KR101601281B1 - 고속 연마 방법 - Google Patents

고속 연마 방법 Download PDF

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Publication number
KR101601281B1
KR101601281B1 KR1020090128625A KR20090128625A KR101601281B1 KR 101601281 B1 KR101601281 B1 KR 101601281B1 KR 1020090128625 A KR1020090128625 A KR 1020090128625A KR 20090128625 A KR20090128625 A KR 20090128625A KR 101601281 B1 KR101601281 B1 KR 101601281B1
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South Korea
Prior art keywords
polishing
polishing pad
carrier
substrate
grooves
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KR1020090128625A
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English (en)
Korean (ko)
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KR20100074046A (ko
Inventor
그레고리 피 멀다우니
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20100074046A publication Critical patent/KR20100074046A/ko
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Publication of KR101601281B1 publication Critical patent/KR101601281B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1020090128625A 2008-12-23 2009-12-22 고속 연마 방법 Active KR101601281B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/317,573 2008-12-23
US12/317,573 US8057282B2 (en) 2008-12-23 2008-12-23 High-rate polishing method

Publications (2)

Publication Number Publication Date
KR20100074046A KR20100074046A (ko) 2010-07-01
KR101601281B1 true KR101601281B1 (ko) 2016-03-08

Family

ID=41560870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090128625A Active KR101601281B1 (ko) 2008-12-23 2009-12-22 고속 연마 방법

Country Status (6)

Country Link
US (1) US8057282B2 (https=)
EP (1) EP2202031B1 (https=)
JP (1) JP5453075B2 (https=)
KR (1) KR101601281B1 (https=)
CN (1) CN101758446A (https=)
TW (1) TWI449598B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12594645B2 (en) 2023-06-09 2026-04-07 Western Digital Technologies, Inc. Method and disk carrier for use in polishing glass substrate disks

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* Cited by examiner, † Cited by third party
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KR20110100080A (ko) * 2010-03-03 2011-09-09 삼성전자주식회사 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN117103107A (zh) * 2022-05-16 2023-11-24 成都高真科技有限公司 还原料浆用抛光装置
CN115922557B (zh) * 2023-03-09 2023-07-25 长鑫存储技术有限公司 一种抛光组件及抛光设备

Citations (2)

* Cited by examiner, † Cited by third party
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JP2005228828A (ja) 2004-02-10 2005-08-25 Asahi Kasei Chemicals Corp 半導体ウェハの製造方法
US20080182493A1 (en) 2007-01-31 2008-07-31 Muldowney Gregory P Polishing pad with grooves to reduce slurry consumption

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TW320591B (https=) * 1995-04-26 1997-11-21 Fujitsu Ltd
JPH11347938A (ja) * 1998-06-08 1999-12-21 Ebara Corp 研磨生成物の排出機構及び研磨装置
TW479000B (en) * 2000-02-24 2002-03-11 United Microelectronics Corp Polish pad for polishing semiconductor wafer
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
US7059950B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad having grooves arranged to improve polishing medium utilization
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7131895B2 (en) * 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
US7300340B1 (en) * 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
US7520798B2 (en) 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228828A (ja) 2004-02-10 2005-08-25 Asahi Kasei Chemicals Corp 半導体ウェハの製造方法
US20080182493A1 (en) 2007-01-31 2008-07-31 Muldowney Gregory P Polishing pad with grooves to reduce slurry consumption

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12594645B2 (en) 2023-06-09 2026-04-07 Western Digital Technologies, Inc. Method and disk carrier for use in polishing glass substrate disks

Also Published As

Publication number Publication date
CN101758446A (zh) 2010-06-30
KR20100074046A (ko) 2010-07-01
US8057282B2 (en) 2011-11-15
US20100159810A1 (en) 2010-06-24
JP5453075B2 (ja) 2014-03-26
JP2010155338A (ja) 2010-07-15
TW201029802A (en) 2010-08-16
EP2202031B1 (en) 2016-09-21
EP2202031A3 (en) 2015-09-23
EP2202031A2 (en) 2010-06-30
TWI449598B (zh) 2014-08-21

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