KR101615359B1 - system for curing substrate - Google Patents

Abstract

The present invention relates to a substrate curing system, and more particularly, to a substrate curing system, in which a curing treatment for a metal layer formed on a substrate and a curing treatment for an overcoat layer formed to protect the metal layer are performed through a series of continuous processes, It is possible to reduce the time, effort, and cost for the process, and the curing process for each of the metal layer and the overcoat layer is constituted by the temporary curing process and the final curing process, .
The constituent means constituting the substrate curing system of the present invention is a substrate curing system comprising: a first work hardening device for hardening a metal layer formed on a substrate by heating a substrate on which a metal layer is formed in a vacuum state; A first main curing apparatus for irradiating pulsed light onto the transferred substrate to cure the metal layer formed on the substrate, a substrate drawn out from the first main curing apparatus and having an overcoat layer formed thereon, A second temporary hardening device for hardening the overcoat layer formed on the substrate by heating the substrate, a second temporary hardening device for hardening the overcoat layer formed on the substrate by supplying hot air to the substrate transferred from the second temporary hardening device, And a device.

Description

[0001] The present invention relates to a system for curing substrate,

The present invention relates to a substrate curing system, and more particularly, to a substrate curing system, in which a curing treatment for a metal layer formed on a substrate and a curing treatment for an overcoat layer formed to protect the metal layer are performed through a series of continuous processes, It is possible to reduce the time, effort, and cost for the process, and the curing process for each of the metal layer and the overcoat layer is constituted by the temporary curing process and the final curing process, .

The touch screen panel, which has recently been used as a new input device with smart phones, is being expanded to include tablet PCs, notebooks, monitors, TVs, etc. In response to the demand for slimmer, lighter, higher quality, .

Such a touch screen panel is an input device that can easily use a computer or the like with interactive and intuitive operation by simply touching a button displayed on a display with a finger. The touch screen panel includes a touch panel, a controller IC, and a driver SW.

Such a touch screen panel may be a resistive type, a capacitive type, an ultrasonic type, or an infrared type depending on the operation principle. Due to many advantages such as high reliability, excellent performance, fast response speed, and multi-touch implementation, many capacitive methods have been adopted and used.

As such a capacitance method, a method using a transparent electrode of ITO film or ITO glass is mainly applied. However, the electrostatic capacity method is difficult to apply to a middle- or large-sized touch screen due to the low conductivity of the ITO transparent electrode, and the price of indium as a rare earth metal is high, raising the price of the product.

In order to overcome these disadvantages, there is an increasing demand for a metal mesh structure in order to realize middle and large sized touch screen panels and flexible display panels. The metal mesh structure is an electrostatic touch using a metal material, and a highly conductive metal layer, that is, silver (Ag) or copper (Cu) is arranged in an orthogonal manner on a transparent substrate (glass or film) to form an electrode.

However, in such a metal mesh structure, there is a problem that a visibility problem and a moiré phenomenon occur. The visibility problem is a phenomenon in which the shiny metal pattern is visible when the finished product is realized, and the moiré phenomenon is a phenomenon in which the shiny metal mesh pattern and the grid pattern of the display are added together and appear like waves. The metal mesh pattern is formed on the haze pattern, and the signal electrode is formed on the bezel printing surface.

The signal electrodes formed on the metal mesh pattern and the bezel printing surface are all formed of a metal layer formed on the substrate and an overcoat layer OC may be formed on the metal layer to protect the metal layer and to improve visibility .

The metal layer and the overcoat layer formed on the substrate may all be applied by an ink jet method, and in this case, the ink must contain a lot of solvent components. As a prior art related thereto, Korean Patent No. 10-1182514 discloses a " thermal curing apparatus for vacuum drying and a vacuum drying thermal curing method ".

However, the prior art describes only the structure of one device capable of performing thermal curing by a heating plate in a vacuum state only, and a process capable of curing the metal layer and the overcoat layer through a series of successive processes And the system are not described at all.

Furthermore, the prior art thermal curing device is a structure in which the substrate can be drawn in and out through the opening of the sealing portion corresponding to the door. Therefore, it is very difficult to clean and maintain the inside of the thermal curing apparatus.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method for manufacturing a semiconductor device, which comprises curing a metal layer formed on a substrate and curing the overcoat layer, It is an object of the present invention to provide a substrate curing system that can save time, effort, and cost for a substrate curing process.

It is another object of the present invention to provide a substrate curing system capable of improving the curing efficiency of a substrate by constituting each of the curing treatments for the metal layer and the overcoat layer by a temporary curing process and a final curing process.

In addition, since the curing treatment for the metal layer formed on the substrate can be performed by a curing device capable of heating in a vacuum state, the solvent component contained in the metal layer applied by the ink jet can be easily removed, And to provide a substrate curing system capable of increasing the curing efficiency.

The hardening device capable of heating the metal layer formed on the substrate in a vacuum state is constituted by the lower chamber and the upper chamber and the upper chamber can be arranged to be spaced apart from the lower chamber, And it is an object of the present invention to provide a substrate curing system which facilitates withdrawal of a substrate from a lead-in and curing apparatus of the curing apparatus and facilitates cleaning and maintenance in the curing apparatus.

According to an aspect of the present invention, there is provided a substrate curing system comprising: a substrate having a metal layer formed thereon, the substrate being heated in a vacuum to form a metal layer formed on the substrate, A first main curing device for irradiating pulsed light onto a substrate transferred from the first temporary vulcanizing device to cure the metal layer formed on the substrate, and a second main curing device which is drawn out from the first main curing device to form an overcoat layer A second temporary hardening device for heating the substrate to draw an overcoat layer formed on the substrate after the substrate having the overcoat layer formed thereon is heated and hot air is supplied to the substrate transferred from the second temporary hardening device, And a second main curing device for curing the overcoat layer formed on the substrate The.

The first temporary hardening device includes a first loader for loading a substrate on which the metal layer is formed, a substrate to be transferred from the first loader, and a metal layer formed on the substrate by heating in a vacuum atmosphere, And a first unloader for withdrawing the substrate from the hardening treatment apparatus and the metal layer hardening treatment apparatus.

