KR101565675B1 - Heat emitting package of mounting under element and substrate and manufacturing method thereof - Google Patents

Heat emitting package of mounting under element and substrate and manufacturing method thereof Download PDF

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KR101565675B1
KR101565675B1 KR1020140009092A KR20140009092A KR101565675B1 KR 101565675 B1 KR101565675 B1 KR 101565675B1 KR 1020140009092 A KR1020140009092 A KR 1020140009092A KR 20140009092 A KR20140009092 A KR 20140009092A KR 101565675 B1 KR101565675 B1 KR 101565675B1
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South Korea
Prior art keywords
metal
main base
groove
heat dissipation
manufacturing
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KR1020140009092A
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Korean (ko)
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KR20150088591A (en
Inventor
김현호
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재단법인 다차원 스마트 아이티 융합시스템 연구단
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Priority to KR1020140009092A priority Critical patent/KR101565675B1/en
Priority to PCT/KR2015/000552 priority patent/WO2015111889A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A method of fabricating a heat dissipation package mounted on a device includes the steps of: creating at least one groove on the top surface of the main base; Bonding the metal to the at least one groove based on the position of the predetermined element; Stacking an insulator on the main base so that the metal is covered; And polishing the upper surface and the lower surface of the main base in which the insulator is stacked so that the upper surface and the lower surface of the metal are exposed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipation package,

TECHNICAL FIELD [0001] The present invention relates to a heat dissipation package mounted on an element and a method of manufacturing the same, and more specifically, to a heat dissipation package including a metal disposed so as to be in contact with an element for heat dissipation of the element and a manufacturing method thereof.

Conventionally, a structure has been proposed in which a device is bonded onto a substrate with a predetermined gap between the device and the substrate, or a heat dissipation hole is formed in the substrate to which the device is bonded, in order to release heat generated in the device.

For example, in Korean Patent Laid-Open No. 10-2013-0010387 (Jan. 28, 2013), a via hole for heat radiation is formed on a circuit board having a pattern electrode connected to an electrode of an LED element, And the generated heat is discharged to the back surface of the circuit board through the via hole.

However, there is a problem in that heat dissipation through only the heat dissipation hole with respect to heat generated in the device is limited. Further, since the heat dissipation holes are formed in the circuit board itself, there is a disadvantage that the usable area for the circuit board to which the devices are bonded is reduced.

Therefore, in the present specification, a heat dissipation package including a metal disposed directly in contact with an element for heat dissipation of the element and a technique for manufacturing the same are proposed.

Embodiments of the present invention provide a heat dissipation package that improves the heat dissipation efficiency of a device by including a metal arranged to directly contact the device, and a method of manufacturing the same.

In addition, embodiments of the present invention provide a method of bonding a metal included in a heat radiation package to at least one groove included in a main base by using a predetermined element position in a process of manufacturing a heat radiation package.

Embodiments of the present invention also provide a method of creating at least one groove included in a main base to which a metal is bonded.

In addition, embodiments of the present invention provide a heat dissipation package that performs a role of a substrate by allowing a circuit line pattern to be generated in the heat dissipation package, and a method of manufacturing the same.

A method of fabricating a heat dissipation package mounted on a device according to an embodiment of the present invention includes the steps of: creating at least one groove on the upper surface of the main base; Bonding the metal to the at least one groove based on the position of the predetermined element; Stacking an insulator on the main base so that the metal is covered; And polishing the upper surface and the lower surface of the main base in which the insulator is stacked so that the upper surface and the lower surface of the metal are exposed.

Wherein the step of bonding the metal to the at least one groove comprises: determining a position of the metal using the position of the predetermined element; Dispensing the fixed adhesive to the at least one groove based on the determined position of the metal; Disposing the metal in the at least one groove in which the fixed adhesive is dispensed; And drying the fixed adhesive dispensed between the at least one groove and the metal to fix the metal.

The step of determining the position of the metal using the position of the predetermined element may include the step of determining the position of the metal so that the lower end of the element and the upper surface of the metal are in contact with each other for heat dissipation of the element.

The step of forming the at least one groove on the upper surface of the main base may include bonding at least two planar bases of the same material as the main base to the upper surface of the main base.

