KR101583753B1 - Apparatus and method for processing substrate - Google Patents

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus
And a spraying member disposed in the chamber and spraying a liquid onto the substrate, wherein the position at which the liquid and the substrate collide with each other is located at an upper portion of the chamber, And a nozzle provided so as to be formed in a direction oblique to a second direction perpendicular to the first direction when viewed from above.
The substrate processing method comprises: transporting a substrate along a first direction; processing the substrate by spraying a liquid through a jetting member provided in an upper portion of the chamber onto the substrate to be transported, wherein the jetting member has a position where the liquid collides with the substrate And a nozzle provided so as to be formed in an inclined direction in a second direction perpendicular to the first direction when viewed from above.

Description

[0001] APPARATUS AND METHOD FOR PROCESSING SUBSTRATE [0002]

The present invention relates to a substrate processing apparatus and method, and more particularly, to a substrate processing apparatus for cleaning a substrate.

Contaminants such as particles, organic contaminants, and metallic contaminants on the surface of the substrate greatly affect the characteristics of semiconductor devices and the yield of production. Therefore, a cleaning process for removing various contaminants adhering to the surface of the substrate is very important in the semiconductor manufacturing process, and a process for cleaning the substrate is performed before and after each unit process for manufacturing a semiconductor. Cleaning of the substrate generally includes a chemical treatment process, a rinsing process, and a drying process. The chemical treatment process is to remove metallic foreign substances, organic substances, or particles remaining on the substrate using a chemical. The rinsing process uses deionized water to remove any residual chemical on the substrate. In the drying process, the substrate is dried using nitrogen gas or the like.

FIG. 1 is a plan view showing a conventional substrate processing apparatus, and FIG. 2 is a side sectional view showing a conventional substrate processing apparatus. According to the conventional substrate processing apparatus, the substrate is transported in a tilted state, with one side being provided lower than the other. A plurality of nozzles are provided along the transport direction of the substrate. Each of the nozzles is disposed perpendicular to the transport direction of the substrate when viewed from the top in the longitudinal direction. The liquid sprayed from the nozzle forms a water film on the substrate. Referring to FIG. 2, the water film is formed thicker toward the lower side from the inclined direction of the substrate. Therefore, the portion where the water film is thickly formed is not sufficiently transmitted to the liquid discharged from the nozzle, and therefore, cleaning is difficult.

SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus and method capable of improving cleaning efficiency.

SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus and method in which the force of a nozzle is uniformly transferred to a substrate that is transported in a tilted state.

The present invention provides a substrate processing apparatus. According to one embodiment, the substrate processing apparatus includes a chamber, a transport unit disposed in the chamber and transported in a first direction, and a jet member disposed in the chamber, for jetting the liquid onto the substrate, And a nozzle provided so as to be formed in a direction oblique to a second direction perpendicular to the first direction when viewed from above.

According to one example, a plurality of the nozzles are provided, and the nozzles are sequentially arranged along the first direction.

By another, the transport unit is provided to transport the substrate in a tilted state along the second direction with respect to a horizontal plane.

The present invention provides a substrate processing method. According to one embodiment, a substrate processing method comprises: transporting a substrate along a first direction; processing the substrate by spraying a liquid through a nozzle provided in an upper portion of the chamber to the substrate being transported; The position where the substrate collides is formed in an inclined direction in a second direction perpendicular to the first direction when viewed from above.

According to one example, a plurality of the nozzles are provided, and the nozzles are sequentially arranged along the first direction.

According to another example, the substrate can be transported inclined along the second direction with respect to the horizontal plane.

According to an embodiment of the present invention, the detergency of the substrate can be increased through the nozzle formed obliquely.

According to an embodiment of the present invention, the cleaning force of the substrate can be increased by moving the substrate at an inclined angle.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plain view showing a conventional substrate processing apparatus.
2 is a side sectional view showing a conventional substrate processing apparatus.
3 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view showing an example of the transport unit of Fig. 3;
5 and 6 are plan views showing relative positions of the nozzle and the substrate shown in Fig. 3, respectively.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

3 is a sectional view showing a substrate processing apparatus 1 according to an embodiment of the present invention.

3, the substrate processing apparatus 1 includes a process chamber 100, a transfer unit 200, and a jetting member 300. [

The process chamber 100 provides a space for processing the substrate. In one example, the process chamber 100 may include an etch chamber 102, a cleaning chamber 104, and a drying chamber 106. The process chamber 100 is arranged with the etching chamber 102, the cleaning chamber 104, and the drying chamber 106 along the first direction. The first direction is defined as the moving direction of the substrate S. The etching chamber 102 supplies a chemical to the substrate S and proceeds the etching process. The cleaning chamber 104 removes the chemical by supplying pure water onto the substrate S having been subjected to the etching process. The drying chamber 106 dries the chemical or pure water remaining on the surface of the substrate S.

