KR101561224B1 - Carrier glass remover - Google Patents

Abstract

A carrier glass peeling apparatus is disclosed. A carrier glass peeling apparatus according to the present invention is a carrier glass peeling apparatus comprising a stage unit on which a glass bonding substrate on which a carrier glass is stuck to one surface of a flexible substrate is placed, and a carrier glass on the glass bonding substrate, And a peeling unit for holding the carrier glass and peeling the carrier glass from the gap area on the flexible substrate.

Description

Carrier Glass Peeling Device {CARRIER GLASS REMOVER}

The present invention relates to a carrier glass peeling apparatus, and more particularly, to a carrier glass peeling apparatus capable of efficiently peeling a carrier glass from a flexible substrate without damaging the flexible substrate.

Recently, as the electronic display industry has rapidly developed in the semiconductor industry, a flat panel display (FPD) has begun to emerge.

A flat panel display (FPD) is thinner and lighter image display device than a cathode ray tube (CRT), which was conventionally used as a display in a TV or a computer monitor, and includes a liquid crystal display crystal display, a plasma display panel (PDP), and an organic light emitting diode (OLED).

Of such flat display devices (FPDs), OLEDs are cemented thin display devices that realize a color image by self-emission of organic materials, and have attracted attention as a promising display device of the next generation in that the structure is simple and the light efficiency is high.

OLEDs can be divided into passive PMOLEDs and active AMOLEDs depending on the driving method. In particular, AMOLED is a self-emissive display that has a faster response speed than conventional displays, has a natural color and low power consumption.

The OLED manufacturing process includes a pattern forming process, an organic film deposition process, an encapsulating process, and a laminating process in which a substrate on which an organic thin film is deposited and an encapsulating process are adhered to each other.

On the other hand, AMOLED can realize flexible display technology when it is applied to a film that can be bent easily and not thinner than a glass substrate, or a willow glass (glass that can be bent).

However, such a flexible substrate such as a film or a shallow glass is very thin, so it is prone to sag and is susceptible to impact. Therefore, it is not used alone in the process of manufacturing a flat display (FPD) Is used.

Therefore, there is a need to develop a carrier glass peeling apparatus capable of quickly and easily peeling off a carrier glass adhered to a flexible substrate after a predetermined process is completed, without damaging the flexible substrate.

Korean Patent Laid-Open Publication No. 10-2013-00003997 (LG Display Co., Ltd.), 2013.01.09

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a carrier glass peeling apparatus capable of quickly and easily peeling a carrier glass bonded to a flexible substrate without damaging the flexible substrate.

According to an aspect of the present invention, there is provided a stage unit comprising: a stage unit on which a glass bonding substrate on which a carrier glass is adhered is mounted on one surface of a flexible substrate; A gap region forming unit disposed adjacent to the stage unit, the gap glass forming unit forming a gap region in which the carrier glass is partially separated from the flexible substrate; And a peeling unit for gripping the carrier glass and peeling the carrier glass from the gap area on the flexible substrate.

Wherein the gap region forming unit includes: a gap generation module that moves a part of the carrier glass relative to the flexible substrate to generate a gap between the carrier glass and the flexible substrate; And a gap extension module extending the gap to the gap area.

Wherein the gap generation module comprises: a knife portion having a knife inserted between the flexible substrate and the carrier glass; And a knife moving unit coupled to the knife unit and moving the knife unit in a direction in which the knife unit approaches and separates from the glass substrate.

The knife moving part includes an EL block for knife part to which the knife part is coupled; An ELM guide for a knife part for guiding movement of the ELM block for knife part; And an EL block drive unit for moving the EL block for the knife unit.

The gap generation module may generate the gap in a corner area of the glass adhesion substrate.

The gap extension module may include: a nozzle unit for spraying air between the carrier glass and the flexible substrate; And an air supply unit for supplying the air to the nozzle unit.

Wherein the nozzle unit comprises: a corner nozzle unit for jetting the air into a corner area of the glass substrate; And a corner nozzle for spraying the air to an edge area of the glass substrate.

The peeling unit includes a peeling unit body; A gap area enlargement module connected to the peeling unit body and enlarging the gap area by relatively moving a part of the carrier glass relative to the flexible substrate so that the gap area is enlarged; And a peeling module that is connected to the peeling unit body and moves the remainder of the carrier glass relative to the flexible substrate to peel off the carrier glass from the flexible substrate.

