KR101325793B1 - A straight line pipe style light emitted diode lighting lamp - Google Patents

A straight line pipe style light emitted diode lighting lamp Download PDF

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Publication number
KR101325793B1
KR101325793B1 KR1020130027978A KR20130027978A KR101325793B1 KR 101325793 B1 KR101325793 B1 KR 101325793B1 KR 1020130027978 A KR1020130027978 A KR 1020130027978A KR 20130027978 A KR20130027978 A KR 20130027978A KR 101325793 B1 KR101325793 B1 KR 101325793B1
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South Korea
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heat dissipation
led lamp
led
dissipation frame
frame
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KR1020130027978A
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Korean (ko)
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정재훈
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정재훈
주식회사 진성플라텍
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/10Construction

Abstract

The present invention comprises an LED bonding surface fixed to an LED lamp by burying the center part of a heat radiation frame for forming a recess in the outer diameter part of a circular shape. A heat radiation space where the inner side of the heat radiation frame is separated from the outer side is formed. A reflecting surface is formed on a flat surface inclined to both ends of the heat radiation frame. A diffusion plate is formed to support the reflecting surface and to cover the front part of an LED lamp. Therefore, a straight line pipe type LED lamp improves heat transfer efficiency.

Description

직관형 엘이디램프{a straight line pipe style light emitted diode lighting lamp}Intuitive LED lamp {a straight line pipe style light emitted diode lighting lamp}
본 발명은 원형상으로 외경측에 요철이 형성되는 방열프레임의 중앙부가 내측으로 함몰되어 엘이디모듈이 고정되는 엘이디부착면이 구비되는 구성으로 방열프레임의 내측 및 외측에 분리되는 방열공간이 각각 형성되고, 상기 방열프레임의 양단이 경사지는 평면상의 반사면이 각각 구비되며, 상기 반사면에 지지되면서 엘이디모듈의 전방을 커버링하도록 확산판이 구비되는 구성으로 열전달 효율을 높이도록 하는 직관형 엘이디램프에 관한 것이다.According to the present invention, a heat dissipation space is formed on the inside and the outside of the heat dissipation frame in a circular shape in which a central portion of the heat dissipation frame in which the unevenness is formed on the outer diameter side is recessed inward and the LED attachment surface to which the LED module is fixed is formed. In addition, each of the heat dissipation frame is provided with a planar reflecting surface on which both ends are inclined, and is provided with a diffuser plate to cover the front of the LED module while being supported on the reflecting surface to improve the heat transfer efficiency LED lamp. .
일반적으로, 야간에 또는 실내에서 광을 제공하거나 물체를 조사하기 위해 다양한 종류의 램프 또는 등이 이용되고 있다. In general, various types of lamps or the like are used to provide light or to irradiate an object at night or indoors.
이 같은 램프 또는 등은 전원을 공급받아 전기에너지를 광에너지로 변환하여 광을 제공하거나 물체를 조사하는 것으로서, 대체로 백열전구 또는 형광등을 사용하는 것이 일반적이다.Such lamps or lamps are supplied with power to convert electrical energy into light energy to provide light or to irradiate an object, and in general, incandescent lamps or fluorescent lamps are generally used.
최근에는 고가임에도 불구하고 다양한 색연출을 행할 수 있으며 수명이 길고 전기 소모량이 적다는 장점으로 인해 LED(Light Emitting Diode)를 이용한 램프 또는 등이 널리 개발되어 사용되고 있으며, 그 형상 및 모양도 다양화 되고 있다. Recently, although it is expensive, various colors can be produced, and a long lifetime and low power consumption have led to the development of lamps or lamps using LEDs (Light Emitting Diodes). have.
