KR101581303B1 - Apparatus For Analyzing Substrate Contamination And Method Thereof - Google Patents

Abstract

An apparatus for analyzing substrate contaminants according to the present invention is to receive a monitor wafer in a semiconductor manufacturing process to perform a gas phase decomposition thereon, and transfers a sample solution, which has scanned the monitor water with a scan nozzle, from the scan nozzle to an analyzer through a flow pat to have the analyzer analyze the same. The apparatus includes a recycling unit for processing the scan-completed monitor wafer with a solution including at least acidic or alkaline chemical, to recycle the scan-completed monitor wafer. According to the present invention, since an conventional wasted monitor wafer can be reused, a cost required for the monitor wafer can be greatly reduced.

Description

[0001] The present invention relates to an apparatus for analyzing substrate contaminants,

The present invention relates to a substrate contamination analyzing apparatus and a substrate contamination analyzing method capable of analyzing contaminants such as metal atoms in an in-line.

Korean Patent Registration No. 3833264 (published on Apr. 9, 2003) discloses an apparatus for analyzing contaminants on a semiconductor wafer. In the contamination analyzer, the surface of the wafer is automatically cleaned in order to analyze metallic contaminants adsorbed on the wafer surface. And a device structure for collecting contaminants.

However, in the substrate contamination analyzer described above, the scanned sample is placed in the sampling cup and the operator must take it to the analyzer for analyzing. Therefore, it is necessary to check the operator's time and work time, It is a hindrance to rapid analysis.

 In addition, the conventional apparatus and method for analyzing contaminants have problems such as discomfort and contamination control problems in the chemical solution production required for scanning and etching, calibration problems of the analyzer, sensitivity problems during use, and the problem of discarding the monitor wafer used for analysis have.

The recognition of the problems and problems of the prior art is not obvious to a person having ordinary skill in the art, so that the inventive step of the present invention should not be judged based on the recognition based on such recognition I will reveal.

Korean Registered Patent No. 383264, September 9, 2003 Announcement

It is an object of the present invention to provide an apparatus and method for analyzing a substrate contaminant that overcomes at least one of the problems of the prior art described above,

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate contamination analyzer and analysis method capable of real-time or quick analysis without requiring manual work by a worker, solving pollution and safety problems in a moving process, and real time or quick analysis.

 It is also an object of the present invention to provide a substrate contamination analyzer and analysis method that solves the problem of controlling inconveniences and contaminants in chemical liquid production, the calibration problem of the analyzer, and the problem of lowering sensitivity during use.

It is also an object of the present invention to provide an apparatus and method for analyzing a substrate contaminant capable of recycling a monitor wafer used for analysis.

It is also an object of the present invention to provide an apparatus and method for analyzing a substrate contaminant that can be automatically analyzed in-line.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, unless further departing from the spirit and scope of the invention as defined by the appended claims. It will be possible.

An apparatus for analyzing substrate contamination according to an aspect of the present invention is a substrate contamination analyzer for transferring a sample solution scanned by using a scan nozzle on a substrate to be analyzed from the scan nozzle to an analyzer through a flow path,

A sample tube having a space in which the sample solution is to be loaded; And a switching valve coupled to the sample tube and having at least a load position at which the sample solution is loaded into the sample tube and an injection position at which the loaded sample solution is injected toward the analyzer, And a detection sensor which is installed in the sample tube to distinguish between the gas section and the sample solution, and includes a gas section before and after the sample solution.

In the above substrate contamination analyzer, the detection sensor may be a liquid sensor.

In the above substrate contamination analyzer, the liquid sensor may be an optical sensor or a proximity sensor.

In the substrate contamination analyzer described above, it is determined that the sample solution arrives from the scan nozzle to the sample tube when the sensing sensor detects gas and liquid in the order of the load position.

In the substrate contamination analyzer described above, it is determined that the sample solution moves to the analyzer when the detection sensor detects the liquid and the gas in this order in the injection position.

An apparatus for analyzing substrate contamination according to an aspect of the present invention is a substrate contamination analyzer for transferring a sample solution scanned by using a scan nozzle on a substrate to be analyzed from the scan nozzle to an analyzer through a flow path,

A sample tube having a space in which the sample solution is to be loaded; And a switching valve coupled to the sample tube and having at least a load position at which the sample solution is loaded into the sample tube and an injection position at which the loaded sample solution is injected toward the analyzer, The flow path from at least the scan nozzle to the switching valve is cleaned.

The substrate contamination analyzer may further include a first metering pump used for loading the sample solution into the sample tube and a first pump used for the cleaning, wherein the first metering pump and the first pump Is connected to the same port of the switching valve, and the first pump has a larger capacity than the first metering pump.

The substrate contamination analyzer may further include a second dosing pump for pushing the loaded sample solution to the analyzer with ultrapure water when the sample is in the injection position.

In the above substrate contamination analyzer, the sample tube is a sample loop.

In the above substrate contamination analyzer, the switching valve may be a six-port injection valve.

A substrate contamination analyzing method according to an aspect of the present invention is a substrate contamination analyzing method performed in a substrate contamination analyzing apparatus for transferring a sample solution scanned by using a scan nozzle from an analyzing substrate through a flow path from the scan nozzle to an analyzer ,

A first step of loading the sampled sample solution into a sample tube located in the middle of the flow path; And a second step of injecting the sample solution loaded into the sample tube toward the analyzer, wherein the sample solution includes a gas section before and after the sample solution, and in the first step or the second step, And the arrival or movement of the sample solution is detected by using a detection sensor installed in the sample tube and detecting the gas section and the sample solution separately.

In the above-described substrate contamination analyzing method, the sensing sensor may be a liquid sensing sensor.

In the above-described substrate contamination analyzing method, the liquid sensor may be an optical sensor or a proximity sensor.

In the above-described substrate contamination analyzing method, it is determined that the sample solution arrives from the scan nozzle to the sample tube when the detection sensor senses in order of gas and liquid in the first step.

In the above-described substrate contamination analyzing method, it is determined that there is a loss of the sample solution if the sensing sensor does not sense the liquid in the first step.

In the above-described substrate contamination analyzing method, it is determined that the sample solution moves to the analyzer when the sensing sensor senses the order of the liquid and the gas in the second step.

In the above-described substrate contamination analyzing method, if it is not detected that the detection sensor is switched from a liquid to a gas in the second step, it is determined that there is an abnormality.

A substrate contamination analyzing method according to an aspect of the present invention is a substrate contamination analyzing method performed in a substrate contamination analyzing apparatus for transferring a sample solution scanned by using a scan nozzle from an analyzing substrate through a flow path from the scan nozzle to an analyzer ,

A first step of loading the sampled sample solution into a sample tube located in the middle of the flow path; And a second step of injecting the sample solution loaded into the sample tube toward the analyzer, wherein, in parallel with the second step, at least the interval from the scan nozzle to the front of the sample tube is rinsed .

In the above-described substrate contamination analyzing method, the cleaning is performed by inserting the scan nozzle into a cleaning solution container, and then sucking the cleaning nozzle with a pump.

The substrate contamination analyzing method is characterized in that air or gas is filled in the flow path including at least the section from the scan nozzle to the front of the sample tube before the first step is performed again after the cleaning.

In the above-described substrate contamination analyzing method, different pumps are used for the loading and cleaning in the first step, and a pump having a larger suction speed is used in the cleaning.

In the method of analyzing a substrate contaminant, a second dosing pump for pushing the loaded sample solution to ultra-pure water toward the analyzer is used in the second step.

In the above-described substrate contamination analyzing method, the sample tube is characterized by being a sample loop.

In the above-described substrate contamination analyzing method, a switching valve, which is combined with the sample tube and has at least a load position at which the sample solution is loaded into the sample tube and an injection position at which the loaded sample solution is injected toward the analyzer, is used .

In the above-described substrate contamination analyzing method, the switching valve may be a six-port injection valve.

An apparatus for analyzing a substrate contaminant according to an aspect of the present invention is an apparatus for analyzing a substrate contaminant that transfers a sample solution sucked by using a nozzle on a substrate to be analyzed from the nozzle to an analyzer through a channel,

And a standard solution introducing part coupled to the flow path through which the sample solution is transferred by using a T-shaped tube to introduce a standard solution for calibration into the flow path, wherein the standard solution introducing part comprises: A sample tube with space to be; And a switching valve coupled to the sample tube and having at least a load position at which the standard solution is loaded into the sample tube and an injection position at which the standard solution is injected toward the T-tube.

