JP2001068394A - Resist removing method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for removing a resist with use of adhesive tape of an ultraviolet curing type, which can easily and reliably remove an unnecessary resist and can avoid an adhesive agent component from remaining on an article such as a semiconductor substrate, by preventing undesirable curing of adhesive tape at a peripheral edge by ultraviolet rays. SOLUTION: The apparatus includes an adhesive-tape applying means within a chamber 60 for openably accommodating an article (substrate) W on which an adhesive tape T is applied and also includes an evacuating means for vacuumizing the chamber 60, or a gas supply means for supplying inert gas into the chamber 60. Under a condition that air in the chamber 60 is evacuated, ultraviolet rays are irradiated onto the tape T applied onto the article W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image formed of an unnecessary resist (unnecessary resist remaining on an article) when manufacturing various microfabricated articles such as semiconductor substrates, various printed boards, various masks, and lead frames. And a device for peeling off the pattern).

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, for example, a resist material is applied to a semiconductor substrate such as a silicon wafer, and a predetermined image (resist pattern) is formed by an ordinary photo process. Using this as a mask,
For example, various processes such as ion implantation, etching, and doping are performed. Thereafter, the unnecessary image is removed, and a predetermined circuit is formed. Next, in order to form the next circuit, a cycle of applying the resist material again is repeatedly performed. Also, when circuits are formed on various substrates, unnecessary images are removed after image formation. At this time, the removal of the unnecessary image of the resist material is generally performed by ashing (ashing), a solvent (stripping liquid), a chemical, or the like.

[0003] However, if ashing is used to remove an image, there is a risk that the operation requires a lot of time and that impurity ions in the resist are implanted into the wafer. Further, the use of a solvent or a chemical causes a problem of damaging the working environment.

Therefore, recently, as a means for removing unnecessary resist images without the above-mentioned problems, for example, as disclosed in Japanese Patent Application Laid-Open No. Hei 9-148232, adhesive tapes are used to remove resist film images. Paste on the top,
A method of removing the resist film image by integrally peeling off the adhesive tape and the resist has been proposed.

[0005]

The above-mentioned means for adhering and removing unnecessary substances on the wafer surface by using an adhesive tape includes:
Although it has an advantage that unnecessary resist can be removed without causing contamination of the wafer by impurities as in the conventional ashing technique, it has the following problems. That is, in the ultraviolet irradiation process, if air enters between the peripheral portion of the article such as a semiconductor substrate and the adhesive tape, ultraviolet curing failure of the adhesive at this location is likely to occur, and therefore, when the adhesive tape is peeled off. In some cases, the resist remains on the peripheral portion of the article without being peeled off, or an adhesive component that is not sufficiently cured remains on the article.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and a method and an apparatus for removing a resist using an ultraviolet-curable adhesive tape are disclosed. It is an object of the present invention to prevent ultraviolet curing failure of an adhesive tape, remove unnecessary resist easily and surely, and prevent an adhesive component from remaining on an article.

[0007]

In order to achieve the above object, the present invention has the following arrangement. That is, the invention according to claim 1 is a method in which an ultraviolet-curable adhesive tape is attached to an article on which a resist pattern is formed, and the adhesive tape is irradiated with ultraviolet light to cure the adhesive of the adhesive tape. In a resist removal method for removing a resist pattern on an article from an article by peeling off the adhesive tape, irradiation of the adhesive tape with ultraviolet rays is performed in an atmosphere from which the atmosphere is excluded.

[0008] The invention described in claim 2 is the first invention.
In the invention described in the above, the irradiation of the pressure-sensitive adhesive tape with ultraviolet rays is performed in a reduced-pressure atmosphere in which the air is excluded.

[0009] The invention described in claim 3 is the first invention.
In the invention described in (1), the irradiation of the adhesive tape with ultraviolet rays is performed in an inert gas atmosphere from which the atmosphere is excluded.

[0010] The invention described in claim 4 is the first invention.
In the invention according to any one of the above items (1) to (3), the irradiation of the adhesive tape with ultraviolet rays is performed while heating the article.

