KR101679759B1 - Light emitting device and method for fabricating the same - Google Patents

Light emitting device and method for fabricating the same Download PDF

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Publication number
KR101679759B1
KR101679759B1 KR1020100081751A KR20100081751A KR101679759B1 KR 101679759 B1 KR101679759 B1 KR 101679759B1 KR 1020100081751 A KR1020100081751 A KR 1020100081751A KR 20100081751 A KR20100081751 A KR 20100081751A KR 101679759 B1 KR101679759 B1 KR 101679759B1
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South Korea
Prior art keywords
light
light emitting
emitting device
layer
phosphor
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KR1020100081751A
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Korean (ko)
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KR20120018846A (en
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조경우
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엘지이노텍 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)

Abstract

The present invention relates to a light emitting device package for improving spectral uniformity and a manufacturing method thereof. A method of manufacturing a light emitting device package according to an embodiment includes: mounting a plurality of light emitting devices on a substrate on which electrodes are formed so as to be spaced apart; Inspecting the optical characteristics of each of the light emitting devices; Determining an amount of a light-transmitting layer to be laminated on each of the light-emitting elements based on optical characteristics of the light-emitting elements; Stacking a light-transmitting layer on each of the light-emitting elements according to the determined amount of the light-transmitting layer; Laminating a phosphor layer on the light emitting device and the light transmitting layer; Laminating a resin layer on the phosphor layer; And a control unit.
According to the embodiment, it is possible to provide a light emitting device package with improved spectral uniformity and improved yield, and a method of manufacturing the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package,

The present invention relates to a light emitting device package for improving spectral uniformity and a manufacturing method thereof.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using semiconductor materials of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

A light emitting device package in which a light emitting device is mounted on a package body and is electrically connected is widely used as a light source of a display device. In such a light emitting device package, a light emitting element is mounted on a substrate, and a lead frame for forming an electrode is disposed on the substrate. The light emitting element is electrically connected to the lead frame. A phosphor layer is laminated on the light emitting element, and a resin layer is laminated on the phosphor layer. For example, white light can be emitted while light from a light emitting element that emits blue light passes through a yellow phosphor. A lens may be attached on the resin layer to condense the light emitted from the light emitting element.

In general, a difference in luminous intensity or color temperature occurs in each light emitting device due to a process variation when a light emitting device is manufactured. However, in spite of variations in the luminous intensity or color temperature of such a light emitting device, a certain amount of phosphors are always laminated on the light emitting device, and the white light of the finished light emitting device package does not have the desired optical characteristics.

Embodiments provide a light emitting device package having improved spectral uniformity and improved yield, and a manufacturing method thereof.

A method of manufacturing a light emitting device package according to an embodiment includes: mounting a plurality of light emitting devices on a substrate on which electrodes are formed so as to be spaced apart; Inspecting the optical characteristics of each of the light emitting devices; Determining an amount of a light-transmitting layer to be laminated on each of the light-emitting elements based on optical characteristics of the light-emitting elements; Stacking a light-transmitting layer on each of the light-emitting elements according to the determined amount of the light-transmitting layer; Laminating a phosphor layer on the light emitting device and the light transmitting layer; Laminating a resin layer on the phosphor layer; And a control unit.

In addition, the optical characteristics of the light emitting device are luminous intensity or color temperature.

Further, the light-transmitting layer includes a silicone gel.

Further, the height of the light-transmitting layer is 1 to 200 mu m.

Further, the volume of the light-transmitting layer is 1 to 200% of the volume of the light emitting device.

In addition, the step of laminating the phosphor layers may include applying a phosphor between the masking members after the masking members are provided at both sides of the respective light emitting devices at a constant height.

A method of manufacturing a light emitting device package according to an embodiment includes: mounting a plurality of light emitting devices on a substrate on which electrodes are formed so as to be spaced apart; Laminating a phosphor layer on each of the light emitting elements; Inspecting optical characteristics of light emitted through the phosphor layer in each of the light emitting devices; Determining the amount of the phosphor to be added to or removed from the phosphor layer according to the inspection result; Adding a phosphor to the phosphor layer or removing the phosphor from the phosphor layer according to the determined amount; Laminating a resin layer on the phosphor layer; And a control unit.

In addition, the optical characteristics of the light emitting device are luminous intensity or color temperature.