In the substrate contamination analyzer described above, the standard solution is flowed out at predetermined time intervals or before calibrating in the load position.

In the substrate contamination analyzer described above, the loaded standard solution is pushed by ultra pure water using a metering pump at the injection position.

In the above-described substrate contamination analyzer, when at least the sample solution is transferred through the T-shaped tube, at least the channel between the T-shaped tube and the switching valve is filled with the ultra pure water.

In the above substrate contamination analyzer, the sample tube is a sample loop.

In the above substrate contamination analyzer, the switching valve may be a six-port injection valve.

An apparatus for analyzing a substrate contaminant according to an aspect of the present invention is an apparatus for analyzing a substrate contaminant that transfers a sample solution sucked by using a nozzle on a substrate to be analyzed from the nozzle to an analyzer through a channel,

A sample solution inlet for injecting the sample solution into the analyzer after loading the sample solution; And a standard solution introducing part coupled to the flow path between the sample solution introducing part and the analyzer using a T-shaped tube to introduce a standard solution for calibration, wherein the sample solution introducing part injects the sample solution into the analyzer And the ultra pure water carrier portion for pushing the sample solution as ultrapure water when diluting the standard solution for calibration.

An apparatus for analyzing a substrate contaminant according to an aspect of the present invention is an apparatus for analyzing a substrate contaminant that transfers a sample solution sucked by using a nozzle on a substrate to be analyzed from the nozzle to an analyzer through a channel, A sample solution introducing portion for injecting the sample solution into the analyzer; And a standard solution introducing unit coupled to the flow path between the sample solution introducing unit and the analyzer by using a T-shaped tube to introduce a standard solution for calibration. When the calibration of the analyzer as the standard solution is performed And the sample solution introducing part dilutes the standard solution by introducing a scan solution instead of the sample solution.

In the above substrate contamination analyzer, the standard solution introducing portion may include: a sample tube having a space for loading the standard solution; A third port coupled to the flow path to which the standard solution is supplied, a second port coupled to the suction pump for sucking the standard solution, a second port coupled to the T- 5 port, and a sixth port to which ultra pure water for pushing the standard solution is supplied.

In the above-described substrate contamination analyzer, when loading the standard solution, between the first port and the second port, between the third port and the fourth port, and between the fifth port and the sixth port, And between the sixth port and the first port, between the second port and the third port, and between the fourth port and the fifth port when the standard solution is injected.

A substrate contamination analyzing method according to an aspect of the present invention is a substrate contamination analyzing method performed in a substrate contamination analyzing apparatus for analyzing a sample solution scanned by using a scan solution on an analyzing substrate,

The step of calibrating the analyzer may include: a first step of analyzing the at least one standard solution by transferring the standard solution to the analyzer while real-time dilution of the standard solution with the ultrapure water; And a second step of transferring and analyzing the scan solution used for the scan to the analyzer.

In the above-described substrate contamination analyzing method, if the result of the analysis of the scan solution in the second step is less than the set value of the trace concentration, the analysis result of the first step is used as it is for analyzing the sample solution.

In the above-described substrate contamination analyzing method, the analysis result of the first step is corrected by the analysis result of the second step, and the sample solution is analyzed.

In the above-described substrate contamination analyzing method, the first step is performed at a plurality of different dilution concentrations and is used to obtain a calibration curve.

In the above-described substrate contamination analyzing method, the calibration curve is corrected by the analysis result of the second step.

The concentration of the sample solution is subtracted from the concentration of the sample solution according to the analysis result of the second step.

In order to perform the real-time dilution in the first step, the ultrapure water and the standard solution are respectively injected into different sample tubes, injected simultaneously by two different dosing pumps, and mixed in a T- .

In the above substrate contamination analyzing method, the dilution ratio of the ultrapure water and the standard solution is determined by the discharge flow rate of the two different metering pumps.

A substrate contamination analyzing method according to an aspect of the present invention is a substrate contamination analyzing method performed in a substrate contamination analyzing apparatus for analyzing a sample solution scanned by using a scan solution on an analyzing substrate,

Analyzing the standard solution with the analyzer at a plurality of different dilution concentrations to obtain a calibration curve and analyzing the series of sample solutions using the obtained calibration curve, Value is within the set range, and the sensitivity check step of checking the sensitivity is automatically performed at the set period or the set time.

In the above-described substrate contamination analyzing method, when the concentration value specified in the sensitivity check step is out of the setting range, the process of acquiring the calibration curve is performed again.

A substrate contamination analyzing method according to an aspect of the present invention is a substrate contamination analyzing method performed in a substrate contamination analyzer for analyzing a sample solution scanned by using a scan nozzle on an analyzing substrate,

In the above-described substrate contamination analyzing method, after analyzing the sample solution, the flow path from the scan nozzle to the analyzer is cleaned, ultrapure water is transferred to the analyzer, and it is determined whether the measured concentration value is within the set range Thereby automatically performing a self-verification step of verifying whether the sample solution is contaminated by the transfer of the sample solution.

In the above-described substrate contamination analyzing method, the self-verification step is performed when the transferred sample solution has a concentration higher than a predetermined concentration value.

In the above-described substrate contamination analyzing method, an alarm is generated when the set range is out of a predetermined number of times as a result of the self-verification step.

A substrate contamination analyzing apparatus according to an aspect of the present invention includes a monitor wafer introduced in a semiconductor manufacturing process, gas-phase decomposed, and then a sample solution of the monitor wafer is scanned using a scan nozzle from the scan nozzle to an analyzer And analyzing the analyzed substrate contamination with the analyzer,

And a recycling unit for treating the monitor wafer with the solution containing at least acid series or base series chemical in order to recycle the monitor wafer having completed the scan.

In the substrate contamination analyzer described above, the acid-based chemical is characterized by containing hydrofluoric acid and hydrogen peroxide.

In the substrate contamination analyzer described above, the base-based chemical is characterized by comprising ammonium hydroxide and hydrogen peroxide.

In the above substrate contamination analyzer, the recycling unit may include: an upper nozzle for spraying the solution onto an upper surface of the dummy wafer; And a lower nozzle for spraying the solution onto the lower surface of the dummy wafer.

In the above-described substrate contamination analyzer, the recycling unit may include a chamber, and an inner bottom of the chamber may be inclined to one side.

A method of analyzing a substrate contaminant according to an aspect of the present invention is a method of analyzing a substrate contaminant in a semiconductor manufacturing process, comprising: introducing a monitor wafer in a semiconductor manufacturing process to vapor phase decompose the sample wafer; A method for analyzing a substrate contaminant, the method comprising:

And a recycling processing step of treating the monitor wafer with the solution including at least acid-based or base-based chemical in the chamber in order to recycle the monitor wafer that has been scanned.

In the substrate contamination analyzing method, the recycling process may include:

And spraying the solution onto both surfaces of the monitor wafer.

The apparatus for analyzing substrate contaminants according to an embodiment of the present invention includes a substrate to be analyzed, a gas phase decomposition step of introducing the substrate to be analyzed, and a sample solution, which has been scanned with the scan solution using the scan solution, An apparatus for analyzing substrate contaminants, comprising:

And an automatic control unit for automatically mixing the ultrapure water and the central supply chemical to produce the scan solution, wherein the prepared scan solution is transferred to the analyzer through the flow path to verify at least the contamination of the prepared scan solution .

In the above-described substrate contamination analyzer, the scan solution automatic manufacturing unit may include: a scan solution bath in which the manufactured scan solution is temporarily stored; And a valve and a flow rate controller located between the lines for supplying the ultrapure water and the central supply chemical and the scan solution vessel, respectively.

The substrate contamination analyzer may further include a valve positioned between the lines supplying the central supply chemical and discharging the central supply chemical at all times or periodically discharging the chemical to prevent contamination due to stagnation .

According to an aspect of the present invention, there is provided a method for analyzing a substrate contaminant, comprising the steps of: introducing a substrate to be analyzed and subjecting the substrate to vapor phase decomposition, transferring a sample solution of the substrate to be analyzed using the scan solution from the scan nozzle to the analyzer 1. A method for analyzing substrate contaminants, the method comprising:

A first step of automatically mixing the ultrapure water and the central supply chemical to prepare and store the scan solution in a vessel; And a second step of transferring the prepared scan solution through the flow path from the vessel to the analyzer to verify at least whether the produced scan solution is contaminated.

