KR101677375B1 - Sample inserting apparatus for electroplating simulator - Google Patents

Sample inserting apparatus for electroplating simulator Download PDF

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Publication number
KR101677375B1
KR101677375B1 KR1020150096058A KR20150096058A KR101677375B1 KR 101677375 B1 KR101677375 B1 KR 101677375B1 KR 1020150096058 A KR1020150096058 A KR 1020150096058A KR 20150096058 A KR20150096058 A KR 20150096058A KR 101677375 B1 KR101677375 B1 KR 101677375B1
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KR
South Korea
Prior art keywords
specimen
holder
insertion stage
stage
plating
Prior art date
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KR1020150096058A
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Korean (ko)
Inventor
박영재
Original Assignee
주식회사 포스코
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Priority to KR1020150096058A priority Critical patent/KR101677375B1/en
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Publication of KR101677375B1 publication Critical patent/KR101677375B1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An electroplating simulator sample loading apparatus for inserting a specimen into a chamber in which a specimen is plated, the apparatus comprising: an inserting stage in which the specimen is supported and inserted forward into the chamber; A fixed stage connected to the rear surface of the insertion stage and having magnet means for selectively generating a magnetic force while sealing the plating space upon insertion of the insertion stage; And a holder connected to the front of the insertion stage and opened by rotating the upper region forward in relation to the lower region and separating the specimen from the insertion stage.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electroplating simulator,

The present invention provides an additional structure of a holder capable of stably supporting a specimen on an inserting stage inserted into a plated space in a chamber in which a specimen is plated, thereby preventing the specimen or the apparatus from being damaged in the plating process, And the opening of the holder after the work is naturally performed in the conventional plating process, thereby making it easy to remove the specimen.

Conventionally, in performing a plating operation on a specimen, a specimen is inserted into a plating space in a chamber where a specimen is plated. In this process, the specimen is simply loaded into the inserting means while being loaded, so that the specimen may be caught frequently and the bottom of the specimen and the bottom of the apparatus may be damaged.

In addition, even after the plating operation is completed, the specimen comes out of the plating space during the process of falling out of the specimen, resulting in damage of the specimen and the apparatus, resulting in economic loss and delay of the operation.

Accordingly, it is intended to provide a specimen charging apparatus capable of stable support of the specimen and smooth out-of-operation.

It should be understood that the foregoing description of the background art is merely for the purpose of promoting an understanding of the background of the present invention and is not to be construed as an admission that the prior art is known to those skilled in the art.

KR 10-2009-0032227 A

The present invention provides an additional structure of a holder capable of stably supporting a specimen on an inserting stage inserted into a plated space in a chamber in which a specimen is plated, thereby preventing the specimen or the apparatus from being damaged in the plating process, It is an object of the present invention to provide a device for loading a specimen with ease of opening and closing a holder after a work is performed naturally in a conventional plating process.

According to an aspect of the present invention, there is provided an electroplating simulator sample loading apparatus including: an insertion stage to be inserted into an open plating space of a chamber when a specimen is supported and moved forward to a chamber side; A fixed stage connected to the rear surface of the insertion stage and having magnet means for selectively generating a magnetic force while sealing the plating space upon insertion of the insertion stage; And a holder which is connected to the front of the insertion stage and opens by rotating the upper region forward relative to the lower region and separates the specimen from the insertion stage.

The holder includes a front portion parallel to the front surface of the insertion stage; A side portion bent at both ends of the front portion and extending rearward; A lower portion bent at the lower end of the front portion and extending rearward and on which the specimen is seated; And a connection portion extending from a lower portion of the side portion and rotatably connected at a side of the insertion stage.

On both sides of the insertion stage, there is formed a mounting groove recessed in the width direction of the insertion stage so as to receive the side surface and the connection portion of the holder. When the holder rotates forward, An additional portion may be provided.

The front portion may be formed with an opening portion in which a front surface of the specimen placed in the holder is plated to open.

The center of gravity of the holder is located in front of a virtual line extending upward from a pivot point at which the holder rotates, so that the holder can be opened due to inertia due to the weight of the holder when the magnetic force drops.

According to the electroplating simulator specimen charging apparatus of the present invention as described above, the holder, in which the specimen is stably supported by the plating space in the chamber in which the specimen is plated, is disposed in front of the inserting stage, And the specimen and the apparatus are not damaged due to friction with the bottom surface or the like.

In addition, even when the specimen is removed from the apparatus after the completion of the plating operation, the specimen does not fall, and the specimen and the apparatus can be prevented from being damaged.

