KR101580866B1 - A circuit board and process for producing of the same - Google Patents

Abstract

The present invention provides a method of manufacturing a semiconductor device, comprising: providing a first base substrate including a concave portion and a convex portion; Forming a first insulating layer pattern on the concave portion of the first base substrate; Forming a metal layer on the convex portion of the first base substrate; Attaching a second base substrate to the top of the metal layer; Simultaneously separating the second base substrate and the metal layer from the first base substrate to produce a circuit board including the metal layer; And a step of laminating a plurality of circuit boards including the metal layer to fabricate a first circuit board and a second circuit board positioned above the second circuit board, It is possible to solve the technical limitations of the step of etching the metal wiring by eliminating the etching step of the metal wiring constituting the circuit wiring of the circuit wiring.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a circuit board,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a circuit board and a method of manufacturing the circuit board, and more particularly, to a circuit board capable of miniaturizing or highly integrating circuits and a method of manufacturing the circuit board.

The speaker is to convert the electrical energy into mechanical energy by the voice coil existing between the gaps by the Fleming left hand rule that the current carrying conductor is in the magnetic field.

That is, when a current signal including various frequencies is applied to the voice coil, the voice coil generates mechanical energy according to the magnitude of the current and the frequency, generates vibration in the diaphragm attached to the voice coil, A sound pressure of a predetermined magnitude which can be generated is generated.

Speakers (Speakers) are those that are relatively close to the human ear and are used in close contact with the human ear. Generally speaking, the speaker is a speaker that has a relatively large sound pressure and uses a predetermined distance from the human ear. .

A magnetic circuit of such a speaker can be formed by a magnet and an upper plate in a yoke made of an iron metal, and a magnetic flux can be bridged at right angles to a voice coil existing in the gap. And the voice coil is bonded to the diaphragm, generating an electromotive force in the vertical direction by an input signal, thereby generating a negative pressure by vibrating the diaphragm restrained by bonding to the frame.

Recently, speakers have been continuously realized in terms of small size, light weight, and high performance in response to the commercialization of high energy magnets and the development of molding technology of microstructures and the tendency to be small and light in the field of information and communication.

In addition, as the spread of mobile communication terminals rapidly spreads, the use of micro speakers has been expanded and the size of the accessories has been reduced due to the miniaturization of the micro speakers, which makes it difficult to meet such trend with conventional design techniques I have.

The micro speaker according to the related art will be briefly described as follows.

11 is a cross-sectional view showing a conventional micro speaker.

Referring to FIG. 11, a micro speaker according to the related art includes a frame 11 having a space on the inner surface, a magnet 14 magnetized in the up and down direction embedded in the frame, and a magnetic circuit A yoke 13, an upper plate 15 attached to the magnet 14 to form a magnetic circuit, an acoustic generating diaphragm 17 having an outer end fixed to an upper end of the frame 11, A voice coil 16 wound and fixed in a cylindrical shape at the lower end of the frame 11, a protection plate 18 covering the open end of the frame 11, and a PCB substrate 19 joined to one side of the outer surface of the frame 11 .

In the general micro speaker construction as described above, the diaphragm has wave of various shapes in order to eliminate excellent response and buckling at the time of moving up and down. The shape of the diaphragm is a design variable that has the greatest influence on the frequency characteristic Thereby significantly affecting the acoustic characteristics of the speaker.

In recent years, miniaturization of a speaker, which is a sound reproduction part, has been accelerated in accordance with an increase in the size of an LCD window and a slimmer product in a mobile communication terminal. In order to reduce the area occupied by the speaker, The PCB substrate has a difficulty in designing to produce the optimum performance by using the minimum space.

At this time, as a typical PCB substrate, for example, a film carrier is used as a method for mounting a fine circuit pattern on the surface of a resin substrate having a thin film shape.

Conventionally used film carriers are formed by placing a conductive metal such as copper on the surface of a polyimide film and applying a photosensitive resin to the surface of the layer made of the conductive metal and then exposing and developing the photosensitive resin to form a desired pattern And etching the metal layer using the pattern thus formed as a masking resist.

However, as described above, in order to reduce the area occupied by the speaker in accordance with market conditions, miniaturization or high integration of the PCB substrate, which is one of the components, must be possible. In the case of the method for producing a film carrier, it is difficult to form fine wirings having a width of about 30 mu m or less, and further technological innovation is demanded toward manufacturing a next generation high density line substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and provides a circuit board and a method for manufacturing the circuit board that can be miniaturized or highly integrated through miniaturization of the metal wiring constituting the circuit wiring of the circuit board .