The invention according to claim 5 provides an adhesive tape sticking means for sticking an ultraviolet-curable adhesive tape on an article on which a resist pattern is formed, and a method of irradiating the adhesive tape with ultraviolet light to form the adhesive tape. In a resist removing device including an ultraviolet irradiation unit that cures the adhesive, and an adhesive tape peeling unit that removes a resist pattern on the article from the article by peeling the adhesive tape,
An openable and closable chamber for storing an article to which an adhesive tape is to be attached, and an exhaust unit for depressurizing and exhausting the inside of the chamber, and the adhesive tape attaching unit is provided in the chamber, and the ultraviolet irradiation unit is The adhesive tape attached to the article is irradiated with ultraviolet rays in a reduced-pressure atmosphere in the chamber.

Further, the invention according to claim 6 is an adhesive tape sticking means for sticking an ultraviolet-curable adhesive tape on an article having a resist pattern formed thereon, and the adhesive tape is irradiated with ultraviolet rays to form the adhesive tape. In a resist removing device including an ultraviolet irradiation unit that cures the adhesive, and an adhesive tape peeling unit that removes a resist pattern on the article from the article by peeling the adhesive tape,
An openable and closable chamber for storing an article to which an adhesive tape is attached, and gas supply means for supplying an inert gas into the chamber, and the adhesive tape attaching means is provided in the chamber, and The ultraviolet irradiation means is configured to irradiate the adhesive tape attached to the article with ultraviolet light in an inert gas atmosphere in the chamber.

[0013] The invention described in claim 7 is the same as in claim 5.
In the invention described in Item 6, the heating means for heating the article in the chamber is provided.

[0014]

The operation of the present invention is as follows. According to the method for removing a resist according to claim 1, first, an ultraviolet-curable pressure-sensitive adhesive tape is attached to an article on which a resist pattern is formed, and then to an adhesive tape attached in an atmosphere in which the atmosphere is excluded. UV light is applied. After the pressure-sensitive adhesive of the pressure-sensitive adhesive tape is cured by ultraviolet irradiation, the pressure-sensitive adhesive tape is peeled off from the article, and unnecessary resist on the article is peeled off and removed integrally with the pressure-sensitive adhesive tape.

In the step of irradiating the ultraviolet rays, the article is placed in an atmosphere from which the atmosphere is excluded, so that air is removed from between the peripheral edge of the article and the adhesive tape. The ultraviolet curing of the adhesive is sufficiently performed.

Here, examples of the form in which the article is placed in an atmosphere from which the atmosphere is excluded include, for example, removing the atmosphere in a closed space containing the article into a reduced-pressure atmosphere (claim 2), or storing the article. It is possible to replace the atmosphere in the enclosed space with an inert gas to create an inert gas atmosphere (claim 3).

Here, when the article is irradiated with ultraviolet rays while being heated (claim 4), the pressure-sensitive adhesive of the pressure-sensitive adhesive tape is softened by heating and spreads sufficiently to the periphery of the article, and unnecessary resist on the periphery of the article is removed. And the adhesive is reliably cured in a state where there is no gap between the peripheral edge of the article and the adhesive tape.

According to the resist removing apparatus of the present invention, the article on which the resist pattern is formed is housed in the chamber, and the adhesive tape of the ultraviolet curing type is applied by the adhesive tape attaching means provided in the chamber. Is affixed on the article, and then the inside of the chamber is evacuated and evacuated by evacuation means.
Ultraviolet rays are irradiated on the adhesive tape stuck on the article by the ultraviolet irradiation means.

In the process of irradiating the ultraviolet rays, since the article is placed in a reduced-pressure atmosphere in the chamber, air is removed from between the periphery of the article and the adhesive tape. UV curing of the agent is sufficiently performed.

Thereafter, the adhesive tape is peeled off from the article, and unnecessary resist on the article is peeled off and removed integrally with the adhesive tape.

According to the resist removing apparatus of the present invention, the article on which the resist pattern is formed is housed in the chamber, and the adhesive tape of the ultraviolet curing type is applied by the adhesive tape attaching means provided in the chamber. Is applied on the article, and then the gas supply means supplies an inert gas into the chamber, and the atmosphere in the chamber is replaced with the inert gas. Then, in an inert gas atmosphere in the chamber, ultraviolet rays are applied to the adhesive tape stuck on the article by ultraviolet irradiation means.