The lower part of the holder is rotatably installed in front of the insertion stage, and the holder is designed to be automatically opened without any additional facility by the backward movement of the insertion stage after the plating operation, .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing a loading process of a specimen according to an embodiment of the present invention; FIG.
2 is a view showing a holder opened according to an embodiment of the present invention;
3 shows a holder according to an embodiment of the invention.
Figure 4 illustrates an insertion stage according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The electroplating simulator sample loading apparatus according to the present invention is an apparatus for inserting a specimen 10 into a chamber C where a plating operation of the specimen 10 is carried out. When the specimen 10 is supported and moved forward to the chamber C side, An insertion stage 100 to be inserted into the open plating space 20 of the chamber C; A fixing stage 200 connected to the rear surface of the insertion stage 100 and having magnet means 210 for selectively generating a magnetic force by sealing the plating space 20 upon insertion of the insertion stage 100; And a holder 300 connected to the front of the insertion stage 100 and opened by rotating the upper region forward relative to the lower region and separating the specimen 10 from the insertion stage 100.

The chamber C is a place where the plating solution is injected from the inside to perform the plating operation on the test piece 10. Thus, the plating work space opened to the chamber C is provided. The structure to be inserted into the open space of the chamber C is the insertion stage 100.

In one embodiment of the present invention, the insertion stage 100 is connected to a moving means 30 for moving the insertion stage 100. The moving means 30 moves the insertion stage 100 forward and backward in the direction in which the chamber C is present. The open plating space 20 of the chamber C is opened toward the insertion stage 100 side. The insertion stage 100 is inserted into the plating space 20 of the chamber C when the insertion stage 100 moves forward and comes into contact with the chamber C. [

The fixing stage 200 connected to the rear surface of the insertion stage 100 functions to completely seal the plating space 20 of the chamber C, which is primarily opened.

In one embodiment of the present invention, the area of the front surface of the fixed stage 200 is larger than the front surface area of the insertion stage 100. The fixing stage 200 formed on the rear surface of the insertion stage 100 when the insertion stage 100 is moved forward and inserted into the chamber C is brought into close contact with the chamber C so that the plating space 20 of the chamber C It is sealing.

The plating solution is sprayed for plating the test piece 10 in the plating space 20 of the chamber C. When the plating space 20 is not closed in this process, And thus interferes with the smooth operation of the device.

As in the present invention, the plating space 20 is completely closed during the plating operation, thereby preventing external contamination as described above.

In addition, the fixed stage 200 is provided with a magnet unit 210 to serve to fix the test piece 10. The test piece 10 is fixed to the fixed stage 200 by the magnetic force due to the magnet unit 210 in the plating space 20. [ The rear surface of the test piece 10 is brought into close contact with the fixed stage 200, and the front surface of the test piece 10 is plated with the plating solution.

If the fixed stage 200 is not equipped with the fixing means for the specimen 10 such as the magnet means 210, the specimen 10 moves in accordance with the spraying of the plating solution in the plating space 20, The plating is not uniformly performed and accurate testing or measurement is not performed. Therefore, the magnet unit 210 as described above is required.

However, it is obvious that the magnetic force generated by the magnet means 210 must be selectively generated so that the charging and discharging of the charging device becomes smooth after completion of the plating operation of the test piece 10.

A holder 300, in which the test piece 10 is received, is positioned on the front surface of the insertion stage 100. When the specimen 10 is fixed only by the magnet unit 210 as in the conventional case, the specimen 10 may lose its weight when moving to the chamber C of the specimen loading means and may be dropped to the bottom. In this case, not only the specimen 10 but also the plating apparatus may be damaged. Also, even after the completion of the plating operation, even when the test piece 10 is taken out, the test piece 10 may fall down due to the drop of the magnetic force, and the above damage may occur.

Therefore, by adding a configuration for physically fixing the test piece 10 as in the present invention, the test piece 10 can be stably moved together with the movement of the charging device and inserted into the plating space 20. After completion of the plating operation, (10) can be safely removed.

The lower portion of the holder 300 is connected to the side of the insertion stage 100 and the upper region of the holder 300 is rotated forward with respect to the lower region so that the upper end of the holder 300 is opened with a circular arc. The specimen 10 is inserted into the open space of the holder 300 and the holder 300 is closed and inserted into the plating space 20 and then the specimen 10 is fixed in the plating space 20 by the magnetic force.

When the plating operation is completed, the magnetic force is released and the holder 300 and the fixing stage 200 to which the insertion stage 100 is connected move backward. As will be described in detail below, the holder 300 is rotated forward due to inertia due to its own weight to open the plated sample 10 from the plunger.

Alternatively, the magnetic force generated by the magnet unit 210 may be generated before entering the plating space 20, so that the test piece 10 may be more securely fixed and then inserted. Even in this case, the specimen 10 can be stably supported regardless of the weight of the specimen 10 itself.