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to solve the above-mentioned problems, the present invention provides a method of manufacturing a semiconductor device, comprising: providing a first base substrate including a concave portion and a convex portion; Forming a first insulating layer pattern on the concave portion of the first base substrate; Forming a metal layer on the convex portion of the first base substrate; Attaching a second base substrate to the top of the metal layer; Simultaneously separating the second base substrate and the metal layer from the first base substrate to produce a circuit board including the metal layer; And laminating two circuit boards including the metal layer to manufacture a first circuit board and a second circuit board positioned above the second circuit board.

Further, the present invention is characterized in that the metal layer includes a first metal layer and a second metal layer, the first metal layer is located on the first circuit board, and the second metal layer is located on the second circuit board The present invention also provides a method of manufacturing a circuit board.

Further, the present invention provides a method of manufacturing a circuit board, further comprising forming a through hole in the first metal layer and the second metal layer, and forming a connection wiring in the through hole.

Further, in the present invention, the first base substrate on which the first insulating layer pattern is formed on the concave portion constitutes a first master substrate, and the first master substrate is reused. ≪ / RTI >

The step of providing the first base substrate including the concave portion and the convex portion may include forming a second insulating layer pattern on the third base substrate to form a second master substrate, ; And forming the first base substrate on the second master substrate.

The second insulating layer pattern may be formed by forming a second insulating layer on the third base substrate and etching the second insulating layer by a known etching method, A mask including an opening corresponding to an insulating layer pattern is manufactured and a second insulating layer is formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) through the mask And then depositing the film on the substrate.

The present invention also provides a method of manufacturing a circuit board in which the concave portion is formed in a region corresponding to the second insulating layer pattern and the convex portion is formed in an area not corresponding to the second insulating layer pattern .

Further, the present invention provides a method of manufacturing a circuit board in which the metal layer is determined according to the shape of the second insulating layer pattern.

As described above, the circuit board and the method of manufacturing the same according to the present invention solve the technical limitation of the step of etching the metal wiring by excluding the etching process of the metal wiring constituting the circuit wiring of the circuit board, Is possible.

Further, in the present invention, after separating the metal layer from the master substrate, the metal layer is used as the circuit wiring of the circuit substrate, and the master substrate can be reused as a master substrate for continuously producing the metal layer of the circuit substrate.

Further, in the present invention, it is possible to constitute the base substrate constituting the circuit board with a very thin thickness.

1A to 1D are cross-sectional views illustrating a process of manufacturing a general circuit board.
2 to 10 are schematic views showing a process of manufacturing a circuit board according to the first embodiment of the present invention.
11 is a cross-sectional view showing a conventional micro speaker.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

1A to 1D are cross-sectional views illustrating a process of manufacturing a general circuit board.

First, referring to FIG. 1A, a copper thin film layer 20 is formed on an insulating substrate 10.

Thereafter, as shown in FIG. 1B, a photoresist layer 30 is formed on the copper foil layer 20.

1C, a photoresist pattern 31 having a desired shape is formed by exposing and developing the photoresist layer. Then, as shown in FIG. 1D, the formed photoresist pattern 31 is patterned into a masking resist 31. Then, The copper thin film layer is etched to form the copper thin film pattern layer 21.

Thereafter, an ashing process or a wet removing process is performed to remove the photoresist pattern 31, and a circuit board having the copper thin film pattern layer 21 formed on the insulating substrate 10 as a circuit wiring is manufactured .

However, as described above, in order to reduce the area occupied by a speaker or a reciever, it is necessary to miniaturize a circuit board, which is one of the components, or to increase the degree of integration. However, In the case of a general circuit board manufacturing method, it is difficult to form fine wirings having a width of about 30 mu m or less due to the technical limitations of the step of etching metal wirings.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 to 10 are schematic views showing a process of manufacturing a circuit board according to the first embodiment of the present invention. Here, a in each drawing corresponds to a sectional view, and b corresponds to a perspective view.

2A and 2B, a process of manufacturing a circuit board according to a first embodiment of the present invention produces a first master substrate.

The first master substrate means a first stage substrate for manufacturing a second master substrate to be described later. In the step of manufacturing a circuit board according to the first embodiment of the present invention, A circuit board can be manufactured through the above-described process, which will be described later.

2A and 2B, a first base substrate 210a for manufacturing the first master substrate is provided.

As described later, the first base substrate is preferably made of a metal such as Ni, NiCo, NiFe, or NiW so that the second base substrate of the second master substrate can be formed by electroplating. However, The material of the first base substrate is not limited.