The step of forming the at least one groove on the upper surface of the main base may be performed by using at least one of Imprinting, Drilling, And creating a groove.

A method of manufacturing a heat dissipation package to be mounted on a device, comprising the steps of: forming at least one of the remaining portions of the main base on which the insulator is stacked, And forming the second electrode layer.

The device may be at least one of a light emitting diode (LED), a power module, a processor, or a power chip.

A method of fabricating a heat dissipation package mounted on a CIS (CMOS Image Sensor) according to an embodiment of the present invention includes: forming at least one groove on a top surface of a main base; Bonding a metal to the at least one groove based on a position of a predetermined CIS; Stacking an insulator on the main base so that the metal is covered; And polishing the upper surface and the lower surface of the main base in which the insulator is stacked so that the upper surface and the lower surface of the metal are exposed.

The step of bonding the metal to the at least one groove may include: determining a position of the metal using the position of the predetermined CIS; Dispensing the fixed adhesive to the at least one groove based on the determined position of the metal; Disposing the metal in the at least one groove in which the fixed adhesive is dispensed; And drying the fixed adhesive dispensed between the at least one groove and the metal to fix the metal.

The step of determining the position of the metal using the preset CIS position may include determining the position of the metal so that the lower end of the CIS and the upper surface of the metal are in contact with each other to dissipate heat of the CIS.

The step of forming the at least one groove on the upper surface of the main base may include bonding at least two planar bases of the same material as the main base to the upper surface of the main base.

The step of forming the at least one groove on the upper surface of the main base may be performed by using at least one of Imprinting, Drilling, And creating a groove.

According to an embodiment of the present invention, there is provided a heat dissipation package mounted on a device, comprising: a metal having exposed upper and lower surfaces; A main base adhered to the metal, the main base surrounding the side lower portion of the metal; And an insulator laminated on the main base and surrounding a side upper end portion of the metal, the metal being disposed at a position where the lower end of the element and the upper surface of the metal are in contact with each other for heat dissipation of the element.

A heat dissipation package mounted on a CIS (CMOS Image Sensor) according to an embodiment of the present invention includes a metal exposed on the upper and lower surfaces; A main base adhered to the metal, the main base surrounding the side lower portion of the metal; And an insulator laminated on the main base and surrounding a side upper end portion of the metal, wherein the metal is disposed at a position where a lower end of the CIS and an upper surface of the metal are in contact with each other for heat dissipation of the CIS.

Embodiments of the present invention can provide a heat dissipation package that improves the heat dissipation efficiency of a device and a method of manufacturing the same, by including a metal disposed directly in contact with the device.

In addition, embodiments of the present invention can provide a method of bonding a metal contained in a heat radiation package to at least one groove included in a main base by using a predetermined element position in the process of manufacturing the heat radiation package.

Embodiments of the present invention also provide a method of creating at least one groove included in a main base to which a metal is bonded.

In addition, embodiments of the present invention can provide a heat dissipation package that performs a role of a substrate and a manufacturing method thereof by making it possible to generate a circuit line pattern in the heat dissipation package.

1 is a view illustrating a process of manufacturing a heat dissipation package according to an embodiment of the present invention.
2 is a view showing a process of manufacturing at least one groove included in the main base in the process of manufacturing the heat radiation package.
3 is a view illustrating a heat dissipation package mounted on an element according to an embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a heat radiation package according to an embodiment of the present invention.
5 is a view illustrating a process of manufacturing a heat dissipation package according to another embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to or limited by the embodiments. In addition, the same reference numerals shown in the drawings denote the same members.

1 is a view illustrating a process of manufacturing a heat dissipation package according to an embodiment of the present invention.

Referring to FIG. 1, a system for manufacturing a heat dissipation package mounted on a device according to an embodiment of the present invention creates at least one groove 111 on the upper surface of a main base 110. Here, the material constituting the main base 110 may include, but is not limited to, a polymer, glass, or silicon, and may include materials used for manufacturing a general substrate . At this time, at least one groove 111 can be created in various ways. A detailed description thereof will be described with reference to Fig.

Here, the device may be at least one of a light emitting diode (LED), a power module, a processor, or a power chip. Also, the device may be a CIS (CMOS Image Sensor). However, the device is not limited to these, and may be any one of modules generally mountable on a semiconductor substrate.