이와같은 기술과 관련되어 종래의 특허 제866586호에 엘이디를 이용한 형광등의 구성이 개시되어 있으며 이는 도 1에 도시된 바와 같이, 반구형상의 베이스(12)와, 그리고 상기 베이스(12) 양단에서 내향하며 절곡형성된 연장부(14)를 포함하여 이루어진 본체(10); 상기 본체(10)의 베이스(12) 내측에 길이방향을 따라 형성되고, 방열면적을 넓혀 방열효율을 높이기 위한 방열 날개부(20); 상기 베이스(12)의 연장부(14)에 얹혀지는 플레이트(32)와, 그리고 상기 플레이트(32) 양측에 연결된 수용돌기(34)를 포함하여 이루어진 고정부(30); 상기 고정부(30)의 수용돌기(34) 사이에 안착되고, 다수의 엘이디(42)(LED)가 실장된 피씨비(PCB)기판으로 이루어진 엘이디모듈(40); 상기 본체(10)를 덮고 반구형상으로 이루어지며, 상부 중심보다 양측부 두께가 상대적으로 얇게 형성되어, 양측부로 방사되는 빛의 투과량을 높여 상기 엘이디모듈(40)에서 조사되는 빛의 지향각을 확장시키는 캡(50); 상기 본체(10)의 상단부에는 삽입부(62)가 형성되고, 상기 캡(50)에 하단부에는 상기 삽입부(62)에 결합되는 대응삽입부(64)가 형성되어, 상기 본체(10)와 상기 캡(50)의 결합 및 분리시 상기 삽입부(62)와 상기 대응삽입부(64)가 탄성을 발휘하여 상기 본체(10)와 캡(50)의 결합 및 분리용이성을 보장하기 위한 탈착수단(60); 및 상기 본체(10)와 상기 캡(50)의 결합 후 양단을 고정결합하는 고정커버(80);를 포함하여 이루어진다.In connection with such a technique, a configuration of a fluorescent lamp using an LED is disclosed in the prior art Patent No. 866586, which is inwardly inclined toward the hemispherical base 12 and both ends of the base 12, as shown in FIG. A main body 10 including a bent extension portion 14; A heat dissipation wing unit 20 formed along the longitudinal direction inside the base 12 of the main body 10 to increase the heat dissipation area to increase heat dissipation efficiency; A fixing part 30 including a plate 32 mounted on the extension part 14 of the base 12, and a receiving protrusion 34 connected to both sides of the plate 32; An LED module 40 seated between the receiving protrusions 34 of the fixing part 30 and formed of a PCB (PCB) board on which a plurality of LEDs 42 (LEDs) are mounted; Covering the main body 10 is made in a hemispherical shape, the thickness of both sides is formed relatively thinner than the upper center, to increase the amount of light emitted to both sides to extend the direction of the light irradiated from the LED module 40 A cap 50 to make; An insertion part 62 is formed at an upper end of the main body 10, and a corresponding insertion part 64 coupled to the insertion part 62 is formed at a lower end of the cap 50 to form the main body 10. Detachment means for ensuring the coupling and separation ease of the main body 10 and the cap 50 by the elasticity of the insertion portion 62 and the corresponding insertion portion 64 when the cap 50 is coupled and separated 60; And a fixing cover 80 fixedly coupling both ends after the main body 10 and the cap 50 are coupled to each other.
이와 같은 구성에 따라, 상기 엘이디모듈(40)을 이용함으로써 형광등의 사용수명을 반영구적으로 유지할 수 있고, 방열면적을 넓혀 방열효과를 높일 수 있으며, 형광등의 고장 및 수리시 고정커버(80)에 의해 본체(10)와 캡(50)을 신속하고 간편하게 분리 및 결합할 수 있으며, 캡(50)의 두께를 상부 중심보다 양측부를 상대적으로 얇게 하여 조명효율을 높일 수 있게 되는 것이다.According to this configuration, by using the LED module 40 can be used to maintain the life of the fluorescent lamp semi-permanently, to increase the heat dissipation area to increase the heat dissipation effect, by fixing the cover 80 during the failure and repair of the fluorescent lamp The main body 10 and the cap 50 can be quickly and easily separated and combined, and the thickness of the cap 50 will be relatively thinner on both sides than the upper center to increase the lighting efficiency.
그러나, 이와 같은 엘이디를 이용한 형광등은 단순하게 엘이디모듈(40)에서 발광되는 광을 특정구조의 캡(50)을 통해 조명효율을 높일 수 있어 그 조명효율의 향상에 한계가 있고, 캡(50)과 본체(10)의 분해 결합이 신속하게 이루어지지 못하며, 본체(10)의 외측면에 접촉되는 공기에 의해서만 열전달이 이루어져 방열효과가 저하되는 문제점이 있다.However, the fluorescent lamp using the LED can increase the lighting efficiency of the light emitted from the LED module 40 through the cap 50 of a specific structure has a limit in improving the lighting efficiency, the cap 50 Decomposition and coupling of the main body 10 is not made quickly, there is a problem that the heat transfer is reduced only by the air in contact with the outer surface of the main body 10 to reduce the heat dissipation effect.