The upper layer of the metal layer hardening processing apparatus may include a lower chamber fixedly disposed on the lower chamber, an upper chamber movably disposed on the upper side of the lower chamber so as to be in close contact with the lower chamber to form a closed space therein, An upper chamber driving means for placing the upper chamber in close contact with or spaced from the lower chamber and a lower chamber driving means for moving the upper chamber in a lower portion of the lower chamber, And a vacuum holding means for sucking air in the hermetically sealed space.

In addition, the first curing apparatus may include a second loader for loading a hardened substrate in the first hardening curing apparatus, a substrate transferred from the second loader, and thereafter irradiating pulsed light to form A second aligner for placing and aligning a substrate transferred from the second transfer, and a second aligner for aligning the substrate transferred from the second transfer and a second aligner for aligning the substrate transferred from the second transfer, And a second unloader for transferring the substrate aligned by the liner to the overcoat layer forming apparatus.

The second temporary hardening device may include an OC hardening loader for loading the substrate on which the overcoat layer is formed from the overcoat layer forming device, a substrate transferred from the OC hardening loader, An OC hardening treatment apparatus for hardening the formed overcoat layer and an OC hardening unloader for withdrawing the substrate from the OC hardening treatment apparatus.

Also, the second main curing apparatus may include: an OC-shaped cured loader for loading a substrate to which the overcoat layer is adhered in the second hardening curing apparatus; a substrate to be transferred from the OC- And an OC-shaped curing unit for curing the overcoat layer formed on the substrate and an OC-shaped curing unloader for withdrawing the substrate from the OC-series curing unit.

According to the substrate curing system of the present invention having the above technical problems and the solution, the curing treatment for the metal layer formed on the substrate and the curing treatment for the overcoat layer formed for protecting the metal layer are performed through a series of continuous processes It is advantageous in that it can save time, effort and cost for the substrate hardening treatment.

In addition, since each of the curing treatment for the metal layer and the overcoat layer is constituted by the temporary hardening step and the final hardening step, there is an advantage that the hardening efficiency of the substrate can be improved.

In addition, since the curing treatment for the metal layer formed on the substrate can be performed by a curing device capable of heating in a vacuum state, the solvent component contained in the metal layer applied by the ink jet can be easily removed This has the effect of increasing the curing efficiency.

Further, since the curing apparatus capable of heating the metal layer formed on the substrate in a vacuum state is constituted by the lower chamber and the upper chamber, and the upper chamber is configured to be spaced apart from the lower chamber, It is easy to pull out the substrate from the pull-in and cure apparatus of the substrate, and it is easy to clean and maintain in the curing apparatus.

1 is a block diagram of a substrate curing system according to an embodiment of the present invention.
2 is a front view of a metal layer hardening treatment apparatus constituting a substrate hardening system according to an embodiment of the present invention.
3 is a first perspective view of a metal layer hardening treatment apparatus constituting a substrate hardening system according to an embodiment of the present invention.
4 is a second perspective view of a metal layer hardening treatment apparatus constituting a substrate hardening system according to an embodiment of the present invention.
FIG. 5 is an explanatory view of the operation of a metal layer hardening treatment apparatus constituting the substrate hardening system according to the embodiment of the present invention. FIG.
6 is a front view of an OC hardening treatment apparatus constituting a substrate hardening system according to an embodiment of the present invention.
Fig. 7 is a configuration diagram of a sliding stage constituting the OC hardening treatment apparatus of Fig. 6;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a substrate curing system according to the present invention having the above-described problems, solutions and effects will be described in detail with reference to the accompanying drawings.

The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator.

1 is an overall block diagram of a substrate curing system according to an embodiment of the present invention.

1, a substrate curing system 1000 according to an embodiment of the present invention includes a first hardening apparatus 100A, a first hardening apparatus 200A, and a second hardening apparatus 100A for curing a metal layer formed on a substrate, And a second hardening device 400A and a second hardening device 500A for curing the overcoat layer OC formed on the substrate.

The first temporary hardening device 100A corresponds to a device for preliminarily hardening a metal layer formed on the substrate through heating in a vacuum state, and the first hardening device 200A corresponds to the first temporary hardening device 100A, And secondarily curing the metal layer on the substrate primarily cured by the light source 100A using pulse light.

The metal layer formed on the substrate, which is cured by the first temporary hardening device 100A and the first primary hardening device 200A, is formed on the metal mesh pattern and / or bezel print surface formed on the substrate for the touch screen panel And may correspond to a signal electrode to be formed.

As described above, the metal layer formed on the substrate can be formed on the substrate through the inkjet method, and the metal component is preferably silver nanoparticles. That is, the metal layer is preferably formed by applying silver nano ink onto the substrate using an ink jet.

As described above, since the metal layer formed on the substrate is coated with the silver nano ink by the ink jet method, the silver nano ink formed on the substrate contains the solvent component. Therefore, it is preferable that the metal layer formed of the silver nano ink is cured through a process of easily removing the solvent component.

Accordingly, the substrate curing system 1000 according to the embodiment of the present invention includes a first substrate 100 that can be cured by heating in a vacuum state to easily remove volatile solvent contained in a metal layer formed on the substrate, (100A).

That is, the first temporary hardening device 100A performs a process of hardening the metal layer formed on the substrate by heating the substrate on which the metal layer is formed in a vacuum state.

The first temporary hardening device 100A corresponds to an apparatus capable of removing a volatile component remaining in a metal thin film (layer) by drying a metal thin film (layer) formed on a substrate or a glass in a vacuum state, So that it is possible to induce rapid evaporation of the volatile component.

When the solvent component contained in the metal layer formed on the substrate is removed by the first temporary hardening device 100A, the substrate is transferred to the first hardening device 200A. Then, the first main curing apparatus 200A irradiates the substrate with pulse light to remove the solvent (moisture, solvent, etc.) remaining in the metal layer and to perform curing through crystallization.

That is, the first hardening device 200A irradiates the substrate transferred from the first hardening device 100A with pulse light to harden the metal layer formed on the substrate. As described above, when pulsed light is irradiated to the substrate in the first curing device 200A, solvent such as solvent and moisture remaining in the metal layer formed by applying silver nano ink is evaporated and the metal layer hardens And hardened.

Specifically, when the first main curing device 200A irradiates pulsed light onto the substrate, a pulse is applied to the silver nanoparticle ink (metal layer) coated on the substrate, As the heat is generated, the remaining solvent evaporates. Also, the metal layer may be hardened through the process of crystallizing while the metal layer reaches the high temperature instantaneously by the applied pulse.

