KR101554453B1

KR101554453B1 - Probe card

Info

Publication number: KR101554453B1
Application number: KR1020150065504A
Authority: KR
Inventors: 김재길; 류승호
Original assignee: 김재길
Priority date: 2015-05-11
Filing date: 2015-05-11
Publication date: 2015-09-18

Abstract

More particularly, the present invention relates to an integral contact probe card, in which a needle body is embedded in a groove formed in a PCB so that a needle does not protrude from the surface of the PCB, and the needle body is fixed by soldering, And the probe card is brought into close contact with the probe card.
According to the present invention, the needle and the needle body are embedded in the thickness of the PCB so that there is no protruding structure on the top surface of the PCB, thereby minimizing the interval between the top surface of the PCB and the bottom surface of the integrating sphere.

Description

Integrated Proximity Probe Card {PROBE CARD}

More particularly, the present invention relates to an integral contact probe card, in which a needle body is embedded in a groove formed in a PCB so that a needle does not protrude from the surface of the PCB, and the needle body is fixed by soldering, And the probe card is brought into close contact with the probe card.

The probe card is an inspection device for checking whether an object to be inspected is normally operating by transmitting an electric signal while contacting a semiconductor device or an LED chip.

In order to inspect the device that generates light, a probe-integrated integrating sphere is installed on the probe card for collecting the light generated from the object to be inspected upward.

FIG. 1 is a perspective view showing a structure of a probe card according to the related art, and FIG. 2 is a sectional view showing a state in which an integrating sphere is closely attached to the probe card of FIG.

1 and 2, a conventional probe card 1 is provided with a printed circuit board 2 on which a through hole 2a is formed. In the upper part of the printed circuit board 2, a " Is electrically connected and fixed by a soldering operation with a circuit pattern formed on the upper surface of the printed circuit board 2 and then straightly extended into the through hole 2a and the other end is bent into the through hole 2a, A pair of blades 3 protruding downward from the lower surface of the substrate 2 are coupled. A pair of blades 3 are arranged opposite to each other and a probe bar 4 having a "L" shape contacting the electrode pads of the LED chip 7 placed under the printed circuit board 2 at the other end is soldered And is fixedly coupled.

In this state, the integrating sphere 8 moves up and down, and comes into contact with the upper surface of the printed circuit board 2. [ The inspection of the LED chip 7 proceeds in a state in which the integrating sphere 8 is as close as possible to the upper surface of the printed circuit board 2. [

The integrating sphere 8 having a shape similar to that of a part of the sphere can no longer be brought under the body of the printed circuit board 2 and the blade 3 due to the physical shape of the pair of blades 3, The card 1 is configured such that the vertical distance H1 between the printed circuit board 2 and the bottom surface of the light receiving portion 8a of the integrating sphere 8 is limited to 3 mm and the light receiving angle? do. That is, as the integrating sphere 8 is close to the printed circuit board 2, the greater the light receiving angle, the more the received light amount is increased and the more accurate optical characteristic can be measured, but the conventional probe card 1 described above can not.

Therefore, it is necessary to make the upper surface of the probe card 1 flat so that the integrating sphere 8 is brought into close contact with the bottom surface of the printed circuit board 2 as much as possible so that light does not leak.

KR 10-2013-0021164 A KR 10-2011-0053031 A

According to an aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising: forming a body insertion groove into which a needle body can be inserted in a rim of an opening formed in a PCB; inserting a needle body inserted into the body insertion groove into a PCB, And an object of the present invention is to provide an integral-contact type probe card in which protruded structures are not formed.

A probe card for inspecting light generated in a semiconductor device (204) in a state in which an integrating sphere (8) for collecting light is brought close to an upper surface, characterized in that a center opening (102a) is formed A PCB 102; A connection terminal 104 formed at one side edge of the PCB 102; A connection circuit pattern 106 formed on a surface of the PCB 102 to transmit an inspection signal; A conductor 108 for coating an inner surface of the body insertion groove 102b formed by cutting a part of the rim of the opening 102a; A needle body 110 embedded in the body insertion groove 102b and fixed by soldering 114; And a needle 112 fixed to the needle body 110 and contacting the semiconductor element 204. The needle body 110 is completely embedded in the body insertion groove 102b, 102 or the lower surface thereof.

According to the present invention, the needle and the needle body are embedded in the thickness of the PCB so that there is no protruding structure on the top surface of the PCB, thereby minimizing the interval between the top surface of the PCB and the bottom surface of the integrating sphere.

1 is a perspective view showing the structure of a probe card according to a related art.
Fig. 2 is a sectional view showing a state in which an integrating sphere is closely attached to the probe card of Fig. 1; Fig.
3 is a perspective view illustrating a structure of a probe card according to an embodiment of the present invention.
4 is a cross-sectional view showing the internal structure of the probe card of FIG. 3;
5 is a perspective view illustrating a method of fixing a needle body to a PCB;
6 is a sectional view showing a state in which an integrating sphere is in close contact with the probe card of Fig. 3;

Hereinafter, an "integral contact probe card" (hereinafter, referred to as probe card) according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 3 is a perspective view showing the structure of a probe card according to an embodiment of the present invention, FIG. 4 is a sectional view showing the internal structure of the probe card of FIG. 3, and FIG. 5 is a perspective view illustrating a method of fixing a needle body to a PCB.