The technical idea of the present invention is to stably mount the specimen 10 on the insertion stage 100 inserted with the specimen 10 into the plating space 20 in the chamber C where the plating of the specimen 10 is performed It is possible to prevent the specimen 10 or the apparatus from being damaged during the plating process and to open the holder 300 after the plating operation is carried out naturally in the conventional plating process, 10) is easy to remove.

In the electroplating simulator sample loading apparatus according to the present invention, the holder 300 includes a front portion 310 parallel to the front surface of the insertion stage 100; A side portion 320 bent at both ends of the front portion 310 and extending rearward; A lower portion 330 folded at the lower end of the front portion 310 and extending rearward and on which the test piece 10 is seated; And a connection part 340 extending from the lower side of the side part 320 and rotatably connected at the side of the insertion stage 100. [

The front portion 310 of the holder 300 is configured to be parallel to the front surface of the insertion stage 100 so that the specimen 10 entering the holder 300 can also be positioned parallel to the insertion stage 100, An even plating operation can be performed on the entire surface of the specimen 10 in the plating chamber 20.

The extended length of the side portion 320 bent from both ends of the front portion 310 and extending rearward may be greater than the thickness of the test piece 10 to accommodate the test piece 10.

The extended length of the lower portion 330 bent rearward from the lower end of the front portion 310 should be larger than the thickness of the test piece 10 and should be the same as the extended length of the side portion 320, (310) may be positioned parallel to the insertion stage (100).

According to an embodiment of the present invention, a drain port is formed in the lower surface portion 330, and the plating solution plated with the test piece 10 may be discharged through the discharge port. If not discharged, it may accumulate in the space between the specimen 10 and the holder 300 in the holder 300, so that the surface may not be uniformly plated.

A connection part 340 extending from the lower side of the side part 320 toward the insertion stage 100 is formed and connected to the insertion stage 100. At this time, a hole penetrating the side of the connection part 340 and the insertion stage 100 is formed, a fixing pin is connected to the connection part 340, a groove is formed in the connection part 340, and a protrusion protruding from the side of the insertion stage 100 So that the upper region can be rotated forward with respect to the lower region of the holder 300. The upper portion of the holder 300 can be rotated in the forward direction.

The extended form of the connecting portion 340 must extend downwardly from the lower portion of the side portion 320 toward the insertion stage 100 side so that the holder 300 can be pivoted forward to secure a certain pivoting angle.

According to the embodiment of the present invention, since the holder 300 is made of a conductor, the magnetic force by the magnet means 210 is not opened by the weight of the holder 300 in the state of holding the test piece 10, It is possible to stably support the test piece 10 within or outside the test piece 20.

A mounting groove 110 is formed on both sides of the insertion stage 100 of the electroplating simulator sample loading apparatus according to the present invention so that the side of the holder 300 and the connection portion 340 are accommodated in the width direction of the insertion stage 100 A limiting part 120 is provided on the lower surface of the seating groove 110 to limit the forward rotation angle of the holder 300 when the holder 300 is rotated forward by contacting the front edge 341 of the connection part 340 .

Even if the holder 300 is newly provided in the existing apparatus by forming the mounting grooves 110 in which the side surfaces of the holder 300 and the connecting portions 340 are accommodated in the width direction so as to accommodate both sides of the insertion stage 100, There is no need to newly change the plating space 20 of the chamber C corresponding to the shape in which the insertion stage 100 is combined. In addition, since the holder 300 can be more stably connected to the insertion stage 100, it is possible to expect an effect that the integrity of both configurations is added.

A limiting part 120 is provided on the lower surface of the seating groove 110 to limit the front rotation angle of the holder 300 when the front edge 341 of the connection part 340 of the holder 300 contacts the holder 300 when the holder 300 rotates forward . If there is no such provision, the holder 300 is opened at a maximum of 90 degrees forward. When the magnetic force is removed and the plate 300 is removed from the plating space 20 by rearward movement, the holder 300 is opened due to inertia, ) Will protrude forward. In this process, the plated surface of the front surface of the test piece 10 may be rubbed against the floor and may be damaged, so that a separate configuration such as the limiting portion 120 is required.

The apparatus for charging an electroplating simulator according to the present invention may have an opening 350 formed in the front part 310 to open the front surface of the specimen 10 placed in the holder 300 .

The opening portion 350 is formed on the front surface of the plating space 20 so that the specimen 10 can be directly supported and fixed in the plating space 20 and can be plated with the plating solution of the sprayed type from the front side. The plating solution may be sprayed in the plating space 20, but the plating solution may be sprayed from the top of the plating space 20 as well as from the front.

