KR101588857B1 - Led lighting apparatus - Google Patents

Abstract

LED lighting device is started. Wherein the LED lamp comprises an LED substrate portion including a PCB and at least one LED element disposed on the PCB, at least one air cap corresponding to the at least one LED element and in close contact with the PCB, And at least one socket portion formed in close contact with the air cap of the at least one LED element and corresponding to the arrangement of the at least one LED element.

Description

LED LIGHTING APPARATUS

The present invention relates to an LED lamp, and more particularly, to an LED lamp having an air cap formed in close contact with an LED substrate, thereby reducing noise between the LED substrate and the socket and preventing dust from entering between the LED substrate and the socket The present invention relates to an LED luminaire capable of forming a natural light distribution by expanding air inside an air cap according to heat generated by an LED device and deforming the air cap convexly.

Conventionally, a fluorescent lamp has been widely used as means for providing visible light. In recent years, the use of LED (Lighting Emitting Diode) lamps has been increasing as a substitute for fluorescent lamps due to problems of eye fatigue, heat generation, life span and power loss.

LED is excellent in efficiency of converting power into light and has high efficiency compared to incandescent lamp, fluorescent lamp and compact fluorescent lamp, which are currently used lighting apparatuses, and is highly economical, and also obtains high efficiency illumination at low voltage It has the advantage of less glare, less scattering of light and superior stability. For this reason, it is widely used not only in various fields such as various landscape lighting and advertisements, but also as a traffic signal lamp and a home lamp.

In spite of its advantages, such an LED lamp has a relatively high manufacturing cost compared to conventional fluorescent lamps and incandescent lamps, and thus has a problem in that it can not be used as a lighting device for illuminating a wide range of indoor and outdoor areas or intensively examining a specific area. Also, if the capacity is increased to increase the brightness, there is a problem that a large ventilation hole must be added for heat radiation.

Also, such a conventional LED lighting fixture is likely to generate a clearance due to a tolerance or an assembly error between the LED and the heat-dissipating component at the time of manufacture, and may be deformed depending on the use to lower the heat dissipation efficiency. A separate cushioning material such as a silicon pad is required to prevent noise between the PCB and the socket portion. In addition, due to the heat generated by the LED, dust in the air is introduced into the gap between the PCB and the socket, thereby causing contamination of the luminaire, thereby lowering the light quantity of the LED lamp.

KR 10-2013-0052796 A

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems and it is an object of the present invention to provide an air cap which is closely attached to an LED substrate portion to reduce noise between the LED substrate portion and the socket portion, And it is an object of the present invention to provide an LED lamp which can form a natural light distribution by expanding the air inside the air cap according to the heat generated by the LED element and deforming the air cap convexly.

Another object of the present invention is to provide an LED lighting device having a structure that can be replaced with a conventional lighting fixture and can maximize heat radiation efficiency.

It is another object of the present invention to provide an LED lamp having a material and structure that can be easily attached to and detached from a ceiling or a wall surface.

It is another object of the present invention to provide an LED lamp that can efficiently arrange and collect a plurality of LEDs and can maximize operating performance as illumination.

In order to achieve the above object, an LED lamp according to an embodiment of the present invention includes a PCB and an LED substrate portion including at least one LED element disposed on the PCB, and corresponds to the at least one LED element At least one air cap formed in close contact with the PCB, and at least one socket portion formed in close contact with the at least one air cap and corresponding to the arrangement of the at least one LED element.

Advantageously, the at least one air cap is tightly coupled between the top of the at least one socket and the PCB, thereby sealing the internal space between the at least one air cap and the PCB.

Also preferably, the at least one air cap can be inflated as the temperature of the interior space rises by the heat of the at least one LED element.

Also, at least one support portion extending upward and contacting the lower surface of the PCB may be formed on an outer surface of the at least one socket portion.

Preferably, the LED lamp further comprises at least one coupling member inserted through the PCB and inserted into the at least one support.

Preferably, the at least one socket portion is formed in a conical shape having an opening at an upper end thereof, and a reflective portion for condensing light generated from the at least one LED element is formed on an inner surface of the at least one socket portion .

The LED lamp may further include a heat dissipation member coupled to the LED substrate and having a heat dissipation fin on an upper surface thereof, and a power supply unit coupled to the heat dissipation member.

Also, preferably, at least one support portion formed on the outer side surface of the at least one socket portion and extending upward is formed to be in contact with the lower surface of the PCB, and the LED lighting fixture penetrates through the heat dissipation member and the PCB And at least one coupling member for inserting the upper surface of the PCB into the lower surface of the heat dissipation member by being inserted into the at least one support portion.

Preferably, the LED lamp further includes a wire connecting the housing portion or the heat dissipating member to an inner wall of the ceiling or the wall.

The LED lamp may further include an anti-vibration member disposed between the heat dissipation member and the housing portion and made of an elastic material.

Also, preferably, the housing part further includes a magnetic body provided on the upper side, and may be fixedly attached to the metal material provided on the ceiling surface or the wall surface by the magnetic force of the magnetic body.

Preferably, the housing part further includes a side wall part having a rectangular column shape housing the LED substrate part on the inner circumferential side, and a protruding part protruding in the outer circumferential direction from the side wall part and having a rectangular ring shape.