The gap area enlarging module may further include: a vacuum absorption part for enlarging a gap area for vacuum-adsorbing the carrier glass; And an up / down driver for enlarging the gap area to up / down the vacuum absorption part for enlarging the gap area with respect to the flexible substrate.

The gap area enlarging module can relatively move the corner area of the carrier glass relative to the flexible substrate.

Wherein the peeling module comprises: a plurality of peeling adsorption units for vacuum-adsorbing the carrier glass; And a peeling up / down driving unit for up / down the peeling adsorption unit with respect to the flexible substrate.

The peeling adsorbing portions may be disposed apart from each other at equal intervals.

The peeling up / down driving unit may independently up / down each of the peeling adsorption units.

Wherein the stage unit comprises: a support plate supporting the glass substrate and having a plurality of vacuum holes; And a vacuum pump connected to the vacuum hole.

And an ionizer for removing static electricity from the glass bonding substrate.

The embodiments of the present invention are characterized in that the gap region forming unit forms a gap region in which the carrier glass is partially separated from the flexible substrate on the glass substrate and the peeling unit peels the carrier glass from the gap region on the flexible substrate, It is possible to quickly and easily peel the carrier glass from the flexible substrate without damaging the substrate.

1 is a perspective view illustrating a carrier glass peeling apparatus according to an embodiment of the present invention.
2 is a plan view showing the gap region forming unit of Fig.
Fig. 3 is a view showing the peeling unit of Fig. 1. Fig.
FIG. 4 is a view showing the peeling up / down driving unit of FIG. 3. FIG.
5 is an operational state diagram of the gap generation module of FIG.
6 is an enlarged view of the portion 'A' in FIG.
7 is an operational state diagram of the gap extension module of FIG.
8 is an operational state diagram of the gap area enlargement module of FIG.
FIG. 9 and FIG. 10 are operational state diagrams of the peeling module of FIG. 3. FIG.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in order to avoid unnecessary obscuration of the present invention.

Prior to the description with reference to the drawings, any of a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) display may be used as the flat display to be described below. However, the present embodiment adopts an organic light emitting display (OLED).

The flexible substrate refers to a thin flexible film or a willow glass.

FIG. 1 is a perspective view showing a carrier glass peeling apparatus according to an embodiment of the present invention, FIG. 2 is a plan view showing a gap region forming unit of FIG. 1, FIG. 3 is a view showing the peeling unit of FIG. 1 5 is an operational state diagram of the gap generation module of FIG. 1, FIG. 6 is an enlarged view of the 'A' portion of FIG. 5, and FIG. FIG. 7 is an operational state diagram of the gap extension module of FIG. 1, FIG. 8 is an operational state diagram of the gap expansion module of FIG. 3, and FIGS. 9 and 10 are operational state diagrams of the separation module of FIG.

1 to 10, the carrier glass peeling apparatus according to the present embodiment is provided with a stage unit (hereinafter referred to as a stage unit) ST on which a glass bonding substrate ST on which a carrier glass T is stuck is mounted on one surface of a flexible substrate S And a gap region G that is disposed adjacent to the stage unit 100 and forms a gap region G in which the carrier glass T is partially separated from the flexible substrate S, And a peeling unit 300 for holding the carrier glass T and peeling the carrier glass T from the gap region G on the flexible substrate S. [

The carrier glass peeling apparatus according to the present embodiment is characterized in that the gap region forming unit 200 first forms the gap region G on the glass adhesion substrate ST and then the peeling unit 300 expands the gap region G The carrier glass T can be quickly and easily peeled off from the flexible substrate S without damaging the flexible substrate S by peeling the carrier glass T from the flexible substrate S. [

The glass bonding substrate ST refers to a carrier glass T adhered to the upper or lower surface of the flexible substrate S. In this embodiment, the glass bonding substrate ST is provided in a rectangular shape.

A glass bonding substrate (ST) is seated on the stage unit (100). The stage unit 100 includes a support plate 110 supporting a glass substrate ST and provided with a plurality of vacuum holes (not shown), a vacuum pump (not shown) connected to a vacuum hole (not shown) .

In this embodiment, the support plate 110 contacts the flexible substrate S to support the glass substrate ST.