A transfer unit 200 may be provided in the process chamber 100. The transfer unit 200 moves the substrate S in the first direction between the chambers 100 and within the cleaning chamber 104.

4 is a view showing the transport unit 200. Fig. The transfer unit 200 is disposed inside the cleaning chamber 104. The transfer unit 200 is also disposed inside the etching chamber 102 and the drying chamber 104. The transport unit 200 has a plurality of shafts 220, rollers 240, and a drive unit 260. A plurality of shafts (220) are arranged along the first direction (12). Each shaft 220 is provided with its longitudinal direction in a second direction 16. The second direction 16 is the direction perpendicular to the first direction 14 when viewed from above the cleaning chamber 104. The shafts 220 are disposed side by side. Shafts 220 are provided from a location adjacent to the substrate inlet 110 to a location adjacent to the substrate outlet 120. A plurality of rollers 240 are fixedly coupled to the respective shafts 220 along the longitudinal direction thereof. The shafts 220 are rotated by the driving unit 260 about the center axis thereof. The drive portion 260 has pulleys 262, belts 264, and a motor 266. The pulleys 262 are coupled to both ends of the respective shafts 220, respectively. The pulleys 262 coupled to the different shafts 220 and disposed adjacent to each other are connected to each other by a belt 264. One of the pulleys 262 is coupled to a motor 266 for rotating it. The shaft 220 and the rollers 240 are rotated by the assembly of the pulley 262, the belt 264 and the motor 266 described above and the substrate S is in contact with the roller As shown in FIG. In the present invention, the transport unit 200 may be an inclined transport unit. The transport unit 2200 transports the substrate S in an inclined manner along the second direction 16. One end and the other end of each shaft 220 are provided at different heights, so that the substrate S can be transported in an inclined state.

The injection member 300 is located at the top of the cleaning chamber 104. The injection member 300 includes a nozzle 310 for supplying a liquid onto the substrate S. For example, the nozzle 310 may be a water jet, spray, or the like. The liquid may be pure. Referring to FIG. 5, the nozzle 310 is provided such that the position at which the liquid and the substrate S collide is formed in a slanting direction in the second direction 16. Each of the nozzles 310 is provided with a plurality of discharge ports for discharging the liquid along its longitudinal direction. The nozzle 310 is provided in an oblique direction to the second chamber 16 when viewed from the top in the longitudinal direction. A plurality of nozzles 310 are provided. The nozzles 310 are provided at regular intervals from each other along the first direction 12. By arranging the respective nozzles 310 in diagonal lines, the liquid sprayed from the discharge port onto the substrate S is injected so as not to overlap in the second direction 16. The sprayed liquid flows along the second direction 16 on the substrate S. And flows to the lower surface in the inclined direction of the substrate S flowing in the second direction 16. Therefore, the thickness of the water film on the substrate S can be kept constant. The force of the liquid ejected from the ejection port of the nozzle 310 collides with the substrate S becomes uniform. Thereby, the substrate cleaning force is improved and the amount of liquid used can be minimized.

6, the lower end portion of the nozzle 1310 may be located upstream of the first direction 12 and the upper end portion of the nozzle 1310 may be located downstream of the first direction 12. [

The same effect can be obtained even when the arrangement of the nozzles 1310 is different from that of FIG.

In the above-described examples, the cleaning process for the substrate has been described. However, the number of process chambers and the type of process may differ. For example, it may be applied to an etching process, and the liquid may be provided with a chemical. For example, it may be applied to a drying process, and the liquid may be provided with a drying gas.

Claims (6)

In the substrate processing apparatus,
chamber;
A conveying unit disposed in the chamber and conveying in a first direction; And
And a jetting member disposed in the chamber for jetting liquid onto the substrate,
Wherein the jetting member includes a nozzle provided so as to be formed in a direction oblique to a second direction perpendicular to the first direction when viewed from above the position where the liquid collides with the substrate,
The transport unit transports the substrate in a tilted state along the second direction with respect to a horizontal plane,
Wherein a plurality of the nozzles are provided and the nozzles are arranged diagonally at regular intervals along the first direction so that liquid sprayed onto the substrate from the plurality of nozzles is sprayed so as not to overlap with each other in the second direction, .
delete delete A substrate is transported along a first direction, and a substrate is processed by jetting a liquid onto a substrate to be transported by a nozzle,
The liquid is sprayed so that a position where the liquid collides with the substrate is formed in a direction oblique to a second direction perpendicular to the first direction when viewed from above,
The substrate is transported in an inclined state along the second direction with respect to the horizontal plane,
Wherein a plurality of the nozzles are provided and the nozzles are obliquely arranged at regular intervals along the first direction so that liquid sprayed onto the substrate from the plurality of nozzles is sprayed so as not to overlap with each other in the second direction .


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