Further, preferably, the magnetic body may be coupled to the upper side of the protrusion.

Further, it may further comprise a film portion disposed to cover the lower surface of the at least one socket portion.

The LED lamp according to the present invention includes the air cap formed in close contact with the LED substrate portion to reduce noise between the LED substrate portion and the socket portion and to prevent dust from entering between the LED substrate portion and the socket portion The air inside the air cap expands due to the heat generated by the LED element, and the air cap is deformed convexly, thereby forming a natural light distribution.

In addition, the LED lamp according to the present invention is minimized in height, and is compact and heat dissipated through the entire upper surface, thereby maximizing thermal efficiency and improving operational reliability.

In addition, since the LED lamp according to the present invention can be attached to and detached from the ceiling or the wall through the magnetic material, it is possible to save time and cost due to assembly and maintenance.

Further, since the LED lamp according to the present invention has a structure capable of efficiently arranging and condensing a plurality of LEDs, efficiency as a lighting is maximized and a structure for improving the heat transfer efficiency between the heat dissipating member and the LED is provided, There is an effect to be improved.

1 is an exploded perspective view showing an LED lamp according to an embodiment of the present invention.
2 is a perspective view illustrating an LED lamp according to an embodiment of the present invention.
3A is a side view and a side sectional view of an LED lamp according to an embodiment of the present invention.
FIG. 3B is a side cross-sectional view of an LED lamp according to an embodiment of the present invention, showing a state in which the air cap expands according to heat generation of the LED element. FIG.
3C is a side sectional view showing an LED lamp according to another embodiment of the present invention.
FIG. 3D is a side sectional view showing an LED lamp according to still another embodiment of the present invention. FIG.
4 is an exploded perspective view illustrating an LED lamp according to another embodiment of the present invention.
5 is a perspective view showing an LED lamp according to an embodiment of the present invention.
FIG. 6 is a view showing an LED lighting device according to an embodiment of the present invention disposed on a ceiling. FIG.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is an exploded perspective view showing an LED lamp according to an embodiment of the present invention. Referring to FIG. 1, an LED lamp 100 according to an exemplary embodiment of the present invention may include a housing 110, at least one air cap 115, and an LED substrate 120. 1, the LED lamp 100 may further include a dustproof member 130, a heat dissipating member 140, and a power supply unit 150. The LED lamp 100 includes a housing 110, at least one air cap 115, an LED substrate 120, a dustproof member 130, a heat dissipating member (not shown) 140 and the power supply unit 150 in this order.

The housing part 110 is a member that forms an outer appearance of a lower surface and a side surface of the LED lamp 100. The housing part 110 can be coupled with the heat radiation member 140 on the upper side, One air cap 115 can be accommodated. The housing part 110 may include at least one socket part 190 inside the LED socket part 120. The at least one socket part 190 may have a predetermined opening And may have a structure capable of appropriately reflecting the light emitted by the at least one LED element formed on the LED substrate unit 120.

At least one air cap 115 may correspond to at least one LED element formed on the LED substrate part 120. [ 1, at least one air cap 115 may be comprised of six rows and six rows to correspond to the arrangement of at least one socket portion 190 of the housing portion 110, (115) may be formed in a convexly protruding shape so as to be insertable into an upper opening formed in at least one socket portion (190). Although FIG. 1 shows six air caps 115 formed as an integral unit, the air caps 115 may be arranged and joined in various ways, for example, each air cap 115 may be formed separately. can be changed.

The LED substrate unit 120 may be disposed below the heat dissipation member 140 and the dustproof member 130 and may include a PCB and at least one LED device disposed on the PCB. The LED substrate 120 may be formed of a general printed circuit board or various types of substrates capable of mounting LED elements.

The LED substrate portion 120, the at least one air cap 115 and the housing portion 110 may be closely contacted to each other by a coupling member 185, as shown in FIG. The coupling member 185 may be a fastening means such as a screw and the LED substrate 120 and at least one air cap 115 may be provided with a hole for penetrating the coupling member 185. The coupling member 185 may be inserted into at least one support portion 193 formed in the housing portion 110 after passing through the LED substrate portion 120 and the hole of the at least one air cap 115. Meanwhile, the coupling member 185 may be realized by various types of fastening means known to those skilled in the art. Also, in FIG. 1, at least one support 193 is illustrated as being formed in only a portion of at least one socket portion 190, which is exemplary, and in accordance with an embodiment, at least one support 193 may include at least one The socket part 190, and the like. Meanwhile, the surface of the LED substrate 120 may have a transparent coating to prevent moisture and dust.

The vibration preventing member 130 is disposed between the joining portions of the heat dissipating member 140 and the housing portion 110, that is, the heat dissipation member 140, May be disposed between the lower surface of the member (140) and the upper surface of the housing part (110). The anti-vibration member 130 may be made of a material having elasticity, and may have a rectangular ring shape as shown in FIG. 1, and may support the lower edge of the heat dissipating member 140.

The heat dissipation member 140 may be coupled to the upper side of the LED substrate unit 120 and the heat dissipation fin may be formed on the upper surface thereof. The heat dissipation member 140 may be coupled to the housing unit 110 while the LED substrate unit 120 is coupled to the lower side. Since the heat radiating member 140 forms most of the outer appearance of the upper surface of the LED lamp, it can serve as a kind of an upper cover and the power supply unit 150 can be mounted on the heat radiating member 140.

