KR101570313B1 - Curable resin composition, protective film, and method for forming protective film - Google Patents

Abstract

The present invention relates to a polymer containing a polymerizable unsaturated compound having at least one functional group selected from the group consisting of an oxiranyl group, an oxetanyl group and an allyl group, and a culuride filter containing a functional group capable of cross- And a siloxane oligomer for a protective film of the curable resin composition. According to the present invention, a cured film having a high degree of transparency and surface hardness can be formed on a substrate even if the surface of the substrate is low in planarity, and a square having excellent resistance to heat and pressure, acid resistance, alkali resistance and sputter resistance There is provided a curable resin composition used for forming a protective film for a tooth.
[Index]
A curable resin composition, a polymerizable unsaturated compound, a siloxane oligomer

Description

TECHNICAL FIELD [0001] The present invention relates to a curable resin composition, a protective film, and a method for forming a protective film,

The present invention relates to a curable resin composition, a method for forming a protective film with the composition, and a protective film. More particularly, the present invention relates to a composition for forming a protective film for use in a color filter for a liquid crystal display element (LCD) and a color filter for a charge coupled device (CCD), a method for forming a protective film using the composition, Shielding film.

In a radiation device such as an LCD or a CCD, a display element is immersed in a solvent, an acid, or an alkali solution or the like during its manufacturing process. When the wiring electrode layer is formed by sputtering, the surface of the element is locally exposed to high temperatures. Therefore, in order to prevent the device from being deteriorated or damaged by such a process, a protective film made of a thin film having resistance to these processes is provided on the surface of the device.

Such a protective film is required to have a high adhesion to a substrate or a lower layer on which the protective film is to be formed or to a layer formed on a protective film, to have a smooth and strong film itself, to be transparent, to have high heat resistance and light resistance, Yellowing, whitening and the like, water resistance, solvent resistance, acid resistance and alkali resistance, and the like. As a material for forming a protective film satisfying these various characteristics, for example, a thermosetting composition comprising a polymer having a glycidyl group is known (Japanese Patent Laid-Open Publication No. Hei 5-78453 and Japanese Patent Laid-Open No. 2001 -91732).

When such a protective film is used as a protective film for a color filter of a color liquid crystal display device or a charge coupled device, it is generally required to planarize a stepped portion formed by a color filter formed on a base substrate.

Further, in a color liquid crystal display device, for example, a color liquid crystal display device of the STN (Super Twisted Nematic) method or the TFT (Thin Film Transistor) method, in order to uniformly maintain the cell interval of the liquid crystal layer, And then joining the panels is carried out. Then, the liquid crystal cell is sealed by thermocompression bonding of the sealing material. However, there is a phenomenon in which the protective film of the portion where the bead is present is caused by the heat and pressure applied at this time, and the cell gap is disadvantageously deviated.

Particularly, when manufacturing a color liquid crystal display device of the STN type, since the accuracy of bonding of the color filter and the counter substrate must be very strict, a highly planarization performance of a step and a heat resistance and pressure resistance performance are required for the protective film.

Recently, a method of forming a wiring electrode (indium tin oxide (ITO) or indium zinc oxide (IZO)) on a protective film of a color filter by sputtering and patterning ITO or IZO with an acid or an alkali is also used. Therefore, the surface of the color filter protective film is locally exposed to a high temperature during sputtering, and numerous chemical treatments are performed. Therefore, the patterning characteristics of the wiring electrodes are good and the line width of the ITO or IZO pattern is not thinned more than necessary during these treatments, and the adhesiveness to the wiring electrodes is also improved so that ITO or IZO is not peeled off from the protective film during the chemical treatment Is required.

However, in the above-mentioned adhesion assisting agent for providing adhesion, there is a problem that the inside of the coating machine is contaminated as a charged product at the time of forming a protective film, and maintenance, cleaning and the like are required. Nowadays, from this point of view, not only an adhesion promoter but also a tendency such as low outgassing of a material is also seen. In addition, the patterning characteristics of the wiring electrode are insufficient in the conventional adhesion aids.

For forming such a protective film, it is convenient to use a thermosetting composition having an advantage of being able to form a protective film having excellent hardness by a simple method. However, the protective film resin composition for manifesting the above- And thus has a problem that the shelf life of the composition itself is very short, which makes handling very difficult. That is, not only the coating performance of the composition itself deteriorates over time, but also frequent maintenance and cleaning of the coating machine is required, which is complicated in operation.

Transparency, and the like, as well as a material that can easily form a protective film satisfying various performances as described above and which has excellent storage stability as a composition is not yet known.

Japanese Patent Application Laid-Open (kokai) No. 4-218561 discloses a thermosetting composition containing a latent carboxyl compound used in paints, inks, adhesives and molded products. However, .

DISCLOSURE OF THE INVENTION <

The present invention has been made based on the above-described circumstances, and an object of the present invention is to provide a cured film having a high flatness even on a substrate having a low surface flatness, and being excellent in transparency and surface hardness, , Sputtering resistance and the like, and is preferably used for forming a protective film for a light-shielding film having good patterning characteristics of a wiring electrode, has a small amount of a sublimation generated at the time of forming a protective film, and is excellent in storage stability as a composition, A method for forming a protective film using the composition, and a protective film formed from the composition.

Other objects and advantages of the present invention will be apparent from the following description.

The above objects and advantages of the present invention are attained by firstly providing a polymer comprising a polymerizable unsaturated compound having at least one functional group selected from the group consisting of [A] oxiranyl, oxetanyl and allyl groups, and [B] [A] And a siloxane oligomer containing a functional group capable of undergoing crosslinking reaction by heat.

The above objects and advantages of the present invention are achieved by a method for forming a protective film for a color filter, characterized in that a coating film is formed using the curable resin composition and then heat treatment is performed.

The above objects and advantages of the present invention are achieved by a protective film of a color filter formed of the curable resin composition.

BEST MODE FOR CARRYING OUT THE INVENTION [

Each component of the resin composition of the present invention will be described below.

[A] Copolymer

The [A] copolymer of the present invention is a copolymer containing a repeating unit derived from a polymerizable unsaturated compound having at least one functional group selected from the group consisting of oxiranyl, oxetanyl and allyl groups.

The [A] copolymer is not limited as long as it satisfies the above conditions, and may be any of an addition polymer, a heavy polymer and a polycondensation polymer.

As the preferred polymer (A) in the present invention, for example,

(A) a polymerizable unsaturated compound having at least one functional group selected from the group consisting of an oxiranyl group, an oxetanyl group and an allyl group (hereinafter referred to as "unsaturated compound (a) (A) and (b1) other than the unsaturated carboxylic acid and / or the polymerizable unsaturated polycarboxylic acid anhydride (hereinafter collectively referred to as "unsaturated compound (b1)") (Hereinafter referred to as "copolymer (A1)") of an unsaturated compound (hereinafter referred to as "unsaturated compound (b2)");

(A2) a polymer having at least one functional group selected from the group consisting of at least two oxiranyl groups, oxetanyl groups and allyl groups in the molecule, an acetal ester structure of carboxylic acid, a ketal ester structure of carboxylic acid, A polymer containing at least one structure selected from the group consisting of an alkylcycloalkyl ester structure and a t-butyl ester structure of a carboxylic acid (hereinafter referred to as "polymer (A2)");

(A3) a copolymer of an unsaturated compound (a) and a polymerizable unsaturated compound (hereinafter referred to as "unsaturated compound (b5)") other than the unsaturated compound (a) (Hereinafter referred to as "copolymer (A3)") having no carboxylic acid ester structure, carboxylic acid 1-alkylcycloalkyl ester structure and carboxylic acid t-

And the like.

Examples of the polymer (A2) include (A2-1) an unsaturated compound (a), (b3) an acetal ester structure of a carboxylic acid, a ketal ester structure of a carboxylic acid, a 1-alkylcycloalkyl ester structure of a carboxylic acid, (B4) a polymerizable unsaturated compound containing at least one structure selected from the group consisting of a t-butyl ester structure of a carboxylic acid (hereinafter referred to as " unsaturated compound (b3) (Hereinafter referred to as "copolymer (A2-1)") of a polymerizable unsaturated compound other than the unsaturated compound (b3) (hereinafter referred to as "unsaturated compound (b4)").

The copolymer (A1) may further contain an acetal ester structure of a carboxylic acid, a ketal ester structure of a carboxylic acid, a 1-alkylcycloalkyl ester structure of a carboxylic acid, and a t-butyl ester structure of a carboxylic acid , And the polymer (A2) may further contain a carboxyl group or a carboxylic acid anhydride group.

Examples of the unsaturated compound (a) in the copolymer (A1), the polymer (A2) and the copolymer (A3) include glycidyl (meth) acrylate, glycidyl Epoxycyclohexyl acrylate, glycidyl acrylate, glycidyl acrylate, glycidyl α-n-butyl acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4- Vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, 3-methyl-3- (meth) acroyloxymethyl oxetane, 3- 3-ethyl-3- (meth) acroyloxymethyl oxetane, allyl acrylate, and allyl methacrylate.

These unsaturated compounds (a) can be obtained by reacting a component [A] of the component [B], which will be described later, with a functional group capable of undergoing a crosslinking reaction by heat (hereinafter referred to as a "thermal crosslinking reactor") is a vinyl group, A crosslinking reaction is carried out with the [B] component in the case of a diol, a carboxyl group, a hydroxyl group, a mercapto group, an ureido group, a styryl group or an amino group.

Among these unsaturated compounds (a), glycidyl methacrylate, methacrylic acid-6,7-epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p- (Meth) acroyloxymethyloxetane, 3-ethyl-3- (meth) acroyloxymethyloxetane, allyl methacrylate, and the like, and the heat resistance , And it is preferably used because it increases surface hardness.

The unsaturated compounds (a) may be used alone or in combination of two or more.

As the unsaturated compound (b1) in the copolymer (A1), for example,

Unsaturated carboxylic acids such as (meth) acrylic acid, crotonic acid,? - ethyl acrylic acid,? - n-propyl acrylic acid,? - n-butylacrylic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid and itaconic acid;

Unsaturated polycarboxylic anhydrides such as maleic anhydride, itaconic anhydride, citraconic anhydride, and cis-1,2,3,4-tetrahydrophthalic anhydride

And the like.

These unsaturated compounds (b1) are subjected to a crosslinking reaction with the [B] component when the thermal crosslinking reactor of the component [B] to be described later is an oxiranyl group, an oxetanyl group, an episulfide group, a hydroxyl group, a mercapto group or an amino group .

As the unsaturated carboxylic acid in these unsaturated compounds (b1), acrylic acid and methacrylic acid are particularly preferable, and as the unsaturated polycarboxylic acid anhydride, maleic anhydride is particularly preferable. These preferred unsaturated compounds (b1) are highly effective in copolymerization reactivity and are effective in increasing the heat resistance and surface hardness of the resulting protective film.

The unsaturated compound (b1) may be used alone or in admixture of two or more.

As the unsaturated compound (b2), for example,

(Meth) acrylic acid hydroxyalkyl esters such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate;

(Meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, sec- Butyl (meth) acrylate; and (meth) acrylic acid alkyl esters such as t-butyl (meth) acrylate;

(Meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.O ^{2, 6]} decane-8-one (hereinafter referred to as tricyclo [5.2.1.0 ^2,6] decane-8-one as a box "dicyclopentanyl"), (meth) acrylate, 2-dicyclopentanyl oxyethyl (meth) (meth) acrylate, alicyclic acrylate such as a carbonyl soboro ester;

(Meth) acrylic acid aryl esters such as phenyl (meth) acrylate and benzyl (meth) acrylate;

Unsaturated dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate and diethyl itaconate;

N-phenylmaleimide, N-benzylmaleimide, N-cyclohexylmaleimide, N-succinimidyl-3-maleimide benzoate, N-succinimidyl-4-maleimide butyrate, N- Unsaturated dicarbonylimide derivatives such as 6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate and N- (9-acridyl) maleimide;

(Meth) acrylonitrile,? -Chloroacrylonitrile, vinylidene cyanide compounds such as vinylidene cyanide;

Unsaturated amide compounds such as (meth) acrylamide and N, N-dimethyl (meth) acrylamide;

Aromatic vinyl compounds such as styrene,? -Methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene;

Indene derivatives such as indene and 1-methylindene;

In addition to conjugated diene compounds such as 1,3-butadiene, isoprene and 2,3-dimethyl-1,3-butadiene

Vinyl chloride, vinylidene chloride, vinyl acetate

And the like.

Among these unsaturated compounds (b2), (meth) acrylic acid hydroxyalkyl esters, methyl methacrylate, t-butyl methacrylate, cyclohexyl acrylate, dicyclopentanyl methacrylate, 2-methylcyclohexyl acrylate, Amide, N-cyclohexylmaleimide, styrene, p-methoxystyrene, and 1,3-butadiene. These preferred unsaturated compounds (b2) have a high copolymerization reactivity and are excellent in heat resistance (except for 1,3-butadiene) and surface hardness (except for 1,3-butadiene) It is valid for.

The unsaturated compound (b2) may be used alone or in admixture of two or more.

As specific preferred examples of the copolymer (A1)

Glycidyl acrylate / acrylic acid / dicyclopentanyl acrylate / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / methyl methacrylate / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / cyclohexyl acrylate / p-methoxystyrene copolymer,

Glycidyl acrylate / acrylic acid / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

6,7-epoxyheptyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

6,7-epoxyheptyl methacrylate / acrylic acid / maleic anhydride / styrene copolymer,

Epoxy heptyl methacrylate / acrylic acid / maleic anhydride / t-butyl methacrylate copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / acrylic acid / dicyclopentanil acrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / methyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / cyclohexyl acrylate / p-methoxystyrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / acrylic acid / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Styrene / 1,3-butadiene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate /

3-ethyl-3- (meth) acroyloxymethyloxetane / acrylic acid / maleic anhydride / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / acrylic acid / maleic anhydride / t-butyl methacrylate copolymer,

Allyl methacrylate / acrylic acid / dicyclopentanyl acrylate / styrene copolymer,

Allyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / methacrylic acid / methyl methacrylate / styrene copolymer,

Allyl methacrylate / methacrylic acid / cyclohexyl acrylate / p-methoxystyrene copolymer,

Allyl methacrylate / acrylic acid / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Allyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

Allyl methacrylate / acrylic acid / maleic anhydride / styrene copolymer,

Allyl methacrylate / acrylic acid / maleic anhydride / t-butyl methacrylate copolymer

And the like.

More preferably, among these copolymers (A1)

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Glycidyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Styrene / 1,3-butadiene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate /

3-methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-phenylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

Allyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / methacrylic acid / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Allyl methacrylate / methacrylic acid / di-cyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer

.

In the copolymer (A1), the content of the repeating unit derived from the unsaturated compound (a) is preferably from 10 to 70% by weight, particularly preferably from 20 to 60% by weight, based on the total repeating units. The total content of the repeating units derived from the unsaturated compound (b1) is preferably 5 to 40% by weight, particularly preferably 10 to 30% by weight, based on the total repeating units. The content of the repeating unit derived from the unsaturated compound (b2) is preferably from 10 to 70% by weight, particularly preferably from 20 to 50% by weight, based on the total repeating units.

If the content of the repeating unit derived from the unsaturated compound (a) is less than 10% by weight, the heat resistance and surface hardness of the protective film tend to decrease. On the other hand, if the content exceeds 70% by weight, the storage stability of the composition tends to decrease . If the total content of the repeating units derived from (b1) the polymerizable unsaturated carboxylic acid and the polymerizable unsaturated polycarboxylic acid anhydride is less than 5% by weight, the heat resistance, surface hardness and chemical resistance of the protective film tend to be lowered, On the other hand, if it exceeds 40% by weight, the storage stability of the composition tends to be lowered. If the content of the repeating unit derived from the other polymerizable unsaturated compound (b2) is less than 10% by weight, the storage stability of the composition tends to deteriorate. On the other hand, if it exceeds 70% by weight, the heat resistance and surface hardness There is a tendency.

The polymer (A2) is then selected from the group consisting of an acetal ester structure of a carboxylic acid, a ketal ester structure of a carboxylic acid, a 1-alkylcycloalkyl ester structure of a carboxylic acid, and a t-butyl ester structure of a carboxylic acid It has at least one structure. The polymer (A2) is not particularly limited as long as it meets the above requirements, and may be any of an addition polymer, a heavy polymer, and a polycondensation polymer.

Examples of the group forming the acetal ester structure of the carboxylic acid include 1-methoxyethoxy group, 1-ethoxyethoxy group, 1-n-propoxyethoxy group, 1-i-propoxyethoxy group, Butoxyethoxy group, 1-n-butoxyethoxy group, 1-i-butoxyethoxy group, 1-sec-butoxyethoxy group, 1-cyclohexyloxyethoxy group, 1-norbornyloxyethoxy group, 1-boronyloxyethoxy group, 1-phenyloxyethoxy group, 1- (1-naphthyloxy) (Cyclohexyl) (methoxy) methoxy group, (cyclohexyl) (ethoxy) methoxy group, (cyclohexyl) (n-propoxy) methoxy group , (Cyclohexyl) (phenoxy) methoxy group, (cyclohexyl) (benzyloxy) methoxy group, (cyclohexyl) Phenyl) (methoxy) methoxy group, (phenyl) (ethoxy) methoxy group, (phenyl) (n-propoxy) (Phenyl) (benzyloxy) methoxy group, (benzyl) (methoxy) methoxy group, (phenyl) (cyclohexyloxy) methoxy group, Propoxy) methoxy group, (benzyl) (cyclohexyloxy) methoxy group, (benzyl) (ethoxy) methoxy group, Benzyl) (phenoxy) methoxy group, (benzyl) (benzyloxy) methoxy group, 2-tetrahydrofuranyloxy group and 2-tetrahydropyranyloxy group.