In the electroplating simulator specimen charging apparatus according to the present invention, when the center of gravity of the holder 300 exists in front of a hypothetical line extending upward from a pivot point at which the holder 300 is pivoted, The holder 300 is opened by inertia due to its own weight.

The removal of the specimen 10 from the holder 300 should be easy. In order to do so, the holder 300 should be freely opened. However, the holder 300 also needs to be designed to be opened only when the holder 300 is held out of view because it also serves to hold the specimen 10 while receiving it.

A portion where the holder 300 is connected to the insertion stage 100 and rotates forward is defined as a turning point. If the center of gravity of the holder 300 is located forward with respect to an imaginary line extending upward from the pivot point, when the insertion stage 100 is moved backward after the magnetic force by the magnet means 210 is removed, 300 will be opened with inertia according to their own weight, and thus the removal of the specimen 10 will be easy.

There is a technical merit in that the holder 300 is naturally opened when the specimen 10 is to be removed in a series of processes of plating the specimen 10 without any additional configuration or design.

While the present invention has been particularly shown and described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims It will be apparent to those of ordinary skill in the art.

10: Psalm 20: Plating space
100: insertion stage 200: fixed stage
210: Magnet means 300: Holder
310: front portion 320: side portion
330: lower surface portion 340: connection portion

Claims (5)

An electroplating simulator specimen charging apparatus for inserting a specimen into a chamber in which a specimen is plated,
An insertion stage to be inserted into the open plating space of the chamber when the specimen is supported and moved forward to the chamber side;
A fixed stage connected to the rear surface of the insertion stage and having magnet means for selectively generating a magnetic force while sealing the plating space upon insertion of the insertion stage; And
And a holder which is connected to a front side of the insertion stage and opens by rotating the upper region forward relative to the lower region and separates the specimen from the insertion stage,
The holder includes a front portion parallel to the front surface of the insertion stage; A side portion bent at both ends of the front portion and extending rearward; A lower portion bent at the lower end of the front portion and extending rearward and on which the specimen is seated; And a connection portion extending from a lower portion of the side portion and rotatably connected at a side of the insertion stage. delete The method according to claim 1,
On both sides of the insertion stage, there is formed a mounting groove recessed in the width direction of the insertion stage so as to receive the side surface and the connection portion of the holder. When the holder rotates forward, the bottom surface of the mounting groove contacts with the front edge of the connection portion, Wherein the first and second electrodes are provided on the surface of the electroplating simulator. The method according to claim 1,
Wherein an opening is formed in the front portion of the specimen which is seated in the holder so that the front surface of the specimen is opened to be plated. The method according to claim 1,
The holder is opened in the inertia due to the self weight of the holder when the magnetic center of gravity of the holder exists in front of the virtual line extending upward from the pivot point at which the holder rotates and the magnetic force is dropped. Device.
KR1020150096058A 2015-07-06 2015-07-06 Sample inserting apparatus for electroplating simulator KR101677375B1 (en)

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KR1020150096058A KR101677375B1 (en) 2015-07-06 2015-07-06 Sample inserting apparatus for electroplating simulator

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Application Number Priority Date Filing Date Title
KR1020150096058A KR101677375B1 (en) 2015-07-06 2015-07-06 Sample inserting apparatus for electroplating simulator

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KR101677375B1 true KR101677375B1 (en) 2016-11-18

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006191038A (en) * 2005-01-05 2006-07-20 Samsung Sdi Co Ltd Aligning system for tray and tray holder
KR20090032227A (en) 2007-09-27 2009-04-01 대륙금속(주) Specimen making device that electroplate on nonconducting resin
KR100897070B1 (en) * 2000-07-09 2009-05-14 브룩스-피알아이 오토메이션(스윗질랜드) 게엠베하 Storage device, especially for the intermediate storage of test wafers
KR20120000962A (en) * 2010-06-28 2012-01-04 현대제철 주식회사 Apparatus for testing coke manufacturing
JP2012012627A (en) * 2010-06-29 2012-01-19 Hitachi High-Technologies Corp Vacuum chamber device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100897070B1 (en) * 2000-07-09 2009-05-14 브룩스-피알아이 오토메이션(스윗질랜드) 게엠베하 Storage device, especially for the intermediate storage of test wafers
JP2006191038A (en) * 2005-01-05 2006-07-20 Samsung Sdi Co Ltd Aligning system for tray and tray holder
KR20090032227A (en) 2007-09-27 2009-04-01 대륙금속(주) Specimen making device that electroplate on nonconducting resin
KR20120000962A (en) * 2010-06-28 2012-01-04 현대제철 주식회사 Apparatus for testing coke manufacturing
JP2012012627A (en) * 2010-06-29 2012-01-19 Hitachi High-Technologies Corp Vacuum chamber device

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