponding to the cutting length of the film 110 while replacing the film 110, the film 110 can be cut larger than the powder tray 12 to prevent the film 110 from being wasted.

On the other hand, in comparison between FIG. 2 and FIG. 11, it can be seen that the film cutout 140 shown in FIG. 11 has moved forward (left in the drawing). In this case, the moving distance of the film cutout 140 may be half the length of the film table 133-1 of FIG. 11 compared to the length of the film table 133 of FIG. That is, when the length of the film table 133 of FIG. 2 is a and the length of the film table 133-1 of FIG. 11 is b, the film cut portion 140 of FIG. 11 moves forward One distance may be (ab) / 2.

2 and Fig. 11, it can be seen that the center position C of the film table 133 or 133-1 is constant. When the film table 133-1 corresponds to the size of the substrate, the tray picker 20 is moved to the film table 133-1 at a position where the center position of the film table 133-1 and the center position of the tray picker 20 coincide with each other The film 110 and the powder tray 12 can be picked up.

On the other hand, when the size of the substrate is changed and the film table 133-1 is exchanged, the central axis C, which is 1/2 of the length of the film to be cut, The position of the film table 133-1 can be fixed by fastening the film table 133-1 to the base plate 130. [

When the size of the film table 133-1 is changed according to the length of the film to be cut, the film table 133-1 is wound around the film table 133-1 with reference to one side of the film table 133-1 where the cutter is located. The film 110 can be supplied by varying the amount of the film picker 150 to the side end.

Referring to FIG. 1, the tray picker 20 moves only along the tray picker conveying rail 21 disposed in the X-axis direction, and can not move in the Y-axis direction. If the film cutting section 140 does not move when the film table 133-1 of FIG. 11 is disposed instead of the film table 133 of FIG. 2, the center position C of the film 110 is shifted in the Y- . Therefore, the tray picker 20 can not pick up the cut film 110 shorter.

The tray picker 20 moves in the X-axis direction so that the center position C of the film 110 always coincides with the movement of the film cutout portion 140 as the size of the film table 133-1 becomes smaller, So that the film 110 can be picked up.

Next, a film cutting apparatus 101 according to another embodiment of the present invention will be described with reference to FIGS. 12 and 13. FIG. FIG. 12 is a side view showing a film cutting apparatus 101 according to another embodiment of the present invention, and FIG. 13 shows a state in which a length after cutting a film is changed by transferring the film cutting unit 140.

The film cutting apparatus 101 according to another embodiment of the present invention may be provided so that the film table 133-2 moves together with the film cutout 140. [ That is, the cutting length of the film 110 is changed, and the film table 133-2 can move together with the film cut portion 140 moving in the longitudinal direction of the film.

To this end, the film table 133-2 may be fixed to the film cutout 140 rather than to the base plate 130. That is, the film cutout portion 140 is fixed to one side of the film table 133-2, and the cutter feed rail 131 (see FIG. 1) provided on the base plate 130 that supports the film table 133-2 and the film cutout portion 140 The film 110 can be cut to a predetermined length while being moved together along the longitudinal direction of the film.

The film cutting apparatus 101 can cut the film 110 to match the changed length without replacing the film table 133-2 even when the cut length of the film 110 is changed.

Comparing FIG. 12 and FIG. 13, it can be seen that the film cutout 140 of FIG. 13 has moved forward (left in the drawing). At this time, the movement distance of the film cut portion 140 may be half of the cut length of the film. That is, when the cut length of the film of Fig. 12 is c and the cut length of the film of Fig. 13 is d, the distance that the film cut portion 140 of Fig. 13 moves forward (cd) .

More specifically, when the film table 133-2 and the film cutout 140 are fixed and move together, the center axis of the half of the length of the film to be cut and the center axis of the tray picker 20 coincide with each other The film table 133-2 is moved in the Y axis direction so that the film cut portion 140 is moved from one side of the fixed film table 133-2 to the film table 133-2 The film 110 can be supplied.

In addition, the distance that the film picker 150 picks up the film 110 and travels is also reduced by the cutting length of the reduced film.

That is, the amount of movement of the film picker 150, which adsorbs the film 110, is varied based on the film cutout 140 fixed to one side of the film table 133-2, The film 110 can be supplied as much as the length.