The first curing apparatus 200A includes a light irradiation lamp (not shown) for irradiating pulse light on the substrate. The light irradiation lamp generates pulsed light having a predetermined frequency to irradiate the metal layer, and generates pulsed light so that the metal layer can be selectively (locally) instantaneously generated. As described above, since the irradiation lamp instantaneously induces heat generation, there is an advantage that the metal layer can be cured without deformation of the substrate.

The silver nano ink applied to the substrate, that is, the metal layer, is effectively removed by the first temporary hardening device 100A, and a solvent such as solvent and water remaining by the first hardening device 200A And at the same time, it can be crystallized and cured. That is, the metal layer of the silver nano ink component on the substrate can be effectively cured through the first temporary hardening device 100A and the first primary hardening device 200A.

Although the curing process for the substrate coated with the silver nano ink may proceed rapidly by one process, that is, by one device, in the present invention, the metal layer of the silver nano ink component is effectively cured , The first temporary hardening device 100A and the first primary hardening device 200A are successively used to increase the hardening efficiency.

The metal layer formed on the substrate is cured while passing through the first temporary hardening device 100A and the first final hardening device 200A. Therefore, in order to cure only the metal layer formed on the substrate, the substrate hardening system can be configured using only the first temporary hardening device 100A and the first hardening device 200A.

However, the substrate curing system 1000 according to the present invention further comprises a second hardening device 400A and a second hardening device 500A for curing the overcoat layer OC.

That is, the substrate curing system according to an embodiment of the present invention may include the second temporary hardening device 400A and the second temporary hardening device 400A capable of curing the overcoat layer OC applied to protect the metal layer and / And a second curing device 500A.

In more detail, the substrate curing system according to the embodiment of the present invention is configured to perform a series of continuous processes of curing the metal layer formed on the substrate and curing the overcoat layer formed on the substrate. Therefore, compared with the construction in which the curing process for the metal layer and the overcoat layer is performed in a separate process rather than a continuous process, the present invention has the effect of relatively saving time, effort and cost for curing the metal layer and the overcoat layer on the substrate I have.

After the curing process by the first curing device 200A is completed, the second curing device 400A and the second curing device 500A are used to cure the overcoat layer OC The substrate on which the curing process has been completed by the first curing device 200A is transferred to the overcoating layer OC forming device 300A before being transferred to the second hardening curing device 400A.

The substrate on which the hardening process for the metal layer has been completed is introduced into the overcoat layer forming apparatus 300A, and the overcoat layer forming apparatus 300A forms an overcoat layer OC on the substrate through an inkjet method do. The overcoat layer may be applied to the metal layer to protect the cured metal layer or may be applied to other portions of the substrate for a specific function and may be simultaneously applied to the metal layer and other portions of the substrate.

The substrate coated with the overcoat layer in the overcoat layer forming apparatus 300A is loaded into the second temporary hardening device 400A. Then, the second temporary hardening device 400A heats the substrate to a predetermined temperature so that the solvent contained in the overcoat layer is evaporated to be hardened.

That is, the second temporary hardening device 400A draws the substrate having the overcoat layer formed thereon in the overcoat layer forming device 300A drawn out from the first main curing device 200A, and then heats the substrate, The overcoat layer formed on the substrate is tentatively cured.

The second temporary hardening device 400A evaporates the solvent contained in the overcoat layer applied by the inkjet method through a heating process. That is, the second hardening curing apparatus 400A evaporates the solvent component and water contained in the overcoat layer of the nanoparticle component to harden the hardened layer.

The second hardening curing apparatus 400A may have a lower hardening efficiency than the first hardening curing apparatus 100A which is hardened through heating in a vacuum state. That is, the overcoat layer formed on the substrate is preliminarily formed by the second temporary hardening device 400A, but is not completely hardened.

In order to completely cure the preliminarily cured overcoat layer through the second hardening curing apparatus 400A, the substrate drawn out from the second hardening curing apparatus 400A is loaded onto the second hardening apparatus 500A And the curing process is performed for a relatively long time.

The second main curing apparatus 500A performs a curing process for the substrate for a relatively long time using hot air. That is, the second main curing device 500A supplies hot air to the substrate transferred from the second temporary hardening device 400A to cure the overcoat layer formed on the substrate.

Since the overcoating layer formed on the substrate is hardened only preliminarily in the second temporary hardening device 400A, the second hardening device 500A advances the hardening process for the substrate for a relatively long time. That is, since the overcoat layer formed on the substrate that is drawn into the second main curing apparatus 500A still contains a large amount of solvent such as solvent and moisture, the second main curing apparatus 500A can not supply hot air And the curing process is performed for a relatively long time.

The substrate curing system according to the present invention described above includes the first temporary hardening device 100A, the first hardening device 200A, the second hardening device 400A, and the second hardening device 500A, do.

The first temporary hardening device 100A, the first hardening device 200A, the second hardening device 400A, and the second hardening device 500A have a total tact time for the entire hardening process, It is desirable to have an appropriate substrate accommodating structure with its own tact time so that a smooth flow of the substrate can be achieved.

Specifically, the first temporary hardening device 100A performs a metal layer hardening process on the substrate using three chambers, performs a metal layer hardening process in which 30 substrates are received in each chamber, The tact time of the hardening process takes about 18 to 22 minutes.

Since the first temporary vulcanizing apparatus 100A heats in a vacuum state and performs the curing process for about 20 minutes, the metal layer formed on the substrate drawn out from the first temporary vul. State. Therefore, the tact time in the first curing apparatus 200A can be short.

That is, the first main curing apparatus 200A removes the solvent remaining in the metal layer through a process of instantaneously applying pulse light, and can be cured through a crystallization process. Therefore, the tact time of the curing process performed in the first curing device 200A is very short, ranging from 8 seconds to 12 seconds. Specifically, the substrate drawn out from the first temporary hardening device 100A is loaded into the first hardening device 200A, immediately irradiated with pulsed light, is immediately drawn out after being aligned, Forming apparatus 300A.

The substrate on which the overcoat layer is formed in the overcoat layer forming apparatus 300A is preliminarily cured by heating after being drawn into the second hardening curing apparatus 400A. Specifically, the second temporary hardening device 400A is constituted by 40 chambers, each chamber receives about 30 substrates to undergo the hardening process, and the tact time is about 8 to 12 minutes.