The third step of the substrate contamination analyzing method may further include washing the vessel with the ultrapure water and the central supply chemical for preparing the scan solution before performing the first step and discharging the vessel to the drain, And further comprising:

In the above-described substrate contamination analyzing method, at least the central supply chemical is always discharged to the drain or periodically discharged to prevent contamination due to the stagnation of the central supply chemical.

According to an aspect of the present invention, there is provided an apparatus for analyzing a substrate contaminant, comprising: a nozzle for sucking a sample solution containing a contaminant in a semiconductor substrate, transferring the sample solution from the nozzle to the analyzer through a flow path, As an apparatus,

And an etching solution manufacturing section for automatically manufacturing an etching solution for global etching or point etching the bulk of the semiconductor substrate,

An etching solution bath storing an etching solution prepared; And a metering pump for sequentially sucking at least two kinds of chemicals and ultrapure water to produce the etching solution, and discharging the etching solution into the etching solution vessel, wherein the chamber for the global etching or the nozzle for the point etching And is supplied through a flow path.

In the above-described substrate contamination analyzer, the at least two chemicals include hydrofluoric acid and nitric acid.

According to an aspect of the present invention, there is provided a method for analyzing a substrate contaminant, comprising: sampling a sample solution containing a contaminant using a nozzle in a semiconductor substrate, transferring the sample solution from the nozzle to the analyzer through a flow path, A method for analyzing substrate contamination performed in an apparatus,

And an etching solution automatic manufacturing process for automatically producing an etching solution for global etching or point etching of the bulk of the semiconductor substrate, wherein the automatic etching solution manufacturing process comprises sequentially preparing two or more chemical and ultra pure water for producing the etching solution The etching solution is supplied from the etching solution vessel through the channel to the chamber for the global etching or the nozzle for the point etching from the etching solution bath.

In the above-described substrate contamination analyzing method, the part or the entirety of the flow path used for the suction and discharge is repeatedly purged with the non-reactive gas between the above-described repeated inhalation and discharge.

According to one aspect of the present invention, the sample solution can be sensed and loaded according to arrival at the sample tube, so that accurate loading of the sample solution is possible, loss of the sample solution can be prevented, less sample solution can be used, The sample tube can be moved at a high speed.

According to one aspect of the present invention, there is an effect that the movement of the sample solution can be checked using the detection of the liquid detection sensor even when the sample solution is not introduced into the analyzer.

According to an aspect of the present invention, a simple sensor is added on a sample tube, thereby confirming the loss process of the sample around the sample tube, and it is possible to check the sample loss without checking the human being anytime, The safety can be improved.

According to an aspect of the present invention, since the sample solution of the scan nozzle can be loaded into the sample tube at a high speed by using the liquid detection sensor during the transfer of the sample solution, the transfer time can be shortened.

According to aspects of the present invention, even if the concentration of the contaminant in the scanning solution fluctuates, it is possible to correct the concentration of the contaminant in a batch, so that the shaking of the scanning solution can be easily eliminated in the calibration.

According to an aspect of the present invention, there is an effect that a time-consuming calibration process is not performed frequently by introducing a sensitivity check process that can be performed by a simple procedure.

According to an aspect of the present invention, by automatically performing a self-validation function, it is possible to easily eliminate the memory effect in the apparatus and method for analyzing substrate contaminants and to improve the reliability of the results of analyzing substrate contaminants have.

According to an aspect of the present invention, since the monitor wafer that has been discarded in the past can be reused, the cost of the monitor wafer can be greatly reduced.

According to an aspect of the present invention, there is provided an apparatus and method for analyzing substrate contaminants, which can prevent safety accidents and contamination of chemical liquids and ensure the quality of a manufactured scan solution.

According to one aspect of the present invention, in-line monitoring is possible in a substrate manufacturing process, and a closed sampling system is operated, so there is no chemical handling safety problem and cross contamination problem, and real time or quick response is possible.

FIG. 1 is an explanatory view showing an overall configuration of a substrate contaminant analyzing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram schematically illustrating a flow path and a valve for supplying and transferring a scan solution, a sample solution, a standard solution, an etchant, and the like in the apparatus for analyzing substrate contaminants according to an embodiment of the present invention.
Fig. 3 shows an example in which a sample tube and a liquid detection sensor are installed. Fig. 3 (A) shows an example in which a liquid detection sensor is installed in a rod-shaped sample tube, In which the liquid detection sensor is installed.
4 is a flowchart illustrating a sensitivity check process according to an embodiment of the present invention.
5 is a flowchart illustrating a self-verification process according to an embodiment of the present invention.
6 is a cross-sectional view of a recycle unit according to an embodiment of the present invention.
7 is a schematic diagram showing a scan solution producing unit according to an embodiment of the present invention.
8 is a schematic diagram showing an etching solution producing unit according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which: FIG. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention in the drawings, parts not related to the description are omitted, and similar names and reference numerals are used for similar parts throughout the specification.

Meaning of Terms

In this specification, the term "substrate" refers to a semiconductor wafer, an LCD substrate, an OLED substrate, and the like. The term "substrate" refers not only to a start state during the manufacturing process, but also includes an oxide film, Or an element or the like may be formed.

As used herein, a "scan" involves scanning in depth direction to obtain a point depth profile at a particular point on the substrate, optionally with a scan for all or a portion of the substrate.

As used herein, the term " scan solution " refers to a solution to be supplied to or supplied to a nozzle for scanning a substrate, and the " sample solution " is used as a scan solution or as a scan solution and a point etching solution It refers to a solution in which contaminants are collected after being scanned.

Overall Configuration and Operation of Substrate Contaminant Analysis Apparatus

FIG. 1 is an explanatory view showing an overall configuration of a substrate contaminant analyzing apparatus according to an embodiment of the present invention.

The substrate contaminant analyzing apparatus of the present invention includes a load port 10, a robot 20, an aligner unit 30, a VPD unit 40, a scan unit 50, a recycling unit 60 and an analyzer 70 .

The load port 10 is located at one side of the substrate contaminant analysis apparatus and provides a path for opening the cassette containing the substrate to introduce the substrate into the interior of the substrate contaminant analysis apparatus. The robot 20 grasps the substrate to automatically transfer the substrate between the respective components of the substrate contaminant analysis apparatus. Specifically, the robot 20 aligns the cassette of the load port 10, the alignment unit 30, the VPD unit 40, (50) and the recycling unit (60). The aligner unit 30 performs the function of aligning the substrate, in particular, to align the center of the substrate before placing the substrate on the scan stage 51.

The VPD unit 40 is a unit in which vapor phase decomposition (VPD) is performed on a substrate. The VPD unit 40 includes an introduction port and a door for introducing the substrate, a process chamber, a rod plate provided inside the process chamber, And etches the surface or the bulk of the substrate by a gaseous etchant.

The scan unit 50 includes a scan stage 51 and a scan module 52. The scan stage 51 is mounted with a substrate or the like on which gas phase decomposition has been performed in the VPD unit 40, And performs a function of rotating the substrate in a process of scanning the substrate using the scan module 52. The scan module 52 is provided on one side of the scan stage 51 and includes a scan nozzle 53 (see FIG. 2) for scanning the substrate while the scan solution is in the vicinity of the substrate, and a scan nozzle And a scan module arm capable of moving the position of the scan nozzle, for example, in three axial directions. One or a plurality of scan nozzles and scan modules may be provided. The scan solution is supplied to the scan nozzles of the scan unit 50 through the flow path, and the sample solution is transferred to the analyzer 70 through the flow path.

The recycling unit 60 processes the substrate with a solution containing an acid series or a base series of chemicals in order to recycle the substrate after the scan is completed, and includes an introduction port and a door for introducing the substrate, a processing chamber, and a processing chamber A vacuum chuck, and a nozzle for spraying an etchant, and the like will be described later in detail.

The analyzer 70 analyzes and analyzes the sample solution through the flow path from the scan nozzle of the scan unit 50 and analyzes the presence or absence of contaminants contained in the sample solution, the content of contaminants, or the concentration of contaminants. As the analyzer 70, an inductively coupled plasma mass spectrometry (ICP-MS) is preferred.