The heat dissipation member 140 is a member that is coupled to the upper side of the LED substrate unit 120 and emits heat generated from the LED substrate unit 120 to the outside. It improves the deterioration of the light efficiency and the lifetime of the LED module due to heat generation When the required power of the LED module to be used is large or the amount is large, the heat dissipating member 140 can be formed in a larger size.

The heat dissipation member 140 fixes the LED substrate unit 120 on the lower side. Since the LED substrate unit 120 includes a plurality of LED elements arranged in rows on a plane as will be described later, Lt; / RTI >

The power supply unit 150 may be coupled to the upper side of the heat dissipation member 140 and may supply power to the LED lamp 100. The power supply unit 150 may be an SMPS transformer (Switching Mode Power Supply), which is capable of generating an appropriate DC voltage in the LED substrate unit 120 by flowing an external AC current. The SMPS transformer controls the supply of current to the transformer through switching to generate the appropriate voltage on the secondary side. However, it goes without saying that the power supply unit 150 may be various devices other than the power supply unit 150 as long as it can change the waveform and voltage of external power.

The power supply unit 150 may be fixed to the upper side of the LED lamp 100 and may further include a fixing member 182 for enhancing the coupling force between the power supply unit 150 and the heat dissipation member 140. have. The fixing member 182 may be formed of a fastening means such as a screw and has a hole for penetrating the fixing member 182 to the power supply unit 150 and a fastening member 182 for fastening the heat dissipating member 140 to the fixing member 182 As shown in Fig. The fixing member 182 may be a member such as a nut that engages with a threaded protrusion formed on the heat dissipating member 140, or may be formed of various types of fastening means known to those skilled in the art. According to the embodiment, the power supply unit 150 may be coupled to the housing unit 110 without being directly coupled to the heat dissipation member 140. [

The LED lamp 100 according to an exemplary embodiment of the present invention includes a heat dissipation member 140 and a housing unit 110 vertically coupled to each other to enhance a coupling force between the housing unit 110 and the heat dissipation member 140. [ The connecting member 181 may be provided. The connection member 181 may be formed as a fastening means such as a screw. For example, a predetermined hole may be formed to penetrate the upper surface and the lower surface of the heat dissipation member 140, and the connection member 181 may be formed in the housing portion 110 When the predetermined groove that can be fastened is formed, the coupling member 181 can be coupled in a manner of being inserted. The connecting member 181 may be a member such as a nut fastened to a screw-shaped projection formed on the housing part 110, or may be realized by various types of fastening means.

The LED lighting device 100 according to an embodiment of the present invention includes a magnetic body 160 that can be coupled to an upper surface adjacent to four corner portions of the housing portion 110 and the magnetic body 160 to the housing portion 110, (Not shown). A detailed description of the magnetic substance 160 and the binding member 183 will be described in detail with reference to FIG. 2, and a detailed description thereof will be omitted here.

2 is a perspective view illustrating an LED lamp according to an embodiment of the present invention. FIG. 2 is an enlarged view of a part of a combined form of the LED lamp 100 according to an embodiment of the present invention shown in FIG. 1. Referring to FIG. 2, the housing 110 and the heat radiating member 140 Let's take a closer look.

As described above, the heat dissipation member 140 is a member for emitting heat generated from the LED substrate unit 120 disposed on the lower side to the outside, and can form most of the upper surface. The heat dissipation member 140 may be a plate-like member having a substantially rectangular shape and may be formed of a metal material having a high heat transfer performance. Preferably, the heat dissipation member 140 is made of an alloy material including copper (Cu) or aluminum (Al), but may be made of various materials capable of implementing a heat dissipation function.

As shown in FIG. 2, the heat radiating member 140 may include at least one radiating fin 141 protruding upward. The radiating fins 141 may be integrally formed as the same material as the radiating member 140, and may be integrally formed as an injection molding. The radiating fins 141 are members for increasing the contact area with air and facilitating heat emission, and they may protrude in the shape of ribs in the longitudinal direction or the width direction and may be arranged in the width direction or in the longitudinal direction And may be formed in various shapes according to the embodiments.

The heat dissipation member 140 may further include a step 144 protruding in a rib shape for seating the power supply unit 150 on the upper surface. That is, since the upper surface of the heat dissipation member 140 is mostly made of the heat dissipation fin 141, the same structure as that of the step portion 144 can be formed in order to couple the power supply unit 150 to the upper surface of the heat dissipation member 140 have. The lower surface of the step portion 144 can be supported while a part of the lower surface of the power supplying portion 150 is seated on the upper surface of the step portion 144. The lower surface of the power supplying portion 150 can be properly supported, And may be formed so as to protrude upward in two rows of ribs.

As described above, the connecting member 181 may be disposed to enhance the coupling force between the housing part 110 and the heat dissipating member 140, and the fixing member 181 may be disposed between the power supplying part 150 and the heat dissipating member 140. [ (182) may be disposed.