상기와 같은 종래의 문제점을 개선하기 위한 본 발명의 목적은, 열방출구조의 본체프레임이 일체로 형성되도록 하고, 엘이디램프의 분해 및 조립작업이 간편하면서도 신속하게 이루어질 수 있도록 하며, 공기의 접촉면적을 넓히면서 공기유동이 용이하여 냉각효율을 높일 수 있도록 하고, 빛의 확산효과를 높혀 에너지의 낭비없이 원하는 조도의 구현이 가능토록 하며, 대량생산에 의해 원가를 절감할 수 있도록 하는 직관형 엘이디램프를 제공하는 데 있다.An object of the present invention for improving the conventional problems as described above, the main body frame of the heat dissipation structure to be integrally formed, to facilitate the disassembly and assembly of the LED lamp and quickly, the contact area of air Intuitive LED lamps allow easy air flow to increase cooling efficiency, increase light diffusion effect to achieve desired illuminance without wasting energy, and reduce cost by mass production. To provide.
본 발명은 상기 목적을 달성하기 위하여, 원형상으로 외경측에 요철이 형성되는 방열프레임의 중앙부가 내측으로 함몰되어 엘이디모듈이 고정되는 엘이디부착면이 구비되는 구성으로 방열프레임의 내측 및 외측에 분리되는 방열공간이 각각 형성되고, 상기 방열프레임의 양단이 경사지는 평면상의 반사면이 각각 구비되며, 상기 반사면에 지지되면서 엘이디모듈의 전방을 커버링하도록 확산판이 구비되는 직관형 엘이디램프를 제공한다.In order to achieve the above object, the central portion of the heat dissipation frame in which the irregularities are formed on the outer diameter side in a circular shape is recessed inward to separate the inside and the outside of the heat dissipation frame with an LED attachment surface to which the LED module is fixed. Each of the heat dissipation spaces is formed, a planar reflecting surface on which both ends of the heat dissipation frame are inclined is provided, and a straight LED lamp having a diffuser plate is provided to cover the front of the LED module while being supported by the reflecting surface.
그리고, 본 발명의 확산판은 방열프레임에 밀착되는 면에 흑화처리되는 코팅층이 구비되는 직관형 엘이디램프를 제공한다.In addition, the diffusion plate of the present invention provides a linear LED lamp having a coating layer to be blackened on the surface in close contact with the heat radiation frame.
더하여, 본 발명의 반사면에는 확산판이 고정토록 지지홈이 일체로 함몰 형성되는 직관형 엘이디램프를 제공한다.In addition, the reflective surface of the present invention provides a linear LED lamp in which the supporting groove is integrally formed so that the diffusion plate is fixed.
또한, 본 발명의 방열프레임에는 외경 또는 내경을 따라 요철이 구비되면서 양단에 공기유동홀이 관통되는 커버가 장착되는 직관형 엘이디램프를 제공한다. In addition, the heat dissipation frame of the present invention provides a straight-type LED lamp that is equipped with a cover through which the air flow hole is provided at both ends while the irregularities are provided along the outer diameter or the inner diameter.
이상과 같이 본 발명에 의하면, 열방출구조의 본체프레임이 일체로 형성되어 구조가 간단하고, 엘이디램프의 분해 및 조립작업이 간편하면서도 신속하며, 공기의 접촉면적 및 유동이 용이하여 냉각효율을 높이고, 빛의 확산효과를 높혀 에너지의 낭비없이 원하는 조도의 구현이 가능하며, 대량생산에 의해 원가를 절감하는 효과가 있는 것이다.According to the present invention as described above, the main body frame of the heat dissipation structure is formed integrally, the structure is simple, easy disassembly and assembly work of the LED lamp, quick, and the contact area and flow of air is easy to increase the cooling efficiency In addition, it is possible to realize desired illumination without wasting energy by increasing light diffusion effect, and it is effective to reduce cost by mass production.
도1은 종래의 엘이디램프를 도시한 사시도이다.
도2는 본 발명에 따른 직관형 엘이디램프를 도시한 사시도이다.
도3은 본 발명에 따른 직관형 엘이디램프를 도시한 분해도이다.
도4는 본 발명에 따른 직관형 엘이디램프를 도시한 저면사시도이다.
도5 및 도6은 각각 본 발명에 따른 엘이디램프를 도시한 측면도이다.
1 is a perspective view showing a conventional LED lamp.