Since the temporary hardening of the overcoat layer proceeds weakly in the second temporary hardening device 400A, the second hardening device 500A performs the hardening process for a relatively long time. However, since the second main curing apparatus 500A performs a curing process for a long time, the curing process is performed by hot air in a state in which a relatively large number of substrates are accommodated.

According to the substrate curing system configured as described above, since the curing process for the metal layer formed on the substrate and the curing process for the overcoat layer formed to protect the metal layer are performed through a series of continuous processes, There is an advantage that time, effort and cost for curing treatment can be reduced.

In addition, since each of the curing treatment for the metal layer and the overcoat layer is constituted by the temporary hardening step and the final hardening step, there is an advantage that the hardening efficiency of the substrate can be improved.

The first hardening device 100A, the first hardening device 200A, the second hardening device 400A, and the second hardening device 500A, which constitute the substrate hardening system according to the embodiment of the present invention, The configuration and operation will be described as follows.

First, the first temporary hardening device 100A performs an operation of hardening the metal layer formed on the substrate by heating the substrate on which the metal layer is formed in a vacuum state. Therefore, the first temporary hardening device 100A includes a first loader 101 for loading a substrate from the outside, a second loader 101 for mounting a substrate transferred from the first loader 101, And a first unloader (103) for drawing out the substrate hardened by the hardening treatment apparatus (100) and the metal layer hardening treatment apparatus (100) and transferring the substrate to the first hardening apparatus (200A) do.

The first loader 101 loads the substrate having the metal layer formed thereon into the metal layer hardening processing apparatus 100. Specifically, the first loader 101 draws a substrate from a metal layer forming apparatus (not shown) for forming a metal layer on the substrate by an inkjet method, and draws the substrate to the metal layer hardening processing apparatus 100.

The substrate on which the metal layer is loaded by the first loader 101 is seated in the metal layer hardening treatment apparatus 100. Then, the metal layer hardening apparatus 100 places the substrate transferred from the first loader 101, and then hardens the metal layer formed on the substrate through heating in a vacuum atmosphere.

The substrate on which the metal layer subjected to the hardening by the metal layer hardening treatment apparatus (100) is formed is taken out by the first unloader (103). That is, the first unloader 103 pulls out the substrate on which the hardened metal layer is formed from the metal layer hardening processing apparatus 100, and can be transferred to the first hardening apparatus 200A.

The substrate taken out from the first unloader 103 may be transferred to the first main curing device 200A and subjected to the aligning process and then may be subjected to the main curing process by the pulse light. 200A so that the substrate can be conveyed to the first main curing apparatus 200A after the substrate is aligned by the first temporary hardening apparatus 100A before the substrate is held by suction as it is, It is possible to smoothly perform the curing process without increasing the complexity of the first main curing apparatus.

That is, the first hardening apparatus 200A will be described later, but the second loader 201, the metal layer final hardening apparatus 200, the second transfer 203, the second aligner 205, (207), providing up to the alignment means can increase the complexity of the equipment. Therefore, it is preferable that the substrate subjected to the hardening treatment is transferred to the first main curing device 200A in a state previously aligned in the first temporary hardening device 100A.

As a result, the first temporary hardening device 100A according to the present invention can be applied not only to the first loader 101, the metal layer hardening device 100, and the first unloader 103, And a first aligner (105) for aligning the substrate subjected to the hardening treatment by the processing apparatus (100).

Accordingly, the first unloader 103 draws the substrate on which the hardened metal layer is formed from the metal layer hardening processing apparatus 100, and transfers the substrate to the first aligner 105 to be seated. Then, the first aligner 105 performs alignment by pushing four sides of the mounted substrate.

The substrate aligned by the first aligner 105 is adsorbed and supported by the second loader 201 provided in the first main curing device 200A to be able to process the main curing process, (200). This will be described later.

As described above, the substrate on which the metal layer is formed is subjected to the hardening treatment in a state in which the metal layer is placed in the hardening treatment apparatus 100. That is, the metal layer hardening device 100 places a substrate transferred from the first loader 101, and then hardens the metal layer formed on the substrate through heating in a vacuum atmosphere.

The metal layer hardening treatment apparatus 100 is shown in Figs. 2 to 5. Fig. 2 is a front view of the metal layer hardening treatment apparatus 100, FIG. 3 is a first perspective view, FIG. 4 is a second perspective view, and FIG. 5 is an operation explanatory view.

As shown in FIGS. 2 to 5, the metal layer hardening apparatus 100 includes a lower chamber 110 fixedly disposed, a lower chamber 110 movable upward and downward from the upper chamber 110, An upper chamber 130 formed in close contact with the chamber 110 to form a closed space therein and a heating stage formed on the lower chamber 110 to seat the substrate and having a heating plate 153 inserted therein, An upper chamber driving means 170 for closely placing the upper chamber 130 in the lower chamber 110 or placing the upper chamber 130 away from the lower chamber 110 and a lower chamber driving means 170 connected to the lower chamber 110, And a vacuum holding means (190) arranged to suck air in the closed space.

The lower chamber 110 and the upper chamber 130 are tightly coupled to each other to form a closed space, and the substrate is heated and cured in a state where the inside of the closed space is maintained in a vacuum state. Further, the lower chamber 110 and the upper chamber 130 may be spaced apart so that the substrate can be drawn into the closed space or the substrate can be drawn out from the closed space.

The lower chamber 110 has a rectangular shape as a whole, and is disposed in a fixed state unlike the upper chamber 130. In order to effectively form the closed space, the upper surface of the lower chamber 110 may be formed to be flat. However, in order to effectively form the closed space, the lower portion of the lower chamber 110, (Not shown).

When the upper chamber 130 is brought into close contact with the upper surface of the lower chamber 110, the upper closed space 133 formed in the upper chamber 130 and the lower closed space 113 of the lower chamber 110 A closed space for maintaining a vacuum state is formed during the hardening process.

When the closed space is formed by the close contact between the lower chamber 110 and the upper chamber 130, the air remaining in the closed space is exhausted to the outside. Therefore, the sealed space can maintain a vacuum state. In order to keep the sealed space in a vacuum state, the sealed space must be kept airtight with the outside.

