KR101678937B1 - Three dimensional camera module and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a three-dimensional camera module and a method of manufacturing the same.
That is, the three-dimensional camera module of the present invention comprises: a first image sensor chip for photographing a left eye image; A second image sensor chip for photographing a right eye image; A printed circuit board on which the first image sensor chip and the second image sensor chip are mounted with a predetermined spacing therebetween; And a connector electrically connected to the printed circuit board.

Description

[0001] The present invention relates to a three-dimensional camera module and a manufacturing method thereof,

The present invention relates to a three-dimensional camera module that can easily implement a three-dimensional camera module by a modularization process of mounting a two-dimensional image sensor chip on a printed circuit board, and a method of manufacturing the same.

In general, camera modules applied to portable mobile communication devices such as camera phones, personal digital assistants (PDAs), smart phones, and IT devices are manufactured in a small size. Recently, various functions A mobile communication device equipped with a camera module having a built-in camera module is gradually being launched.

Such a camera includes a plurality of lenses, and is configured to adjust the optical focal length by moving each lens and changing its relative distance.

The camera module is manufactured using an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) as a main component. The camera module condenses an image of an object through the image sensor, And the stored data is outputted as an image through a display medium such as an LCD or a PC monitor in the apparatus.

The present invention solves the problem that a three-dimensional camera module can be simply implemented by a modularization process of mounting a two-dimensional image sensor chip on a printed circuit board.

According to the present invention,

A first image sensor chip for capturing an image for the left eye;

A second image sensor chip for photographing a right eye image;

A printed circuit board on which the first image sensor chip and the second image sensor chip are mounted with a predetermined spacing therebetween;

A three-dimensional camera module including a connector electrically connected to the printed circuit board is provided.

According to the present invention,

A first image sensor chip for capturing an image for the left eye;

A second image sensor chip for photographing a right eye image;

A printed circuit board on which the first image sensor chip and the second image sensor chip are mounted with a predetermined spacing therebetween;

A three-dimensional camera module is provided on the lower surface of the printed circuit board and includes terminals electrically connected to the first image sensor chip and the second image sensor chip.

According to the present invention,

Preparing a first image sensor chip for capturing a left eye image and a second image sensor chip for capturing a right eye image;

Mounting the first image sensor chip and the second image sensor chip on a printed circuit board;

Electrically connecting the first image sensor chip and the second image sensor chip to the printed circuit board;

And mounting a connector electrically connected to the printed circuit board.

The three-dimensional camera module according to the present invention can be easily implemented by a modularization process in which a first image sensor chip for photographing a left eye image and a second image sensor chip for photographing a right eye image are mounted on a printed circuit board There is an effect that can be.

The three-dimensional camera module according to the present invention includes a first image sensor chip and a second image sensor chip mounted on a substrate to implement a three-dimensional camera module, The interval between the second image sensor chips can be freely designed.

1 is a conceptual drawing for explaining a three-dimensional camera module according to the present invention;
2 is a conceptual diagram for explaining a state where a connector is connected to a three-dimensional camera module according to the present invention.
3 is a schematic cross-sectional view illustrating a state in which a three-dimensional camera module according to the present invention is connected to a main board of an electronic device
4 is a schematic plan view showing a state in which a connector is formed on the bottom surface of the three-dimensional camera module according to the present invention.
5 is a schematic sectional view for explaining a state in which the three-dimensional camera module of FIG. 4 is connected to a main board of an electronic device
6 is a schematic cross-sectional view for explaining a state in which a three-dimensional camera module according to the present invention is flip-chip bonded to a main board of an electronic device
FIGS. 7A to 7C are schematic views for explaining examples of an electronic apparatus equipped with a three-dimensional camera module according to the present invention; FIGS.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a conceptual diagram for explaining a three-dimensional camera module according to the present invention.

The three-dimensional camera module according to the present invention includes a first image sensor chip 110 for photographing a left eye image and a second image sensor chip 120 for photographing a right eye image on a printed circuit board 100, .