The gap region forming unit 200 is disposed adjacent to the stage unit 100 and forms a gap region G in which the carrier glass T is partially separated from the flexible substrate S do.

The gap region formation unit 200 includes a gap generation module 210 for generating a gap G1 between the carrier glass T and the flexible substrate S and a gap generation module 210 for expanding the gap G1 to the gap region G And a gap extension module 220 for performing a gap extension process.

The gap generation module 210 moves a part of the carrier glass T relative to the flexible substrate S to generate a gap G1 between the carrier glass T and the flexible substrate S. [ The gap generation module 210 generates a gap G1 for minimizing the damage of the flexible substrate S and generating a gap G1 (generating a gap G1 at a portion where the surface pressure is lowest) (Vertex area).

In this embodiment, since the glass adhesion substrate ST has a rectangular shape, four gap generation modules 210 are provided and are disposed adjacent to the four corner areas of the glass adhesion substrate ST, respectively.

The gap generation module 210 includes a knife portion 211 having a knife 211a inserted between the flexible substrate S and the carrier glass T and a knife portion 211 coupled to the knife portion 211, And a knife moving unit 212 for moving the glass substrate 201 in a direction in which it approaches and separates from the glass adhesion substrate ST.

The knife 211a is inserted between the flexible substrate S and the carrier glass T to generate a local gap G1 between the carrier glass T and the flexible substrate S. [

The knife moving part 212 is coupled to the knife part 211 and moves the knife part 211 in a direction in which the knife part 211 approaches and separates from the glass bonding substrate ST.

The knife moving part 212 includes an EL block 213 for a knife part to which the knife part 211 is coupled, an EL guide 214 for a knife part for guiding the movement of the EL block 213 for knife part, And an EL block drive unit 215 for moving the knife unit 213.

On the other hand, the gap extension module 220 extends the gap G1 to the gap region G. [ The gap extension module 220 includes a nozzle portion 221 for jetting air between the carrier glass T and the flexible substrate S and an air supply portion (not shown) for supplying air to the nozzle portion 221 .

The nozzle unit 221 is disposed toward the side edge of the glass bonding substrate ST and ejects air between the carrier glass T and the flexible substrate S. [

In the present embodiment, as shown in Fig. A corner nozzle part 221a for jetting air to the corner area of the glass adhesion substrate ST and a corner nozzle part 221b for jetting air to the corner area of the glass adhesion substrate ST.

The air injected from the corner nozzle part 221a flows into the gap G1 generated by the gap generation module 210 and the carrier glass T is pushed up against the flexible substrate S to form a local gap G1).

The gap G1 locally formed on the glass adhesion substrate ST by the gap generation module 210 is formed by the corner nozzle portion 221a in the corner of the glass adhesion substrate ST as shown in Fig. Lt; / RTI > region. A gap region G is formed in the corner region of the glass substrate ST by the gap generation module 210 and the corner nozzle portion 221a.

The corner nozzle portion 221b is formed by injecting air into the edge area of the glass substrate ST so that the gap area G formed in the corner area of the glass substrate ST is formed in the edge area of the glass substrate ST .

The gap region forming unit 200 is configured such that the carrier glass T is adhered to the edge region of the glass adhesion substrate ST including the corner region and the edge region of the glass adhesion substrate ST, To form a region (G).

As described above, the carrier glass peeling apparatus according to the present embodiment can prevent the contact between the gap region forming unit 200 and the flexible substrate S by expanding the gap G generated by the knife 211a using air So that breakage of the flexible substrate S can be prevented.

On the other hand, the peeling unit 300 grasps the carrier glass T and peels the carrier glass T from the gap region G on the flexible substrate S.

The peeling unit 300 includes a peeling unit main body 310 and a gap area enlarging module 320 connected to the peeling unit main body 310 to enlarge the gap area G and connected to the peeling unit main body 310 And a peeling module 330 for peeling the carrier glass T from the flexible substrate S finally.

The peeling unit main body 310 includes a vacuum expanding module (not shown) connected to the gap area expanding module 320 and the peeling module 330 to provide vacuum pressure.

The gap area expanding module 320 is connected to the peeling unit main body 310 and moves a part of the carrier glass T relative to the flexible substrate S so that the gap area G is enlarged.