In addition, the step of laminating the phosphor layers may include applying a phosphor between the masking members after the masking members are provided at both sides of the respective light emitting devices at a constant height.

A light emitting device package of an embodiment includes: a substrate; A light emitting element on the substrate; A phosphor layer laminated to cover the light emitting element; A light-transmitting layer laminated on the light-emitting element between the light-emitting element and the phosphor layer to adjust an amount of the phosphor layer to be laminated; A resin layer laminated on the phosphor layer; And the volume of the phosphor layer stacked on the light emitting element is reduced by a volume of the light transmitting layer.

Further, the amount of the light-transmitting layer is controlled according to the optical characteristics of the light-emitting device.

In addition, the optical characteristics of the light emitting device are luminous intensity or color temperature.

According to the embodiment, it is possible to provide a light emitting device package with improved spectral uniformity and improved yield, and a method of manufacturing the same.

1A to 1F are views sequentially illustrating a method of manufacturing a light emitting device package according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of FIGS. 1A to 1F.
3A to 3F are views sequentially illustrating a method of manufacturing a light emitting device package according to a second embodiment of the present invention.
4 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of FIGS. 3A to 3F.
5A to 5F are views sequentially illustrating a method of manufacturing a light emitting device package according to a third embodiment of the present invention.
6 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of Figs. 5A to 5F.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Example  One

Hereinafter, a method of manufacturing a light emitting device package according to a first embodiment of the present invention will be described with reference to FIGS. 1A to 1F and FIG. 1A to 1F are views sequentially illustrating a method of manufacturing a light emitting device package according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of FIGS. 1A to 1F.

In the light emitting device package, a light emitting element is mounted on a substrate, a phosphor layer is stacked on the light emitting element, and light emitted from the light emitting element is emitted through the phosphor layer. Optical characteristics of the light emitting device include luminous flux, illuminance, beam angle, optical efficiency, and color temperature. The light emitting device is fabricated to have the desired optical characteristics according to the design values, but the optical characteristics may be different for each light emitting device due to process variations.

Conventionally, when a light emitting device package is manufactured, a plurality of light emitting elements are mounted on a substrate, and a certain amount of phosphor layers are applied to each light emitting element at a time. Therefore, since the same amount of phosphor layers are applied regardless of the optical characteristics of the respective light emitting devices, the spectrum or the like of the finally fabricated light emitting device package is not uniform, which causes the yield to be lowered. For example, when light from a light emitting element that emits blue light passes through a yellow phosphor, white light is emitted. In the case where the amounts of phosphors stacked thereon are the same regardless of the optical characteristics of the respective light emitting elements, White light having a color temperature may not be emitted, or the like.

The embodiment adjusts the amount of the fluorescent material stacked thereon according to the optical characteristics of each light emitting device so that the spectrum of the finally prepared light emitting device package can be made uniform and the yield can be increased.

Referring to FIG. 1A, a plurality of light emitting devices 130 are mounted on a substrate 110 on which electrodes 120 are formed. Each light emitting element 130 is electrically connected to the electrode 120 by a wire 135.

Next, as shown in FIG. 1B, the optical characteristics of each light emitting device 130 are inspected using the inspection equipment 136. FIG. At this time, the optical characteristic to be inspected may be luminous intensity or color temperature.

For example, the color temperature of the light emitting device 130 that emits blue light may be different due to process variations. That is, the intensity of the blue light emitted by each of the light emitting devices 130 may differ. In this case, if the same amount of yellow phosphor is stacked on each of the light emitting devices 130, white light emitted from the finally manufactured light emitting device package may be deviated and a desired spectrum may not be formed. A light emitting device package in which a desired spectrum is not emitted is treated as a defect, which causes a decrease in yield. Therefore, it is necessary to check the color temperature of the light emitting element 130 and adjust the amount of the phosphor deposited on the light emitting element 130 according to the inspection result.

In addition, a difference in luminous intensity of the light emitting device 130 may occur due to process variations. Even in this case, if the same amount of yellow phosphor is stacked on each light emitting device 130, a difference in brightness may occur in the white light emitted from the finally fabricated light emitting device package. This is because light emitted from the light emitting device 130 passes through the phosphor layer 150 and the light amount and the light efficiency decrease. Therefore, it is necessary to inspect the luminous intensity of the luminous means 130 and adjust the amount of the luminous means to be laminated on the luminous means 130 according to the result of the inspection.