Therefore, there is an advantage that a three-dimensional camera module can be realized by a simple modularization process in which the first image sensor chip 110 and the second image sensor chip 120 are mounted on the printed circuit board 100.

Here, a rigid printed circuit board or a flexible printed circuit board can be applied to the printed circuit board 100.

The first image sensor chip 110 for capturing the left eye image and the second image sensor chip 120 for capturing the right eye image are spaced apart by a predetermined distance d.

On the other hand, our human eyes are separated by approximately 6.5 cm from the left eye and right eye, and binocular disparity exists between the left eye and the right eye.

In other words, the two eyes of the human right and left eyes see different two-dimensional images, and these two images are transmitted to the brain through the retina and are recognized as a three-dimensional image.

Likewise, three-dimensional stereoscopic images can be obtained by taking two different cameras at different angles by using the principle of binocular parallax described above, projecting two different projectors on a screen, and seeing three-dimensional images with human eyes .

At this time, the interval between the two cameras is necessary, and there is a difference in the distance between the shooting of the object at a distance and the shooting of a close object.

Therefore, the present invention implements the three-dimensional camera module by mounting the first image sensor chip 110 and the second image sensor chip 120 on the substrate 100, The distance d between the first image sensor chip 110 and the second image sensor chip 120 can be freely designed.

For example, a webcam mounted on an LCD monitor and a notebook PC mainly shoots a subject at a short distance, and a camera mounted in a mobile phone shoots a subject at a short distance and at a long distance.

When the three-dimensional camera module according to the present invention is used for close-up photography, the distance between the first image sensor chip 110 and the second image sensor chip 120 is set to 1.5 cm to 2 cm It is good to do.

In addition, when the three-dimensional camera module is used for long-distance photographing, the distance between the first image sensor chip 110 and the second image sensor chip 120 may be set to 2 cm to 6.5 cm.

FIG. 2 is a conceptual diagram for explaining a state in which a connector is connected to a three-dimensional camera module according to the present invention. FIG. 3 is a view illustrating a state in which a three-dimensional camera module according to the present invention is connected to a main board of an electronic device Fig.

The method for manufacturing the three-dimensional camera module will now be described. First, the first image sensor chip 110 and the second image sensor chip 120 are prepared.

In this case, the first and second image sensor chips 110 and 120 perform a conventional semiconductor manufacturing process on a plurality of image sensors on a wafer, integrate them, and then separate the wafer into individual image sensors, ) Process.

Next, the first image sensor chip 110 and the second image sensor chip 120 are mounted on the printed circuit board 100. This process is performed by a conventional die attach process .)

Then, the first image sensor chip 110 and the second image sensor chip 120 are electrically connected to the printed circuit board 100.

Here, the first image sensor chip 110 and the second image sensor chip 120 are electrically connected to the printed circuit board 100 by flip chip bonding using wire bonding or solder.

Subsequently, a connector for connecting to a connector of an external electronic device is electrically connected to the printed circuit board 100.

Thus, the manufacture of the three-dimensional camera module of the present invention is completed.

Therefore, the three-dimensional camera module of the present invention includes a first image sensor chip 110 for photographing a left eye image; A second image sensor chip 120 for capturing a right eye image; A printed circuit board 100 on which the first image sensor chip 110 and the second image sensor chip 120 are spaced apart from each other; And a connector electrically connected to the printed circuit board (100).

As shown in FIG. 2, the connector includes a film 210 having conductive lines electrically connected to the printed circuit board 100; And a connector structure 200 connected to the film 210.

The three-dimensional camera module of the present invention may include a lens barrel having optical lenses.

Therefore, as shown in FIG. 3, the '200' connector structure 200 is connected to the '310' connector structure fixed to the main board 300 of the electronic device, so that the 3D camera module of the present invention is mounted on the electronic device .

FIG. 4 is a schematic plan view showing a state in which a connector is formed on the bottom surface of the three-dimensional camera module according to the present invention, FIG. 5 is a view showing a state in which the three- And is a schematic cross-sectional view for explaining.