Of these, preferred are 1-ethoxyethoxy group, 1-cyclohexyloxyethoxy group, 2-tetrahydropyranyloxy group, 1-n-propoxyethoxy group and 2-tetrahydropyranyloxy group .

Examples of the group forming the ketal ester structure of the carboxylic acid include 1-methyl-1-methoxyethoxy group, 1-methyl-1-ethoxyethoxy group, Methyl-1-i-butoxyethoxy group, 1-methyl-1-i-butoxyethoxy group, Methyl-1-t-butoxyethoxy group, 1-methyl-1-cyclopentyloxyethoxy group, 1-methyl- Methyl-1-norbornyloxyethoxy group, 1-methyl-1-bornyloxyethoxy group, 1-methyl- Methyl-1-benzyloxyethoxy group, 1-cyclohexyl-1-methoxyethoxy group, 1-cyclohexyl-1- Cyclohexyl-1-cyclohexyloxyethoxy group, 1-cyclohexyl-1-n-propoxyethoxy group, 1-cyclohexyl- 1-cyclohexyl-1-phenoxyethoxy group, 1- Phenyl-1-ethoxyethoxy group, 1-phenyl-1-n-propoxyethoxy group, 1-phenyl-1-methoxyethoxy group, Phenyl-1-i-propoxyethoxy group, 1-phenyl-1-cyclohexyloxyethoxy group, 1-phenyl- 1-benzyl-1-ethoxyethoxy group, 1-benzyl-1-n-propoxyethoxy group, 1-benzyl- 1-cyclohexyloxyethoxy group, 1-benzyl-1-phenyloxyethoxy group, 1-benzyl-1-benzyloxyethoxy group, 2- (2-methyl-tetrahydrofuranyl ) Oxy group, a 2- (2-methyl-tetrahydropyranyl) oxy group, a 1-methoxy-cyclopentyloxy group and a 1-methoxy-cyclohexyloxy group.

Among these, preferred are 1-methyl-1-methoxyethoxy group and 1-methyl-1-cyclohexyloxyethoxy group.

Examples of the group forming a 1-alkylcycloalkyl ester structure of a carboxylic acid in combination with a carboxyl group include 1-methylcyclopropyl group, 1-methylcyclobutyl group, 1-methylcyclopentyl group, 1-methylcyclohexyl Methylcyclohexyl group, 1-methylcyclohexyl group, 1-methylcyclodecyl group, 1-ethylcyclopropyl group, 1-ethylcyclobutyl group, 1-ethylcyclopentyl group Ethyl cyclohexyl group, 1-ethylcyclohexyl group, 1-ethylcyclooctyl group, 1-ethylcyclononyl group, 1-ethylcyclodecyl group, 1- (isopropylcyclopropyl group, 1- Propylcyclohexyl group, a 1- (isopropyl) cyclohexyl group, a 1- (iso) propylcyclohexyl group, a 1- (iso) propylcyclopentyl group, (1-propylcyclohexyl) group, a 1- (iso) butylcyclohexyl group, a 1- Butyl cyclohexyl group, 1- (iso) butylcyclohexyl group, 1- (iso) butylcyclooctyl group, 1- (iso) butylcyclooctyl group, 1- Pentylcyclopentyl group, 1- (iso) pentylcyclohexyl group, 1- (iso) pentylcyclohexyl group, 1- (Iso) pentylcyclohexyl group, a 1- (iso) pentylcyclohexyl group, a 1- (iso) pentylcyclohexyl group, a 1- (Iso) hexylclohexyl group, 1- (iso) hexylclohexyl group, 1- (iso) hexylclohexyl group, 1- (Iso) heptylcyclohexyl group, a 1- (iso) heptylcyclohexyl group, a 1- (iso) heptylcyclohexyl group, a 1- (Iso) heptylcyclohexyl group, a 1- (iso) heptylcycloheptyl group, a 1- (iso) heptylcyclooctyl group, a 1- 1 - (isooctyl) cyclopentyl group, 1 - (iso) octylcyclopentyl group, 1 - (isooctyl) cyclopentyl group, (Iso) octylcyclohexyl group, 1- (iso) octylcyclohexyl group, 1- (iso) octylcyclohexyl group, 1- .

The polymer (A2) can provide a one-pack type curable resin composition (?) That has better storage stability than the case of using the copolymer (A1) and also has an excellent planarizing ability of the resulting protective film.

Examples of the unsaturated compound (b3) in the copolymer (A2-1) include norbornene compounds having an acetal ester structure of a carboxylic acid or a ketal ester structure of a carboxylic acid, acetal, ketal or 1- (Meth) acrylic acid ester compound having an alkylcycloalkyl ester structure, and t-butyl (meth) acrylate.

Specific examples of the norbornene compound having an acetal ester structure or a ketal ester structure include 2,3-di-tetrahydropyran-2-yloxycarbonyl-5-norbornene,

2,3-di-trimethylsilanyloxycarbonyl-5-norbornene, 2,3-

2,3-di-triethylsilanyloxycarbonyl-5-norbornene, 2,3-

2,3-di-t-butyldimethylsilanyloxycarbonyl-5-norbornene, 2,3-

2,3-di-trimethylgermyloxycarbonyl-5-norbornene, 2,3-

2,3-di-triethylgermyloxycarbonyl-5-norbornene, 2,3-

2,3-di-t-butyldimethylgermyloxycarbonyl-5-norbornene, 2,3-

2,3-di-t-butyloxycarbonyl-5-norbornene, 2,3-

2,3-di-benzyloxycarbonyl-5-norbornene, 2,3-

2,3-di-tetrahydrofuran-2-yloxycarbonyl-5-norbornene,

2,3-di-tetrahydropyran-2-yloxycarbonyl-5-norbornene,

2,3-di-cyclobutyloxycarbonyl-5-norbornene, 2,3-

2,3-di-cyclopentyloxycarbonyl-5-norbornene, 2,3-

2,3-di-cyclohexyloxycarbonyl-5-norbornene, 2,3-

2,3-di-cycloheptyloxycarbonyl-5-norbornene, 2,3-

2,3-di-1-methoxyethoxycarbonyl-5-norbornene, 2,3-

2,3-di-1-t-butoxyethoxycarbonyl-5-norbornene,

2,3-di-1-benzyloxyethoxycarbonyl-5-norbornene, 2,3-

2,3-di- (cyclohexyl) (ethoxy) methoxycarbonyl-5-norbornene,

2,3-di-1-methyl-1-methoxyethoxycarbonyl-5-norbornene,

2,3-di-1-methyl-1-i-butoxyethoxycarbonyl-5-norbornene,

2,3-di- (benzyl) (ethoxy) methoxycarbonyl-5-norbornene and the like;

Specific examples of the (meth) acrylic acid ester compound having an acetal ester or ketal ester structure include 1-ethoxyethyl (meth) acrylate, tetrahydro-2H-pyran- 1 - (1,1-dimethyl-ethoxy) ethyl (meth) acrylate, 1 - (2-methylpropoxy) ethyl (meth) acrylate, - (cyclohexyloxy) ethyl (meth) acrylate, and the like.

As specific examples of the (meth) acrylic acid ester compound having the 1-alkylcycloalkyl ester structure,

(Meth) acrylate, 1-methylcyclohexyl (meth) acrylate, 1-methylcyclohexyl (meth) acrylate, 1-methylcyclopentyl (Meth) acrylate, 1-methylcyclopentyl (meth) acrylate, 1-methylcyclopentyl (meth) acrylate, (Meth) acrylate, 1-ethylcyclohexyl (meth) acrylate, 1-ethylcyclohexyl (meth) acrylate, 1-ethylcyclopentyl (Meth) acrylate, 1-ethylcyclohexyl (meth) acrylate, 1-ethylcyclodecyl (meth) acrylate, 1- ) Acrylate, 1- (iso) propylcyclopentyl (meth) acrylate Propylcyclohexyl (meth) acrylate, 1- (isopropyl) cyclohexyl (meth) acrylate, 1- (Meth) acrylate, 1- (iso) butylcyclohexyl (meth) acrylate, 1- (iso) butylcyclopentyl Butyl cyclohexyl (meth) acrylate, 1- (iso) butyl cyclohexyl (meth) acrylate, 1- (iso) butyl cyclohexyl (Meth) acrylate, 1 - (iso) pentylcyclopentyl (meth) acrylate, 1 - - (iso) pentylcyclobutyl (meth) acrylate, 1- (iso) pentylcyclopentyl (meth) (Meth) acrylate, 1- (iso) pentylcyclohexyl (meth) acrylate, 1- (iso) pentylcyclohexyl - (iso) pentyl cyclodecyl (meth) acrylate,

(Meth) acrylate, 1- (iso) hexyl chloropropyl (meth) acrylate, 1- (iso) hexyl cobutyl (Meth) acrylate, 1- (iso) hexylcyclohexyl (meth) acrylate, 1- (iso) hexylcyclohexyl Meth) acrylate,

(Meth) acrylate, 1- (iso) heptylcyclopentyl (meth) acrylate, 1- (iso) heptylcyclohexyl (Meth) acrylate, 1- (iso) heptylcyclohexyl (meth) acrylate, 1- (iso) heptylcyclohexyl (Iso) heptylcyclodecyl (meth) acrylate,

(Meth) acrylates such as 1- (iso) octylcyclopropyl (meth) acrylate, 1- (iso) octylcyclobutyl (Meth) acrylate, 1- (iso) octylcyclohexyl (meth) acrylate, 1- (iso) octylcyclohexyl (Iso) octyl cyclodecyl (meth) acrylate, and the like.

Of these, 1-ethylcyclopentyl (meth) acrylate, 1-ethylcyclohexyl (meth) acrylate, 1- (isopropyl) cyclopentyl (meth) (Meth) acrylate, 1- (isobutyl) butylcyclopentyl (meth) acrylate and 1- (iso) butylcyclohexyl (meth) acrylate are preferably used, and more preferred are 1-ethylcyclopentyl 1-ethylcyclohexyl (meth) acrylate, and particularly preferred are 1-ethylcyclopentyl (meth) acrylate and 1-ethylcyclohexyl (meth) acrylate. These are preferably used from the viewpoints of copolymerization reactivity, heat resistance of the resulting protective film, and improvement of storage stability of the composition solution.

Of these, acetal esters of carboxylic acids, ketal esters or (meth) acrylic acid ester compounds having a 1-alkylcycloalkyl ester structure and t-butyl (meth) acrylate are preferable, and 1-ethoxyethyl methacrylate Methyl methacrylate, 1- (1,1-dimethyl) ethyl methacrylate, 1- (2-methylpropoxy) 1-ethylcyclohexyl (meth) acrylate, 1-ethylcyclohexyl (meth) acrylate, t-butyl methacrylate Is particularly preferable.

These preferred unsaturated compounds (b3) are effective in providing a one-pack type curing resin composition having high copolymerization reactivity, excellent storage stability and planarizing ability of a protective film, and enhancing the heat resistance and surface hardness of the resulting protective film.

The unsaturated compound (b3) may be used alone or in admixture of two or more.

Examples of the unsaturated compound (b4) include the same compounds as those exemplified for the unsaturated compound (b1) and the unsaturated compound (b2).

Among these unsaturated compounds (b4), methyl methacrylate, cyclohexyl acrylate, dicyclopentanyl methacrylate, 2-methylcyclohexyl acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, styrene, p- 1,3-butadiene and the like are preferable. These preferable unsaturated compounds (b4) have a high copolymerization reactivity and are excellent in heat resistance (except for 1,3-butadiene) and surface hardness (except for 1,3-butadiene) of the obtained protective film It is valid for.

The unsaturated compound (b4) may be used alone or in combination of two or more.

As specific preferred examples of the copolymer (A2-1)

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Methacrylic acid glycidyl / acrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / di-cyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / methyl methacrylate / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / methyl methacrylate / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / cyclohexyl acrylate / p-methoxystyrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / cyclohexyl acrylate / p-methoxystyrene copolymer,

Glycidyl acrylate / t-butyl methacrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Methacrylic acid 6,7-epoxyheptyl / acrylate tetrahydro-2H-pyran-2-yl / methacrylic acid t-butyl / maleic anhydride copolymer,

Methacrylic acid 6,7-epoxyheptyl / methacrylic acid tetrahydro-2H-pyran-2-yl / methacrylic acid-t-butyl / maleic anhydride copolymer,

Epoxy heptyl methacrylate / t-butyl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Epoxy heptyl methacrylate / t-butyl methacrylate / maleic anhydride / styrene copolymer,

Methacrylic acid glycidyl / acrylic acid 1- (cyclohexyloxy) ethyl / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

Glycidyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / di-cyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer

Glycidyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Glycidyl methacrylate / 1-ethylcyclopentyl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclohexyl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / dicyclopentanyl methacrylate / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methyl-3-ethyl-3- (meth) acroyloxymethyloxetane / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Acrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Acryloyloxymethyloxetane / acrylic acid 1- (cyclohexyloxy) ethyl / dicyclopentanyl methacrylate / styrene copolymer, 3-ethyl-3-

(Cyclohexyloxy) ethyl methacrylate / dicyclopentanyl methacrylate / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Acryloyloxymethyloxetane / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-

(Meth) acroyloxymethyloxetane / 1- (cyclohexyloxy) ethyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Acrylonitrile, 3-ethyl-3- (meth) acroyloxymethyloxetane / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

(Meth) acroyloxymethyloxetane / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer ,

Acrylic acid tetrahydro-2H-pyran-2-yl / dicyclopentanyl methacrylate / 1,3-butadiene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Butyl methacrylate / dicyclopentanyl methacrylate / 1,3-butadiene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane / methacrylic acid tetrahydro-

(Meth) acroyloxymethyloxetane / acrylate tetrahydro-2H-pyran-2-yl / methyl methacrylate / styrene copolymer,

Methyl-3-ethyl-3- (meth) acroyloxymethyloxetane / tetrahydro-2H-pyran-2-yl methacrylate / methyl methacrylate / styrene copolymer,

Acryloyloxymethyloxetane / acrylic acid tetrahydro-2H-pyran-2-yl / acryloylcyclohexyl / p-methoxystyrene copolymer,

Acryloyloxymethyloxetane / methacrylic acid tetrahydro-2H-pyran-2-yl / acryloylcyclohexyl / p-methoxystyrene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / N-phenylmaleimide / styrene copolymer,

Ethyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / methacrylic acid t-butyl / maleic anhydride copolymer, 3-methyl-3- (meth) acroyloxymethyloxetane /

Methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid tetrahydro-2H-pyran-2-yl / methacrylic acid t-butyl / maleic anhydride copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / maleic anhydride / styrene copolymer,

Styrene / 1,3-butadiene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane / acrylic acid 1- (cyclohexyloxy) ethyl methacrylate / dicyclopentanyl methacrylate / styrene /

(Meth) acryloyloxymethyloxetane / 1- (cyclohexyloxy) ethyl methacrylate / di-cyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / acrylate tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / acrylate tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / 1,3-butadiene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / methyl methacrylate / styrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / methyl methacrylate / styrene copolymer,

Allyl methacrylate / acrylate tetrahydro-2H-pyran-2-yl / cyclohexyl acrylate / p-methoxystyrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / cyclohexyl acrylate / p-methoxystyrene copolymer,

Allyl methacrylate / t-butyl methacrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / dicyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer,

Allyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / di-cyclopentanyl methacrylate / styrene / 1,3-butadiene copolymer

Allyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Allyl methacrylate / 1-ethylcyclopentyl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / 1-ethylcyclohexyl acrylate / di-cyclopentanyl methacrylate / styrene copolymer

And the like.

