KR101547823B1 - 기판의 가공 장치 - Google Patents

기판의 가공 장치 Download PDF

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Publication number
KR101547823B1
KR101547823B1 KR1020130062308A KR20130062308A KR101547823B1 KR 101547823 B1 KR101547823 B1 KR 101547823B1 KR 1020130062308 A KR1020130062308 A KR 1020130062308A KR 20130062308 A KR20130062308 A KR 20130062308A KR 101547823 B1 KR101547823 B1 KR 101547823B1
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KR
South Korea
Prior art keywords
substrate
sensor
holder
tool
base
Prior art date
Application number
KR1020130062308A
Other languages
English (en)
Korean (ko)
Other versions
KR20140004000A (ko
Inventor
요시히로 구보
마사카즈 노자키
요시미 다카하시
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20140004000A publication Critical patent/KR20140004000A/ko
Application granted granted Critical
Publication of KR101547823B1 publication Critical patent/KR101547823B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
KR1020130062308A 2012-06-26 2013-05-31 기판의 가공 장치 KR101547823B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012142674A JP2014004776A (ja) 2012-06-26 2012-06-26 基板の加工装置
JPJP-P-2012-142674 2012-06-26

Publications (2)

Publication Number Publication Date
KR20140004000A KR20140004000A (ko) 2014-01-10
KR101547823B1 true KR101547823B1 (ko) 2015-08-27

Family

ID=49897749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130062308A KR101547823B1 (ko) 2012-06-26 2013-05-31 기판의 가공 장치

Country Status (4)

Country Link
JP (1) JP2014004776A (zh)
KR (1) KR101547823B1 (zh)
CN (1) CN103515219B (zh)
TW (1) TWI521730B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102355043B1 (ko) * 2014-03-28 2022-01-25 엘지디스플레이 주식회사 디스플레이 장치 및 이를 제조하는 벤딩 장치
CN104716070B (zh) * 2015-04-03 2017-12-26 合肥京东方光电科技有限公司 尺寸检测装置及基板装载装置
CN105171089A (zh) * 2015-07-24 2015-12-23 南通福通机床有限公司 一种龙门机床

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071157A (ja) * 2009-09-24 2011-04-07 Dainippon Screen Mfg Co Ltd 電極形成装置および電極形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003267742A (ja) * 2002-03-13 2003-09-25 Nakamura Tome Precision Ind Co Ltd 硬質脆性板のスクライブ方法
JP3867230B2 (ja) * 2002-09-26 2007-01-10 本田技研工業株式会社 メカニカルスクライブ装置
JP4373922B2 (ja) * 2002-11-06 2009-11-25 三星ダイヤモンド工業株式会社 スクライブライン形成装置及びスクライブライン形成方法
JP2006119024A (ja) * 2004-10-22 2006-05-11 Tokyo Electron Ltd プローブおよびその製造方法
JP2011155151A (ja) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用スクライブ装置
JP5145368B2 (ja) * 2010-03-29 2013-02-13 三星ダイヤモンド工業株式会社 積層基板のパターニング装置
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071157A (ja) * 2009-09-24 2011-04-07 Dainippon Screen Mfg Co Ltd 電極形成装置および電極形成方法

Also Published As

Publication number Publication date
TW201401546A (zh) 2014-01-01
JP2014004776A (ja) 2014-01-16
TWI521730B (zh) 2016-02-11
CN103515219A (zh) 2014-01-15
KR20140004000A (ko) 2014-01-10
CN103515219B (zh) 2016-08-10

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