In this embodiment, the light-transmitting layer 140 is formed on the light-emitting device 130 as a means for changing the amount of the fluorescent material stacked on the light-emitting device 130.

Next, as shown in Fig. 1C, the amount of the light-transmitting layer 140 to be laminated on the light-emitting element 130 is determined according to the inspection result of each light-emitting element 130 inspected by the inspection equipment 136 . Then, the light-transmitting layer 140 is stacked on each of the light-emitting devices 130 according to the determined amount.

For example, when the color temperature of each light emitting device 130 is checked by the inspection equipment 136, the light transmitting layer 140 is stacked on the light emitting device 130 having a weak blue light intensity, 130) in a relatively small amount. The amount of the light-transmitting layer 140 to be laminated is determined according to the color temperature of the light-emitting element 130. That is, as the intensity of the blue light is weaker, the amount of the light-transmitting layer 140 stacked on the light-emitting device 130 is increased.

As a result of checking the luminous intensity of each light emitting device 130 by the inspection equipment 136, there may be a light emitting device 130 having a weak light intensity. By stacking the light-transmitting layer 140 on the light-emitting device 130, the amount of the phosphor is relatively reduced, and thus the lightness of the light emitted through the phosphor can be increased.

The light-transmitting layer 140 is formed of a material having excellent light transmittance. Such a light-transmitting layer 140 may comprise, for example, a silicone gel. Silicone gels are known to have very good light transmittance. A relatively small amount of the light transmitting layer 140 is stacked on the left light emitting element 130 and a relatively large amount of the light transmitting layer 140 is stacked on the right light emitting element 130. Depending on the result of the inspection, the light-transmitting layer 140 may not be laminated like the light-emitting device 130 in the middle. The height of the light-transmitting layer 140 may be 1 to 200 mu m. The volume of the light-transmitting layer 140 may be 1 to 200% of the volume of the light-emitting element 130.

Next, as shown in FIG. 1D, a masking member 145 having a constant height is provided on both sides of each light emitting device 130. The masking member 145 may be a stencil mask. The light emitting device 130 is mounted between the respective masking members 145. When the fluorescent substance is applied to the space between the masking members 145, phosphors corresponding to the height of the masking member 145 are stacked on the light emitting device 130 .

FIG. 1E shows a state in which the phosphor layer 150 is coated on the light emitting device 130. FIG.

Next, as shown in Fig. 1F, the masking member 145 is removed. A resin layer may be applied on the phosphor layer 150 in the light emitting device package.

2 shows a light emitting device package 100 manufactured by such a method. As shown in the figure, the light-transmitting layer 140 is laminated on the light-emitting element 130. The light transmitting layer 140 is used to adjust the amount of the phosphor layer 150 to be laminated on the light emitting device 130. That is, the amount of the phosphor layer 150 stacked on the light emitting device 130 is reduced by the volume of the light transmitting layer 140 stacked on the light emitting device 130. In other words, since the phosphor layer 150 stacked on the light emitting device 130 is stacked to have a certain shape, if the light transmitting layer 140 is contained in such a shape, the phosphor layer 150 can not be stacked as much as the space, The amount of layer 150 is reduced.

As described above, the amount of the light-transmitting layer 140 can be adjusted according to the optical characteristics of the light-emitting element 130, for example, the lightness or the color temperature.

Example  2

Hereinafter, a method of manufacturing a light emitting device package according to a second embodiment of the present invention will be described with reference to FIGS. 3A to 3F and FIG. 3A to 3F are views sequentially illustrating a method of manufacturing a light emitting device package according to a second embodiment of the present invention. 4 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of FIGS. 3A to 3F.

In this embodiment, the amount of light emitted from the light emitting element or the light efficiency is changed by adding a phosphor on the phosphor layer stacked on the light emitting element, without laminating the light emitting layer on the light emitting element.

Referring to FIG. 3A, a plurality of light emitting devices 230 are mounted on a substrate 210 on which electrodes 220 are formed. Each light emitting element 230 is electrically connected to the electrode 220 by a wire 235.

Next, as shown in FIG. 3B, masking members 240 having a predetermined height are provided on both sides of the respective light emitting devices 230. This masking member 240 may be a stencil mask.