Among these copolymers (A2-1), more preferably,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Methacrylic acid glycidyl / acrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1- (cyclohexyloxy) ethyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer,

* Glycidyl methacrylate / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer

Glycidyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Glycidyl methacrylate / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclohexyl methacrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / dicyclopentanyl methacrylate / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methyl-3-ethyl-3- (meth) acroyloxymethyloxetane / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Acrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-3- (meth) acroyloxymethyloxetane /

Acryloyloxymethyloxetane / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer, 3-ethyl-

(Meth) acroyloxymethyloxetane / 1- (cyclohexyloxy) ethyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Acrylonitrile, 3-ethyl-3- (meth) acroyloxymethyloxetane / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

(Meth) acroyloxymethyloxetane / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer ,

Ethyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid polymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl methacrylate / N-phenylmaleimide / styrene copolymer,

Ethyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer, 3-methyl-3- (meth) acroyloxymethyloxetane /

Methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Acrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer, 3-methyl-3- (meth) acroyloxymethyloxetane /

Methyl-3- (meth) acroyloxymethyloxetane / methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

(Meth) acroyloxymethyloxetane / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Acryloyloxymethyloxetane / methacrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer, 3-methyl-

Acrylonitrile copolymer, 3-methyl-3- (meth) acroyloxymethyloxetane / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate /

(Tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer (3-methyl-3- ,

Methyl-3- (meth) acroyloxymethyloxetane / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclohexyl methacrylate / N-phenylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl acrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / tetrahydro-2H-pyran-2-yl methacrylate / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / acrylate tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / acrylate tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid tetrahydro-2H-pyran-2-yl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / acrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / methacrylic acid 1- (cyclohexyloxy) ethyl / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / 2,3-di (tetrahydropyran-2-yloxycarbonyl) -5-norbornene / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / t-butyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclohexyl acrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclopentyl acrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer,

Allyl methacrylate / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclohexyl methacrylate / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / 1-ethylcyclopentyl methacrylate / N-phenylmaleimide / styrene / methacrylic acid copolymer

.

In the copolymer (A2-1), the content of the repeating unit derived from the unsaturated compound (a) is preferably from 10 to 70% by weight, particularly preferably from 20 to 60% by weight, based on the total repeating units. If the content of the repeating unit derived from the unsaturated compound (a) is less than 10% by weight, the heat resistance and surface hardness of the protective film tend to decrease. On the other hand, when the content exceeds 70% by weight, the storage stability of the composition tends to decrease.

The content of the repeating unit derived from the unsaturated compound (b3) is preferably 5 to 60% by weight, particularly preferably 10 to 50% by weight. When the content of the repeating unit derived from the unsaturated compound (b3) falls within this range, good heat resistance and surface hardness of the protective film can be realized.

The content of the repeating unit derived from the unsaturated compound (b4) is an amount obtained by subtracting the total content of the repeating units derived from the unsaturated compound (a) and the unsaturated compound (b3) from 100 wt% In the case of using an unsaturated carboxylic acid or an unsaturated polycarboxylic acid anhydride as the component (A), the storage stability of the composition may be impaired if the total content of the repeating units derived therefrom exceeds 40% by weight. .

Subsequently, examples of the unsaturated compound (b5) in the copolymer (A3) include the same compounds as those exemplified for the unsaturated compound (b2).

Of these unsaturated compounds (b5), methyl methacrylate, cyclohexyl acrylate, dicyclopentanyl methacrylate, 2-methylcyclohexyl acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, styrene, p-methoxystyrene , 1,3-butadiene, and the like. These preferable unsaturated compounds (b5) have a high copolymerization reactivity and are excellent in heat resistance (except for 1,3-butadiene) and surface hardness (except for 1,3-butadiene) of the resulting protective film It is valid for.

The unsaturated compound (b5) may be used alone or in admixture of two or more.

As specific preferred examples of the copolymer (A3)

Glycidyl acrylate / styrene copolymer,

Glycidyl methacrylate / styrene copolymer,

Glycidyl acrylate / dicyclopentyl methacrylate copolymer,

Glycidyl methacrylate / dicyclopentyl methacrylate copolymer,

6,7-epoxyheptyl methacrylate / styrene copolymer,

Glycidyl methacrylate / di-cyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / N-phenylmaleimide / styrene copolymer,

Glycidyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

6,7-epoxyheptyl methacrylate / dicyclopentyl methacrylate copolymer,

6,7-epoxyheptyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / styrene copolymer,

Allyl methacrylate / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / dicyclopentyl methacrylate copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / dicyclopentyl methacrylate copolymer,

Allyl methacrylate / dicyclopentyl methacrylate copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / dicyclopentanyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / dicyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / di-cyclopentanyl methacrylate / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / N-phenylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / N-phenylmaleimide / styrene copolymer,

Allyl methacrylate / N-phenylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / N-cyclohexylmaleimide / styrene copolymer,

Glycidyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / N-cyclohexylmaleimide / styrene copolymer

And the like.

More preferably, among these copolymers (A3)

Glycidyl methacrylate / styrene copolymer,

Glycidyl methacrylate / dicyclopentyl methacrylate copolymer,

Glycidyl methacrylate / di-cyclopentanyl methacrylate / styrene copolymer,

Glycidyl methacrylate / N-cyclohexylmaleimide / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / dicyclopentyl methacrylate copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / dicyclopentanyl methacrylate / styrene copolymer,

3-methyl-3- (meth) acroyloxymethyloxetane / N-cyclohexylmaleimide / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / dicyclopentyl methacrylate copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / dicyclopentanyl methacrylate / styrene copolymer,

3-ethyl-3- (meth) acroyloxymethyloxetane / N-cyclohexylmaleimide / styrene copolymer,

Allyl methacrylate / styrene copolymer,

Allyl methacrylate / dicyclopentyl methacrylate copolymer,

Allyl methacrylate / di-cyclopentanyl methacrylate / styrene copolymer,

Allyl methacrylate / N-cyclohexylmaleimide / styrene copolymer

.

In the copolymer (A3), the content of the repeating unit derived from the unsaturated compound (a) is preferably 1 to 90% by weight, particularly preferably 40 to 90% by weight, based on the total repeating units.

If the content of the repeating unit derived from the unsaturated compound (a) is less than 1% by weight, the heat resistance and surface hardness of the protective film tend to decrease. On the other hand, if the content exceeds 90% by weight, the heat resistance and the storage stability of the composition tend to deteriorate have.

The copolymer [A] preferably has a weight average molecular weight (hereinafter may be referred to as "Mw ") in terms of polystyrene measured by gel permeation chromatography (dissolution solvent tetrahydrofuran), preferably 1,000 to 100,000, Is from 2,000 to 50,000, particularly preferably from 3,000 to 40,000. If the Mw is less than 1,000, the coating property of the composition becomes insufficient or the heat resistance of the formed protective film may be insufficient. On the other hand, when the Mw exceeds 100,000, the planarization performance may become insufficient.

The molecular weight distribution (Mw / Mn) of the copolymer (A) is preferably 5.0 or less, more preferably 3.0 or less.

Such a copolymer is obtained by copolymerizing the polymerizable unsaturated compound (a) and (b1) to (b5) in the presence of a suitable solvent and a suitable polymerization initiator in a known manner, for example, by radical polymerization can do.

[B] Component

The component [B] used in the present invention is a siloxane oligomer having a functional group capable of undergoing a crosslinking reaction by heat with the above-mentioned [A] component. Preferably, the alkoxysilane represented by each of the following general formulas Followed by decomposition.

[Chemical Formula 1]

Si (R ¹ ) ₁ (R ² ) _m (OR ³ ) _n

(Wherein R ¹ is an oxiranyl group, an oxetanyl group, an episulfide group, a vinyl group, an allyl group, a (meth) acryloyl group, a carboxyl group, a hydroxyl group, a mercapto group, an isocyanate group, R ² and R ³ may be the same or different and each is a hydrogen atom or a monovalent organic group; l and n are each an integer of 1 to 3; and m is an integer of 0 to 2 Provided that l + m + n = 4)

(2)

Si (R ⁴ ) _x (OR ⁵ ) _4-x

(Wherein R ⁴ and R ⁵ may be the same or different and are each a monovalent organic group and x is an integer of 0 to 3)

It should be understood that the hydrolyzate includes hydrolyzed all of the hydrolyzable portion of the raw material, and some of the hydrolyzate is hydrolyzed and partially hydrolyzed.

Specific examples of the compound (1) containing an oxiranyl group include 3-glycidoxymethyltrimethoxysilane, 3-glycidoxymethyl triethoxysilane, 3-glycidoxymethyl tri-n-propyloxysilane, 3 -Glycidoxymethyl tri-i-propyloxysilane, 3-glycidoxymethyl triacetoxysilane, 3-glycidoxymethyl methyldimethoxysilane, 3-glycidoxymethyl methyldiethoxysilane, 3- Propyloxysilane, 3-glycidoxymethylmethyldi-i-propyloxysilane, 3-glycidoxymethylmethyldiacetoxysilane, 3-glycidoxymethylethyldimethoxysilane, 3 -Glycidoxymethylethyldiethoxysilane, 3-glycidoxymethylethyldi-n-propyloxysilane, 3-glycidoxymethylethyldi-i-propyloxysilane, 3-glycidoxymethylethyldiacetoxy Silane, 3-glycidoxymethylphenyldimethoxysilane, 3-glycidoxymethylphenyldiethoxysilane, 3-glycidoxymethylphenyl di-n-propyloxy Silane, 3-glycidoxymethylphenyl di-i-propyloxysilane, 3-glycidoxymethylphenyl diacetoxysilane, 3-glycidoxyethyltrimethoxysilane, 3-glycidoxyethyltriethoxysilane, 3 Glycidoxyethyl tri-n-propyloxysilane, 3-glycidoxyethyl tri-i-propyloxysilane, 3-glycidoxyethyltriacetoxysilane, 3-glycidoxyethylmethyldimethoxysilane, 3 -Glycidoxyethylmethyldiethoxysilane, 3-glycidoxyethylmethyldi-n-propyloxysilane, 3-glycidoxyethylmethyldi-i-propyloxysilane, 3-glycidoxyethylmethyldiacetoxy Silane, 3-glycidoxy ethyl ethyl dimethoxy silane, 3-glycidoxyethyl ethyl diethoxy silane, 3-glycidoxyethyl ethyl di-n-propyloxy silane, 3- glycidoxyethyl ethyl di- 3-glycidoxyethyldiacetoxysilane, 3-glycidoxyethylphenyldimethoxysilane, 3-glycidoxyethylphenyldiethoxysilane, 3-glycidoxyethyldiacetoxysilane, -Glycidoxyphenyl di-n-propyloxysilane, 3-glycidoxyphenyldi-i-propyloxysilane, 3-glycidoxyethylphenyldiacetoxysilane, 3- glycidoxypropyltrimethoxy Silane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltri-n-propyloxysilane, 3-glycidoxypropyltri-i-propyloxysilane, 3- glycidoxypropyltriacetoxy Silane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldi-n-propyloxysilane, 3-glycidoxypropylmethyldi-i- Glycidoxypropylethyldiethoxysilane, 3-glycidoxypropylethyldiethoxysilane, 3-glycidoxypropylethyldiacetoxysilane, 3-glycidoxypropylethyldimethoxysilane, 3-glycidoxypropylethyldiethoxysilane, 3- glycidoxypropylethyldi- Oxysilane, 3-glycidoxypropylethyldi-i-propyloxysilane, 3-glycidoxypropylethyldiacetoxysilane, 3- 3-glycidoxypropyldiethoxysilane, 3-glycidoxypropylphenyldi-n-propyloxysilane, 3-glycidoxypropylphenyldi-i-propyloxysilane, 3-glycidoxypropyldimethoxysilane, 2- (3,4-epoxycyclohexyl) methyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) methyltriethoxysilane, 2- (3,4-epoxycyclohexyl) methylmethyldimethoxysilane, 2 (3,4-epoxycyclohexyl) methyltriethoxysilane, 2-ethylhexylcyclohexylmethyltrimethoxysilane, (3,4-epoxycyclohexyl) methyl methyldiethoxysilane, 2- (3,4-epoxycyclohexyl) methyl methyldi-n-propyloxysilane, 2- (3,4-epoxycyclohexyl) methylethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) methylethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) Methylethyldi-n-propyloxysilane, 2- (3,4-epoxycyclohexyl) methylethyldiacetoxysilane, 2- (3,4-epoxycyclohexyl) methylphenyldimethoxysilane, 2- (3,4-epoxycyclohexyl) methylphenyldiethoxysilane, Propyloxysilane, 2- (3,4-epoxycyclohexyl) methylphenyl diacetoxysilane, 2- (3,4-epoxycyclohexyl) ethyl tri (3,4-epoxycyclohexyl) ethyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltri-n-propyloxysilane, 2- (3,4-epoxycyclohexyl) ethylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethylmethyldiethoxysilane, 2- (3,4-epoxy Propyloxysilane, 2- (3,4-epoxycyclohexyl) ethylmethyldiacetoxysilane, 2- (3,4-epoxycyclohexyl) ethylethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethylethyldiethoxysilane, 2- (3,4- Propyloxysilane, 2- (3,4-epoxycyclohexyl) ethylethyldiacetoxysilane, 2- (3,4-epoxycyclohexyl) ethylphenyldimethoxysilane, 2 - (3,4-epoxycyclohexyl) ethylphenyl diethoxy silane, 2- (3,4-epoxycyclohexyl) ethylphenyl di- (3,4-epoxycyclohexyl) propyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) propyltriethoxysilane, 2- (3,4-epoxycyclohexyl) (3,4-epoxycyclohexyl) propyltriacetoxysilane, 2- (3,4-epoxycyclohexyl) propylmethyldimethoxysilane, 2- (3,4- Epoxycyclohexyl) propylmethyl diethoxysilane, 2 (3,4-epoxycyclohexyl) propylmethyl di-n-propyloxysilane, 2- - (3,4-epoxycyclohexyl) propyl ethyl dimethoxy Propyloxysilane, 2- (3,4-epoxycyclohexyl) propylethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) propylethyldi- Propylphenyldimethoxysilane, 2- (3,4-epoxycyclohexyl) propylphenyldiethoxysilane, 2- (3,4-epoxycyclohexyl) Propyloxysilane, 2- (3,4-epoxycyclohexyl) propylphenyldiacetoxysilane, and the like;

Specific examples of the compound (1) containing an episulfide group include 2,3-epithiopropyloxymethyltrimethoxysilane, 2,3-epithiopropyloxymethyltriethoxysilane, 2,3-epithiopropyloxy Methyltri-n-propyloxysilane, 2,3-epithiopropyloxymethyltri-i-propyloxysilane, 2,3-epithiopropyloxymethyltriacetoxysilane, 2,3-epithiopropyloxymethylmethyl Dimethyloxymethylmethyldiethoxysilane, 2,3-epithiopropyloxymethylmethyldi-n-propyloxysilane, 2,3-epithiopropyloxymethylmethyldi-i- Propyloxymethylmethyldiacetoxysilane, 2,3-epithiopropyloxymethylethyldimethoxysilane, 2,3-epithiopropyloxymethylethyldiethoxysilane, 2,3-epithiopropyloxymethylmethyldiethoxysilane, 2,3-epithiopropyloxymethyldiethoxysilane, 2,3- -Epithiopropyloxymethylethyldi-n-propyloxysilane, 2,3-epithiopropyloxymethylethyldi-i-propyloxysilane, 2 , 3-epithiopropyloxymethylethyldiacetoxysilane, 2,3-epithiopropyloxymethylphenyldimethoxysilane, 2,3-epithiopropyloxymethylphenyldiethoxysilane, 2,3-epithiopropyloxymethylphenyl di n-propyloxysilane, 2,3-epithiopropyloxymethylphenyldi-i-propyloxysilane, 2,3-epithiopropyloxymethylphenyldiacetoxysilane, 2,3-epithiopropyloxyethyltrimethoxy Silane, 2,3-epithiopropyloxyethyltriethoxysilane, 2,3-epithiopropyloxyethyltri-n-propyloxysilane, 2,3-epithiopropyloxyethyltri-i-propyloxysilane, 2,3-epithiopropyloxyethyltriacetoxysilane, 2,3-epithiopropyloxyethylmethyldimethoxysilane, 2,3-epithiopropyloxyethylmethyldiethoxysilane, 2,3-epithiopropyloxy Ethylmethyl di-n-propyloxysilane, 2,3-epithiopropyloxyethylmethyldi-i-propyloxysilane, 2,3- Epoxycyclohexylmethyldiethoxysilane, thiopropyloxyethylmethyldiacetoxysilane, 2,3-epithiopropyloxyethylethyldimethoxysilane, 2,3-epithiopropyloxyethylethyldiethoxysilane, 2,3-epithiopropyloxyethylethyldi- n-propyloxysilane, 2,3-epithiopropyloxyethylethyldi-i-propyloxysilane, 2,3-epithiopropyloxyethylethyldiacetoxysilane, 2,3-epithiopropyloxyethylphenyldimeth N-propyloxysilane, 2,3-epithiopropyloxyethylphenyldiethoxysilane, 2,3-epithiopropyloxyphenyldi-n-propyloxysilane, 2,3-epithiopropyloxyethylphenyldi-i-propyl Oxysilane, 2,3-epithiopropyloxyethylphenyldiacetoxysilane, 2,3-epithiopropyloxypropyltrimethoxysilane, 2,3-epithiopropyloxypropyltriethoxysilane, 2,3- Epithiopropyloxypropyltri-n-propyloxysilane, 2,3-epithiopropyloxypropyltri-i-propyloxysilane, 2,3-epithiopropyloxypropyltriacetoxysilane, 2,3-epithiopropyloxypropylmethyldimethoxysilane, 2,3-epithiopropylpropylmethyldiethoxysilane, 2,3-epithiopropyloxy Propyloxysilane, 2,3-epithiopropyloxymethyldi-i-propyloxysilane, 2,3-epithiopropyloxymethyldiacetoxysilane, 2,3-epithiopropylsilane, Propyloxypropylethyldiethoxysilane, 2,3-epithiopropylpropylethyldiethoxysilane, 2,3-epithiopropylpropylethyldi-n-propyloxysilane, 2,3-epithiopropylpropylethyldi propyloxypropylethyldiacetoxysilane, 2,3-epithiopropylpropylphenyldimethoxysilane, 2,3-epithiopropylpropylphenyldiethoxysilane, 2,3-epithiopropyloxydiphenyldimethoxysilane, 2,3-epithiopropyloxyphenyldi-n-propyloxysilane, 2,3-epithiopropyl Propyloxyphenyl di-i-propyloxysilane, 2,3-epithiopropyloxyphenyldiacetoxysilane, and the like;