In addition, the apparatus for analyzing substrate contaminants according to an embodiment of the present invention may be used for automatically preparing scan solutions and etching solutions, transferring sample solutions, auto-calibration of analyzers, sensitivity check, self- Etc., and such portions can be configured mainly on the side or inside of the substrate contaminant analysis apparatus, which will be described later.

In the following, a description will be made on the basis of a case where the contaminants on the surface of the substrate are scanned and analyzed in relation to a method of operating the entire configuration of the substrate contaminant analyzing apparatus.

The robot 20 draws the substrate to be analyzed from the load port 10 into the process chamber of the VPD unit 40 and the VPD unit 40 vaporizes the surface of the substrate by using the etching gas. As a result, the oxide film on the surface of the substrate is bonded with the etching gas and is discharged in a gaseous state, and impurities such as metal atoms contained in the surface and the oxide film remain in a state capable of trapping on the surface of the substrate.

Subsequently, the substrate is taken out of the VPD unit 40 by using the robot 20, and is then placed on the scan stage 51. The scan solution is transferred from the scan solution vessel 121 (see FIG. 2) to the tip of the scan nozzle through the flow path so that the droplet of the scan solution is put between the tip of the scan solution and the substrate surface.

In this state, the substrate is scanned in parallel with the rotation of the scan stage 51 and the position control of the scan module arm, so that the scan nozzle is moved on the substrate in a spiral trajectory, So that the scan nozzle can be moved to a plurality of concentric loci to scan the substrate. When the substrate is scanned using the scan nozzles, the scan solution becomes a sample solution that absorbs contaminants such as metal atoms. After the scan, the scan nozzles suck the sample solution, and the sample solution flows from the scan nozzle to the analyzer 70 And the analyzed sample solution is analyzed in the analyzer 70 such as ICP-MS. The scan solution is, for example, a solution containing hydrofluoric acid (HF), hydrogen peroxide (H ₂ O ₂ ) and ultrapure water.

The scanned substrate is transferred from the scan stage 51 into the process chamber of the recycling unit 60 by the robot 20 and is transferred by the recycling unit 60 into a solution containing an acid series or a base series of chemicals Thereby allowing the substrate to be reused, and then the robot 20 withdraws the substrate from the process chamber of the recycling unit 60 and mounts it again onto the cassette of the load port 10. [

On the other hand, before being transferred to the VPD unit 40, before being transferred from the VPD unit 40 to the scan stage 51, or before being transferred from the scan stage 51 to the recycling unit 60 , The aligner unit 30 can be used to align the substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate contamination analyzing apparatus and a substrate contamination analyzing method according to an embodiment of the present invention will be described in detail with reference to the detailed features.

Transfer of scanning solution and sample solution through the flow path and sensor detection

FIG. 2 is a diagram schematically illustrating a flow path and a valve for supplying and transferring a scan solution, a sample solution, a standard solution, an etchant, and the like in the apparatus for analyzing substrate contaminants according to an embodiment of the present invention.

The sample tubes 82, 92, and 112 may be various shapes such as a bar shape, a spiral shape, or a loop shape, and the sample tube may be, for example, a sample loop have.

The metering pumps 85, 86 and 95 may be syringe pumps, diaphragm pumps, gear pumps, piston pumps, etc., and pumps of a high precision type may be preferred and the pumps 87, 96 and 116 may be metering pumps, Type pump or a pump of a large capacity type may be preferred.

The scan solution of the scan solution vessel 121 or the etching solution of the point etchant solution 131 is manufactured and stored through an automatic manufacturing apparatus described later. Each solution is transferred to the scan nozzle 53 through a valve system including a third pump 116 and a third valve 113, a fourth valve 114 and a fifth valve 115.

The procedure for transferring the scan solution to the scan nods 53 is as follows. The valve between the scan solution vessel 121 and the third pump 116 is opened and the predetermined volume is extracted using the third pump 116. It is sensed by the third liquid detection sensor 111 that the scan liquid arrives at the third sample tube 112 at the front end of the third pump 116.

Then, the valve is closed, the third valve 113 is opened, and the third pump 116 is used to supply the scan solution to the scan nozzle 53 by a predetermined amount. On the other hand, for point bulk etching, an etching solution may be used together with the scan solution, and the etching solution and the scan solution may be provided to the scan nozzle 53 alternately or in a predetermined order.

Additional pressure can be applied during or after discharge of the pump using air or gas to complete the quantitative solution transfer. The sample travel distance is usually in the range of 2 to 4 m, but other than that, it is possible.

The sample introducing portion 100 is a device for introducing a sample solution, a standard solution, a scan solution, or ultrapure water into the analyzer 70 as a sample. The sample introducing portion 100 includes a sample solution introducing portion 80 and a standard solution introducing portion 90 do.

The switching valves 81 and 91 are connected to two ports of the sample tubes 82 and 92 and have a loading position at which the solution is loaded into the sample tube and an injection position at which the loaded solution is injected, Position. The switching valves 81 and 91 may be an injection valve or a combination of a plurality of valves and a flow path. The switching valves 81 and 91 are preferably six-port injection valves.

The liquid sensing sensors 83, 93, and 111 may be liquid sensing sensors, such as an optical sensor capable of detecting the presence or absence of a liquid, or a proximity sensor for sensing a change in capacitance to be coupled. In particular, the liquid detection sensors 83, 93, 111 are installed close to or attached to the sample tubes 82, 92, 112 to sense liquid in the sample tubes.

Fig. 3 shows an example in which a sample tube and a liquid detection sensor are installed. Fig. 3 (A) shows an example in which a liquid detection sensor is installed in a rod-shaped sample tube, In which the liquid detection sensor is installed.

The liquid detection sensors 83, 93, and 111 may be installed at the center or one side of the sample tubes 82, 92, and 112, or may include two or more liquid detection sensors.

The sample solution introducing portion 80 selectively introduces a sample solution or a scan solution and supplies the sample solution or the scan solution to the sample solution introducing portion 80. The sample solution introducing portion 80 includes a first switching valve 81, a first sample tube 82, a first liquid detection sensor 83, A second metering pump 86, a first valve 88, a second valve 89, and the like.

The first sample tube 82 is a tube having a space for loading a sample solution scanned by the scan nozzle, and a first liquid detection sensor 83 is installed.

The first switching valve 81 is connected to the first sample tube 82 and the port 1 and port 4 are connected to the first sample tube 82 and the load position in which the sample solution is mainly loaded in the first sample tube 82, And an injection position for injecting the loaded sample solution to the analyzer 70 side.

The sample may be air or an inert gas such that the sample solution is loaded into the first sample tube 82 before and after the sample solution, and the first sensing sensor 83 is connected to the first sample tube 82 to distinguish between the gas phase and the sample solution.

The sample solution introducing portion 80 and the standard solution introducing portion 90 are provided in the sample tubes 82 and 92 and are connected to the sample solution or standard solution Or the like.

It is determined that the sample solution arrives from the scan nozzle to the sample tube 82 when the first liquid detection sensor 83 senses in the order of gas and liquid in the load position and the liquid detection sensor 83 in the injection position detects liquid and When it is detected in the order of the gas, it is judged that the sample solution moves to the analyzer 70 side.

The first metering pump 85 is mainly used when the sample solution is loaded into the sample tube 81 when the switching valve 81 is in the load position and the second metering pump 86 is mainly used when the switching valve 81 is injected Position to push the loaded sample solution to the analyzer 70 with ultra pure water.

Hereinafter, the operation of the sample solution introducing portion 80 will be described in detail.

In the basic state, the first switching valve 81 is in the injection position and always supplies ultrapure water to the analyzer 70 through the first sample tube 82, so that the first sample tube 82 and the flow path are cleaned do. Further, the tube between the scan nozzle 53 and the first switching valve 81 is filled with air or gas rather than liquid.

After the scan nozzle 53 has completed the scan, the first valve 88 is opened and the first switching valve 81 sucks the sample by the first metering pump 85 at the load position, And is loaded into the first sample tube 82 located in the middle of the flow path between the scan nozzle 53 and the analyzer 70. The travel distance of the sample solution may be in the range of, for example, 2 to 4 m.

When the sample solution reaches the sample tube, it senses the first liquid detection sensor 83 and switches the first switching valve 81 to the injection position. When the first liquid detection sensor 83 senses in the order of gas and liquid, it is judged that the sample solution arrives from the scan nozzle to the first sample tube 82.