In this ultraviolet irradiation step, the interior of the chamber is in an inert gas atmosphere from which the atmosphere has been removed, so that there is no air between the periphery of the article and the adhesive tape, and the adhesive at this point is not present. Is sufficiently cured.

Thereafter, the adhesive tape is peeled off from the article by the adhesive tape peeling means, and the unnecessary resist on the article is peeled off and removed integrally with the adhesive tape.

According to the resist removing apparatus of the present invention, since the article in the chamber is appropriately heated by the heating means, the pressure-sensitive adhesive of the adhesive tape is softened and sufficiently extended to the peripheral portion of the article. Yukitaru.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a resist removing apparatus when the present invention is applied to a semiconductor substrate will be described below with reference to the drawings.

FIG. 1 is an overall plan view of a resist removing apparatus according to the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a longitudinal sectional front view of a main part. As shown in FIGS. 1, 2, and 3, the resist removing apparatus of the present embodiment basically includes a cassette C1 in which semiconductor substrates (articles) W each having a resist pattern adhered to the surface thereof are stacked and stored. A substrate supply unit 1 to be loaded, a transport mechanism 3 equipped with a robot arm 2 that bends and revolves, an alignment stage 4 that positions a substrate W, a tape supply unit 5 that supplies an adhesive tape T to a tape attaching / peeling site, When attaching the adhesive tape T to the surface of the substrate W,
An attaching table 7 with a divided chamber 6 for holding
A peeling table 8 for holding the substrate W when the adhesive tape T is peeled off from the surface of the substrate W, an ultraviolet irradiation device 10 having a divided chamber 9 below, a tape sticking unit 11 mounted in the divided chamber 9, a peeling table 8, a peeling unit 12 for peeling the adhesive tape T from the substrate W, a tape collecting unit 13 for winding and collecting the adhesive tape T peeled off from the surface of the substrate W, and a cassette C2 for stacking and storing the processed substrates W. The base 17 includes a substrate collection unit 14 in which the substrate 17 is loaded, a table moving mechanism 15 that reciprocally moves the attaching table 7 and the peeling table 8 left and right, and a peeling unit moving mechanism 16 that reciprocates the peeling unit 12 left and right. It is arranged at the upper part, and is configured to carry in / out a cassette from just before the base 17.

Here, a base wall 18 is erected at the front and rear central portions on the base 17, and the substrate supply unit 1, the transfer mechanism 3, the alignment stage 4, and the substrate collection unit 14 are located in front of the base wall 18. At the same time, the attaching table 7, the peeling table 8, the table moving mechanism 15, the tape supply unit 5, the ultraviolet irradiation device 10, the peeling unit 12, the peeling unit moving mechanism 16, and the like are provided on the back side of the base wall 18. The substrate W is passed through long left and right openings 18a formed in the base wall 18.
Are transported back and forth. In FIG. 2, the base wall 18 is shown in a transparent manner for easy illustration.

The substrate supply unit 1 stores and stores the substrate W in a cassette C1 in a horizontal posture with the surface on which the resist pattern is present facing upward, and the substrate recovery unit 2 performs a resist removal process. The completed substrates W are similarly stacked and stored in the cassette C2 in a horizontal posture.

The robot arm 2 of the transfer mechanism 3 is configured to be able to bend and extend and rotate, and takes out the substrate W from the substrate supply unit 1 and transfers the substrate W to the alignment stage 4.
Supply, alignment stage 4 to pasting table 7
Of the substrate W into the substrate W
Out, and loading of the processed substrate W into the substrate collection unit 14.

The sticking table 7 and the peeling table 8 are mounted side by side on the left and right, and are supported by a common table moving mechanism 15 so as to be able to move left and right at a constant stroke. The table moving mechanism 15 includes a pair of left and right movable tables 2 that can move left and right along the guide rails 21.
2 and 23, a feed screw 24 for reciprocally feeding the movable tables 22 and 23 at a constant stroke, and a motor 25 for driving the movable tables 22 and 23 forward and reverse.
The sticking table 7 and the peeling table 8 are supported on the cylinders 2 and 23 by cylinders 26 and 27, respectively, so as to be able to move up and down independently.

The tape supply unit 5 separates the separator s from the tape Ts with separator led out from the raw material roll R, winds and collects the separator s, and separates the adhesive tape T with the adhesive surface exposed on the lower surface from the bonding table 7. It is configured to pass above the table 8 to the peeling unit 12.

