KR101622498B1 - Corson alloy and method for manufacturing same - Google Patents

Abstract

A corson alloy in which the occurrence of sagging is remarkably suppressed and a method of manufacturing the same are provided. Wherein at least one of Ni and Co is contained in an amount of 0.8 to 4.5% by mass and Si is contained in an amount of 0.2 to 1.0% by mass, the balance being copper and inevitable impurities, (Bending deformation coefficient) of 100 to 120 의 and a Young's modulus in the 45 째 direction (bending deformation coefficient) of not more than 140 의.

Description

[0001] CORSON ALLOY AND METHOD FOR MANUFACTURING SAME [0002]

INDUSTRIAL APPLICABILITY The present invention relates to a lead frame material for a semiconductor device such as a conductive spring material such as a connector, a terminal, a relay and a switch, a semiconductor device such as a transistor or an integrated circuit And a method of manufacturing the same.

BACKGROUND ART [0002] In recent years, miniaturization of electric and electronic parts has progressed, and copper alloy used for these parts has been required to have good strength, electric conductivity and bending workability. In accordance with this demand, there has been an increasing demand for precipitation hardening type copper alloys such as Korson alloys having high strength and electrical conductivity instead of conventional solid solution copper alloys such as phosphor bronze and brass. The Korson alloy is an alloy in which an intermetallic compound such as Ni-Si, Co-Si and Ni-Co-Si is deposited in a Cu matrix, and has high strength, high conductivity and good bending workability.

For example, the connector comprises a female terminal and male terminal, and an electrical connection is obtained by fitting both terminals. In the electrical contact, the female terminal holds the male terminal by its spring force, and a desired contact force is obtained.

If the strength of the female terminal material is low, permanent deformation (sagging) occurs in the female terminal when male terminals are inserted. When sagging occurs, the contact force at the electrical contact portion is lowered, and the electrical resistance is increased. Therefore, in order to suppress the occurrence of sagging, a copper alloy material having a high proof stress and a spring limit value has been developed (for example, Patent Document 1, etc.).

Patent Document 2 proposes a Korson alloy in which the bending deformation coefficient in the rolling direction is adjusted to 105 ㎬ or less so that the spring displacement of the connector can be increased. However, the sagging characteristic of this material is not sufficient in particular when the spring is repeatedly deformed, and there is also a problem that the contact force of the spring is remarkably lowered.

Japanese Patent Application Laid-Open No. 2004-131829 WO2011 / 068134

In order to improve the sagging characteristic of the copper alloy material, it is effective to enhance the strength characteristics such as proof stress and spring limit value. However, due to reasons such as deterioration of bending workability accompanying high strength, improvement in sagging by only high strength has been limited.

Therefore, in the present invention, it is an object of the present invention to provide a corundum alloy in which the occurrence of sagging is remarkably suppressed by using a means other than high strength, and a manufacturing method thereof.

The spring portion of the connector is simplified as a cantilever, and the principle of sagging is explained. As shown in Fig. 1, when the deformation (d) is applied to the position of the length L from the fixed end of the plate spring fixed at one end, the contact force P shown by the following formula 1 is obtained, The maximum stress S represented by the following formula 2 is generated.

P = dEwt ³ / 4L ³ (Equation 1)

S = 3tEd / 2L ² (Equation 2)

Where E is the Young's modulus, w is the plate width, and t is the plate thickness.

If S exceeds the proof stress of the copper alloy, which is the material of the leaf spring, the leaf spring is permanently deformed and sagging occurs in the leaf spring. From Equation 2, it is considered that the lower the Young's modulus of the material, the greater the deformation at which the occurrence of sagging begins, that is, the sagging does not occur well.

Normally, the spring portion of a connector or the like is designed so that its longitudinal direction is orthogonal to the rolling direction in the rolling plane (direction of 90 degrees in Fig. 2). Therefore, it can be said that the Young's modulus in the direction forming the angle of 90 degrees with the rolling direction is low.

On the other hand, the deformation applied to the spring portion of the connector or the like is often made not only once but also many thousands or more times by insertion or removal of the terminal. Especially, in relays and the like, the number of deformation is remarkably large.

The inventor of the present invention has found that the sagging when repeatedly deforming in a direction forming an angle of 90 degrees with the rolling direction has not only a Young's modulus in a direction forming an angle of 90 degrees with the rolling direction but also a Young's modulus in a direction forming an angle of 45 degrees with the rolling direction And that the effect is significant.

According to one aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising the steps of: providing at least one of Ni and Co in an amount of 0.8 to 4.5 mass% and Si in an amount of 0.2 to 1.0 mass%, the balance being copper and inevitable impurities, (Coefficient of bending deformation) of 100 to 120 의 and a Young's modulus in the 45 캜 direction (bending deformation coefficient) of not more than 140 르 in the direction of 90 ° (the angle formed with the rolling direction of the rolled copper foil, Hand alloy.

In one embodiment of the cornson alloy according to the present invention, at least one of Ni and Co is contained in an amount of 0.8 to 4.5% by mass, Si is contained in an amount of 0.2 to 1.0% by mass, the balance of copper and inevitable impurities, Young's modulus in the direction of the drawing (bending strain coefficient) is 106 to 120 mm and Young's modulus in the 45-degree direction (bending strain coefficient) is 106 to 140 mm.