The flow path between the scan nozzle 53 and the sample tube 82 is filled with air or gas. When the sample solution is moved by the pump operation, the sample solution is filled with air or gas before and after the sample solution. This provides the advantage that only the section of the sample solution can be identified. For example, before the sample solution is introduced into the first sample tube 82, the gas area is present and the liquid detection sensor of the first sample tube 82 is in an off state. At this time, when the liquid sample solution reaches the first liquid detection sensor 83, the output state of the liquid detection sensor is on. At this time, the first switching valve 81 is switched to the injection position, Can be stored in the tube (82), and the first metering pump (85) for suction is stopped. Both ends of the sample solution have gas, and a plurality of sensors may be added for accurate measurement.

If the first liquid detection sensor 83 can not detect the liquid, the suction process of the sample solution can be repeated a predetermined number of times. If no liquid is detected by the process, it is determined that the sample solution on the substrate is lost and an alarm process is performed.

According to one embodiment of the present invention, since the sample solution can be sensed and loaded according to arrival at the sample tube, accurate loading of the sample solution is possible, loss of the sample solution can be prevented, less sample solution can be used, There is an effect that the nozzle can be moved at high speed from the nozzle to the sample tube.

The first switching valve 80 is then switched from the load position to the injection position and the sample solution loaded in the first sample tube 82 is injected into the analyzer. At this time, the sample solution is supplied to the analyzer 70 using a second metering pump 86 connected to the first switching valve 81, and supplied at a constant flow rate. A second dosing pump 86 is used to push the loaded sample solution to the analyzer 70 with ultra pure water.

When the first liquid detection sensor 83 detects liquid and gas in this order, it is determined that the sample solution moves to the analyzer 70 side. If the first liquid detection sensor 83 does not detect the change from the liquid to the gas, it can be determined that there is an abnormality and an alarm can be issued.

When the sample solution is introduced, both ends of the sample solution are gaseous, and when the sample solution moves, it can detect that the first liquid detection sensor 83 is changed from off state to on state to off state or from on state to off state . The movement of the sample solution is introduced into the analyzer in the order of the sample solution-gas-ultrapure water while the ultrapure water is moved together with the second metering pump 86.

According to the embodiment of the present invention, there is an effect that the movement of the sample solution can be checked using the detection of the first liquid sensor 83 even when the sample solution is not introduced into the analyzer 70. Then, an analysis command is issued to the analyzer 70 and the analysis result is confirmed.

There may be various sample loss processes in the process of transferring the wafer sample to the analyzer. During the scanning process, the sample may be lost (the sample may escape from the nozzle due to the characteristics of the wafer and may leak to the wafer surface. In the process of moving the sample to the sample tube, there may be a sample loss due to abnormality of the pump, It may be lost by the pump or the sample introduction device abnormality during the movement.

On the other hand, according to the embodiment of the present invention, the sensor can be simply added on the sample tube, thereby confirming the loss process of the sample around the sample tube. It is possible to improve the reliability of the analysis result and the safety by checking the sample loss without any confirmation from the person in the automated equipment.

Combination of injection and cleaning of sample solution

The flow path from at least the scan nozzle 53 to the first switching valve 81 is cleaned in parallel with the injection of the sample solution to the analyzer 70 at the injection position of the first switching valve 81.

According to an embodiment of the present invention, there is provided a method comprising: a first step of loading a scanned sample solution into a first sample tube 82 located in the middle of a flow path; And a second step of injecting the sample solution loaded into the first sample tube 82 toward the analyzer 70. In parallel with the second step, at least the scan nozzle 53, the first sample tube 82, Including the preceding section.

Further, when the injection of the sample solution is completed, the flow path from the first switching valve 81 to the analyzer 70 is naturally cleansed by the ultra pure water which is pushed. The path to be cleaned includes the sample movement path from the scan nozzle 53 to the analyzer 70 and the scan nozzle 53 itself.

The cleaning is performed by inserting the scan nozzle 53 into the nozzle cleaning vessel 54 and then sucking it using a pump. More specifically, the scan nozzle 53 is inserted into the nozzle cleaning vane 54 that maintains a clean state by overflowing at all times, and then the cleaning nozzle 53 is rotated by a predetermined time or repeatedly using the first switching valve 81 and the first pump 87 The ultra pure water or the cleaning solution is sucked continuously to perform cleaning.

In this case, a chemical pump (HF, HF + H ₂ O ₂ , HNO ₃ , HCl, etc.) can be introduced into the cleaning solution to increase the cleaning efficiency and shorten the cleaning time. It is good.

A first metering pump 85 used for loading the sample solution into the first sample tube 82 and a first pump 87 used for cleaning, The first pump 87 is connected to the same port (port 6) of the first switching valve 81 and the first pump 87 has a larger capacity than the first metering pump 85. Different pumps are used for loading and cleaning the sample solution, and a pump with a higher suction speed is used for cleaning.

The cleaning of the scan nozzles 530 is possible only with ultra-pure water and can also introduce a chemical solution, which can be carried out continuously in a single vessel or divided into ultrapure water and chemical solution.

In order to shorten the overall process time, cleaning can proceed in parallel during the injection process. In general, the analyzer 70 such as ICP-MS needs to introduce the sample at a slow rate. If the sample is introduced at a high speed, waste of the sample becomes severe. For example, the analyzer 70 can measure a rate of about 0.1 ml / The sample is introduced. In this case, the time for injecting the sample solution of the first sample tube 82 to the analyzer 70 is considerable, and in one embodiment of the present invention, The flow path up to the valve 81 is cleaned.

According to an embodiment of the present invention, the time of several minutes to several tens of seconds can be shortened in preparation for the simultaneous cleaning, and a sample solution of the scan nozzle 53 is supplied to the sample tube at a high speed It is possible to shorten the transfer time.

Then, after the cleaning, the scan nozzle 53 rises to the top of the nozzle cleaning vessel 54 and continues pumping in this state. In this way, the tubes from the scan nozzle 53 to the first switching valve 81 and the first pump 87 are filled with gas, not liquid.

It is preferable that at least a portion of the flow path including the section from the scan nozzle 53 to the front of the first sample tube 82 before the process of loading the sample solution into the first sample tube 82 after cleaning, Fill the gas. Thereafter, the scan nozzle 53 enters the nozzle cleaning vessel 54 again and remains in the standby state.

Auto Calibration

An embodiment of the present invention is a substrate contamination analyzing apparatus for transferring a sample solution sucked by using a scan nozzle (53) on a substrate to be analyzed from a scan nozzle (53) to an analyzer (70) The standard solution introducing portion 90 may be connected to the standard solution introducing portion 90 through a T-shaped tube 94 in the middle of the flow path through which the sample solution is transferred, Can be introduced.

The sample inlet 100 according to an embodiment of the present invention includes a sample solution inlet 80 for injecting a sample solution into the analyzer 70 after loading the sample solution and a sample solution inlet 80 between the sample solution inlet 80 and the analyzer 70 And a standard solution introducing portion 90 which is coupled to the flow path of the sample solution using a T-shaped tube 94 to introduce a standard solution for calibration.

The standard solution introducing portion 90 includes a second switching valve 91, a second sample tube 92, a second liquid sensing sensor 93, a third metering pump 95 and a second pump 96, The second sample loop 92 has a space for the standard solution to be loaded and the second switching valve 91 is coupled to the second sample tube 92 and the standard solution is loaded into the second sample tube 92 And is a valve having at least an injection position for injecting the load position and the loaded standard solution to the T-shaped tube 94 side. The second switching valve 91 may be a six port injection valve.

The second switching valve 91 has a first port and a fourth port coupled to the second sample tube 92, a third port coupled to the flow path through which the standard solution is supplied, a second pump A fifth port connected to the T-shaped tube 94, and a sixth port supplied with ultra pure water for pushing the standard solution.

When the second switching valve 91 loads the standard solution, it is connected between the first port and the second port, between the third port and the fourth port, and between the fifth port and the sixth port, A connection is made between the sixth port and the first port, between the second port and the third port, and between the fourth port and the fifth port.

According to an embodiment of the present invention, the dilution ratio of the sample solution and the standard solution can be variously adjusted by using the sample introduction unit 100, and the calibration can be automatically performed while introducing the dilution ratio into the analyzer 70.