Thereafter, a first insulating layer pattern 210b is formed on the first base substrate 210a.

The first insulating layer pattern is for forming a concave portion on a second base substrate of a second master substrate to be described later. In manufacturing a second base substrate to be described later by an electroplating method, The first insulating layer pattern may be formed of a silicon oxide film or a silicon nitride film so as to have electrical insulation so as to form a concave portion in a region corresponding to the pattern 210b. However, in the present invention, no.

Meanwhile, in forming the first insulating layer pattern, a first insulating layer is formed on the first base substrate, and the first insulating layer is etched by a known etching method, Can be formed.

The first insulating layer pattern may be formed using various methods such as a known chemical vapor deposition (CVD) method or a physical vapor deposition (PVD) method. For example, A mask including an opening corresponding to the first insulating layer pattern is formed on the first insulating layer pattern and the first insulating layer pattern is formed by a chemical vapor deposition (CVD) method or a physical vapor deposition (PVD) An insulating layer may be deposited.

Next, referring to FIGS. 3A and 3B, a second base substrate 220 for manufacturing a second master substrate, which will be described later, is formed below the first master substrate.

In this case, the lower portion of the first master substrate is described with reference to FIGS. 3A and 3B. In the case of reversing FIGS. 2A and 2B, it is defined that the second base substrate is formed on the first master substrate . Therefore, the term " upper " and " lower " in the present invention are not limited to the meaning, and it is generally defined as forming a second base substrate on the first master substrate. Hereinafter, The terms in the lower part can be used in the above-mentioned sense.

The second base substrate 220 may be formed on the first master substrate using a known electroplating method. In the first master substrate, a portion covered with the first insulating layer pattern may be formed of a plating layer And the plating layer is formed higher than the height of the first insulating layer pattern by continuous electroplating, so that the second base substrate 220 as shown in FIGS. 3A and 3B can be formed.

That is, in the electroplating method, the first insulating layer pattern functions as a non-conductive layer, so that the second metal layer is not formed in the region where the first insulating layer pattern is formed, The plating layer is formed higher than the height of the pattern so that the second base substrate 220 as shown in Figs. 3A and 3B, that is, the second base substrate 220 including the concave portion and the convex portion, (220) can be formed.

The electroplating process may be an electroplating process for plating Ni or an Ni alloy such as NiCo, NiFe, or NiW. The electroplating process for forming the second base substrate is well known in the art. .

On the other hand, although not shown in the drawings, the second base substrate can be manufactured through a known electroless plating method.

The electroless plating method is a plating method using a chemical reaction by means of an electrocatalyst, and unlike electroplating, a coating is formed even if electricity is not applied to the object to be plated, and a coating is formed on almost all materials such as plastic, paper, A coating film can be formed. In addition, a coating film can be formed on a complicated structure, and the physical properties of the formed film are excellent in corrosion resistance, alkali resistance, abrasion resistance, solderability, adhesion and heat resistance and are widely applied to automobiles, aircrafts, general machinery, have.

To this end, a seed layer may be formed on the first base substrate including the first insulating layer pattern, and the second base substrate may be formed by chemical reaction due to the seed layer acting as a catalyst.

At this time, since the step difference occurs in the region where the first insulating layer pattern is formed and the region where the first insulating layer pattern is not formed, the second base substrate 220 as shown in FIGS. 3A and 3B, A second base substrate 220 including a concave portion and a convex portion can be formed.

Since the electroless plating method is well known in the art, a detailed description thereof will be omitted below.

4A and 4B, by separating the second base substrate 220 from the first master substrate including the first base substrate 210a and the first insulating layer pattern 210b, A second base substrate 220 for manufacturing a two-master substrate can be manufactured.

4A and 4B, the second base substrate 220 includes a concave portion 221 and a convex portion 222, and the concave portion 221 221 and the convex portion 222 are formed by the first insulation layer pattern located on the first master substrate, that is, the first insulation layer pattern is formed in the region corresponding to the first insulation layer pattern, And a convex portion 222 is formed in an area not corresponding to the first insulating layer pattern.

5A and 5B, a second insulating layer pattern 230 is formed on the concave portion 221 of the second base substrate 220. Referring to FIG.

The second insulating layer pattern 230 may be formed of the same material as that of the first insulating layer pattern 230. The second insulating layer pattern 230 may be formed using a known chemical vapor deposition (CVD) And may be formed using various methods such as PVD (Physical Vapor Deposition). Therefore, the method of forming the second insulating layer pattern in the present invention is not limited thereto.