In another embodiment of the cornson alloy according to the present invention, at least one of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn and Ag is contained in an amount of 0.005 to 3.0 mass% .

According to another aspect of the present invention, there is provided an ingot comprising 0.8 to 4.5 mass% of at least one of Ni and Co, 0.2 to 1.0 mass% of Si, and the balance of copper and inevitable impurities, Hot rolled to a thickness of 5 to 20 mm at a temperature of 800 to 1000 占 폚 and then subjected to cold rolling at a degree of processing of 30 to 99% to obtain an average temperature raising rate of 400 to 500 占 폚 at 1 to 50 占 폚 / To 5 to 600 seconds to perform preliminary annealing with a degree of softening of 0.25 to 0.75 and cold rolling with a working degree of 7 to 50% followed by a solution treatment at 700 to 900 DEG C for 5 to 300 seconds and a heat treatment at 350 To 550 DEG C for 2 to 20 hours,

Wherein the degree of softening is represented by S in the following formula:

S = (? ₀ -?) / (? ₀ -? ₉₀₀ )

Where? ₀ is the tensile strength before pre-annealing,? And? ₉₀₀ are the tensile strength after pre-annealing and after annealing at 900 占 폚, respectively.

In one embodiment of the method for producing the Korson alloy according to the present invention, the ingot contains at least one of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, 3.0% by mass.

According to another aspect of the present invention, there is provided a new article having a corson alloy of the present invention.

According to another aspect of the present invention, there is provided an electronic device part having a corseon alloy of the present invention.

According to the present invention, when used as an electronic part such as a connector for designing a spring in a direction perpendicular to a rolling direction in a rolling plane, a corson alloy in which the occurrence of sagging accompanied with the operation of the spring is remarkably suppressed, Method can be provided.

Fig. 1 is an explanatory diagram of a principle in which sagging occurs.
Fig. 2 is a view showing the rolling direction of the rolled copper foil of the Korson alloy in the rolling plane, the direction making 45 degrees to the rolling direction, and the direction making 90 degrees to the rolling direction.
Fig. 3 is a relation diagram of annealing temperature and tensile strength when the alloy according to the present invention is annealed at various temperatures. Fig.
4 is an explanatory diagram of a deformation test related to the embodiment.

(Amount of addition of Ni, Co and Si)

Ni, Co, and Si are precipitated as intermetallic compounds such as Ni-Si, Co-Si, and Ni-Co-Si by appropriate aging treatment. The strength of the copper alloy is improved by the action of the precipitate, and Ni, Co and Si solidified in the Cu matrix by the precipitation are decreased, so that the conductivity is improved. However, when the total amount of Ni and Co is less than 0.8 mass% or Si is less than 0.2 mass%, desired strength can not be obtained. On the contrary, when the total amount of Ni and Co exceeds 4.5 mass% or Si exceeds 1.0 mass% The conductivity is lowered. Therefore, in the corundum alloy according to the present invention, the addition amount of at least one of Ni and Co is 0.8 to 4.5% by mass, and the addition amount of Si is 0.2 to 1.0% by mass. The addition amount of at least one of Ni and Co is preferably 1.0 to 4.0% by mass, and the addition amount of Si is preferably 0.25 to 0.90% by mass.

(Other added elements)

Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn and Ag contribute to the strength increase.

Zn is effective for improving the heat peelability of Sn plating, Mg for improving stress relaxation property, and Zr, Cr and Mn for improving hot workability. If the total amount of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn and Ag is less than 0.005 mass%, the above effect can not be obtained. Therefore, in the corundum alloy according to the present invention, it is preferable that these elements are contained in a total amount of 0.005 to 3.0 mass%, more preferably 0.01 to 2.5 mass%.

(Young's modulus)

By controlling the Young's modulus in the 90 degree direction to be low, the sagging of the spring designed in the rolling orthogonal direction is reduced. The Young's modulus in the 90 degree direction of a typical Korson alloy is about 125 to 130.. By adjusting the Young's modulus to 120 ㎬ or less, sagging becomes significantly smaller than that of a conventional Korson alloy. On the other hand, when the Young's modulus is lowered, the contact force at the electrical contact is lowered, as is apparent from the above-mentioned formula (1). When the Young's modulus in the 90-degree direction is less than 100 ㎬, the increase of the contact resistance accompanying the drop of the contact force can not be ignored. Therefore, the Young's modulus in the 90 degree direction is adjusted to 100 to 120 degrees. From the viewpoint of the contact force, it is more preferable that the Young's modulus in the direction of 90 degrees is 106 ㎬ or more. The more preferable range of the Young's modulus is 110 to 115..

On the other hand, in the case of the Korson alloy having the Young's modulus in the 90-degree direction adjusted to 100-120 ㎬, the Young's modulus in the 45-degree direction may exceed 140 하고 and reach 150 ㎬ or more. By controlling the Young's modulus in the 45 ° direction to be suppressed and adjusting the Young's modulus in the 45 ° direction to 140 ㎬ or less, more preferably 130 ㎬ or less, not only sagging at the time of one deformation but also Sagging is also improved.