The gap area enlargement module 320 moves the corner area of the carrier glass T relative to the flexible substrate S in this embodiment. Therefore, the gap area enlargement module 320 is provided in four and is arranged close to the corner area of the glass substrate ST.

The gap area expanding module 320 includes a vacuum absorption section 321 for enlarging the gap area for vacuum adsorption of the carrier glass T and a vacuum absorption section 321 for expanding the gap area to the upper side of the flexible substrate S Up / down driver 322 for enlarging / reducing a gap area for down / up.

The gap area enlarging up / down driving part 322 is connected to the peeling unit main body 310 and is provided with a vacuum absorption part 321 for enlarging the gap area absorbing the carrier glass T, (See Fig. 8 (b)). As a result,

The gap area enlargement module 320 further enlarges the space between the carrier glass T and the flexible substrate S so that the air can flow more easily into the space between the carrier glass T and the flexible substrate S. [

On the other hand, the peeling module 330 is connected to the peeling unit main body 310 and moves the remaining portion of the carrier glass T (the portion where the gap region G is not formed) relative to the flexible substrate S, The glass T is peeled from the flexible substrate S.

The peeling module 330 includes a plurality of peeling adsorption units 331 for vacuum adsorption of the carrier glass T and a peeling adsorption unit 331 provided on the peeling unit main body 310 for separating the carrier glass T from the flexible substrate S, And an up / down driving unit 332 for up / down operation.

In the present embodiment, the peeling adsorption units 331 are disposed apart from each other at equal intervals. The peeling adsorption section 331 includes a suction bar 333 provided in a bar shape and a vacuum pump 337 for transmitting a vacuum pressure to the adsorption bar 333.

The peeling up / down driving unit 332 independently up / down each of the peeling adsorption units 331.

The peeling up / down driving section 332 includes a peeling EL block 334 coupled to the peeling attracting section 331 and a peeling use EL block 334 for peeling use which guides the movement of the peeling use EL block 334 An ELM guide 335, and a peeling EL block drive unit 336 for moving the peeling EL block 334. The stripping EL block driving unit 336 is connected to the peeling unit main body 310.

Meanwhile, the carrier glass peeling apparatus according to the present embodiment further includes an ionizer (not shown) for removing static electricity from the glass substrate ST.

The carrier glass peeling apparatus according to the present embodiment includes a loading unit (not shown) for loading the glass bonding substrate ST into the stage unit 100 and a flexible substrate S on which the carrier glass T is peeled And an unloading unit (not shown) to be taken out of the stage unit 100.

Hereinafter, the operation of the carrier glass peeling apparatus according to the present embodiment will be described.

The knife 211a of the gap generation module 210 approaches the side end portion of the glass bonding substrate ST which is seated on the stage unit 100 first.

The knife 211a is inserted between the flexible substrate S and the carrier glass T as shown in Fig. 5 to generate a local gap G1. As described above, the gap G1 is formed in the corner region of the glass substrate ST for minimizing the damage of the flexible substrate S and for the efficiency of generating the gap G1.

Thereafter, the gap extension module 220 sprays air between the carrier glass T and the flexible substrate S to expand the gap G1. At this time, the gap area enlargement module 320 increases the gap area G by raising the corner area of the carrier glass T with respect to the flexible substrate S.

The gap area G is further enlarged by the gap area enlargement module 320 and the gap between the carrier glass T and the flexible substrate S becomes larger so that air is supplied to the carrier glass T and the flexible substrate S, As shown in FIG.

Next, the carrier glass T on which the peeling absorption section 331 is adsorbed is lifted up, and finally the carrier glass T is peeled off from the flexible substrate S.

At this time, as shown in Figs. 9 and 10, the peeling adsorbing portions 331 rise sequentially from the edge of the carrier glass T to the central region. Further, the peeling adsorbing portions 331 rise symmetrically and sequentially in accordance with the central region of the carrier glass T as a reference.

The tact time of the carrier glass peeling process is reduced by the symmetrical rise of the peeling adsorbing portions 331 and the carrier glass T is abruptly raised by the sequential rise of the peeling adsorbing portions 331 The flexible substrate S can be prevented from being peeled off and the flexible substrate S can be prevented from being damaged in the peeling step.

As described above, in the carrier glass peeling apparatus according to the present embodiment, the gap region forming unit 200 forms a gap region G in which the carrier glass T is partially separated from the flexible substrate S, And the peeling unit 300 peels the carrier glass T from the gap area G on the flexible substrate S so that the carrier glass T is fastened on the flexible substrate S without damage to the flexible substrate S It can easily peel off.