The system for fabricating the heat dissipation package then determines the position at which the metal 130 is to be disposed using the position of the predetermined element and then determines the position of the metal 130 in the at least one groove 111 based on the determined position of the metal 130 120 may be dispensed. At this time, in the system for manufacturing the heat dissipation package, the position of the metal 130 can be determined so that the lower surface of the device and the upper surface of the metal 130 are in contact with each other.

Thereafter, the system for manufacturing the heat dissipation package arranges the metal 130 in the at least one groove 111 in which the fixed adhesive body 120 is dispensed, and dries the fixed adhesive body 120 to remove the metal 130 Can be fixed.

After the metal 130 is fixed to the main base 110, the system for fabricating the heat dissipation package stacks the insulator 140 on the main base 110 so that the metal 130 is covered.

The system for manufacturing the heat dissipation package polishes the upper surface 112 and the lower surface 113 of the main base 110 in which the insulator 140 is stacked so that the upper surface and the lower surface of the metal 130 are exposed.

The system for manufacturing the heat dissipation package includes a main base 110 in which the insulator 140 is stacked to generate a circuit line pattern so that the heat dissipation package can function as a substrate, A vertical passageway may be formed in at least one portion 150 of the portion.

Accordingly, the heat-radiating package manufactured through the above-described process has the main base 110 and the main base 110, which are bonded to the metal 130 and the metal 130, the upper and lower surfaces of which are exposed, 110 and an insulator 140 surrounding the side upper end portion of the metal 130. Here, the metal 130 is disposed at a position where the lower end of the element and the upper surface of the metal 130 are in contact with each other to dissipate heat. The heat dissipation package further includes a vertical passage formed in at least one portion 150 of the remaining portion of the main base 110 in which the insulator 140 is stacked, As shown in FIG.

In the case where the device is a CIS, the heat dissipation package manufactured through the process described above is bonded to the metal 130 and the metal 130, which are exposed to the upper and lower surfaces, to cover the lower side of the metal 130, 110 and an insulator 140 stacked on the main base 110 and surrounding a side upper end portion of the metal 130. Here, the metal 130 is disposed at a position where the lower end of the CIS and the upper surface of the metal 130 are in contact with each other to dissipate heat of the CIS. The heat dissipation package further includes a vertical passage formed in at least one portion 150 of the remaining portion of the main base 110 in which the insulator 140 is stacked, As shown in FIG.

As described above, the heat-radiating package according to the embodiment of the present invention is manufactured to include the metal 130 disposed to be in contact with the lower end of the device for heat radiation of the device, thereby improving the heat radiation efficiency of the device, By being fabricated to include a vertical passageway for creating a pattern, it can serve as a substrate.

2 is a view showing a process of manufacturing at least one groove included in the main base in the process of manufacturing the heat radiation package.

2, a system for manufacturing a heat-radiating package according to an embodiment of the present invention includes at least two planar bases 220 of the same material as the main base 210, which are joined to the upper surface of the main base 210, At least one groove 211 included in the main base 210 can be created.

The system for manufacturing the heat dissipation package can be manufactured by removing a portion 230 of the main base 210 by using at least one of imprinting, drilling, and etching, At least one groove 211 included in the groove 210 may be formed.

3 is a view illustrating a heat dissipation package mounted on an element according to an embodiment of the present invention.

Referring to FIG. 3, a heat dissipation package 310 according to an embodiment of the present invention may be mounted on the device 320 to emit heat 330 generated from the device 320. At this time, the heat dissipation package 310 can be attached to the element 320 by being bonded to the element 320 with the adhesive 321. In addition, the circuit line pattern 340 can be generated in the heat dissipation package 310 through the vertical passage.

The heat dissipation package 310 is stacked on the main base 312 and the main base 312 which are bonded to the metal 311 and the metal 311 exposed on the upper and lower surfaces and cover the lower side of the metal 311, And an insulator 313 surrounding a side upper end portion of the insulator 311. Here, the metal 311 is disposed at a position where the lower end of the element and the upper surface of the metal 311 are in contact with each other to dissipate heat of the element.

4 is a flowchart illustrating a method of manufacturing a heat radiation package according to an embodiment of the present invention.