Specific examples of the oxetanyl group-containing compound (1) include (oxetan-3-yl) methyltrimethoxysilane, (oxetan-3-yl) methyltriethoxysilane, (Oxetan-3-yl) methyl methyl-1-propyloxysilane, (oxetan-3-yl) methyltriacetoxysilane, (Oxetan-3-yl) methylmethyldiethoxysilane, (oxetan-3-yl) methylmethyldi-n-propyloxysilane, (Oxetan-3-yl) methylethyldiethoxysilane, (oxetan-3-yl) methylethyldimethoxysilane, (oxetan- (Oxetan-3-yl) methylethyldiacetoxysilane, (oxetan-3-yl) methylethyldi- (Oxetan-3-yl) methylphenyldimethoxysilane, (oxetan-3-yl) methylphenyldiethoxysilane, Silane, (oxetan-3-yl) methylphenyl di-i-propyloxysilane, (oxetan-3-yl) methylphenyl diacetoxysilane, Propyloxysilane, (oxetan-3-yl) ethyltri-i-propyloxysilane, (oxetane-3-yl) ethyltriethoxysilane, (Oxetan-3-yl) ethylmethyldimethoxysilane, (oxetan-3-yl) ethylmethyldiethoxysilane, (oxetan- -Propyloxysilane, (oxetan-3-yl) ethylmethyldi-i-propyloxysilane, (oxetan-3- yl) ethylmethyldiacetoxysilane, Silane, (oxetan-3-yl) ethylethyldiethoxysilane, (oxetan-3-yl) ethylethyldi-n-propyloxysilane, (oxetan- Silane, (oxetan-3-yl) ethylethyldiacetoxysilane, (oxetan-3-yl) ethylphenyldimethoxysilane, (oxetan- (Oxetan-3-yl) ethylphenyl di-i-propyloxysilane, (oxetan-3-yl) ethylphenyl diacetoxysilane, (Oxetane-3-yl) propyltrimethoxysilane, (oxetan-3-yl) propyltriethoxysilane, (Oxetan-3-yl) propyltriacetoxysilane, (oxetan-3-yl) propylmethyldimethoxysilane, (oxetan-3-yl) propylmethyl Propyloxysilane, (oxetan-3-yl) propylmethyldi-i-propyloxysilane, (oxetan-3-yl) propylmethyl (Oxetan-3-yl) propylethyldimethoxysilane, (oxetan-3-yl) propylethyldiethoxysilane, (oxetan- (Oxetan-3-yl) propylethyldiacetoxysilane, (oxetan-3-yl) (Oxetan-3-yl) propylphenyldimethoxysilane, (oxetan-3-yl) propylphenyldiethoxysilane, (3-methyloxetan-3-yl) methyltrimethoxysilane, (3-methyloxetane), 3-yl) methyltriethoxysilane, (3-methyloxetan-3-yl) methyltri-n-propyloxysilane, , (3-methyloxetan-3-yl) methyltriacetoxysilane, (3-methyloxetan-3-yl) methylmethyldimethoxysilane, Silane, (3-methyloxetan-3-yl) methylmethyl di-n-propyloxysilane, (3-methyloxetan- (3-methyloxetan-3-yl) methylethyldiethoxysilane, (3-methyloxetan-3-yl) methylethyldimethoxysilane, jade (3-methyloxetan-3-yl) methyl ethyldi-n-propyloxysilane, (3-methyloxetan-3-yl) methylphenyldimethoxysilane, (3-methyloxetan-3-yl) methylphenyldiethoxysilane, (3-methyloxetan-3-yl) methylphenyl diacetoxysilane, (3-methyloxetane-3-yl) methylphenyl di- (3-methyloxetan-3-yl) ethyltrimethoxysilane, (3-methyloxetan-3-yl) ethyltriethoxysilane, (3-methyloxetan-3-yl) ethyltriacetoxysilane, (3-methyloxetan-3-yl) ethylmethyldimethoxy Silane, (3-methyloxetan-3-yl) ethylmethyldiethoxysilane, (3-methyloxetan-3-yl) ethylmethyldihydroxypropyloxysilane, ) Ethyl methyl di-n- (3-methyloxetan-3-yl) ethylmethyldiacetoxysilane, (3-methyloxetan-3-yl) ethylethyldimethoxysilane, (3-methyloxetan-3-yl) ethylethyldi-i-propyloxysilane, (3-methyloxetan- (3-methyloxetan-3-yl) ethylphenyldimethoxysilane, (3-methyloxetan-3-yl) ethylethyldiacetoxysilane, (3-methyloxetane-3-yl) ethylphenyl di-i-propyloxysilane, (3-methyloxetane- (3-methyloxetane-3-yl) propyltrimethoxysilane, (3-methyloxetane-3-yl) propyltriethoxysilane, (3-methyloxetan-3-yl) propyltri-i-propyloxysilane, (3-methyloxetan-3-yl) propyltriacetoxysilane , (3-methyloxetane-3-yl) propylmethyldimethoxysilane, (3-methyloxetane-3-yl) propylmethyldiethoxysilane, (3-methyloxetane-3-yl) propylmethyldiacetoxysilane, (3-methyloxetane-3-yl) propylmethyldi- (3-methyloxetane-3-yl) propylethyldimethoxysilane, (3-methyloxetane-3-yl) propylethyldiethoxysilane, (3-methyloxetan-3-yl) propylethyldiacetoxysilane, (3-methyloxetan-3-yl) propylethyldiisopropyloxysilane, Phenyldimethoxysilane, (3-methyloxetane-3-yl) propylphenyldiethoxysilane, (3-methyloxetane- (3-methyloxetane-3-yl) propylphenyldiacetoxysilane, (3-ethyloxetan-3-yl) (3-ethyloxetan-3-yl) methyltriethoxysilane, (3-ethyloxetan-3-yl) methyltri- (3-ethyloxetan-3-yl) methylmethyldimethoxysilane, (3-ethyloxetane-3-yl) methyltriacetoxysilane, 3-yl) methylmethyldiethoxysilane, (3-ethyloxetan-3-yl) methylmethyldi-n-propyloxysilane, (3-ethyloxetan-3-yl) methylmethyldiacetoxysilane, (3-ethyloxetan-3-yl) methylethyldimethoxysilane, Propyloxysilane, (3-ethyloxetan-3-yl) methylethyldi-i-propyloxysilane, (3-ethyloxetan- (3-ethyloxetan-3-yl) methylphenyldiethoxysilane, (3-ethyloxetan-3-yl) methylphenyldimethoxysilane, -Ethyloxetane-3 (3-ethyloxetan-3-yl) methylphenyl di-i-propyloxysilane, (3-ethyloxetan-3-yl) methylphenyl diacetoxysilane, Ethyltriethoxysilane, (3-ethyloxetan-3-yl) ethyltriethoxysilane, (3-ethyloxetan-3-yl) ethyltri- (3-ethyloxetan-3-yl) ethyltri-i-propyloxysilane, (3-ethyloxetan-3-yl) ethyltriacetoxysilane, Ethylmethyldimethoxysilane, (3-ethyloxetan-3-yl) ethylmethyldiethoxysilane, (3-ethyloxetan- (3-ethyloxetan-3-yl) ethylmethyldiacetoxysilane, (3-ethyloxetan-3-yl) ethylethyldimethoxysilane (3-ethyloxetan-3-yl) ethylethyldiethoxysilane, (3-ethyloxetan-3-yl) ethylethyldi- Ethylethyldi-i-propyl (3-ethyloxetan-3-yl) ethylethyldiacetoxysilane, (3-ethyloxetan-3-yl) ethylphenyldimethoxysilane, (3-ethyloxetan-3-yl) ethylphenyl di-i-propyloxysilane, (3- (3-ethyloxetane-3-yl) propyltriethoxysilane, (3-ethyloxetane-3-yl) propyltrimethoxysilane, Propyloxysilane, (3-ethyloxetan-3-yl) propyltri-i-propyloxysilane, (3-ethyloxetan- (3-ethyloxetane-3-yl) propylmethyldimethoxysilane, (3-ethyloxetane-3-yl) propylmethyldiethoxysilane, ) Propyl methyldi-n-propyloxysilane, (3-ethyloxetan-3-yl) propylmethyl di- Silane, (3-ethyloxetane-3-yl) propylethyldimethoxysilane, (3-ethyloxetane- (3-ethyloxetane-3-yl) propylethyldiacetoxysilane, (3-ethyloxetane-3-yl) 3-yl) propylphenyldimethoxysilane, (3-ethyloxetan-3-yl) propylphenyldiethoxysilane, (3-ethyloxetan- , (3-ethyloxetane-3-yl) propylphenyldi-i-propyloxysilane, (3-ethyloxetan-3-yl) propylphenyldiacetoxysilane and the like;

Specific examples of the vinyl group-containing compound (1) include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri-n-propyloxysilane, vinyltri-i-propyloxysilane, vinyltriacetoxysilane, vinyltri (Methoxyethoxy) silane, vinyl methyl dimethoxy silane, vinyl methyl diethoxy silane, vinyl methyl di-n-propyloxy silane, vinyl methyl di-i-propyloxy silane, vinyl methyl diacetoxy silane, Propyloxysilane, vinylethyldi-i-propyloxysilane, vinylethyldiacetoxysilane, vinylethyldi (methoxyethoxy) silane, vinylphenyldimethoxysilane, vinylphenyldimethoxysilane, vinylethyldiethoxysilane, vinylethyldi- Vinylphenyl di-i-propyloxysilane, vinylphenyldiacetoxysilane, vinylphenyldi (methoxyethoxy) silane, and the like;

Specific examples of the allyl group-containing compound (1) include allyltrimethoxysilane, allyltriethoxysilane, allyltri-n-propyloxysilane, allyltri-i-propyloxysilane, allyltriacetoxysilane, (Methoxyethoxy) silane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, allylmethyl di-n-propyloxysilane, allylmethyl di-i-propyloxysilane, allylmethyl diacetoxysilane, Propyloxysilane, allylethyldi-i-propyloxysilane, allylethyldiacetoxysilane, allylethyldi (methoxyethoxy) silane, allylphenyldimethoxysilane, allylethyldiethoxysilane, Propyloxysilane, allylphenyl di-i-propyloxysilane, allylphenyl diacetoxysilane, allylphenyl di (methoxyethoxy) silane, and the like;

Specific examples of the compound (1) containing a (meth) acryloyl group include 3- (meth) acryloxymethyltrimethoxysilane, 3- (meth) acryloxymethyltriethoxysilane, 3- (Meth) acryloxymethyltriacetoxysilane, 3- (meth) acryloxymethyltrimethoxysilane, 3- (meth) acryloxymethyltrimethoxysilane, 3- (Meth) acryloxymethylmethyldiethoxysilane, 3- (meth) acryloxymethylmethyldi-n-propyloxysilane, 3- (meth) acryloxymethylmethyldi- (Meth) acryloxymethylethyldiethoxysilane, 3- (meth) acryloxymethylethyldimethoxysilane, 3- (meth) acryloxymethylethyldiethoxysilane, 3- (Meth) acryloxymethylethyldiethoxysilane, 3- (meth) acryloxymethylethyldiisopropyloxysilane, 3- (meth) acryloxymethylethyldiacetoxysilane, 3- Acryloxymethylphenyl diethoxysilane, 3- (meth) acryloxymethylphenyl di-n-propyloxysilane, 3- (meth) acryloxymethylphenyl di- Acryloxyethyltriethoxysilane, 3- (meth) acryloxymethylphenyldiacetoxysilane, 3- (meth) acryloxyethyltrimethoxysilane, 3- (meth) acryloxyethyltriethoxysilane, 3- (Meth) acryloxyethyltrimethoxysilane, 3- (meth) acryloxyethyltrimethoxysilane, 3- (meth) acryloxyethyltrimethoxysilane, 3- (Meth) acryloxyethylmethyldiethoxysilane, 3- (meth) acryloxyethylmethyldi-n-propyloxysilane, 3- (meth) acryloxyethylmethyldi- (Meth) acryloxyethyl ethyldimethoxysilane, 3- (meth) acryloxyethyl ethyldiethoxysilane, 3- Acryloxyethyl ethyldiacetoxysilane, 3- (meth) acryloxyethylethyldi-n-propyloxysilane, 3- (meth) acryloxyethylethyldi- (Meth) acryloxyethylphenyldimethoxysilane, 3- (meth) acryloxyethylphenyldiethoxysilane, 3- (meth) acryloxyethylphenyldi-n-propyloxysilane, 3- (Meth) acryloxypropyltriethoxysilane, 3- (meth) acryloxypropyltriethoxysilane, 3- (meth) acryloxypropyltrimethoxysilane, 3- (Meth) acryloxypropyltriacetoxysilane, 3- (meth) acryloxypropyltri-i-propyloxysilane, 3- (meth) (Meth) acryloxypropylmethyldiethoxysilane, 3- (meth) acryloxypropylmethyldiethoxysilane, 3- (meth) acryloxypropylmethyldi-n-propyloxysilane, 3- (Meth) acryloxypropylethyldimethoxysilane, 3- (meth) acryloxypropylethyldimethoxysilane, 3- (meth) acryloxypropylethyldimethoxysilane, 3- (Meth) acryloxypropylethyldiacetoxysilane, 3- (meth) acryloxypropylethyldi-n-propyloxysilane, 3- (meth) (Meth) acryloxypropylphenyldimethoxysilane, 3- (meth) acryloxypropylphenyldiethoxysilane, 3- (meth) acryloxypropylphenyldi-n-propyloxysilane, 3- Propyloxysilane, 3- (meth) acryloxypropylphenyldiacetoxysilane, and the like;

Specific examples of the carboxyl group-containing compound (1) include carboxymethyltrimethoxysilane, carboxymethyltriethoxysilane, carboxymethyltri-n-propyloxysilane, carboxymethyltri-i-propyloxysilane, (Methoxyethoxy) silane, carboxymethylmethyldimethoxysilane, carboxymethylmethyldiethoxysilane, carboxymethylmethyldi-n-propyloxysilane, carboxymethylmethyldi-i-propyloxysilane, Carboxymethylethyldiacetoxysilane, carboxymethylethyldiethoxysilane, carboxymethylethyldimethoxysilane, carboxymethylethyldiethoxysilane, carboxymethylethyldi-n-propyloxysilane, carboxymethylethyldi-i-propyloxysilane, carboxymethylethyldiacetoxy Silane, carboxymethylethyldi (methoxyethoxy) silane, carboxymethylphenyldimethoxysilane, carboxymethylphenyldiethoxysilane, carboxymethylphenyl di- carboxymethylphenyl diacetoxysilane, carboxymethylphenyl di (methoxyethoxy) silane, 2-carboxyethyltrimethoxysilane, 2-carboxyethyltriethoxy Carboxyethyltriethoxysilane, 2-carboxyethyltri (n-propyloxysilane, 2-carboxyethyltri-i-propyloxysilane, 2- Carboxyethylmethyldimethoxysilane, 2-carboxyethylmethyldiethoxysilane, 2-carboxyethylmethyldi-n-propyloxysilane, 2-carboxyethylmethyldi-i-propyloxysilane, 2- Carboxyethylethyldiethoxysilane, 2-carboxyethylethyldiethoxysilane, 2-carboxyethylethyldimethoxysilane, 2-carboxyethylethyldiethoxysilane, 2-carboxyethylethyldi-n-propyloxysilane, 2- Ethyldiacetoxysilane, 2-carboxyethylethyl (Methoxyethoxy) silane, 2-carboxyethylphenyldimethoxysilane, 2-carboxyethylphenyldiethoxysilane, 2-carboxyethylphenyldi-n-propyloxysilane, 2-carboxyethylphenyldi- Silane, 2-carboxyethylphenyldiacetoxysilane, 2-carboxyethylphenyldi (methoxyethoxy) silane and the like;