Normally, the first switching valve 81 is located at the injection position and constantly ultra pure water is introduced into the analyzer 70 through the first sample loop 81, which has the meaning of routine cleaning.

Meanwhile, when calibrating, the third metering pump 93 pushes the loaded standard solution with ultra-pure water, and then the flow path of the third metering pump 95 from the T-tube 94 is filled with ultra-pure water. After completion of the calibration It returns to the load position and remains in this state at this time. Since the second switching valve 91 is normally in the load position (the state shown in FIG. 2) and the flow path of the third metering pump 95 from the T-shaped tube 94 is filled with the ultra-pure water, During the analysis of the sample solution, the standard solution is incorporated into the sample solution via the T-tube 94 to enter the analyzer 70 so as not to affect the analysis results.

 At least when the sample solution is transported through the T-shaped tube 94, at least the channel between the T-shaped tube 94 and the second switching valve 91 is filled with ultra-pure water, It can be excluded from being affected by this standard solution.

In the load position of the second switching pump 91, the standard solution can be flowed out before the predetermined time or before the calibration. In the injection position, the loaded standard solution is pushed by the ultra-pure water using the third dosing pump 95 .

According to an embodiment of the present invention, the sample solution introducing portion 90 includes a ultra-pure water carrier portion 88 for pushing the sample solution with ultrapure water when the sample solution is injected toward the analyzer 70, The ultra-pure water carrier portion 88 is commonly used for dilution.

Hereinafter, a process of auto-calibrating the analyzer 70 using the sample inlet 100 in the apparatus for analyzing substrate contaminants according to an embodiment of the present invention will be described.

Since the sample to be analyzed with the analyzer is a sample solution derived from the scan solution, it may be preferable to dilute the standard solution with the scan solution and perform the calibration in the calibration.

According to one embodiment of the present invention, the standard solution is analyzed while diluting it with the scan solution. The sample introducing part 100 according to an embodiment of the present invention includes a sample solution introducing part 80 for introducing a sample solution. When the calibration solution for the analyzer is performed as a standard solution, the sample solution introducing part 80 Dilute the standard solution by introducing the scan solution instead of the sample solution. When the standard solution is diluted with the scan solution, the first valve 88 is closed and the second valve 89 is opened to remove the scan solution for dilution from the scan solution vessel 121 while using the structure of the sample solution introduction part 80 as it is Directly introduced.

In another embodiment of the present invention, the standard solution is diluted with ultrapure water instead of diluted with the scan solution, and the concentration of the ultrafine contaminant may be fluctuated during the manufacturing or handling of the scan solution. And calibrating using the measurement results of the scan solution.

According to one aspect of the present invention, the standard solution is sent to the analyzer 70 while analyzing at least one standard solution with ultra-pure water in real time dilution, and the scan solution used for the scanning is transferred to the analyzer 70, do.

According to one embodiment of the present invention, ultra pure water analysis → standard solution concentration 1 analysis → standard solution concentration 2 analysis →. . → standard solution concentration N analysis → scan solution analysis, etc. When analyzing the standard solution, it is measured and analyzed in the order of low concentration to high concentration, thereby reducing the memory effect which may be caused by deposition of metal atoms or the like in the flow path .

The ultrapure water is supplied to the analyzer 70 at a predetermined flow rate by using the second dosing pump 86 and the ultrapure water is supplied to the analyzer 70 through the second dosing pump 86. Then, Analyzes the ultrapure water and derives the analysis results of the ultrapure water.

Then, the second sample tube 92 is filled with the standard solution by using the second pump 96 as the second switching valve 91 as the load position. The second sample loop 92 may be cleaned and then filled in the second sample tube 92 by pumping the standard solution through the second sample loop 92 for a predetermined time or longer, if necessary.

And switches the second switching valve 91 to the injection position after a predetermined time without sensing the arrival of the standard solution using the second liquid detection sensor 93 or without using the second liquid detection sensor 93. Here, the load position is the connection state in which the standard solution can be introduced, and the injection position is the connection state in which the standard solution can be introduced into the analyzer.

Next, the ultrapure water of the first sample loop 82 is introduced into the analyzer 70 using the second metering pump 86 connected to the first injection valve 81, and at the same time, the third metering pump 82 connected to the second switching valve 91 A pump 95 is used to introduce the standard solution of the second sample loop 92 into the analyzer 70. Each solution is mixed and mixed in an intermediate T-tube (94). The mixing or dilution ratio is determined by the discharge flow rate of each pump.

According to one embodiment of the present invention, for real-time dilution, the ultrapure water and the standard solution are respectively loaded into different sample tubes, then injected simultaneously by two different dosing pumps and mixed in the T-tube 94, Is determined by the discharge flow rate of two different metering pumps.

Then, the analyzer 70 performs the analysis to store the result for the standard solution concentration 1, and sequentially measures and analyzes the various standard solution concentrations. At this time, the dilution ratio is adjusted by changing the discharge flow rate as described above.

Analysis for the standard is performed at a plurality of different dilution concentrations to obtain the calibration curve. Once the calibration of the standard is completed for various concentrations, a calibration curve is generated and the calibration curve shows the relationship between the analyzer input and output, or the concentration of the sample introduced and the analyzer output. Here, 'calibration curve' does not necessarily mean a mathematical curve but may include a mapping table or a mapping function to know the correspondence between the input and the output of the analyzer or between the concentration of the introduced sample and the output of the analyzer .

The calibration curve prepared for each element in each sample is reliable with excellent linearity. If the linearity judgment reference value is set and if it is undershot, the whole or part of the calibration is resumed and the normal process can be performed only when the set value is satisfied.

The substrate contaminant analyzer analyzes the scan solution with the analyzer (70). The scan solution is filled in the first sample tube 82 of the first switching valve 81 and the first pump 87 is used at the load position of the first switching valve 81 without passing through the scan nozzle 53. [ 1 sample loop 82, where the first valve 88 is closed and the second valve 89 is open.

Then, the scan solution is pushed to the analyzer with ultrapure water at a predetermined flow rate by using the first metering pump 85, and the analyzer 70 performs the analysis to derive the analysis result of the scan solution.

As a result of the analysis on the scan solution, if the contaminants such as metal atoms are lower than the set value of the trace concentration, the analysis result of the standard solution can be applied as it is to analyze the sample solution later.

Alternatively, if the analysis result of the scan solution is lower than the set value of the trace concentration, the analysis result of the standard solution may be corrected by the analysis result of the scan solution so as to be used for analyzing the sample solution . The calibration curve can be calibrated according to the result of analysis on the scan solution, or the concentration of the scan solution can be subtracted from the concentration of the sample solution according to the analysis result of the scan solution in analyzing the sample solution. If the result of the analysis of the scan solution is higher than the set value of the trace concentration, it may be re-measured, and if it is abnormal, the scan solution may be remanufactured.

The concentration of the trace contaminants contained in the scan solution may fluctuate during manufacture or handling, and accordingly, when the solution is diluted with the scan solution, the error due to the scan solution can not be discriminated from the analysis result of the standard solution. According to the example, even if the concentration of the contaminant in the scanning solution fluctuates due to solving such a problem, it is possible to collectively correct the concentration of the contaminant in the scanning solution. Therefore, the shaking of the scanning solution is easily eliminated in the calibration.

 Sensitivity Check

As described above, the substrate contaminant analyzing apparatus analyzes the standard solution with the analyzer 70 at a plurality of different dilution concentrations through the auto-calibration to acquire the calibration curve, and analyzes the series of sample solutions using the obtained calibration curve .

According to an embodiment of the present invention, a sensitivity check step of measuring the standard solution with the analyzer 70 at a predetermined period or a predetermined time and determining whether the measured concentration value is within the set range and checking the sensitivity is executed.

The sensitivity check step can be executed simply with less frequency than the frequency of auto-calibration. If the density value specified in the sensitivity check step is out of the setting range, the process of acquiring the calibration curve is performed again.

The analyzer 70 slightly changes the analytical sensitivity with time. Accordingly, the state of sensitivity is checked to check whether there is an abnormality. If the sensitivity is different, the result of the measurement is different and the reliability of the analysis result is lowered.

4 is a flowchart illustrating a sensitivity check process according to an embodiment of the present invention.