The power supply unit 150 may further include a seating part (not shown) protruding outwardly so that the power supply part 150 can be seated on the stepped part 144. The seating portion may be formed of a plate material corresponding to the shape of the step portion 144 and may be formed with a predetermined through hole so that the fixing member 182 can penetrate and be fastened to the step portion 144. [ Accordingly, the power supply unit 150 can be mounted on the upper surface of the step portion 144 at a predetermined distance from the upper side of the heat dissipation member 140, and the heat dissipation efficiency due to the arrangement of the power supply unit 150 can be lowered Can be minimized.

The housing part 110 may further include at least one socket part 190 therein and a rectangular side wall part 111 for coupling the heat radiating member 140 to the upper side. The side wall part 111 can accommodate the LED substrate part 120 on the inner circumferential side and can be formed into a rectangular column shape. The outer circumference of the heat dissipation member 140 may be formed to correspond to the shape of the outer circumference of the side wall portion 111 of the housing portion 110 in consideration of the accuracy of assembling and aesthetics.

A protrusion 112 protruding in a circumferential direction from the side wall part 111 may be further provided on the outer side of the side wall part 111 in order to prevent the connection with the outside of the LED lamp 100 and direct heat transfer. The protruding portion 112 may have a substantially rectangular ring shape and may be connected to the side wall portion 111 on the inner circumferential side. The protrusion 112 may be connected to a part of the side wall part 111 and may be formed only at a part of the side surface.

Meanwhile, in consideration of the certainty of assembly, the heat dissipating member 140 may further include a bent portion 142 bent downward from the end side. The bending portion 142 is bent substantially vertically downward from the rim of the heat dissipating member 140 so that the inner surface of the bending portion 142 is in close contact with the outer peripheral surface of the side wall portion 111 of the housing portion 110 . When the heat dissipating member 140 is provided with the bending portion 142 as described above, the reliability of assembly can be further improved.

The bent portion 142 may be formed on only one side of the rectangular heat dissipation member 140 or on both sides or four sides of the heat dissipation member 140. Alternatively, 2 shows two embodiments in which two bending portions 142 are formed on both sides of the heat dissipating member 140. In this case, the shearing force in the horizontal direction in the combined state of the housing portion 110 and the heat dissipating member 140, And the shear force in the height direction can be supported by the connecting member 181. [ That is, the bent portion 142 can function as a stopper that restricts the radiation member 140 from moving in the horizontal direction from above the housing portion 110. The bending portion 142 may be formed on all four sides of the heat dissipating member 140. In this case, the bending portion 142 may be formed on the side wall portion 111 of the housing portion 110 from the inner periphery of the bending portion 142. [ Since all four sides are supported, the reliability of the assembly can be further improved.

According to an embodiment of the present invention, the inner circumferential side of the bent portion 142 may have a hook shape, and a groove corresponding to the hook shape may be formed on the outer circumferential surface of the side wall portion 111. In this case, The connection member 181 may be omitted because the heat generating member 110 and the heat dissipating member 140 can be coupled by the elastic force of the bent portion 142. [

Referring to FIG. 2, the LED lighting apparatus 100 according to an embodiment of the present invention may further include a magnetic body 160 disposed on the upper side. The magnetic body 160 may be coupled to an upper surface adjacent to the four corners of the housing 110 and may be made of a material such as a permanent neodymium magnet.

The magnetic substance 160 may be selectively disposed on the heat dissipation member 140 or the housing unit 110. In consideration of the installation method in which the power supply unit 150 and the heat dissipation member 140 are embedded on the ceiling or the wall surface, And may be coupled to the upper side of the protrusion 112 of the unit 110. Accordingly, the housing part 110 can be fixedly attached to the ceiling surface or the metal material provided on the wall surface by the magnetic force of the magnetic body 160.

The binding member 183 may further include a magnetic member 160 which penetrates the magnetic body 160 in the up and down direction to connect the magnetic body 160 to the upper surface of the housing portion 110, And a fastening means such as a screw which is screwed into the formed groove. 1 and 2, the magnetic substance 160 is disposed at the four corners of the housing portion 110, but is illustratively shown. The magnetic substance 160 is disposed at the center of one side of the housing portion 110 Or may be arranged in two on both sides.

The process of embedding and fixing the LED lamp 100 in the ceiling according to an embodiment of the present invention when the magnetic substance 160 is provided on the upper surface of the housing part 110 will be described below.

The power supply unit 150 is coupled to the upper side of the heat dissipation member 140 and the power supply unit 150 is coupled to the lower side of the LED substrate unit 120 and the housing unit 110 A part of the heat radiating member 140 and the side wall portion 111 can be inserted into the opening of the ceiling. A metal material such as a steel structure is provided on the lower surface of the ceiling adjacent to the opening, and the magnetic material 160 fixes the LED lamp 100 on the ceiling by magnetic force. Meanwhile, if no magnetizable material is formed on the ceiling, the metallic material may refer to a bracket (170 in FIG. 6) provided on a ceiling surface or a wall surface of a portion where the magnetic body 160 is disposed. The bracket 170 is fixed to a ceiling surface or a wall surface of a portion where the magnetic body 160 is disposed and is attached to the magnetic body 160 to support the LED lighting fixture 100.