Further, in the case of the Korson alloy whose Young's modulus in the 90-degree direction is adjusted to 100-120 어떻게, the Young's modulus in the 45-degree direction is extremely small when the manufacturing method is adjusted, and when the Young's modulus is less than 110 ㎬ Less, and even less than 120.. In other words, the Young's modulus in the 90 ° direction is 100-120 ° and the Young's modulus in the 45 ° direction is adjusted to 140 ° or lower. In the Korson alloy of the present invention, the Young's modulus in the 45 ° direction is typically 106 ㎬ or more, Typically more than 110,, more typically more than 120.. The Young's modulus value of the present invention is a value measured as a bending modulus of a cantilever beam.

(Manufacturing method)

In the general manufacturing process of the Korson alloy, the raw materials such as electric copper, Ni, Co and Si are dissolved in the melting furnace to obtain a molten metal of a desired composition. Then, the molten metal is cast into an ingot. Thereafter, hot-rolled, cold-rolled, solution-annealing and aging are finished in the order of the desired thickness and characteristics. After the heat treatment, the surface may be pickled or polished to remove the surface oxide film generated at the aging time. In order to increase the strength, the solution treatment and the cold rolling after aging or aging may be performed.

In the present invention, a heat treatment (hereinafter also referred to as preliminary annealing) and cold rolling (hereinafter also referred to as light rolling), which are relatively low cost, are performed before the solution treatment to obtain the Young's modulus.

In the preliminary annealing, the material is held at the temperature range of 500 to 700 占 폚 for 5 to 600 seconds to partially recrystallize the grains in the rolled structure formed by cold rolling after hot rolling. The ratio of the recrystallized grains in the rolled structure has an optimum value, and a desired Young's modulus can not be obtained even if it is excessively large or excessively large. The optimum ratio of the recrystallized grains is obtained by adjusting the softness (S) defined below to 0.25 to 0.75.

FIG. 3 illustrates the relation between the annealing temperature and the tensile strength when annealing the pre-annealed material related to the present invention at various temperatures. The specimen with the thermocouple was inserted into a tubular furnace at 950 ° C, and when the specimen temperature measured by the thermocouple reached a predetermined temperature, the specimen was taken out of the furnace, cooled, and the tensile strength was measured. The recrystallization progresses at 500 to 700 ° C, and the tensile strength is rapidly lowered. The gradual decrease in tensile strength on the high temperature side is due to the growth of recrystallized grains.

The degree of softening (S) in the preliminary annealing is defined by the following equation.

S = (? ₀ -?) / (? ₀ -? ₉₀₀ )

Where? ₀ is the tensile strength before pre-annealing,? And? ₉₀₀ are the tensile strength after pre-annealing and after annealing at 900 占 폚, respectively. The temperature of 900 占 폚 is employed as the reference temperature for determining the tensile strength after recrystallization since the alloy according to the present invention is completely recrystallized by annealing at 900 占 폚.

When S is less than 0.25 or exceeds 0.75, the Young's modulus in the 90-degree direction exceeds 120..

In order to adjust S to 0.25 to 0.75, it is preferable to keep the material at a temperature range of 500 to 700 占 폚 for 5 to 600 seconds. When the material temperature exceeds 700 DEG C, or when the holding time exceeds 600 seconds, it becomes difficult to adjust S to 0.75 or less. When the holding time becomes less than 5 seconds, it becomes difficult to adjust S to 0.25 or more. When the material arrival temperature is less than 500 占 폚, the material holding time at 500 to 700 占 폚 becomes zero, and it becomes difficult to adjust S to 0.25 or more as in the case where the holding time is less than 5 seconds.

The adjustment of S from 0.25 to 0.75 can be carried out by the following procedure.

(1) The tensile test strength (? ₀ ) of the material before the pre-annealing is measured.

(2) The material before the pre-annealing is annealed at 900 占 폚. Specifically, a material with a thermocouple is inserted into a tubular furnace at 950 DEG C, and when the sample temperature measured by the thermocouple reaches 900 DEG C, the sample is taken out of the furnace and is water-cooled.

(3) The tensile strength (? ₉₀₀ ) of the material after the 900 占 폚 annealing is obtained.

(4) For example, when? ₀ is 800 MPa and? ₉₀₀ is 300 MPa, the tensile strengths corresponding to softenings of 0.25 and 0.75 are 675 MPa and 425 MPa, respectively.

(5) Annealing conditions are determined so that the tensile strength after annealing is 425 to 675 MPa.

In addition to the control of S, the rate of temperature rise of the material in the preliminary annealing is controlled. In order to obtain a desired Young's modulus, the average heating rate from 400 ° C to 500 ° C is adjusted in the range of 1 to 50 ° C / sec, more preferably in the range of 1.5 to 40 ° C / sec, and more preferably in the range of 2 to 20 ° C / There is a need.