First, the standard solution is diluted at a specific ratio or is directly measured by the analyzer 70 (S10), and the output value or expected concentration value of the analyzer 70 is known in advance. Then, it is determined whether the measured concentration value is within the setting range (S12). If the concentration value is out of the setting range, the auto-calibration process is performed again (S14) to obtain the calibration curve again. If the concentration value does not exceed the setting range, the analysis of the sample solution such as the next sample solution is continued S16). If the measured concentration value is within the set deviation, normal processing can be performed to measure the next sample, while if the measured concentration value deviates from the set deviation, it is recognized as a change in sensitivity and the calibration process is performed again.

If the measurement range is out of the predetermined range, the calibration may be performed when the measurement is out of the set range even after repeating the measurement for the standard solution by a predetermined number without performing the calibration of the analyzer 70 again.

According to an embodiment of the present invention, the sensitivity checking process, which can be performed by a simple procedure, is introduced, so that a time-consuming calibration process is not performed frequently.

Self Validation

Analysis of contaminated samples at high concentrations may leave some contaminants in the nozzles, channels, and analyzers in contact with the sample. Typically, the cleaning of the relevant part proceeds after the analysis of each sample, but in the case of a highly contaminated sample, the contamination may not be removed once, or by a predetermined number of rinses.

If this contamination remains, even a clean sample may be measured as contaminated when the next sample is measured. The remaining material in the previously measured sample has a memory effect that affects the results of the newly measured sample. As such, the memory effect can cause problems in the reliability of the sample measurement results. Accordingly, according to an embodiment of the present invention, a self validation function for checking whether a memory effect is completely eliminated is automatically performed.

5 is a flowchart illustrating a self-verification process according to an embodiment of the present invention.

The sample solution is transferred to the analyzer according to a conventional procedure and analyzed (S20). After the analysis, the flow path from the scan nozzle to the analyzer is cleaned (S22). At this time, the sample solution may be automatically cleaned using ultrapure water.

According to one embodiment of the present invention, a self-verification process (S40) is added to determine whether the transferred sample solution has a concentration higher than a predetermined concentration value (S24). If the sample solution is not a high concentration sample, .

However, if the sample is a high-concentration sample, the sample transfer part is chemically cleaned (S26), the ultrapure water is cleaned with the ultrapure water and transferred to the analyzer (S28), and it is judged whether the measured concentration value of the ultrapure water is within the set range (S30). If the set range is out of the set range, the chemical cleaning and ultrapure water analysis process are repeated. If the set range is exceeded, an alarm may be generated if the set range is exceeded. As a result of execution of the self-verification step, an alarm is generated when the set range is deviated by a predetermined number of times.

In the above-described self-verification step, it is determined whether or not the sample is a high-concentration sample, but it is also possible to perform self-verification composed of ultrapure water analysis or the like regardless of whether the sample is a high concentration sample.

According to an embodiment of the present invention, a self-validation function is automatically performed to easily eliminate a memory effect in a substrate contamination analyzing apparatus and method, and to improve the reliability of a substrate contamination analysis result .

Recycling for Monitor Wafer

The substrate contaminant analyzer is mainly composed of a monitor wafer in a semiconductor manufacturing process, and after gas phase decomposition, a monitor wafer is analyzed by an analyzer using a scan nozzle. Conventionally, contamination analysis of wafers by ICP-MS and the like is accompanied by VPD, so it is classified into destructive analysis, and wafers that have been analyzed are discarded.

However, according to one embodiment of the present invention, at least the recycling unit 60 is used to treat the wafer containing the acid-based or base-based chemical in order to recycle the monitor wafer that has been scanned. Acid-based chemicals include hydrofluoric acid and hydrogen peroxide, and base-based chemicals include ammonium hydroxide and hydrogen peroxide.

6 is a cross-sectional view of a recycle unit according to an embodiment of the present invention.

The recycling unit 60 includes an upper nozzle 69 (shown in a disengaged state), an upper nozzle mount 63, a lower nozzle 64, a wafer load plate 61, a wafer vacuum chuck 62, 66, a vacuum chuck driving part 67, an inclined part 65, and the like.

The upper nozzle 69 (shown in the separated state) is mounted on the upper nozzle mounting part 63 and injects the solution onto the upper surface of the monitor wafer, and the upper nozzle rotation driving part 66 rotates the upper nozzle. The lower nozzle 64 injects the above solution onto the lower surface of the monitor wafer, and can be driven to rotate by the lower nozzle rotation driving part 68. The recycling unit 60 can process both sides of the monitor wafer through the nozzles provided at the top and the bottom.

And the recycling unit 60 includes a chamber, wherein the inner bottom of the chamber includes an inclined portion 65 that is tapered in one direction to assist in draining the solution after treatment.

According to an embodiment of the present invention, there is provided a method for recycling a monitor wafer, the method comprising: a recycling process step of treating at least a monitor wafer in a chamber with a solution containing at least acid series or base series chemicals, The above-described solution is sprayed on both surfaces of the substrate.

The process of the recycling unit will be described in detail. After bringing the monitor wafer into the process chamber and placing it on the raised wafer load plate 61, the wafer load plate 61 is lowered and the door is closed. Then, as the upper nozzle moves to the wafer center and injects the chemical liquid, the wafer is rotated at a low speed and the upper nozzle is rotated at a limited angle. Chemical solution injection is similarly performed to the lower portion of the wafer after the uniform spray of the chemical liquid by the upper nozzle.

Then, rinse is performed on the upper and lower wafers using ultrapure water, the wafer is rotated at a high speed, nitrogen gas is sprayed and dried, and after the drying, the wafer load plate is lifted and the door is opened.

According to an embodiment of the present invention, since the monitor wafer that was conventionally discarded can be reused, the cost of the monitor wafer can be greatly reduced.

Automatic chemical liquid preparation for scan solutions

In the conventional apparatus for analyzing substrate contaminants, the chemical solution used in each step was directly manufactured by the operator or purchased and purchased. Accordingly, there is an inconvenience that the operator has to periodically replenish or replace the chemical liquid.

In addition, there is a problem that can cause a safety accident in the process of manufacturing and replacing the chemical liquid, and the contamination of some samples in the process of work may seriously lower the reliability of the measurement result. Since the apparatus according to the present invention is a device for analyzing a trace amount of pollution, the level of allowed pollution degree is very low and it is very likely that the pollution source in case of minor carelessness or work environment does not satisfy the allowable pollution level, high.

7 is a schematic diagram showing a scan solution producing unit according to an embodiment of the present invention.

The scan solution manufacturing section automatically mixes the ultrapure water and the central supply chemical to prepare a scan solution,

The scan solution manufacturing unit includes a scan solution vessel 121, a plurality of valves 125a to 125i, a plurality of flow rate controllers 122 to 124, and a pump 127. The scan solution vessel 121 (the same as 121 in FIG. 2) is a vessel in which the prepared scan solution is temporarily stored.

The valve and flow rate controller supplies the DIW and the central supply chemistry (Chem1, Chem2) between the line supplying the DIW and the central supply chemistry (Chem1, Chem2) and the scan solution vessel (121) Between the drain lines 128 and the scan line 121, and between the scan line 121 and the drain 128. In particular, the valves 125f, 125g, 125g are positioned between the lines and the drains supplying the central supply chemistry to vent or periodically vent the central supply chemistry to prevent contamination due to stagnation of the central supply chemistry.

Also, in one embodiment of the present invention, the scan solution stored in the scan solution vessel 121 is transferred to the analyzer through the flow path to verify at least whether the scan solution is contaminated.

Hereinafter, the automatic manufacturing and verification process of the scan solution will be described.

The chemical liquid may be supplied by a pump or a central supply system, and the volume of the chemical liquid is defined by using a flow rate controller (122, 123, 124) or a metering pump (not shown) and supplies a predetermined volume to the scan solution vessel 121. The chemical liquid supply can be carried out sequentially or simultaneously with the chemical liquid to be mixed and can be introduced by opening the relevant valve.

First, the cleaning solution vessel 121 is cleaned using the ultra-pure water and the central supply chemical for manufacturing the scan solution in the same manner, and then discharged to the drain. In detail, when the valve 125f is closed and the valve 125c is opened, the flow rate is adjusted using the flow rate controller 124 to introduce ultrapure water into the scan solution vessel 121, and similarly, the first central supply chemical (HF ) And the second central supply chemical (H ₂ O ₂ ) are introduced in the same manner after a predetermined time, and the flow rate and valve opening time are adjusted to achieve the final volume.