Figure 2 is a perspective view of a linear LED lamp according to the present invention.
Figure 3 is an exploded view showing a linear LED lamp according to the present invention.
Figure 4 is a bottom perspective view showing a rectangular LED lamp according to the present invention.
5 and 6 are side views showing the LED lamp according to the present invention, respectively.
이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 직관형 엘이디램프를 도시한 사시도이고, 도3은 본 발명에 따른 직관형 엘이디램프를 도시한 분해도이며, 도4는 본 발명에 따른 직관형 엘이디램프를 도시한 저면사시도이고, 도5 및 도6은 각각 본 발명에 따른 엘이디램프를 도시한 측면도이다.Figure 2 is a perspective view showing a linear LED lamp according to the present invention, Figure 3 is an exploded view showing a linear LED lamp according to the present invention, Figure 4 is a bottom perspective view showing a linear LED lamp according to the present invention. 5 and 6 are side views showing the LED lamp according to the present invention, respectively.
본 발명의 엘이디램프(100)는, 원형상으로 외경 또는 내경측에 요철(111)이 형성되는 방열프레임(110)의 중앙부가 내측으로 함몰되어 그 일측면에 하나 이상의 엘이디모듈(200)이 고정되는 엘이디부착면(130)이 구비된다.LED lamp 100 of the present invention, the center portion of the heat dissipation frame 110 is formed in a circular shape on the outer diameter or inner diameter side is recessed inward one or more LED module 200 is fixed to one side LED mounting surface 130 is provided.
이때, 상기 엘이디부착면(130)은 수평면 또는 일정경사를 갖는 ∨형상 중에서 선택된다.In this case, the LED attachment surface 130 is selected from a horizontal shape or a U-shape having a predetermined slope.
그리고, 상기 방열프레임(110)은 엘이디부착면(130)을 중앙으로 하여 그 하측면 양측으로 위치토록 양단이 외측을 향하여 하향 경사지도록 돌출되는 평면상의 반사면(150)이 각각 구비된다.In addition, the heat dissipation frame 110 is provided with a planar reflecting surface 150 which protrudes so that both ends are inclined downward toward the outside so as to be positioned at both sides of the LED attaching surface 130 at the center thereof.
이때, 상기 방열프레임(110)의 내측 및 외측에 분리되는 내부방열공간(S1)및 외부방열공간(S2)이 각각 형성된다.At this time, the inner heat dissipation space (S1) and the outer heat dissipation space (S2) are formed on the inside and the outside of the heat dissipation frame 110, respectively.
또한, 상기 반사면(150)에 지지되면서 엘이디모듈(200)의 전방을 커버링하도록 확산판(240)이 설치된다.In addition, the diffusion plate 240 is installed to cover the front of the LED module 200 while being supported by the reflective surface 150.
이때, 상기 확산판(240)은 흑화처리되는 코팅층(245)이 일체로 형성된다.In this case, the diffusion plate 240 is integrally formed with a coating layer 245 to be blackened.
더하여, 상기 반사면(150)에는 확산판(240)이 고정토록 지지홈(155)이 일체로 함몰 형성된다.In addition, the support surface 155 is integrally formed in the reflective surface 150 to fix the diffusion plate 240.
또한, 상기 방열프레임(110)의 길이방향 양단에는 내부방열공간에 대응되는 공기유동홀(263)이 형성되는 커버(260)가 장착되는 구성으로 이루어 진다. In addition, both ends of the heat dissipation frame 110 in the longitudinal direction are made of a configuration in which a cover 260 is formed which is formed with an air flow hole 263 corresponding to the inner heat dissipation space.
상기와 같은 구성으로 이루어진 본 발명의 동작을 설명한다.The operation of the present invention constructed as described above will be described.
도2 내지 도5에서 도시한 바와같이 본 발명의 엘이디램프(100)는, 방열프레임(110)이 일반적인 직관형 형광등과 유사한 형상을 갖도록 원형상으로 형성되면서 그 외경 또는 내경측에 요철(111)이 형성되어 공기와의 접촉면적을 넓힘으로써 방열효과를 높이게 된다.2 to 5, the LED lamp 100 of the present invention, the heat dissipation frame 110 is formed in a circular shape so as to have a shape similar to a general straight fluorescent lamp, the unevenness 111 on the outer or inner diameter side thereof. This is formed to increase the heat dissipation effect by widening the contact area with air.