In this three-dimensional camera module, a '250' connector structure is formed on the bottom surface of the printed circuit board 100.

The '250' connector structure may be directly connected to the connector fixed to the main board of the electronic device.

That is, the '250' connector structure of the printed circuit board 100 of the three-dimensional camera module is a female connector or a male connector, and the '320' connector structure fixed to the main board 300 of the electronic apparatus is' 250 Lt; RTI ID = 0.0 > a < / RTI > connector structure.

For example, if the '250' connector structure of the printed circuit board 100 of the three-dimensional camera module is a female connector, the '320' connector structure fixed to the main board 300 of the electronic device may include the ' A male connector corresponding to the structure.

Therefore, as shown in FIG. 5, the '250' connector structure of the printed circuit board 100 of the three-dimensional camera module is placed on a '320' connector structure fixed to the main board 300 of the electronic device When the pressure is applied, both can be connected and fixed.

FIG. 6 is a schematic cross-sectional view for explaining a state in which a three-dimensional camera module according to the present invention is flip-chip bonded to a main board of an electronic device. FIGS. 7A to 7C are cross- Fig. 2 is a schematic view for explaining examples of an electronic device equipped with a module. Fig.

The first terminals 101 electrically connected to the first image sensor chip 110 and the second image sensor chip 120 are formed on the lower surface of the printed circuit board 100 of the three-dimensional camera module, The second terminals 301 corresponding to the first terminals 101 are formed on the main board 300 of the main body 300. [

Therefore, when the solder 150 is placed on the second terminals 301 (soldering) and the three-dimensional camera module is directly mounted on the main board 300 of the electronic device, they are combined.

Mounting the printed circuit board 100 of the three-dimensional camera module directly on the main board 300 of the electronic device via the solder 150 may be referred to as flip chip bonding.

Therefore, as shown in FIG. 6, the solder 150 is interposed between the first terminals 101 and the second terminals 301.

As a result, the three-dimensional camera module 500 of the present invention can be utilized in an electronic device such as the LCD monitor 400, the notebook PC 630, and the mobile phone 700 as shown in FIGS. 7A to 7C .

In the case of the notebook PC 500 shown in FIG. 7B, the display unit 610 is connected to the body unit 620, and the 3D camera module 500 is installed on the display unit 610 do.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (11)

A first image sensor chip for capturing an image for the left eye;
A second image sensor chip for photographing a right eye image;
A printed circuit board on which the first image sensor chip and the second image sensor chip are mounted with a predetermined spacing therebetween;
And a first connector structure fixed to a bottom surface of the printed circuit board,
The first connector structure is disposed to be opposed to a second connector structure fixed to a top surface of the main board of the electronic apparatus,
Wherein the first connector structure and the second connector structure are male / male connector structures,
Wherein only a spaced space is provided between the first image sensor chip and the second image sensor chip,
Wherein the first image sensor chip and the second image sensor chip are disposed on an upper surface of the printed circuit board, the first connector structure is disposed on a lower surface of the printed circuit board,
Wherein the spacing space is 1.5 to 6.5 cm.
delete delete delete delete The method according to claim 1,
The electronic device includes:
3D camera module, which is one of LCD monitor, notebook PC and mobile phone.
delete delete delete delete Preparing a first image sensor chip for capturing a left eye image and a second image sensor chip for capturing a right eye image;
Mounting the first image sensor chip and the second image sensor chip on a printed circuit board;
Electrically connecting the first image sensor chip and the second image sensor chip to the printed circuit board;
Fixing a first connector structure to a bottom surface of the printed circuit board;
Securing a second connector structure on the upper surface of the main board of the electronic device so as to face the first connector structure;
Placing the printed circuit board on a top surface of the main board and applying pressure to connect the first connector structure and the second connector structure,
Wherein only a spaced space is provided between the first image sensor chip and the second image sensor chip,
Wherein the first image sensor chip and the second image sensor chip are disposed on an upper surface of the printed circuit board, the first connector structure is disposed on a lower surface of the printed circuit board,
Wherein the spacing space is 1.5 to 6.5 cm.

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