Although the present invention has been described in detail with reference to the above drawings, the scope of the scope of the present invention is not limited to the above-described drawings and description.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: stage unit 110: support plate
200: gap region formation unit 210: gap generation module
211: knife portion 211a: knife
212: knife moving part 213: elb block for knife part
214: Elbow guide for knife blade
215: EL block drive unit for knife
220: gap extension module 221: nozzle part
221a: Corner nozzle unit 221b: Corner nozzle unit
300: peeling unit 310: peeling unit body
320: Gap area expansion module
321: Vacuum suction part for enlarging the gap area
322: Up / down driver for gap area enlargement
330: peeling module 331: peeling adsorption part
332: Peeling up / down driver
333: Absorption bar 334: Elimination block for peeling
335: Elongation guide for peeling 336: Eliminating block drive for peeling
337: Vacuum pressure transfer part S: Flexible substrate
T: Carrier glass ST: Glass bonding substrate
G: gap region G1: gap

Claims (15)

A stage unit on which a glass bonding substrate on which a carrier glass is adhered is mounted on one surface of a flexible substrate;
A gap region forming unit disposed adjacent to the stage unit, the gap glass forming unit forming a gap region in which the carrier glass is partially separated from the flexible substrate; And
And a peeling unit for gripping the carrier glass and peeling the carrier glass from the gap region on the flexible substrate,
The gap region forming unit includes:
A gap generation module for moving a part of the carrier glass relative to the flexible substrate to generate a gap between the carrier glass and the flexible substrate; And
And a gap extension module extending the gap to the gap area,
The gap generation module includes:
A knife portion inserted between the flexible substrate and the carrier glass, the knife portion being provided to form a local gap between the flexible substrate and the carrier glass; And
And a knife moving part coupled with the knife part and moving the knife part in a direction in which the knife part approaches and separates from the glass adhesion substrate. delete delete The method according to claim 1,
The knife-
An EL block for the knife part to which the knife part is coupled;
An ELM guide for a knife part for guiding movement of the ELM block for knife part; And
And an EL block driving part for moving the EL block for the knife part. The method according to claim 1,
Wherein the gap generation module generates the gap in a corner area of the glass adhesion substrate. The method according to claim 1,
Wherein the gap extension module comprises:
A nozzle unit for spraying air between the carrier glass and the flexible substrate; And
And an air supply unit for supplying the air to the nozzle unit. The method according to claim 6,
In the nozzle unit,
A corner nozzle unit for spraying the air into a corner area of the glass bonding substrate; And
And a corner nozzle for jetting the air to an edge area of the glass bonding substrate. The method according to claim 1,
Wherein the peeling unit comprises:
Peeling unit main body;
A gap area enlargement module connected to the peeling unit body and enlarging the gap area by relatively moving a part of the carrier glass relative to the flexible substrate so that the gap area is enlarged; And
And a peeling module connected to the peeling unit body for moving the remaining portion of the carrier glass relative to the flexible substrate to peel off the carrier glass from the flexible substrate. 9. The method of claim 8,
The gap area enlargement module includes:
A vacuum adsorption unit for enlarging a gap region for vacuum-adsorbing the carrier glass; And
And an up / down driver for enlarging a gap area for up / down the vacuum absorption part for enlarging the gap area with respect to the flexible substrate. 10. The method of claim 9,
Wherein the gap area enlarging module moves the corner area of the carrier glass relative to the flexible substrate. 9. The method of claim 8,
The peeling module comprises:
A plurality of peeling adsorption units for vacuum-adsorbing the carrier glass; And
And a peeling up / down driving unit for up / down the peeling adsorption unit with respect to the flexible substrate. 12. The method of claim 11,
Wherein the peeling adsorbing portions are disposed apart from each other at equal intervals. 9. The method of claim 8,
Wherein the peeling up / down driving unit independently up / down each of the peeling adsorption units. The method according to claim 1,
The stage unit includes:
A support plate for supporting the glass bonding substrate and provided with a plurality of vacuum holes; And
And a vacuum pump connected to the vacuum hole. The method according to claim 1,
And an ionizer for removing static electricity from the glass bonding substrate.

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