The Young's modulus in the 45 ° direction exceeds 140 아 even if the average heating rate is less than 1 캜 / sec and exceeds 50 캜 / sec. If the average temperature raising rate is lower than 1 캜 / sec, the Young's modulus in the 90 ° direction may be less than 100 경우, and when it exceeds 50 캜 / sec, the Young's modulus in the 90 ° direction may exceed 120 경우 in some cases.

There are two types of annealing systems that are industrially used in the manufacture of new products: continuous annealing in which the furnace is driven in the furnace to heat the furnace, and batch annealing furnaces in which the coils are wound in a furnace to heat the furnace. Generally, the rate of temperature rise at 400 to 500 ° C in the continuous annealing is more than 50 ° C / sec, and the rate of temperature rise at 400 to 500 ° C in the batch annealing is less than 1 ° C / sec. The temperature raising rate of 1 to 50 占 폚 / sec can be achieved by, for example, a countermeasure such as inclining the temperature distribution in the furnace in continuous annealing.

Further, in the above-mentioned step (2), when the sample temperature measured by the thermocouple reaches 900 DEG C, the sample is taken out from the furnace and is water-cooled. Concretely, for example, The wire is cut at the time when the temperature reaches 900 ° C and the water is dropped by dropping it in the water tank formed at the lower part. The water is quickly removed from the furnace by manual operation immediately after the sample temperature reaches 900 ° C, .

After the preliminary annealing, prior to the solution treatment, a light rolling of 7 to 50% is carried out. The machinability R (%) is defined by the following formula.

R = (t ₀ - t) / t ₀ x 100 (t ₀ : plate thickness before rolling, t: plate thickness after rolling)

If the processing degree deviates from this range, the Young's modulus in the 90-degree direction exceeds 120..

The process for producing the alloy according to the present invention is as follows in the order of the process.

(1) Casting of ingots

(2) Hot rolling (at a temperature of 800 to 1000 占 폚 and a thickness of about 5 to 20 mm)

(3) Cold rolling (30 to 99% of processing degree)

(4) Preliminary annealing (degree of softening: S = 0.25 to 0.75, average temperature raising rate at 400 to 500 ° C: 1 to 50 ° C / sec)

(5) Light rolling (7 to 50% processing)

(6) Solution treatment (700 to 900 ° C for 5 to 300 seconds)

(7) Cold rolling (1 to 60% of machining degree)

(8) Aging treatment (2 ~ 20 hours at 350 ~ 550 ℃)

(9) Cold rolling (1 to 50% of working)

(10) Deformation removal annealing (at a temperature of 300 to 700 ° C for 5 seconds to 10 hours)

Here, the hot-rolling 2 can be carried out under the condition of a normal Korson alloy, but it is preferable to finish the rolling to a predetermined thickness in a state where the material temperature is maintained at 350 DEG C or higher, and then immediately cool the steel. As a result, formation of coarse precipitates (which do not contribute to the increase in strength of the product) during cooling after hot rolling is suppressed.

The degree of processing of the cold rolling 3 is preferably 30 to 99%. In order to generate partially recrystallized grains in the preliminary annealing 4, it is necessary to introduce deformation in the cold rolling 3, and effective deformation is obtained at a processing degree of 30% or more. On the other hand, if the degree of processing exceeds 99%, cracks may occur on the edge of the rolled material, and the material under rolling may be broken.

The cold rolling (7 and 9) is carried out arbitrarily for high strength, and the strength is increased with the increase of the rolling degree, while the bendability is lowered. The effect of the present invention is obtained that the sagging is suppressed by the control of the Young's modulus irrespective of the presence or absence of the cold rolling 7 and 9 and the degree of each processing. Cold rolling (7 and 9) may or may not be performed. However, it is not preferable from the viewpoint of bendability that the degree of processing in each of the cold rolling (7 and 9) exceeds the upper limit value, and the degree of each degree of processing below the lower limit value is not preferable from the standpoint of high- .

The deformation removing annealing 10 is carried out arbitrarily in order to recover the spring limit value or the like lowered by the cold rolling in the case of performing the cold rolling 9. The effect of the present invention that the sagging is suppressed by the control of the Young's modulus is obtained regardless of the presence or absence of the deformation-removing annealing 10. Deformation removal annealing 10 may or may not be performed.

Regarding the steps (6) and (8), it is only necessary to select the general manufacturing conditions of the Korson alloy.

The Korson alloy of the present invention can be processed into various new products, for example, plates, rods, and foils. Further, the Korson alloy of the present invention can be used as a lead frame, a connector, a pin, a terminal, a relay, And can be used for electronic device parts such as battery foil. Example

Examples of the present invention will be described below with reference to comparative examples. However, these examples are provided to better understand the present invention and its advantages, and are not intended to limit the invention.

(Example 1)

An alloy containing 2.6% by mass of Ni, 0.58% by mass of Si, 0.5% by mass of Sn and 0.4% by mass of Zn and the balance of copper and inevitable impurities was used as an experimental material, and preliminary annealing and light- Young 's modulus and Young' s modulus on the sagging characteristics of the product.