Specific examples of the compound (1) containing a hydroxyl group include hydroxymethyltrimethoxysilane, hydroxymethyltriethoxysilane, hydroxymethyltri-n-propyloxysilane, hydroxymethyltri-i-propyloxy Silane, hydroxymethyltriacetoxysilane, hydroxymethyltri (methoxyethoxy) silane, hydroxymethylmethyldimethoxysilane, hydroxymethylmethyldiethoxysilane, hydroxymethylmethyldi-n-propyloxysilane, Hydroxymethylmethyldiethoxysilane, hydroxymethylethyldimethoxysilane, hydroxymethylethyldiethoxysilane, hydroxymethylethyldi-n-propyloxysilane, hydroxymethylmethyldiacetoxysilane, hydroxymethylethyldiethoxysilane, hydroxymethylethyldi- Hydroxymethylethyldiacetoxysilane, hydroxymethylethyldi (methoxyethoxy) silane, hydroxymethylphenyldimethoxysilane, hydroxymethylphenyldiethoxysilane, hydroxymethylphenyldiethoxysilane, hydroxymethylethyldiacetoxysilane, hydroxymethylethyldiacetoxysilane, D- hydroxymethylphenyl diacetoxysilane, hydroxymethylphenyl di (methoxyethoxy) silane, 2-hydroxyethyltrimethoxysilane, 2-hydroxymethylphenyl diacetoxysilane, Hydroxyethyl tri-n-propyloxysilane, 2-hydroxyethyltri-i-propyloxysilane, 2-hydroxyethyltriacetoxysilane, 2-hydroxyethyltri ( Methoxyethoxy) silane, 2-hydroxyethylmethyldimethoxysilane, 2-hydroxyethylmethyldiethoxysilane, 2-hydroxyethylmethyldi-n-propyloxysilane, 2-hydroxyethylmethyldi-i -Propyloxysilane, 2-hydroxyethylmethyldiacetoxysilane, 2-hydroxyethylethyldimethoxysilane, 2-hydroxyethylethyldiethoxysilane, 2-hydroxyethylethyldi-n-propyloxysilane, 2-hydroxyethylethyldi-i-propyloxysilane, 2-hydroxyethylethyldiacetoxysilane, 2-hydroxyethylethyl (Methoxyethoxy) silane, 2-hydroxyethylphenyldimethoxysilane, 2-hydroxyethylphenyldiethoxysilane, 2-hydroxyethylphenyldi-n-propyloxysilane, 2- hydroxypropyltriethoxysilane, 3-hydroxypropyltriethoxysilane, 3-hydroxypropyltriethoxysilane, 3-hydroxypropyltrimethoxysilane, 3-hydroxypropyltriethoxysilane, Silane, 3-hydroxypropyltri-n-propyloxysilane, 3-hydroxypropyltri-i-propyloxysilane, 3-hydroxypropyltriacetoxysilane, 3- hydroxypropyltri (methoxyethoxy) Silane, 3-hydroxypropylmethyldimethoxysilane, 3-hydroxypropylmethyldiethoxysilane, 3-hydroxypropylmethyldi-n-propyloxysilane, 3-hydroxypropylmethyldi- 3-hydroxypropylmethyldiacetoxysilane, 3-hydroxypropylethyldimethoxysilane, 3-hydroxypropylethyldiethoxysilane, Silane, 3-hydroxypropylethyldi-n-propyloxysilane, 3-hydroxypropylethyldi-i-propyloxysilane, 3-hydroxypropylethyldiacetoxysilane, 3- Hydroxypropylphenyldimethoxysilane, 3-hydroxypropylphenyldiethoxysilane, 3-hydroxypropylphenyldi-n-propyloxysilane, 3-hydroxypropylphenyldi-i- Hydroxypropylphenyldiacetoxysilane, 3-hydroxypropylphenyldi (methoxyethoxy) silane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzyltrimethoxysilane , 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzyltriethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzyltri-n-propyloxysilane, - (p-hydroxyphenylcarbonyloxy) benzyltri-i-propyloxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzyltriacetoxysil , 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylmethyldimethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzyltri (methoxyethoxy) (P-hydroxyphenylsulfonyloxy) benzylmethyldiethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylmethyldi-n-propyloxysilane, 4-hydroxy- (p Hydroxyphenylcarbonyloxy) benzylmethyldi-i-propyloxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylmethyldiacetoxysilane, 4-hydroxy- (p- Benzylethyldimethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylethyldiethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylethyldimethoxysilane, propyloxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylethyldiamine, 4-hydroxy- Cetk 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylphenyldimethoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylethyldi (methoxyethoxy) Hydroxyphenyl diethoxy silane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylphenyl di-n-propyloxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylphenyl diacetoxysilane, 4-hydroxy- (p-hydroxyphenylcarbonyloxy) benzylphenyl di- Hydroxyphenylcarbonyloxy) benzylphenyl di (methoxyethoxy) silane and the like;

Specific examples of the mercapto group-containing compound (1) include mercaptomethyltrimethoxysilane, mercaptomethyltriethoxysilane, mercaptomethyltri-n-propyloxysilane, mercaptomethyltri-i-propyloxysilane , Mercaptomethyltriacetoxysilane, mercaptomethyl tri (methoxyethoxy) silane, mercaptomethyl methyl dimethoxy silane, mercaptomethyl methyl diethoxy silane, mercaptomethyl methyl di-n-propyloxy silane, Mercaptomethyl methyldiacetoxysilane, mercaptomethylethyldimethoxysilane, mercaptomethylethyldiethoxysilane, mercaptomethylethyldi-n-propyloxysilane, mercaptoethylmethyldiacetoxysilane, mercaptomethylethyldiethoxysilane, (Methoxyethoxy) silane, mercaptomethylphenyldimethoxysilane, mercaptomethylphenyldiethoxysilane, mercaptomethylphenyldiethoxysilane, mercaptomethylethyldiacetoxysilane, mercaptomethylethyldiacetoxysilane, mercaptomethylethyldi (methoxyethoxy) silane, n-propyloxysilane, mercaptomethylphenyl di-i-propyl Mercaptoethyltrimethoxysilane, 2-mercaptoethyltriethoxysilane, 2-mercaptoethyltriethoxysilane, 2-mercaptoethyltriethoxysilane, 2-mercaptoethyltriethoxysilane, 2-mercaptoethyltriethoxysilane, Mercaptoethyltriacetoxysilane, 2-mercaptoethyltri (methoxyethoxy) silane, 2-mercaptoethylmethyldimethoxy, 2-mercaptoethyltriethoxysilane, Silane, 2-mercaptoethylmethyldiethoxysilane, 2-mercaptoethylmethyldi-n-propyloxysilane, 2-mercaptoethylmethyldi-i-propyloxysilane, 2-mercaptoethylmethyldiacetoxysilane , 2-mercaptoethylethyldimethoxysilane, 2-mercaptoethylethyldiethoxysilane, 2-mercaptoethylethyldi-n-propyloxysilane, 2-mercaptoethylethyldi-i-propyloxysilane, 2 Mercaptoethylethyldiacetoxysilane, 2-mercaptoethylethyldiacetoxysilane, 2-mercaptoethylethyldi (methoxyethoxy) silane, 2-mercaptoethylphenyldimethoxysilane, 2-mercaptoethylphenyldiethoxysilane, Mercaptoethylphenyldiacetoxysilane, 2-mercaptoethylphenyldi (n-propyloxysilane), 2-mercaptoethylphenyldiisopropylsilane, 2-mercaptoethylphenyldiacetoxysilane, 2- , 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltri-n-propyloxysilane, 3-mercaptopropyltri-i-propyloxysilane, 3- Mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltri (methoxyethoxy) silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, 3- 3-mercaptopropylethyldiethoxysilane, 3-mercaptopropylethyldiethoxysilane, 3-mercaptopropylethyldiethoxysilane, 3-mercaptopropylethyldiethoxysilane, 3- Mercaptopropylethyldiacetoxysilane, 3-mercaptopropylethyldi-n-propyloxysilane, 3-mercaptopropylethyldi-i-propyloxysilane, 3- (Methoxyethoxy) silane, 3-mercaptopropyldimethoxysilane, 3-mercaptopropyldiethoxysilane, 3-mercaptopropyldiphenyl-n-propyloxysilane, 3- Phenyldi-i-propyloxysilane, 3-mercaptoprophenyldiacetoxysilane, 3-mercaptoprophenyldi (methoxyethoxy) silane, etc .;

Specific examples of the isocyanate group-containing compound (1) include isocyanatomethyltrimethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyltri-n-propyloxysilane, isocyanatoethyl (Methoxyethoxy) silane, isocyanatomethylmethyldimethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyltriethoxysilane, Silane, isocyanatomethylmethyldi-n-propyloxysilane, isocyanatomethylmethyldi-i-propyloxysilane, isocyanatomethylmethyldiacetoxysilane, isocyanatomethylethyldimethoxysilane , Isocyanatomethylethyldiethoxysilane, isocyanatomethylethyldi-n-propyloxysilane, isocyanatomethylethyldi-i-propyloxysilane, isocyanatomethylethyldiacetoxysilane, Isocyanate Isocyanatomethylphenyl diethoxysilane, isocyanatomethylphenyl di (n-propyloxysilane), isocyanatomethylphenyldimethoxysilane, isocyanatomethylphenyldiethoxysilane, isocyanatomethylphenyldimethoxysilane, isocyanatomethylphenyldimethoxysilane, (methoxyethoxy) silane, 2-isocyanatoethyltrimethoxysilane, 2-isocyanatoethyltriethoxysilane, isocyanatomethylphenyl diacetoxysilane, isocyanatomethylphenyl di Propyloxysilane, 2-isocyanatoethyltriacetoxysilane, 2-isocyanatoethyltriethoxysilane, 2-isocyanatoethyltriethoxysilane, 2-isocyanatoethyltriethoxysilane, (Methoxyethoxy) silane, 2-isocyanatoethylmethyldimethoxysilane, 2-isocyanatoethylmethyldiethoxysilane, 2-isocyanatoethylmethyldi-n-propyloxy Silane, 2-isocyanatoethylmethyldi-i-propyloxysilane, 2-isocyanate Isocyanatoethyl ethyldimethoxysilane, 2-isocyanatoethyl ethyldiethoxysilane, 2-isocyanatoethyl ethyl di-n-propyloxysilane, 2-iso (Isocyanatoethyl) silane, 2-isocyanatoethyldiacetoxysilane, 2-isocyanatoethylethyldi (methoxyethoxy) silane, 2-isocyanatoethyl 2-isocyanatoethylphenyldiethoxysilane, 2-isocyanatoethylphenyldi-n-propyloxysilane, 2-isocyanatoethylphenyldi-i-propyloxysilane, 2 - isocyanatoethylphenyldiacetoxysilane, 2-isocyanatoethylphenyldi (methoxyethoxy) silane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltri 3-isocyanatopropyltri-n-propyloxysilane, 3-isocyanatopropyltri-i-propyloxysilane, 3- Isocyanatoethyltriethoxysilane, isocyanatopropyltriacetoxysilane, 3-isocyanatopropyltri (methoxyethoxy) silane, 3-isocyanatopropylmethyldimethoxysilane, 3-isocyanatopropylmethyldiethoxysilane, Propyloxysilane, 3-isocyanatopropylmethyldi-n-propyloxysilane, 3-isocyanatopropylmethyldi-i-propyloxysilane, 3- isocyanatopropylmethyldiacetoxysilane, 3-isocyanate 3-isocyanatopropylethyldiethoxysilane, 3-isocyanatopropylethyldi-n-propyloxysilane, 3-isocyanatopropylethyldi-i-propyloxysilane, , 3-isocyanatopropylethyldiacetoxysilane, 3-isocyanatopropylethyldi (methoxyethoxy) silane, 3-isocyanatopropyldiphenyldimethoxysilane, 3-isocyanatopropyl Phenyldiethoxysilane, 3-isocyanatopropylphenyl di-n-propyloxysilane, 3- Such SOCIETE isocyanato propylphenyl di -i- propyloxy silane, 3-isocyanato propyl phenyl diacetoxy silane, 3-isocyanato-propylphenyl-di (methoxyethoxy) silane;

Specific examples of the compound (1) containing an amino group include aminomethyltrimethoxysilane, aminomethyltriethoxysilane, aminomethyltri-n-propyloxysilane, aminomethyltri-i-propyloxysilane, (Methoxyethoxy) silane, aminomethylmethyldimethoxysilane, aminomethylmethyldiethoxysilane, aminomethylmethyldi-n-propyloxysilane, aminomethylmethyldi-i-propyloxysilane, Aminomethylethyldiacetoxysilane, aminomethylethyldimethoxysilane, aminomethylethyldiethoxysilane, aminomethylethyldi-n-propyloxysilane, aminomethylethyldi-i-propyloxysilane, aminomethylethyldiacetoxy Silane, aminomethylethyldi (methoxyethoxy) silane, aminomethylphenyldimethoxysilane, aminomethylphenyldiethoxysilane, aminomethylphenyl di-n-propyloxysilane, aminomethylphenyldi-i-propyl Aminomethylphenyl diacetoxysilane, aminomethylphenyl di (methoxyethoxy) silane, 2-aminoethyltrimethoxysilane, 2-aminoethyltriethoxysilane, 2-aminoethyltri-n-propyloxysilane, Aminoethyltriacetoxysilane, 2-aminoethyltri (methoxyethoxy) silane, 2-aminoethylmethyldimethoxysilane, 2-aminoethylmethyldiethoxy Silane, 2-aminoethylmethyldi-n-propyloxysilane, 2-aminoethylmethyldi-i-propyloxysilane, 2-aminoethylmethyldiacetoxysilane, 2-aminoethylethyldimethoxysilane, 2- Ethylethyldiethoxysilane, 2-aminoethylethyldi-n-propyloxysilane, 2-aminoethylethyldi-i-propyloxysilane, 2-aminoethylethyldiacetoxysilane, 2- Aminoethoxyphenyldimethoxysilane, 2-aminoethylphenyldiethoxysilane, 2-amino Aminoethylphenyldiacetoxysilane, 2-aminoethylphenyldi (methoxyethoxy) silane, 3-aminoethylphenyl di-n-propyloxysilane, 2- Aminopropyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltri-n-propyloxysilane, 3-aminopropyltri-i-propyloxysilane, 3-aminopropyltriacetoxysilane, 3 Aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-aminopropylmethyldi-n-propyloxysilane, 3-aminopropylmethyldimethoxysilane, propyloxysilane, 3-aminopropylethyldiethoxysilane, 3-aminopropylethyldiethoxysilane, 3-aminopropylethyldi-n-propyloxysilane, 3-aminopropylethyldimethoxysilane, Propyloxydi-propyloxysilane, 3-aminopropylethyldiacetoxysilane, 3-amino (Methoxyethoxy) silane, 3-aminopropylphenyldimethoxysilane, 3-aminopropylphenyldiethoxysilane, 3-aminopropylphenyldi-n-propyloxysilane, 3-aminopropylphenyldi N-2 (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropylphenyl diacetoxysilane, 3-aminopropylphenyldimethoxy silane, Aminopropyltriethoxysilane, N-2- (aminoethyl) -3-aminopropyltri-n-propyloxysilane, N-2- (aminoethyl) (aminoethyl) -3-aminopropyltriethoxysilane, N-2 (aminoethyl) -3-aminopropyltriacetoxysilane, N-2- (Aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldiethoxysilane, N-2- -Propyloxysilane, N-2- (Ami N-2- (aminoethyl) -3-aminopropylethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldiacetoxysilane, Aminopropylethyldi-n-propyloxysilane, N-2- (aminoethyl) -3-aminopropylethyldiethoxysilane, N-2- (Aminoethyl) -3-aminopropylethyldiacetoxysilane, N-2- (aminoethyl) -3-aminopropylethyldi ( Aminoethyl) -3-aminopropylphenyldiethoxysilane, N-2- (aminoethyl) -3-aminopropylphenyldimethoxysilane, N-2- N-2- (aminoethyl) -3-aminopropylphenyl di-n-propyloxysilane, N-2- Phenyldiacetoxysilane, N-2- (aminoethyl) -3-aminopropylphenyl di (methoxy Propyloxysilane, aminomethyltriacetoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltriethoxysilane, aminomethyltri- Aminomethylmethyldiethoxysilane, aminomethylmethyldiethoxysilane, aminomethylmethyldiethoxysilane, aminomethylmethyldi-n-propyloxysilane, aminomethylmethyldi-i-propyloxysilane, aminomethylmethyldiacetoxysilane, Aminomethylethyldimethoxysilane, aminomethylethyldimethoxysilane, aminomethylethyldiethoxysilane, aminomethylethyldi-n-propyloxysilane, aminomethylethyldi-i-propyloxysilane, aminomethylethyldiacetoxysilane, Aminomethylphenyl diethoxy silane, aminomethylphenyl di-n-propyloxy silane, aminomethylphenyl di-i-propyloxy silane, aminomethylphenyl diacetoxy (Methoxyethoxy) silane, 2-aminoethyltrimethoxysilane, 2-aminoethyltriethoxysilane, 2-aminoethyltri-n-propyloxysilane, 2-aminoethyltri-i Aminoethyltrimethoxysilane, 2-aminoethyltriacetoxysilane, 2-aminoethyltri (methoxyethoxy) silane, 2-aminoethylmethyldimethoxysilane, 2-aminoethylmethyldiethoxysilane, 2-aminoethylmethyl Aminoethylmethyldiacetoxysilane, 2-aminoethylethyldimethoxysilane, 2-aminoethylethyldiethoxysilane, 2-aminoethylethyldiethoxysilane, 2-aminoethylethyldiethoxysilane, 2-aminoethylethyldiacetoxysilane, 2-aminoethylethyldi (methoxyethoxy) silane, 2-aminoethylethyldi-n-propyloxysilane, 2- Aminoethylphenyldimethoxysilane, 2-aminoethylphenyldiethoxysilane, 2-aminoethylphenyldi-n-propyloxysilane, 2- Aminoethylphenyldiacetoxysilane, 2-aminoethylphenyldi (methoxyethoxy) silane, N-phenyl-3-aminopropyltrimethoxysilane, N- Phenyl-3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltri-n-propyloxysilane, N-phenyl- Aminopropyltriethoxysilane, N-phenyl-3-aminopropyltriethoxysilane, N-phenyl-3-aminopropylmethyldiethoxysilane, N-phenyl- Phenyl-3-aminopropylmethyl di-i-propyloxysilane, N-phenyl-3-aminopropylmethyldiacetoxysilane, N-phenyl Aminopropylethyldimethoxysilane, N-phenyl-3-aminopropylethyldiethoxysilane, N-phenyl-3-aminopropylethyldi-n-propyloxysilane, N-phenyl- -i 3-aminopropylethyldiacetoxysilane, N-phenyl-3-aminopropylethyldi (methoxyethoxy) silane, N-phenyl-3-aminopropylphenyldimethoxysilane, Phenyl-3-aminopropyldiphenyldiethoxy silane, N-phenyl-3-aminopropylphenyl di-n-propyloxysilane, N-phenyl- Aminopropylphenyl diacetoxysilane, N-phenyl-3-aminopropylphenyl di (methoxyethoxy) silane, 3-trimethoxysilyl-N- (1,3-dimethyl- Amine, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, 3-tri-n-propyloxysilyl-N- (1,3-dimethyl- Etc;