Therefore, the sealing member 115 is inserted into the rim portion 111 corresponding to the outer portion of the upper surface of the lower chamber 110. That is, the rim portion 111 of the lower chamber 110 is formed with an insertion groove along the partition step 117 of the lower hermetic space 113, and the sealing member 115 is inserted into the insertion groove .

The upper chamber 130 is disposed opposite to the upper chamber 110, which is configured as described above. The upper chamber 130 is vertically movable from the upper side of the lower chamber 110 to closely contact the lower chamber 110 to form a closed space therein.

Therefore, the lower surface of the upper chamber 130 may be formed to be flat as a whole. However, in order to effectively form the closed space, an upper sealing space (not shown) 133 are formed.

When the upper chamber 130 is in close contact with the lower chamber 110, the rim 131 of the upper chamber 130 and the rim 111 of the lower chamber are in contact with each other, So that the airtightness is maintained. As a result, the upper hermetic space 133 and the lower hermetic space 113 may be shielded from the outside to maintain a hermetic state.

The substrate is accommodated in the closed space formed by the upper closed space 133 and the lower closed space 113. To this end, the heating stage 150 is disposed in the closed space. The heating stage 150 seats and supports the substrate so that the substrate can be heated and cured in a vacuum state, and further performs heating.

That is, the heating stage 150 is formed on the lower chamber 110 to seat the substrate, and a heating plate 153 is inserted therein to heat the substrate. The heating stage 150 is disposed in the closed space.

As described above, the heating stage 150 is formed on the lower chamber 110, but is not disposed in contact with the upper surface of the lower chamber 110, but is disposed in a spaced apart state .

The heating stage 150 is supported by the vertical bar 159 vertically disposed on the upper surface of the lower chamber 110 (the bottom surface of the lower hermetically sealed space) As shown in FIG.

The reason why the heating stage 150 is spaced apart from the upper surface of the lower chamber 110 as described above is that the air in the closed space is configured to be exhausted to the lower side of the lower chamber 110. That is, when the heating stage 150 is attached to the upper surface of the lower chamber 110, air can not be exhausted to the lower side of the lower chamber 110, And may be spaced apart from the upper surface of the lower chamber 110. I will explain more about this later.

A heating plate 153 is inserted into the heating stage 150. Specifically, the heating stage 150 includes a heating plate 153 interposed between the lower plate 151 and the upper plate 155. On the upper plate 155, a seating plate 157 on which the substrate can be mounted is formed.

The heat generated in the heating plate 153 is conducted to the upper plate 155 and transferred to the seating plate 157. As a result, the substrate placed on the seating plate 157 is heated and heated by the heating plate 153.

As described above, the substrate is subjected to the temporary hardening process while being seated on the heating stage 150. Accordingly, the upper chamber 130 is spaced apart from the lower chamber 110 in order to allow the substrate to be seated on the heating stage 150, or to allow the substrate subjected to the hardening process to be taken out. Be able to.

That is, the substrate may be transferred onto the heating stage 150 in a state where the upper chamber 130 is spaced upward from the lower chamber 110, or may be taken out after performing the hardening process. As a result, the upper chamber 130 must be able to be driven to descend in order to come in close contact with the lower chamber 110 to form the closed space, and further be able to be driven to be lifted up for the inlet and outlet of the substrate .

The driving for raising and lowering the upper chamber is performed by the upper chamber driving means (170). That is, the upper chamber driving unit 170 performs the operation of closely positioning the upper chamber 130 to the lower chamber 110 or placing the upper chamber 130 away from the lower chamber 110.

That is, the upper chamber driving means 170 drives the upper chamber 130 to be lowered to be in close contact with the lower chamber 110 in order to perform the temporary hardening process on the substrate. The upper chamber driving means 170 drives the upper chamber 130 to be spaced apart from the lower chamber 110 in order to draw in and out the substrate.

As a result, the upper chamber driving means 170 moves the upper chamber 130 up and down. The upper chamber driving means 170 driving the up and down movement of the upper chamber is mounted on the base plate 171 and the driving rod 173 is coupled to the upper portion of the upper chamber 130, The base plate 171 and the lower chamber 110 are connected to each other so that the base plate 171 and four corners of the lower chamber 110 are connected to each other. And a guide rod 177 fixedly arranged in the vertical direction and disposed at four corners of the upper chamber 130, respectively.

One end of the guide rod 177 is coupled to each of four corners of the base plate 171 and the other end of the guide rod 177 is coupled to four corners of the lower chamber 110. As a result, the base plate 171 can be stably held on the lower chamber 110 through the guide rod 177.

Meanwhile, the guide rods 177 are disposed to pass through the four corners of the upper chamber 130, respectively. Accordingly, when the driving cylinder 175 moves up and down the upper chamber 130, the upper chamber 130 can be lifted and lowered while being guided by the guide rod 177. That is, the upper chamber 130 is arranged to be able to move up and down stably along the guide rod 177.

The upper chamber driving means 170 drives the upper chamber 130 to descend so that the upper chamber can be brought into close contact with the lower chamber. Then, the closed space formed by the upper chamber and the lower chamber is maintained in a hermetic state.

In this way, when the hermetically sealed space is maintained, the hermetically sealed space must be kept in a vacuum state in order to perform the hardening process on the substrate mounted on the heating stage 150. [

The closed space is switched to the vacuum state by the vacuum holding means (190). That is, the vacuum holding means 190 is connected to the lower portion of the lower chamber 110 to suck air in the closed space and exhaust the air to the outside. As a result, the closed space can be switched to the vacuum state by the vacuum holding means 190.

As described above, the vacuum holding means 190 is connected to a lower side of the lower chamber 110. That is, the vacuum holding means 190 includes an exhaust pipe 191 connected to the lower chamber 110 downward. The exhaust pipe 191 maintains a state of communicating with the closed space through a lower side of the lower chamber 110.

As a result, the air in the closed space is exhausted downward through the exhaust pipe 191. It goes without saying that the exhaust pipe 191 is connected to the suction pump. That is, when the suction pump is operated, air in the closed space is sucked and exhausted through the exhaust pipe 191, so that the closed space can be converted to a vacuum state.

Since the upper chamber 130 is moved up and down, it is not preferable that the vacuum holding means is connected. Therefore, the vacuum holding means 190 is connected to the lower side of the lower chamber 110.