Referring to FIG. 4, a system for manufacturing a heat dissipation package according to an embodiment of the present invention creates at least one groove on the upper surface of the main base (410). Here, the system for manufacturing the heat radiation package can form at least one groove on the upper surface of the main base by bonding at least two planar bases of the same material as the main base to the upper surface of the main base. The system for manufacturing the heat dissipation package may generate at least one groove on the upper surface of the main base by using at least one of imprinting, drilling, and etching.

The system for fabricating the heat dissipation package then attaches the metal to at least one groove based on the location of the predetermined element (420). Here, the system for manufacturing the heat dissipation package determines the position of the metal using the position of the predetermined element, dispenses the fixed adhesive to at least one groove based on the determined position of the metal, The metal can be adhered to at least one groove by disposing the metal in at least one groove that is fenced and drying and fixing the metal by drying the fixed adhesive that is dispensed between the at least one groove and the metal. In this case, in the system for manufacturing the heat dissipation package, the position of the metal can be determined so that the lower end of the device and the upper surface of the metal are in contact with each other for heat dissipation of the device.

In addition, the system for fabricating the heat-radiating package includes an insulator 430 stacked on the main base so as to cover the metal.

Thereafter, the system for manufacturing the heat dissipation package polishes (440) the upper and lower surfaces of the main base in which the insulator is stacked so that the upper and lower surfaces of the metal are exposed.

In addition, the system for fabricating the heat-radiating package may form a vertical passage (450) in at least one portion of the main base except the portion where the metal is disposed, in order to generate the circuit line pattern.

Here, the device may be at least one of a light emitting diode (LED), a power module, a processor, or a power chip.

Although not shown in the drawing, if the device is a CIS, a method of manufacturing a heat radiation package is as follows.

1) The system for manufacturing the heat dissipation package according to an embodiment of the present invention creates at least one groove on the upper surface of the main base. Here, the system for manufacturing the heat radiation package can form at least one groove on the upper surface of the main base by bonding at least two planar bases of the same material as the main base to the upper surface of the main base. The system for manufacturing the heat dissipation package may generate at least one groove on the upper surface of the main base by using at least one of imprinting, drilling, and etching.

2) The system for manufacturing the heat dissipation package adheres the metal to at least one groove based on the position of the preset CIS. Here, the system for manufacturing the heat dissipation package determines the position of the metal using the position of the predetermined CIS, dispenses the fixed adhesive to at least one groove based on the determined position of the metal, The metal can be adhered to at least one groove by disposing the metal in at least one groove that is fenced and drying and fixing the metal by drying the fixed adhesive that is dispensed between the at least one groove and the metal. At this time, in the system for manufacturing the heat radiation package, the position of the metal can be determined so that the lower end of the CIS and the upper surface of the metal are in contact with each other to dissipate heat of the CIS.

3) A system for manufacturing a heat dissipation package stacks an insulator on a main base to cover the metal.

4) The system for manufacturing the heat dissipation package polishes the upper surface and the lower surface of the main base in which the insulator is stacked so that the upper and lower surfaces of the metal are exposed.

5) In addition, in order to produce a line pattern, a system for manufacturing a heat-radiating package may form a vertical passage in at least one of the remaining portions of the main base on which the insulators are stacked, except for the portion where the metal is disposed.

5 is a view illustrating a process of manufacturing a heat dissipation package according to another embodiment of the present invention.

Referring to FIG. 5, the system for manufacturing the heat dissipation package may perform the polishing process in various ways. For example, the system for manufacturing the heat dissipation package can perform the same process as that of FIG. 1 before polishing, and only the process of polishing the upper and lower surfaces of the main base 510 is different from the polishing process of FIG. Can be performed differently.

The system for manufacturing the heat dissipation package includes a process of polishing the upper surface and the lower surface of the main base 510 in which the insulator 530 is stacked so that the upper surface 511 and the lower surface 512 of the metal 520 are exposed, The main base 510 may be polished such that all of the portions of the main base 510 are removed.

Thereafter, the system for manufacturing the heat-radiating package includes at least one of the remaining portions of the insulator 530 except for the portion where the metal 520 is disposed, for generating the circuit line pattern so that the polished heat- A vertical passage may be formed in one portion 540.