At this time, although not shown in the figure, the cross-section can be planarized by a known chemical mechanical polishing (CMP) process for planarization of the upper surface of the second insulation layer pattern 230, The upper surface of the second insulating layer pattern 230 and the upper surface of the convex portion 222 of the second base substrate 220 may be substantially flat.

The second insulating layer pattern 230 is formed on the concave portion 221 of the second base substrate 220 so that the second insulating layer pattern 230 is formed on the concave portion 221 of the second base substrate 220, 2 master substrate can be manufactured.

That is, in the step of manufacturing the circuit board according to the first embodiment of the present invention, as will be described later, the circuit board can be manufactured substantially through the second master substrate, And may correspond to a first-stage substrate for manufacturing a master substrate.

6A and 6B, a second base substrate 220 including a second insulation layer pattern 230 formed on a second master substrate, that is, a concave portion 221, A metal layer 240 is formed on the master substrate.

The metal layer 240 constitutes a circuit pattern in the circuit board according to the present invention, and the metal layer can be formed using a known electroplating method.

Since the second insulating layer pattern 230 is formed on the concave portion 221 of the second base substrate 220 at this time, The metal layer 240 can be formed only on the convex portion 222. [

That is, since the second insulating layer pattern 230 functions as a non-conductive layer in the electroplating method, the metal layer is not formed in the region where the second insulating layer pattern 230 is formed, The metal layer can be formed only on the metal layer.

The electroplating process may be an electroplating process for plating Ni, NiCo, NiFe, NiW, Cu, Cu alloy, etc., and the electroplating process for forming the metal layer is well known in the art. .

2 to 6, it can be seen that the metal layer constituting the circuit pattern in the circuit board according to the present invention is formed in correspondence with the region where the insulating layer of FIG. 2 is not formed.

That is, in the present invention, a second master substrate is manufactured through a first master substrate, and a metal layer constituting a circuit pattern is formed through the second master substrate. In manufacturing the metal layer, The shape of the metal layer is determined according to the shape of the first insulating layer pattern.

In this case, as described above, the first insulating layer pattern can be formed by a known etching method. In the present invention, etching a certain layer by a known etching method does not etch the metal wiring, This corresponds to a method of etching the insulating layer.

That is, in the case of a general circuit board manufacturing method, it is difficult to form a fine wiring having a width of about 30 μm or less due to the technical limitation of the step of etching the metal wiring. In the present invention, However, since the shape of the metal layer constituting the circuit pattern is determined by the method of etching the insulating layer, the technical limit of the step of etching the metal wiring can be solved.

In addition, as described above, the first insulating layer pattern can be formed using a known chemical vapor deposition (CVD) method or a physical vapor deposition (PVD) method through a mask In this case as well, the process of etching the metal wiring can be eliminated.

Further, in the present invention, since the circuit wiring is formed by a known electroplating method, not by forming the circuit wiring of the circuit board by the method of etching the metal wiring in the subsequent steps, the technical limit of the step of etching the metal wiring It is possible to form a fine wiring having a wiring width of 10 mu m or less.

As a result, in the present invention, since the metal wiring etching process for etching the metal layer constituting the circuit wiring of the circuit board can be eliminated, it is possible to form the fine wiring having the wiring width of 10 m or less, Is possible.

Next, referring to FIGS. 7A and 7B, a third base substrate 300 is attached to the upper portion of the metal layer 240 formed on the second master substrate, The separated third base substrate 300 and the metal layer 240 may be used as a circuit board by simultaneously separating the metal layer 300 and the metal layer 240.

That is, the third base substrate 300 is attached to the upper portion of the metal layer 240, and the third base substrate 300 and the metal layer 240 are simultaneously separated from the second master substrate. Can be used as a circuit board.

The third base substrate may be an inorganic substrate such as quartz or glass, or may be an inorganic substrate such as a polyethylene terephthalate (PET), a polyethylene naphthalate (PEN), a polycarbonate (PC), a polystyrene (PS), a polypropylene (PP), a polyimide ), Polyethylenesulfonate (PES), polyoxymethylene (POM), polyetheretherketone (PEEK), polyethersulfone (PES) and polyetherimide Therefore, the material of the third base substrate is not limited in the present invention.

At this time, since the third base substrate can be used only in the process of separating the metal layer, the third base substrate can be made very thin.

In other words, in the case of a general circuit board manufacturing process, since the base board serves as a support in the process of manufacturing the circuit board, there is a restriction that the base board must be a certain thickness or more. In the present invention, Since the third base substrate is used only for the process of separating the metal layer, it is advantageous that the third base substrate can have a very thin thickness of 10 탆 or less.

