KR100681264B1 - Electronic device package and method for fabricating the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device package and a method of manufacturing the same, wherein a dicing groove is formed in a base substrate on which a plurality of electronic devices are formed, and bonded with a lid substrate having a dicing groove formed thereon, and then individually packaged by mechanical force. By separating into, it is possible to simplify the process by performing a batch process on a wafer basis.

Electronics, Packages, Dicing, Grooves, Impact, Mechanical

Description

Electronic device package and method for manufacturing the same {Electronic device package and method for fabricating the same}

1 is a schematic cross-sectional view illustrating a dicing process using a braid according to the prior art.

Figure 2 is a schematic cross-sectional view for explaining a laser dicing process according to the prior art

3 is a cross-sectional view of an electronic device package according to a first embodiment of the present invention.

4 is a cross-sectional view of an electronic device package according to a second embodiment of the present invention.

5A to 5E are cross-sectional views illustrating a manufacturing process of an electronic device package according to a first embodiment of the present invention.

6A to 6E are cross-sectional views illustrating a manufacturing process of an electronic device package according to a second embodiment of the present invention.

7 is a photographic view of an individual electronic device package manufactured and separated in accordance with the present invention.

<Description of the symbols for the main parts of the drawings>

100: base substrate

101,105,301,302,303,305: Dicing Home

110,310: home 200: electronic device

210: electrode line 300: cover substrate

The present invention relates to an electronic device package and a method of manufacturing the same, and more particularly, to form a dicing groove in a base substrate on which a plurality of electronic elements are formed, and to bond with a lid substrate on which the dicing groove is formed, The present invention relates to an electronic device package and a method of manufacturing the same, which can be simplified by performing a batch process on a wafer basis by separating into individual packages.

In general, a plurality of electronic devices are formed on a base substrate, and the plurality of electronic devices are diced and separated into individual chips.

Here, the electronic device includes forming an integrated device on a semiconductor substrate such as a silicon substrate.

Thereafter, the electronic device is packaged to be protected from the outside and mounted on a mother board for use.

FIG. 1 is a schematic cross-sectional view illustrating a dicing process using a braid according to the related art. Each base electron 10 formed with a plurality of electronic elements is diced with a braid 12. The element chip 11 is separated.

Such a dicing process using a braid is a method of completely cutting and separating a base substrate by rotating a circular braid having a thickness of several tens to several hundred microns.

Therefore, since the base substrate is cut with a circular braid, the dicing process using the braid causes damage such as cracks to the base substrate and the electronic device, resulting in a problem of deterioration of the characteristics of the electronic device. do.

FIG. 2 is a schematic cross-sectional view illustrating a laser dicing process according to the prior art, and dicing a base substrate 20 on which a plurality of electronic elements are formed by laser light to separate each of the individual electronic element chips 21. do.

This laser dicing process has been widely used recently because the impact applied to the base substrate is much smaller than the dicing process using a braid.

Meanwhile, the dicing process using the above-described braid and laser generates a lot of heat and performs the process while supplying cooling water to the dicing region.

However, the dicing process described above is a cause of contamination because by-products such as fine particles cut during the process are generated and these fine particles are thrown out through the cooling water.

And, there is a disadvantage that the cross section of the dicing is nonuniform and the dicing thickness is not easy to adjust.

In addition, since the separate chips cannot be used independently, there is a disadvantage in that an additional packaging process is performed in order to protect the chip from external foreign matter and external force.

Accordingly, the present invention has been made to solve the problems described above, after forming a dicing groove in the base substrate formed with a plurality of electronic elements, bonding with the cover substrate formed with the dicing groove, It is an object of the present invention to provide an electronic device package and a method for manufacturing the same, which can be simplified by performing a batch process on a wafer basis by separating them into individual packages.

The first preferred aspect for achieving the above object of the present invention is

A base substrate;

An electronic device formed on the base substrate;

An electrode line electrically connected to the electronic device, and drawn out to a side surface of the electronic device;

A groove is formed in the lower portion, and the electronic device package includes a cover substrate positioned in the groove, exposing a part of the electrode line, and bonded to the base substrate.

The second preferred aspect for achieving the above object of the present invention is

A base substrate having a groove formed thereon;

An electronic device formed on a bottom surface of a groove in the base substrate;

An electrode line electrically connected to the electronic device, and drawn out to a side surface of the electronic device;

An electronic device package including a cover substrate exposed to a portion of the electrode line and bonded to the base substrate is provided.