After waiting a predetermined time for chamber cleaning, the valve 125i is opened and the solution of the solution 121 of the scan solution is discharged to the drain 128 by using the pump 127 or gas pressurization, and this process may be omitted or repeated It is possible.

Then, the ultrapure water and the central supply chemical are automatically mixed to prepare the scan solution and store it in the vessel. The manufacturing process of the scan solution is the same as the process of filling the ultrapure water and the central supply chemical for the above-mentioned bevel cleaning, but the concentration and the like can be controlled differently.

Then, the scan solution prepared through the flow path is transferred from the scan solution vessel 121 to the analyzer 70 to verify whether or not at least the prepared scan solution is contaminated. At this time, the sample is transferred to the analyzer 70 by using the valve 89 (FIG. 2), the switching valve 81 and the sample tube 82 and analyzed. This process can be the same as the process of analyzing the scan solution in the calibration process have. If the measured result is more than the set value, it is judged that it is contaminated, and the re-manufacturing and analysis are repeated for the set number of times.

According to an embodiment of the present invention, there is an effect that safety accidents and chemical liquid contamination are prevented in the apparatus and method for analyzing substrate contaminants, and the quality of the manufactured scan solution can be assured.

And the scan solution manufacturing unit periodically discharges the center supply chemical to the drain to prevent contamination due to the stagnation of the central supply chemical. The contamination can be caused by biological substances such as bacteria. However, the scan solution producing unit according to an embodiment of the present invention prevents contamination due to the stagnation of the chemical solution in advance.

An exhaust can be connected to the scan solution vessel 121 to smoothly supply the chemical solution and the chemical solution present in the scan solution vessel 121 can be removed by the drain 128 using the pump 127 or gas pressurization, . ≪ / RTI > In addition, the chemical solution level sensor (126a, 126b) may be provided in the scan solution vessel 121 to automatically perform a new operation if the chemical solution is insufficient, or to stop the operation for safety when the chemical solution level is excessively produced.

8 is a schematic diagram showing an etching solution producing unit according to an embodiment of the present invention.

The etch solution manufacturing section automatically manufactures an etching solution for global etching or point etching of the bulk of the semiconductor substrate. The etching solution manufacturing section includes chemical supply vessels 133 and 134 for supplying the chemical, point etching liquid bath 131, A plurality of valves 136a to 136g, and a metering pump 135. [

The point etching solution vessel 131 is an etching solution vessel for storing an etching solution for point etching the substrate to analyze the point Depth Profile of the substrate and supplying the etching solution to the scanning nozzle 53. The bulk etchant vessel 132 is an etchant solution vessel that etches from the VPD unit to the bulk of the substrate and stores the etchant for scanning and analyzing the bulk.

The metering pump 135 sequentially sucks two or more chemicals and ultrapure water to produce an etching solution and then discharges the etching solution into a point etchant solution vessel 131 or an etching solution vessel of the bulk etching solution vessel 132. Then, the etchant is converted into a gaseous state or supplied in a liquid state through a flow path from the etching solution vanes 131 and 132 to a chamber for global etching or a nozzle for point etching, and the chemical used is preferably hydrofluoric acid (HF) include nitric acid (HNO _3).

Hereinafter, an automatic etching solution manufacturing process for producing an etching solution in an etching solution producing unit according to an embodiment of the present invention will be described.

The manufacturing process is a process of automatically manufacturing an etching solution for global etching or point etching of a bulk of a semiconductor substrate. The process of sequentially sucking two or more chemical and ultrapure water for producing an etching solution, And the produced nicking solution is supplied from the etching solution vessel through a channel to a chamber for global etching or a nozzle for point etching.

A first, open the valve (136c) relating to the chemical (HNO ₃₎ to open the metering pump 135, the suction by a volume defined by the first chemical and the valve valve (136e) connected to the bulk etching solution vessel 132 to close the (136c) And the first chemical sucked in is sucked out by using the metering pump 135. [ At this time, since only the valve 136e of the bulk etching liquid vessel 132 is open, the chemical liquid is supplied to the bulk etching liquid vessel 132.

Other chemical liquids such as the second chemical and ultrapure water are also prepared by supplying them in the same manner in accordance with the predetermined dilution ratio, and the chemical liquid for point etching can also be produced by the same method.

The metering pump 135 is used to purge part or all of the flow path used for suction and discharge between the process of repeating suction and discharge with the non-reactive gas. A non-reactive gas such as N 2 may be used to completely remove or supply the chemical solution which may remain in the tube or the like, in order to complete the constant amount supply by the metering pump 135.

If the pressure is applied during the supply of the chemical liquid to the etchant vessel, the supply can be smoothly performed by supplying the exhaust gas. The chemical liquid present in the etchant vessel can be removed by a pump or a gas pressurized by drain, . If the chemical solution level sensor (137a, 137b, 138a, 138b) is provided in the etchant vessel, the chemical solution level sensor can automatically be newly manufactured if the chemical solution is insufficient or the operation can be stopped for safety in the case of excessive production. Chemical level sensors 139a and 139b may also be provided in the supply vessels 133 and 134 to enable an alarm when the level of the chemical becomes less than a certain level.

The apparatus and method for analyzing substrate contaminants according to an embodiment of the present invention can completely perform the manufacture of a chemical such as a scan solution and an etchant for analysis, a supply to a scan nozzle, a transfer of a sample solution after a scan, Maintenance and replenishment of chemical quality, calibration of the analyzer, maintenance of sensitivity, maintenance of performance, cleaning of the flow path, recycling of the monitor wafer, etc., can be carried out automatically in a single device.

Conventional substrate contamination analyzing apparatuses have a delay in response to a manual operation of a worker, a safety problem in chemical handling, and a problem of cross contamination. However, according to one embodiment of the present invention, in-line monitoring is possible in a substrate manufacturing process, System, there is no chemical handling safety problem and cross contamination problem, and real time or quick response is possible.

10: load port 20: robot
30: aligner unit 40: VPD unit
50: scan unit 51: scan stage
52: scan module 53: scan nozzle
60: Recycling unit 70: Analyzer
80: sample solution introducing portion 81: first switching valve
82: first sample tube 83: first liquid detection sensor
90: standard solution introduction part 91: second switching valve
92: second sample tube 93: second liquid detection sensor
94: T-tube 100: Sample introduction part
121: Scan solution vessel 131: Point etch solution vessel

Claims (17)

A substrate contamination analyzer for analyzing a sample solution, which is obtained by vaporizing a monitor wafer in a semiconductor manufacturing process, and then scans the monitor wafer using a scan nozzle, from a scan nozzle to an analyzer through a flow path,
And a recycling unit for treating the monitor wafer with the solution containing at least acid series or base series chemical to recycle the monitor wafer that has been scanned,
Wherein the acid-based chemistry comprises hydrofluoric acid and hydrogen peroxide, the base-based chemistry comprises ammonium hydroxide and hydrogen peroxide,
The recycling unit comprises:
An upper nozzle for spraying the solution used in the treatment onto the upper surface of the monitor wafer; And a lower nozzle for spraying the solution used for the treatment onto the lower surface of the monitor wafer,
Wherein the analyzer is an inductively coupled plasma mass spectrometer and the analysis by the analyzer is classified as destructive analysis involving VPD,
Wherein the substrate contamination analyzing apparatus comprises: delete delete delete The method according to claim 1,
Wherein the recycling unit comprises a chamber,
Wherein the inner bottom of the chamber is tilted to one side,
Wherein the substrate contamination analyzing apparatus comprises: A monitor wafer in a semiconductor manufacturing process is introduced and vapor-phase decomposed, a sample solution of the monitor wafer is transferred from the scan nozzle to the analyzer through a flow path, and analyzed by the analyzer The substrate contamination analyzing method comprising:
And a recycling processing step of treating the monitor wafer with the solution containing at least acid series or base series chemical in the chamber in order to recycle the monitor wafer which has finished the scanning,
Wherein the acid-based chemistry comprises hydrofluoric acid and hydrogen peroxide, the base-based chemistry comprises ammonium hydroxide and hydrogen peroxide,
The recycling processing step includes:
And spraying the solution onto both surfaces of the monitor wafer,
Wherein the analyzer is an inductively coupled plasma mass spectrometer and the analysis by the analyzer is classified as destructive analysis involving VPD,
≪ / RTI > delete delete delete delete delete delete delete delete delete delete delete

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