As described above, since the LED lamp 100 according to an exemplary embodiment of the present invention includes the magnetic body 160, the LED lamp 100 according to the prior art There is an effect that the hassle can be solved. In other words, since the LED lighting device 100 can be easily coupled by inserting it into the opening of the ceiling, it is easy to install and the disassembling process according to the maintenance can be remarkably convenient compared to the prior art.

Meanwhile, the shape of the housing part 110 shown in FIGS. 1 and 2 is exemplary, and the housing part 110 of the LED lighting device 100 according to an embodiment of the present invention can be changed into various forms.

3A is a side view and a side sectional view of an LED lamp according to an embodiment of the present invention.

3A, the upper power supply unit 150 is omitted for convenience of explanation. As shown in the left side view, since the LED lamp 100 according to the embodiment of the present invention is formed in a substantially rectangular shape as a whole, the height of the upper and lower portions is lowered. Therefore, most of the outer shape of the LED lamp 100 is formed on the lower side of the housing part 110 in a state of being embedded in the ceiling.

The side wall portion 111 and the protruding portion 112 are omitted in the side sectional view on the right side and the enlarged view (inside the chain double-dashed line), so that the LED substrate portion 120 and the at least one socket portion 190 are combined. do.

The LED lighting unit 100 according to an embodiment of the present invention includes the LED substrate unit 120 disposed on the lower surface of the flat heat dissipation member 140 and the lower surface of the LED substrate unit 120, At least one socket portion 115 and at least one socket portion 190 may be disposed in order.

The LED substrate portion 120 may include a PCB 122 and at least one LED element 121 disposed on the PCB 122. At least one LED element 121 may be fixed on the PCB 122 by a soldering method or the like.

At least one air cap 115 may correspond to at least one LED element 121 and may be formed in close contact with the PCB 122. The at least one air cap 115 may be made of a soft, elastic, transparent material such as a silicone material, and the portion corresponding to the LED element 121 may be formed of a convex .

The at least one air cap 115 is tightly coupled between the upper end of the at least one socket portion 190 and the PCB 122 so as to surround each LED element 121, The internal space between the cap 115 and the PCB 122 can be sealed. The at least one air cap 115 functions as a buffer between the PCB 122 and the upper end of the socket portion 190 to prevent noise generated at the temperature difference between the PCB 122 and the socket portion 190 It is possible to solve the problem that the dust in the air is introduced into the gap between the PCB 122 and the socket part 190 due to the heat generated by the LED element 121 to induce the pollution of the luminaire and the light amount of the luminaire is lowered have.

At least one socket unit 190 is formed in close contact with at least one air cap 115 and the LED elements 121 of the LED substrate unit 120 are arranged to be opened, May be formed corresponding to the arrangement of the at least one LED element 121. [ That is, each of the socket units 190 may be disposed in the at least one socket unit 190 corresponding to the positions of the respective LED devices 121. 3A, the socket portion 190 may be formed in a conical shape with its top end cut off, and a predetermined opening is formed on the upper side so that all or a part of the LED element 121 is inserted and light is emitted downward .

A reflection portion 191 for condensing light generated from at least one LED element 121 may be formed on the inner surface of at least one socket portion 190. The reflector 191 may be coated or surface-treated with a material having a high reflectance so as to condense the light emitted from the LED element 121 and reflect the light in a proper direction.

3A, the socket portion 190 has an inwardly curved shape. The socket portion 190 is an example of the socket portion 190, and the shape of the socket portion 190 may be variously changed have. The angle formed by the inner surface of the socket unit 190 may be selectively set according to the degree of light condensation from the respective LED elements 121. The height of the at least one socket portion 190 may be formed to a height at which the PCB 122 is disposed in a state where the housing portion 110 and the heat dissipating member 140 are coupled with each other as shown in FIG.

Meanwhile, the LED lamp 100 according to the embodiment of the present invention shown in FIG. 3A may include at least one support portion 193 on the outer surface of at least one socket portion 190. The at least one support portion 193 may be formed in a space between the lower side of the LED substrate portion 120 and the upper side of the at least one socket portion 190 and the socket portion 190 And may be in contact with the lower surface of the PCB 122. [0043] The at least one support portion 193 may have a height corresponding to a distance between a lower surface of the PCB 122 and an outer surface of the socket portion 190, but the present invention is not limited thereto.

As the at least one support portion 193 is disposed, at least one LED element 121 may be guided so as to be inserted at a precise position of each socket portion 190 during assembly. Also, it is possible to prevent an undesirable lateral movement of the LED substrate unit 120 in the coupled state, and it is possible to accurately determine the insertion height between the PCB 122 and the socket unit 190.

The LED lamp 100 may further include at least one coupling member 185 inserted through the PCB 122 and inserted into the at least one support portion 193. The PCB 122 may have a through hole at a position corresponding to at least one support portion 193 and at least one air cap 115 may have a through hole at a corresponding position . The coupling member 185 may be implemented by various types of fastening means such as screws or bolts and the PCB 122 and the at least one supporting portion 193 are coupled by the coupling member 185, The portion 190 may be secured to the PCB 122 and the at least one air cap 115 may be in close contact with the PCB 122. Accordingly, it is possible to solve the problem that a clearance is generated between the LED substrate part 120 and the housing part 110 due to a tolerance or an assembly error in the production process.