The third preferred aspect for achieving the above object of the present invention is

Forming a plurality of electronic elements on the base substrate, and forming electrode lines electrically connected to the pair of electronic elements between each neighboring pair of electronic elements;

Forming a first dicing groove in a lower portion of the base substrate in a region corresponding to the center of the electrode line, and forming a second dicing groove in a lower portion of the base substrate in a region corresponding to each pair of electronic elements;

A plurality of grooves for placing each pair of electronic elements therein are formed under the cover substrate, and third and fourth dicing grooves corresponding to the first and second dicing grooves are formed on the cover substrate. And forming a fifth dicing groove on the lid substrate spaced apart from both sides of the third dicing groove corresponding to the first dicing groove;

Bonding a lid substrate on the base substrate such that each pair of electronic elements formed in the base substrate is positioned inside each of the plurality of grooves in the lid substrate;

There is provided a method of manufacturing an electronic device package comprising a step of mechanically impacting the first to fifth dicing groove to separate the structure having each of the electronic devices individually.

A fourth preferred aspect for achieving the above object of the present invention is

Forming a plurality of grooves spaced apart from each other on the base substrate, forming a pair of electronic devices spaced apart from each other in the bottom surface of each groove, and forming an electrode line electrically connected to each of the pair of electronic devices Forming between each of a pair of electronic elements;

Forming a first dicing groove in a lower portion of the base substrate in a region corresponding to the center of the electrode line, and forming a second dicing groove in a lower portion of the base substrate in a region corresponding to each pair of electronic elements;

Third and fourth dicing grooves corresponding to the first and second dicing grooves are formed on the cover substrate, and on the cover substrate spaced apart from both sides of the third dicing groove corresponding to the first dicing groove. Forming a fifth dicing groove;

Bonding a lid substrate to the base substrate;

There is provided a method of manufacturing an electronic device package comprising a step of mechanically impacting the first to fifth dicing groove to separate the structure having each of the electronic devices individually.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3 is a cross-sectional view of an electronic device package according to a first embodiment of the present invention, including a base substrate 100; An electronic device (200) formed on the base substrate (100); An electrode line 210 electrically connected to the electronic device 200 and drawn out to a side surface of the electronic device 200; A groove 110 is formed at a lower portion of the cover 110, the electronic device 200 being positioned inside the groove 110, exposing a part of the electrode line 210, and bonded to the base substrate 100. It is composed of a substrate (300).

The electronic device package according to the present invention configured as described above may be configured by bonding the cover device 300 to the base substrate 100 by bonding the electronic device 200 formed on the base substrate 100 to the base substrate 100.

In addition, the base substrate 100 may be a semiconductor substrate, and the electronic device may be a device integrated on a semiconductor substrate.

In addition, the electronic device 200 is preferably a sensing device.

4 is a cross-sectional view of an electronic device package according to a second embodiment of the present invention, including a base substrate 100 having a groove 110 formed thereon; An electronic device 200 formed on an inner bottom surface of the groove 110 of the base substrate 100; An electrode line 210 electrically connected to the electronic device 200 and drawn out to a side surface of the electronic device 200; The cover 300 is exposed to a portion of the electrode line 210 and bonded to the base substrate 100.

5A through 5E are cross-sectional views illustrating a manufacturing process of an electronic device package according to a first embodiment of the present invention. First, as illustrated in FIG. 5A, a plurality of electronic devices 200 are disposed on a base substrate 100. ) And an electrode line 210 electrically connected to the pair of electronic elements between each neighboring pair of electronic elements.

Here, the electronic devices are preferably devices integrated on the base substrate.

The base substrate is preferably a semiconductor substrate.

Thereafter, a first dicing groove 101 is formed under the base substrate 100 in a region corresponding to the center of the electrode line 210, and the base substrate in the region corresponding to each pair of electronic elements is formed. 100) a second dicing groove 105 is formed in the lower portion (FIG. 5B).

At this time, the thickness d1 from the dicing groove to the upper surface of the base substrate is thinly formed so that the region is cut by an applied mechanical impact.

Subsequently, a plurality of grooves 310 for placing each pair of electronic elements 200 therein are formed under the cover substrate 300, and the first and second dies are disposed on the cover substrate 300. Covering substrates formed with third and fourth dicing grooves 301 and 305 corresponding to the first and second dicing grooves 101 and 105, and spaced apart from both sides of the third dicing groove 301 corresponding to the first dicing groove 101. 300) fifth dicing grooves 302 and 303 are formed in the upper portion (FIG. 5C).

Then, the cover substrate (above the base substrate 100 so that each pair of electronic elements formed in the base substrate 100 are located in each of the plurality of grooves 310 in the cover substrate 300) 300 is bonded (FIG. 5D).