Specific examples of the ureido group-containing compound (1) include isocyanatomethyltrimethoxysilane, ureidomethyltriethoxysilane, ureidomethyltri-n-propyloxysilane, ureidomethyltri-i-propyl (Methoxyethoxy) silane, ureidomethylmethyldimethoxysilane, ureidomethylmethyldiethoxysilane, ureidomethylmethyldi-n-propyloxysilane, ureidomethylmethyldiacetoxysilane, , Ureidomethylmethyldi-i-propyloxysilane, ureidomethylmethyldiacetoxysilane, ureidomethylethyldimethoxysilane, ureidomethylethyldiethoxysilane, ureidomethylethyldi-n-propyloxysilane, (Methoxyethoxy) silane, ureidomethylphenyldimethoxysilane, ureidomethylphenyldiethoxysilane, ureidomethylphenyldiethoxysilane, ureidomethylethyldiacetoxysilane, ureidomethylethyldiacetoxysilane, ureidomethylethyldiacetoxysilane, ureidomethylethyldiacetoxysilane, ureidomethylethyldi methyl Ureidomethylphenyl diacetoxysilane, ureidomethylphenyl di (methoxyethoxy) silane, 2-ureidoethyltrimethoxysilane, 2-ureidoethyltrimethoxysilane, -Ureidoethyltriethoxysilane, 2-ureidoethyltri-n-propyloxysilane, 2-ureidoethyltri-i-propyloxysilane, 2-ureidoethyltriacetoxysilane, 2-ureidoethyl (Methoxyethoxy) silane, 2-ureidoethylmethyldimethoxysilane, 2-ureidoethylmethyldiethoxysilane, 2-ureidoethylmethyldi-n-propyloxysilane, 2-ureidoethylmethyldi 2-ureidoethyl ethyldiethoxysilane, 2-ureidoethylethyldiethoxysilane, 2-ureidoethylethyldimethoxysilane, 2-ureidoethylethyldiethoxysilane, 2-ureidoethylethyldi-n-propyloxy Silane, 2-ureidoethylethyldi-i-propyloxysilane, 2-ureidoethylethyldiacetoxysilane, 2-ureido (Methoxyethoxy) silane, 2-ureidoethylphenyldimethoxysilane, 2-ureidoethylphenyldiethoxysilane, 2-ureidoethylphenyldi-n-propyloxysilane, 2-ureidoethylphenyl (Methoxyethoxy) silane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 2-ureidoethylphenyldiacetoxysilane, Propyloxysilane, 3-ureidopropyltriacetoxysilane, 3-ureidopropyltri (methoxypolyethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropylmethyldimethoxysilane, 3-ureidopropylmethyldiethoxysilane, 3-ureidopropylmethyldi-n-propyloxysilane, 3-ureidopropylmethyldi-i-propyloxy Silane, 3-ureidopropylmethyldiacetoxysilane, 3-ureidopropylethyldimethoxysilane, 3-ureidopropyl ethyl Propyloxysilane, 3-ureidopropylethyldi-n-propyloxysilane, 3-ureidopropylethyldi-i-propyloxysilane, 3-ureidopropylethyldiacetoxysilane, 3-ureidopropylethyldi (Methoxyethoxy) silane, 3-ureidopropylphenyldimethoxysilane, 3-ureidopropylphenyldiethoxysilane, 3-ureidopropylphenyldi-n-propyloxysilane, 3- i-propyloxysilane, 3-ureidopropylphenyldiacetoxysilane, 3-ureidopropylphenyldi (methoxyethoxy) silane and the like;

Specific examples of the compound (1) containing a styryl group include styryltrimethoxysilane, styryltriethoxysilane, styryltri-n-propyloxysilane, styryltri-i-propyloxysilane, styryltri (Methoxyethoxy) silane, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, styrylmethyldi-n-propyloxysilane, styrylmethyldi-i-propyloxysilane , Styrylmethyldiacetoxysilane, styrylethyldimethoxysilane, styrylethyldiethoxysilane, styrylethyldi-n-propyloxysilane, styrylethyldi-i-propyloxysilane, styrylethyldiacetyl (Methoxyethoxy) silane, styrylphenyldimethoxysilane, styrylphenyldiethoxysilane, styrylphenyldi-n-propyloxysilane, styrylphenyldi-i-propyloxysilane , Styrylphenyl diacetoxysilane, styrylphenyl di (methoxyethoxy) silane, etc.

.

Among them, the compound (1) containing an oxiranyl group, an oxetanyl group, a carboxyl group and a mercapto group is preferably used, and particularly, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) Ethyltriethoxysilane, (3-ethyloxetan-3-yl) propyltrimethoxysilane, (3-ethyloxetane-3-yl) propyltriethoxysilane, carboxymethyltrimethoxysilane, 3- Mercaptopropyltrimethoxysilane and 3-mercaptopropyltriethoxysilane are preferable in terms of reactivity with the component [A].

Further, the compound (1) containing an oxiranyl group and an oxetanyl group is preferably used in view of the ITO patterning property, and particularly, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane , 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, (3-ethyloxetan-3-yl) propyltrimethoxysilane, ) Propyl triethoxysilane is preferred.

Specific examples of the compound (2) include tetraalkoxysilane such as tetramethoxysilane, tetraethoxysilane (commonly referred to as TEOS), tetra-n-propyloxysilane, tetraisopropyloxysilane and tetra-n-butoxysilane; Monoalkyltrialkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-propyloxysilane, ethyltriethoxysilane, and cyclohexyltriethoxysilane; Phenyltriethoxysilane, 4-aminophenyltriethoxysilane, 4-nitrophenyltriethoxysilane, 4-chlorophenyltriethoxysilane, 4-aminophenyltriethoxysilane, Monoaryltrialkoxysilanes such as methylphenyltriethoxysilane and 4-hydroxyphenyltriethoxysilane; 4-chlorophenyloxytriethoxysilane, 4-cyanophenyltrioxyethoxysilane, 4-aminophenyloxytriethoxysilane, 4-nitrophenyloxy silane, 4-aminophenyltriethoxysilane, Monoaryloxytrialkoxysilanes such as triethoxysilane, 4-methylphenyloxytriethoxysilane, and 4-hydroxyphenyloxytriethoxysilane; Monohydroxy trialkoxy silanes such as monohydroxy triethoxy silane, monohydroxy triethoxy silane, monohydroxy triethoxy silane, monohydroxy tri-n-propyloxy silane; Dialkyldialkoxysilanes such as dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldi-n-propyloxysilane, methyl (ethyl) diethoxysilane and methyl (cyclohexyl) diethoxysilane; Monoalkyl monoaryl dialkoxy silanes such as methyl (phenyl) diethoxy silane; Diaryldialkoxysilanes such as diphenyldiethoxysilane; Diaryloxydialkoxysilanes such as diphenoxydiethoxysilane; Monoalkyl monoaryloxydialkoxysilanes such as methyl (phenoxy) diethoxysilane; Monoaryl monoaryloxydialkoxysilanes such as phenyl (phenoxy) diethoxysilane; Dihydroxydialkoxysilane such as dihydroxydimethoxysilane, dihydroxydiethoxysilane, dihydroxydi-n-propyloxysilane; Monoalkyl monohydroxydialkoxysilanes such as methyl (hydroxy) dimethoxysilane;

Monoaryl monohydroxydialkoxysilanes such as phenyl (hydroxy) dimethoxysilane; Trialkylmonoalkoxysilanes such as trimethylmethoxysilane, trimethylethoxysilane, trimethyl-n-propyloxysilane, dimethyl (ethyl) ethoxysilane and dimethyl (cyclohexyl) ethoxysilane; Dialkyl monoaryl monoalkoxysilanes such as dimethyl (phenyl) ethoxysilane; Monoalkyldiaryl monoalkoxysilanes such as methyl (diphenyl) ethoxysilane; Triaryloxymonoalkoxysilanes such as triphenoxyethoxysilane; Monoalkyldiaryloximmonoalkoxysilanes such as methyl (diphenoxy) ethoxysilane; Monoaryldiaryloxy monoalkoxysilanes such as phenyl (diphenoxy) ethoxysilane; Dialkyl monoaryloxymonoalkoxysilanes such as dimethyl (phenoxy) ethoxysilane; Diarylmonoaryloxy monoalkoxysilanes such as diphenyl (phenoxy) ethoxysilane; Monoalkyl monoaryl monoaryloxy mono alkoxy silanes such as methyl (phenyl) (phenoxy) ethoxy silane; Trihydroxymonoalkoxysilane such as trihydroxymethoxysilane, trihydroxyethoxysilane, and trihydroxy-n-propyloxysilane.

Of these, tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxy Silane and diphenyldiethoxysilane are preferable in terms of reactivity and adhesion to a substrate.

Any of a plurality of these compounds may be used in an arbitrary composition.

The compound [B] used in the present invention can be obtained by adding the above compound to the cohydrolysis reaction.

The hydrolysis reaction is preferably carried out in a suitable solvent. Examples of such solvents include alcohols such as methanol, ethanol, n-propanol, isopropyl alcohol, n-butanol, isobutyl alcohol, t-butyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone, propylene glycol monomethyl ether, Water-soluble solvents such as glycol methyl ether acetate, tetrahydrofuran, dioxane and acetonitrile, and aqueous solutions thereof.

Since these water-soluble solvents are removed in the subsequent steps, those having relatively low boiling points such as methanol, ethanol, n-propanol, isopropyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone and tetrahydrofuran are preferable, Ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone are more preferable, and methyl isobutyl ketone is most preferable.

The hydrolysis reaction for synthesizing the component [B] is preferably carried out using an acid catalyst such as hydrochloric acid, sulfuric acid, nitric acid, formic acid, oxalic acid, acetic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, Various Lewis acids and the like, or base catalysts such as ammonia, primary amines, secondary amines, tertiary amines, nitrogen-containing aromatic compounds such as pyridine, basic ion exchange resins, hydroxides such as sodium hydroxide, carbonates such as potassium carbonate , A carboxylate such as sodium acetate, various Lewis bases, and the like. The amount of water used, the reaction temperature, and the reaction time are appropriately set. For example, the following conditions can be used.

The amount of water to be used is preferably 1.5 mol or less, more preferably 1 mol or less, and even more preferably 0.9 mol or less, based on 1 mol of the total amount of the alkoxyl group and the halogen atom in the compound represented by the formula (1) and the compound represented by the formula Mole.

The reaction temperature is preferably 40 to 200 占 폚, more preferably 50 to 150 占 폚.

The reaction time is preferably 30 minutes to 24 hours, more preferably 1 to 12 hours.

The polystyrene reduced weight average molecular weight (hereinafter sometimes referred to as "Mw ") of the component [B] by gel permeation chromatography (GPC) is preferably 500 to 10,000, more preferably 1,000 to 3,000. When the Mw is less than 500, it is difficult to exhibit sufficient adhesion and an effect of suppressing contaminants generated at the time of spacer formation. On the other hand, when the Mw is more than 10,000, there is a possibility that the coating property is deteriorated.

Examples of commercially available products of the component [B] include BY16-848, BY16-201, BY16-853C, BY16-208, BY16-209, BY16-850, SF8417, BY16-849, BY16-872, BY16-855D , SF8411, SF8413, SF8421, BY16-839, BY16-750, SF8418 (manufactured by Toray Dow Corning Silicon Co., Ltd.), TSF4700, TSF4701, TSF4702, TSF4703, TSF4704, TSF4705, TSF4706, TSF4707, TSF4708, TSF4709 , TSF4730, TSL9906, YF3965, XF42-B0970 (manufactured by Momentive Performance Materials), X-41-1053, X-41-1056, X-41-1805, X- -2651, X-40-2655A, X-40-9721 (manufactured by Shinetsu Chemical Co., Ltd.), FM-0711, FM-0721 and FM- .

[C] Curing agent

The acid anhydride [C] may be added to improve the heat resistance and hardness of the protective film to be formed. Examples of the acid anhydride [C] include a polymer containing a repeating unit derived from a polymerizable unsaturated compound having an acid anhydride group (c-1) (excluding the copolymer [A]), or (c-2) Acid anhydrides.

Examples of the unsaturated polycarboxylic acid anhydrides used for synthesizing the polymer containing a repeating unit derived from the polymerizable unsaturated compound having an acid anhydride group as the component (c-1) include itaconic anhydride, citraconic anhydride, Maleic anhydride, and cis 1,2,3,4-tetrahydrophthalic anhydride.

Examples of the olefinic unsaturated compound used for synthesizing the copolymer of the polymerizable unsaturated compound having anhydride group and olefinic unsaturated compound include styrene, p-methylstyrene, p-methoxystyrene, methyl methacrylate , t-butyl methacrylate, tricyclohexyl methacrylate [5.2.1.0 ^2,6 ] decan-8-yl, 2-methylcyclohexyl acrylate, phenylmaleimide and cyclohexyl .

The copolymerization ratio of the polymerizable unsaturated compound having an acid anhydride group and the polymerizable unsaturated compound having an acid anhydride group in 100 parts by weight of the copolymer of the olefinically unsaturated compound is preferably 1 to 80 parts by weight, more preferably 10 to 60 parts by weight Wealth. By using such a copolymer, a protective film excellent in planarization property can be obtained.

Preferred examples of the copolymer of the polymerizable unsaturated compound having an acid anhydride group and the olefinically unsaturated compound include maleic anhydride copolymer / styrene, citraconic anhydride / methacrylic acid tricyclo [5.2.1.0 ^2,6 ] decan-8- And an acrylic polymer.

The weight average molecular weight of the copolymer of the polymerizable unsaturated compound having an acid anhydride group and the olefinically unsaturated compound in terms of polystyrene is preferably 500 to 50,000, more preferably 500 to 10,000. By using a copolymer having such a molecular weight range, a protective film excellent in planarization property can be obtained.

Examples of the polycarboxylic acid anhydride (c-2) include anhydrides such as itaconic anhydride, succinic anhydride, citraconic anhydride, dodecenylsuccinic anhydride, tricarbamic acid, maleic anhydride, hexahydrophthalic anhydride, Aliphatic dicarboxylic acid anhydrides such as phthalic anhydride and himic anhydride; Alicyclic polycarboxylic acid dianhydrides such as 1,2,3,4-butanetetracarboxylic acid dianhydride and cyclopentanetetracarboxylic acid dianhydride; Aromatic polycarboxylic anhydrides such as phthalic anhydride, pyromellitic anhydride, trimellitic anhydride, and benzophenonetetracarboxylic acid anhydride; And ester group-containing acid anhydrides such as ethylene glycol bistrimelitic acid anhydride and glycerin tristrimellitic acid anhydride. Of these, aromatic polycarboxylic acid anhydrides, particularly trimellitic acid anhydride, are preferable in that a cured film having high heat resistance can be obtained.

[D] Multifunctional compound

As the [D] multifunctional compound to be used in the present invention, a cationic polymerizable compound and / or a polyfunctional (meth) acrylic compound is used. The cationic polymerizable compound is a compound having two or more oxiranyl groups or oxetanyl groups in the molecule (except for the above-mentioned copolymer [A-1]). Examples of the compound having two or more oxiranyl groups or oxetanyl groups in the molecule include compounds having two or more epoxy groups in the molecule or compounds having 3,4-epoxycyclohexyl groups.