3C, phosphors are applied to the spaces between the respective masking members 240 so that the phosphor layers 250 corresponding to the height of the masking member 240 are formed on the respective light emitting elements 230 Respectively.

Next, as shown in FIG. 3D, the inspection equipment 245 is used to examine the characteristics of light emitted from each light emitting device 230 through the phosphor layer 250. FIG. At this time, the optical characteristic to be inspected may be, for example, a light intensity, a light efficiency, a color temperature, and the like.

In order to emit white light from the light emitting device package, for example, the light from the light emitting element 230 emitting blue light may pass through the yellow phosphor layer 250. When the blue light is strong in the color temperature of the examined light, it is necessary to complement the yellow phosphor to indicate white light having a desired color temperature. Therefore, when it is determined that the amount of the phosphor layer 250 is insufficient, the desired white light can be obtained by supplementing the phosphor layer 250.

FIG. 3E shows a state in which the phosphor 251 is further stacked on the phosphor layer 250 of the light emitting device 230, which is judged to be insufficient in the amount of the phosphor layer 250. The amount of the added phosphor 251 is based on the inspection result according to the inspection equipment 245. In the drawing, no fluorescent material is stacked on the light emitting element 230 in the middle.

Next, as shown in FIG. 3F, the masking member 240 is removed. A resin layer may be applied on the phosphor layer in the light emitting device package.

FIG. 4 shows a light emitting device package 200 manufactured by such a method. A phosphor layer 250 is stacked on the light emitting device 230 and a phosphor 251 is further stacked on the phosphor layer 250 to increase the amount of the phosphor layer stacked on the light emitting device 230 I will. Thus, desired optical characteristics of the light emitting device package can be obtained.

Example  3

Hereinafter, a method of manufacturing a light emitting device package according to a third embodiment of the present invention will be described with reference to FIGS. 5A to 5F and FIG. 5A to 5F are views sequentially illustrating a method of manufacturing a light emitting device package according to a third embodiment of the present invention. 6 is a cross-sectional view of a light emitting device package manufactured according to the manufacturing method of Figs. 5A to 5F.

In this embodiment, the light amount, the light efficiency, and the color temperature of the light emitted from the light emitting device are changed by removing a part of the fluorescent material stacked on the light emitting device according to the inspection result by the inspection equipment.

Referring to FIG. 5A, a plurality of light emitting devices 330 are mounted on a substrate 310 on which electrodes 320 are formed. Each light emitting element 330 is electrically connected to the electrode 320 by a wire 335.

Next, as shown in FIG. 5B, a masking member 340 having a predetermined height is provided on both sides of each light emitting device 330. FIG. The masking member 340 may be a stencil mask.

5C, phosphors are applied to the spaces between the masking members 340 so that the phosphor layers 350 corresponding to the height of the masking member 340 are formed on the respective light emitting elements 330 Respectively.

Next, as shown in FIG. 5D, the inspection equipment 345 is used to inspect the characteristics of light emitted from the respective light emitting devices 330 through the phosphor layer 350.

When the amount of the phosphor layer 350 is large, the amount of light emitted from the light emitting element 330 may be insufficient through the phosphor layer 350, and the desired white light may not be emitted. Further, when the amount of the phosphor layer 350 is large, the white light emitted from the light emitting element 330 through the phosphor layer 350 may not exhibit a desired color temperature. In this case, the phosphor of the phosphor layer 350 is partially removed in accordance with the inspection result by the inspection equipment 345, so that light emitted from the light emitting device 330 can exhibit desired optical characteristics.

5E shows a state in which the phosphor on the light emitting element 330, which is determined to have a large amount of the phosphor layer 350, is partially removed. The amount of phosphor removed is based on the results of the inspection according to the inspection equipment 345. In the drawing, the phosphor is not removed from the phosphor layer 350 on the light emitting element 330 in the middle.

Next, as shown in FIG. 5F, the masking member 340 is removed. A resin layer may be applied on the phosphor layer 350 in the light emitting device package.

6 shows a light emitting device package 300 manufactured by such a method. As shown, the phosphor layer 350 on the light emitting element 330 was partially removed in the initially laminated state. Accordingly, it is possible to obtain desired optical characteristics of the light emitting device package by controlling the amount of the phosphor layer 350 stacked on the light emitting device 330 according to the inspection result.