In a high-frequency melting furnace, 2.5 kg of electric copper was dissolved in an argon atmosphere using a graphite crucible having an inner diameter of 60 mm and a depth of 200 mm. An alloying element was added so that the alloy composition was obtained, the molten metal temperature was adjusted to 1300 占 폚 and then poured into a cast iron mold to prepare an ingot having a thickness of 30 mm, a width of 60 mm and a length of 120 mm. The ingot was heated at 950 占 폚 for 3 hours as hot rolling, rolled to a thickness of 10 mm while keeping the material temperature at 350 占 폚 or higher, and then immediately cooled. The oxide scale on the surface of the hot-rolled plate was ground and removed by grinding. The thickness after grinding was 9 mm. Thereafter, rolling and heat treatment were carried out in the order of the following steps to prepare a product sample having a thickness of 0.15 mm.

(1) Cold Rolling: Cold rolled to a predetermined thickness according to the rolling process of light rolling.

(2) Preliminary annealing: A sample was inserted into an electric furnace adjusted to a predetermined temperature, held for a predetermined time, and then allowed to stand in the atmosphere for cooling. The sample temperature was measured using a thermocouple welded to the sample, and the average temperature raising rate of 400 to 500 ° C and the holding time of 500 to 700 ° C were obtained.

(3) Light rolling: Cold rolling was carried out to various thicknesses of 0.18 mm in various rolling processes.

(4) Solution treatment: A sample was inserted into an electric furnace adjusted to 800 DEG C and held for 10 seconds, and then the sample was placed in a water bath and cooled.

(5) Aging treatment: An electric furnace was used and heated in an Ar atmosphere at 450 캜 for 5 hours.

(6) Cold Rolling: Cold rolling was performed from 0.18 mm to 0.15 mm at a working rate of 17%.

(7) Deformation removal annealing: A sample was inserted into an electric furnace adjusted to 400 DEG C, held for 10 seconds, and left to stand in the atmosphere for cooling.

The following evaluations were performed on the sample after the pre-annealing and the product sample (in this case, deformation-annealed).

(Softness evaluation in preliminary annealing)

The tensile strength of the specimen before and after the pre-annealing was measured in parallel with the rolling direction in accordance with JIS Z 2241 using a tensile tester, and the respective values were defined as? ₀ and?. In addition, σ was determined to ₉₀₀ to 900 ℃ the procedure for annealing a sample in the manufacture by (inserted into the furnace 950 ℃ and the sample is cooled when it reached 900 ℃) and, in parallel with the rolling direction measured in the same manner the tensile strength. From the values of? ₀ ,? and? ₉₀₀ , the degree of softening (S) was determined by the following formula.

S = (? ₀ -?) / (? ₀ -? ₉₀₀ )

(Tensile test of the product)

A 0.2% proof stress was measured in parallel with the rolling direction in accordance with JIS Z 2241 using a tensile tester.

(Young's modulus measurement)

Young's modulus was measured in accordance with JACBA technical standard "Method for measuring bending strain coefficient by cantilever of copper and copper alloy plate assembly".

A sample of a short plate having a plate thickness t, a width w (= 10 mm) and a length of 100 mm was placed in a direction in which the longitudinal direction of the sample shown in Fig. 2 was at an angle of 90 degrees with the rolling direction, Respectively. One end of the specimen was fixed and a load of P (= 0.15 N) was applied to the position of L (= 100 t) from the fixed end. From the strain (d) at this time, the Young's modulus E was obtained using the following equation .

E = 4 · P · (L / t) ³ / (w · d)

(Deformation test)

A specimen of a short-cut desk having a width of 5 mm was sampled in a direction in which the longitudinal direction of the specimen shown in Fig. 2 was at an angle of 90 degrees with the rolling direction.

Next, as shown in Fig. 4, one end of the sample is fixed and a deformation (d) is applied to the sample at a position of distance L from the fixed end by pressing a punch formed by cutting the tip with a knife edge, Was returned to the initial position and unloaded. The moving speed of the punch was 1 mm / min.

First, deformation was applied one time to measure the contact force (P) (load acting on the punch), and after sagging, sagging (?) Was performed. Further, 5,000 deformation was applied, and sagging (delta) after removal was calculated.

Table 1 shows the evaluation results. Here, the deformation test was conducted under the conditions of t (plate thickness) = 0.15 mm, w (plate width) = 5 mm, L (spring length) = 10 mm and d (deformation) = 3 mm. The sagging (?) Was measured with a resolution of 0.01 mm, and when sagging (?) Was not detected, the sagging (?) Was expressed as <0.01 mm.

Each of Examples 1 to 16 was prepared by preliminary annealing and light rolling in the conditions specified by the present invention. The Young's modulus in the direction of 90 degrees and the direction of 45 degrees satisfied the requirements of the present invention, No sagging was detected at all. In addition, the contact force tends to decrease with the lowering of the Young's modulus in the 90-degree direction. The contact force of Examples 6 and 16 in which the Young's modulus in the 90-degree direction was as low as 105 ㎬ and 102 은 was slightly lower than the contact force in the other examples. It was possible to maintain a contact force exceeding 1.2 N in the present invention.

The contact force P obtained in the deformation test is not only the alloy characteristic such as the Young's modulus E and the proof stress but also the shape of the specimen t or w or the deformation of the specimen as shown in the formula 1 [P = dEwt ³ / 4L ³ ] It is also affected by the conditions (L, d). The contact force obtained in the inventive example can be said to be a sufficient level with respect to the expected contact force from the shape of the sample and the deformation condition.