As shown in FIG. 3, the attaching table 7
It is provided inside a half-split split chamber 6 that is opened upward, and a vacuum suction pad 32 that moves up and down by a cylinder 31 is provided at the center.
The divided chamber 6 includes a gas cylinder 33 storing an inert gas such as nitrogen gas, and a vacuum pump 34 for suctioning and removing the atmosphere in the divided chamber 6.
And the inside and the outside of the divided chamber 6 are communicated and shut off via a control valve 37. In addition, a vacuum suction pad 38 that moves up and down and moves up and down by a cylinder (not shown) is also provided at a central portion of the peeling table 8.
(See FIG. 6 (i)).

The tape sticking unit 11 is configured to reciprocate a movable table 42 equipped with a sticking roller 41 horizontally and horizontally with a fixed stroke by a feed screw 44 driven forward and reverse by a motor 43. The cylinder itself is swung up and down by a cylinder 45.

The ultraviolet irradiation device 10 is mounted on the upper part of the divided chamber 9 opened downward, and transmits the ultraviolet light generated from the ultraviolet lamp 46 into the divided chamber 9 through a transparent window 47 made of quartz glass or the like. Irradiation is performed, and irradiation is shut off by sliding the shutter 48.

As shown in FIG. 1, the tape peeling unit 1
Numeral 2 is configured to reciprocate a movable table 52 equipped with a peeling roller 51 horizontally and horizontally with a fixed stroke by a feed screw 54 driven forward and reverse by a motor 53.

Each part of the resist removing apparatus according to the present invention is constituted as described above. The process of removing unnecessary resist on the substrate W will be described below with reference to FIGS.

First, the robot arm 2 sucks and holds one substrate W from the cassette C 1 of the substrate supply unit 1, takes it out, and transfers it onto the alignment stage 4, where it is used to detect an orientation flat or a notch of the substrate W. Based on the position, the substrate W is aligned.

The aligned substrate W is again supported by the robot arm 2 and supplied onto the sticking table 7 at the lower standby position. As shown in FIG. 4A, a vacuum suction pad 32 projects and waits at the center of the attaching table 7. After the substrate W is transferred from the robot arm 2 onto the vacuum suction pad 32, the vacuum suction is performed. Pad 32
Is lowered and retreated, and the substrate W is held on the attaching table 7 in a fixed posture. The surface of the bonding table 7 is configured as a vacuum suction surface, and a heater 28 is built in the table as a heating means, and the substrate W on the bonding table 7 is heated to an appropriate temperature.

Next, as shown in FIG. 4B, the bonding table 7 holding the substrate W by suction is moved up together with the divided chamber 6, and the ultraviolet irradiation device 10 is moved down together with the divided chamber 9, so that the upper surface of the substrate W The lower and upper divided chambers 6 and 9 are brought into close contact with each other while the lower surface (adhesive surface) of the adhesive tape T is approached to form a chamber 60 isolated from the outside. In addition, a packing material 61 (see FIG. 3) is provided at an opening edge of the upper divided chamber 9, and airtightness at a joint portion is achieved. When the chamber 60 is formed, the vacuum pump 34 is operated to exhaust the air in the chamber 60, and the inside of the chamber 60 is reduced in pressure. Subsequently, an inert gas is supplied from the gas cylinder into the chamber 60, and the air remaining in the chamber 60 is replaced with the inert gas.

Next, as shown in FIG. 4 (c), the tape application unit 11 is operated, and the application roller 41 rolls forward while pressing the adhesive tape T against the upper surface of the substrate W, and applies the adhesive tape T to the substrate W. On top of At this time, since the substrate W is heated by the heater 28 built in the bonding table 7, the adhesive of the adhesive tape T is softened and flows into the unevenness of the resist pattern on the substrate surface, and the contact between the adhesive and the resist pattern is caused. The area increases.