As described above, in the light emitting device package and the manufacturing method thereof according to the embodiment, the amount of the phosphor layer stacked on the light emitting device is controlled based on the inspection result by the inspection equipment. The adjustment of the amount of the phosphor layer is controlled by a method of laminating a light-transmitting layer on the light-emitting element, laminating the phosphor on the phosphor layer laminated on the light-emitting element, or partially removing the phosphor from the laminated phosphor layer. Accordingly, a light emitting device package having a uniform spectrum and a desired optical characteristic can be manufactured for each light emitting device package, and the yield can be improved by reducing a defective light emitting device package.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: light emitting device package 110: substrate
120: electrode 130: light emitting element
135: Wire 136: Inspection Equipment
140: light-transmitting layer 145: masking member
150: phosphor layer 160: resin layer

Claims (14)

Mounting a plurality of light emitting elements on a substrate on which electrodes are formed so as to be spaced apart;
Inspecting the optical characteristics of each of the light emitting devices;
Determining an amount of a light-transmitting layer to be laminated on each of the light-emitting elements based on optical characteristics of the light-emitting elements;
Stacking a light-transmitting layer on each of the light-emitting elements according to the determined amount of the light-transmitting layer;
Laminating a phosphor layer on the light emitting device and the light transmitting layer;
Laminating a resin layer on the phosphor layer;
Emitting diode package. The method according to claim 1,
Wherein the optical characteristics of the light emitting device are luminous intensity or color temperature. The method according to claim 1,
Wherein the light-transmitting layer comprises a silicone gel. The method according to claim 1,
And the height of the light-transmitting layer is 1 to 200 占 퐉. The method according to claim 1,
Wherein the volume of the light-transmitting layer is 1 to 200% of the volume of the light-emitting device. The method according to claim 1,
Wherein the step of laminating the phosphor layers comprises applying a phosphor between the masking members after providing a masking member at a constant height on both sides of the respective light emitting elements. delete delete delete Board;
A light emitting element on the substrate;
A phosphor layer laminated to cover the light emitting element;
A light-transmitting layer laminated on the light-emitting element between the light-emitting element and the phosphor layer to adjust an amount of the phosphor layer to be laminated;
A resin layer laminated on the phosphor layer;
/ RTI >
Wherein a volume of the phosphor layer laminated on the light emitting device is reduced by a volume of the light transmitting layer. 11. The method of claim 10,
And the amount of the light-transmitting layer is adjusted according to the optical characteristics of the light-emitting device. 12. The method of claim 11,
Wherein the optical characteristic of the light emitting device is luminous intensity or color temperature. 11. The method of claim 10,
Wherein the light-transmitting layer comprises a silicone gel. 11. The method of claim 10,
And the volume of the light-transmitting layer is 1 to 200% of the volume of the light-emitting element.
KR1020100081751A 2010-08-24 2010-08-24 Light emitting device and method for fabricating the same KR101679759B1 (en)

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KR101296205B1 (en) * 2012-07-20 2013-08-13 주식회사 네패스엘이디 Method for fabricating light emitting device package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134792A (en) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd Manufacturing method of white semiconductor light- emitting device
JP2002344029A (en) 2001-05-17 2002-11-29 Rohm Co Ltd Method of adjusting color tone of light-emitting diode
JP2004186488A (en) 2002-12-04 2004-07-02 Nichia Chem Ind Ltd Light emitting device, manufacturing method thereof, and chromaticity adjusting method thereof
JP2009260244A (en) * 2008-03-25 2009-11-05 Toshiba Corp Light-emitting device and method of manufacturing the same, and apparatus for manufacturing light-emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134792A (en) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd Manufacturing method of white semiconductor light- emitting device
JP2002344029A (en) 2001-05-17 2002-11-29 Rohm Co Ltd Method of adjusting color tone of light-emitting diode
JP2004186488A (en) 2002-12-04 2004-07-02 Nichia Chem Ind Ltd Light emitting device, manufacturing method thereof, and chromaticity adjusting method thereof
JP2009260244A (en) * 2008-03-25 2009-11-05 Toshiba Corp Light-emitting device and method of manufacturing the same, and apparatus for manufacturing light-emitting device

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