In Comparative Example 1, pre-annealing and light rolling were not carried out, and this corresponds to a general Cor-Son alloy. Since the Young's modulus in the 90-degree direction exceeded 120 ㎬, sagging occurred with one deformation, and this sagging slightly increased to 5,000 deformation.

In Comparative Example 2, preliminary annealing and light rolling were performed, but the temperature reached at the time of preliminary annealing exceeded 700 캜 and the degree of softening exceeded 0.75. Since the degree of softening was excessive, the Young's modulus in the 90-degree direction exceeded 120.. As a result, sagging occurred with one deformation, and this sagging slightly increased to 5,000 deformation.

In Comparative Example 3, preliminary annealing and light rolling were performed, but the holding time at the time of preliminary annealing was less than 5 seconds, and the degree of softening was less than 0.3. Since the degree of softening was too low, the Young's modulus in the direction of 90 degrees exceeded 120.. As a result, sagging occurred with one deformation, and this sagging slightly increased to 5,000 deformation.

In Comparative Examples 4 and 5, preliminary annealing and light rolling were carried out. However, since the degree of processing during light rolling was both too small and too large, the Young's modulus in the direction of 90 degrees exceeded 120.. As a result, sagging occurred with one deformation, and this sagging slightly increased to 5,000 deformation.

In Comparative Example 6, since the degree of softening of the preliminary annealing and the degree of processing of the light rolling were proper conditions, the Young's modulus in the 90-degree direction was in the range of 100 to 120.. However, since the rate of temperature rise at 400 to 500 占 폚 in the preliminary annealing was less than 1 占 폚 / sec, the Young's modulus in the 45 占 direction exceeded 140 占.. As a result, sagging was not detected in one deformation but sagging occurred in 5000 deformation.

In Comparative Example 7, as in Comparative Example 6, the rate of temperature rise in the preliminary annealing was small, but the rate of temperature increase was particularly slow, so that the Young's modulus in the 45 ° direction exceeded 140 ㎬ and sagging occurred at 5000 times deformation In addition, the Young's modulus in the 90-degree direction was less than 100 ㎬, and the contact force was less than 1 N, which was reduced to about two-thirds of the inventive example. When the contact force is lowered to this level, there arises a problem that the contact electric resistance of the contact is abnormally increased when the connector is processed and used.

In Comparative Example 8, since the degree of softening of the preliminary annealing and the degree of processing of the light rolling were proper conditions, the Young's modulus in the 90-degree direction was in the range of 100 to 120.. However, since the rate of temperature rise at 400 to 500 ° C in preliminary annealing exceeded 50 ° C / second, the Young's modulus in the 45 ° direction exceeded 140 ° C. As a result, sagging was not detected in one deformation but sagging occurred in 5000 deformation.

In Comparative Example 9, the heating rate in the preliminary annealing was excessive, but the heating rate was particularly large. As a result, not only the Young's modulus in the 45 ° direction exceeded 140 ㎬, but also the Young's modulus in the 90 ° direction Exceeding 120.. As a result, one sag occurred already in one transformation, and this sagging remarkably increased with 5,000 transformations.

In Comparative Example 10, preliminary annealing and light rolling were performed, but the holding time at the time of preliminary annealing exceeded 600 seconds, the degree of softening became excessive, and the rate of temperature rise was excessively small. The Young's modulus in the 90-degree direction exceeded 120 ㎬ and sagging occurred in one deformation, and this sagging slightly increased to 5,000 deformation.

(Example 2)

It was verified that the sagging improvement effect shown in Example 1 was obtained with a Korson alloy having different components and manufacturing conditions.

Casting, hot rolling and surface grinding were carried out in the same manner as in Example 1 to obtain a plate having a thickness of 9 mm and having the components shown in Table 2. This plate was subjected to rolling and heat treatment in the following order of steps to obtain a product sample having a thickness shown in Table 2. [

(1) cold rolling

(2) Preliminary annealing: carried out in the same manner as in Example 1.

(3) Light rolling

(4) Solution treatment: A sample was inserted into an electric furnace adjusted to a predetermined temperature and held for 10 seconds, and then the sample was put in a water bath and cooled. The temperature was selected so that the average diameter of recrystallized grains was in the range of 5 to 25 m.

(5) Cold rolling (rolling 1)

(6) Aging treatment: An electric furnace was used for heating in an Ar atmosphere at a predetermined temperature for 5 hours. The temperature was chosen so that the tensile strength after aging was at a maximum.

(7) Cold rolling (rolling 2)

(8) Deformation removal annealing: After inserting a sample into an electric furnace adjusted to a predetermined temperature and holding it for 10 seconds, the sample was allowed to stand in the atmosphere and cooled.

Samples and product samples after pre-annealing were evaluated in the same manner as in Example 1. [ In the deformation test, w = 5 mm was set, and L and d were set so that the effect of the present invention can be easily exhibited for each group of alloys described later.