The at least one support portion 193 may have a narrow protrusion shape and may have a shape that surrounds an upper portion of each socket portion 190 in a ring shape. And may have a long rib shape in the horizontal or vertical direction. In addition, as another function of the at least one support portion 193, since the LED element 121 is disposed at the upper end side of the socket portion 190 in a ring shape or a rib shape, the light generated from the LED element 121 can be prevented from leaking laterally It is possible.

In addition, the at least one support portion 193 may have a protruding shape extending downward from the PCB 122. In this case, the supporting portion 193 extending from the PCB 122 can be in contact with the outer surface of the socket portion 190, and at least one supporting portion 193 can be in contact with the socket portion 190, And a fastening groove for fastening can be further provided. The at least one support 193 is brought into contact with a predetermined portion of the outer wall surface of the socket portion 190 at the lower end portion in the process of joining the heat dissipation member 140 and the housing portion 110 coupling the LED substrate portion 120, When the coupling is completed, a force can be applied upward to the LED substrate unit 120. Accordingly, the upper surface of the LED substrate unit 120 is more closely adhered to the lower surface of the heat dissipation member 140, and the heat transfer between the heat dissipation member 140 and the LED substrate unit 120 can be more smooth.

3A, the lower surface of the housing part 110 is opened in a state in which the inner surface of the socket part 190 and the LED element 121 are exposed. In order to prevent the foreign materials from entering the film part 195 May be disposed to cover the lower surface of the socket unit 190. The film part 195 may be made of various materials and colors to select the transmittance of light generated from the LED element 121, and may be made of a light transmitting material. The film portion 195 may have a shape corresponding to the outer periphery of the protrusion 112 and an adhesive material may be formed on the upper surface of the housing portion 110 to facilitate attachment and detachment thereof. Accordingly, since the film part 195 can be easily attached and detached, it is possible to easily select the color of light or intensity of light.

FIG. 3B is a side cross-sectional view of an LED lamp according to an embodiment of the present invention, showing a state in which the air cap expands according to heat generation of the LED element. FIG.

Referring to FIG. 3B, when the LED lamp 121 operates to generate heat, the temperature of the internal space 123 rises, so that at least one air cap 115 can be bulged . That is, the PCB 122 and the at least one support 193 can be joined by the coupling member 185 to press the air cap 115, so that the inner space 123 around the LED element 121 is pressed against the air (Pressure) * (volume) = (number of gas molecules) * (gas constant) * (temperature) according to the ideal gas state equation PV = nRT, When the air in the inner space 123 of the air cap 115 is heated due to the heat generated by the LED cap 121, the volume of the air is increased so that the air cap 115 having a thin structure bulges so as to form a natural light distribution of the LED element 121 . Since the air cap 115 repeats expansion and contraction according to the operation of the LED element 121, the air cap 115 may be formed of a flexible and elastic material, for example, a silicone material. In addition, the air cap 115 may be formed to have a thickness enough to expand according to the heat generated by the LED element 121.

In the prior art, a plastic lens must be separately mounted to make the light distribution of the LED element 121, and at the same time, a cushioning material such as a silicon pad is inserted to prevent noise between the PCB 122 and the socket portion 190 The LED lamp 100 according to the embodiment of the present invention is characterized in that the air cap 115 is expanded and formed into a convex lens by the heat generated by the LED element 121 bonded on the PCB 122 The required light distribution can be made without using a separate plastic lens, and noise between the PCB 122 and the socket portion 190 can be prevented without a separate cushioning material.

In addition, the LED lamp 100 according to an embodiment of the present invention has an effect of easily modifying the transparency and the thickness of the air cap 115 to easily adjust a desired light amount and a light irradiation angle.

3C is a side sectional view showing an LED lamp according to another embodiment of the present invention.

The LED lamp according to another embodiment of the present invention as shown in FIG. 3C is characterized in that the heat dissipating member 140 is provided with a hole for penetrating the coupling member 185, and the coupling member 185 is connected to the heat dissipating member 140, The upper surface of the PCB 122 is closely attached to the lower surface of the heat dissipating member 140 by being inserted and fixed to at least one support portion 193 through the through hole 122. The radiating fins 141 may not be formed in the through holes formed in the radiating member 140.

Accordingly, the LED lamp according to another embodiment of the present invention more closely adheres the heat dissipating member 140 to the upper surface of the PCB 122, so that the heat generated from the LED 121 is more smoothly discharged through the heat dissipating member 140 There is an effect that can be. 3C has a connecting member 181 for vertically coupling the heat dissipating member 140 and the housing 110 because the connecting member 185 is also penetrated through the heat dissipating member 140 It may not be separately provided.

Other than the differences described above, the LED lamp according to another embodiment of the present invention shown in FIG. 3C is similar to the LED lamp according to the embodiment of the present invention described above with reference to FIGS. 1 to 3B, It is omitted.

FIG. 3D is a side sectional view showing an LED lamp according to still another embodiment of the present invention. FIG.

In the LED lamp according to another embodiment of the present invention shown in FIG. 3D, since the inner side surface of the socket portion 190 can be formed in the form of a wave pattern, a unique beauty can be produced.