The exhaust pipe 191 is connected to the lower side of the lower chamber 110 so that the air in the closed space is sucked / The heating stage 150 disposed above the lower chamber 110 is spaced from the upper surface of the lower chamber 110.

If the heating stage 150 is closely attached to the upper portion of the lower chamber 110, the exhaust pipe 191 and the closed space can not communicate with each other. Accordingly, it is preferable that the heating stage 150 is disposed on the lower chamber.

The metal layer hardening processing apparatus 100 configured as described above allows the substrate to be hardened in the closed space. In the process of hardening the substrate, the closed space is continuously contaminated by the solvent, moisture, and the like. Therefore, the closed space must be periodically cleaned through maintenance.

In order to clean the closed space as described above, the upper chamber 130 should be spaced apart from the lower chamber 110. That is, as shown in FIG. 5 (a), the upper chamber 130 maintains a state of being in close contact with the lower chamber 110, so that the hardening process can proceed in the closed space.

Then, when the closed space needs to be cleaned, the upper chamber 130 is raised by the upper chamber driving means 170 as shown in FIG. 5 (b). In this way, the operator can perform maintenance such as cleaning of the closed space in the state that the closed space is opened.

However, when the upper chamber driving unit 170 is in trouble during the cleaning process with the closed space being opened as described above, the upper chamber 130 may be suddenly lowered to cause a safety accident. For example, the driving cylinder 175 of the upper chamber driving means 170 is an air cylinder, and the upper chamber can be rapidly lowered due to an operation problem of the air cylinder.

In order to prevent an unexpected safety accident, a latching bar 119 is coupled to the side surface of the lower chamber 110 in a horizontal direction. Correspondingly, a side wall of the upper chamber 130 is horizontally And the engaging jaw 139 is engaged.

A supporting rod 195 is connected between the latching bar 119 and the latching jaw 139. Specifically, an insertion hole into which the latch bar 119 can be inserted is formed at one side of the support bar 195. One end of the support bar is connected to the retaining bar 119 so as not to be detached when the insertion hole formed at one side of the support bar 195 is inserted into the retaining bar 119. In this state, The upper end of the upper chamber 130 can be held by the support bar 195 when the other end of the upper chamber 130 is disposed to support the lower surface of the locking protrusion 139.

In order to prevent the unexpected rapid descent of the upper chamber when the upper chamber is separated from the lower chamber to clean the closed space, It is preferable to connect and dispose them between the jaws 139.

According to the first temporary hardening device 100A including the metal layer hardening device 100 described above, the hardening process for the metal layer formed on the substrate can be processed by the hardening device capable of heating in a vacuum state Therefore, it is possible to easily remove the solvent component contained in the metal layer applied by the ink jet, thereby increasing the curing efficiency.

Further, since the curing apparatus capable of heating the metal layer formed on the substrate in a vacuum state is constituted by the lower chamber and the upper chamber, and the upper chamber is configured to be spaced apart from the lower chamber, It is easy to pull out the substrate from the pull-in and cure apparatus of the substrate, and it is easy to clean and maintain in the curing apparatus.

The substrate subjected to the temporary hardening process for the metal layer in the first temporary hardening device 100A is transferred to the first hardening device 200A to remove the solvent remaining in the metal layer to complete the hardening process.

As shown in FIG. 1, the first hardening apparatus 200A includes a second loader 201 for loading a hardened substrate from the first hardening apparatus 100A, a second loader 201 for loading a hardened substrate from the first hardening apparatus 100A, A metal layer main curing processing apparatus 200 for depositing a transferred substrate and then irradiating pulsed light to cure the metal layer formed on the substrate, a second transferring unit for transferring the substrate from the metal layer final curing processing apparatus 200, A second aligner 205 for placing and aligning the substrate transferred from the second transfer 203 and a substrate aligned by the second aligner 205 to the overcoat layer forming apparatus 300A And a second unloader 207 for transmitting the second unloader 207 to the second unloader 207.

The second loader 201 constituting the first curing device 200A is arranged to be movable in a pick-and-place manner to a substrate aligned by the first aligner 105 constituting the first temporary hardening device 100A And the metal layer is transferred to and placed on the final curing device 200.

Then, the metal layer final curing apparatus 200 drives the irradiation lamp to irradiate pulsed light onto the mounted substrate. The light irradiation lamp emits pulse light so that heat can be applied to the metal layer on the substrate instantaneously. Then, the solvent remaining in the metal layer on the substrate evaporates instantaneously and hardens.

The substrate that has undergone the curing process in the metal layer final curing apparatus 200 is seated in the second aligner 205 through the second transfer 203 in a pick-and-place manner. That is, the second transfer 203 picks up the substrate that has undergone the hardening process of the metal layer final curing processing apparatus 200, and transfers the substrate to the second aligner 205.

Then, the second aligner 205 performs alignment by pushing four sides of the mounted substrate. The substrate aligned by the second aligner 205 is transferred to the overcoat layer forming apparatus 300A by the second unloader 207. [ That is, the second unloader 207 picks up the substrates aligned by the second aligner 205 and transfers them to the overcoat layer forming apparatus 300A.

The overcoat layer forming apparatus 300A forms an overcoat layer by applying a nanoparticle ink onto the transferred substrate using an inkjet method. Since the overcoat layer is also formed by coating the nano particle ink, the overcoat layer contains solvents such as solvent and water, and the process of removing the solvent and curing the ink is performed.

To this end, the substrate on which the overcoat layer is formed is subjected to a curing process while passing through the second temporary hardening device 400A and the second final hardening device 500A. The substrate on which the overcoat layer is formed in the overcoat layer forming apparatus 300A is transferred to the second hardening curing apparatus 400A to perform the preliminary hardening treatment in which the solvent component contained in the overcoat layer is removed.

The second temporary hardening device 400A includes an OC hardening loader 401 for loading a substrate on which the overcoat layer is formed from the overcoat layer forming device 300A, An OC hardening treatment apparatus 400 for hardening the overcoating layer formed on the substrate through heating and an OC hardening unloader 403 for drawing the substrate from the OC hardening treatment apparatus 400, .