Tables 2 and 3 show the evaluation results. When either rolling 1, rolling 2 or deformation-removing annealing was not carried out, "no" was marked in the respective degrees of processing or temperature.

(Alloy A)

Alloy A contains only Ni and Si as alloying elements, and the balance consists of copper and inevitable impurities. Rolling 1, rolling 2, and deformation removing annealing are all performed.

In Inventive Example A-1, sagging was not detected after 1 and 5,000 transformations because the Young's modulus satisfied the specification.

In Comparative Example A-1, since the degree of softening in the preliminary annealing exceeded 0.75 and the Young's modulus in the 90-degree direction exceeded 120 ㎬, sagging occurred in a single deformation.

In Comparative Example A-2, sagging occurred at 5000 times of deformation because the rate of temperature rise in the preliminary annealing was not less than 1 占 폚 / sec and the Young's modulus in the 45 占 direction exceeded 140 占..

In Comparative Example A-3, since the total concentration of Ni and Co and the Si concentration were low, the proof stress of the product was lowered, and sagging occurred at one time of deformation.

As for the contact force, the Young's modulus in the direction of 90 degrees was greater than or equal to 100 에서는 in Inventive A-1, Comparative Example A-1 and Comparative Example A-2, . On the other hand, in Comparative Example A-3 in which the Young's modulus in the 90-degree direction exceeded 100 지만 but the proof stress was remarkably low, about 2/3 of the Young's modulus in the 90- Only the contact force of the contact surface was obtained.

(Alloy B)

Alloy B contains 1.6% Ni, 0.36% Si, 0.5% Sn, and 0.4% Zn (% is% by mass, the same) as the alloy component, and the balance is composed of copper and inevitable impurities. Further, rolling 2 and deformation removal annealing are performed.

In Inventive Example B-1, since the Young's modulus satisfied the specification, no sagging was detected after 1 and 5,000 transformations.

In Comparative Example B-1, pre-annealing and light rolling were not performed, and the Young's modulus in the 90-degree direction exceeded 120 ㎬, so that sagging occurred in a single deformation.

In Comparative Example B-2, sagging occurred at 5000 times of deformation because the rate of temperature increase in the preliminary annealing was more than 50 DEG C / sec and the Young's modulus in the 45 DEG direction was more than 140 mu m.

Further, since the Young's modulus in the direction of 90 DEG was 100 ㎬ or more in each of Examples B-1, Comparative Example B-1, and Comparative Example B-2, the contact force at a level expected from the shape and deformation conditions was obtained.

(Alloy C)

Alloy C contains 3.8% Ni, 0.81% Si, 0.1% Mg and 0.2% Mn as alloy components, the balance being composed of copper and inevitable impurities. In addition, rolling 2 and deformation-removing annealing are performed.

In Inventive C-1, sagging was not detected after 1 and 5,000 transformations because the Young's modulus satisfied the specification.

In Comparative Example C-1, since the softening degree in the preliminary annealing exceeded 0.75 and the Young's modulus in the 90-degree direction exceeded 120 ㎬, sagging occurred in a single deformation.

In Comparative Example C-2, the softening degree in the preliminary annealing was not less than 0.25, and the Young's modulus in the 90-degree direction exceeded 120 때문에, so that sagging occurred in one deformation.

In Comparative Example C-3, sagging occurred at 5000 times of deformation because the rate of temperature rise in the preliminary annealing was not less than 1 占 폚 / sec and the Young's modulus in the 45 占 direction was more than 140 占..

In addition, since the Young's modulus in the direction of 90 degrees was greater than or equal to 100 발 in each of the inventive C-1, comparative example C-1, comparative example C-2 and comparative example C-3, .

(Alloy D)

Alloy D contains 2.3% Ni, 0.46% Si and 0.2% Mg as alloying elements and the balance consists of copper and inevitable impurities. Further, rolling 1 is carried out.

In Inventive Example D-1, since the Young's modulus satisfied the specification, no sagging was detected after 1 time of deformation and 5,000 times.

In Comparative Example D-1, sagging occurred at one time of deformation because the working degree of lightly-rolled steel exceeded 50% and the Young's modulus in the 90-degree direction exceeded 120..

In Comparative Example D-2, sagging occurred at 5000 times of deformation because the rate of temperature rise of the preliminary annealing was more than 50 ° C / second and the Young's modulus in the 45 ° direction was more than 140 ° C.

Further, since the Young's modulus in the direction of 90 degrees in both Example D-1, Comparative Example D-1 and Comparative Example D-2 was 100 ㎬ or more, the contact force of the level expected from the sample shape and deformation conditions was obtained.

(Alloy E)

The alloy E contains 2.0% Ni, 0.69% Si, 1.1% Co, and 0.1% Cr as alloy components, the balance being composed of copper and inevitable impurities. Further, rolling 2 and deformation removal annealing are performed.

In Inventive Example E-1, sagging was not detected after 1 and 5,000 transformations because the Young's modulus satisfied the specification.

In Comparative Example E-1, sagging occurred at one time of deformation because the working degree of light rolling was not less than 7% and the Young's modulus in the 90-degree direction exceeded 120..