When the cutting length of the film 110 is shortened, the film cut portion 140 moves by half of the cut length of the film 110, so that the center position of the powder tray 12 placed on the cut film 110 and the center position of the tray picker 20 May be disposed on the film table 133-2 so as to be coincident with each other. Accordingly, the tray picker 20 moving in the X-axis direction can pick up the film 110 at the same position.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

10: Compression molding apparatus 11: Powder tray supply section
12: Powder tray 20: Tray picker
21: tray picker conveying rail 30: tray cleaning part
31: Cleaning table 32: Cleaning device
33: Cleaning table transferring rail 40: Powder supply part
50: Powder tray feeder 51: Tray feeder feed rail
100: Film cutting device 110: Film
120: Film supply part 130: Base plate
131: cutter feed rail 132: table support
133: Film table 134: Picker support
135: Picker conveying rail 140: Film cut section
141: body portion 142: rail block
143: Moving block 144: Cutter joining block
145: cylinder 146: shock absorbing member
147: cutting member 148:
149: Adsorption hole 150: Film picker
151: suction hole 152: first driving part
153: pressing member 154: second driving section

Claims (14)

A compression molding apparatus for molding a substrate,
A film picker provided with a suction unit capable of adsorbing an upper surface of a film supplied from a film supply unit and movable in the Y axis direction so as to adjust the length of the film;
A film table mounted on the film picker so as to be able to move in the Y-axis direction in order to position the film on which the film picked up by the film picker is adhered;
A film cutting unit fixed to one side of the film table and movably movable in the X axis direction and cutting the film along one side of the film table; And
And a powder tray provided on the upper surface of the cut film and the film cut by the film cutting section and having a through hole for receiving the powder therein are picked up together to move the powder to the feed section side, A tray picker,
Wherein the film picker varies the movement amount of the film picker based on the film cut portion to supply the film to the film table by a predetermined length according to the size of the substrate,
Wherein the film table is located at a position where the central position of the tray picker and the center position of a half of the length of the film to be cut coincide with each other. The method according to claim 1,
Further comprising a base plate for supporting the film table and the film cut portion,
Wherein the film cutting unit moves along the rails provided on the base plate in the longitudinal direction of the film to cut the film in accordance with a predetermined standard. The method according to claim 1,
The position at which the tray picker picks up the cut film and the powder tray is always fixed,
Wherein the tray picker picks up the center portion of the tray picker at a point where the center portion of the powder tray lying on the cut film coincides with each other. The method according to claim 1,
Wherein the film picker suctions the film supplied from the film supply unit and moves in the Y axis direction by a length of the film to be cut from one side of the film table on which the film cut unit is fixed, . The method according to claim 1,
Wherein the film picker further comprises a pressing member capable of pressing a film seated on the film table at a position adjacent to the film cut-
Wherein a brush portion is provided at an end of the pressing member,
And the brush portion removes foreign matter on the upper surface of the film table. 6. The method according to any one of claims 1 to 5,
Wherein the film cutting section includes a film seating section for holding and fixing the bottom surface of the film and a cutter disposed adjacent to the film seating section for cutting the film, And a compression molding device positioned opposite to the compression molding device. 3. The method of claim 2,
The film cutting unit includes a rail block that moves along a rail provided on the base plate, a moving block that is movable in the X-axis direction with respect to the rail block, and a movable block that is movable in the X- And a cutter detachably coupled to the cutter coupling block to cut the film. delete delete delete delete delete delete delete
KR1020150145138A 2015-10-19 2015-10-19 Apparatus of Compression Molding KR101690108B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210087333A (en) 2020-01-02 2021-07-12 한미반도체 주식회사 Molding Powder supplying Apparatus and Molding Powder supplying Method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249348B1 (en) * 2011-04-27 2013-04-01 (주)엔에스 Cutting processor for roll film and mothod thereof
KR101417329B1 (en) * 2011-10-07 2014-07-08 다이-이치 세이코 가부시키가이샤 Resin encapsulating apparatus
KR101515720B1 (en) * 2013-12-23 2015-04-27 세메스 주식회사 Apparatus for supplying release film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249348B1 (en) * 2011-04-27 2013-04-01 (주)엔에스 Cutting processor for roll film and mothod thereof
KR101417329B1 (en) * 2011-10-07 2014-07-08 다이-이치 세이코 가부시키가이샤 Resin encapsulating apparatus
KR101515720B1 (en) * 2013-12-23 2015-04-27 세메스 주식회사 Apparatus for supplying release film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210087333A (en) 2020-01-02 2021-07-12 한미반도체 주식회사 Molding Powder supplying Apparatus and Molding Powder supplying Method

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