The OC hardening loader 401 picks up the substrate on which the overcoat layer is formed in the overcoat layer forming apparatus 300A in a pick and place manner and transfers the substrate to the OC hardening treatment apparatus 400. [ Then, the OC hardening treatment apparatus heats the substrate on which the overcoat layer is formed, so that the solvent contained in the overcoat layer can be removed to be hardened.

The OC pre-curing unloader 403 pulls out the substrate on which the over-coating layer having been hardened for a predetermined period of time in the OC hardening treatment apparatus 400 is formed by the pick-and-place method and is transferred to the second main curing apparatus 500A Lt; / RTI > It is preferable that the OC hardening unloader 403 picks up the hardened substrate and places it on alignment means (not shown) provided in the second main curing apparatus 500A.

The second temporary hardening device 400A configured as described above removes the solvent contained in the overcoat layer to perform hardening of the substrate. 6, the OC hardening treatment apparatus 400 for performing the hardening process on the overcoat layer includes a sliding stage 450 disposed on the fixed chamber 410, So that the temporary hardening process for the overcoat layer can be performed in the closed space formed between the transfer chambers 430.

To this end, the OC hardening treatment apparatus 400 includes a fixed chamber 410 fixedly disposed, a movable chamber 430 driven to move up and down on the fixed chamber 410, And a sliding stage 450 which is slidably disposed in the sliding stage 450. 6 (a) shows a state in which the moving chamber 430 is lowered and is in close contact with the sliding stage 450, and FIG. 6 (b) shows a state in which the moving chamber 430 rises and the sliding stage 450, respectively.

The sliding stage 450 includes a supporting plate 451 on which a heating plate (not shown) is inserted and supported on a top surface of the sliding stage 450, a support plate 451 on the top surface of the sliding stage 450, And a sliding plate 453 slidable by the means 490 and exposed to the outside of the fixed chamber 410.

The sliding plate 453 that attaches the support plate 451 to the upper surface forms a closed space between the movable chamber 430 and maintains the airtightness. That is, the moving chamber 430 is lowered by the moving chamber driving means 470 and is brought into close contact with the rim of the sliding plate 453.

An upper sealing space (not shown) is formed on the lower surface of the moving chamber 430 in the same manner as the upper chamber 130 constituting the metal layer hardening treatment apparatus 100 described above. Therefore, when the movable chamber 430 descends and is brought into close contact with the sliding plate 453, the upper closed space forms a closed space for performing the hardening process on the overcoat layer.

The moving chamber 430 can be moved up and down by a moving chamber driving means 470, which can be configured as an air cylinder or the like. When the movable chamber driving means 470 descends the moving chamber to form a closed space between the moving chamber and the sliding plate 453, the supporting plate 451 is heated, and the substrate, on which the overcoat layer is formed, .

That is, since the heating plate is inserted into the support plate 451, the substrate on which the overcoat layer is mounted on the support plate 451 is heated by the heating plate. Then, the solvent or the like contained in the overcoat layer formed on the substrate is evaporated and preliminarily cured.

The moving chamber driving means 470 may be configured to move the substrate in a state where the substrate is mounted on the sliding stage 450, specifically, the supporting plate 451, and when the substrate is pulled out after completion of the hardening process of the overcoat layer , The movable chamber 430 is lifted up so as to be spaced apart from the sliding plate 453.

The moving chamber driving means 470 drives the moving chamber 43 to move up so that the sliding stage 450 can be cleaned by the operator even when the sliding stage 450 needs to be maintained do.

The sliding stage 450 is slid in one direction according to the driving of the sliding driving means 490 so as to be exposed to the outside of the fixed chamber 410 so that the operator can easily clean the sliding stage 450. [ . As a result, the operator can easily carry out cleaning of the sliding stage 450.

The sliding stage 450, or more specifically, the sliding plate 453 constituting the sliding stage 450 may be slid by the sliding driving means 490, as shown in FIG. 7 (a) shows a state before the sliding plate 453 is slid, and FIG. 7 (b) shows a state in which the sliding plate 453 is slid by the sliding driving means 490 .

7, the sliding driving means 490 for slidably driving the sliding plate 453 includes a pair of frames 491 disposed to face each other, a pair of frames 491, A first LM guide 492 attached along the longitudinal direction of the first LM guide 492 and a first LM guide 492 attached to the inner side of the frame, A first driving module 494 for transmitting a driving force for reciprocating movement of the feeding plate 493, a sliding plate 453 for feeding the driving force to the feeding plate 493, A second LM guide 495 which is attached to the lower ends of both sides of the sliding plate 493 in a longitudinal direction and engages with a second LM block (not shown) attached to the inner surface of the conveying plate 493, And a sliding plate It is configured to include a second drive module (496) for transmitting the driving force for the reciprocating motion of the byte.

The LM block is provided on the inner side surface and the outer side surface of the transfer plate 493. That is, the outer surface of the conveyance plate 493 is provided with a first LM block which can be engaged with the first LM guide 492 to be slidable. On the inner surface of the conveyance plate 493, And a second LM block that engages the sliding plate 495 to allow the sliding plate to slide.

As a result, the sliding plate 453 is driven to slide through the two-step process. That is, when the first driving module 494 generates and transmits a driving force, the feeding plate 493 is slid in a state engaged with the first LM guide 492. As a result, the sliding plate is firstly slid indirectly. At this time, the sliding plate 453 is maintained in LM engagement with the inner surface of the transfer plate 493.

Next, when the second driving module 496 generates and transmits a driving force, a driving force is directly transmitted to the sliding plate 453. [ As a result, the sliding plate 453 having the second LM guide 495 coupled to the lower ends of the second LM guide 495 is inserted into the second LM block provided on the inner surface of the transfer plate 493 The second driving module is slid secondarily along the driving direction applied by the second driving module.

As a result, the sliding plate 453 can be exposed to the outside of the fixed chamber through the primary sliding and the secondary sliding according to the driving of the sliding driving means 490 having the above-described structure. As a result, the operator can easily clean the sliding stage 450.

As described above, the OC pre-curing unloader 403 holds the substrate on which the over-coating layer having been hardened by the OC hardening treatment apparatus 400 having the above-described structure is formed, Lt; / RTI >

Then, the second main curing apparatus 500A performs the alignment process on the substrate on which the hardened cured overcoat layer is formed. Accordingly, the second curing apparatus 500A includes alignment means for performing alignment immediately on the transferred substrate.

