KR101666462B1 - 웨이퍼 스크라이빙을 위한 오토포커스 방법 및 장치 - Google Patents

웨이퍼 스크라이빙을 위한 오토포커스 방법 및 장치 Download PDF

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Publication number
KR101666462B1
KR101666462B1 KR1020107021644A KR20107021644A KR101666462B1 KR 101666462 B1 KR101666462 B1 KR 101666462B1 KR 1020107021644 A KR1020107021644 A KR 1020107021644A KR 20107021644 A KR20107021644 A KR 20107021644A KR 101666462 B1 KR101666462 B1 KR 101666462B1
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KR
South Korea
Prior art keywords
workpiece
laser
laser beam
wafer
measuring
Prior art date
Application number
KR1020107021644A
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English (en)
Korean (ko)
Other versions
KR20110010693A (ko
Inventor
지우핑 자이
준 주
리프 서머필드
청-포 후앙
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20110010693A publication Critical patent/KR20110010693A/ko
Application granted granted Critical
Publication of KR101666462B1 publication Critical patent/KR101666462B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automatic Focus Adjustment (AREA)
KR1020107021644A 2008-03-28 2009-03-24 웨이퍼 스크라이빙을 위한 오토포커스 방법 및 장치 KR101666462B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4042008P 2008-03-28 2008-03-28
US61/040,420 2008-03-28
PCT/US2009/038122 WO2009120706A2 (en) 2008-03-28 2009-03-24 Autofocus method and apparatus for wafer scribing

Publications (2)

Publication Number Publication Date
KR20110010693A KR20110010693A (ko) 2011-02-07
KR101666462B1 true KR101666462B1 (ko) 2016-10-14

Family

ID=41114651

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107021644A KR101666462B1 (ko) 2008-03-28 2009-03-24 웨이퍼 스크라이빙을 위한 오토포커스 방법 및 장치

Country Status (5)

Country Link
JP (1) JP2011517428A (zh)
KR (1) KR101666462B1 (zh)
CN (1) CN101983420B (zh)
TW (1) TWI447468B (zh)
WO (1) WO2009120706A2 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE46672E1 (en) 2006-07-13 2018-01-16 Velodyne Lidar, Inc. High definition LiDAR system
CN102259234A (zh) * 2010-05-26 2011-11-30 Ntn株式会社 激光制图装置和激光制图方法
KR20120019649A (ko) * 2010-08-26 2012-03-07 삼성엘이디 주식회사 레이저 스크라이빙 장치 및 그의 스크라이빙 방법
CN103217098B (zh) * 2012-01-19 2017-05-03 昆山思拓机器有限公司 多光谱光电寻焦器的寻焦方法
CN103212908A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种激光喷嘴零点位置标定方法
CN103955108A (zh) * 2014-05-15 2014-07-30 中国工程物理研究院激光聚变研究中心 多能点谱分辨软x射线分幅成像系统
US10627490B2 (en) 2016-01-31 2020-04-21 Velodyne Lidar, Inc. Multiple pulse, LIDAR based 3-D imaging
CN109154661A (zh) 2016-03-19 2019-01-04 威力登激光雷达有限公司 用于基于lidar的3-d成像的集成照射和检测
US10393877B2 (en) 2016-06-01 2019-08-27 Velodyne Lidar, Inc. Multiple pixel scanning LIDAR
US10386465B2 (en) 2017-03-31 2019-08-20 Velodyne Lidar, Inc. Integrated LIDAR illumination power control
US10545222B2 (en) 2017-05-08 2020-01-28 Velodyne Lidar, Inc. LIDAR data acquisition and control
KR102551322B1 (ko) * 2017-12-08 2023-07-04 주식회사 탑 엔지니어링 변위센서를 이용한 스크라이브 장치 및 그것의 동작 방법
SG11202008643PA (en) * 2018-04-09 2020-10-29 Tokyo Electron Ltd Laser processing device, laser processing system, and laser processing method
US10712434B2 (en) 2018-09-18 2020-07-14 Velodyne Lidar, Inc. Multi-channel LIDAR illumination driver
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US11885958B2 (en) * 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
CN111940910A (zh) * 2019-05-16 2020-11-17 松下知识产权经营株式会社 激光加工装置、激光加工方法以及修正数据生成方法
US11556000B1 (en) 2019-08-22 2023-01-17 Red Creamery Llc Distally-actuated scanning mirror

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000230802A (ja) * 1999-02-10 2000-08-22 Anritsu Corp 変位測定装置
JP2006187782A (ja) * 2005-01-05 2006-07-20 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5117254A (en) * 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
JP2886957B2 (ja) * 1990-09-06 1999-04-26 キヤノン株式会社 自動焦点合せ装置
JPH06297175A (ja) * 1993-04-15 1994-10-25 Nippon Steel Corp レーザ加工装置用ギャップセンサ
JP3555230B2 (ja) * 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
US6031615A (en) * 1997-09-22 2000-02-29 Candela Instruments System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness
JP5122773B2 (ja) * 2006-08-04 2013-01-16 株式会社ディスコ レーザー加工機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000230802A (ja) * 1999-02-10 2000-08-22 Anritsu Corp 変位測定装置
JP2006187782A (ja) * 2005-01-05 2006-07-20 Disco Abrasive Syst Ltd レーザー加工装置

Also Published As

Publication number Publication date
KR20110010693A (ko) 2011-02-07
TWI447468B (zh) 2014-08-01
JP2011517428A (ja) 2011-06-09
TW200951530A (en) 2009-12-16
CN101983420A (zh) 2011-03-02
WO2009120706A2 (en) 2009-10-01
CN101983420B (zh) 2013-06-26
WO2009120706A3 (en) 2010-02-18

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