When the application of the adhesive tape T as described above is completed, as shown in FIG. 5D, the ultraviolet irradiation device 1 is maintained while the inside of the chamber 60 is maintained in an inert gas atmosphere.
0, the shutter 48 is opened, and the ultraviolet lamp 4
The ultraviolet ray from No. 6 is irradiated on the adhesive tape T stuck on the heated substrate W. The adhesive of the adhesive tape T is hardened by the ultraviolet irradiation, and the adhesive strength between the unnecessary resist on the substrate W and the adhesive is enhanced. In the process of irradiating the ultraviolet rays, the substrate W is placed in an inert gas atmosphere in the chamber, so that air is removed from between the peripheral edge of the substrate W and the adhesive tape T. The ultraviolet curing of the pressure-sensitive adhesive at the location is sufficiently performed.

When the ultraviolet irradiation step is completed, outside air is introduced into the chamber 60, and the inside is returned to the atmospheric pressure. Then, as shown in FIG. , UV irradiation device 10
Is raised together with the division chamber 9, and the chamber 60 is separated and opened. At this time, the holding arm 6 that is swung horizontally is
2 is inserted below the substrate W, and the holding arm 62 receives and supports the substrate W stuck and held on the lower surface of the adhesive tape T.

Next, as shown in FIG. 5F, the sticking table 7 and the peeling table 8 are integrally moved forward to the right, and the peeling table 8 is moved below the substrate W stuck and held on the adhesive tape T. 6 (g), the peeling table 8 is raised, the substrate W is sucked and held on the upper surface thereof, and the holding arm 62 returns to the standby position.

Next, as shown in FIG. 6H, the tape peeling unit 12 is moved forward while holding the substrate W on the peeling table 8 by suction, and the peeling roller 51 peels the adhesive tape T from the substrate W. While rolling.

When the peeling of the adhesive tape T from the substrate W is completed, as shown in FIG. 6 (i), after the peeling table 8 holding the substrate W from which the adhesive tape T has been peeled off is lowered, the resist is removed. The processed substrate W is floated on the peeling table 8 by raising the vacuum suction pad 38, carried out by the robot arm 2 of the transport mechanism 3, and stored in the cassette C2 of the substrate collecting section 14.

Thus, one resist removal process is completed.
The sticking table 7, the peeling table 8, and the tape peeling unit 12 are moved back to the original positions to prepare for the next substrate loading.

Incidentally, the inside of the chamber 60 is set to 10 Torr.
A nitrogen gas was introduced into the chamber 60 while maintaining the reduced pressure atmosphere, and the substrate W was irradiated with ultraviolet rays while being heated and maintained at about 130 ° C., and the adhesive tape T was peeled off. In addition, it was confirmed that unnecessary resist on the peripheral portion could be completely removed, and that no adhesive component remained on the peripheral portion of the substrate W.

In the embodiment, in order to completely eliminate the atmosphere in the chamber 60, the inside of the chamber 60 is evacuated to a reduced pressure and then an inert gas is introduced into the chamber 60.
Depending on the type of the adhesive tape T or the like, it is possible to irradiate the ultraviolet rays while the inside of the chamber 60 is evacuated or evacuated, or to introduce the inert gas without evacuating the inside of the chamber 60 and irradiate the ultraviolet rays. .

The present invention can be embodied in the following modes. In the above-described embodiment, the tape attaching unit 11 is provided in the chamber 60, so that the adhesive tape T is attached and the ultraviolet irradiation is performed in the chamber 60. However, the tape attaching unit 11 is provided outside the chamber 60. Then, after the adhesive tape T is applied in the air, the substrate W can be housed in the chamber 60 and the ultraviolet irradiation can be performed in a reduced-pressure atmosphere or an inert gas atmosphere. As the inert gas, a rare gas such as a helium gas or an argon gas can be used in addition to the nitrogen gas. When a cooling mechanism is incorporated in the peeling table 8 to cool the substrate W and the adhesive tape T, the curing of the adhesive of the adhesive tape T is further promoted, and the resist is easily peeled.

[0050]

As is apparent from the above description, the following effects can be expected according to the present invention.

According to the resist removing method of the first aspect of the present invention, since the adhesive tape is irradiated with ultraviolet rays in an atmosphere from which the atmosphere is excluded, the air between the peripheral portion of the article and the adhesive tape is eliminated. UV irradiation can be performed in the state,
As a result, the pressure-sensitive adhesive was hardened at the peripheral portion of the article, the unnecessary resist was peeled off at the peripheral portion of the article, and the residual adhesive component was eliminated.