Examples of the compound having two or more epoxy groups in the molecule include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hydrogen Bisphenol F diglycidyl ether, hydrogenated bisphenol AD diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, and brominated bisphenol S diglycidyl ether. Diglycidyl ethers;

1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylol propane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, Polyglycidyl ethers of polyhydric alcohols such as cidyl ether;

Polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol and glycerin;

Phenol novolak type epoxy resins;

Cresol novolak type epoxy resin;

Polyphenol type epoxy resins;

Diglycidyl esters of aliphatic long chain dibasic acids;

Glycidyl esters of higher fatty acids;

Epoxidized soybean oil, and epoxidized linseed oil.

Examples of commercial products of the compound having two or more epoxy groups in the molecule include Epicot 1001, Copper 1002, Copper 1003, Copper 1004, Copper 1007, Copper 1009, Copper 1010, Copper 828 (or more) as bisphenol A type epoxy resin. Japan Epoxy Resin Co., Ltd.);

As bisphenol F type epoxy resin, Epikote 807 (manufactured by Japan Epoxy Resin Co., Ltd.) and the like;

Examples of the phenol novolac epoxy resin include Epicote 152, Epoxy 154, Epoxy 157S65 (manufactured by Japan Epoxy Resin Co., Ltd.), EPPN201 and Epoxy 202 (manufactured by Nippon Kayaku Co., Ltd.);

EOCN102, copper 103S, copper 104S, 1020, 1025, and 1027 (manufactured by Nippon Kayaku Co., Ltd.) and Epikote 180S75 (manufactured by Japan Epoxy Resin Co., Ltd.) as cresol novolak type epoxy resin;

As the polyphenol type epoxy resin, Epikote 1032H60 and XY-4000 (manufactured by Japan Epoxy Resin Co., Ltd.) and the like;

CY-175, 177, 179, Araldite CY-182, Copper 192 and 184 (manufactured by Ciba Specialty Chemicals), ERL-4234, 4299, 4221, (Trade name, manufactured by Dainippon Ink and Chemicals, Inc.), Epicote 871, and Copper 872 (manufactured by Udagaku Kogyo Co., Ltd., Japan) Epoxy Resin Co., Ltd.), ED-5661 and 5662 (manufactured by Celanese Coatings Co., Ltd.);

As the aliphatic polyglycidyl ether, Epolite 100MF (manufactured by Kyoeisha Chemical Co., Ltd.) and Epiol TMP (manufactured by NIPPON BUSINESS CO., LTD.) And the like can be given.

Examples of the compound having two or more 3,4-epoxycyclohexyl groups in the molecule include 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, 2- (3,4 Bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxycyclohexylmethyl) adipate, bis (Cyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3 ', 4'-epoxy-6'-methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane) (3,4-epoxycyclohexylmethyl) ether of ethylene glycol, ethylenebis (3,4-epoxycyclohexanecarboxylate), lactone-modified 3,4-epoxycyclohexylmethyl-3 ' , 4'-epoxycyclohexanecarboxylate, and the like.

Of these cationic polymerizable compounds, phenol novolak type epoxy resin and polyphenol type epoxy resin are preferable.

On the other hand, as the polyfunctional (meth) acrylate compound, for example,

Acrylate such as ethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol (meth) acrylate, polypropylene glycol di (Meth) acryloyloxyethyl) phosphate, pentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tri (Meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, triacryloyloxypentaerythritol succinic acid (also known as 3-acryloyloxy- , 2-bisacryloyloxymethyl-propyl) ester, diacryloyloxypentaerythritol succinic acid (alias: 3-acryloyloxy-2-acryloyloxymethyl-propyl) ester, pentaacryloyl Ilocidipentaeri Acryloyloxymethyl-propyl] -2,2-bis-acryloyloxymethyl-propyl] ester}, tetraacryloyloxymethyl-2,2-bis (3-acryloyloxy-2,2-bis-acryloyloxymethyl-propyl) -2-acryloyloxymethyl-propyl] ester} or the like is used in place of . Examples of commercially available products include Aronix M-210, M-240, M-6200, M-309, M-400, M-402, M-405, M- KAYARAD HDDA, copper HX-220, copper R-604, copper TMPTA, copper DPHA, copper DPCA-20, copper DPCA-30 (manufactured by Toa Kosei Kogyo K.K.) , DPCA-60, DPCA-120 (manufactured by Nippon Kayaku Co., Ltd.), Biscott 260, Dong 312, Dong 335HP, Dong 295, Dong 300, Dong 360, Dong GPT, Dong 3PA, Dong 400 Manufactured by Yuki Kogyo Co., Ltd.).

They are used alone or in combination.

[E] Curing accelerator

The [E] curing accelerator may be added in combination with the [C] curing agent to improve the heat resistance and hardness of the formed protective film.

Specific examples of the curing accelerator [D]

Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 2,4-diamino-6- [ )] - ethyl-S-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')] - [2'-ethyl-4'-methylimidazolyl undecylimidazolyl- (1 ')] -ethyl-S-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2 Phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenylimidazole isocyanuric acid adduct, 2,4-diamino-6- [ )] -Ethyl-S-triazine isocyanuric acid adduct.

The addition amount of the curing accelerator [D] is preferably 0.0001 to 10 parts by weight based on 100 parts by weight of the copolymer (A). More preferably from 0.001 to 1 part by weight from the viewpoints of heat resistance and storage stability.

[F] Surfactant

The surfactant may be added to improve the application performance of the resin composition of the present invention.

Examples of such a surfactant include fluorine surfactants, silicone surfactants, nonionic surfactants, and other surfactants.

Examples of the fluorochemical surfactant include BM-1000 and BM-1100 manufactured by BM CHIMIE Co., Ltd., Megafac F142D, Faf 172, Copper F 173, Copper F 183, Sumitomo (trade name) manufactured by Dainippon Ink and Chemicals, FTX-218, FTX-218, and Asahi (trade name) manufactured by 3M Co., Ltd., Fluorad FC-135, FC-170C, FC-430 and FC- S-131, S-141, S-145, S-382, SC-101, SC-102, SC- -103, SC-104, SC-105, SC-106, and the like.

Examples of the silicone surfactants include SH-28PA, SH-190, SH-193, SZ-6032, SF-8428, DC-57, DC-190, and PAINTAD19 (trade names, manufactured by Toray Dow Corning Silicone Co., 300, Dong 306, Dong 310, Dong 335, Dong 341, Dong 344, Dong 370, L-7001, L-7002, manufactured by Big Chem Japan Co., And commercial products such as EF301, EF303 and EF352 manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KP341, Shin Akita Kasei Co.,

Examples of the nonionic surfactant include polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyoxyethylene dialkyl ester, and the like.

Examples of the polyoxyethylene alkyl ether include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, and the like. Examples of polyoxyethylene aryl ethers include polyoxyethylene octyl phenyl ether and polyoxyethylene nonyl phenyl ether. Examples of polyoxyethylene dialkyl esters include polyoxyethylene dilaurate and polyoxyethylene distearate.

As the other surfactant, trade name: (meth) acrylic acid-based copolymer poly-flow No. 57 and No. 90 available from Kyoeisha Chemical Co., Ltd. can be mentioned.

The amount of these [F] surfactants to be added is preferably 5 parts by weight or less, more preferably 2 parts by weight or less, per 100 parts by weight of the polymer [A]. When the amount of the surfactant is more than 5 parts by weight, film roughness of the coating film tends to easily occur in the coating step.

Thermosensitive acid Generator

A thermosensitive acid generator may be added to the composition of the present invention. Examples of the heat-sensitive acid generator include sulfonium salts, benzothiazonium salts, ammonium salts, and phosphonium salts. Of these, sulfonium salts and benzothiazonium salts are preferably used.

The resin composition of the present invention is prepared by homogeneously dissolving or dispersing the respective components described above in an appropriate solvent. As the solvent to be used, those which do not react with each component by dissolving or dispersing each component of the composition are preferably used.

The resin composition of the present invention is characterized in that the component [A] is [A3] (a) a polymerizable unsaturated compound having at least one functional group selected from the group consisting of oxiranyl, oxetanyl and allyl groups, Is a copolymer of a polymerizable unsaturated compound other than the component (a), and is a copolymer of a carboxyl group, a carboxylic acid anhydride group, an acetal ester structure of a carboxylic acid, a ketal ester structure of a carboxylic acid, In the case of a copolymer having no alkyl ester structure and no t-butyl ester structure of carboxylic acid, it is prepared as a set containing a first liquid containing no [C] curing agent and a second liquid containing a [C] curing agent , Can be mixed before use. It is preferable that the first liquid contains [D] a polyfunctional compound.

Examples of such solvents include alcohols, ethers, glycol ethers, ethylene glycol alkyl ether acetates, diethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol alkyl ether acetates, Glycol alkyl ether propionate, aromatic hydrocarbons, ketones, esters and the like.

Specific examples thereof include alcohols such as methanol, ethanol, benzyl alcohol and the like;

Ethers such as tetrahydrofuran;

As the glycol ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and the like;

As the ethylene glycol alkyl ether acetates, methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate and the like;

Diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether and the like;

Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether and the like;

Propylene glycol monoalkyl ethers such as propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, propylene glycol butyl ether and the like;

As the propylene glycol dialkyl ether, propylene glycol dimethyl ether, propylene glycol methyl ethyl ether, propylene glycol methyl propyl ether, propylene glycol methyl isopropyl ether, propylene glycol methyl butyl ether, propylene glycol methyl isobutyl ether, propylene glycol methyl pentyl ether, Glycol methyl cyclopentyl ether, propylene glycol methyl hexyl ether, propylene glycol methyl cyclohexyl ether, propylene glycol methyl heptyl ether, propylene glycol methyl octyl ether and the like;

Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol butyl ether acetate and the like;

Propylene glycol alkyl ether propionate, propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether propionate and the like;

Aromatic hydrocarbons such as toluene, xylene and the like;

Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl isoamyl ketone and the like;

Examples of the ester include methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy- Hydroxypropionate, propyl 3-hydroxypropionate, propyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, 2- Methyl methoxyacetate, methyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethoxyacetate, ethoxyacetate, ethoxyacetate, isopropylacetate, Propoxyacetic acid, propoxyacetic acid, propoxyacetic acid, propoxyacetic acid, propoxyacetic acid, butoxyacetic acid, butoxyacetic acid, Methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, methyl 2- methoxypropionate, methyl 2-methoxypropionate, Ethoxypropionate, propyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, Ethoxypropionate, propyl 3-ethoxypropionate, propyl 3-ethoxypropionate, propyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, Butyl propionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, Acid propyl, and 3-butoxy-propionic acid butyl, respectively.

Of these, alcohols, diethylene glycol, propylene glycol alkyl acetates, ethylene glycol alkyl ether acetates and diethylene glycol dialkyl ethers are preferable, and benzyl alcohol, diethylene glycol ethyl methyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether Acetate, diethylene glycol dimethyl ether, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol diethyl ether, methyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-methoxypropionate .

The amount of the solvent to be used is preferably 1 to 50% by weight, more preferably 5 to 40% by weight, in the composition of the present invention, the content of the total solid content (amount obtained by removing the amount of solvent from the total amount of the composition containing the solvent) .

A high boiling solvent may be used together with the above-mentioned solvent. Examples of the high boiling point solvent usable herein include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamide, Butanol, ethyl benzoate, diethyl oxalate, diethyl benzoate, ethyl benzoate, ethyl benzoate, ethyl benzoate, ethyl benzoate, ethyl benzoate, Diethyl maleate,? -Butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, and the like.

The amount of the high boiling point solvent to be used is preferably 90% by weight or less, more preferably 80% by weight or less, based on the total amount of the solvent.

The composition prepared as described above is preferably used after filtration using a millipore filter having an pore size of 0.2 to 3.0 mu m, more preferably a pore size of 0.2 to 0.5 mu m or so.

Formation of protective film of color filter

Next, a method for forming a protective film of a color filter using the composition of the present invention will be described.

A protective film of a desired color filter can be formed by applying a resin composition solution of the present invention to the surface of a substrate, pre baking to remove the solvent to form a coating film, and then performing heat treatment.

When the resin composition of the present invention is prepared as a set containing the first solution and the second solution, and the mixture is used, the first solution and the second solution of the set are mixed, A protective film of a color filter can be formed by forming a film and then performing heat treatment.

As the substrate that can be used, for example, glass, quartz, silicon, resin, or the like can be used. Examples of the resin include resins such as polyethylene terephthalate, polybutylene terephthalate, polyether sulfone, polycarbonate, polyimide, ring-opening polymers of cyclic olefins and hydrogenated products thereof.

As a coating method, a suitable method such as a spraying method, a roll coating method, a rotation coating method, a bar coating method, and an ink jet method can be used. Particularly, a coating method using a spin coater, a spinless coater or a slit die coater is preferably used .

The conditions for the prebaking differ depending on the kind of each component and the blending ratio, and preferably from 70 to 90 DEG C for about 1 to 15 minutes. The thickness of the coating film is preferably 0.15 to 8.5 mu m, more preferably 0.15 to 6.5 mu m, and still more preferably 0.15 to 4.5 mu m. The thickness of the coating film referred to here is to be understood as the thickness after removal of the solvent.

The heat treatment after the coating film formation can be carried out by a suitable heating apparatus such as a hot plate or a clean oven. The treatment temperature is preferably about 150 to 250 DEG C, and the heating time may be 5 to 30 minutes in the case of using a hot plate and 30 to 90 minutes in the case of using an oven.

When a radiation-sensitive acid generator is used in the resin composition, the resin composition is coated on the surface of the substrate, the solvent is removed by prebaking to form a coating film, and then a radiation treatment (exposure treatment) Can be formed. If necessary, a further heat treatment may be performed after the exposure treatment.

Examples of the radiation that can be used in the irradiation treatment of the radiation include visible light, ultraviolet light, far ultraviolet light, electron beam, X-ray and the like, but ultraviolet rays containing light having a wavelength of 190 to 450 nm are preferable.

The exposure dose is preferably 100 to 20,000 J / m2, more preferably 150 to 10,000 J / m2.

After the irradiation of the radiation, heat treatment may be further optionally performed. The heating temperature at this time is preferably about 150 to 250 DEG C, and a suitable apparatus such as a hot plate or a clean oven can be used as the heating apparatus. The heating time may be 5 to 30 minutes in the case of using a hot plate, and 30 to 90 minutes in the case of using an oven.

The protective film of the color filter

The thickness of the protective film thus formed is preferably 0.1 to 8 占 퐉, more preferably 0.1 to 6 占 퐉, and still more preferably 0.1 to 4 占 퐉. Further, when the protective film of the present invention is formed on a substrate having a step of a color filter, the above-mentioned film thickness should be understood as the thickness from the top of the color filter.

The protective film of the present invention is a transparent protective film which satisfies adhesiveness, surface hardness, transparency, heat resistance, light resistance, solvent resistance and the like as well as the color formed on the base substrate It is preferable as a protective film for a light pipe having excellent capability of flattening a step of a filter.

Particularly, since the protective film of the present invention may be exposed to heating in excess of 250 캜 in the panel manufacturing process, having sufficient heat resistance to such a case is assured by having sufficient dimensional stability at 270 캜.

[Example]

Hereinafter, the present invention will be described in more detail with reference to Synthesis Examples and Examples, but the present invention is not limited to the following Examples.

(Co) polymer

Synthesis Example 1

5 parts by weight of 2,2'-azobis-isobutyronitrile and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 70 parts by weight of glycidyl methacrylate and 30 parts by weight of styrene were charged, and after nitrogen replacement, stirring was started slowly. The solution temperature was raised to 95 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-1). The solid concentration of the obtained polymer solution was 32.8% by weight.

Synthesis Example 2

5 parts by weight of 2,2'-azobis-isobutyronitrile and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 80 parts by weight of 3-ethyl-3-methacryloyloxymethyloxetane and 20 parts by weight of styrene were charged, purged with nitrogen, and then slowly stirred. The solution temperature was raised to 95 캜, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-2). The solid concentration of the obtained polymer solution was 33.0% by weight.

Synthesis Example 3

5 parts by weight of 2,2'-azobis-isobutyronitrile and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 70 parts by weight of glycidyl methacrylate, 15 parts by weight of styrene, and 15 parts by weight of N-cyclohexylmaleimide were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 95 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-3). The solid concentration of the obtained polymer solution was 33.1 wt%.

Synthesis Example 4

5 parts by weight of 2,2'-azobis-isobutyronitrile and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 60 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene and 30 parts by weight of tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate were charged, and after nitrogen substitution, stirring was started slowly . The solution temperature was raised to 95 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-4). The solid concentration of the obtained polymer solution was 32.9% by weight.

Synthesis Example 5

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 50 parts by weight of glycidyl methacrylate, 15 parts by weight of styrene, 15 parts by weight of N-cyclohexylmaleimide and 20 parts by weight of methacrylic acid were charged, and after nitrogen replacement, stirring was started slowly. The solution temperature was raised to 95 캜, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-5). The solid concentration of the obtained polymer solution was 33.0% by weight.

Synthesis Example 6

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 40 parts by weight of styrene and 60 parts by weight of allyl methacrylate were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-6). The solid concentration of the obtained polymer solution was 32.3% by weight.

Synthesis Example 7

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 50 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene and 40 parts by weight of allyl methacrylate were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 70 캜, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-7). The solid concentration of the obtained polymer solution was 32.6% by weight.

