KR101681116B1 - 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법 - Google Patents

인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법 Download PDF

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Publication number
KR101681116B1
KR101681116B1 KR1020160064796A KR20160064796A KR101681116B1 KR 101681116 B1 KR101681116 B1 KR 101681116B1 KR 1020160064796 A KR1020160064796 A KR 1020160064796A KR 20160064796 A KR20160064796 A KR 20160064796A KR 101681116 B1 KR101681116 B1 KR 101681116B1
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KR
South Korea
Prior art keywords
palladium
solution
hole
dip
catalyst solution
Prior art date
Application number
KR1020160064796A
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English (en)
Korean (ko)
Inventor
김건범
조소연
Original Assignee
(주)오알켐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)오알켐 filed Critical (주)오알켐
Priority to KR1020160064796A priority Critical patent/KR101681116B1/ko
Priority to JP2016228300A priority patent/JP6184578B1/ja
Application granted granted Critical
Publication of KR101681116B1 publication Critical patent/KR101681116B1/ko
Priority to CN201710041299.9A priority patent/CN107022755B/zh
Priority to TW106103197A priority patent/TWI609993B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Catalysts (AREA)
KR1020160064796A 2016-05-26 2016-05-26 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법 KR101681116B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160064796A KR101681116B1 (ko) 2016-05-26 2016-05-26 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법
JP2016228300A JP6184578B1 (ja) 2016-05-26 2016-11-24 無電解銅メッキをする方法、及び無電解銅メッキのための触媒溶液を製造する方法
CN201710041299.9A CN107022755B (zh) 2016-05-26 2017-01-19 用于将印刷电路板的通孔无电镀铜的方法、用于其的催化溶液以及用于制备催化溶液的方法
TW106103197A TWI609993B (zh) 2016-05-26 2017-01-26 用於將印刷電路板的通孔無電鍍銅的方法、用於其的催化溶液以及用於製備催化溶液的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160064796A KR101681116B1 (ko) 2016-05-26 2016-05-26 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법

Publications (1)

Publication Number Publication Date
KR101681116B1 true KR101681116B1 (ko) 2016-12-09

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Family Applications (1)

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KR1020160064796A KR101681116B1 (ko) 2016-05-26 2016-05-26 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법

Country Status (4)

Country Link
JP (1) JP6184578B1 (ja)
KR (1) KR101681116B1 (ja)
CN (1) CN107022755B (ja)
TW (1) TWI609993B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3670698A1 (en) * 2018-12-17 2020-06-24 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
CN112969819A (zh) * 2018-11-14 2021-06-15 Ｙｍｔ股份有限公司 电镀积层和印刷电路板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115110070B (zh) * 2022-07-13 2023-10-27 上海天承化学有限公司 一种用于离子钯活化工艺的预浸液及其应用
CN117779004A (zh) * 2023-12-27 2024-03-29 广东哈福技术股份有限公司 一种用于离子钯活化工艺的预浸液及其使用方法

Citations (3)

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JP2001323381A (ja) * 2000-05-16 2001-11-22 Sony Corp めっき方法及びめっき構造
JP2012151267A (ja) * 2011-01-19 2012-08-09 Konica Minolta Ij Technologies Inc 金属パターンの製造方法
KR101484938B1 (ko) * 2014-11-05 2015-01-21 (주)오알켐 이온 팔라듐 촉매를 사용한 이물질 발생이 없는 다층 인쇄 회로 기판의 동도금 방법

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EP0109402B1 (en) * 1982-05-26 1988-06-01 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
JP3220350B2 (ja) * 1995-05-15 2001-10-22 イビデン株式会社 プリント配線板の製造方法
US20020197404A1 (en) * 2001-04-12 2002-12-26 Chang Chun Plastics Co., Ltd., Taiwan R.O.C. Method of activating non-conductive substrate for use in electroless deposition
JP3881614B2 (ja) * 2002-05-20 2007-02-14 株式会社大和化成研究所 回路パターン形成方法
US8591637B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronic Materials Llc Plating catalyst and method
CN103094193B (zh) * 2011-11-02 2016-04-06 中芯国际集成电路制造(上海)有限公司 一种铜互连结构的制造方法
JP6272673B2 (ja) * 2013-10-30 2018-01-31 ローム・アンド・ハース電子材料株式会社 無電解めっき用触媒液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323381A (ja) * 2000-05-16 2001-11-22 Sony Corp めっき方法及びめっき構造
JP2012151267A (ja) * 2011-01-19 2012-08-09 Konica Minolta Ij Technologies Inc 金属パターンの製造方法
KR101484938B1 (ko) * 2014-11-05 2015-01-21 (주)오알켐 이온 팔라듐 촉매를 사용한 이물질 발생이 없는 다층 인쇄 회로 기판의 동도금 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112969819A (zh) * 2018-11-14 2021-06-15 Ｙｍｔ股份有限公司 电镀积层和印刷电路板
EP3670698A1 (en) * 2018-12-17 2020-06-24 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
WO2020126145A1 (en) * 2018-12-17 2020-06-25 Atotech Deutschland Gmbh Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof

Also Published As

Publication number Publication date
CN107022755A (zh) 2017-08-08
CN107022755B (zh) 2018-06-12
JP2017210679A (ja) 2017-11-30
TW201741498A (zh) 2017-12-01
JP6184578B1 (ja) 2017-08-23
TWI609993B (zh) 2018-01-01

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