Meanwhile, as described above, the second insulating layer material is preferably a Teflon-based material, and the Teflon-based material is a material having excellent non-stick properties.

That is, in separating the third base substrate 300 and the metal layer 240 simultaneously from the second master substrate, even if a part of the second insulating layer pattern is partially in contact with the metal layer, Sticking property, the metal layer can be easily separated from the second insulating layer pattern.

In the method of manufacturing a circuit board according to the present invention, a method of manufacturing a general circuit board can produce only one wiring pattern by one completed process. In the present invention, however, It is possible to reuse it.

That is, as described above, after separating the metal layer 240 from the second master substrate, the metal layer is used as a circuit pattern, and the second master substrate is continuously reused as a master substrate for producing a circuit pattern This is possible.

Next, referring to FIG. 8, a plurality of circuit boards manufactured by the processes of FIGS. 2 to 7 are laminated.

That is, as shown in FIG. 8, a plurality of the circuit boards of FIG. 7B are stacked to form a first circuit board 400 and a second circuit board 400 'located above the first circuit board 400 Thereby producing a circuit board.

At this time, the first circuit board and the second circuit board may correspond to the same third base board 300 and 300 'as the same metal layer 240 and 240', and thus the metal layers 240 and 240 ' Can be positioned to correspond to each other.

The first metal layer 240 on the first circuit board 400 and the second metal layer 240 'on the second circuit board 400' are hereinafter referred to as the first metal layer 240 ' The metal layer 240 and the second metal layer 240 'may be positioned to correspond to each other.

Next, referring to FIG. 9, a through hole 410 is formed in the first metal layer 240 and the second metal layer 240 'corresponding to each other.

The through hole 410 may be formed by a known etching method or by a known punching method.

In forming the through holes 410 in the first metal layer 240 and the second metal layer 240 ', the third base substrate 300 and the third base substrate 300' of each of the first circuit substrate and the second circuit substrate, A through hole can be formed at the same time.

Next, referring to FIG. 10, a connection wiring 420 is formed in the through hole 410 formed in the first metal layer 240 and the second metal layer 240 '.

The connection wiring 420 is for electrically connecting the first metal layer 240 and the second metal layer 240 'and electrically connects the first circuit board 400 and the second metal layer 240' Two circuit boards 400 'can be electrically connected.

The connection wiring 420 may be formed by soldering so that the connection wiring 420 electrically connects the first circuit board 400 and the second circuit board 400 ' The first circuit board 400 and the second circuit board 400 'may be attached.

As a result, the circuit board according to the present invention can be manufactured, and further, a multilayer circuit board can be manufactured.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

210a: first base substrate 210b: first insulating layer pattern
220: second base substrate 230: second insulating layer pattern
221: concave portion 222: convex portion
240: metal layer 300: third base substrate

Claims (9)

Providing a first base substrate including a concave portion and a convex portion;
Forming a first insulating layer pattern on the concave portion of the first base substrate;
Forming a metal layer on the convex portion of the first base substrate;
Attaching a second base substrate to the top of the metal layer;
Simultaneously separating the second base substrate and the metal layer from the first base substrate to produce a circuit board including the metal layer; And
Stacking two circuit boards including the metal layer to manufacture a first circuit board including a first metal layer and a second circuit board formed on the first circuit board and including a second metal layer and,
The step of providing the first base substrate including the concave portion and the convex portion includes:
Forming a second insulating layer pattern on the third base substrate to produce a second master substrate;
And forming the first base substrate on the second master substrate. delete The method according to claim 1,
Forming a through hole in a first circuit board including the first metal layer, the first metal layer, a second circuit board including the second metal layer and the second metal layer, and forming a connection wiring in the through hole; Further comprising the steps of: The method according to claim 1,
The first base substrate on which the first insulating layer pattern is formed on the concave portion constitutes a first master substrate,
Wherein the first master substrate is reusable. delete The method according to claim 1,
The formation of the second insulating layer pattern may be performed,
A second insulating layer is formed on the third base substrate and the second insulating layer is etched by a known etching method or a mask including openings corresponding to the second insulating layer pattern is manufactured And a second insulating layer is deposited by chemical vapor deposition (CVD) or physical vapor deposition (PVD) through the mask. The method according to claim 6,
The recessed portion is formed in a region corresponding to the second insulating layer pattern and the convex portion is formed in an area not corresponding to the second insulating layer pattern. 8. The method of claim 7,
Wherein the metal layer is determined according to a shape of the second insulating layer pattern. A circuit board manufactured by the manufacturing method according to any one of claims 1, 3, 4, 6 to 8.

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