Synthesis Example 8

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 60 parts by weight of 3-ethyl-3-methacryloyloxymethyloxetane, 10 parts by weight of styrene and 30 parts by weight of allyl methacrylate were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-8). The solid concentration of the obtained polymer solution was 32.7% by weight.

Synthesis Example 9

5 parts by weight of 2,2'-azobis-isobutyronitrile and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 45 parts by weight of glycidyl methacrylate, 40 parts by weight of 3-ethyl-3-methacryloyloxymethyloxetane and 15 parts by weight of styrene were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-9). The solid concentration of the obtained polymer solution was 33.3% by weight.

Synthesis Example 10

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 20 parts by weight of styrene, 20 parts by weight of N-cyclohexylmaleimide, and 60 parts by weight of allyl methacrylate were charged, purged with nitrogen, and stirred slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-10). The solid concentration of the obtained polymer solution was 32.5% by weight.

Synthesis Example 11

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 20 parts by weight of styrene, 20 parts by weight of N-cyclohexylmaleimide and 20 parts by weight of methacrylic acid, 20 parts by weight of glycidyl methacrylate and 20 parts by weight of 1-ethylcyclohexylmethacrylate were charged, And stirring was started slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-11). The solid concentration of the obtained polymer solution was 32.6% by weight.

Synthesis Example 12

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 20 parts by weight of styrene, 20 parts by weight of N-cyclohexylmaleimide, 20 parts by weight of methacrylic acid, 20 parts by weight of glycidyl methacrylate and 20 parts by weight of 1-ethylcyclopentyl methacrylate were charged, And stirring was started slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-12). The solid concentration of the obtained polymer solution was 32.7% by weight.

Synthesis Example 13

5 parts by weight of 2,2'-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of propylene glycol monomethyl ether acetate were added to a flask equipped with a cooling tube and a stirrer. Subsequently, 20 parts by weight of styrene, 20 parts by weight of N-cyclohexylmaleimide, 20 parts by weight of methacrylic acid, 20 parts by weight of glycidyl methacrylate, and 20 parts by weight of tetrahydro-2H-pyran- , Purged with nitrogen, and then stirred slowly. The solution temperature was raised to 70 占 폚, and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A-13). The solid concentration of the obtained polymer solution was 32.4% by weight.

Siloxane Oligomer  Of [B] Synthetic example

Synthesis Example 1

39.6 g of phenyltrimethoxysilane and 64.0 g of (3-ethyloxetan-3-yl) propyltriethoxysilane were taken in a 500-mL three-necked flask, and 100 g of methyl isobutyl ketone was added and dissolved. The solution was warmed to 60 &lt; 0 &gt; C with stirring by a magnetic stirrer. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The polymer [B-1] had a weight average molecular weight of 1,600.

Synthesis Example 2

48.8 g of diphenyldimethoxysilane and 49.2 g of 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane were taken in a 500-mL three-necked flask, and 100 g of propylene glycol methyl ether acetate was added to dissolve the obtained product The mixed solution was heated to 60 DEG C with stirring by a magnetic stirrer. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The polymer [B-2] had a weight average molecular weight of 2,000.

Synthesis Example 3

30.4 g of tetramethoxysilane and 47.2 g of 3-glycidoxypropyltrimethoxysilane were added to a 500-mL three-necked flask, and 100 g of propylene glycol methyl ether was added to dissolve. The obtained mixed solution was stirred by a magnetic stirrer Lt; 0 &gt; C. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The polymer [B-3] had a weight average molecular weight of 1,400.

Synthesis Example 4

27.2 g of methyltrimethoxysilane and 39.2 g of 3-mercaptopropyltrimethoxysilane were added to a 500-mL three-necked flask, and 100 g of propylene glycol methyl ether was added to dissolve the mixture. The resulting mixed solution was stirred with a magnetic stirrer Lt; 0 &gt; C. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The polymer [B-4] had a weight average molecular weight of 1,900.

Synthesis Example 5

29.8 g of dimethyldimethoxysilane and 51.0 g of 3-methacryloxypropylmethyldiethoxysilane were placed in a 500-mL three-necked flask, and 100 g of propylene glycol methyl ether was added to dissolve the mixture. The resulting mixed solution was stirred by a magnetic stirrer Lt; 0 &gt; C. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The polymer [B-5] had a weight average molecular weight of 1,800.

Synthesis Example 6

27.0 g of methyltrimethoxysilane and 48.1 g of 3-acryloxypropylmethyldiethoxysilane were added to a 500-mL three-necked flask, and 100 g of propylene glycol methyl ether was added to dissolve. The resulting mixed solution was stirred by a magnetic stirrer Lt; 0 &gt; C. To this, 8.6 g of ion-exchanged water containing 1% by weight of oxalic acid was continuously added over 1 hour. After reacting at 60 DEG C for 4 hours, the obtained reaction solution was cooled to room temperature. Thereafter, the alcohol component as the reaction by-product was distilled off under reduced pressure from the reaction solution. The weight average molecular weight of this polymer [B-6] was 2,100.

Preparation and evaluation of resin composition

Example 1

20 parts by weight of the siloxane oligomer (B-1), 20 parts by weight of hexahydronaphthalene (B-1), and 20 parts by weight of the siloxane oligomer (B-1) were added to a solution containing the copolymer (A- 40 parts by weight of phthalic anhydride (C-1), 0.1 part by weight of 2-phenyl-4-methylimidazole (D-1) as a curing accelerator, and SH-28PA (manufactured by Dow Corning Silicone Co., (S-1) and diethylene glycol ethyl methyl ether (S-2) were added at a ratio of 8: 2 so that the solid content concentration became 20% by weight , And filtered with a Millipore filter having a pore diameter of 0.5 mu m to prepare a resin composition.

The composition was coated on a SiO ₂ immersion glass substrate using a spinner, pre-baked on a hot plate at 80 ° C for 5 minutes to form a coating film, and heat treated in an oven at 230 ° C for 60 minutes to form a protective film having a film thickness of 2.0 μm .

Evaluation of protective film

(1) Evaluation of transparency

The transmittance of the substrate having the protective film formed as described above was measured using a spectrophotometer (150-20 type double beam (manufactured by Hitachi Seisakusho Co., Ltd.)) at 400 to 800 nm. The minimum values of the transmittance of 400 to 800 nm are shown in Table 1. When the value is 95% or more, the transparency of the protective film is good.

(2) Evaluation of thermal stability stability

The substrate having the protective film formed as described above was heated in an oven at 250 DEG C for one hour, and the film thickness before and after heating was measured. Table 1 shows the thermal stability stability calculated according to the following formula (1). When this value is 95% or more, it can be said that the thermal stability is good.

[Equation 1]

Stability of heat resistance dimension = (film thickness after heating) / (film thickness before heating) x 100 (%)

(3) Evaluation of heat discoloration resistance

The substrate having the protective film formed as described above was heated in an oven at 250 캜 for 1 hour, and the transparency before and after heating was measured in the same manner as in the above (1). The heat discoloration resistance calculated according to the following formula (2) is shown in Table 1. When this value is 5% or less, it can be said that the heat discoloration resistance is good.

&Quot; (2) &quot;

Heat discoloration property = Transmittance before heating - Transmittance (%) after heating

(4) Measurement of pencil hardness

With respect to the substrate having the protective film formed as described above, the surface hardness of the protective film was measured by a pencil scratch test of 8.4.1 of JIS K-5400-1990. These values are shown in Table 1. When this value is 4H or more, the surface hardness is good.

(5) Evaluation of adhesion

After the substrate having the protective film formed as described above was subjected to a pressure cooker test (120 DEG C, 100% humidity, 100% for 4 hours), 8.5.3 of the JIS K-5400-1990 adhesion lattice tape method (Adhesion to SiO ₂ ) was evaluated. Of the 100 grids, the number of remaining grids is shown in Table 2.

A protective film having a thickness of 2.0 탆 was formed in the same manner as described above except that a Cr substrate was used in place of the SiO ₂ immersion glass substrate for the evaluation of the adhesion to Cr, and the same evaluation was made by the above-mentioned lattice tape method. The results are shown in Table 1.

(6) Evaluation of sublimate

After the above composition was baked on a SiO ₂ immersion glass substrate using a spinner to a film thickness of 2.0 탆, a glass wafer was set on a substrate 1 to 2 cm above the substrate to be prebaked, Minute preliminary baking was carried out to attach the ascending material to the glass wafer. Thereafter, the haze value of the substrate to which the ascending material was attached was measured using a haze meter to evaluate the presence or absence of the sublimed material. The haze value is observed to be high (haze value> 1) when there is a large amount of charge (out gas is large), and the haze value is almost zero when there is no charge.

(7) Evaluation of storage stability

The viscosity of the resin composition for forming a protective film prepared in Example 1 was measured using an ELD type viscometer manufactured by Tokyo Kikai Co., Thereafter, the solution viscosity at 25 캜 was measured daily while the composition was kept at 25 캜. The number of days required to increase the viscosity by 5% based on the viscosity immediately after the preparation was determined. When the number of days is more than 20 days, the storage stability is good.

(8) Evaluation of alkalinity

The substrate having the protective film formed as described above was immersed in 5% NaOH at 30 DEG C for 30 minutes, and then the film thickness was measured after removing moisture with a hot plate. The alkali resistance calculated according to the following formula (3) is shown in Table 1. When this value is 95% or more, it can be said that the alkali resistance is good.

&Quot; (3) &quot;

Alkalinity = (film thickness after moisture removal) / (film thickness before immersion) x 100 (%)

(9) Evaluation of ITO patterning characteristics

An ITO target (an ITO filling rate of 95% or more, In ₂ O ₃ / SnO ₂ (thickness: 100 Å) was deposited on a substrate having a protective film formed as described above with a high rate sputtering apparatus SH-550-C12 (manufactured by NIPPON SHINO KOGYO Co., ₂ = 90/10 weight ratio), ITO was sputtered at 60 占 폚. The atmosphere at this time was a reduced pressure of 1.0 × 10 ^-5 Pa, an Ar gas flow rate of 3.12 × 10 ^-3 m ³ / hour, and an O ₂ gas flow rate of 1.2 × 10 ^-5 m 3 / hour. The substrate after the sputtering was heated in a clean oven at 240 캜 for 1 hour.

Subsequently, a positive resist PFR3650 manufactured by JSR Corporation was coated on the obtained substrate using a spinner, and prebaked at 90 DEG C for 2 minutes on a hot plate to form a coating film. Thereafter, using a photomask having a line and space pattern of 10 占 퐉 / 10 占 퐉, the intensity ratio of ghi rays (wavelengths of 436 nm, 405 nm and 365 nm = 2.7) was measured using a photoconductor Canon PLA501F : 2.5: 4.8) was irradiated at an exposure of 40 W / m2 and 250 J / m2 in terms of i-line, immersed in a 2.4% aqueous TMAH solution at room temperature for 60 seconds, rinsed with ultrapure water for 60 seconds, . Thereafter, the substrate was subjected to heat treatment in a clean oven at 150 DEG C for 1 hour to produce a substrate on which a resist pattern was formed.

Subsequently, patterning of ITO by wet etching was performed using an etchant in which nitric acid / hydrochloric acid was mixed at a weight ratio of 1/3. The obtained substrate was immersed in an etching agent, the substrate was taken out every 10 seconds, and the line width of the formed ITO line pattern was measured with an optical microscope to measure the etching time at which the line width of the ITO line pattern became 10 mu m. The line width of the ITO line pattern when immersed in the etching agent was measured with an optical microscope for a time corresponding to 1.2 times of this etching time, and the results are shown in Table 1. The closer the line width of the formed ITO line pattern is to 10 탆, the more excellent ITO patterning characteristics can be obtained.

Examples 2 to 18 and Comparative Examples 1 to 5

A resin composition was prepared in the same manner as in Example 1 except that the kind and amount of each component of the composition were changed as shown in Table 1 and the solvent shown in Table 1 was used to adjust the solid content concentration as shown in Table 1. [

Using the resin composition for forming a protective film prepared as described above, a protective film was formed in the same manner as in Example 1 and evaluated. The results are shown in Table 1.

In Table 1, the abbreviations of the adhesion promoter (B), the acid anhydride (C), the curing accelerator (D), the cationic polymerizable compound (E), the surfactant (F) and the solvent (S) .

B-1 to B-6:

B-7: Silicone alkoxy oligomer (trade name: X-41-1056, manufactured by Shinetsu Chemical Co., Ltd.)

B-8: Epoxy-modified silicone oil (trade name: BY16-855D, manufactured by Toray Dow Corning Silicone Co., Ltd.)

B-9: Epoxy-modified silicone oil (trade name: TSF4730, manufactured by Momentive Performance Materials)

B-10: Carboxy-modified silicone oil (trade name: SF8418, manufactured by Toray Dow Corning Silicone Co., Ltd.)

b-1:? -glycidoxypropyltrimethoxysilane

C-1: Hexahydrophthalic anhydride

C-2: Trimellitic acid anhydride

C-3: ST / maleic anhydride copolymer

C-4: ST / cyclohexylmaleimide / maleic anhydride copolymer

D-1: 2-phenyl-4-methylimidazole

D-2: 2-phenyl-4-methylimidazole-5-hydroxymethylimidazole

D-3: 2-phenyl-1-benzylimidazole

D-4: 1-Benzyl-2-methylimidazole

E-1: bisphenol A novolak type epoxy resin (Epikote 828, manufactured by Japan Epoxy Resin Co., Ltd.)

E-2: novolak type epoxy resin (trade name: Epicoat 154, manufactured by Japan Epoxy Resin Co., Ltd.)

E-3: dipentaerythritol hexaacrylate (trade name: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.)

E-4: pentaacryloyloxydipentaerythritol succinic acid {alias: [3- (3-acryloyloxy-2,2-bis-acryloyloxymethyl-propyl) -2,2-bis- Yloxymethyl-propyl] ester, abbreviation: PADPS}

F-1: silicone surfactant (trade name: SH-28PA, manufactured by Toray Dow Corning Silicone Co., Ltd.)

F-2: silicone surfactant (trade name: Byk-344, manufactured by Big Chem Co., Ltd.)

F-3: Fluorine-based surfactant (trade name: POTGENT FTX-218, manufactured by NEOS Co., Ltd.)

F-4: silicone surfactant (trade name: PAINTAD19, manufactured by Toray Dow Corning Silicone Co., Ltd.)

S-1: Propylene glycol monomethyl ether acetate

S-2: Diethylene glycol ethyl methyl ether

EFFECTS OF THE INVENTION [

According to the present invention, it is possible to form a cured film having a high flatness even on a substrate having a low surface flatness, to have high transparency and surface hardness, to exhibit various resistance properties such as heat resistance and pressure resistance, acid resistance, alkali resistance and sputter resistance A resin composition which is preferably used for forming a protective film for a light device having a good patterning property of a wiring electrode, has a small amount of a sublimation generated at the time of forming a protective film, and is excellent in storage stability as a composition, And a protective film formed from the composition.

Claims (7)

[A3] (A3) a polymerizable unsaturated compound having at least one functional group selected from the group consisting of an oxiranyl group, an oxetanyl group and an allyl group, and (b5) a polymerizable unsaturated compound other than the above component (a) Which is a copolymer of a carboxyl group, a carboxylic acid anhydride group, an acetal ester structure of a carboxylic acid, a ketal ester structure of a carboxylic acid, a 1-alkylcycloalkyl ester structure of a carboxylic acid, and a t- A copolymer having no ester structure, and
(A) component selected from the group consisting of [B] oxetanyl groups, episulfide groups, vinyl groups, allyl groups, (meth) acryloyl groups, mercapto groups, ureido groups and styryl groups. Wherein the siloxane oligomer comprises a siloxane oligomer containing a functional group. The curable resin composition according to claim 1, wherein the component [B] is a siloxane oligomer obtained by cohydrolysis of an alkoxysilane represented by each of the following formulas (1) and (2)
&Lt; Formula 1 >
Si (R ¹ ) ₁ (R ² ) _m (OR ³ ) _n
(Wherein R ¹ represents a substituent group containing an oxetanyl group, an episulfide group, a vinyl group, an allyl group, a (meth) acryloyl group, a mercapto group, an ureido group or a styryl group, and R ² and R ³ are the same M and n are each an integer of 1 to 3, and m is an integer of 0 to 2, provided that 1 + m + n = 4.
(2)
Si (R ⁴ ) _x (OR ⁵ ) _4-x
(Wherein R ⁴ and R ⁵ may be the same or different and each is a hydrogen atom or a monovalent organic group and x is an integer of 0 to 3) The curable resin composition according to claim 1 or 2, further comprising a [C] curing agent. The curable resin composition according to any one of claims 1 to 3, further comprising [D] a polyfunctional monomer as a cationically polymerizable compound (excluding the above component [A3]), a polyfunctional (meth) acrylic compound, Composition. A method for forming a protective film for a color filter, characterized in that a coating film is formed on a substrate by using the curable resin composition according to any one of claims 1 to 4, and then heat treatment is performed. A protective film for a color filter formed from the curable resin composition according to any one of claims 1 to 4. delete