Specifically, the second main curing apparatus 500A includes an OC main curing loader 501 for loading the substrate on which the overcoat layer is adhered in the second press curing apparatus 400A, an OC main curing loader 501, An OC pre-curing apparatus 500 for placing the substrate to be transferred from the OC pre-curing apparatus 500, and then curing the over-coating layer formed on the substrate through heating, (503).

However, the OC pre-curing loader 501 does not directly transfer the substrate on which the overcoat layer is adhered from the second preliminary curing apparatus 400A to the OC pre-curing apparatus 500, The substrate subjected to the aligning process is picked and picked up and transferred to the OC main curing apparatus 500.

Then, the OC main curing apparatus 500 supplies hot air to the substrate to dry and cure the solvent such as solvent and water contained in the overcoat layer. The OC screen hardening processing apparatus 550 holds and holds a plurality of stacking trays in a state of being vertically spaced apart.

Since the loading tray seats a plurality of substrates, the amount of the substrate to be subjected to the curing treatment in the OC main curing apparatus 500 can be increased. The substrate that has undergone the final curing treatment by the hot air in the OC main curing apparatus 500 is taken out to the outside by the OC main curing unloader 503 while being placed on the loading tray.

The second hardening device 400A and the second hardening device 500A described above can perform the hardening process for the overcoat layer formed on the substrate. Since the curing treatment for the overcoat layer is primarily performed through heating in the second hardening curing apparatus and is performed secondarily through hot air in the second hardening apparatus for curing, .

According to the substrate curing system of the present invention described above, since the curing treatment for the metal layer formed on the substrate and the curing treatment for the overcoat layer formed for protecting the metal layer are performed through a series of continuous processes, There is an advantage that time, effort and cost for curing treatment can be reduced.

In addition, since each of the curing treatment for the metal layer and the overcoat layer is constituted by the temporary hardening step and the final hardening step, there is an advantage that the hardening efficiency of the substrate can be improved.

In addition, since the curing treatment for the metal layer formed on the substrate can be performed by a curing device capable of heating in a vacuum state, the solvent component contained in the metal layer applied by the ink jet can be easily removed This has the effect of increasing the curing efficiency.

Further, since the curing apparatus capable of heating the metal layer formed on the substrate in a vacuum state is constituted by the lower chamber and the upper chamber, and the upper chamber is configured to be spaced apart from the lower chamber, It is easy to pull out the substrate from the pull-in and cure apparatus of the substrate, and it is easy to clean and maintain in the curing apparatus.

Although the embodiments according to the present invention have been described, it is to be understood that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the following claims.

100A: first temporary hardening device 100: metal layer hardening treatment device
101: first loader 103: first unloader
105: first aligner 110: lower chamber
111: rim portion of lower chamber 113: lower hermetically sealed space
115: sealing material 117: compartment step
119: Retaining bar 130: Upper chamber
131: rim portion of the upper chamber 133: upper sealing space
139: latching jaw 150: heating stage
151: lower plate 153:
155: upper plate 157: seating plate
159: vertical bar 170: upper chamber drive means
171: base plate 173: driving rod
175: drive cylinder 177: guide rod
190: Vacuum holding means 191: Exhaust pipe
195: Support Rod
200A: first curing apparatus 200: metal layer final curing apparatus
201: second loader 203: second transfer
205: second aligner 207: second unloader
300A: overcoat layer forming device 400A: second hardening device
400: OC hardening device 401: OC hardening loader
403: OC hardening unloader 410: fixed chamber
430: moving chamber 450: sliding stage
451: Support plate 453: Sliding plate
470: Moving chamber drive means 490: Sliding drive means
491: Frame 492: First LM Guide
493: Transfer plate 494: First drive module
495: second LM guide 496: second drive module
500A: second main curing apparatus 500: OC main curing apparatus
501: OC original cured loader 503: OC original cured unloader
1000: substrate hardening system

Claims (6)

In the substrate curing system,
A first temporary vulcanizing device heating the substrate on which the metal layer is formed in a vacuum state to harden the metal layer formed on the substrate;
A first main curing device for irradiating pulse light onto a substrate transferred from the first temporary hardening device to harden a metal layer formed on the substrate;
A second temporary hardening device for drawing a substrate on which an overcoat layer is formed in the overcoat layer forming apparatus drawn by the first hardening apparatus and heating the substrate to harden the overcoat layer formed on the substrate;
And a second main curing device for supplying hot air to the substrate transferred from the second temporary hardening device to harden the overcoat layer formed on the substrate,
The first temporary hardening device includes a first loader for loading a substrate on which the metal layer is formed, a substrate to be transferred from the first loader, and a metal layer for hardening the metal layer formed on the substrate by heating in a vacuum atmosphere. And a first unloader for withdrawing the substrate from the processing apparatus and the metal layer hardening processing apparatus.
delete The method according to claim 1,
An upper chamber which is disposed to be movable up and down on the upper side of the lower chamber and which is in close contact with the lower chamber to form a closed space in the lower chamber; An upper chamber driving means for placing the upper chamber in close contact with or spaced from the lower chamber, and a lower chamber driving means for connecting and disposing the upper chamber to the lower portion of the lower chamber, And a vacuum holding means for sucking air in the closed space.
The method according to claim 1,
The first curing apparatus includes a second loader for loading a substrate temporarily hardened in the first hardening apparatus, a substrate transferred from the second loader, and irradiating pulse light to form a metal layer A second aligner for aligning the substrate transferred from the second transfer and aligning the substrate; and a second aligner for aligning the substrate transferred from the second transfer, And a second unloader for transferring the aligned substrates to the overcoat layer forming apparatus.
The method according to claim 1,
The second temporary hardening device includes an OC hardening loader for loading a substrate on which the overcoat layer is formed from the overcoat layer forming device, a substrate transferred from the OC hardening loader, An OC hardening treatment apparatus for hardening the coating layer and an OC hardening unloader for withdrawing the substrate from the OC hardening treatment apparatus.
The method according to claim 1,
The second main curing apparatus includes an OC main curing loader for loading the substrate on which the overcoat layer is adhered by the second adherent curing apparatus, a substrate conveyed from the OC main curing loader, And an OC-shaped curing unloader for withdrawing the substrate from the OC-type curing processing apparatus.

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