또한, 상기 방열프레임(110)은 하측에서 원의 일부가 하향하면서 외경측으로 각각 경사지는 반사면(150)이 일체로 각각 형성되는 구성으로 방열면적을 넓히면서도 형광등의 반사갓 역활을 수행하게 된다.In addition, the heat dissipation frame 110 is a configuration in which the reflective surface 150 which is inclined toward the outer diameter side while the part of the circle is downward from the lower side is formed integrally to expand the heat dissipation area while also serving as a reflection lamp of the fluorescent lamp.
더하여, 상기 방열프레임(110)의 중앙부가 내측으로 함몰되어 하나 이상의 엘이디모듈(200)이 고정되는 엘이디부착면(130)이 구비되는 구성으로 내부에 방열공간이 형성됨은 물론 외부에서도 열이 발생되는 엘이디모듈(200)에 근접하는 위치까지 공기가 유입토록되어 방열효과를 높이게 된다.In addition, the heat dissipation space is formed inside the heat dissipation space is formed in the interior of the heat dissipation frame 110 is provided with an LED attachment surface 130 to which the one or more LED module 200 is fixed to the inside in which the heat is generated Air is introduced to a position close to the LED module 200 to increase the heat dissipation effect.
즉, 본 발명의 방열프레임(110)은 그 일부가 하측으로 향하여 함몰되는 엘이디부착면(130)을 통하여 방열프레임의 내측 및 외측에 분리되는 내부방열공간(S1)및 외부방열공간(S2)이 각각 형성되어 공기와의 접촉면적을 넓혀 방열효과를 향상시킨다.That is, the heat dissipation frame 110 of the present invention is the inner heat dissipation space (S1) and the outer heat dissipation space (S2) is separated on the inside and the outside of the heat dissipation frame through the LED attachment surface 130, a part of which is recessed toward the lower side Each is formed to increase the contact area with air to improve the heat dissipation effect.
이때, 상기 방열프레임(110)에서 하향되어 돌출되는 엘이디부착면(130)은 수평면 또는 일정경사를 갖는 ∨형상으로 형성되어 하나의 엘이디모듈 또는 2개의 엘이디모듈을 장착하게 된다.At this time, the LED attachment surface 130 protruding downward from the heat dissipation frame 110 is formed in a flat shape having a horizontal plane or a predetermined slope to mount one LED module or two LED modules.
또한, 상기 엘이디모듈(200)은 기판의 상측에 복수의 엘이디칩이 장착되는 구성이다.In addition, the LED module 200 is a configuration in which a plurality of LED chips are mounted on the upper side of the substrate.
그리고, 상기 방열프레임(110)은 엘이디부착면(130)을 중앙으로 하여 그 하측면 양측으로 위치토록 양단이 외측을 향하여 하향 경사지는 평면상의 반사면(150)에는 확산판(240)이 장착토록 된다.In addition, the heat dissipation frame 110 has the LED attaching surface 130 at the center thereof, and the diffuser plate 240 is mounted on the planar reflecting surface 150 where both ends are inclined downward toward the outside so as to be positioned at both sides of the lower side of the LED attaching surface 130. do.
이때, 상기 엘이디부착면(130)은 반사면(150)의 상단보다 하향되면 확산면이 증가하게 된다.At this time, when the LED attachment surface 130 is lower than the upper end of the reflective surface 150, the diffusion surface is increased.
또한, 상기 반사면(150)에는 엘이디모듈(200)의 전방을 커버링하도록 하면서 일측에 형광등 반사갓의 폴리싱면과 같이 반사경의 역활을 수행하는 코팅층(2450)을 갖는 확산판(240)이 장착되어 엘이디모듈(200)의 동작시 빗을 전방향에 분산토록 되어 눈부심을 최소화 하게 된다.In addition, the reflecting surface 150 is mounted on the LED and the diffusion plate 240 having a coating layer 2450 having a role of reflecting mirror, such as a polishing surface of the fluorescent lamp reflector on one side to cover the front of the LED module 200 When the module 200 is operated, the comb is distributed in all directions to minimize glare.
더하여, 상기 반사면(150)에는 확산판(240)이 고정토록 지지홈(155)이 일체로 함몰 형성되어 일정 탄성을 갖는 확산판(240)을 압입하여 끼우는 동작에 의해 장착이 용이하게 된다.In addition, since the support groove 155 is integrally formed in the reflective surface 150 so that the diffusion plate 240 is fixed to the reflection surface 150, mounting is facilitated by pressing and inserting the diffusion plate 240 having a predetermined elasticity.