According to the second or third aspect of the present invention, since the reduced pressure atmosphere or the inert gas atmosphere is provided to create an atmosphere in which the atmosphere is excluded, practical application is easy, and the resist according to the first aspect of the present invention. The removal method can be effectively used.

According to the resist removing method of the fourth aspect of the present invention, the adhesive softened by heating can be sufficiently spread over the peripheral portion of the article to adhere to the unnecessary resist, and the unnecessary resist can be more reliably removed. Can be.

According to the resist removing apparatus of the fifth, sixth or seventh aspect of the present invention, since the adhesive tape attaching means is provided in the chamber, the adhesive tape attaching process and the ultraviolet irradiation process are performed in series in the chamber. After performing the adhesive tape pasting process outside the chamber,
The processing efficiency can be increased as compared with the case where the article is moved into the chamber and the ultraviolet irradiation processing is performed, and the resist removal processing with high unnecessary resist removal performance can be performed with high efficiency.

[Brief description of the drawings]

FIG. 1 is an overall plan view of an embodiment of a resist removing apparatus according to the present invention.

FIG. 2 is an overall front view of the resist removing apparatus.

FIG. 3 is a vertical sectional front view of a main part.

FIG. 4 is a process diagram for removing and removing an unnecessary resist.

FIG. 5 is a process chart for stripping and removing unnecessary resist.

FIG. 6 is a process chart for removing and removing unnecessary resist.

[Explanation of symbols]

 60 chamber T adhesive tape W substrate

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Eiji Toyoda 1-1-2 Shimohozumi, Ibaraki-shi, Osaka F-term in Nitto Denko Corporation (reference) 2H096 AA25 AA26 LA06 5F046 MA13 MA17 MA19

Claims (7)

[Claims] Claims 1. An ultraviolet-curable adhesive tape is attached to an article having a resist pattern formed thereon, and the adhesive tape is irradiated with ultraviolet rays to cure the adhesive of the adhesive tape.
A resist removing method for removing a resist pattern on the article from an article by peeling the adhesive tape, wherein the irradiation of the adhesive tape with ultraviolet rays is performed in an atmosphere from which the atmosphere is excluded. . 2. The method of removing a resist according to claim 1, wherein the pressure-sensitive adhesive tape is irradiated with ultraviolet rays in a reduced-pressure atmosphere in which the atmosphere is excluded. 3. The resist removing method according to claim 1, wherein the irradiation of the adhesive tape with ultraviolet rays is performed in an inert gas atmosphere from which the atmosphere is excluded. 4. The resist removing method according to claim 1, wherein the adhesive tape is irradiated with ultraviolet rays while heating the article. 5. An adhesive tape sticking means for sticking an ultraviolet-curable adhesive tape on an article having a resist pattern formed thereon, and an ultraviolet light irradiating means for irradiating the adhesive tape with ultraviolet light to cure the adhesive of the adhesive tape. A resist removing device comprising: an adhesive tape peeling means for removing a resist pattern on the article from the article by peeling the adhesive tape; an openable and closable chamber for housing an article to which an adhesive tape is to be attached; Exhaust means for depressurizing and exhausting the inside, and the adhesive tape sticking means is provided in the chamber, and the ultraviolet irradiation means, in a reduced pressure atmosphere in the chamber, to the adhesive tape stuck to the article A resist removing apparatus configured to irradiate ultraviolet rays. 6. An adhesive tape sticking means for sticking an ultraviolet-curable adhesive tape on an article having a resist pattern formed thereon, and an ultraviolet light irradiating means for irradiating the adhesive tape with ultraviolet light to cure the adhesive of the adhesive tape. A resist removing device comprising: an adhesive tape peeling means for removing a resist pattern on the article from the article by peeling the adhesive tape; an openable and closable chamber for housing an article to which an adhesive tape is to be attached; A gas supply means for supplying an inert gas therein, and the adhesive tape attaching means is provided in a chamber, and the ultraviolet irradiation means applies an inert gas atmosphere to the article in the chamber. A resist removing apparatus, which is configured to irradiate an ultraviolet ray to an adhered adhesive tape. 7. The resist removing apparatus according to claim 5, wherein a heating means for heating an article in the chamber is provided.