Accordingly, the heat dissipation package manufactured through the above-described process includes the metal 520 exposed on the upper and lower surfaces, and the insulator 530 surrounding the sides of the metal 520. Here, the metal 520 is disposed at a position where the lower end of the element and the upper surface of the metal 520 are in contact with each other to dissipate heat. The heat dissipation package may further include a vertical passage formed in at least one portion 540 of the insulator 530 to generate a circuit line pattern, except for the portion where the metal 520 is disposed.

The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the apparatus and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable array (FPA) A programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing unit may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.

The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device , Or may be permanently or temporarily embodied in a transmitted signal wave. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.

The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions to be recorded on the medium may be those specially designed and configured for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (14)

A method of manufacturing a heat dissipation package (100) mounted on a device,
Creating at least one groove in the upper surface of the main base;
Bonding the metal to the at least one groove based on the position of the predetermined element;
Stacking an insulator on the main base so that the metal is covered; And
Polishing the upper surface and the lower surface of the main base in which the insulator is stacked so that the upper surface and the lower surface of the metal are exposed,
Lt; / RTI >
The step of bonding the metal to the at least one groove
Determining a position of the metal using the position of the predetermined element;
Dispensing the fixed adhesive to the at least one groove based on the determined position of the metal;
Disposing the metal in the at least one groove in which the fixed adhesive is dispensed; And
Drying the fixed adhesive dispensed between the at least one groove and the metal to secure the metal
And the heat sink package. delete The method according to claim 1,
The step of determining the position of the metal using the position of the predetermined element
And determining a position of the metal so that a lower end of the element and an upper surface of the metal are in contact with each other to dissipate heat of the element. The method according to claim 1,
The step of creating the at least one groove on the upper surface of the main base
Bonding at least two planar bases of the same material as the main base to the upper surface of the main base
And the heat sink package. The method according to claim 1,
The step of creating the at least one groove on the upper surface of the main base
Forming at least one groove on the upper surface of the main base using at least one of imprinting, drilling, and etching;
And the heat sink package. The method according to claim 1,
Forming a vertical passageway in at least one of the remaining portions of the main base on which the insulator is stacked except for a portion where the metal is disposed,
Further comprising the steps of: The method according to claim 1,
The device
Wherein the heat dissipation package is at least one of a light emitting diode (LED), a power module, a processor, and a power chip. delete delete delete delete delete delete delete
KR1020140009092A 2014-01-24 2014-01-24 Heat emitting package of mounting under element and substrate and manufacturing method thereof KR101565675B1 (en)

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KR1020140009092A KR101565675B1 (en) 2014-01-24 2014-01-24 Heat emitting package of mounting under element and substrate and manufacturing method thereof
PCT/KR2015/000552 WO2015111889A1 (en) 2014-01-24 2015-01-20 Heat-dissipation package mounted to element and method for manufacturing same

Applications Claiming Priority (1)

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KR1020140009092A KR101565675B1 (en) 2014-01-24 2014-01-24 Heat emitting package of mounting under element and substrate and manufacturing method thereof

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KR101565675B1 true KR101565675B1 (en) 2015-11-04

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Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2003060142A (en) 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd Sub-mount unit and its manufacturing method
JP2007173683A (en) * 2005-12-26 2007-07-05 Nec Toppan Circuit Solutions Inc Printed wiring board, its manufacturing method, and plating/etching/grinding processor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005285849A (en) * 2004-03-26 2005-10-13 North:Kk Interlayer member for manufacturing multilayer wiring board and its manufacturing method
KR100707955B1 (en) * 2005-02-07 2007-04-16 (주) 비앤피 사이언스 Light emitting diode and manufacturing method for the same
JP2012033855A (en) * 2010-07-01 2012-02-16 Hitachi Cable Ltd Led module, led package, wiring board, and manufacturing method therefor
JP5767160B2 (en) * 2012-05-07 2015-08-19 信越化学工業株式会社 Manufacturing method of substrate for optical semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060142A (en) 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd Sub-mount unit and its manufacturing method
JP2007173683A (en) * 2005-12-26 2007-07-05 Nec Toppan Circuit Solutions Inc Printed wiring board, its manufacturing method, and plating/etching/grinding processor

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KR20150088591A (en) 2015-08-03

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