Other than the differences described above, the LED lamp according to another embodiment of the present invention shown in FIG. 3D is similar to the LED lamp according to the embodiment of the present invention described above with reference to FIGS. 1 to 3B, Is omitted.

4 is an exploded perspective view illustrating an LED lamp according to another embodiment of the present invention.

4, LED devices 121 are arranged long in a row in each LED substrate portion 120, and the arrangement of the LED devices 121 is arranged in a long plate Shaped PCB 122 can be supported. According to the embodiment, the LED element 121 may be formed of a plurality of rows in one LED substrate unit 120. [

4, a plurality of LED substrate portions 120 are formed of a PCB 122 in which a plurality of LED elements 121 are arranged in a row and are arranged in parallel to the lower side of the heat radiation member 140, The LED substrate 120 may be sagged at the center side, which may lead to a deterioration in heat dissipation performance.

In order to solve such a problem, the LED lamp shown in FIG. 4 may further include a connection bracket 125 near the center of a row of the plurality of LED substrate parts 120. The connection bracket 125 is a kind of plate arranged substantially perpendicular to the rows of the plurality of LED substrate portions 120 arranged in a row and is coupled to the lower surface of the heat dissipation member 140 together with the LED substrate portion 120, The heat dissipation member 140 may be disposed so as to be in close contact with the heat dissipation member 140. Meanwhile, the connection bracket 125 shown in FIG. 4 is an exemplary embodiment, and the arrangement and the number of the connection brackets 125 can be variously changed according to selection.

4, the LED lamp according to another embodiment of the present invention may further include a fastening member 184 for closely contacting the LED substrate portion 120 and the heat dissipating member 140. FIG. 4, a plurality of fastening holes 143 are formed in the heat dissipating member 140 according to the arrangement of the LED substrate portions 120, and the fastening holes 143 are formed in the LED substrate portion 120, A substrate fastening hole 124 may be formed so as to correspond to the position of the substrate fixing hole 124. [ The fastening member 184 may be a screw-like member capable of being inserted into a predetermined hole and may be inserted into the fastening hole 143 and the substrate fastening hole 124, 120 may be disposed in close contact with each other. A portion of the LED substrate 120 separated from the heat dissipating member 140 by heat is formed on the lower side of the heat dissipating member 140 according to the engagement of the fastening member 184, .

In addition, the connection bracket 125 may merely mechanically connect the plurality of LED substrate units 120, or may have a predetermined terminal to provide an electrical connection function. The LED substrate unit 120 includes a plurality of LED elements 121 arranged in a longitudinal direction and the LED substrate unit 120 includes a conductive wire therein to support the array of the LED elements 121 And a predetermined terminal may be formed on the end side so as to be electrically connected to each other. Accordingly, when the length of the LED lighting unit 100 is longer than the length of the LED substrate unit 120, the connection bracket 125 may electrically connect the LED substrate units 120 together.

In the case where the length of the housing part 110 corresponds to the length of the LED board part 120, the heat radiating member 140 may be configured to support the plurality of housing parts 110 together. For example, when two or more heat dissipating members 140 are arranged to be mutually connected in the longitudinal direction, the heat dissipating member 140 may be disposed separately on the upper surface of each housing unit 110, The heat dissipation member 140 may be formed long enough to couple the plurality of housing parts 110 together.

The LED lamp according to another embodiment of the present invention as shown in FIG. 4 is provided between the LED substrate unit 120 and the housing unit 110 and includes at least one air It is possible to further include a cap. The description of the configuration and effects of at least one air cap has already been described above, and thus a detailed description thereof will be omitted.

5 is a perspective view showing an LED lamp according to an embodiment of the present invention.

5, the heat dissipation member 140 may be formed in a rectangular plate shape while the power supply unit 150 is mounted on the upper surface of the heat dissipation member 140, and the LED substrate unit 120 is coupled to the lower surface of the heat dissipation member 140, have.

The array of the LED elements 121 in the housing part 110 is accommodated in the inner space of the side wall part 111 and the rectangular ring shaped protrusion part 112 formed to be wider on the outer periphery side has the opening edge face of the ceiling or wall surface .

As described above, since the protrusion 112 can include the magnetic substance 160, it can be magnetically coupled to a metal structure such as a steel structure formed on a ceiling or a wall surface or a separately attached bracket 170 (Fig. 6) have. However, the protrusion 112 may be omitted according to the embodiment. In this case, the magnetic substance 160 may be formed on the upper surface of the heat dissipating member 140.

Meanwhile, the LED lamp 100 shown in FIG. 5 may further include a wire 186. That is, when the LED lamp 100 is attached to a predetermined portion of the ceiling through the magnetic body 160, there is a possibility that the LED lamp 100 may be detached due to vibration or impact, Lt; / RTI >

The upper end of the wire 186 may be connected to the inner wall of the ceiling or the wall and the lower end may be connected to the heat radiating member 140 or the housing portion 110 through the wire connecting member 187. The wire connecting member 187 may fix the lower end side of the wire 186 on the upper side or the inside thereof and the lower side may be fastened to the heat radiating member 140 or the housing part 110. For example, the connection between the wire connecting member 187 and the heat radiating member 140 or the housing portion 110 may be achieved through a hook-shaped connection structure, and the heat radiating member 140 or the housing portion 110 may be formed, The screw connection of the wire connecting member 187 may be inserted into the screw groove formed in the connecting member 187. In addition, various types of fastening methods may be applied.