Since the Young's modulus in the direction of 90 degrees in both Example E-1 and Comparative Example E-1 was 100 ㎬ or more, the contact force of the level expected from the sample shape and the deformation condition was obtained.

In Comparative Example E-2, the rate of temperature rise of the preliminary annealing was very small. For this reason, the Young's modulus in the 45-degree direction exceeded 140 하고 and sagging occurred due to 5000 deformation. Further, the Young's modulus in the 90-degree direction was less than 100 ㎬, and the contact force was reduced to less than half of Examples E-1 and E-1.

(Alloy F)

The alloy F contains 2.4% Ni, 0.71% Si, 0.2% Sn, 0.5% Ag, 0.2% Cr and 0.01% P as the alloying elements, the balance being composed of copper and inevitable impurities. Rolling 2 is also carried out.

In Inventive Example F-1, since the Young's modulus satisfied the specification, no sagging was detected after 1 time of strain and 5000 times.

In Comparative Example F-1, since the rate of temperature rise in the preliminary annealing was very large, the Young's modulus in the 45 ° direction exceeded 140 과 and the Young's modulus in the 90 캜 direction exceeded 120.. As a result, sagging occurred with one deformation, and this sagging was increased to 5,000 deformation.

Further, since the Young's modulus in the direction of 90 degrees in both Example F-1 and Comparative Example F-1 was 100 ㎬ or more, the contact force at a level expected from the sample shape and deformation conditions was obtained.

(Alloy G)

The alloy G contains 1.9% Co, 0.44% Si, 0.02% Cr, 0.02% Zr, and the balance copper and inevitable impurities as alloy components. Further, rolling 2 and deformation removal annealing are performed.

In Examples G-1 and G-2, since the Young's modulus satisfied the specification, no sagging was detected after 1 time of deformation and 5,000 times.

In Comparative Example G-1, since the degree of softening in the preliminary annealing exceeded 0.75 and the Young's modulus in the direction of 90 degrees exceeded 120 ㎬, sagging occurred in a single deformation.

In Comparative Example G-2, since the rate of temperature rise of the preliminary annealing was very large, the Young's modulus in the 45 ° direction exceeded 140 ㎬ and the Young's modulus in the 90 캜 direction exceeded 120.. As a result, sagging occurred with one deformation, and this sagging was increased to 5,000 deformation.

Since the Young's modulus was 100 ㎬ or more in Examples G-1, G-2, G-1 and G-2, the contact force of the level expected from the sample shape and the deformation condition was obtained. Here, the contact force of the inventive example G-2, which had a Young's modulus of 100 ㎬ or more but not more than 106 ㎬, was slightly lower than the contact force of the other examples, but was at a practically problematic level.

In Comparative Example G-3, the temperature increase rate of the preliminary annealing was very small. For this reason, the Young's modulus in the 45-degree direction exceeded 140 하고 and sagging occurred due to 5000 deformation. In addition, the Young's modulus in the 90-degree direction was less than 100 ㎬, and the contact force was reduced to about half of that in Inventive Example G-1, Inventive Example G-2, Comparative Example G-1 and Comparative Example G-2.

Claims (7)

Wherein at least one of Ni and Co is contained in an amount of 0.8 to 4.5% by mass and Si is contained in an amount of 0.2 to 1.0% by mass, the balance being copper and inevitable impurities, (Bending deformation coefficient) of 100 to 120 의 and a Young's modulus in the 45 째 direction (bending deformation coefficient) of not more than 140 의. The method according to claim 1,
0.8 to 4.5% by mass of at least one of Ni and Co, 0.2 to 1.0% by mass of Si, the balance of copper and inevitable impurities, and Young's modulus in the 90 占 direction (bending modulus) And a Young's modulus in the 45-degree direction (bending modulus) of 106 to 140 ㎬. The method according to claim 1,
Wherein the alloy contains 0.005 to 3.0% by mass of at least one of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn and Ag. An ingot containing 0.8 to 4.5% by mass of at least one of Ni and Co and 0.2 to 1.0% by mass of Si and the balance of copper and inevitable impurities is prepared and the ingot is heated at 800 to 1000 占 폚 to a thickness of 5 to 20 Mm, and then subjected to cold rolling at a working rate of 30 to 99% and maintained at a temperature of 500 to 700 ° C for 5 to 600 seconds at an average heating rate of 400 to 500 ° C at 1 to 50 ° C / Annealing at a softening degree of 0.25 to 0.75 and cold rolling at a working temperature of 7 to 50% followed by solution treatment at 700 to 900 ° C for 5 to 300 seconds and annealing at a temperature of 350 to 550 ° C for 2 to 20 A method for performing an aging treatment of time,
Wherein the softness is represented by S in the following formula:
S = (? ₀ -?) / (? ₀ -? ₉₀₀ )
Where? ₀ is the tensile strength before pre-annealing,? And? ₉₀₀ are the tensile strength after pre-annealing and after annealing at 900 占 폚, respectively. 5. The method of claim 4,
Wherein the ingot contains at least one of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn and Ag in a total amount of 0.005 to 3.0 mass%. A new article having the corson alloy according to any one of claims 1 to 3. An electronic device part having a corundum alloy according to any one of claims 1 to 3.

Images