On the other hand, as shown in the drawings of Figures 5c and 5d, 'd2, d3, d4' is formed thin so that the area is cut in the applied mechanical impact.

Finally, mechanical shocks are applied to the first to fifth dicing grooves 101, 105, 301, 302, 303, and 305 to separate the structure having each of the electronic devices 200 individually (FIG. 5E).

With this mechanical impact, the '320' region of Figure 5d is easily cut away from the structure.

As described above, the electronic device packaging process of the present invention is different from the conventional technology of dicing a base substrate on which a plurality of electronic devices are formed, dividing the chip into individual chips, and then packaging the separated individual chips. Dicing grooves are formed on the formed base substrate, bonded with the cover substrate on which the dicing grooves are formed, and separated into individual packages by mechanical force, thereby simplifying the process by performing a batch process on a wafer basis. There is this.

6A through 6E are cross-sectional views illustrating a manufacturing process of an electronic device package according to a second embodiment of the present invention. First, a plurality of grooves 110 spaced apart from each other are formed on an upper portion of a base substrate 100. A pair of electrode lines 210 are formed on the inner bottom surface of each groove 110 and a pair of electrode lines 210 electrically connected to each of the pair of electronic elements 200. It is formed between each of the electronic elements of (Fig. 6a).

Subsequently, a first dicing groove 101 is formed under the base substrate 100 in a region corresponding to the center of the electrode line 210, and the base substrate 100 in a region corresponding to each pair of electronic elements. The second dicing groove 105 is formed in the lower portion (FIG. 6B).

Thereafter, third and fourth dicing grooves 301 and 305 corresponding to the first and second dicing grooves 101 and 105 are formed on the cover substrate 300 and correspond to the first dicing groove 101. The fifth dicing grooves 302 and 303 are formed on the cover substrate 300 spaced apart from both sides of the third dicing groove 301. (FIG. 6C).

Then, the cover substrate 300 is bonded on the base substrate 100 (FIG. 6D).

Finally, mechanical shocks are applied to the first to fifth dicing grooves 101, 105, 301, 302, 303, and 305 to separately separate the structures having the respective electronic elements 200 (FIG. 6E).

As described above, the process according to the first and second embodiments of the present invention enables manufacturing individual electronic device packages as shown in FIG. 7.

The present invention forms a dicing groove on a base substrate on which a plurality of electronic elements are formed, bonds it to a cover substrate on which the dicing groove is formed, and then separates it into individual packages by mechanical force, thereby performing a batch process on a wafer basis. The effect is to simplify the process.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (8)

delete delete delete delete Forming a plurality of electronic elements on the base substrate, and forming electrode lines electrically connected to the pair of electronic elements between each neighboring pair of electronic elements; Forming a first dicing groove in a lower portion of the base substrate in a region corresponding to the center of the electrode line, and forming a second dicing groove in a lower portion of the base substrate in a region corresponding to each pair of electronic elements; A plurality of grooves for placing each pair of electronic elements therein are formed under a cover substrate, and third and fourth dicing grooves corresponding to the first and second dicing grooves are formed on the cover substrate. Forming a fifth dicing groove on the cover substrate spaced apart from both sides of the third dicing groove corresponding to the first dicing groove; Bonding a lid substrate on the base substrate such that each pair of electronic elements formed in the base substrate is positioned inside each of the plurality of grooves in the lid substrate; And mechanically impacting the first to fifth dicing grooves to separately separate the structures having the respective electronic devices. Forming a plurality of grooves spaced apart from each other on the base substrate, forming a pair of electronic devices spaced apart from each other in the bottom surface of each groove, and forming an electrode line electrically connected to each of the pair of electronic devices Forming between each of a pair of electronic elements; Forming a first dicing groove in a lower portion of the base substrate in a region corresponding to the center of the electrode line, and forming a second dicing groove in a lower portion of the base substrate in a region corresponding to each pair of electronic elements; Third and fourth dicing grooves corresponding to the first and second dicing grooves are formed on the cover substrate, and on the cover substrate spaced apart from both sides of the third dicing groove corresponding to the first dicing groove. Forming a fifth dicing groove; Bonding a lid substrate to the base substrate; And mechanically impacting the first to fifth dicing grooves to separately separate the structures having the respective electronic devices. The method according to claim 5 or 6, The base substrate is a semiconductor substrate, The electronic device is a method of manufacturing an electronic device package, characterized in that the device integrated on a semiconductor substrate. The method according to claim 5 or 6, The electronic device, Method of manufacturing an electronic device package, characterized in that the sensing (Sensing) device.

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