5, two wires 186 are arranged in a direction perpendicular to the heat dissipating member 140. However, the wires 186 may be formed of a wire (not shown) The number and the shape of the light emitting devices 186 may be variously changed depending on the selection.

FIG. 6 is a view showing an LED lighting device according to an embodiment of the present invention disposed on a ceiling. FIG.

Referring to FIG. 6, the ceiling portion 10 is generally formed in a tile manner at a predetermined distance downward for aesthetic purposes on the inner wall of a building or basic structure.

An opening portion (not shown) corresponding to the shape of the outer periphery of the side wall portion 111 of the housing portion 110 is formed in the ceiling portion 10, as shown in FIGS. 1 to 5, The housing part 110 may be inserted into the opening in a state where the LED substrate part 120, the heat radiation member 140, and the power supply part 150 are coupled to each other. That is, the outer circumference of the side wall portion 111 may have a shape corresponding to the inner circumference of the ceiling surface or the opening of the wall surface.

As described above, the protrusion 112 of the housing part 110 faces the lower surface of the rim of the ceiling opening, and the upper surface of the protrusion 112 can be brought into close contact with the lower surface of the rim of the ceiling opening. A magnetic substance 160 is disposed on the upper surface of the protrusion 112 and the magnetic substance 160 can provide a binding force to the bracket 170 provided on the ceiling portion 10 through magnetic force. Therefore, the LED lighting apparatus 100 according to the present invention has an advantage in that the connection between the ceiling portion 10 and the LED lamp 100 is made through magnetic force, so that the LED lighting fixture 100 can be easily detached and attached, and its position adjustment and maintenance can be simplified.

In the embodiment of the present invention, the LED lamp 100 is installed on a ceiling. However, the LED lamp 100 according to the concept of the present invention can be applied to various apparatuses such as a street lamp as well as a wall.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: LED lamp 110: housing part
111: side wall portion 112:
115: Air cap 120: LED substrate part
121: LED element 122: PCB
123: inner space 124: substrate fastening hole
125: connection bracket 130: anti-vibration member
140: heat radiating member 141: radiating fin
142: bending portion 143: fastening hole
150: power supply unit 160: magnetic body
170: bracket 181: connecting member
182: fixing member 183: binding member
184: fastening member 185: coupling member
186: wire 187: wire connecting member
190: socket portion 191: reflective portion
193: Support part 195: Film part

Claims (14)

An LED substrate portion including a PCB and at least one LED element disposed on the PCB;
At least one air cap corresponding to the at least one LED element and formed in close contact with the PCB; And
And at least one socket portion formed in close contact with the at least one air cap and corresponding to the arrangement of the at least one LED element,
Wherein the at least one air cap is inflated as the temperature of the internal space between the at least one air cap and the PCB rises by the heat of the at least one LED element. The airbag according to claim 1, wherein the at least one air cap
Tightly coupled between the top of the at least one socket portion and the PCB, thereby sealing the internal space between the at least one air cap and the PCB. delete 3. The socket according to claim 2,
And at least one supporting part formed to extend upward and to be in contact with a lower surface of the PCB. The LED lighting device according to claim 4,
Further comprising at least one engaging member penetrating the PCB and inserted into the at least one support portion. 3. The apparatus of claim 2, wherein the at least one socket portion comprises:
And is formed in a conical shape having an opening at an upper end thereof,
And an inner side surface of the at least one socket portion,
Wherein a reflective portion for condensing light generated from the at least one LED element is formed. The LED lighting device according to claim 1,
A heat dissipating member coupled to an upper side of the LED substrate portion and having radiating fins formed on an upper surface thereof; And
And a power supply unit coupled to the upper side of the heat dissipation member. 8. The socket according to claim 7, wherein the outer surface of the at least one socket portion
At least one supporting part formed to extend upward and to be in contact with a lower surface of the PCB,
The LED lighting fixture includes:
Further comprising at least one coupling member penetrating through the heat dissipating member and the PCB to be inserted into the at least one support portion to closely contact the upper surface of the PCB with the lower surface of the heat dissipating member. 8. The LED lighting device according to claim 7,
Further comprising a wire connecting the housing portion or the heat dissipating member to an inner wall of the ceiling or the wall. 8. The LED lighting device according to claim 7,
Further comprising an anti-vibration member disposed between the heat dissipating member and the engagement portion of the housing portion and made of an elastic material. The connector according to claim 1,
Further comprising a magnetic body provided on the upper side and fixed to the metal material provided on the ceiling surface or the wall surface by the magnetic force of the magnetic body. 12. The apparatus according to claim 11,
A side wall portion which houses the LED substrate portion on the inner circumferential side and has a rectangular columnar shape; And
And a protruding portion protruding from the side wall portion in an outer circumferential direction and having a rectangular ring shape. The magnetic recording medium according to claim 12,
And the LED is coupled to the upper side of the protruding portion. The method according to claim 1,
Further comprising: a film portion disposed to cover the lower surface of the at least one socket portion.

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