The probe card 100 of the present invention basically has a structure similar to a device used in the past. That is, the connection terminal 104 is formed on one side edge of the PCB 102 on which a predetermined connection circuit pattern 106 is formed, and is installed in another inspection apparatus. The connection terminal 104 and the connection circuit pattern 106 are electrically connected to transmit and receive an inspection signal.

A substantially circular opening 102a is formed in the center of the PCB 102. The size and shape of the opening 102a may vary depending on the type of the semiconductor device or the LED chip. In some cases, the opening 102a may be formed in a rectangular shape, or a plurality of openings 102a may be formed to inspect a plurality of elements at a time.

The PCB 102 is a flat plate made of plastic or metal and has a predetermined thickness. A body insertion groove 102b is formed at the rim of the opening 102a of the PCB 102. [

5, the body insertion groove 102b is formed by cutting a part of the rim of the opening 102a by a predetermined depth and cutting the PCB 102 in the vertical direction. The body insertion groove 102b is made to have a relatively elongated straight shape, and is arranged so as to be parallel to the diameter direction of the opening portion 102a whose longitudinal direction is circular. The needle 112 embedded in the body insertion groove 102b is disposed to face the center of the opening 102a.

A part of the PCB 102 is cut to form the body insertion groove 102b and the inner surface of the body insertion groove 102b is coated with the conductor 108. [ The conductor 108 is made of copper, nickel, gold, silver or the like, and the conductor 108 is also electrically connected to the connection circuit pattern 106. A signal or an electric current transmitted from an external inspection apparatus passes through the connection terminal 104 and the connection circuit pattern 106, the conductor 108, the needle body 110 and the needle 112, Lt; / RTI >

The needle body 110 is a structure for fastening a very thin cylindrical needle 112 to securely fasten the coupled needle 112 to the PCB 102 by soldering. Depending on the shape of the needle body 110, the tension generated by the contact between the needle 112 and the element may be absorbed.

The needle body 110 is generally formed in a substantially rectangular parallelepiped shape, but may have various other shapes.

The needle body 110 is made sufficiently smaller than the internal space of the body insertion groove 102b. Therefore, when the needle body 110 is completely embedded in the body insertion groove 102b, the needle body 110 does not protrude from the upper surface or the lower surface. When the needle body 110 is inserted into the body insertion groove 102b, it is fixed with the solder 114. [ The needle body 110 is electrically connected to the connection circuit pattern 106 via the solder 114 and the conductor 108. [

The needle 112 has the same configuration as that used in a general semiconductor device inspection equipment, and transmits electrical signals while contacting the surface of the device. The needle 112 has a structure capable of absorbing a slight tension.

FIG. 6 is a cross-sectional view showing a state in which the integrating sphere is in close contact with the probe card of FIG. 3;

6, when inspecting an element to be inspected 200 using the probe card 100, the integrating sphere 8 is first brought close to the upper surface of the PCB 102 by the driving device do. The integrating sphere 8 has a shape similar to a part of the sphere whose bottom is opened, and covers the outer periphery of the opening 102a because the opened bottom is a circle. Since the open circumference of the integrating sphere 8 is in close contact with the top surface of the PCB 102 and there is no projecting structure on the top surface of the PCB 102, the open circumference of the integrating sphere 8 and the top surface of the PCB 102 . In practice, the inspection process is not fully touched to minimize the transmission of electrical noise, but close enough so that the light does not leak.

The probe card 100 is lowered or the object to be inspected 200 is raised to bring the needle 112 into contact with the semiconductor element 204 mounted on the substrate 202. [

In this state, an electrical signal is applied to the semiconductor element 204 through the needle 112, light generated at this time is collected in the integrating sphere 8, and the amount of received light is measured to confirm whether or not the semiconductor element 204 is normally operated do.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, As will be understood by those skilled in the art. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

100: Probe card 102: PCB
102a: opening portion 102b: body insertion groove
104: connection terminal 106: connection circuit pattern
108: conductor 110: needle body
112: Needle 114: Solder
200: Inspection object 202: Substrate
204: Semiconductor device

Claims

A probe card for inspecting light generated in a semiconductor element (204) in a state in which an integrating sphere (8) for collecting light is brought close to an upper surface,
A PCB 102 on which a center opening 102a is formed;
A connection terminal 104 formed at one side edge of the PCB 102;
A connection circuit pattern 106 formed on a surface of the PCB 102 to transmit an inspection signal;
A conductor 108 for coating the inner surface of the body insertion groove 102b formed by cutting a part of the rim of the opening 102a in the vertical direction;
A needle body 110 embedded in the body insertion groove 102b and fixed by soldering 114;
And a needle (112) fixed to the needle body (110) and contacting the semiconductor element (204)
The height of the needle body 110 is relatively smaller than the thickness of the PCB 102 so that the needle body 110 is completely embedded in the body insertion groove 102b and the upper surface or the lower surface of the needle body 110 Does not protrude to the upper or lower surface of the PCB 102,
Characterized in that the needle body (110) and the solder (114) are not in contact with the open circumference of the bottom surface of the integrating sphere (8).