또한, 상기 방열프레임(110)의 길이방향 양단에는 내부방열공간에 대응되는 공기유동홀(263)이 형성되는 커버(260)가 장착될 때 상기 공기유동홀(263)을 통하여 외부방열공간(S2)에 공기가 손쉽게 유입되어 방열효과를 높이게 되는 것이다.In addition, the outer heat dissipation space (S2) through the air flow hole 263 when the cover 260 is formed at both ends of the heat dissipation frame 110 in the air direction hole 263 corresponding to the inner heat dissipation space (S2). ) Is easily introduced into the air to increase the heat dissipation effect.
100...엘이디램프 110...방열프레임
130...엘이디부착면 150...반사면
200...엘이디모듈 240...확산판
245...코팅층
100 LED lamp 110 ... heat-dissipating frame
130 ... LED mounting surface 150 ... Reflection surface
200 ... LED module 240 ... Diffusion plate
245 ... coating layer

Claims (4)

  1. 원형상으로 형성되는 방열프레임의 일측이 하향하도록 함몰되어 엘이디모듈이 일측에 고정되는 엘이디부착면이 내측으로 돌출되고, 상기 방열프레임의 내측 및 외측에 분리되는 내부방열공간 및 외부방열공간이 각각 형성되며, 상기 방열프레임의 양단에는 하향하면서 외측으로 경사지는 평면상의 반사면이 각각 구비되며, 상기 반사면에는 엘이디램프의 전방을 커버링하도록 설치되는 확산판이 고정되는 구성으로 이루어진 직관형 엘이디램프.One side of the heat dissipation frame formed in a circular shape is recessed downward so that the LED attaching surface to which the LED module is fixed to one side protrudes inward, and an inner heat dissipation space and an outer heat dissipation space are formed on the inside and the outside of the heat dissipation frame, respectively. And, both ends of the heat dissipation frame is provided with a planar reflecting surface which is inclined outwardly downward, respectively, and the direct-shaped LED lamp consisting of a configuration that is fixed to the diffuser plate is installed to cover the front of the LED lamp.
  2. 제1항에 있어서, 상기 확산판은 방열프레임에 밀착되는 면에 흑화처리되는 코팅층이 구비되는 것을 특징으로 하는 직관형 엘이디램프.According to claim 1, wherein the diffusion plate is a straight type LED lamp, characterized in that the coating layer is provided on the surface in close contact with the heat dissipation frame.
  3. 제1항에 있어서, 상기 반사면에는 확산판이 고정토록 지지홈이 일체로 함몰 형성되는 것을 특징으로 하는 직관형 엘이디램프.The straight LED lamp of claim 1, wherein the reflecting surface is integrally formed with a recess in which the diffusion plate is fixed.
  4. 제1항에 있어서, 상기 방열프레임에는 외경 또는 내경을 따라 요철이 구비되고, 상기 방열프레임의 측면에 각각 지지토록 공기유동홀이 관통되는 커버가 장착되는 것을 특징으로 하는 직관형 엘이디램프. According to claim 1, wherein the heat dissipation frame is provided with irregularities along the outer diameter or the inner diameter, and the linear LED lamp, characterized in that the cover through which the air flow hole is penetrated to support each side of the heat dissipation frame.
KR1020130027978A 2013-03-15 2013-03-15 A straight line pipe style light emitted diode lighting lamp KR101325793B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100008715U (en) * 2009-02-25 2010-09-02 이기종 Lighting Frame Structure using LED Bar
KR100984849B1 (en) 2009-02-05 2010-10-04 서울특별시시설관리공단 a light emitting diode lighting with radiation heat
KR20110023231A (en) * 2009-08-31 2011-03-08 (주)주원 Rod type led lighting device
KR20110101534A (en) * 2010-03-08 2011-09-16 김두환 Led lighting fixture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100984849B1 (en) 2009-02-05 2010-10-04 서울특별시시설관리공단 a light emitting diode lighting with radiation heat
KR20100008715U (en) * 2009-02-25 2010-09-02 이기종 Lighting Frame Structure using LED Bar
KR20110023231A (en) * 2009-08-31 2011-03-08 (주)주원 Rod type led lighting device
KR20110101534A (en) * 2010-03-08 2011-09-16 김두환 Led lighting fixture

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